Vietnam`s Leading Supplier of Semiconductor Equipment, Tools

Transcription

Vietnam’s Leading Supplier of
Semiconductor Equipment,Tools, and Materials!
Ho Chi Minh: (+84) 8 268-0958 Hanoi: (+84) 91-225-7173
Fax: (+84) 8 268-9057 Email: sales@acrosemi.com
Acrosemi Corporation
Table of Contents
By Alphabetical Order
Page
Air Shower………………………………………………………………………………………………………….. 42
Air Shower Pass-thru……………………………………………………………………………………………… 42
Artic Temperature Check…………………………………………………………………………………………. 47
Automated Substrate Handling Systems……………………………………………………………………….. 38
Automated Dicing Saws…………………………………….…………………………………………………….. 38
Accessories by West.Bond ………………………………………………………………………………………. 52
Automated PCB Inspection (AOI)………………………………………………………………………………… 44
Bonders……………………………………………………………………………………………………………… 11
Bonding Tools………………………………………………………………………………………………………. 53
Centrifuges………………………………………………………………………………………………………….. 46
Chamber…………………………………………………………………………………………………………….. 47
Chemical Dispensing System …………………………………………………………………………………… 49
Chip Packaging…………………………………………………………………………………………………….. 33
Cleaning Products & Services …………………………………………………………………………………… 44
Conveyor…………………………………………………………………………………………………………….. 11
Cutting Water Closed-loop Filtration …………………………………………………………………………….. 75
Customized Solutions ……………………………………………………………………………………………… 76
Die Bonding…………………………………………………………………………………………………………. 06
Dicing - Complete Dicing Solutions……….……………………………………………………………………… 64
Dicing Accessories ………………………………………………………………………………………………... 73
Dicing Blades Selection Assistant ……………………………………………………………………………….. 74
Dicing Flanges ……………………………………………………………………………………………………… 72
Dicing Process ……………………………………………………………………………………………………… 77
Dicing Tape………………………………………………………………………………………………………….. 20
DI Water Ionizer ……………………………………………………………………………………………………. 75
Dry Boxes……………………………………………………………………………………………………………. 23
Electronic Door Opener…………………………………………………………………………………………….. 42
Fume Hood………………………………………………………………………………………………………….. 48
Frames and Cassettes ……………………………………………………………………………………………. 75
Furnaces……………………………………………………………………………………………………………... 34
HAST System ………………………………………………………………………………………………………. 46
Industrial Auto Claves ……………………………………………………………………………………………… 46
Gowning room ………………………………………………………………………………………………………. 43
Laboratory Balance…………………………………………………………………………………………………. 44
Leak Detection System…………………………………………………………………………………………….. 46
Mask Aligners ………………………………………………………………………………………………………. 32
Ovens ………………………………………………………………………………………………………………… 23
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A c r o s e m i Co r p o r a t i on
Table of Contents
By Alphabetical Order
Page
Packaging……………………………………………………………………………………………………………. 33
Pass-Thru Chambers……………………………………………………………………………………………….. 40
Probe Station………………………………………………………………………………………………………… 38
Process Controllers…………………………………………………………………………………………………. 49
Process Tank………………………………………………………………………………………………………… 48
Reflower……………………………………………………………………………………………………………… 15
Rework Stations……………………………………………………………………………………………….……. 19
Safety Equipment ………………………………………………………………………………………………….. 45
Screen & Stencil Printers………………………………………………………………………………………….. 25
Sealing……………………………………………………………………………………………………………….. 21&50
Service……………………………………………………………………………………………………………….. 80
SMT (Surface Mount Technology)………………………………………………………………………………… 16
Spindle Coolant Recirculation …………………………………………………………………………………….. 75
Static Control Equipment…………………………………………………………………………………………… 44
Steam Ager………………………………………………………………………………………………………….. 47
Storage System……………………………………………………………………………………………………… 43
Surface Mount Assembly (Full SMT line)…………………………………………………………………………. 16
Temperature Control ……………………………………………………………………………………………….. 43
Testing……………………………………………………………………………………………………………….. 9&49
Tools & Materials……………………………………………………………………………………………………. 50
Training……………………………………………………………………………………………………………….. 66
UV Curing System ………………………………………………………………………………………………….. 75
Vacuum Bake-Out Oven……………………………………………………………………………………………. 23
Vacuum Pressure Furnaces……………………………………………………………………………………….. 34
Vacuum Sealers.……………………………………………………………………………………………………. 50
Wafer Cleaning Station ……………………………………………………………………………………………. 75
Wafer/Film Frame Tape Applicator……………………………………………………………………………….. 20
Wafer Bonders………………………………………………………………………………………………………. 33
Wafer Treatment Products………………………………………………………………………………………… 44
Welding & Sealing…………………………………………………………………………………………………… 21
Wet Benches………………………………………………………………………………………………………….48
Wire Bonding………………………………………………………………………………………………………… 07
Wire Pull Tester……………………………………………………………………………………………………… 09
Work Stations……………………………………………………………………………………………………..…. 12
Workpiece Mounting Unit ………………………………………………………………………………………….. 75
X-Ray ………………………………………………………………………………………………………………… 36
Vibration Testing System…………………………………………………………………………………………....49
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Page 3
Table of Contents
By Category
Page
Die Bonding…………………………………………………………………………………...………………………………. 06
Manual Die Bonder………………………………………………………………………………………………… 06
Manual Pick and Place System…………………………………………………………………………………... 17
Flip Chip Die Bonder………………………………………………………………………………………………. 17
Wire Bonding…………………………………………………………………………………………………………………. 07
Manual Wire Bonder………………………………………………………………………………………………. 07
Semi-Automatic Wire Bonder………….…………………………………………………………………………. 08
Automatic Wire Bonder …………………….………………………………………………………………….. 10
Testing and Inspection
Pull Testing…………………………………………………………………………………………………………. 09
AOI Inspection System……………………………………………………………………………………………. 37
X-Ray Inspection System ………………………………………………………………………………………… 36
Dicing (Complete Dicing Solutions) ………………………………………………………………………………………. 64
Surface Mount Assembly (Full SMT line)………………………………………………………………………………….. 16
Screen & Stencil Printers …………………………………………………………………………………………………… 25
Conveyor/Dryers……………………………………………………………………………………………………………… 11
Mask Aligners…………………………………………………………………………………………………………………. 32
Packaging……………………………………………………………………………………………………………………… 33
Wafer Bonders………………………………………………………………………………………………………………… 33
Dicing Tape……………………………………………………………………………………………………………………. 20
Welding & Sealing…………………………………………………………………………………………………………….. 21
Vacuum Pressure Furnaces………………………………………………………………………………………………… 34
Vacuum Sealers …………………………………………………………………………………………………………….. 50
Probe Stations………………………………………………………………………………………………………………… 38
Cleanroom Products…………………………………………………………………………………………………..…….. 40
Bonding Tools, Wires & Materials …………………………………………………………………………………………. 53
Accessories by West.Bond …………………………………………………………………………………………………. 52
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Page 4
Table of Contents
By Company
Page
West.Bond…………………………………………………………………………………………………………….. 06
Samsung SMT………………………………………………………………………………………………………… 11
Semiconductor Equipment Corporation (S.E.C)……………………………………………………...…………… 17
Polaris Electronics……………………………………………………………………………………………………. 21
Affiliated Manufacturers Incorporated (A.M.I)……………………………………………………………………… 25
Neutronix-Quintel……………………………………………………………………………………………………... 32
SST International………………………………………………………………………………………………...…… 33
YESTech………………………………………………………………………………………………………………. 35
Cascade MicroTech………………………………………………………………………………………………….. 38
Terra Universal ………………………………………………………………………………………………………. 40
DeWeyl Tool Company………………………………………………………………………………………………. 53
Universal (Far East)………………………………………………………………………………………………….. 40
TRIO-TECH International……………………………………………………………………………………………. 40
ACCVACS……………………………………………………………………………………………………………... 50
Advanced Dicing Technologies (A.D.T)……………………………………………………………………………. 64
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Page 5
WEST BOND 7200CR
Manual Epoxy Die Bonder
Model 7200CR provides separate functions on the same tool head to dispense epoxy, then to pick up chips, rotate them into alignment, and place
them. All operation is controlled by West·Bond’s unique three axis micromanipulator, working in combination with optical encoders under microprocessor control. The work piece is held on a free anvil work holder,
where chips are also arrayed for pick up. This machine is very easy to use.
WEST BOND 7316C
Manual Eutectic Die Bonder
Model 7316C allows to pick up and place chips and then bond them by the
mechanical scrub, eutectic method. All operation is controlled by
West·Bond’s unique three-axis micromanipulator under microprocessor
control. The work piece is held on a heated work holder, where chips are
also arrayed for pick up. This machine is very easy to use.
WEST BOND 7327C
Manual Multi-Collet Eutectic Die Bonder
This machine with a pneumatically operated turret mechanism to rotate into
use position a succession of six differently sized die collets. Collets may not
be heated. Turret advance to the next position is by a pushbutton switch on
the manipulator control. Six sets of values for velocity, distance and number
of "Y" axis scrub strokes are entered into buffers associated with the turret
tool positions, and so execute a scrub motion program appropriate to each
bond tool. This machine is very easy to use.
WEST BOND 7367E
Manual Eutectic Tweezer Die Bonder
Model 7367E with heads for mechanized tweezers pick up and placement
of die, and for vacuum pick up and placement of preforms. Tweezers
clamping force is set and displayed by an included load cell calibration fixture, to hold the very low values necessary to place fragile die. The scrub
motion for the bond head’s driven by the transfer motor, is programmable .
Head lift motion is locked out during scrub. Bond force is adjusted . It is
very easy to use.
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WEST BOND 7476D
Manual Wedge-Wedge Wire Bonder
Machines of this series bond aluminum or gold wires from 0.0007 in. to
0.002 in. diameter, gold ribbon 0.0005 in. by 0.002 in. through 0.001 in. by
0.010 in. by the wedge-wedge technique using ultrasonic energy to attach
aluminum wire at room temperature and adding work piece heat for gold
wire. Wire is fed to the work point by two methods selectable by exchange
of wire clamps; either diagonally through the heel of the bonding wedge, or
vertically down through a hollow wedge. Either allows programmed motions
to clamp, break, and feed wire continuously, but requires front-to-back
bonding direction. This machine is very easy to use.
WEST BOND 7700D
Manual Single Ball or Ball-Wedge Wire Bonder
Machines of this series bond gold wires ranging from 0.0007 in. to 0.002 in.
Bonds are made by the ball-to-wedge technique using ultrasonic energy and
work piece heat. Wire is clamped and threaded vertically through a hollow
capillary, allowing independent feeding action. The connection is begun with
a ball formed on the end of the wire stock by electric discharge, and completed by a wedge bond under the end of the capillary tool. The operator
using hand/eye reference to bond targets and elevations guides the bonding
tool manually.
WEST BOND 7372E
Manual Epoxy and Eutectic Dual-Head Die Bonders
Model 7372 use the heads alternately to pick up, rotate, place and bond
chips. Both pick-up and bonding can be done by different methods,
changeable by detachable heads. The machine action to exchange heads
places each one in view at the same use position, and by motions that are
now also orthogonal rather than pivoted. The advantages of the E-Series –
gantry construction to allow unlimited work piece size, orthogonal motions
rather than pivoted, individual axis brakes. ESD protection is included. It is
easy to use.
WEST BOND 7374E
Manual Beam Lead Die Bonders
This machine adapted for ultrasonic bonding, with heat, of the tab leads of
beam lead diodes. The right head is used for pick up of the tabbed die with
provision for rotation at placement. The left head used for bonding the tabs
is equipped with K~Sine Model 46-D Ultrasonic Transducer and with radiant
heat to the bond tool. Built-in ultrasonic power supply is K~Sine Part No
6795, four Watts, dual channel. Settings of power and time program values
are executed via an eight bit interface. Force is adjustable by force spring
through a range of 10 to 175 grams. This machine is very easy to use.
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Page 7
WEST BOND 7476E
Manual Wedge-Wedge Wire Bonder
The base model of this series is Model 7400E, an ultrasonic/thermo-sonic
wedge-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid or microwave devices. The machine bonds aluminum or
gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the
wedge-wedge technique using ultrasonic energy to attach aluminum wire at
room temperature and adding work piece heat for gold wire. Wire is
clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The
bonding tool is guided manually by the operator using hand/eye reference
to bond targets and elevations. This machine is very easy to use.
WEST BOND 7700E
Manual Single Ball or Ball-Wedge Wire Bonder
Model 7700E is a thermo-sonic ball-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices. The
machine bonds gold wires ranging from 0.0007 in. to 0.002 in. Bonds are
made by the ball-to-wedge technique using ultrasonic energy and work
piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing independent feeding action. The connection is begun with a
ball formed on the end of the wire stock by electric discharge, and completed by a wedge bond under the end of the capillary tool. The bonding
tool is guided manually by the operator using hand/eye reference to bond
targets and elevations. This machine is very easy to use.
WEST BOND 747676E
Manual Wedge-Wedge and Ball-Wedge Wire Bonders
Triple Convertible Machines: Including Model 7476E and Model 7700E. This
machine with three bond tool heads, 45° head, 90° head, and ball bonding
head, all convertible. This machine is very easy to use.
WEST BOND 454647E
Semi-Automatic Wedge-Wedge và Ball-Wedge Wire Bonders
Triple Convertible Machines: Including Model 4546E and Model 4700E. This
machine with three bond tool heads, 45° head, 90° head, and ball bonding
head, all convertible.
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WEST BOND 4546E
Semi-Automatic Wedge-Wedge Wire Bonder
Motorized Z and Y Axes
This machine was revolutionary at its inception as the first to make a wire
bond connection fully under programmable software control executed digitally by motors, thus making possible the manufacture of high frequency,
high power semiconductor devices where connections must be identical.
Model 4~00E brings forward the new advances of the "E" Series, notably
the placement of all machine mechanism above the work plane to allow
unlimited access, and the setting of axis brakes to lock on target. There is
choice of alignment by either microscope or video. Bonding mechanism is
constructed of four axes, straight-line and orthogonal, stacked in an array.
Two axes, X and Y, are driven by micromanipulator for positioning, then held by pneumatic brakes for bonding.
Two axes, W (in Y direction) and Z, are driven by programmed motors to create and arch the connection.
WEST BOND 4700E
Semi-Automatic Ball-Wedge or Single Ball Wire Bonder
Model 4700E brings forward the new advances of the "E" Series, notably
the placement of all machine mechanism above the work plane to allow
unlimited access, and the setting of axis brakes to lock on target. There is
choice of alignment by either microscope or video. Bonding mechanism is
constructed of four axes, straight-line and orthogonal, stacked in an array.
Two axes, X and Y, are driven by micromanipulator for positioning, then
held by pneumatic brakes for bonding. Two axes, W (in Y direction) and Z,
are driven by programmed motors to create and arch the connection.
WEST BOND 70PTE
Wire Pull Tester
Model 70PTE Wire Pull Tester provides an exceptionally convenient means
to place a hook under the arch of a bonded wire and then lower the wire
under microprocessor control to measure tensile strength, either destructively or non-destructively. Embodied in this series is a new and unique
WestÂ·Bond three-axis micromanipulator in which the entire mechanism is
arrayed above the work plane, so that there is now no limit to the size of
the work piece. The X, Y, and Z axes are straight-line and purely orthogonal, and each is braked pneumatically during the workstation pull stroke.
Dual counterweights balance the pantograph arm and the tool support individually, complemented by an adjustable spring to counterbalance the hook
tool assembly. The large work platform moves up and down in extremely small steps about a simple pivot while a
load cell measures the force of the wire on the hook.
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WEST BOND 353637E
Automatic, Gantry, Large Area, Wedge & Ball Bonders
Model 353637E : Three-Way Convertibility, 45° Wire Feed, 90° Wire and Ribbon Feed, or Ball Bonder
Model 3536E :Two-Way Convertibility, 45° Wire Feed, or 90° Wire and Ribbon Feed
Model 3700E :Single Ball or Ball-Wedge Bonder
Model 353637E is a gantry with overhead ways and a moving bond
head that brings the bonding function to the work and leaves the
material handling process flow under customer control. The program runs under Windows XP Professional and is executed by a
Pentium 4 processor housed in an Industrial CPU enclosure. Pattern Recognition is accomplished by Matrox components. The User
Interface is displayed on a large LCD color display, and consists of
many screen forms for user interaction. It allows to locate and bond
automatically fine wire connections arrayed over a large, stationary
work piece. There is no limit to the size of the work as this machine
is entirely above the bond plane. The area traversed for bonding is
five and three-eighths by nine and one-half inches; and successive
areas could be presented. The wedge-wedge bonding method accepts aluminum wire, or gold wire with work piece
heat. The primary wire feed method through angled clamps can be converted by exchange of clamp assemblies to
vertical-feed wedge bonding for deep-walled work packages. This machine is intended to bond groups of parallel
wires on work pieces pre-aligned for front-to-back bonding, or can also bond at any wire angles. Quality expectation is high with missing wire detection that functions without work contact, and with on-screen presentation of bond
progress via a second, side-view camera.
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SAMSUNG UL-500
Magazine Unloader
- UL-300 can adopt 3 magazines (Upper 1ea / Lower 2ea)
- UL-500 can adopt 5 magazines (Upper 2ea
/ Lower 3ea)
- Side clamping system for preventing the distortion of magazines
- Adjustable feeding pitch (10,20,30,40mm)
- Self diagnosis function for 7 segments
* Options
- Quick magazine change over system (20s)
- Cooling fan for pusher conveyor
- Automatic conveyor width adjustment (Function)
SAMSUNG GC-170
Gate Conveyor
- High safety design
- Adjustable conveyor speed
- Swing-type gate
- Operator accessing to rear
- Higher security with safety switch
- Passivity gate open, cross
- Easy width adjustment
* Options
- Automatic conveyor width adjustment
SAMSUNG FC-100
Fan Cooling Conveyor
- PCB cooling effect by using fans
- Adjustable fan direction & speed freely
- Adjustable cooling time with a timer
- Conveyor speed adjustable
- Three cooling fans applied.
* Options
- Number of cooling fan & conveyor length
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Page 11
SAMSUNG WS-200
Work Station
- Adjustable conveyor speed
- Various modes are selectable
(Auto,Pass,Manual)
- Easy width adjustment(Manual)
* Options
SAMSUNG NS-100
NG Stocker
- Suitable for inspection unit line
- The efficient control of NG(bad) PCBs
- An excellent substitute for unloader.
- Various feeding pitch. 1~4 steps(10,20,30,40mm)
* Options
- Quick magazine change over system (20 seconds)
- Buffer conveyor
- Automatic conveyor width & pusher
position adjustment
SAMSUNG UL-300
Magazine Unloader
- Self diagnosis function for 7 segments
* Options
- Cooling fan for pusher conveyor
- Automatic conveyor width adjustment (Function)
SAMSUNG LD-500
Magazine Unloader
- LD-300 can adopt 3 Magazines (Upper: 1ea,Lower : 2ea)
- Self diagnosis functio for 7 segments
* Options
- Magazine change overtime (20 seconds)
- Buffer conveyor(LD-500 : B Type)
- Automatic pusher position adjustment
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SAMSUNG TC-100
Turning Conveyor
- Useful unit for L-type line up
- The condition of line buffer abbreviation
* Options
SAMSUNG WT-150
Work Table
- Optimal brightness of electric bulbs (WT-150)
- Adjustable conveyor speed(WT-200)
- Various modes are selectable (Auto, Pass, Manual)
- Easy width adjustment (manual)
* Options
SAMSUNG WT-100
Work Table
Optimal brightness of electric bulbs (WT-150)
Adjustable conveyor speed (WT-200)
Various modes are selectable (Auto, Pass,Manual)
Easy width adjustment (manual)
* Options
Automatic conveyor width adjustment
SAMSUNG LD-150V
Bare Board Loader
- Safety cover design
- Reducing PCB handling time by Lift up/down mechanism
- Can support weighty PCB by strong vacuum system
- According to PCB size, vacuum pads are easily changeable (6Î¦,8Î¦,10Î¦)
* Options
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Page 13
SAMSUNG WT-200
Work Table
- Optimal brightness of electric bulbs (WT-150)
- Adjustable conveyor speed(WT-200)
- Various modes are selectable (Auto, Pass,Manual)
- Easy width adjustment (manual)
* Options
- Quick magazine change over system
(20s)
SAMSUNG IV-100
InvertFlip Station
- Inverter with buffer conveyor is available (IV-150)
- Easy width adjustment by handle (Manual)
* Options
SAMSUNG GC-300
Gate Conveyor
Gate conveyor of shuttle type.
* Options
- Gate open by foot switch
SAMSUNG CC-100
Connection Conveyor
- Conveyor speed adjustable
- Muiti mode (Auto,Pass,Manual)
* Options
- Conveyor length
SAMSUNG LD-300
Magazine Unloader
- Self diagnosis functio for 7 segments
* Options
- Magazine change overtime (20 seconds)
- Buffer conveyor(LD-500 : B Type), Automatic pusher position adjustment
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Page 14
SAMSUNG CP45 Neo
Chip Mounter
14,900 CPH(IPC9850)
0603Chip ~ 42mm(55mm Option)
PCB Size : 510X460mm(Option)
104 X 8mm Feeder Capacity
SAMSUNG CP40C
High Speed Mounter
Designed to handle various components from 0603 to QFP & BGA,
the CP40C enhances the line efficiency of production. Over 1000 field proven installations of CP40C in the world ensures product stability with minimum down time
SAMSUNG CP40CV
High Speed Mounter
Designed to handle various components from 0603 to QFP & BGA
enhances the line efficiency of production. Over 1000's field proven installation of
CP40CV in the world ensures product stability with minimum down time
SAMSUNG RF30 Series
Reflow Soldering System
- Heating and cooling function applicable for the lead-free soldering of various boards
- Energy saving design considering the global warming
- Compact design emphasizing the productivity and floor environment
- Flux recovery function that increased the degree of cleanliness of oven exhausted air
- Added rich productivity management information for operation status, history and output management
- Electrical wiring and structure frame design that improve the maintenance-ability.
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SAMSUNG GC-300
Dispenser
- High Speed Bonding, 32,000DPH(Dot/Hr)
- dispensing Accuracy : Â±0.1mm (3)
- High Speed Dotting with 2 Spindle Bonding Heads
- High Accuracy Bonding by a Fiducial Vision Camera
- Precise Measurement of the Height of the Nozzle on Z-axis by Laser Sensor
(Option)
- Handles the largest PCB [510mm(L)Ã—460mm(W)] among the series of DP models
- Handles 1608Chip ~ SOP, QFP
SAMSUNG Full-line SMT
To find the full SMT line for your company can be time-consuming, costly, and difficult. At Acrosemi, we can help
you stay ahead of the competition and accelerate the process of product design, development, and delivery by
helping you to find the right products for your company. Contact us today for a free quote and see why so many of
our customers are satisfied with the full SMT line that we provide!
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Page 16
S.E.C Model 850
Flip Chip Die Bonder
Semiconductor Equipment Corporation's Model 850 is a versatile, semiautomatic placement system for flip chips, chip scale devices and bare die.
The system is intended for low volume production and development projects
requiring accuracies of +/- 12 microns. A typical application consists of a
cycle in which devices are picked up from a waffle pack, dipped into flux
and then placed on a substrate.
An optional heated stage (S.E.C. Model 855) is available. An additional option, S.E.C.'s Model 430 Hot Gas Jet Module can be integrated to operate
on the S.E.C. Model 850 as a spot heating source for airflow.
S.E.C Model 860
The Eagle Omni Die Bonder
Model 860 Eagle is a multi-use semiautomatic system ideal for R & D and
low volume production. Applications include solder and gold bumped flip
chip, eutectic bonding including laser diodes and bars and epoxy bonding.
Some of the process capabilities that support these applications are ultrasonic, thermosonic, scrub, flux dipping and hot gas spot heating. The new
system is designed for maximum versatility and ease of operation. The Eagle's base platform includes a retractable cube beam splitter viewing system
with LED lighting, precision servo-driven Z motion with closed loop bond
load control, closed loop temperature controls for head, stage and spot
heating and Windows XP Pro operating system. Various standard heads
and stages are available.
S.E.C Model 830
Manual Pick & Place System
The Model 830 is a general purpose pick and place system for die and surface mount components. The 830 offers manually or pneumatically controlled Z motion with semiautomatic vacuum pickup tool movement for transferring die and other small devices from tape or carrier trays to packages. A
footswitch option controls the pick - up head to lower the pickup tool to working height and return it home. Open frame design assures full visiblilty and
complete access of all system components. Operator friendly - takes less
than two minutes to learn to operate. Epoxy die bonding capability can be
easily added. The 830 works with any tape - mounted die removal system,
including S.E.C.'s Model 4800 heated tape expanding die ejector grid featuring a grid plate that can be machined with one of two different pyramid
pitches. .
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S.E.C Model 4800
Die Ejector Grid
A specially designed system to allow die to be loosened for quick and safe
removal from plastic wafer mounting tape. Eliminate the need for ejector
pins or pokers which can break die as they are being ejected from the tack
on the tape.
S.E.C. Model 4750
Die Ejector System
(Poker Plate)
Adaptable to most die handling & die bonding systems
Virtually maintenance free
One moving part
Stand alone die plating system
S.E.C Model 360
UV Exposure System
Revolutionary new design cures UV tapes quickly and uniformly, features an
ultra long life light source and handles all size wafers up to 300mm.
The Model 360 UV exposure system needs no external ventilation and has
a small 18" diameter footprint.
S.E.C Model 300
Wafer/Frame Tape Applicator
Semiconductor Equipment Corporation's wafer/film tape applicator provides
users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers
and their film frames for subsequent cutting of wafers into die. The Model 300
is specifically designed for 300mm wafers.
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Page 18
S.E.C Model 3200/3250
Wafer/Backlap Applicator
Eliminates bubbles between tape and wafer
Provides uniform tension between tape and wafer
Operates with backed and non-backed tape
Adjustable roller pressure
Cuts tape within .005 " of edge of wafer
S.E.C Model 430
Hot Gas Rework Module
Hot gas jet directs up to 800 Âº C heated gas through an interchangeable
quartz nozzle to a specific area. .
S.E.C. Model 450
Hot Gas Rework Station
Using carefully regulated heat controls, quickly and easily removes surface
mounted components and bonded die from PC boards, hybrid micro-circuits
and packages without disturbing nearby components or damaging the removed device.
S.E.C Model HS-1810
Die Matrix Expander
Expand up to 8" wafers including adjustable preheat timer, adjustable motorized stage stroke and speed control, heated stage to 100Âº C and built in
cutter tape separation system.
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Page 19
S.E.C. Model 3100/3150
Wafer/Frame Tape Applicators
Semiconductor Equipment Corporation's Model 3100 & 3150 Wafer/Film
Frame Tape Applicators apply tape with optimal control of temperature and
pressure parameters. Uniform, bubble-free mounting of tape for wafer dicing
is the result. State-of-the-art features make them two of the most advanced
systems available. The Model 3100 handles wafers up to 6" in diameter,
while the Model 3150 handles any size wafer up to 8" in diameter. Both
models are so versatile, they can operate with virtually any film frame.
S.E.C Tape
Tape for Semiconductor Wafer Dicing and Hybrid Substrate Sawing
For nearly 30 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of
tapes which are manufactured specifically for semiconductor wafer dicing
and for ceramic hybrid substrate sawing. These tapes are also useful for
surface protection and many other applications that require an adhesive
tape with relatively low adhesion, no adhesive transfer, and the ability to
stretch without tearing.
S.E.C UV Tape
UV Curable Tape
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure.
S.E.C. High Purity Tape
High Purity Pressure Sensitive Expandable Tape with Liner
Low ionic impurities and adhesion stability make this the perfect tape for
your clean room application.
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POLARIS Accu-Weld 4100 AC/4200 CD
Vacuum Welder
Accu-Weld 4100 AC/Accu-Weld 4200 CD Projection Welding system has capability
of hermetically sealing one small metal electronic package at a time in one shot by
pulling a vacuum and welding, pulling a vacuum and backfilling with an inert gas and
welding, or by welding without pulling a vacuum or backfilling with an inert gas.
Single-Station Welder
Accu-Weld 5100 AC/5200 CD single station projection welder. This system will weld
one projection weld type package with flanges on the header and lid at a time. This
system does not have the capability of welding in a vacuum.
Multi-Station Welder
Accu-Weld 7100 AC/Accu-Weld 7200 CD Projection welding system with capability of
hermetically sealing (8) small metal electronic packages in one shot on our (8) position rotary table welding system. Accu-Weld 7100 AC/7200 CD (8) position rotary
table projection welding system. This system has (8) positions available for loading
(8) packages at a time on the rotary table and welding at a rate of 2000 + per hour
depending on material and size of package.
POLARIS VENUS III
Parallel Seam Sealer
This system will hermetically seal one small metal/ceramic electronic package (in a
square or rectangular configuration) at a time.
www.acrosemi.com
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POLARIS VENUS IV
Parallel Seam Sealer
This system will hermetically seal small metal/ceramic electronics packages in a
square, rectangular, or round configuration. It will seal one package at a time and
also has the capability of matrix sealing.
POLARIS SNAP-TITE
Spacer/Insulator Application System
Snap-tite's unique design makes accurate application of insulators quick and easy.
The snap-on format eliminates the need for adhesives, yet insulators stay secure.
Because Snap-tite is so simple to load and operate, no training is required. Just insert the prepackaged cartridge and start applying the insulators. Snap-tite is air operated, virtually maintenance free and offers rapid and accurate placement of insulators.
PLOLARIS ACCU-WELD 1100
Spot Welder
We applied the technology developed for hermetic sealing to precision spot welding
and got dramatic results. The precise control of current and force by the Accu-Weld
Spot Welder delivers better yields than other spot welders. Available with AC or +/DC current, the Accu-Weld Spot Welder can weld a wide variety of part sizes and
materials including wire welding. It is easy to use and competitively priced for a
lower initial investment. Microprocessor Control with key pad entry and LED readout Power Supply available in 1.0 KVA, 3.5V or 7.5 KVA, 7V Electrical service requirement: 220V, 20 AMP, Single Phase Throat Depth: 2.5" to 4.5"
PLOLARIS LID TACKER
Lid Tacker
This system was designed for tacking lids on to headers before taking them into a
vacuum/bake-out oven and then into an inert gas filled glove box to hermetically
seal the package shut. The Lid Tacker tacks a variety of lid sizes for microelectronic
and optoelectronic packages using either a singular or matrix (multiple) mode. It is
also ideal for fine wire and ribbon bonding to hybrid or microwave circuitry, fine line
printed circuit traces, miniature components and thin or thick film substrates. It is so
versatile, it can be used as a gap welder for battery pack assemblies. This model
tacks a variety of lid sizes for microelectronic and optoelectronic packages using either a singular or matrix
(multiple) mode. It is also ideal for fine wire and ribbon bonding to hybrid or microwave circuitry, fine line printed
circuit traces, miniature components and thin or thick film substrates. The Polaris Lid Tacker is so versatile, it can
be used as a gap welder for battery pack assemblies, too. Adjustable Gap Range: 0 to .060". Total gap range: 0 to
1.0". Throat Depth: 6.75" Manual or Air Actuation. Power Supply: AC-1KVA, 3.5 V Electrical Service Requirement:
220V, 20 AMP, Single Phase Stand alone or enclosed in atmosphere chamber. Fast, easy changeovers.
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POLARIS
Atmosphere Chambers
Our Atmosphere Chambers feature a charging system with 1 1/2" water column
positive pressure of nitrogen or other inert gases.They are constructed from 304
stainless steel featuring a modular construction with removable end panels. Optional
moisture monitors and current analyzers available with our atmosphere chambers.
Select from 2 sizes:
24" X 24" X 48" (2-glove port)
4" X 24" X 60" (4-glove port)
POLARIS
Pass-Thru Interlock Chamber
Remove welded parts independent of the oven.
Purging Gas Controls and dual interlock doors maintain gas integrity in atmosphere
chamber.
PLOLARIS Orion II
Gas Dryers
The Orion II Gas Dryers are capable of achieving levels of less than 5 PPM of moisture and oxygen. They are available in both single and dual column systems and
recirculate gas at 2400 CFH.
POLARIS
Vacuum Bake-Out Oven
Used to bake packages under vacuum to help eliminate moisture. Our standard Vacuum Bake-Out Oven features automatic oven control up to 200Â° C. A special order
system is available with an automatic oven control up to 350Â° C.
+ Available in range of sizes to accommodate various production schedules
+Includes vacuum pump
+ Available with optional Cycle Master Automatic Programmable Oven Sequencer
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PLOLARIS
Current Analyzer
Monitors current during welding process
Essential for setting up precise weld schedules
Available with optional Cycle Master Automatic Programmable Oven Sequencer
PLOLARIS
Hermetic Sealing Services
Metal to metal and ceramic to metal microelectronic and optoelectronic package sealing to mil standard
Vacuum bake-out to help remove moisture
Leak Tests to Mil standard
De-lidding packages to preserve electronics
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Page 24
AMI HC-53
Manual Screen Printer
A manual screen printer, rugged, versatile, and with minimal setup time.
Maximum print area is 5" x 6" (127mm x 152mm). Uses a precision screen
registration mechanism, with micrometer and fine thread adjustments.
AMI MSP-088
Manual Screen Printer
A manual screen printer, rugged, versatile, and with minimal setup time.
Maximum print area is 8" x 8" (203mm x 203mm). Uses a precision screen
registration mechanism, with micrometer and fine thread adjustments.
AMI MSP-645
Semi-Automatic with PLC Control
A scaled-down version of the MSP-885, the MSP-645 uses the same printing mechanism with the AMI Torsion Bar squeegee head, mounted on a
rectangular frame with a reciprocating substrate carriage. This arrangement is very flexible and automatic load/unload options are available. Field
upgrades preserve investment and ensure long-term cost effectiveness.
AMI MSP-485
The newest AMI screen printer is a scaled-up version of the MSP-465. It
uses the patented AMI Torsion Bar squeegee head with a reciprocating
substrate carriage and features front-panel programmable print stroke and
process delays. Manual vision alignment and dual squeegee head options
available.
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AMI XP-508
Standalone, semi-automatic printer developed for maximum flexibility and
economy. Print alignment is by manual stage adjustment. Print head is the
dual-blade DS-III with electric drive. Programmable control of squeegee
speed and pressure is a standard feature. LCD display with keypad and
function key setup. Manual vision alignment options are available.
AMI MSP-9155
A production printer capable of printing substrates or boards up to 16" x
16" (406mm x 406mm). A flexible production printer mounted in a rectangular frame with a reciprocating substrate carriage. Available in 3 versions:
MSP-9155: Basic system with PLC controls (described on this page)
MSP-9155PC: All features of the MSP-9155, plus:
a. PC control system and GUI
b. Recipe storage and retrieval
c. Servo driven, programmable print head
d. Future upgrade path to MSP-9156PC
MSP-9156PC: All features of the MSP-9155PC, plus:
High Precision, Automatic Alignment
Vision alignment and print head options are available. Field upgrades preserve investment and ensure long-term
cost effectiveness.
AMI Model MSP-885
A very flexible production printer mounted in a rectangular frame with a
reciprocating substrate carriage; literally 1,000's of these printers are in use
around the world. Available in 3 versions:
- MSP-885 : Basic system with PLC controls
- MSP-885PC: All features of the MSP-885, plus:
-MSP-886PC:All features of the MSP-885PC, plus:
Many automatic, vision alignment, and print head options are available. Field upgrades preserve investment and
ensure long-term cost effectiveness.
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AMI MSP-1825
A production printer capable of printing substrates or boards up to 18" x
20" (457mm x 508mm). A flexible production printer mounted in a rectangular frame with a reciprocating substrate carriage. Available in 3 versions:
MSP-1825: Basic system with PLC controls
MSP-1825PC: All features of the MSP-1825, plus:
MSP-1826PC: All features of the MSP-1825PC, plus:
Vision alignment and print head options are available. Field upgrades preserve investment and ensure long-term
cost effectiveness.
AMI Model MSP-885PC & MSP-886PC
Semi-Automatic with PC Control
These versions of the MSP-885 feature PC controls, a GUI
(graphical user interface) for the operator, and electric servo motor
squeegee drive. In addition, the MSP-886PC offers fully automatic
operation with automatic vision alignment. Many automatic and programmable print head options are available for both of these printers.
Interface with the system is via graphical user interface with light
pen, PC keyboard and a monitor.
The monitor and keyboard are mounted on a swingarm for convenient positioning during setup and repositioning during operation.
AMI MSP-1005PC
Fully PC-controlled (Pentium™ + Windows ) with graphical user interface
for setup and operation via light pen/monitor. Can be used with either stencils or screens for both thick-film/hybid microelectronics or SMT applications. Many automation options available.
www.acrosemi.com
Page 27
AMI MSP-9155PC & MSP-9156PC
These versions of the MSP-9155 feature PC controls, a GUI (graphical
user interface) for the operator, and electric servo motor squeegee drive. In
addition, the MSP-9156PC offers fully automatic operation with automatic
vision alignment. Many automatic and programmable print head options
are available for both of these printers.
Many automatic, vision alignment, and print head options are available.
Field upgrades preserve investment and ensure long-term cost effectiveness.
Fully Automatic with PC Control and Automatic Vision
These versions of the MSP-885 feature PC controls, a GUI (graphical user
interface) for the operator, and electric servo motor squeegee drive. In addition, the MSP-886PC offers fully automatic operation with automatic vision alignment. Many automatic and programmable print head options are
available for both of these printers. Interface with the system is via graphical user interface with light pen, PC keyboard and a monitor. The monitor
and keyboard are mounted on a swingarm for convenient positioning during setup and repositioning during operation.
AMI MSP-1005PC
Fully PC-controlled (Pentium™ + Windows) with graphical user interface
for setup and operation via light pen/monitor. Can be used with either stencils or screens for both thick-film/hybid microelectronics or SMT applications. Many automation options available.
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AMI MSP-647 & MSP-887
High-Speed Rotary
The MSP-647 and MSP-887 are very high volume systems with typical
throughput rates of 1,000-5,000 parts per hour; actual rates will vary with
squeegee speed, stroke length, and parts handling rates among other factors. Both machines use AMI's patented Torsion Bar squeegee head for
precise thickness control and print definition, coupling the MSP-645 print
head (in the MSP-647) or the MSP-885 print head (in the MSP-887) with a
mechanically indexed 8-station rotary table for unparalled performance. A
variety of automatic load/unload options are available involving parts transfer and loading and unloading of stack or partitioned magazine type cassettes.
AMI MSP-647 & MSP-887
High-Speed Rotary
The MSP-647 and MSP-887 are very high volume systems with typical throughput rates of 1,000-5,000 parts per
hour; actual rates will vary with squeegee speed, stroke length, and parts handling rates among other factors. Both
machines use AMI's patented Torsion Bar squeegee head for precise thickness control and print definition, coupling the MSP-645 print head (in the MSP-647) or the MSP-885 print head (in the MSP-887) with a mechanically
indexed 8-station rotary table for unparalled performance. A variety of automatic load/unload options are available
involving parts transfer and loading and unloading of stack or partitioned magazine type cassettes.
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AMI MTF-CxF, MTF-CxR, MTF-SxF & MTF-SxR
Loading/Reloading Modules
We make modules to handle either partitioned cassettes or stacked cassettes (magazines). From 1-5 cassettes
can be accommodated at a time; parts in magazines are handled by vacuum lift from a pick-and-place head, while
parts in partitioned cassettes are handled on the bottom side by either O-ring or by walking beam transport. Cassettes are automatically indexed up and down; modules with multiple cassettes have new cassettes automatically
move into place when empty (Loading) or filled (Reloading). A full set of sensors keeps track of substrate position
and cassette capacity. If alarm conditions are met, audible and/or visible alarms will sound and the module will halt.
AMI ACL-68C, ACL-78C , MTF-ACL & STF-OL
Collocators
A word that describes a module that takes a single file stream of parts and arranges them in evenly spaced rows
for dispensing onto a belt (as for drying or firing). A full set of sensors keeps track of substrate position. If alarm
conditions are met, audible and/or visible alarms will sound and the module will halt.
Parts are transported by O-ring, by belt, or by edge grip depending on the part and the application.
AMI MTF-M2ME & STF-OUL
Conveyor Unloaders
These modules perform the opposite function of the collocator: they take rows of parts and queue them up single
file for presentation back to a Reloader.
A full set of sensors keeps track of substrate position. If alarm conditions are met, audible and/or visible alarms will
sound and the module will halt.
Parts are transported by O-ring or by belt depending on the part and the application.
AMI Conveyer/Dryers
Conveyer/Dryers
Printed circuits need to be dried quickly and thoroughly to remove all volatile chemicals from the printed paste or ink. Our "black body", long wavelength IR elements provide maximum drying efficiency with shorter drying
times, less paste spread, lower energy costs, and higher yields. Stainless
steel conveyor belts give long life under repeated high temperature cycles.
AMI offers a broad range of automatic belt loading/unloading equipment to
keep product flowing smoothly through the dryer.
AMI AVISAS IV
Automatic Vision Alignment System
This automatic system works with PC-controlled printers MSP-866PC, MSP-1005PC, MSP-9156PC, MSP-1826PC,
and MSP-2406PC.
Registration marks (fiducials) on the substrate can be of any shape. The system is setup based on an actual wet
print which takes screen/stencil stretch and snapoff into account during production. A "best fit" method comparing
the calculated center of the two substrate fiducials with the stored center of the screen fiducials (learned during
setup) is used to align the screen during the production run.
Complete alignment time including fiducial location, correction calculation and movement of the screen/stencil positioner is typically <3 seconds. Absolute accuracy can be Â±0.001" with repeatability to Â±0.0005". AVISAS IV is
integrated with the printer control system and can sense if CCD camera positions have been changed without
changing the alignment setup.
www.acrosemi.com
Page 30
AMI u-Lign™ IV
Manual Vision Alignment Systems
This PC-based system permits use of part of the actual board pattern for
precise fine pitch and fine line printing. It works with all AMI printers with an
adjustable workholder.
u-Lign IV incorporates four different alignment methods:
Image Overlay;
Boundary Tracking; Circles; Dual Crosshairs
Other capabilities include automatic print cycle lockout if preset tolerances
are not achieved and measurement of the distance between any two board
pattern features.
AMI u-Lign™ IIPC
Manual Vision Alignment Systems
This practical and economical system uses two single- or double-crosshair
targets for board alignment with greater accuracy than possible by mechanical features or fixturing of the board. Like the u-Lign IV, it works on all
AMI printers with an adjustable workholder. Click image at right to enlarge.
The crosshairs can be adjusted black to white, dotted or solid to provide
the highest contrast for the operator performing the alignment.
AMI u-Lign™ IIPC
Mylar Alignment Jig
Available as an option on AMI printers with an adjustable workholder. The
jig allows an operator to make a test print on the mylar sheet held in a
frame mounted on the workholder. Workholder X, Y, and Ã˜ adjustments
are used to align the board to the test print on the mylar, and then the
workholder is locked in that position. The operator removes the jig and production printing begins.
AMI Model 2000
Roller Micrometer
Size and sort small parts for go/no-go determination prior to production
or processing -- quickly, easily, and with unprecedented accuracy.
Our roller micrometer functions as an automated thickness gauge. Sort
solder spheres for BGA and flip chip applications, steel/plastic/composite
bearings, metal stampings, solder pre-forms, washers, ceramic tubes,
metal studs, glass beads, tungsten carbide forms -- virtually any part up
to 0.5" in size.
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Neutronix Quintel MPA 500 / 600 Series
Mask Aligners
Projection Alignment - 72 WPH
Temperature Control
Thermal/Pneumatic Distortion Control
1X Scanning Mask Changer (Optional)
Wafer Sizes: 3" to 6" Semi Spec
Wafer Feed: Dual Cassette, Auto Feeder
Alignment: Manual / Automatic
Resolution: 1.5um CD with Depth-Of-Focus +-6um
Neutronix Quintel Q1200
Flood Expose System
A unique machine with single and double-sided exposure capability. Designed specifically for single mask level applications and/or gross geometries and non-critical alignment - current applications include power devices,
LEDs and MEMs applications.
R&D and production applications
Manual loading of substrates
Single-side and double-side exposure capability
Small pieces to 200 mm diameter substrate size
Available Options:
•CTV Microscope
• Manual X, Y and theta alignment stage
Neutronix Quintel
Automated Pattern Recognition Alignment System
NeuVision combines our wealth of PLA experience with user-friendly software to create an alignment system that easily adapts to a broad range of
application challenges. With NeuVision installed on your PLAs, you can:
Automatically align on irregular wafer surfaces such as metal layers or other
noisy or low return thin films.
Define your own alignment marks. While the Chevron Scheme can be used,
it is not required for automatic alignment significantly increasing the capture
area and eliminating the cost of retooling masks.
Program alignment tolerances to match production goals. Extremely tight
alignment, 1 um 3 sigma, can be achieved reliably, throughput can be increased by relaxing tolerance specifications.
Reduce wafer to mask contacts and decrease defect densities associated
with resist lift off.
www.acrosemi.com
Page 32
SST INTERNATIONAL Model 3180/3190
Wafer Bonders
For high reliability wafer bonding
The 3180 and 3190 are programmable wafer bonders offered by SST International for high-reliability bonding of silicon, gallium-arsenide and glass
wafers up to 6 inches (150 mm) in diameter. Both systems provide precise
automatic control of heating and cooling at temperatures up to 500 °C
(1000°C optional). Bellows actuated clamping platens present uniform mechanical bonding pressures up to 750 pounds (350 kg) to the wafer pair.
The 3190 also provides anodic (electrostatic) bonding capabilities with a
user-selected high-voltage power supply and chamber feed-through. Vacuum levels down to 50 millitorr are provided in the 3180 by a two-stage mechanical pump. Vacuum levels below 1 x 10-6 torr are provided in the 3190
by a cryogenic vacuum pumping system combined with a dry mechanical
forepump. Digital vacuum level gauging is provided to monitor and control
vacuum levels. Machine control is provided by an embedded control system
operating in a Microsoft Windows® environment. An unlimited number of
process profiles can easily be created and stored in the controller. Run data is archived for quality control and offline data analysis. Internet and intranet network connectivity is available as an option, permitting remote monitoring,
troubleshooting and maintenance capabilities.
TYPICAL APPLICATIONS:
Many Uses Include:
Silicon to Glass Wafer Bonding
MEMS Wafer Bonding
Pressure Sensor Bonding
Anodic Wafer Bonding
SST INTERNATIONAL Model 1200
Table Top Solder Reflow Station
The Model 1200 Table-Top Vacuum Solder Reflow Station has been designed for process development and low volume production of Flux-Free
and Void-Free soldered joints in microelectronic packages and components. The station is easy to use and profile for a wide variety of soldering
tasks. A ramping temperature controller is combined with customized
PLC’s to provide automatic process control.
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SST INTERNATIONAL Model 3130
Programmable Vacuum / Pressure Furnace
For high reliability microelectronic package assembly
The 3130 is a programmable vacuum and pressure furnace offered by SST
International for high reliability microelectronic package assembly. Advanced technology, provided by the system, allows users to create void-free
solder joints without the use of flux. The 3130 is used in both production and
research environments. The system provides precise automatic control of
heating and cooling up to 500 °C (1000 °C optional) in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50
psig. Machine control is provided by an embedded control system operating
in a Microsoft Windows® environment. An unlimited number of process profiles can easily be created and stored in the controller. Run data is archived
for quality control and off-line data analysis. Internet and intranet network
connectivity is available as an option, permitting remote monitoring, troubleshooting and maintenance capabilities. Custom-designed resistive graphite heating fixtures (ordered separately)
are matched to user application requirements for optimum system performance.
SST INTERNATIONAL Model 3140/3150
High Vacuum Furnaces
For
high
reliability
microelectronic
package
assembly
The 3140 and 3150 are high vacuum furnaces offered by SST International
for high-reliability microelectronic package assembly. Packages are hermetically sealed with very low internal gas pressures and moisture levels.
Prior to package sealing, integral getters may also be activated to ensure
long-term internal package vacuum levels.
SST INTERNATIONAL Model PF-2400
Controlled Atmosphere Large Format Vacuum Furnace
For high volume production in vacuum and inert gas environments
The PF-2400 is ideally suited for processes requiring close control of both
temperature and atmosphere. Primarily intended for void-free, flux-free soldering, the PF-2400 is capable of operating at 10 millitorr vacuum levels, or
at pressures as high as 50 psig using inert gasses. Temperature is controlled in increments of 1 °C from ambient up to a maximum operating temperature of 500 °C.
SST INTERNATIONAL
Graphite Machining
Ultra-Precision Machining of Graphite Components and Assemblies
Serving the Electronics, Aerospace, Semiconductor, Research, MoldMaking and Metallurgical Industries
Materials Selection, Fixture Design and Prototyping
Top Quality Parts, On-Time Delivery and Competitive Prices
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Capabilities
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YESTECH YTV F1 Series
Automatic Optical Inspection
YESTech’s advanced Thin Camera™ technology offers high-speed PCB
inspection with exceptional defect coverage. With up top-down viewing cameras and four side viewing cameras, the F1-Series inspects solder joints and
verifies correct part assembly enabling users to improve quality and increase throughput.
- Quick Set-up
- High Speed
- High Defect Coverage
- Low False Failure Rate
- Smaller Footprint
- Best Price Performance
YESTECH Model YTV M1
Automatic Optical Inspection
YESTech’s advanced Thin Camera™ technology offers high-speed PCB
inspection with exceptional defect coverage. With three megapixel resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling
users to improve quality and increase throughput.
- Quick Set-up
- High Speed
- High Defect Coverage
- Low False Failure Rate
- Smaller Footprint
- Best Price Performance
YESTECH Model YTV B3
Benchtop Automated Optical Inspection
YESTech's advanced Thin Camera™ technology offers off-line benchtop
PCB inspection with exceptional defect coverage. This benchtop system
inspects solder joints and verifies correct part assembly enabling users to
improve quality and increase throughput.
• Quick Set-up
• Color Camera
• High Defect Coverage
• Low False Failure Rate
• Best Price Performance
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YESTECH Model YTX 3000
High-Resolution X-Ray Inspection System
The YTX-3000 x-ray system offers EMS providers and semiconductor packagers a superior yield enhancement solution to reduce costs, improve quality and increase throughput.
The YESTech YTX-3000 provides users with a high-resolution x-ray capability in a flexible, compact maintenance free configuration. The YTX-3000
is available with a 4 or 5 axis sample manipulator and a 15" x 20" (380mm x
508mm) x-y travel for samples up to 5 pounds in weight. Full 360 degrees
of rotation and 30 degrees of tilt are available. Stepper motor drives provide
a wide range of motion from ultra-slow use at high magnifications, to high
speed for travel over large distances. All systems come with a unique control module and programmable motion for automated inspection.
YESTECH Model YTX 3000 HXR
Extremely High Resolution X-Ray System
YESTech's YTX-3000 HXR x-ray system combines extremely high resolution and magnification with the proven power and ease of use of the YTX3000, to provide SMT and semiconductor manufacturers the most costeffective high resolution x-ray inspection solution available.
• Open Tube Low Maintenance Design
• Sub-micron Resolution
• High Magnification
• Superior Software
• Cost Effective
YESTECH Model YTX 6000
Automated In-line X-Ray Inspection System
YESTech's versatile YTX-6000 conveyorized X-Ray inspection system offers SMT and semiconductor packagers complete inspection of critical hidden features and solder joints. The YTX-6000's proven inspection algorithms provide fast and complete inspection of PCB and other assemblies.
Programming the YTX-6000 is fast and intuitive. Operators typically take
less than 30 minutes to create a complete inspection program. The YTX6000 utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
• Highest Defect Detection
• Fast Throughput
• Quick Set-up
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YESTECH Model YTX X1
Automated In-line X-Ray Inspection System
YESTech's YESTech’s versatile X1 Automated X-Ray InspectionSystem
( AXI ) offers complete inspection of solderjoints and other critical hidden
features found in electronic assemblies, PCB’s and packaged semiconductors. Ideal for in-line or off-line operation, the X1’s proven algorithms enable
fastand reliable automated inspection and real-time monitoring of critical
p r o c e s s
i n f o r m a t i o n .
Programming the X1 is fast and intuitive. Operators typically take less than
30 minutes to create a complete inspection program. The X1 utilizes a standard package library to simplify training and insure program portability
across manufacturing lines. Newly available image processing technology
integrates several techniques and inspection algorithms to provide complete
inspection coverage with an extremely low false failure rate.
The YESTech X1 Automated X-Ray system is an effective inspection tool
for ball grid array devices, components undershields and complex high density boards. When integratedwith
YESTech AOI systems, the X1 can increase fault coverageto include nearly all process defects.
• Highest Defect Detection
• Low False Calls
• Fast Throughput
www.acrosemi.com
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CASCADE MicroTech
150mm Probe Station Series
The M150 sets a new standard for providing precision electrical measurement capability in a cost-effective, ultra-flexible platform. Its modular design
and broad range of accessories make it the ideal solution for today’s complex analysis and characterization demands that span multiple materials and
numerous 150mm measurement applications. To get things started, the
M150 is available in three pre-configured stations — a smaller footprint,
Benchtop station; a Multipurpose station; and a Millimeter Wave station.
Depending on your particular application requirements, a broad portfolio of
accessories is available so each pre-configured station can be easily and
conveniently fashioned to meet your particular needs — today and well into
the future. Adding even more flexibility, you can build your own M150 platform by specifying and configuring the
station modules that best suit your needs.
CASCADE MicroTech
300mm Probe Station Series
Taking the next step in 300mm probing means delivering a probe station
that specifically solves the enormous measurement challenges brought on
at each advancing technology node. Shrinking geometries, new process
materials and increasingly complex designs are all pushing the boundaries
of precision electrical metrology. Unfortunately, market windows have little
patience for the complexity of today’s or tomorrow’s measurement challenges. From RF/DC device characterization, to Wafer-Level Reliability, to
IC failure analysis and design debug, more data needs to be collected faster
and more accurately. Enter the Elite 300 probing station.
CASCADE MicroTech
REL-6100/4800 Probe Station Series
The REL-4800 Series Manual Probe Stations and REL-6100 Series Semiautomatic Probe Stations offer superior performance whether probing the
smallest internal IC feature for failure analysis or making accurate DC/CV
parametric measurements on-wafer. Both series feature submicron resolution and excellent stability for probing 200mm (8-inch) wafers.
The power-assisted tilt-back microscope and platen lift handle make application changeover and needle replacement effortless.
www.acrosemi.com
Page 38
CASCADE MicroTech
6” & 8” RF Probe Station
A complete microwave test solution goes far beyond simply connecting the
probes, probe station, and test instrumentation. With Cascade Microtech
you get not only precision tools, but the analytical test experience you need
to make accurate, repeatable, on-wafer measurements. A complete customized Cascade Microtech RF/Microwave test system includes a Summit series probe station, leading-edge Infinity Probes®, NIST-verified Impedance
Standard Substrates, powerful Nucleus® Prober Control and WinCal XE™
software, as well as a complete line of accessories.
CASCADE MicroTech
SUBMIT Probe Station Series
Summit wafer probing systems allow you to access the full measurement
range of your parametric test instrumentation. Whatever your application:
RF/Microwave, device characterization, wafer-level reliability, e-test, modeling, or yield enhancement, Summit probe stations ensure best-in-the-world
measurements.
CASCADE MicroTech
M150 Microfluidics Measurement Flatform
The M150 microfluidics measurement platform from Cascade Microtech provides a convenient and repeatable work space for microfluidic assays.
Scaleable from an affordable, entry-level to a high precision system; the
M150 platform provides researchers and scientist with the maximum level of
flexibility for running microfluidic experiments.
Features
+ Convenient: Dedicated test platform with intuitive features like an integrated high-power optics mount and moveable device holder simplify experiment set up
+ Complete: L-Series system bundles provide complete solutions for high voltage, low voltage, & pressure pumping
+ Scaleable: Starter platform can scale as research requirements grow
+ Flexible: Adjustable microfluidic device holder accommodates a variety of devices
+ Practical: System constructed for maximum signal to noise ratio in florescence detectionexperiments
www.acrosemi.com
Page 39
TERRA UNIVERSAL
BiosafeTM Stainless Steel Pass-Thru Chambers
+ 10 standard sizes
+ Continuous-seam welds are preci sion-ground to create completely
smooth internal surfaces with coved corners to eliminate cracks where
germs and particles can collect
+ Easy to clean and sterilize with standard disinfectants
+Available in 304/316 stainless steel
(electropolishing available)
+ Mechanical interlock is isolated from chamber to preserve smooth internal
surfaces
TERRA UNIVERSAL
CleanSeamTM Stainless Steel Pass-Thru Chambers
+ 15 standard sizes, for wall or floor mounting
+ Continuous-seam welds for easy-clean chambers with no particle infiltration
+ 304/316 stainless steel (electropolishing available)
TERRA UNIVERSAL
Pass-Thru Chambers
+ 15 standard sizes, for wall or floor mounting
+ Five standard materials — 304 stainless steel
(electropolishing available) Static-dissipative PVC
+Acrylic
+Clean laminate
+Acid-resistant polypropylene
TERRA UNIVERSAL
Roll Up Door Pass-Thu
+ Fast-response roll-up doors eliminate door clearance requirements to preserve cleanroom space
+ Available in three standard sizes in sizes up to 83" high – ample room to
transfer carts and large equipment
+ HEPA-filtered air showers available
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Page 40
TERRA UNIVERSAL
Fire Rated Pass-Thru
+ Independently certified to meet Warnock Hersey fire safety requirements
+ Double-wall 304 stainless steel construction with mechanical or electronic
interlock
+ Standard size:
39.5"W X 28"D X 38.25"H
TERRA UNIVERSAL
Pass-Thru Chambers for Terra HardWall Modular Clean Room
+ Available in 15 standard sizes, for wall or floor mounting
+ Select among five standard materials
+Mounting panel allows easy installation on standard Terra Hardwall Cleanrooms
TERRA UNIVERSAL
Pass-Thu Conditioning Chamber
+ Provides controlled cooling of samples being transferred into a laboratory
+ 304 stainless steel chamber is easy to clean and disinfect
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Page 41
TERRA UNIVERSAL
Air Shower
Protected passageway that allows large numbers of personnel to pass into controlled areas
without sacrificing cleanliness.
TERRA UNIVERSAL
Air Shower Pass-Thru
+ Directs HEPA-filtered air at high velocity through adjustable nozzles to remove
particles from parts transferred into the clean room
TERRA UNIVERSAL
Electronics Door Opener
+ Reduces contamination by decreasing hand-to-door
TERRA UNIVERSAL
Work Station
Cleanroom Benches, Stainless Steel Work Stations, and Laboratory Tables
Terra’s clean room benches, tables, and other work stations meet the most critical
cleanliness requirements .
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Page 42
TERRA UNIVERSAL
Gowning Room
+ Gowning Room (Change Room) Products for Your Cleanrooms
Gowning benches, garment racks and cabinets, hand and shoe cleaners, apparel
dispensers, and more!
TERRA UNIVERSAL
Storage System
+ Terra manufactures HEPA-filtered and ULPA-filtered storage systems to meet
strict clean room requirements (Class 1, Class 10, Class 100, etc.), along with
general-purpose lab storage cabinets, storage carts, and clean room shelving.
TERRA UNIVERSAL
Temperature Control
Terra Univesal provides high-quality, reliable controlled-temperature labororatory
products for healthcare, phamaceutical, industrial biotechnology, educational insstitutions, food, and many other industries. Terra Universal brings reliable products to
research as well as industrial environments.
TERRA UNIVERSAL
Wet Processing Station and Equipment
Terra's Module Wet Processing and Cleaning Stations provide economical solutions for semiconductor wafer processing.
Select modular wet benches or fully enclosed cabinets, along with a
complete line of laminar flow hoods, baths, rinsers, and other equipment.
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Page 43
TERRA UNIVERSAL
Cleaning Product and Services
Cleanroom vacuum cleaners, ultrasonic cleaners, plasma cleaners and
more!
TERRA UNIVERSAL
Autoclaves/Sterilizers and Wafer treatment Products
Terra Universal provides high-quality, reliable Autoclaves/Sterilizers,
Biological and Temperature Indicators, and Water Pretreatment products for healthcare, pharmaceutical, industrial biotechnology, educational institutions, food and many other industries. Terra Universal
brings reliable products to research as well as industrial environments.
research as well as industrial environments.
TERRA UNIVERSAL
Laboratory Balances
Terra Universal offers a full complement of fine quality Sartorius balances, including Ultra-Micro and Micro Balances (SE, LE, ME and CP
series), analytical balances (ME, CP, ED and TE series), portable balances (TE series) and toploading balances (TE series).
TERRA UNIVERSAL
Static Control Equipment
Static-dissipative plastics, ionizers, conductive wrist and heel straps,
and a full line of static meters
www.acrosemi.com
Page 44
TERRA UNIVERSAL
Safety Equipment
Exhaust fume monitoring, chemical storage and handling, fire detection,
and more
Product: Safety Can Storage Cabinet, Corrosives Storage, Polyethylene
Acid Storage Cabinets, Toxic Gas Detector System, Oxygen Deficiency
System, Fire Detection System, Enclosed Safety Shower, Gas Leak Detector, Bio-response Respirator.
TERRA UNIVERSAL
Pumps & Compressors
These vacuum/nitrogen pumps and compressors are ideal for use with
glove boxes, ovens, and other critical environments.
Product: Rotary Vane Vacuum Pumps ,Diaphragm Vacuum/Pressure
Pump , Dry Roughing Pumps , Compact Dry Roughing Pumps , Panther
Compressors, Oil-Free Compressors, Disposable Vacuum Pump Inlet
Filter, Vacuum Control Module, Solenoid Vacuum Valve , Oil Mist Exhaust Filters , Oilless Scroll Compressors
www.acrosemi.com
Page 45
UNIVERSAL FAREAST
Centrifuges
The C-103 Series CENTRISAFE component centrifuges are designed for high capacity, high speed acceleration testing of ceramic and hermetically sealed integrated
circuits and other electronic components.
UNIVERSAL FAREAST
Components Leak Detection System
The systems required to test the hermetic seal of integrated circuits and microelectronic devices consist of a pressurization unit and a leak detection
system. Trio-Tech offers several different types of pressurization systems
and leak detection systems for both fine and gross leak testing. These systems meet or exceed military test requirements.
UNIVERSAL FAREAST
HAST System
Express test is the technology and market leader in HAST Testing and provide
turn-key solutions including , systems, test board s, rack, power supplies, training and test services and has over 500 installations over the world.
UNIVERSAL FAREAST
Industrial AutoClaves
Our autoclave systems have been specially designed for pressure / temperature / humidity / bias (PTHB) testing of integrated circuits and other microelectronic materials. These systems provide pressurized, saturated vapor (100%
R.H.) test environments for fast and easy monitoring of integrated circuit manufacturing processes.
www.acrosemi.com
Page 46
UNIVERSAL FAREAST
Artic Temperature Chucks
The Artic TC series of temperature controlled chucks are used for test and
characterization and failure analysis of semiconductor wafers and other
components at hot and cold temperatures.
UNIVERSAL FAREAST
Environmental Chambers
All products will be exposed to a variety of climatic conditions over the use of the product life. A given product may be exposed to a variety of environmental extremes from
the time the product is manufactured, packaged, transported, and stored until it
reaches its final destination.
We offer CTS Gmbh’s range of environmental testing products which are used to simulate these conditions to find product flaws before the product reaches the customer –
saving substantial warranty and product recalls. There are many models available.
UNIVERSAL FAREAST
Steam Agers
FEATURES
4 X 20 vacuum fluorescent display
16 key entry pad
CPU Board
Anti-condensation heaters
Independently timed drawers
Centrifugal pump
Removable inner baskets
UNIVERSAL FAREAST
Automatic Wet Station
For higher volume applications, or if repeatable handling is critical, it is
worthwhile considering Universal Systems' VLF-2002 Series of automated
wet process stations - designed to provide maximum device throughput,
operator safety and ease of use. Operator errors are virtually eliminated
through the use of SMARTware scheduling software.
www.acrosemi.com
Page 47
UNIVERSAL FAREAST
Semi-Automatic Wet Bench
The US Model US-VLF Semi-Automated Wet Station includes all the features of our manual wet process stations plus several additional features for
faster and more reliable processing.
The US-VLF family of products is ideal for critical timing of process chemicals, handling of product through hazardous chemical baths or similar applications where operator-assisted processing is recommended.
UNIVERSAL FAREAST
Fumehood
One of the first considerations when contemplating a wet process station is
the general station configuration and design. Depending on the type of
chemicals to be used, it may be necessary to utilize an enclosed Fumehood
design instead of an open bench design, especially in order to minimize
fumes in the work area.
UNIVERSAL FAREAST
Process Tank
We offer a variety of standard and custom designed process tanks for almost any application.
UNIVERSAL FAREAST
Transfer Arm
Robot transfer arms are extremely helpful for wet process applications that
require precise, repeatable operations especially where dangerous chemicals are used in the process baths. In some cases the weight of the process materials requires mechanical assistance, especially when larger diameter substrates or multiple cassettes are processed.
www.acrosemi.com
Page 48
UNIVERSAL FAREAST
Process Controllers
We offer several types of controllers for almost any application - from basic
tank auto-drain functions to complex, but easy-to-use, PC recipe storage,
activation and process monitoring.
UNIVERSAL FAREAST
Chemical Dispensing System
We offer chemical handling equipment in order to provide a total customer
solution. Our product range includes the Series CD-2002 Chemical Blending
equipment which provides automatic, precisely controlled chemical transport
from a house supply to our process equipment, using our latest PC/PLC
based control systems or individual controllers.
UNIVERSAL FAREAST
Vibration Testing System
We provide a wide range of Electro-Dynamic shakers, air-cooled or watercooled series, with force output from 50Kgf to 18,000Kgf. These Vibration
Testing Systems are designed to perform structual excitation and product
testing of small component to large payloads.
www.acrosemi.com
Page 49
ACCVACS
E Series Impulse Sealer
Clean room compatible
Accvacs digital smart control
Backlit lcd display
Pressure gauge
No pinch safety jaw
Over heat protection
Electronic foot switch start
ACCVACS
E Series Vacuum Sealer
Clean Room Compatible
Accvacs Digital Smart Control
Backlit Lcd Display
Field Re Programmable
( No need to send unit back to us if you decide to
change the Sealer Sequence of Operation )
Stainless Steel Retracting Nozzle
Gas Purge
No Pinch Safety Jaw
Over Heat Protection
Electronic Foot Switch
ACCVACS
E Series Vacuum Sealer With Dual Nozzles
Backlit Lcd Display
( No need to send unit back to us if you decide to
change the Sealer Sequence of Operation )
Stainless Steel Retracting Nozzles
Gas Purge
No Pinch Safety Jaw
www.acrosemi.com
Page 50
ACCVACS
E Series Stainless Steel Vacuum Sealer
Backlit Lcd Display
( No Need To Send Unit Back To Us If You Decide To
Change The Sealer Sequence Of Operation )
Stainless Steel Retracting Nozzles
Gas Purge
No Pinch Safety Jaw
ACCVACS
DTS Medical Series Digital Impulse Sealer With Temperature Control
Backlit Lcd Display
Digital Temperature Controls With
P I D & Auto-Tune
Validatable
Pressure Gauge
No Pinch Safety Jaw
Electronic Foot Switch Start
ACCVACS
MTS Medical Series Color Touch Screen Impulse Sealer With Temperature Control
Stainless Steel Case
Accvacs Color Touch Screen Controls
Fast P I D Temperature Control With Auto-Tune
Pressure Regulator To Adjust
Sealing Bar Pressure
5 Micron Filter
Rs 232 Communication Port
Production Report Writing Software
Electronic Foot Switch Start & E Stop
www.acrosemi.com
Page 51
ACCVACS
DTV Medical Series Digital Vacuum Sealer
With Temperature Control & Gas Purge
Accvacs Digital Smart Controls
Vacuum Gauge
Vacuum Regulator & Vacuum Filter
No Pinch Safety Jaw & Over Heat Protection
Electronic Foot Switch Start
ACCVACS
TSV Medical Series Touch Screen Vacuum Sealer
With Temperature Control & Gas Purge
Accvacs Touch Screen Controls
Digital Vacuum Switch / Gauge
No Pinch Safety Jaw & Over Heat Protection
Electronic Foot Switch Start & E Stop
www.acrosemi.com
Page 52
DeWeyl Tool Company
Automatic Bonding Tools
The Box Style Wedge (Automatic)
The Box style wedge is best suited for Automatic and Semi-Automatic wire
bond equipment. With the Box tool design, the wire is contained side to side
containing movement until just before the bond foot area. This wire control
helps keep the wire centered on the tool and offers enhancements to placement accuracy. DeWeyl’s “CL” style of box wedge is the most popular, offering the most clearance and wire control.
Other Tool Styles are: AL, AN, CN, KN, KNL
DeWeyl Tool Company
Manual Bonding Tools
The Notch Style Wedge (Manual)
The Notch style wedge is primarily designed for use on Manual wire bonders. DeWeyl’s "CS" series is the best choice for Manual wire bonders and is
especially useful for our Microwave customers. When Manual bonding, the
operator looks through the microscope at the Notch to place the wire and
target the wire to the bond pad. Thus, if the wire shifts side to side it does
not pose any significant problem with regards to placement accuracy.
Other Tool Series available are: A, AS, CS, KS.
DeWeyl Tool Company
Vertical Feed / Deep Access Tools
DeWeyl Tool offers a wide range of Vertical Feed / Deep Access bonding
tool solutions for both manual and automatic bonding equipment. We offer a
minimum of three material choices for your consideration, Tungsten Carbide, Titanium and Ceramic. We have a large selection of Vertical Feed /
Deep Access designs. The following Vertical Feed tool series can be found
in our catalog. See the A8D section for information regarding our A8D feature on Vertical Feed Wire Tools.
Vertical Feed Series - CLV, CNV, CSV, KNV, KNLV, KSV, and Ribbon
DeWeyl Tool Company
Ribbon Bonding Tools
Deweyl Tool offers a wide range of Ribbon Bonding tool solutions for both
manual and automatic bonding equipment. We offer both Vertical Deep Access ribbon tools as well as Standard Angle Feed ribbon tools. We offer a
minimum of three material choices for your consideration, Tungsten Carbide, Titanium and Ceramic. We highly recommend our ceramic material
and our "Cross-groove" tips. We have a large selection of Ribbon Bonding
designs. The following Ribbon Bonding tool series can be found in our catalog. See the "Tool Options-2" section for information regarding our A8D feature on Ribbon Bonding Tools.
Ribbon Bonding Series - R, RCS, RCSV, RKN, RKNV, RKS, RKSV, RN, RNV.
Page 53
www.acrosemi.com
DeWeyl Tool Company
TAB Bonding Tools
DeWeyl offers the most extensive TAB bonding tool selection available to
cover all TAB applications. TAB tool applications include: Insulted wire
bonding, Ribbon mesh bonding, Micro BGA bonding, Tamping, and Lead
Beam bonding. DeWeyl arranges our TAB tools by Product geometries
listed below.
DeWeyl Tool Company
Insulated Wire Bonding Tools
Deweyl Tool offers Insulated Wire Bonding tool solutions for various size
wire. We offer a minimum of three material choices for your consideration,
Tungsten Carbide, Titanium and Ceramic.
Insulated Wire Series - F108, F108.
DeWeyl Tool Company
Micro-BGA Tools (Tessera®)
Deweyl Tool offers a wide range of Micro-BGA/Tessera bonding tool solutions. We offer a minimum of three material choices for your consideration,
Tungsten Carbide, Titanium and Ceramic. However, we highly recommend
the ceramic material for best results. We have a large selection of MicroBGA/Tessera® bonding tool designs. We offer both the cross groove and
dimple designs to enhance the ultrasonic coupling. We believe our work
with Tessera Inc. allows Deweyl the ability to offer unique solutions to your
Micro-BGA package demands.
DeWeyl Tool Company
Hesse & Knipps / Palomar Deep Access Series
Hesse & Knipps (Deep Access) and Palomar wedge bonders require a
slightly different shank style (Main body) than other wedge bonder Manufacturers. Two shanks are available, the “double flat” and also the “S-1”
option. The “double flat” has 2 flats compared to the normal wedge single
flat. The “S-1” option has one flat, plus a channel on the back of the wedge
to feed the wire. Below is a representation of the two different styles, or you
can download our datasheets listed below for review.
Page 54
www.acrosemi.com
DeWeyl Tool Company
The A8D Option
In addition to the ceramic tip wedges, DeWeyl has developed an exclusive
design for the "vertical feed" applications identified as the "A8D" option.
This feature maintains maximum control during the looping and feeding
operation's of your equipment. It is highly recommended for maximum vertical feed/deep access performance.
DeWeyl Tool Company
Tool Options
Deweyl Tool offers customer bonding tools solutions to address the problems of today's complex package designs. Here are some of the options
we can offer you. You may reference these options as A1-A10 & A12 A13. For example the A1 option offers a clearance cut on either side of the
tool. See the picture below. These options are in our catalog.
Accessories
LED Luxuray Illuminator 10235
LED Luxuray Illuminator, without power supply. Focused LED lamps are
effective for use at focal distances of 80 to 120 mm; for 100-220V AC
power source; ESD protected.
Accessories
LED Luxuray Illuminator, with stand-alone power supply and mounting
hardware. Focused LED lamps are effective for use at focal distances of
80 to 120 mm; for 100-220V AC power source; ESD protected.
Usage: Olympus SZ30, SZ40, SZ60 & SZ51/61 series and Nikon SMZ-1 &
SMZ-2
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Page 55
Accessories
LED Luxuray Illuminator 10265.01
hardware. Focused LED lamps are effective for use at focal distances of 80
to 120 mm; for 100-220V AC power source; ESD protected.
Usage: Nikon SMZ-660 & SMZ-645
Accessories
to 120 mm; for 100-220V AC power source; ESD protected
Accessories
to 120 mm; for 100-220V AC power source; ESD protected.
Usage: Leica SZ1, SZ2, SZ3, SZ4 & SZ5
Accessories
LED Luxuray Illuminator, with stand-alone power supply and mounting hardware. Focused LED lamps are effective
for use at focal distances of 80 to 120 mm; for 100-220V AC power source; ESD protected.
Usage: Wild / Leica M3, M5, M7 & MZ6
Page 56
www.acrosemi.com
Accessories
LED Luxuray Illuminator, Second Array with "Y" adapter for power supply
connection. This adds an additional light array and gives nearly full circle
illumination. For use with an existing -10265.xx LED Luxuray assembly.
Accessories
LED Luxuray Illuminator, Twin Array, with power supply and mounting
hardware. A pair of lamp assemblies gives nearly full circle illumination.
Focused LED lamps are effective for use at focal distances of 80 to 120
mm; for 100-220V AC power source; ESD protected.
Usage: Olympus SZ30, SZ40, SZ60 & SZ51/61 series and Nikon SMZ-1 &
SMZ-2
Accessories
Accessories
www.acrosemi.com
Page 57
Accessories
LED Luxuray Illuminator, Twin Array, with power supply and mounting hardware. A pair of lamp assemblies gives nearly full circle illumination. Focused LED lamps are effective for use at focal distances of 80 to 120 mm;
for
100-220V
AC
power
source;
ESD
protected.
Usage: Leica SZ1, SZ2, SZ3, SZ4 & SZ5
Accessories
Usage: Wild / Leica M3, M5, M7 & MZ6
Accessories
LED Luxuray Replacement Assembly. This kit is intended for direct lamp
replacement on standard LED Luxuray Illuminator assembly A-10235. This
assembly consists of pre-wiring 7 PCB's that includes 21 lamps with 2 inline connectors; ESD protected.
Accessories
LED Luxuray Illuminator with stand-alone power supply and mounting
adapters for use with the -43B. Focused LED lamps are effective for use at
focal distances of 80 to 120 mm; for 100-220V AC power source; ESD protected. Usage: Olympus SZ30, SZ40, SZ60 & SZ51/61 series and Nikon
SMZ-1 & SMZ-2
Page 58
www.acrosemi.com
Accessories
LED Luxuray Illuminator with stand-alone power supply and mounting adapters for use with the -43B. Focused LED
lamps are effective for use at focal distances of 80 to 120 mm; for 100-220V AC power source; ESD protected. Usage: Leica SZ1, SZ2, SZ3, SZ4 & SZ5
Accessories
S.M.A.R.T.
S.M.A.R.T., Superimposed Microscope Attached Reference Target. A selfcontained assembly for attachment directly to microscope objective to superimpose positional information onto the workpiece view. This information
is added by the beam splitter principle in which the objective rays are partly
transmitted to the work and partly reflected to focus on the information
plane. The information reticule may be moved about in that plane to align to
the "work" point. ESD protected. Power supply included. -10557.xx Luxuray
assemblies include adapters to mount the -43B. Existing customer Luxuray
assemblies require assembly 10444 to mount the -43B.
Accessories
Tool Assembly for Deep Access Bonding –46C
Vertical Wire or Ribbon Feed for Deep Access, Model 7400C. Changes the standard Model 7400C wire/ribbon
guide track from 45Âº to approximately 75Âº to simulate vertical clamp movement. Clamps are opened pneumatically and are driven by linear actuator. Used for bonding down into deep cavities and/or high-density packages.
Assembly No.8433.
Accessories
Tool Assembly for Deep Access Bonding –69C
Standard Tool Assembly for diagonal wire feed for Model 7400C. Clamps are opened pneumatically and are driven
by linear actuator. This is a stand-alone assembly to allow field convertibility. Assembly 8408.
Accessories
External View TV Camera 72E
Color External View TV Camera for "4kE", "5kE", "7kC", "7kD" & "7kE" Series. Assembly No. 10375. Magnification is adjustable within a range of 30X
to 55X; view angle is adjustable; flat screen monitor & power supply included (for use with 100-220V AC power source); ESD protected. Available
as a stand-alone product. Machines purchased before December of 2003
may require a replacement microscope mount bracket.
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Page 59
Accessories
Direct Output from Pull or Shear Tester 75
Direct Output from Pull or Shear Tester to a Computer via RS-232 for graphically plotting the test results. Furnished
as Assembly No. 8500, which includes the software application, connecting cable, and instructions. Only available
for machines with software Version 1.0, or greater, running on Motorola 68000 microprocessor, or together with the
separate purchase of the new CPU Board.
Accessories
Adjustable Height Work Platform 79
Adjustable Height Work Platform, without Rotation. Assembly No. 8557
replaces Assembly No. 8273. Adjusts thru a range of 0.625 in., 0.09375
above and 0.53125 below nominal work elevation.
Accessories
Adjustable Height Work Platform 81
Adjustable Height Work Platform, with Planarity Control. Adjusts thru a
range of 0.625 in., 0.1250 above and 0.5000 below nominal work elevation.
Planarity control of platform is by 3 point adjustment that allows for approximately 2 degree variation in any direction. Assembly No. 10303.
Accessories
Spool Mount 4141.006
Spool Mount: Universal 2.00" dia. spool mount, is housed into a Nickel
plated aluminum enclosure. The wire is fed through a 6.00 inch long
Stainless Steel funnel, which serves as a wire guide. A window is provided
in the cover to monitor the amount of wire used on the spool. Assembly
number A-4141.006.
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Page 60
Accessories
Spool Mount: Universal 2.00" dia. spool mount, is housed into a Nickel
plated aluminum enclosure. The wire is fed through a 6inch long Stainless
Steel funnel, which serves as a wire guide. A window is provided in the
cover to monitor the amount of wire used from the spool. Assembly number
A-4141.008.
Accessories
Spool Mount: Universal 2.00" dia. spool mount, is housed into a Nickel plated aluminum enclosure. The wire is fed
through a 6inch long Stainless Steel funnel, which serves as a wire guide. A window is provided in the cover to
Accessories
1/2" Teflon Spool Mount 4503
1/2" Teflon spool mount for 1/2" diameter spools. Assembly 4503.
Accessories
1/2" Ball Bearing Spool Mount 7769
Standard 1/2" ball bearing spool mount for 1/2" diameter spools. Assembly 7767.
Accessories
1/2" Ball Bearing Spool Mount 7794
Standard 1/2" ball bearing spool mount for 1/2" diameter spools. Assembly 7794.
Accessories
20" x 20" Platform 9221
Extra large 20" x 20" Work Platform Assembly. May be used on all 4KE & 5KE Series machines. Assembly A-9221.
Accessories
20" x 20" Platform 9228
Extra large 20" x 20" Work Platform Assembly. May be used on all 7KE
Series machines. Assembly A-9228. .
Page 61
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Accessories
Kit, Conversion for Model 7400E Series (9264)
Conversion Kit for Model 7400E with K~1100 Wire Despooler. ESD Protection.
Accessories
Wire Despooler K1100
Automatic Wire Despooler. Pays out bond wire at 1.0 in./sec. from 2 in. wire spool.
Maintains constant slack with zero drag. Announces end of wire stock. ESD Protection.
Accessories
Wire Despooler K1100-3
Automatic Wire Despooler. Pays out bond wire at 1.0 in./sec. from either 1/2 in. or 2
in. wire spools. Maintains constant slack with zero drag. Announces end of wire
stock. ESD Protection.
Accessories
Temperature Controller K-1200D
Temperature Controller, 400 Watts. Assembly Part No 8204.ESD Protection.
Accessories
Temperature Controller K-1201D
Temperature Controller, 600 Watts. ESD Protection.
Accessories
Radiant Heater Controller K-1203
Stand-Alone Radiant Heater Controller, with 3021 Radiant Heater Assembly A-8984.
ESD Protection.
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Page 62
Accessories
Gas Flow Control K-1300
Comprised of K~1310 Gas Flow Control and K~1320 Laminar Flow Nozzle. Used to
compliment West Bond Cavity Inert Atmosphere Workholders for Eutectic die attachment. ESD Protection.
Accessories
Vacuum Control K-1311
The operator, by means of an on/off footswitch, releases the vacuum to the work
area. ESD Protection.
Accessories
Nikon ESD Microscope SMZ-660
Nikon Microscope with ESD protection, with E-Arm, with 15X eyepieces, without Illuminator. Assembly No. 9652
Accessories
Microscope SZ3060E
Olympus, Model SZ3060E Microscope with E-Arm, with 15X eyepieces, without Illuminator ESD Protection. Assembly A-8284.001.
Accessories
Microscope SZ51-60E
Conversion Kit for Model 7400E with K~1100 Wire Despooler. ESD Protection.
Page 63
www.acrosemi.com
Advanced Dicing Technologies (ADT)
Advanced Dicing Technologies (ADT) is a world leader in the development and manufacture of dicing saws and
laser scribing systems, dicing blades and processes used in the dicing of silicon-based ICs, hard material
Microelectronic Components (MECs) and in package singulation. ADT offers dicing equipment with a variety of
capabilities and levels of automation to suit an ever-growing range of customer requirements. Combining our dicing
equipment and annular dicing blades, we bring our customers a complete range of dicing solutions.
Dicing Saws - With four different models to choose from, each optimized for a specific range of
applications, the 7100 Series covers the widest range of applications, offering the lowest possible
cost of ownership while providing the most advanced dicing technology available.
Automatic Dicing Saws - With new architecture and advanced process control tools, the 7200
models deliver substantially higher productivity compared to existing dicing systems.
NextStep Laser Scribing Technology - The NextStep System of the laser 8000 Series
removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually
unaffected. The wafer can then be diced using a standard mechanical dicing process.
Dicing Tools - A wide selection of dicing tools to support your process requirements: Annular
Dicing Blades (Resin-bond Blades, Metal-Sintered Blades and Nickel-bond Blades), Dicing Flanges
and Dicing Accessories.
Peripheral Equipment - We offer a broad range of peripheral equipment to complement our
Dicing Saws as part of our “complete dicing solution” concept.
Customized Solutions - ADT has extensive R&D capabilities comprised of highly skilled
personnel and well-equipped process development centers where our engineers identify the
platform, dicing blades and dicing methodologies which are most appropriate to solve specific
challenges as well as generic industry problems.
www.acrosemi.com
Page 64
Dicing Saws - With four different models to choose from, each optimized for a specific range of applications, the
7100 Series covers the full spectrum of dicing materials from IC wafers to package singulation and hard material
application. The 7100 Series offers the lowest possible cost -of- ownership while providing the most advanced
dicing technology.
An On-going Success Story
7100 Series Advantages
The 7100 Dicing System is an industry
leading platform designed for a variety of
applications such as:
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Ceramic Substrates & Capacitors
Automotive Sensors
Glass
Glass on Silicon
PZT
SAW Filters
Sensors & MEMS
LED & LED on PCB Packages
Package Singulation (BGA, QFN)
LTCC
Opto-electronic Components
IC Wafers
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•
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2" and 4" spindle dicing systems
A full range of automatic vision
capabilities
Advanced hardware platform for high
reliability and low maintenance
Heavy Duty, cast-iron base structure for
superior precision and accuracy
Increased yield, throughput and process
control
Unique multi-panel processing
capabilities
Special blade wear forecast algorithm
User-friendly, Windows XP based
Software platform
1) 7100 Models - 2" Vectus
2", DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm
Max.) Optimized for simple, two-channel alignment of thin material
applications up to 150 mm x 150 mm with a low unit cost per device,
such as:
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Low Cost Semiconductor Devices
Discrete Surface Mount Devices
Standard LED Packages
Thin-film Devices
LTCC Substrates
2) 7100 Models - 2" ProVectus
Max.), with closed-loop turntable Optimized for multi-angle dicing of thin,
tight tolerance products up to 200 mm x 200 mm, such as:
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www.acrosemi.com
PCB BGA Panels
High-brightness LED Packages
Silicon Wafers
SAW Filters
Glass/Silicon Sensors
MEMS
PZT
Page 65
Advanced Dicing Technologies (ADT) - Dicing Saws - 7100 Series
3) 7100 Models - 4" Fortis
4", AC, 1.7 kW, Air-bearing Spindle (30 krpm Max.) Optimized for single
substrate dicing of thick material applications up to 150 mm x 150 mm
with a relatively low unit cost per device, such as:
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Ceramic Substrates
Alumina
Hybrids
Thick-film Devices
4) 7100 Models - 4" ProFortis
Max.), with closed-loop turntable Optimized for multi-angle dicing of thin,
tight tolerance products up to 200 mm x 200 mm, such as:
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www.acrosemi.com
PCB BGA Panels
High-brightness LED Packages
Silicon Wafers
SAW Filters
Glass/Silicon Sensors
MEMS
PZT
Page 66
Advanced Dicing Technologies (ADT) - Dicing Saws
7100 Options
Tilting Spindle
Many optoelectronic components utilize 8° angular surfaces to eliminate back-reflection at
connection or termination points. For the benefit of manufacturers who rely on costly and
time-consuming grinding techniques to produce these angled surfaces, ADT has come up
with an alternative.
The Tilting Spindle capability of the 7100 Series' ProVectus model is designed to
allow perpendicular cutting of optoelectronic materials and can be quickly and easily adjusted to dicing at angles between 0° and 15°. Fine adjustment of the spindle angle, along
with blades, dicing parameters, and other inclusive process options developed specifically
for your component type, guarantee precise angular cuts and excellent surface finish.
Customers have found that these cuts are of a quality sufficient to reduce, if not completely eliminate, the need for separate polishing operations.
Large Area
The Large Area capability available with the ProVectus and ProFortis Models of the
7100 Series was developed primarily for customers who are interested in processing 12”
wafers or singulating large PBGA and CBGA substrates. The Increased X, Y and theta
axis travel combined with closed-loop Y and theta axis control allow the highest level of
precision needed for making long cuts over large distances.
AutoLoader
ADT's AutoLoader option brings affordable, automated 5” to 8” frame loading and
unloading capability to the 7100 Series ProVectus and ProFortis Models. Ideal for
applications with short dicing cycle times, this option reduces operator intervention and
allows extended, uninterrupted processing of multiple, frame-mounted workpieces.
A two- stage, built-in drying system dries the top and bottom surfaces of the workpiece
and frame as they are automatically unloaded from the chuck and returned to the
cassette. Fully self-contained, the AutoLoader can be purchased as an accessory to new
equipment and is also field-retrofittable.
www.acrosemi.com
Page 67
Automatic Dicing Saws - With three different models to choose from, each optimized for a specific range of applications, the
7200 Series is designed to optimize for IC applications, package singulation or hard material applications.
Step into the Future of Dicing
7200 Series Advantages
With new architecture and advanced process control tools, the 7200 models deliver
substantially higher productivity compared to
existing dicing systems, while minimizing the
cost of operation. The system offers a wide
range of advanced automation and process
monitoring options to meet the requirements
of your most challenging dicing applications:
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Silicon
Glass on Silicon
MEMS
GaAs wafers
Package Singulation (BGA & QFN)
LTCC
PCB
Hard Materials
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Unique Wx3 wafer handling system streamlines wafer flow for greater productivity
Continuous digital magnification vision
System provides optimal magnification for
any eye-point
Special agorithm predicts blade wear rates
to reduce height measurement time and
increase UPH
Touch panel display supports a user-friendly
graphical interface (GUI)
Atomized wafer cleaning technology for
superior process results
Dedicated dressing cassette enables
automatic blade dressing
Built-in Inspection tray allows for in-process
quality assessment
Small footprint
1) 7200 Models - ProDice
2"-3", DC-brushless, Air-bearing,
1.2 kW, 60 krpm spindle system, optimized for IC applications.
2) 7200 Models - MegaDice
2"-3" High-torque, DC-brushless, Air-bearing, 2.4 kW, 60 krpm spindle
system, optimized for package singulation and IC applications.
3) 7200 Models - GigaDice
4"-5" High-torque, DC-brushless, Air-bearing, 2.5 kW, 30 krpm spindle system,
optimized for automated dicing of hard materials.
www.acrosemi.com
Page 68
NextStep - Laser Scribing Technology
With ever-increasing transistor density, shrinking metal lines and gate dimensions, producers are forced to use metals of higher conductivity such as copper, "low-k" isolation materials such as "black diamond" and more test pads.
These new manufacturing standards set a different threshold for wafer singulation whereby traditional step cut dicing no longer meets
the quality requirements and cost targets for manufacturing.
ADT meets the market challenge with a new, revolutionary type of laser for wafer scribing that is The 8000 Series - NextStep Laser
Scribing System
ADT’s NextStep Laser Scribing System removes only non-silicon elements from the streets leaving the silicon wafer bare and virtually
unaffected. The wafer can then be diced using a standard mechanical dicing process.
NextStep Process Advantages
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Silicon transparency to the
radiation
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No micro-cracking and no
delamination
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One pass process at 600 mm
per second
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Attractive cost-of-ownership
www.acrosemi.com
Page 69
Dicing Tools
30 years of experience in tailoring solutions to specific applications
ADT’s Dicing Saws, NextStep Laser Scribing System, Dicing Blades , Dicing Flanges , Dicing Accessories and Peripheral Equipment
manifest a wealth of dicing know-how and experience accumulated over three decades.
With our FAST & friendly First sAmple Selection Tool (FAST) assistant you can create a first trial, sample blade, part numberand
have your customized blade sample shipped to your address, free of charge.
We offer our customers a comprehensive solution - a unique blend of research, development, process mastery and skill.
State-of-the-Art Manufacturing Technology
Our dicing blades are composed of abrasive materials embedded in a resin or metal matrix. Resinbond Blades are cured under pressure and high temperature, Metal-bond Blades are sintered and
Nickel-bond Blades are manufactured using a tightly controlled electroforming process.
The highest standards of quality assurance & process control
Strict monitoring at each critical stage of the production process insures that each ADT product meets
the desired specifications and dimensional tolerances. Our dicing blades & accessories are tested
extensively on the latest platforms, simulating the customer’s operating conditions and process parameters. A 100% final inspection is conducted on all products leaving the factory.
Attractive cost-of-ownership
By continuously lowering the cost of manufacturing, improving the quality and longevity of our products and maintaining a competitive, premium pricing policy, we lower the total cost-of-ownership and
add value to your dicing operation.
Dicing Accessories
www.acrosemi.com
Dicing Flanges
First sAmple Selection Tool (FAST) - Blade Selection Assistant
Dicing Blades
Page 70
Dicing Blades
Nickel-bond Dicing Blades
•
The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA
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Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size)
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Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)
Resin-bond Dicing Blades
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Resin as binder allows for blade wear management rendering Resin-bond Blades an
excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates,
HTCC and Glass
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Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
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Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness).
Metal-bond (Sintered) Dicing Blades
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With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are
best suited for retaining package shape and size in applications such as: BGA, Soft Alumina,
TiC, LTCC and Ferrite
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Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)
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Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)
·
www.acrosemi.com
Page 71
Dicing Flanges
www.acrosemi.com
Page 72
Dicing Accessories
www.acrosemi.com
Page 73
First sAmple Selection Tool (FAST) - Blade Selection Assistant
Order Your First Trial Sample Blade Today!
There is nothing trivial about choosing the right blade composition for your process. The task requires taking into consideration,
thickness, geometry, diamond concentration, binder hardness and many more variables. With "FAST", our First sAmple Selection
Tool, you can enjoy the benefit of our 30 years of process experience.
Our FAST & friendly assistant will walk you through the selection process taking your particular requirements into consideration and
producing an educated ADT recommendation for a first trial, sample blade, part number. Based on the submitted information a blade
sample will be shipped to your address, free of charge.
Selection by process specifications
The FAST assistant is currently available only for a limited number of applications. In the future, we may expand the scope of this tool to
include additional materials; however, if you cannot find your application among our options, please let us know and we will contact you
shortly.
Please choose the material to be cut:
www.acrosemi.com
Page 74
Peripheral Equipment
We offer a broad range of peripheral equipment to complement our Dicing Saws as part of our “complete dicing solution” concept.
Workpiece Mounting Unit- Model 966
A versatile mounting unit provides uniform, bubble-free wafer mounting for substrates up to 8” in diameter.
Tape Curing System - Models 955
A digitally controlled system which provides UV irradiation for
mounting-tape curing.
Wafer Cleaning Station - Models 974, 975, 976
The cleaning station is designed for sub-micron cleansing of wafers and other diced materials. The system
utilizes a high-pressure, de-ionized water spray with optional, fixed or oscillating surfactant dispensers. The
system offers rapid drying combining a variable spin centrifuge with nitrogen blow-off and an optional IR heat
lamp. Model 974, a microprocessor-controlled version of the 976, enables storage of multiple programs.
Spindle Coolant Recirculation - Model 933
A constant coolant temperature prevents thermal linear expansion/contraction of the spindle and helps maintain the dicing blade in an accurate cut position.
In-line DI Water Ionizer - Model 940
The re-ionizer dissolves CO2 gas in the DI flow to reduce water resistance and thus prevent the build-up of
electrostatic charges on sensitive devices during singulation, rinsing and cleaning.
Cutting Water Closed-loop Filtration - Model 921
The Closed-loop Filtration system filtrates and recycles process water, enables regulation of water temperature and accommodates the use of special coolant additives associated with dicing applications.
Frames and Cassettes
Our frame sizes accommodate wafers and substrates from 3" up to 12"and are constructed of hardened magnetic stainless steel with an electro-polish surface finish. Cassettes are available in styles and sizes to accommodate all frames. Customized versions are available upon request.
www.acrosemi.com
Page 75
Customized Solutions
ADT has extensive R&D capabilities comprised of highly skilled personnel and well-equipped process development centers where our
engineers identify the platform, dicing blades and dicing methodologies which are most appropriate to solve specific challenges as well
as generic industry problems.
Dicing Process
www.acrosemi.com
Special Offers
Page 76
Dicing Process
30 Years of Experience in Analyzing Your Process Needs
ADT's dicing process development services include:
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Dicing Process Analysis
Recommendation of process parameters
Dicing Blade sample offering
Diced parts for quality inspection
Comprehensive application report
On-site process evaluation
Follow-up for further optimization
Customization/new dicing blade development
On-going support
The followings sources of information will give you more detailed insights into a
variety of different dicing processess:
Package Singulation
LED Packaging
LTCC
PBGA
QFN
IC Dicing
GaAs
Silicon
Microelectronic Components (MEC)
Alumina
Ceramic Capacitors
Glass
PCB
PZT
SAW Devices
Silica on Silicon
Laser Scribing
www.acrosemi.com
Page 77
Special Offers
Process Control Tools
Innovative, real-time Process Control Tools insure higher yield and throughput.
Continuous Digital Magnification Vision System
Provides optimal magnification for any eye-point, from x 1 (8 micron/pixel) to x 8 (1 micron/pixel)
Blade Wear Forecast Algorithm
A unique algorithm predicts blade wear rates based on blade wear averaged history. Advantages: reduces measurement time up to a one-third of conventional methods and increases UPH.
A unique pre-defined Alignment Algorithm
Compensates for shrinkage and corrects angled wafer deformation.
Lit-up Chuck
Customized Chuck Illumination.
A lit-up Chuck, illuminated from below, improves cut quality and extends blade life.
A shape retaining Beveled Blade
Improves Cut Quality and Extends Blade life.
Atomized Cleaning Technology
Special Nickel Blades for PCB
New "T", "V" and "Z" type blades for minimal burrs
"T", "V" & "Z" blades are composed of tightly controlled concentration of diamonds bonded by nickel. The unique
"T", "V" & "Z" blades minimize the occurance of burrs while maintaining above average blade life.
Coolant Technology
A unique closed-loop Coolant System
Circulates chilled water and additives to improve wetting properties, enhance cut quality and extend blade life.
Non-bronze Sintered blades
Harder, more stable, non-bronze sintered blades
For better diamond retention.
For more information, visit us online at
http://www.acrosemi.com/eng_products_ADT.htm
www.acrosemi.com
Page 78
Our Customers
Worldwide
ADVANTEST, FUJITSU, HERLEY
HEWLETT PACKARD, HITACHI, INTEL
JDS UNIPHASE, LOCKHEED MARTIN
M/A-COM, TYCO ELECTRONICS
MATSUSHITA, MITEQ, MOTOROLA
MITSUBISHI, NORTHROP GRUMMAN (TRW)
PHILIPS, QUANTUM, RAYTHEON, REMEC
SAMSUNG, SEAGATE TECHNOLOGY
TEXAS INSTRUMENTS
TELEDYNE ELECTRONIC TECHNOLOGIES
TOSHIBA ….
Also more than 200 universities, institutions, labs are
currently using our equipment.
www.acrosemi.com
Page 79
Our Service
When it comes to service and support, you can expect the best from AcroSemi. From technical support, to training,
to field and factory service, our goal is to be responsive to our customers' needs and help you get the most from
your technology investment.
After-Sales Service
"After your selection of equipment, the choice of the best machine depends on how well it is supported!". At
AcroSemi, with over 40 years of experience in the semiconductor industry, we pride ourselves on being able to
offer the very best in after-sales support. We provide the following services to keep your equipment running as the
manufacturer intended:
•
Installation on all equipment sold.
•
Machine set-up.
•
Operation.
•
Troubleshooting.
•
Spare Parts Support.
•
Warranty.
•
Reconditioning of machinery.
•
Friendly and courteous service by
qualified staff.
We also provide:
•
Turnkey projects.
•
Products selections.
•
Full range of Surface Mount Technology (SMT) Line.
•
Full range of Semiconductor Assembly Line.
•
Full range of Dicing Solutions.
•
Advices, Services, and Supports to related Semiconductor Products.
We have skilled engineers who will work closely with you to fully understand your application. Our dedicated team
of sales engineers and inside sales support are available to help you decide which product fits your application best.
Our uncompromising attention to each of our customer's requirements is a top priority. We know you will be
pleased with product performance, price (value) and delivery. Our ultimate goal is TOTAL CUSTOMER
SATISFACTION. Please give us the opportunity to exceed your expectations.
Training
We offer training on all of our range of products and will be happy to tailor a program to suit you and your staff.
For more information, please Email: sales@acrosemi.com or visit us online at http://www.acrosemi.com
www.acrosemi.com
Page 80
www.acrosemi.com
U.S.A Office (Corporate Headquarters)
5242 Villa Dante Ave, Las Vegas, NV 89141, U.S.A.
Tel: 714-468-9034
Fax: 866-212-8857
Email: sales@acrosemi.com
Ho Chi Minh Office
364/1 Cong Hoa, Ward 13, Tan Binh District, HCM City, Vietnam
Tel: (+84) 8-268-0958
Fax: (+84) 8-268-0957
Email: hcmc@acrosemi.com
Hanoi Office
Room 505-N2B, Khu Do Thi Trung Hoa Nhan Chinh, Hoang Minh Giam Street,
Thanh Xuan District, Hanoi, Vietnam
Tel: (+84) 91-225-7173
Fax: 866-212-8857
E-mail: hanoi@acrosemi.com
www.acrosemi.com
Page 81

Vietnam`s Leading Supplier of Semiconductor Equipment, Tools

Transcription

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