Spring Contact Probe Catalog

Transcription

Spring Contact Probe Catalog
1
EXPERIENCE
MAXIMUM QUALITY
Qulamax is dedicated to the success of our customers by being a world-class provider of innovative test product
solutions to the semiconductor and mobile device industry. Qualmax, first established in 1986, offers a wide spectrum
of solutions and services designed to meet the unique challenges of each customer. As a leading provider of test
product solutions, we at Qualmax are committed to delivering value added solutions through our product offerings
and expert customer support.
Qualmax application and design engineering occurs in the United States and Korea by our engineers each of whom
has extensive knowledge and hands-on expertise in semiconductor test applications. Each new technology node brings
additional requirements and challenges which drive the need for advanced test product solutions. Qualmax strives to
consistently deliver advanced capabilities with cost-effective production performance. We intrinsically understand
that to preserve customer trust we must continually deliver new solutions on time. This level of understanding and
execution creates a dynamic synergy which often leads to new potentials and greater opportunities for both parties.
Qualmax’s goal is to manufacture and deliver your test solutions with the highest level of quality. Qualmax spring
contact probes are manufactured and validated in-house at our state-of-the-art manufacturing facility and test lab,
which is ISO certified, maintaining the highest standard of quality and your guaranteed satisfaction. Currently
Headquartered in Pyeongtaek City, Korea, Qualmax has offices in San Jose, California, Hsinchu, Taiwan, Singapore
and Laguna, Philippines plus extensive sales coverage with professional sales representatives located throughout the
world. Qualmax’s global support organization provides the ability to support multinational accounts seamlessly.
2
Design Excellence
Qualmax provides advanced designs for Semiconductor Test
Socket, Spring Contact Probes, Custom Test Interfaces and
Wafer Level Package (WLP) solutions.
Cutting edge design engineering is assured by our dedicated
team which has extensive hands-on experience and knowledge
with the most complex and challenging applications. Test yield
and cost are the key factors we consider with every design.
We have over 3,000 probe designs in our data base already,
from which you can choose anyone immediately. Otherwise,
we can design a new probe within 24 hours for your approval
without NRE charge.
Our Application Engineering team works hand in hand with your
engineers to develop the optimum solution for your specific
test needs. Our primary goal is to provide cuttingedge solutions
which meet and exceed the needs of our clients.
Service Excellence
Qualmax offers highly demanded test product solutions to meet
the needs of the dynamic markets and customers we support.
To maximize value, we offer a customizable portfolio of solutions
and services spanning virtually every aspect of the assembly and
test arena. Our service starts with a dialog, with each customer,
to ensure the complete understanding of objectives, goals and
constraints for every opportunity. The output of which is a custom
solution structured to precisely address both the technical and
commercial requirements of your test applications.
Qualmax understands the value of global support and the
benefits of close proximity to the locations where your products
are designed, manufactured and ultimately tested. Our offices
located throughout North America and Asia is testament of our
commitment to provide a global support organization.
Manufacturing Excellence
Qualmax’s goal is to manufacture and deliver your test solutions
on time and with zero defects. To support the expanding demand
for our solutions we have opened a manufacturing and test lab in
Pyeongtaek City, Korea.
In this state-of-the-art facility, we do every phase of manufacturing
- design, piece parts fabrication, heat treatment, plating, assembly
and quality control - all in-house. Regardless of the unique
dynamic associated with each customers’ operation we can deliver
our solutions during steady state high volume periods and also
address and rapidly respond to burst capacity requirements. Our
manufacturing process is designed to ensure the timely delivery
of new soltions. This in turn helps support your ability to secure
design wins and time to market advantages.
Our unique manufacturing approach ensures you will consistently
receive the highest value available regardless of the complexity
of your application.
Product Excellence
Qualmax is an advanced test hardware solution company solely
focused on providing semiconductor companies and mobile
device manufactures the solutions to today’s most challenging
test applications.
Qualmax offers a wide array of products that support the test
hardware needs of almost any device.
Utilizing our brand new factory in Korea, Qualmax manufactures
high performance spring contact probes to 0.2mm pitch, Kelvin
contacts, test probes with extremely short signal path,
high current probes and high temperature probes to allow for
a full turnkey test solution.
Continuing investments are made to our support network to
ensure we maintain fast and effective support at your critical
locations.
3
“相生” signifies the importance of the business
eco system of today, which involves customers,
employees, vendors, even competitors as well as
the society with which all of us are members and
all are deserving of “a good life”
Dear customers,
“Sangseng”, a Korean word which literally means “mutual life”, is the motto with which every employee at Qualmax integrates
into every aspect of our daily routines. It is derived from an old oriental philosophy, and can be translated into “win-win” in
contemporary English. “Sangseng” is, however, multi-faceted and unlike the original military use of the term “win-win”, which
involved two combatants locked in a goal of defeating or destroying the other party, “Sanseng” is for life.
It can more appropriately be translated as “coexistence” in modern English. So, “Sangseng” signifies the importance of the
business eco system of today, which involves customers, employees, vendors, even competitors as well as the society with
which all of us are members and all are deserving of a “good life”.
With this core value in mind, Qualmax had opened a brand new factory in Korea in 2011 to manufacture spring contact probes
and test sockets. We have a world class manufacturing facility and know-how to produce quality products effectively,
irrespective of the batch size. Qualmax was the first to introduce two weeks lead time in the semiconductor test industry back in
2004, and now with our own manufacturing we are elevating our market leadership again to bring forth mutual life “Sangseng”
for everyone involved in our business.
Experience Maximum Quality with Qualmax.
I thank you for your support and patronage, and look forward to seeing you soon.
With best regards,
Jong Choi
4
/ President & CEO
Quality Assurance
From design completion, through manufacturing, to outgoing inspection, an array of characteristics are reviewed and scrutinized for
every probe built. At design completion state-of-the-art verification tools are deployed to ensure every piece part is complant with
mechanical and electrical standards. Manufacturing and assembly occurs in a clean room where critical parameters like: dimensional
accuracy, hardness, and plating thickness are measured and validated to conform to design tolerances. A rigorous characterization is
performed on all new designs to ensure reliability specifications and design criteria are achieved.
To accomplish this goal a battery of performance variables are assessed including: life span cycling, force vs. deflection, force vs.
contact resistance and an analysis of S-parameters utilizing a vector network analyzer. Detailed measurement reports are provided to
the customers including: bandwidth, current carrying capacity, inductance, and capacitance. Outgoing inspection involves 100% X-ray
screening, physical cycling of the probes to check for assembly issues and visual inspection to screen for cosmetic defects.
All procedures are ISO 9001 certified. With Qualmax Maximum Quality is guaranteed.
Insertion loss (S21) for Sample A vs. Sample B
Contact Resistance vs. Displacement
CRes Average << 40mohms; CRes +2 Std Dev << 50mohms
Force vs. Displacement
Force vs. Current carrying capacity
EDS Quantitative Results
Element Wt%
At%
PK
4.78 11.90
Au M
38.18 14.94
Ni K
39.70 52.13
Cu K
17.34 21.03
5
PRODUCT VARIATION
Modification or Customization Available
9p - 14p
9.00
8.00
7.00
6.00
5.00
4.00
3.00
2.00
1.00
0.00
6
300-00300-001
300-00102-003
300-00064-016
300-00062-003
300-00121-004
300-00118-006
300-00179-021
300-00096-005
300-00082-002
300-00229-002
300-00106-009
300-00275-002
Pitch
0.40(0.016)
0.40(0.016)
0.40(0.016)
0.40(0.016)
0.50(0.020)
0.50(0.020)
0.50(0.020)
0.65(0.026)
0.65(0.026)
0.80(0.031)
0.80(0.031)
1.00(0.039)
Total Length
5.52(0.217)
5.70(0.224)
2.55(0.100)
5.70(0.224)
2.00(0.079)
3.20(0.126)
5.70(0.224)
3.70(0.146)
6.43(0.253)
3.20(0.126)
4.80(0.189)
4.30(0.169)
Barrel Dia
0.26(0.010)
0.26(0.010)
0.31(0.012)
0.31(0.012)
0.35(0.014)
0.38(0.015)
0.38(0.015)
0.51(0.020)
0.53(0.021)
0.57(0.022)
0.57(0.022)
0.84(0.033)
Page No.
9
9
10
10
11
11
12
12
13
13
14
14
15 -19p
19p - 20p
300-50031-002
300-00363-001
300-00034-004
300-00099-002
300-00170-006
300-00025-002
300-00167-001
300-00035-004
300-00059-002
300-00411-001
300-00773-002
300-00358-001
0.40(0.016)
0.40(0.016)
0.40(0.016)
0.65(0.026)
0.80(0.031)
0.80(0.031)
0.80(0.031)
0.80(0.031)
1.00(0.039)
0.80(0.031)
0.20(0.008)
0.15(0.006)
3.25(0.13)
3.80(0.150)
5.64(0.222)
5.70(0.224)
5.70(0.224)
2.65(0.104)
3.55(0.140)
4.84(0.191)
4.46(0.176)
1.00(0.039)
5.95(0.234)
5.00(0.197)
0.31(0.012)
0.31(0.012)
0.31(0.012)
0.50(0.020)
0.58(0.023)
0.60(0.024)
0.62(0.024)
0.70(0.028)
0.80(0.031)
0.60(0.024)
0.13(0.005)
0.11(0.004)
15
15
16
16
17
17
18
18
19
19
20
20
Four piece probe
Three piece probe
Special probe
All dimensions are in mm (inches)
7
TIP STYLE GUIDE
8
Conical (Convex)
Concave
Chisel (Pyramid)
Concave
Chisel
Flat
Chisel Spear
Flat
Spear Point (Star)
Spherical Radius
3 Point (Reduced Crown)
Spherical Radius
4 Point Crown
Point (Spear Point)
4 Point Crown
Point
Tulip
Flex Tip
Serrated
300-00300-001
Ø 0.17
(0.0067)
0.92 (0.0362)
Ø 0.26 (0.0102)
4.00 (0.1575)
Ø 0.12
(0.0047)
0.60 (0.0236)
300-00102-003
5.52 (0.2173)
Ø 0.10
(0.0039)
1.10 (0.0433)
Ø 0.26 (0.0102)
4.00 (0.1575)
Ø 0.10
(0.0039)
0.60 (0.0236)
5.70 (0.2244)
Probe Specifications
Probe Specifications
Device Pitch : 0.40mm (0.016)
Device Pitch : 0.40mm (0.016)
Signal Path Length : 5.00mm (0.197)
Signal Path Length : 5.05mm (0.199)
Spring Force : 10.5gf (0.370oz) at 0.52mm Recommended Travel
Spring Force : 13.5gf (0.476oz) at 0.65mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Stainless steel, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Hardened steel, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Hardened steel, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 2 amps continuous
Current Carrying Capacity : 2 amps continuous
Loop Inductance : 0.91nH
Loop Inductance : 1.15nH
Signal Pin to Return Capacitance : 0.36pF
Signal Pin to Return Capacitance : 0.46pF
-1 dB Insertion Loss Bandwidth : 6.17GHz
-1 dB Insertion Loss Bandwidth : 5.05GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches) | All spring forces are in grams (ounces)
9
300-00064-016
Ø 0.16
(0.0063)
300-00062-003
Ø 0.15
(0.0059)
1.10 (0.0433)
Ø 0.31
(0.0122)
4.00 (0.1575)
Ø 0.15
(0.0059)
0.60 (0.0236)
0.65 (0.0256)
Ø 0.31
(0.0122)
1.60 (0.0630)
Ø 0.16
(0.0063)
0.30 (0.0118)
2.55 (0.1004)
5.70 (0.2244)
Probe Specifications
Probe Specifications
Device Pitch : 0.40mm (0.016)
Device Pitch : 0.40mm (0.016)
Signal Path Length : 2.10mm (0.083)
Signal Path Length : 5.20mm (0.205)
Spring Force : 18gf (0.635oz) at 0.45mm Recommended Travel
Spring Force : 20.3gf (0.716oz) at 0.50mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Music wire, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 2 amps continuous
Current Carrying Capacity : 2 amps continuous
Loop Inductance : 0.49nH
Loop Inductance : 1.20nH
Signal Pin to Return Capacitance : 0.20pF
Signal Pin to Return Capacitance : 0.48pF
-1 dB Insertion Loss Bandwidth : 29.67GHz
-1 dB Insertion Loss Bandwidth : 4.42GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
10
300-00121-004
300-00118-006
Ø 0.18
(0.0071)
Ø 0.20
(0.0079)
Ø 0.35
(0.0138)
Ø 0.20
(0.0079)
0.50 (0.0197)
0.50 (0.0197)
1.20 (0.0472)
2.00 (0.0787)
Ø 0.38
(0.0150)
2.30 (0.0906)
Ø 0.18
(0.0071)
0.40 (0.0157)
3.20 (0.1260)
0.30 (0.0118)
Probe Specifications
Probe Specifications
Device Pitch : 0.50mm (0.020)
Device Pitch : 0.50mm (0.020)
Signal Path Length : 1.70mm (0.067)
Signal Path Length : 2.75mm (0.108)
Spring Force : 18.5gf (0.653oz) at 0.30mm Recommended Travel
Spring Force : 16gf (0.564oz) at 0.45mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Music wire, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 2 amps continuous
Current Carrying Capacity : 2 amps continuous
Loop Inductance : 0.43nH
Loop Inductance : 0.75nH
Signal Pin to Return Capacitance : 0.17pF
Signal Pin to Return Capacitance : 0.30pF
-1 dB Insertion Loss Bandwidth : 34.30GHz
-1 dB Insertion Loss Bandwidth : 19.27GHz
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
11
300-00179-021
Ø 0.20
(0.0079)
Ø 0.38
(0.0150)
Ø 0.20
(0.0079)
300-00096-005
1.65 (0.0650)
3.40 (0.1339)
5.70 (0.2244)
Ø 0.30
(0.0118)
0.80 (0.0315)
Ø 0.51
(0.0201)
2.40 (0.0945)
Ø 0.30
(0.0118)
0.50 (0.0197)
3.70 (0.1457)
0.65 (0.0256)
Probe Specifications
Probe Specifications
Device Pitch : 0.50mm (0.020)
Device Pitch : 0.65mm (0.026)
Signal Path Length : 4.95mm (0.195)
Signal Path Length : 3.00mm (0.118)
Spring Force : 30gf (1.058oz) at 0.75mm Recommended Travel
Spring Force : 23.5gf (0.829oz) at 0.70mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Music wire, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 2 amps continuous
Current Carrying Capacity : 3 amps continuous
Loop Inductance : 0.82nH
Loop Inductance : 0.63nH
Signal Pin to Return Capacitance : 0.33pF
Signal Pin to Return Capacitance : 0.25pF
-1 dB Insertion Loss Bandwidth : 14.84GHz
-1 dB Insertion Loss Bandwidth : 21.17GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
12
300-00082-002
300-00229-002
1.71 (0.0673)
Ø 0.25
(0.0098)
Ø 0.53
(0.0209)
Ø 0.25
(0.0098)
Ø 0.34
(0.0134)
3.72 (0.1465)
6.43 (0.2531)
0.60 (0.0236)
Ø 0.57
(0.0224)
2.00 (0.0787)
Ø 0.34
(0.0134)
0.60 (0.0236)
3.20 (0.1260)
1.00 (0.0394)
Probe Specifications
Probe Specifications
Device Pitch : 0.65mm (0.026)
Device Pitch : 0.80mm (0.031)
Signal Path Length : 5.46mm (0.215)
Signal Path Length : 2.70mm (0.106)
Spring Force : 26gf (0.917oz) at 0.97mm Recommended Travel
Spring Force : 25gf (0.882oz) at 0.50mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Stainless steel, Gold plated
Spring : Music wire, Gold plated
Device Side : Hardened steel, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 3 amps continuous
Current Carrying Capacity : 3 amps continuous
Loop Inductance : 0.79nH
Loop Inductance : 0.58nH
Signal Pin to Return Capacitance : 0.32pF
Signal Pin to Return Capacitance : 0.23pF
-1 dB Insertion Loss Bandwidth : 15.98GHz
-1 dB Insertion Loss Bandwidth : 27.00GHz
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
13
300-00106-009
Ø 0.35
(0.0138)
Ø 0.57
(0.0224)
Ø 0.35
(0.0138)
300-00275-002
1.08 (0.0425)
3.20 (0.1260)
Ø 0.46
(0.0181)
4.80 (0.1890)
1.00 (0.0394)
Ø 0.84
(0.0331)
2.80 (0.1102) 4.30 (0.1693)
Ø 0.46
(0.0181)
0.50 (0.0197)
0.52 (0.0205)
Probe Specifications
Probe Specifications
Device Pitch : 0.80mm (0.031)
Device Pitch : 1.00mm (0.039)
Signal Path Length : 4.20mm (0.165)
Signal Path Length : 3.45mm (0.136)
Spring Force : 29.3gf (1.034oz) at 0.60mm Recommended Travel
Spring Force : 25gf (0.882oz) at 0.85mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Brass, Gold plated
Spring : Stainless steel, Gold plated
Spring : Stainless steel, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Hardened steel, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 3 amps continuous
Current Carrying Capacity : 5 amps continuous
Loop Inductance : 0.90nH
Loop Inductance : 0.69nH
Signal Pin to Return Capacitance : 0.36pF
Signal Pin to Return Capacitance : 0.28pF
-1 dB Insertion Loss Bandwidth : 8.05GHz
-1 dB Insertion Loss Bandwidth : 19.61GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
14
300-50031-002
300-00363-001
Ø 0.15
(0.0059)
Ø 0.18
(0.01)
0.95 (0.03)
3.25 (0.13)
Ø 0.31
(0.01)
Ø 0.16
(0.01)
0.50 (0.0197)
Ø 0.31
(0.0122)
2.60 (0.1024) 3.80 (0.1496)
Ø 0.15
(0.0059)
0.70 (0.0276)
1.80 (0.05)
0.5 (0.05)
Probe Specifications
Probe Specifications
Device Pitch : 0.40mm(0.016)
Device Pitch : 0.40mm (0.016)
Signal Path Length : 3.25mm(0.128)
Signal Path Length : 3.30mm (0.130)
Spring Force : 25gf (0.882oz) at 0.35mm Recommended Travel
Spring Force : 25gf (0.882 oz) at 0.50mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold Plated
Barrel : Phosphor Bronze, Gold plated
Spring : Music wire, Gold plated
Spring : Music wire, Gold plated
Device Side : Pd Alloy
Device Side : Hardened steel, Gold plated
Board Side : Hardened Beryllium Copper, Gold Plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 3 amps continuous
Current Carrying Capacity : 2 amps continuous
Loop Inductance : 0.46nH
Loop Inductance : 0.63nH
Signal Pin to Return Capacitance : 0.18pF
Signal Pin to Return Capacitance : 0.25pF
-1 dB Insertion Loss Bandwidth : 31.16GHz
-1 dB Insertion Loss Bandwidth : 22.17GHz
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
15
300-00034-004
Ø 0.20
(0.0079)
300-00099-002
0.87 (0.0343)
Ø 0.26
(0.0102)
Ø 0.31
(0.0122)
Ø 0.15
(0.0059)
3.90 (0.1535)
5.64 (0.2220)
1.00 (0.0394)
Ø 0.50
(0.0197)
3.60 (0.1417) 5.70 (0.2244)
Ø 0.26
(0.0102)
1.10 (0.0433)
0.87 (0.0343)
Probe Specifications
Probe Specifications
Device Pitch : 0.40mm (0.016)
Device Pitch : 0.65mm (0.026)
Signal Path Length : 5.04mm (0.198)
Signal Path Length : 4.94mm (0.194)
Spring Force : 22.1gf (0.780oz) at 0.60mm Recommended Travel
Spring Force : 20.1gf (0.709oz) at 0.76mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Stainless steel, Gold plated
Spring : Stainless steel, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 2 amps continuous
Current Carrying Capacity : 3 amps continuous
Loop Inductance : 0.89nH
Loop Inductance : 0.84nH
Signal Pin to Return Capacitance : 0.36pF
Signal Pin to Return Capacitance : 0.34pF
-1 dB Insertion Loss Bandwidth : 10.55GHz
-1 dB Insertion Loss Bandwidth : 13.70GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
16
300-00170-006
300-00025-002
1.00 (0.0394)
Ø 0.30
(0.0118)
Ø 0.58
(0.0228)
Ø 0.30
(0.0118)
3.60 (0.1417)
Ø 0.50
(0.0197)
1.90 (0.0748)
Ø 0.25
(0.0098)
0.75 (0.0295)
2.65 (0.1043)
5.70 (0.2244)
1.10 (0.0433)
Probe Specifications
Probe Specifications
Device Pitch : 0.80mm (0.031)
Device Pitch : 0.80mm (0.031)
Signal Path Length : 4.94mm (0.194)
Signal Path Length : 2.15mm (0.085)
Spring Force : 26.7gf (0.942oz) at 0.76mm Recommended Travel
Spring Force : 27.5gf (0.970oz) at 0.50mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Stainless steel, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Hardened steel, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 3 amps continuous
Current Carrying Capacity : 3 amps continuous
Loop Inductance : 0.84nH
Loop Inductance : 0.46nH
Signal Pin to Return Capacitance : 0.34pF
Signal Pin to Return Capacitance : 0.18pF
-1 dB Insertion Loss Bandwidth : 12.30GHz
-1 dB Insertion Loss Bandwidth : 31.16GHz
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
17
300-00167-001
Ø 0.52
(0.0205)
2.80 (0.1102)
Ø 0.30
(0.0118)
0.75 (0.0295)
300-00035-004
3.55 (0.1398)
Ø 0.60
(0.0236)
3.53 (0.1390)
Ø 0.30
(0.0118)
1.31 (0.0516)
4.84 (0.1906)
Probe Specifications
Probe Specifications
Device Pitch : 0.80mm (0.031)
Device Pitch : 0.80mm (0.031)
Signal Path Length : 2.95mm (0.116)
Signal Path Length : 4.04mm (0.159)
Spring Force : 25gf (0.882oz) at 0.60mm Recommended Travel
Spring Force : 33.4gf (1.178oz) at 0.80mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Stainless steel, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 3 amps continuous
Current Carrying Capacity : 4 amps continuous
Loop Inductance : 0.62nH
Loop Inductance : 0.76nH
Signal Pin to Return Capacitance : 0.25pF
Signal Pin to Return Capacitance : 0.30pF
-1 dB Insertion Loss Bandwidth : 26.80GHz
-1 dB Insertion Loss Bandwidth : 18.82GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
18
300-00059-002
300-00411-001
Ø 0.50
(0.0197)
Ø 0.67
(0.0264)
3.55 (0.1398)
0.70 (0.0276)
4.46 (0.1756)
1.00 (0.0394)
Ø 0.30
(0.0118)
Ø 0.35
(0.0138)
0.30 (0.0118)
0.91 (0.0358)
Probe Specifications
Probe Specifications
Device Pitch : 1.00mm (0.039)
Device Pitch : 0.80mm (0.031)
Signal Path Length : 3.81mm (0.150)
Signal Path Length : 0.80mm (0.031)
Spring Force : 40.1gf (1.414 oz) at 0.65mm Recommended Travel
Spring Force : 14gf (0.494 oz) at 0.20mm Recommended Travel
Materials
Materials
Barrel : Brass, Gold plated
Barrel : Phosphor Bronze, Gold plated
Spring : Music wire, Gold plated
Spring : Music wire, Gold plated
Device Side : Full-hard beryllium copper, Gold plated
Device Side : Phosphor Bronze, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Board Side : Full-hard beryllium copper, Gold plated
Electrical Specifications
Electrical Specifications
Typical Resistance : < 50 mΩ
Typical Resistance : < 50 mΩ
Current Carrying Capacity : 5 amps continuous
Current Carrying Capacity : 3 amps continuous
Loop Inductance : 0.76nH
Loop Inductance : 0.27nH
Signal Pin to Return Capacitance : 0.30pF
Signal Pin to Return Capacitance : 0.11pF
-1 dB Insertion Loss Bandwidth : 18.86GHz
-1 dB Insertion Loss Bandwidth : 40.10GHz
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
19
300-00773-002
300-00358-001
Ø 0.06
(0.0024)
Ø 0.10
(0.005)
0.50 (0.0197)
1.50
(0.005)
Ø 0.70
3.90 (0.1535) 5.00 (0.1969)
5.95 (0.15)
Ø 0.13
(0.005)
4.15 (0.053)
Ø 0.12
(0.005)
0.30 (0.05)
Ø 0.11
(0.0043)
Ø 0.08
(0.0031)
0.60 (0.0236)
Probe Specifications
Probe Specifications
Device Pitch : 0.20mm(0.008)
Device Pitch : 0.15mm(0.006)
Signal Path Length : 5.95mm(0.234)
Signal Path Length : 4.60mm(0.181)
Spring Force : 10gf (0.353oz) at 0.45mm Recommended Travel
Spring Force : 6gf (0.212oz) at 0.40mm Recommended Travel
Materials
Materials
Barrel : Phosphor Bronze, Gold Plated
Barrel : Phosphor Bronze, Gold Plated
Spring : Music wire, Gold plated
Spring : Music wire, Gold plated
Device Side : Pd Alloy
Device Side : Pd Alloy
Board Side : Hardened Steel, Gold Plated
Board Side : Pd Alloy
Electrical Specifications
Electrical Specifications
Typical Resistance : <300mΩ
Typical Resistance : < 300mΩ
Current Carrying Capacity : 0.3 amps continuous
Current Carrying Capacity : 0.3 amps continuous
Loop Inductance : 1.38nH
Loop Inductance : 1.15nH
Signal Pin to Return Capacitance : 0.55pF
Signal Pin to Return Capacitance : 0.46pF
-1 dB Insertion Loss Bandwidth : 6.5GHz
-1 dB Insertion Loss Bandwidth : 8.5GHz
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
20
300-01011-001 / 101
12.50 (0.10)
1.50 (0.05)
11.00 (0.05)
3~5° Bending
Spec
Ø 0.25 (0.01)
Ø 0.15 (0.01)
Spring Force : 25gf at 1.00mm Recommended Travel
Current Carrying Capacity : 0.5 amps continuius
14.00 (0.05)
Typical Resistance : <50mΩ
10.00 (0.05)
Plunger : Hardended Steel, Gold Plated
Wire
Barrel : Phosphor Bronze, Gold Plated
Spring : Music Wire or Stainless Wire, Gold Plated
0.10
Ø 0.40
Ø 0.35 (0.01)
300-01012-001 / 101
11.50 (0.10)
1.50 (0.05)
Spec
10.00 (0.05)
Ø 0.30 (0.01)
Ø 0.22 (0.01)
Spring Force : 30gf at 1.00mm Recommended Travel
Current Carrying Capacity : 0.5 amps continuius
13.00 (0.05)
Typical Resistance : <50mΩ
9.00
Plunger : Hardended Steel, Gold Plated
Wire
Barrel : Phosphor Bronze, Gold Plated
Spring : Music Wire or Stainless Wire, Gold Plated
0.10
Ø 0.46
Ø 0.40 (0.01)
300-01013-001 / 101
12.50 (0.10)
1.50 (0.05)
Spec
11.00 (0.05)
Ø 0.35 (0.01)
Ø 0.25 (0.01)
Spring Force : 40gf at 1.00mm Recommended Travel
Current Carrying Capacity : 1 amps continuius
14.00 (0.05)
Typical Resistance : <50mΩ
10.00 (0.05)
Plunger : Hardended Steel, Gold Plated
Wire
Barrel : Phosphor Bronze, Gold Plated
Spring : Music Wire or Stainless Wire, Gold Plated
Ø 0.50
0.10
Ø 0.45 (0.01)
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
21
300-01014-001 / 101
13.50 (0.10)
1.50
(0.05)
Spec
12.00 (0.05)
Ø 0.40 (0.01)
Ø 0.26 (0.01)
Spring Force : 40gf at 1.00mm Recommended Travel
Current Carrying Capacity : 2 amps continuius
16.00 (0.05)
Typical Resistance : <50mΩ
11.00
Plunger : Hardended Steel, Gold Plated
5.00
Wire
Barrel : Phosphor Bronze, Gold Plated
Spring : Music Wire or Stainless Wire, Gold Plated
0.10
Ø 0.63
Ø 0.56 (0.01)
Ø 0.49 (0.01)
300-01015-001 / 101
15.50 (0.10)
2.80 (0.05)
Spec.
12.70 (0.05)
Ø 0.50 (0.01)
Ø 0.37 (0.01)
Spring Force : 45gf at 1.80mm Recommended Travel
Current Carrying Capacity : 2 amps continuius
Typical Resistance : <50mΩ
Plunger : Hardended Steel, Gold Plated
17.50 (0.05)
12.57
0.70
2.50
5.00
Wire
Barrel : Phosphor Bronze, Gold Plated
Spring : Music Wire or Stainless Wire, Gold Plated
Ø 0.76 (0.01)
Ø 0.68 (0.01)
Ø 0.56 (0.01)
300-01016-001 / 101
16.40 (0.10)
3.65 (0.05)
Spec.
12.75 (0.05)
Ø 0.68 (0.01)
Ø 0.52 (0.01)
Spring Force : 65gf at 1.80mm Recommended Travel
Current Carrying Capacity : 2 amps continuius
Typical Resistance : <50mΩ
Plunger : Hardended Steel, Gold Plated
17.50 (0.05)
2.50
0.50
12.64
4.86
Barrel : Phosphor Bronze, Gold Plated
Spring : Music Wire or Stainless Wire, Gold Plated
Ø 0.95 (0.01)
Ø 087 (0.01)
All specifications are subject to change without notice | All specifications may be modified upon customer request | All dimensions are in mm (inches)
22
Ø 0.76 (0.01)
Wire
300-01017-001 / 101
28.10 (0.10)
8.10 (0.05)
21.80 (0.05)
Ø 0.68 (0.01)
Ø 0.48 (0.01)
26.00 (0.05)
21.80
6.05
4.20
0.70
Wire
Ø 0.98 (0.01)
Ø 0.87 (0.01)
Ø 0.76 (0.01)
Spec.
Spring Force : 40gf at 1.00mm Recommended Travel
Plunger : Hardended Steel, Gold Plated
Current Carrying Capacity : 2 amps continuius
Barrel : Phosphor Bronze, Gold Plated
Typical Resistance : <50mΩ
Spring : Music Wire or Stainless Wire, Gold Plated
300-01018-001 / 101
32.80 (0.10)
8.10 (0.05)
24.70 (0.05)
Ø 0.75 (0.01)
Ø 1.01 (0.01)
39.20 (0.08)
24.70
6.75
5.50(0.01)
9.05 (0.01)
0.50
Ø 1.40 (0.01)
Ø 1.28 (0.01)
Ø 1.00 (0.01)
Ø 0.55 (0.01)
Spec.
Spring Force : 40gf at 1.00mm Recommended Travel
Plunger : Hardended Steel, Gold Plated
Current Carrying Capacity : 2 amps continuius
Barrel : Phosphor Bronze, Gold Plated
Typical Resistance : <50mΩ
Spring : Music Wire or Stainless Wire, Gold Plated
All spring forces are in grams (ounces) | Some models may be proprietary and not be available for general distribution
23
Qualmax, Inc.
3003 N. 1st St.,
Suite 340, San Jose,
CA 95134, USA
TEL: 1-408-519-5748
FAX: 1-408-490-1820
Qualmax Testech, Inc.
477 Hyeondeukseo-ro,
Hyeondeuk-myun,
Pyeongtaek-si, Gyunggi-do,
Korea 451-813
TEL: 82-70-4481-3300
FAX: 82-31-684-8105
www.qualmax.com
info@qualmax.com
24