SVG 8800 6” Develop Tracks

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Berkeley Microlab
Chapter 4.27
SVG 8800 6” Develop Tracks
(svgdev6 - 384)
1.0
T it l e
SVGDEV6 photoresist developer track
2.0
Pu rp o s e
The SVGDEV6 is the developer track on the SVG 8800 coater/developer machine capable of
dispensing three types of developers for our standard DUV, I-line and G-line resists used in the
Microlab.
3.0
S co p e
This manual provides specific information about the operation of the SVGDEV6, and available
processes on this particular track, as well as simple problem solving tips provided at the end of this
chapter. Please refer to Chapter 4.01 - General Resist Parameters for more information on available
resists/developers on the six-inch SVG tracks.
4. 0
Ap p l i ca b l e Do cu m en t s
Revision History
5. 0
6.0
4.1
SVG 8826 Operation Manual available in the Microlab Office.
4.2
Standard Bottom Anti Reflective Coating (BARC) for DUV resist - Processing details of AR3-600
BARC product is available in Chapter 1.3 - MOD 37.
Def i n it io n s & P ro c es s T e rm in o lo g y
5.1
Coat Track: First track (closest to operator) is used for prime/coat process (svgcoat6).
5.2
Develop Track: Second track (furthest from the operator) is used for post exposure bake, hard
bake and develop processes.
5.3
Develop Station: Developer module on the SVG8800 machine.
5.4
Hot plates: There are two hot plates available on this track, one of which is used for DUV post
exposure bake process (1st station) and the other for post exposure bake of G-line and I-line
resists, as well as hard bake and/or curing of the anti reflective coating material (2nd station).
5.5
Chill Plates: cooling plate/stations positioned right after each hot plate to cool down the wafer.
5.6
Control Panels: Two developer control panels designed to receive input from the operator.
5.7
Indexer Module: Cassette platforms used for wafer load and unload operations.
5.8
Transport Arms: Arms transfer wafers between stations and/or indexer stations.
S af et y
Follow general safety guidelines in the lab as well as the specific safety rules pertaining to
SVGCOAT6/SVGDEV6 tracks, as per follows:
6.1
Do not turn off the develop station, while it is spinning, which can shatter the wafer flying all over.
6.2
Do not place your hand/s in the path of track’s moving parts specifically robots and indexer
modules.
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Chapter 4.27
6.3
Do not access the electronics and high power supplies inside the machine.
6.4
Always put on chemical protection gear: Chemical apron, chemical gloves and face shield when
filling chemicals.
7. 0 St at i st ic al / P ro c e s s D at a
8. 0
7.1
Process monitor data on the Microlab’s home page.
7.2
Problem and comment section under the equipment section of the wand.
7.3
Equipment enable message of the wand.
Av ai l ab l e P ro c es s es & No t es
8.1
System Specification
The SVGDEV6 track is one of the two tracks on the SVG8800 machine.
8.2
8.1.1
The developer module on the SVGDEV6 track is equipped with retractable nozzles.
Therefore, the station can easily be bypassed for I-line and G-line post exposure bake
processes, which are done on the second hot plate, and the next station passed the
developer module.
8.1.2
The developer control module can accept up to 99 developer programs, as well as 12
arm programs (1-10 and A-B).
Bake Processes
There are two hot plates available for different types of bake processes.
8.2.1
First hot plate station from right to left looking at the track is exclusively used for post
exposure bake (PEB) processing of the DUV resist (UV210GS-0.6 resist), and is kept at
130ºC at all times. This module is controlled by hot plate control panel shown in Figure 1,
located in front of the tool.
Note:
8.2.2
The second hot plate on this track is used for PEB bake of G-line and I-line resists, and is
kept at 120ºC at all times. This second station can also be used for curing AR3-600,
bottom anti reflective (BARC) coating by changing the temperature setting to 213ºC. This
can be accomplished by turning the dial knob, while pressing the black square button
down on the small control unit farthest to the right on the front side of the SVG8800
machine. Releasing the button will display the actual temperature on the hot plate. The
hot plate temperature will need to get adjusted back to 120ºC, after the BARC curing has
been accomplished.
Note:
8.3
Post Exposure Bake is a method used to further enhance the activation of
photo-acid produced during the exposure process in the critical sidewall areas of
the resist, often impacted by the standing wave effect. The standing wave effect
caused by interference of incident and reflected light during the exposure
process can cause ridges in the sidewalls of the resist pattern, and profoundly
impact the quality of small features. The PEB treatment is highly recommended
for critical layers with small feature sizes on them.
Hard Bake is one of the methods used to harden the patterned resist against
possible resist reflow/damage during the plasma etch and/or other harsh
treatments. See UV-bake method, Chapter 4.34, for another technique used for
hardening the patterned resist.
Develop Processes
There are three types of developers available on the SVGDEV6 Track. These are specific
developers designed to address DUV, G-line and I-line photoresist develop processes in the
Microlab, listed below.
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9. 0
Chapter 4.27
8.3.1
MF26A (Rohm Haas) developer for UV210-0.6 (Rohm Hass) Deep UV resist.
8.3.2
OCG 934 2:1 (Fuji Film) for OCG 825 35CS (FujiFilm) G-line resist.
8.3.3
OPD 4262 (Fuji Film) for OiR 700-10 (FujiFilm) I-line resist.
S VG 88 0 0 O p e r at i o n
There are two tracks available on the SVG8800 system. The developer track on the backside of the
machine (closest to wall) is designed to perform post exposure bake, develop, and hard bake
operations.
9.1
General Developer Operation
9.1.1
Enable the system (SVGDEV6) on the wand.
9.1.2
Verify that the power to the system is ON.
9.1.3
Verify that the SVGDEV6 track is in AUTO mode. This can be checked on the pertinent
developer control panel in front of the machine, see Figures 1 and 2 in Section 11. The
LED next to the word AUTO should be illuminated on the Manual-single-Auto key
(switch). If not, press this key to toggle through the other options (SINGLE or MANUAL)
until AUTO is selected.
9.1.4
Select your desired PEB and developer recipe by entering your selected program number
on the key pad, followed by pressing program select key on the pertinent control panel.
Alternatively, press the PROGRAM SELECT button on the control panel keyboard to
toggle through the available programs (1-9 for bake and 1-99 for the developer). The
developer/hard bake station (second bake station) share the same control panel. When
the developer display is selected, an asterisk appears at the left of the developer display
(upper section of the display panel). When the OVEN display (second hot plate) is
selected successfully, a plus sign appears at the left of the OVEN display.
Note: The right two control panels on a group of four panels in front of the machine are
dedicated to the developer track: The left control panel is used to control the PEB
station and the second one (far right one of the 4 panels) is used for develop
and PEB/Hard bake processes. You can toggle between the develop and
Hardbake modules by using the STATION SELECT button on this second panel
(Figure 2). Make sure proper window on the control panel is activated before
entering your desired recipe.
Note:
9.1.5
Load an empty cassette onto the receive indexer at left side of the developer track. Load
the cassette containing your wafers on the send indexer (opposite end of the receive
indexer). Make sure that the cassettes are properly seated on the indexers.
Note:
9.1.6
The post exposure bake (PEB) temperature on the first bake station is set for
DUV processes at 130ºC. DO NOT CHANGE THIS TEMPERATURE SETTING.
Post exposure bake for the I-line and G-line resists can be done on the second
bake station instead, and by skipping the first bake plate and the developer
station (program9). Once the PEB is done, you will need to bring the wafer/s
back to send through the developer module, this time skipping the first and
second hot plates on the track (program9) .
Looking at the machine standing in front of the SVG8800, the developer track
processes wafers from right to left.
Press the start button on both developer track keypads to initiate the run. This prompts
load and receive indexers to go down until the send cassette senses a wafer. The wafer
will then get transported to the first station selected on this track (Post Exposure Bake
station, if it is not bypassed by the program9 option).
Note:
If the receive cassette does not lower, remove the cassette and then replace it.
Hit START and the cassette should lower.
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Chapter 4.27
9.1.7
If necessary, press INDEX RESET button once to bring the send indexers up (starting
position) or twice for the receive indexer to come up. (Note that if you press the INDEX
RESET button, you must lift the cassettes completely off the elevator and then replace
them in order to proceed, i.e. for the cassette to go down.) These actions reset the send
& receive elevators and can help user to alleviate/resolve cassette indexer problems.
Note: If the cassette is at a lower position on the elevator, do not remove the it until the
INDEX RESET button is pressed.
9.2
Other Functions on the Control Panel
Beside the switch functions described above, i.e. Power, Start, Index Reset, Station Select and
Program Select; there are other useful functions, which are described below:
9.3
9.2.1
START INDEX: Depressing the Start Index once, will return the Send indexer to top
position. Receive indexer will not reset until any wafer in process enters the receive
cassette. Depressing the Start Index twice, will return the Receive cassette to top position
immediately unless there is a wafer between the processing station and the receive
cassette. The Send cassette is unaffected.
9.2.2
(OVEN, DEVELOPER) STOP: Ends processing immediately. Pressing START will
resume processing with the next operation programmed.
9.2.3
TRANSFER STOP: Immediately stops all indexers and transfer arms. Wafers in transit
between stations will remain in place until START command is given. Wafers in process
will complete processing and will come to the top position waiting for the START
command.
9.2.4
EVENT SELECT: Used to verify the sequence of operations and associate parameters
for the selected program. The events will be shown in sequence, but depressing the
number followed by the event select key can also access a particular event.
9.2.5
WAFER LOST: Allows the operator to resume wafer processing if a wafer is removed or
broken during processing or if a sensor fails to see a transfer. The key is only functional
when a wafer has not been received at its next station after a 6 sec delay.
9.2.6
CLEAR: Used to resume processing when machine is in programming, diagnostic or
calibration mode. It is used to turn off the “Wafer Lost” alarm.
9.2.7
DIAGNOSTIC SELECT: Used to access machine and sensor state diagnostics. Machine
State messages for the send indexer and processing station will be displayed in the
upper display window. Machine State messages for the receive indexer are displayed in
the lower display window. Sensor State messages are displayed in the top display
window only. See Section 10.23 for a listing of machine and sensor state codes.
SVGDEV6 Programs
There are several bake and develop programs available on this developer track, which are listed
in the tables below (details of programs are noted in Appendix 2).
Program
(#)
Bake type
Mode
Bake Temp.
(ºC)
Bake Time
(sec.)
Chill Time
(sec.)
Comments
*1
Post Exposure
Contact
130
60
6
Std. DUV PEB
9
No Bake
-
−
−
−
Table 1 – Post-Exposure Bake Program for DUV Resist Process ONLY ( First Hot Plate)
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Chapter 4.27
Bake type
Mode
Bake Temp.
(ºC)
Bake Time
(sec.)
Chill Time
(sec.)
Comments
*1
Post Exposure
Contact
120
60
6
G-line & I -line
resists
4
BARC Cure
Contact
213
60
20
Adjust the
temp back
9
No Bake
-
−
−
−
Program
(#)
Table 2 – BARC Cure (Second Hot Plate)
Program
(#)
Developer Type
Resist Type
Develop Time
(sec.)
Temp.
(ºC)
Comments
*1
MF26A (Rohm Haas)
UV210-0.6
60
20
STD dev. time
*2
OCG 934 2:1 (Fuji Film)
OCG 825 35CS
2 x 30
20
STD dev. time
*3
OPD 4262 (Fuji Film)
OiR 700-10
60
20
STD dev. time
4
OCG 934 2:1 (Fuji Film)
OCG 825 35CS
30
20
1/2 time dev.
5
OPD 4262 (Fuji Film)
OiR 700-10
30
20
1/2 time dev.
9
No Develop
−
−
−
Skips Station
Table 3 - Develop Programs
Note 1:
Developer temperature is kept at 20 ± 1ºC.
Note 2:
Programs with an asterisk next to the number are standard programs.
10 . 0 T ro u b l e sh o o t in g G u i d el in e s
10.1 Robot arm problems: Do not touch the robot arms, while they are in motion. Do not move robots,
if they are out of alignment or stuck. Such actions can damage the arms or pinch your fingers,
caused bodily harm to the operator. Reboot the track control panel, if necessary to address above
robot issues, as per follows:
10.1.1 Make sure there are no wafers on the developer chuck and/or stuck on the track before
rebooting the system.
10.1.2 Press the power button to turn off the first hot plate panel and the developer panel.
10.1.3 Wait for a few second, and then turn the panels on by first pressing the power button on
the first hot plate panel, then the developer panel. Make sure the power is on on the
hotplate.
10.1.4 Report the fault, if above action did not realign the arm.
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Chapter 4.27
10.2 Alarm on the track: sensor condition is not satisfied before a certain time has elapsed, then an
alarm will sound. The alarm can be turned off by pressing the CLEAR key on the control panel
keyboard. The machine state can then be checked using the diagnostics feature as per follows.
10.2.1 Press the diagnostic select key on the control panel. The display will show the following
prompt: SELECT MODE 1-2-3.
10.2.2 Press 1 to display the present machine state. The machine states diagnostic messages
for the upstream indexers and processing stations are displayed in the upper display
window. Machine state messages for the downstream sensors are displayed in the lower
display window.
10.2.3 The following table describes the various machine state messages and their meanings:
PURGE/EXHAUST FAILURE: Airflow used to purge motors of flammable vapors if a
safety feature has been interrupted. It also displayed this message if process exhaust
flow is below minimum acceptable level.
PURGE/EXH RESUMED - START? Air purge pressure or process exhaust flow is again
within limits. Press START to resume operation.
SENDER CASSETTE?
Designated cassette is no longer detected.
RECEIVER CASSETTE?
By cassette micro switch. Cassette has been
dislodged or removed while in process. Replace
cassette on support.
SENDER STOP - START?
When the cassette has been placed on the indexer
platform properly.
RECEIVER STOP - START?
One of these messages will be displayed, Press
START to resume operation.
Note:
Cassette can be dislodged if indexer wafer or
index sensor does not see wafer, causing
indexer to drive past wafer.
CLEAR WAFER - START?
Power-up has been performed with a wafer on the
spindle chuck or chill plate: vacuum is turned on
momentarily at these locations to check for a wafer. If
message is displayed, remove wafer. If no wafer is
present, the vacuum sensor needs to be reset to
properly detect wafers.
VACUUM BREAK - START?
Vacuum detection of the wafer while it is on the
spindle chuck has been interrupted.
WFR LOST IN TRACK - START? It is on the spindle chuck has been interrupted. The
top message is displayed pre-process. Either the
wafer has been dislodged or removed from the chuck
or the chuck vacuum switch is misadjusted or bad.
SPEED OUT OF BAND - START? Message displayed if the spindle speed deviates
beyond the limits of the spindle speed band. The next
wafer is held at the spindle top position until START is
depressed.
COVER IN PLACE?
The process cover is not in place atop the carriage.
Dispense operations will not take place until the cover
is replaced.
10.3 Low Developer Alarm: A Low Developer Alarm occurs when any developer tank level falls below
a one gallon reserve. This will be accompanied by a yellow light powered up on the display on
the wall for that particular developer tank. Silence the alarm by pressing the "acknowledge"
button and then report the fault on Mercury client as warning status and symptoms:
chemical. This will enable staff to promptly address the low level developer issue by refilling the
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Chapter 4.27
tank. See developer status display monitor on figure 3 and 4 for more detail. Svgdev tracks can
continue to be used following a low level alarm. A warning allows sufficient time for staff to refill
the tank. There is plenty of developer/ EBR/ HMDS/ acetone in the tank for you to use the track
until the staff refills it.
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Chapter 4.27
F ig u r es & Sc h e m a t i c s
Figure 1 – First Hot Plate Control Panel
Figure 2 – Developer and PEB/Hard Bake Control Module
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Chapter 4.27
Figure 3 – Low level light indicators
Figure 4 – “ACKNOWLEDGE” button to silence alarm
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Chapter 4.27
11 . 0 Ap p en d ic e s
Appendix 1
Refill of the Developer Tanks
Each photoresist used at the svgcoat6 has a developer specific to that resist; the developers are in
pressurized tanks behind the svgdev6 in Service Chase 383.
► Wafers coated with Rohm Haas UV210GS-0.6 DUV Positive Photoresist are developed with the
Rohm Haas MF 26A Developer.
► Wafers coated with OCG 825 Positive Photoresist are developed with the G-line developer OCG 934
2:1 Positive Resist Developer.
► Wafers coated with OiR 700-10 Positive I-line Photoresist are developed with the I-line developer
OPD 4262 Positive Resist Developer.
► Each of these developers can be found in the yellow cabinet in service chase 381or Room 399. Use
them, as they are, no mixing necessary.
The svgdev6 developer tanks each have a low liquid level sensor inside the tank; these sensors are
connected to wall mounted low liquid level warning lights located to the left rear of the svgdev6. A light
on indicates a need to refill the tank(s) before attempting to develop wafers. Once the developer is
refilled, the low developer light will go off and the low developer wall alarm will silent.
The warning lights are arranged as follows:
Light #1: Developer #1: MF 26A (maintained by staff)
Light #2: Developer #2: OCG 934 2:1 (maintained by staff)
Light #3: Developer #3: OPD 4262 (maintained by staff)
Light #4: EBR (maintained by staff)
Light #5: HMDS (maintained by staff)
When there is a need to refill any of the above tanks, please report promptly on Mercury using symptoms:
chemical. The lab members are no longer allowed to refill the developer tanks. The staff will observe the
following procedure:
► Use a safety carrier, choose the correct developer from the yellow cabinet in Service Chase 381 or
Room 399, and transport it to Service Chase 383 (where the developer tanks are located).
► Each tank is clearly labeled for each developer and other chemicals.
► To refill the DUV, G-line or I-line developer tank, first turn the black vent knob 180 degrees to vent the
®
tank. Next, remove the lid to the tank, making sure that the Teflon O-ring does not stick to the lip of
the tank. Refill the tank with the proper positive resist developer directly out of the bottle with the
provided funnel on the side of the developer tank, replace the lid (making sure that it is seated
correctly and the Teflon O-ring is faced down) and turn the black vent knob back to its original
position.
Note:
On the wall directly behind the developer tanks are five pressure gauges, one for each
chemical tank. When the developer tanks have been refilled and the lids correctly positioned,
the PSI for the developer tanks should read between 3 to 9 on the gauge, and the EBR tank
should read 3 on the gauge. If the pressure reads 0, the tank lid has not been seated
correctly and must be reseated again.
*Do not leave empty developer bottles in the service chase; they must be properly rinsed 1 minute and
dried 1 minute in bottlewash, labels scratched and disposed in the proper plastics bottle trashcan in
Room 582A.
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Chapter 4.27
Appendix 2
SVGDEV6 programs
PEB and Hard Bake Programs
PROGRAM #
EVENT
OPERATION
TIME (sec.)
GAP
Program 1 – 60 sec. PEB at 130ºC for the UV 210-0.6 (DUV. Use the first hot plate for this process.
+1
+1
+1
1
2
3
Bake
Cool
End
60
6
0
-
Program 4 – 60 sec. BARC cure at 213ºC. Use 2nd Hot plate, change back temp, after your are done.
+1
+1
+1
1
2
3
Bake
Cool
End
60
20
0
-
Note: + LED displays bake programs which had been selected successfully.
Developer Programs
PROGRAM #
EVENT
OPERATION
ARM
TIME (sec.)
SPEED
(rpm)
Exhaust
(krpm/sec)
Program 1 – Developer program for Rohm Haas UV 210-0.6 Photoresist (standard DUV Developer)
*1
1
Spin
1T
2
500
50
*1
2
SP1
2T
5
300
50
*1
3
ST1
3T
6
50
50
*1
4
ST1
4T
4
0
50
*1
5
Spin
0T
60
0
50
*1
6
Spin
0T
2
500
50
*1
7
Rins
R0T
30
500
50
*1
8
Spin
0T
20
2000
50
*1
9
End
-
-
-
-
Program 2 – Developer program for OCG 934 2:1 Photoresist (standard G-line Developer)
*2
1
SP2
2T
6
300
50
*2
2
ST2
3T
4
50
50
*2
3
Spin
0T
30
0
50
*2
4
SP2
2T
6
300
50
*2
5
ST2
4T
4
50
50
*2
6
Spin
0T
30
0
50
*2
7
Rins
R0T
30
500
50
*2
8
Spin
0T
20
3000
50
*2
9
End
-
-
-
-
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Chapter 4.27
Program 3 – Developer program for OiR 700-10 Photoresist (standard I-line Developer)
*3
1
Spin
1T
2
500
50
*3
2
SP3
2T
5
300
50
*3
3
ST3
3T
5
50
50
*3
4
ST3
4T
4
0
50
*3
5
Spin
0T
60
0
50
*3
6
Spin
0T
2
500
50
*3
7
Rins
R0T
30
500
50
*3
8
Spin
0T
20
3000
50
*3
9
End
-
-
-
-
Note: * LED displays developer programs which had been selected successfully.
Arms Programs
PROGRAM
#
EVENT
OPERATION
TIME (sec.)
SPEED
(krpm)
1A1
Travs
1
300
1A2
End
–
–
2A1
Travs
1
330
2A2
Travs
1
250
2A3
Travs
1
330
2A4
Travs
1
300
2A5
End
–
–
A1
Travs
1
100
3A2
Travs
1
330
3A3
Travs
3
250
3A4
End
–
–
4A1
Travs
3
250
4A2
Home
1
–
4A3
End
–
–
Program 1
Program 2
Program 3
Program 4
Sia Parsa 01/18/12
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