MC6802 MC6808 MC6802NS

MC6802
MC6808
MC6802NS
MICROPROCESSOR
The MC6802
registers
WITH CLOCK AND OPTIONAL RAM
is a monolithic
and accumulators
8-bit microprocessor
of the present
MC~OO
that contains
all the
plus an internal
clock
oscillator
and driver on the same chip. In addition,
the MCW02 has 128
bytes of on-board
RAM located at hex addresses $~
to $O07F. The
first 32 bytes of RAM, at hex addresses $~
to $001 F, may be retained
in a low power
mode by utilizing
VCC standby;
thus, facilitating
memory ietention
during a power-down
situation.
The MC6802 is completely
software compatible
with the MC68W as
well as the entire
M~W
family
of parts.
Hence,
the MC6802
is expand-
..,,....,., t..>i
able to WK words.
The MC6802NS
is identical
to the MC6802 without
standby
RAM
feature.
The MC6808 is identical
to the MC6802 without
on-board
RAM,
● On-Chip
Clock
● 128x8
Circuit
Bit On-Chip
● 32 Bytes of RAM
● Software-Compatible
● Expandable
● Standard
● 8-Bit
.
16-8it
with
the MC68~
to 64K Words
TTL-Compatible
Word
Inputs
and Outputs
Size
Memory
● Interrupt
RAM
are Retainable
Addressing
~>,,~
;\J:
.!$
;~,~:
~\R,!. t
*$\i,
‘$. ~.~.,
$\iM
~..;,,
,
,W ..,~$!,‘~
.,,
...
~.~:;, ‘>~.
,?
.*..:Xl~,o,,
.f+$.t,,.
*$,,
.1,>,,
~,.t..~.$
~:t<y:i
“..>
,.,..
,,
,,.,)?
,$$.!.,
.,.
..\,.\.\,
+$;,
,{, ~.$>&,
.
,,:.4,.,~.>
.:s$..
,..b
~
>l,i,y.
,,\\, ‘J.i:..$
>
~y$
,’ ... ~./,,
.,,.,{+? ,, “
‘,{$;:,?.:$:
~s.q,
~~,i$~
.,,. a:.,,3,,
,~,i
, ..>.,’,
~~
.:>
,\\.)t.
~’
,,.,,a,+:>.,
‘~,.-’
.~,~
?;:<, \%:>t
‘...f$,+
~J:
,.KK,*?
~,,,
!::,,
;.!,, .,J~
~.?.,
,..,.
,,~t~r.tc
,>....,..,.
~,,).$
Capability
ORD&Q~,~lJjFOR
,,,$%
~~.*>
Freq&&nc$@fiz)
:$:f~ls$
,,{.:.
Ceramic
~:,,“v \
*?.O
L Suffix
~~
,““.NA.Jx$:i
\ ‘:.ik 1.0
~:<$.
., ‘,‘$?$
1.0
.,~;...
.*:‘.;::,,$
+,?..
*
>?:$>l,. \
1.5
,if
.,:\
.\:.\ a “
1.5
.,.. .,.;(>~ti~
...%
*...l..~’!::::
1.5
~\J.,
.13,,
i
v,
,3*
,\
t.i.v,\
2.0
>;~j.’,.].
~~\ .,
,~,~~,.,t:;
.
2.0
~e~ti~
P Suffix
1.0
1.0
1.0
1.0
1.5
1.5
1.5
2.0
2.0
Temperature
PIN ASSIGNMENT
Vss[
1.
40 )fl EsET
HALT[
2
39 ]EXTAL
VR[
3
38 ] XTAL
FQ [ 4
MATION
,,:, ,,.
Package Type
P SUFFIX
LASTIC PACKAGE
CASE 711
Order Number
Ooc to 70”C
– 40°C to 85°C
Ooc to 70”C
O“c to 70°c
O“c to 70”C
–40°C to 85°C
O“c to 70°c
Ooc to 700c
O“c to 70°c
M C6802L
MCM02CL
MC6802NSL
M C6808L
M C68A02L
M C68A02CL
MC68A08L
MC68B02L
MC68B08L
O“c to 700c
–40°C to 85°C
Ooc to 700c
Ooc to 700c
Ooc to 700c
–40°C to 85°C
O“c to 70°c
Ooc to 700c
O“c to 700c
MC6802P
MC6802CP
M C6802N SP
M C6808P
MC68A02P
M C68A02CP
M C68A08P
MC68B02P
MC68B08P
37 ]E
VLIA[
5
36 ] RE**
NMI[
6
35 ] VCC
BA[
7
34 J R/~
8
33 ] DO
Vcc[
AO [ 9
32 ]Dl
Al [ 10
31 ]D2
A2 [ 11
30 ] D3
A3 ~ 12
29 ] D4
A4 [ 13
28 ] D5
A5 [ 14
27 ] D6
A6 [ 15
26 ] D7
A7 [ 16
25 ]A15
A8 [ 1?
24 ]A14
A9 [ 18
23 ]A13
A1O[
19
Standby*
22 ]A12
* pin 35 mUSt be tied to 5 V on the MC6802NS
* * pin 36 must be tied to ground for the Mc6808
@MOTOROLA lNc , 1984
DS9818-R3
TYPICAL
Vcc
0
Counter/
Timer
Vcc
M C6W6
1/0 15
ROM,
1/0,
Cso
Control
~
2 k BVtes ROM
10 !/0 Lines
3 Lines Timer
,
Vcc
0
-
~Q
-
MR
VMA
_
RESET +
HALT
VMA
Clock
~
~
~
—
~
~
Parallel
IJO
1
Timer
RESET
~
~
MICROCOMPUTER
E
R 1~
-
RE +
—
R ‘ w MC6802
BA -
EXTAL
~
{n
AO-A1O,
CPI
Csl
AO-A15
AO-A15
XTAL
-
SVmbol
Input
Temperature
Range
M C680A02,
M C6802C,
M C680B02
TA
M C680A02C
M C6802N S
MC6808,
Storage
MC68A08,
Temperature
THERMAL
system
chip.
interfacing
is
~hh
It is not int.~n~
be limited
it be expandable
the
and
to this,C{~~~&*
with
Microcomputer
Resistance
‘**. ,“~~~’
,,$:,Th[s\,{~put
,.:\.
circuitrv
to protect
the
propriate
‘c
logic voltage
level (e.g.,
either
VSS
or VCC).
,..
\:~
\
Sy:p@&*$
(Junction
contains
to +7.0
– 5$,&,~&T80
,~.,
$?$,,,
s,
Tstg
Characteristic
Thermal
Unit
o to *TO “’~
M C68B08
Range
CHARACTERISTICS
Average
svstem
is
svstem
“!*!KQutS against
damage
due to high static
:&+,,,e..!:.,.,
v
it is ad.
v ~a;$$~:~~~$t~ltagesor eleCttiC fields; however,
–0.3 to +7.0
~t vised that normal precautions
be taken to
,:,,\>..*’
.’ ~~’:<
*,:?IW
avoid application
of anv voltage higher than
oto
+70
-?~::~’
maximum
rated
voltages
to
this
high.- .
impedance
circuit.
Reliability
of operation
is
– 40 to + 8p<g,,
t
enhanced
if unused inputs are tied to an apo to +,gQ<.. ‘!$ ,,
–0.3
Vin
Voltage
M C6802,
Value
Vcc
Voltage
Operating
microcomputer
combination
this
cost ef-
MPU
\,<J*,
*Ri.!~$.>,
~>
RATINGS
Rating
SupplV
in a minimum
a typical
The
ot@r ‘~@&ln
\ *\*:,
faml$~,tts$j:{$iW
\*.SS::[.:,j.:.
.+..
*T
...,.~i.,
~l!,:l!,
,~
\\J,
‘>
.,)...,t;+: ,.: ~~::
i.., ~:
\:,q::,$q?>:J,f
t,:$
.~.!..
~.:...
,. ,$.~
i,<>, \,Ii\.
.>,$.,‘&?
‘
i.
., \,*i.,!,.,,.
.,,,~~:,!,
-...2:.p.,
,’,> *.>\)
lit.
‘~.’ ,.,
.f:~s,,)W
‘
$~:
*ii,”
~’~?l~.
,, ‘*K>+.}!
—
MAXIMUM
shown
the M6800
o
CP2
of the
but that
DO-D7
DO-D7
center
that
shows
microcomputer.
a ROM
ml
MPU
DO-D7
This block diagram
fective
Value
Unit
to Ambient)
Plastic
Ceramic
,//,
.*,.,
~,
~,.<.}:
~~,
,.:~ :1,
,,,..,~$.
‘$~:::,,t,.
, ~$’
,,!,
.,.,.,.
, ~,~
.... ,,.~.$)
:*
:.,
“~v~,.
,i,.
The average chip-juncti~~%p~rature,
TJ = TA+ (pD.Q$A) ‘?~~$
POWER
TJ,
CONSIDERATIONS
in ‘C can be obtained
from:
(1)
,Jj:.:’~$+
*]~?{i>,
‘ .t!i~.
Where:
~:~,~$”%~ient
~~~~~Package
Temperature,
Thermal
‘C
Resistance,
Junction-to-Ambient,
OC/W
,\@F$~2$\m= plNT+ pPORT
t “PINT=
ICC x Vcc, Watts – Chip Internal Power
~?~:~,<$,
....-.\\,!;)$
,T~~,
;h’”””
PpORT=
Port Power Dissipation,
Watts – User Determined
~,$:.,,
,
!<~,(p
,..’
.+,.
<
PPORT
may become
$~{,~ost
applications
pPORT@ PINT and can be neglected.
dr$~ ~arlington
bases or sink LED loads,
~:::
~
~n approximate
PD=
Solving
K:
relationship
between
PD and TJ (if PpORT
is neglected)
significant
if the device
to
is:
(TJ +273°C)
equations
is configured
(2)
1 and 2 for K gives:
K= PD*(TA+2730C)
+OJA*PD2
(3)
Where K is a constant pertaining
to the particular part. K can be determined
for a known TA. Using this value of K the values of PD and TJ can be obtained
value of TA,
from equation 3 by measuring
PD (at equilibrium)
by solving equations
(1) and (2) iteratively for any
Semiconductor
2
Products Inc.
DC ELECTRICAL CHARACTERISTICS
I
(Vcr
= 5.0 Vdc
f 5%,
VSR = 0, TA = O to 70”C,
Characteristic
I
Logic,
Input High Voltage
Input
Low Voltage
Input
Leakage
Output
unless
Svmb
RESET
Logic,
Current
(Vin =0 to 5.25 V, VCC=
EXTAL,
Max
I Unit I
I
v~~
I
-
,,
Vcc=min)
(i Load=
– 145wA,
VCC=
rein)
(lLoad=
– 100wA,
VCC=
rein)
Output
Low Voltage
Internal
Power
AO-A15,
(Measured
VCC=
at TA=
E
rein)
O°C)
Power Down
Power Up
VCC Standby
Standby
VMA,
Current
Capacitance
(Vln=O,
VOH
BA
(lLoad = 1.6 mA,
Dissipation
R/~,
Vss+O.8
—
—
1.0
2.5
VSS+2.4
–
—
VSS+2.4
–
–
Vss+2.4
–
VOL
–
PINT
—
VSBB
4.0
v
PA
,+!.
..8
ISBB
f=l.O
DO- D7
MHz)
Logic
Inputs,
AO-A15,
CONTROL TIMING (VCC=5.O
V +5%,
VSS=O,
TA=TL
to TH, unless
r
R/~,
Cin
EXTAL
VMA
Cout
otherwjw
ri~$,j
) \?*..L
MC6802
Mcmo2Ns
MC6B08
Characteristics
Min
Frequency
~’‘1:.,,,-\\
>:,..
of Operation
t,)
.<?
‘.’
,,;t..!.,:,
“+$9
,
,.
,.,,
s,,,. >,.
.,\,,\
*!\*\*.,!.,\.!,.
Frequency
External
Oscillator
Oscillator
Processor
Controls
Frequency
Start
Up Time
(HALT,
MR,
RE, RESET,
~
~lk,.,’wt~,.
MOTOROLA
“
f.
fXTAL
4xfo
trc
0.1
5
3
v’
mA
pF
pf
MC6BA02
I MC68B02
I
\
Max
1.0
1.0
4,0
1.0 I1
0.4
4.0
0.4 I 6.0
I 0.4
I
100
–
lMI
–
11001
200
–
140
–
110
—
Im
—
T
Semiconductor
@
~~$~,
*,iti
— ,t:, >.,
.R*.@
4.75
#
TA=250C,
–
*$>~’;25
-i.
$):,
—
–,
,:> “~: as B.O
*Y~<
*:,
>,.,,.,,...
.};,,:,
..*;.+,’
$ ., ;~,>10
12.5
*’
.
,$,
.,:.,+it~:~’
6.5
10
.f, **,
,+
‘.’?l~.-’ —
-,.!., ‘:$”).,
12
‘ ~~~,:’.:>~j)i
VSB
I
“ LL
;s–0.3
.—
Iin
DO-D7
–205pA,
Crystal
I
t
High Voltage
(l Load=
Crystal
I TVD
>> ~~u
RESET
Logic
max)
noted)
Min
I v~~+2.0
VIH
EXTAL
otherwise
01 I
6.0
I
1.0
lW
I
1 8.0
1
1
Products Inc.
I MHz
1
I MHz
I
–Ims
–
–
I
8.0
ns
Im
I
ns
I
BUS TIMING
CHARACTERISTICS
MC8B02
Ident.
Svmbol
Characteristic
Number
Min
Max
Min
tcyc
0667
10
0.5
10
pWEL
450
500
280
5000
210
5000
PWEH
450
9500
280
9700
220
9700 , ‘A$*.’J 8+
25
–
25
–
–
20
–
20
E Low
3
Pulse Width,
E H)gh
4
Clock
9
Address
12
Non- Muxed
17
Read Data Setup
18
Read Data Hold Tme
19
Write
Data Delay Tme
21
Write
Data Hold Time*
tDH~V
29
Usable
and data
:~, {f
Rise and Fall Time
Hold T{me*
hold times
to E (See Nate 5)
Time
tested
rather
than
FIGURE
24?
ps
n~>,,
“?{.
~:~$i?
,t:,’’’%$~:i$is
20
iAVl
tAv2
160
–
lm
–
270
–
–
50$:‘ $$~~t ~
..&.$;$i$,.rlj>i
~,..
“s
–
tDSR
100
–
70
~:t
,<;~@ “ -
ns
IDHR
10
–
10
tDDW
–
225
30
–
1000/o tested
2 –
Max
tAH
tACC
T:me (See No!e 41
are periodically
Unit
10
Pulse Width,
*Address
MC8BB08
Max
2
Valid Tme
MC6BB02
MC68A08
10
Cvcle Time
Access
MC6B08
MC6BA02
Min
1
Address
MC6802NS
.$, – “?.;>i~’1o
–.+~ :1,70
a,+
:YQ:::~:’:
~,* *k$2Q~’
\ ~,, *,
‘+:$..%;%~:
.,;$l:~
..... ....,~~~,t
.~+.,.,. ,$.
$\.*
*,4,.
,
,,~:t.
,.,-..
.,,.
}’<.,f::y>x~,.+:?.
Yt>
%...rh$:<>~.
,..:.,
535
-
–
–
160
“s
ns
20
_
ns
235
–
ns
BUS TIMl NGm4e ‘$)?iwe~?
,;*.,
.:.-,.i.,,<,.~
E
—
R/~,
Address
(Non- Muxed)
Read Data
Non-Muxed
,
Write Data
Non- Muxed
NOTES:
,*i: ~
~:
~{ ‘f’
1. ~@&~~<Wvels
,.,,,\,,
shown
z,~~$<ufement
**~,$$..\ .
~ji~~~.~lectricals
points
shown
shown
for the MCN02
4.’’& sable access
are VLSO.4
V, VH z2,4
V, unless
otherwise
are 0.8 V and 2.0 V, unless otherwise
time is computed
apply
to the MCM02NS
bv: 12+ 3+4–
specified.
noted.
and MC~08,
unless
otherwise
noted.
17.
5. If programs are not executed from on-board RAM, TAV1 applies. If programs are to be stored and executed from on-board RAM, TAV2 applies. For normal data storage in the on-board
RAM, this extended
delav does not apply. Programs cannot be executed from on-board
RAM when using A and B parts (M C68A02, MCMA08,
MC~B02,
MC68B08).
On-board RAM can be used for data storage with all parts
6. All electrical
and control
characteristics
are referenced
from:
TL=OOC
minimum
and TH = 70°C
maximum.
..
MOTOROLA
Semiconductor
4
Products Inc.
FIGURE 3 – BUS TIMING TEST LOAD
4.75
v
?
C= 130 pF for DO-D7, E
=W pF for AO-A15, R/~, and VMA
=30 pF for BA
R= 11.7 k~ for DO-D7, E
= 16.5 kQ for AO-A15, R/~, and VMA
=24 kQ for BA
FIGURE 4 – TYPICAL DATA BUS OUTPUT DELAY
versus CAPACITIVE LOADING
600
I
I
I
I
- lo H=-205@max@2.4v
lo L=l,6mAmax@0.4V
500 -VCC=50V
- TA = 25°C
~
5
u
z
G
>
400
300
a
d
0
200
/
100
CL fncludesstrav
o
200
100
0
CL, LOAD
400
300
CAPACITANCE
capacitance
500
600
(PF)
I
..::\ .
FIGURE 6 – EXPANd%@:~*OCK
A15
A14
A13
A12
25
24
23
22
All
2SX
AlQ,.+ A~w’
19“’”
18
DIAGRAM
A8
A7
A6
A5
A4
A3
A2
Al
17
16
15
14
13
12
11
10
AO
9
i
L
m36
‘AMEnab’e
: =A35
:
I
‘Ccstandb,
Instruction
Register
VCC=
Pin 8
Vcc=
Pin 35 for
VSS=Pins
VSS=
I
~ m
m
MCW02NS
1, 21
P\n 36 for
MC~08
26
27
28
29
30
31
32
33
D?
D6
D5
D4
D3
D2
DI
DO
MOTOROLA
Semiconductor
5
Products Inc.
I
MPU REGISTERS
—
read/write
memory
that
may
A general block diagram of the MCW02 is shown in Figure
6. As shown, the number and configuration
of the registers
that is convenient.
are the same as for the MCWOO. The 128x 8-bit RAM* has
been added to the basic MPU. The first 32 bytes can be re-
of information
in the stack
must be non-volatile.
In those
have
any
applications
when
location
(address)
that require
power
is lost,
storage
the stack
tained during power-up
and power-down
conditions
via the
RE signal.
The MC6802NS
is identical to the MC6802 except for the
standby feature on the first 32 bytes of RAM, The standby
feature
does
not exist
on the
must be tied to 5 V.
The MC6808 is identical
MC6802NS
to the
and thus
MC6802
except
pin 35
for
on-
board RAM.
Since the MC6808 does not have on-board
RAM pin 36 must be tied to ground allowing the processor to
utilize up to WK bytes of external memory.
The MPU
has three
16-bit
registers
and three 8-bit
registers available for use by the programmer
(Figure 7).
PROGRAM
The
points
STACK
CONDITION
program
counter
is a two
program
byte
(16-bit)
register
that
Overflow
address.
pointer
down/pop-up
stack.
is a two
available
byte
register
location
that
contains
in an external
This stack is normally
a random
the
diti~p
are not executed
plies.
For normal
when
using
from
data storage
A and B parts
on-board
in the on-board
(M C68A02,
RAM,
TAVI
RAM,
MC68A08,
this extended
MC68B02,
,~d
Register
,$&?~Ju~~Within
access
applies.
?&$e
(b6 and
.+@~ure 8 shows
push-
bit 3
the
b7) are ones.
order
of saving
the
microprocessor
the stack.
:*\i
:!:.,$!ti,.~$:>.~r.&
i ~..
‘If programs
(V), ,Q#’~~y,frorn bit 7 (C), and Half Carry from
(H). These,~i+~+~~~fle
Condition
Code Register are used as
testable .$d$dit]pns
for the conditional
branch instructions.
Bit 4 is.$’@~@Y@rupt mask bit (1), The unused bits of the Con-
POINTER
of the next
REq{$FEF
CODE
The condition
cq~#:~t~]M~er
indicates
the results of an
Arithmetic
Logic U*#~~&~eration:
Negative
(N), Zero (Z),
COUNTER
to the current
The stack
address
(ALU).
.-
If b~-s
are to be stored
dela~does
not apply.
M&68 B08).
On-board
and executed
Programs
RAM
cannot
from
on-board
be executed
from
can be used for data storage
RAM,
TAV2
on-board
with
apRAM
—
all parts.
UNIT
I
lx
]
15
Register
Index
0
Pc
Program
15
Counter
0
SP
Stack
7
Pointer
0
Condition
Codes
Register
Carry
(From
eit
7)
Overflow
Zero
~
Half
Carry
(From
Semiconductor
@
6
.
Bit 3)
Products
Inc.
FIGURE8–
SAVING THE STATUS
OF THE MICROPROCESSOR
IN THE STACK
m-9
H
SP = Stack
I
I
1’
I
b
Pointer
CC = Condition
Codes
ACCB
= Accumulator
B
ACCA
= Accumulator
A
(AI=
called
the Proce$sor
IX H = I ndex
Register,
Higher
Order
B Bits
I XL
Register,
Lower
Order
B Bits
= Index
PCH
= Program
Counter,
Higher
Order
8 Bits
PCL
= Program
Counter,
Lower
Order
B Bits
Status
Byte!
m-2
m -1
m
m+l
m+2
——
H-
MPU SIGNAL
., .:;.,.
..
.iJ.\ .,..:,.>,
Proper operation
and timing signals
of the MPU requires that certain control
be provided to accomplish
specific func-
tions and that other signal lines be monitored
to determine
the state of the processor.
These control and timing signals
are similar to those of the MCM~
except that TSC, D&~,
~1, 42 input,
and two
unused
and the following
signal
RAM Enable (RE)
VCC Standby
+2 Output
The following
have
been elimin~td~:w
the HALT
line must go high for one clock cycle.
HALT
should
be tied high if mt
used. This
and timing
Crystal Connections
EXTAL
Memory Ready (MR)
Enable
pins
, ~~on~ bus available will be at a high state, valid memory
.,~+,ws
will beat a low state. The address bus will display
‘%~~’*LEddress of the next instruction.
,..
operation,
transition
of
,f~,
~
— To ensure single instruction
HALT line must occur tpcs
before the falling edge of E
(E)
is a summary
lines have been ~*~Q:
.~,4,.: ‘ +$\.
\
.>::~,,,.1:, ~’
~::\>$.(.,f:l>
and XTAL
> qk$~i.,
“*F
.:+>.~
,,>>!.,L,k
\ ,f,$:,
*;>,
,>L~,,,
\
+&,‘?
‘$+::+,>,.
.,,.
,t:,’f.’>!.:l.+.;’>~”
.,.,
of the?~,P~
signals:
‘,~~
* \?.:t,.,,.
‘ :\J
.ici’.
/?.~.~,
engineering
design
sure proper
operation
READ/WRITE
This
memory
practice
in general
adthe
the
and
is good
and necessary
to en-
of the part.
(R/~)
TTL-compatible
devices
whether
output
signals
the
peripherals
the MPU is in a read (high)
and
or write
Sixteen pins are used for t%~a~dress bus. The outputs are
capable of driving one >a~~dar&TTL
load and 90 pF, These
(low) state. The normal standby state of this signal is read
(high). When the processor is halted, it will be in the read
state. This output
is capable of dtiving
one standard
TTL
load and 90 pF.
lines do not have thr~~k~t~?capability.
~.
:,.$
.:.!},.. !:\.
,,,,
VALID
ADDRESS
DATA
BUS
(AO-A15)
.,,
,~,,:$t
<r..,,,.,,
~
BUS (DO@p
MEMORY
ADDRESS
(VMA)
This output indicates to peripheral
devices that there is a
valid address on the address bus, In normal operation,
this
signal should be utilized for enabling
peripheral
interfaces
Eight pins,~~ti~d
for the data bus. It is bidirectional,
transferrin~~da~$?{o
and from the memory
and peripheral
devicest~~$ ‘{w
has three-state
output
buffers capable of
such as the PIA and AC IA. This signal is not three-state.
One
standard TTL load and 90 pF may be directly driven by this
active high signal.
drivin~!~~~tandard
TTL load and 130 pF.
D~~J$~s
will be in the output
mode when the internal
RA~$~s accessed and RE will be high. This prohibits external
data entering the MPU. It should be noted that the internal
RAM is fully decoded from $~
to $W7F. External RAM at
is ac-
BUS AVAILABLE
(BA) – The bus available signal will normally be in the low state; when activated,
it will go to the
high state indicating
that the microprocessor
has stopped
and that the address bus is available (but not in a three-state
condition).
This will occur if the ~
line is in the low state
HALT
or the processor
When this input is in the low state, all activity
in the
machine will be halted. This input is level sensitive,
In the
HALT mode, the machine will stop at the end of an instruc-
tion of a WAIT instruction.
At such time, all three-state
output drivers will go to their off-state and other outputs to their
normally
inactive level. The processor is removed from the
$~0
to $W7F
cessed.
must
be disabled
when
internal
RAM
MOTOROLA
Semiconductor
@
7
is in the WAIT
state as a result of the execu-
Products Inc.
I
WAIT
state by the occurrence
or nonmaskable
one standard
INTERRUPT
interrupt.
TTL
of a maskable
This output
(mask bit I = O)
is capable
tion of a routine to initialize the processor from its reset condition. All the higher order address lines will be forced high.
For the restart, the last two ($ FFFE, $FFFF) locations
in
of driving
load and 30 pF.
REQUEST
memory will be used to load the program
by the program counter.
During the restart
(~Q)
before
mask
it recognizes the request.
bit in the condition
code
down sequences are shown in Figures 9 and 10, res~~~~:ly.
RESET, when brought low, must be held low~$~~~~~ttiree
clock cycles. This allows adequate time to res~:~:~;t$ternally
to the reset. This is independent
of the tk~~pb~~?-up
reset
At that time, if the
register is not set,
the machine
will begin an interrupt
sequence.
The index
register,
program
counter,
accumulators,
and condition
code register are stored away on the stack. Next the MPU
will respond to the interrupt
request by setting the interrupt
mask bit high so that no further
interrupts
end of the cycle, a 16-bit vectoring
in memory
locations
$FFF8 and
may occur.
high threshold
without
bouncing{JF@~/~f~$?ng, or otherwise
causing an erroneous
reset (less ?k~:~~three clock cycles).
This may cause improper
MPmu~era~lon
until the next valid
At the
address which is located
$FFF9 is loaded
which
reset.
causes the MPU to branch to an interrupt routine in memory.
The HALT line must be in the high state for interrupts
to
be serviced.
is low,
A nominal
Interrupts
will be latched
3 k~ pullup
resistor
wire-OR and optimum
control
directly to VCC if not used.
internally
while
to VCC should
of interrupts.
NON-MASKABLE
(NMI)
,}.,.,*.;S!,5 ‘*8S
input
requests
that a nonbe generated
within the pro-
cessor. As .w~~%:i{*@tnterrupt
request signal, the processor
will compl~e
?%J#current instruction
that is being executed
before i~~?q~~~~~zes the NM I signal, The interrupt mask bit in
may be tied
the con~~~on code register has no effect on NMI.
~Xfi+e,in~~x register, program
counter,
accumulators,
RESET
This
lNT<KN&T
A low-going
ed~b$:+~~}this
maskable
interr,~~~ se@ence
HALT
be used for
~Q
that is addressed
routine, the inter-
rupt mask bit is set and must be reset before the MPU can be
interrupted
by ~Q.
Power-up
and reset timing and ~ower-
A low level on this input requests that an interrupt
sequence be generated within the machine. The processor will
wait until it completes
the current instruction
that is being
excuted
interrupt
input
is used
to
reset
and
start
the
MPU
from
a
power-down
condition,
resulting from a power failure or an
initial start-up
of the processor.
When this line is low, the
MPU is inactive and the information
in the registers will be
lost. If a high level is detected
on the input, this will sig;al
the MPU to begin the restart sequence.
—
and
,,,,modwn code registers are stored away on the stack. At the
address which is located
~,en’~of the cycle, a 16-bit vectoring
.\;\).~<s:,
,.,
~.?wmemory
locations
$FFFC
and
$FFFD
is loaded causing the
,:.~i,~,
1,,.\%:,,
*{~j;:’+MPU to branch to an interrupt
service routine in memory.
,.
+,
A nominal 3 k~ pullup resistor to VCC should be used for
.\.,~
wire-OR
This will start eKwu$~*:$)t:.,>
“*’!. .....
and optimum
control
of interrupts.
ml
may be tied
Vcc
E
RESET
I
(See Note Below)
Option 2
(See Figure 10 for
Power-down
Condition)
RE
.-
*
NOTE:
If option
1 is chosen,
RESET and RE pins can be tied together
MOTOROLA
Semiconductor
8
Products
Inc.
FIGURE 10 – POWER-DOWN
to VCC if not used.
Inputs ~Q and NM I are hardware interrupt lines that are
sampled when E is high and will start the interrupt routine on
directly
a low E following
the completion
of an instruction.
Figure 11 is a flowchart
describing
the major
paths and interrupt
vectors of the microprocessor.
gives the memory
map for interrupt
decision
Table 1
‘CC7
vectors
TABLE 1 – MEMORY MAP FOR
INTERRUPT VECTORS
Vector
MS
LS
Description
Restart
$FFFE
$FFFF
$FFFC
$FFFD
Non-Maskable
$FFFA
$FFFB
Software
Interrupt
$FFF8
$FFF9
Interrupt
Request
Interrupt
1
FIGURE 1
Execute
Interrupt Routine
I
,V,
Execute
Instruction
Bb
NM I
$FFFC
$FFFD
+
MOTOROLA
@
Semiconductor
9
TQ
$FFF8
$FFF9
Products Inc.
SEQUENCE
I
a m
FIGURE 12 – CRYSTAL SPECIFICATIONS
38
39
n
,
1
coutT
AA
“
-.
T
,
I
Cin
Crystal Loading
——
——
—
—.
——
—
—
,
~!
‘These
Crystals
are representative
of other
types
+$~cut
parallel
resonance
crystal
parameters
only.
~~ cR% may also be used.
and 39 Pin
-.
m
MOTOROLA
Semiconductor
10
Products
FIGURE14–
MEMORY
READY
SYNCHRONIZATION
r
4xfo
Oscillator
I
u
The tpcs
setup
E will be stretched
The E clock will resume
is referenced
asserted.
normal
to transitions
There
is no direct
operation
at the end of the fi cycle during
of E were it not stretched.
means
of determining
If tpcs
when
MOTOROLA
@
setup
the tpcs
which
MR assertion
time is not met,
references
occur,
unless
Semiconductor
11
meets the tpcs
E will fail at the second
setup time, The tpcs
possible
the svnchron!zing
transition
circuit
is
in in-
setup time
time after MR is
of Figure
Products Inc.
time
14 is used.
I
RAM
ENABLE
(RE –
A TTL-compatible
MC8B02+
MC6802NS
RAM enable
input
RAM of the MC~02.
When placed
chip memory is enabled to respond
the low state, RAM is disabled.
to disable reading and writing
power-down
situation.
RAM
MPU INSTRUCTION
ONLY)
controls
SET
...
the on-chip
The instruction
in the high state, the onto the MPU controls.
In
set has 72 different
are binary and decimal
store, conditional
or
This pin may also be utilized
the on-chip
RAM during a
Enable must be low three
instructions.
Included
arithmetic,
logical, shift, rotate,
unconditional
branch,
interrupt
stack manipulation
instructions
(Tables 2 through
struction
set is the same as that for the MC68~.
load,
and
6). The in-
cycles before VCC goes below 4.75 V during power-down.
RAM enable must be tied low on the MC6808. RE should be
tied to the correct high or low state if not used.
EXTAL
AND
These
XTAL
inputs
are used for the internal
be crystal controlled.
resonant
fundamental
divide-by-four
circuit
oscillator
that
may
There are seven address
These connections
are for a parallel
crystal (see Figure 12). (AT-cut. ) A
has been added so a 4 MHz crystal may
grammer,
four times
the required
be grounded.
An RC network
source
E clock
frequency.
on pins 38and
directly
usable
39. An RC network
frequency
than
tpW@L.
dynamic
clock
The
is used,
MC6802,
parts except
external
clock
MEMORY
of 1
MHz, @%l#iWes
as a frequency
for the internal
to retain
READY
it may not be halted
MC6808
and
RAM,
are
and require
the
information.
(MR)
MR is a TTL-compatible
input
signal
‘:~..\
DIRECT
allows
in-
These
used. This is necessary to ens~e ~[d~er
operation
of the
,:)
part, A maximum
stretch is,,J@~#}<:,*
~..5+, ;$
\.::.i,,a!j~
~i,t..
~~t}+
ENABLE (E)
.,*,,
~,,
This pin supplies t~d:’~f$@for the MPU and the rest of the
addressing,
VCC ~$#ti$BY
~m}~h
RA~*as
retention
be connected
Direct
the lowest
is containaddressing
256 bytes in the
255. Enhanced
execu-
instructions.
ADDRESSING
addressing,
the address
contained
in the se-
is used as the higher eight bits of
the address of the operand. The third byte of the instruction
is used as the lower eight bits of the address for the operand.
This is an absolute address in memory. These are three-byte
of
instructions.
ONLY)
ADDRESSING
In indexed addressing,
the address contained
in the second byte of the instruction
is added to the index register’s
lowest eight bits in the MPU. The carry is then added to the
higher
order
eight
bits of the index
register.
This
result
is
then used to address memory. The modified
address is held
in a temporary
address register so there is no change to the
index register. These are two-byte
instructions.
to VCC.
MOTOROLA
address
zero through
cond byte of the instruction
supplies the dc voltage to the first 32 bytes of
well as the RAM Enable (RE) control logic. Thus,
of data in this portion of the RAM on a power-up,
pin must
of the operand
of the instruction.
locations
are two-byte
In extended
power-down,
or standby condition
is guaranteed.
Maximum
current drain at VSB maximum
is ISBB, For the MC~02NS
this
i.e.,
INDEXED
(MC6802
the address
byte
the user to directly
EXTENDED
system. This is a,,~~,$:-:~flase,
TTL-compatible
clock. This
clock may be c~~’~~,ofled
by a memory read signal. This is
is capable
A or
instructions.
tion times are achieved by storing data in these locations.
In
most configurations,
it should be a random-access
memory.
tegral numbers
of half periods,
thus ,+J:o%n~ interface
to
slow memories.
Memory Ready timi~’%’%~n
in Figure 15.
MR should be tied high (connect.~d~~ctly
to VCC) if not
‘the MC6800. This output
TTL load and 130 pF.
accumulator
ADDRESSING
In direct
machine,
equivalent
to~.~~~~
driving o:~’*~t~@ard
.:Ji:)./!;}).\,,$(
either
These are one-byte
‘*’$’}*Yuction.
The MPU addresses this location when it fetches
..:J<,K
.,.’-.
~!ip,;.....*+?.\
.!,, the immediate
instruction
for execution.
These are two- or
‘NJ
three-byte
instructions.
d:
.,?
$<.,.
,
,.:), ,i?~:l
‘.’i’~,+,~
controllin~f%~@t-
E wj{:~~%~~~tched
be microseconds.
,~$~~j,rnm~diate addressing,
the operand is contained
in the
$j-,o~ti
byte of the instruction
except LDS and LDX which
$!.ha~ the operand in the second and third bytes of the in-
normal
M R is low,
instruction
With a bus
IMME4:TEADDRESSING
ed in the second
When
the
?:+
ching of E. Use of M R requires synchronization
$~~t~@4xfo
signal, as shown in Figure 14. When MR is hi~$~~?,@]l be in
operation.
addressing,
accumulat@#r~~A3@ pacified.
for more
MC6802NS
by a proof both
ADDRESSING
In accumuld~/~&/y
type TTL or CMOS
would
.,,.,,, $,>..
‘.~,,..,
,,,,,..$:,~:
Pin 38 is to
oscillator will work well as long as the TTL or CMOS output
drives the on-chip oscillator.
LC networks are not recommended
to be used in place of
the crystal.
If an external
thak<~~$ w~sed
mo~&:~*~#tion
can be found in Table 7 alo~$~w
the associated
execution
time that is ~J~$~’’f#$machine
cycles.
ACCUMULATO~k(A~X)
is not
modes
the addressing
type of instruction
and the codin~~i,t,~in
the instruction.
A
summary of the addressing rn~h@~sfoP’a particular instruction
be used in lieu of a 1 MHz crystal for a more cost-effective
system. An example of the crystal circuit layout is shown in
Figure 13. Pin 39 may be driven externally
by a TTL input
signal
with
Semiconductor
@
12
Products
Inc.
~
IMPLIED
byte of the instruction
is added to the program
counter’s
lowest eight bits plus two. The carry or borrow is then added
ADDRESSING
addressing
mode,
address (i. e., stack pointer,
one-byte instructions.
In the implied
index
the instruction
register,
etc.).
gives the
These
to the high eight bits. This allows the user to address data
within a range of – 125 to + 129 bytes of the present instruc-
are
tion.
RELATIVE
These
are two-byte
instructions.
ADDRESSING
In relative
addressing,
the address
contained
ABA
ADC
ADD
AND
ASL
ASR
Add Accumulators
Add with Carry
Add
Lqical And
Arithmetic Shift Left
ArithmetK Shfi Right
BCC
BCS
BEQ
BGE
BGT
BHI
BIT
BLE
BLS
BLT
BMI
BNE
BPL
BRA
BSR
BVC
BVS
Branch if Carry Clear
Branch if Carry Set
Branch if Equal to Zero
Branch if Greater or Equal Zero
Brawh if Greater than Zero
Bra~h if Higher
Bit Test
Bra~h t Less or Equal
Branch if Lower or Same
Branch if Less than Zero
Brawh f Minus
Brawh f Not Equal to Zero
Bramh if Pfus
Bra~h Always
Brawh to Subroutine
Brawh f Ovetilow Clear
Branch if Overflow Set
,*!*
in the second
CLR
CLV
CMP
COM
CPX
Clear Ovetilow
Compare
Complement
Compare Index Register
DAA
DEC
DES
DEX
Decimal Adjust
Decrement
Decrement Stack Pointer
Decrement Itiex Register
EOR
Exclusive OR
INC
INS
INX
$~$~~,}
,$:~EW’
“%&A
,$
Increment
~....;\..:.. STS
Increment Stack Pointer~’ ‘~”::~}STX
Increment Index Re@T&:tt
SUB
JMP
JSR
LDA
LDS
LDX
LSR
.t$...)’j,,,,
.$.
Rotate $#:\$~~
Rotate~~!@t,”+
Retu~?Wfnterrupt
R~w:,&@rn Subroutine
~+
~~lx,
SBA
..*:gubtr’&t Accumulators
SBC,, ~dtitract
with CarV
SE@~*’!I, *&et Car~
ROL
ROR
RTI
RTS
Load St@k P&hter
NEG
NOP
CBA
CLC
CLI
MOTOROLA
Swl
Set Interrupt Mask
Set Overflow
Store Accumulator
Store Stack Register
Store Index Register
Subtract
Software Interrupt
TAB
TAP
TBA
TPA
TST
TSX
Txs
Transfer
Transfer
Transfer
Transfer
Test
Transfer
Transfer
WAI
Wait for Interrupt
Semiconductor
@
13
Accumulators
Accumulators to Condition Code Reg.
Accumulators
Condition Code Reg. to Accumulator
Stack Pointer to Index Register
Idex Register to Stack Pointer
Products Inc.
1
TABLE3–
ACCUMULATOR
AND MEMORY INSTRUCTIONS
-..
ADDRESSING
IMMED
MNEMONIC
OPERATIONS
kdd
Add
Carry
INOEX
1P-=
(All
OP.
A.M.
ADD8
8+M.
A8A
A.E
ADCA
A-
M+C.
AOC8
B+
5
labels
10 Co”tenlsl
B
r
●
:
:
●
M+CB
j
●
A
A
A
●
*
B
●
●
.
.
BITB
a.bl
.
.: !
CLR
00
M
0,
d~. !
CLRA
00
A
F e,
*: *: *
lee, r”dl
Adl”sl,
Jecre(”er,
●
●
●
COMA
.
.
COMB
9
●
.
NEG
.
NEGA
.
.
NEGB
●
*
DAA
.
.
DEC
●
*
OECA
.
.
DEC8
●
*
EORA
.
.
EORB
.*
INC
.
INCA
.
.
INCB
●
*
LOAA
.*
LDAB
.
.
ORAA
.
.
ORAB
.
.
PSHA
.
.
A
t
s,.e OR
,Icre,,,erll
Acmltr
III CI.SIVP
Data
Dala
PSH B
.
.
.
.
PULB
.
ROL
●
.
ROLA
●
●
ROLB
.
.
ROR
.
.
RORA
.
.
RORB
●
●
ASL
.
.
ASLA
●
*
.
.
Rtght
Ar, th(”el,
c
AsLa
jh, ft R,ght,
Sht7R,
Ar, th,net,
ght,
c
ASR
27163
2’
LogIc
7463
A
0-[13’11!1
bl
B 1
2~B753
A
STAB
2F753
B
SU8A
2~B043
A
SUEB
2iFOC3
8M.
SBA
I
ABA
S8CA
2B243
A
2F243
8
L
S6 CB
TAB
TEA
27063
TST
TSTA
TSTB
+
MSP
Note
-n
bO
M
P,l A
!,1
Code
Number
of MPU
N“(nber
of Proqra,n
Arlthmet(c
PI”S
Ar, fhmel(c
M,,,.,,
8oolea(I
AND
cO.te,~lS
.t
- Acc”,n”la!or
+
Boolean
Inclus,ve
~
Bo.learl
Exclus,
m
Cotnple,”e”t
IHexadetl(nall,
Cycles,
memo.f
Bytes,
IoCat,o<l
addressing
mode
oo,. !ed to be Slack
,Ils!r”ct,ons
aft
.
.
.,
●
.,1
●
●
.
.
.
.
.
.
.
●
*
.
.
●
*
B
.
.
B
A
.
.
.
.
A-DO
●
.
B-00
.
.
MCB
!A
00
HIP
i
COOE
SVMBOLS
OR
H
ve OR,
01 M,
Hall
,a,,y
{(”m
b,r 3,
mask
l“l~,<”pl
N
Negal, ”e (s,gn bdtl
BI1 = Zero,
z
Zero
00
Byte
v
overflow,
c
Carry
R
Reset Albvays
s
Set Always
= zero,
Po(r>ter,
addressing
lbyte)
2’s complement
from
TeSI and stl
.
MOTOROLA
●
C A
Tra,, sfe< Into,
IMP LIEO
●
.
.
o
,ncl,, ded t,, the COIL,,I)II for
9
e
E
CONOITION
0Ptr210n
C
P,l
Semiconductor
14
No!
b,t 7
f lrue,
cleared
olherw,
se
Affected
Products
.-
e
A
LEG ENO.
OP
.
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LefI
jh, ft Left,
●
●
2’s
Negate)
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CBA
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Cornplen>erll,
?ota:e
$$, x
CMPB
COM
ActIBltrs
Co,.plernen(,
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;
CMPA
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.
8.M
CLR8
‘“sh
0
A!ti.
Co mpafe
lr,
I
:
A
AM
Clear
Load
4
H
BITA
311 Test
Excl.
:ONO.
AND8
ANDA
4nd
OPERAT!ON
register
refer
=
ADDA
A,mlrrs
4ddw,lh
BOOLEAN/ARITHMETIC
IES
MC
Inc. –
I
I
TABLE 4 – INDEX REGISTER AND STACK MANIPULATION
INSTRUCTIONS
CONO,
II
POINTER
MNEMONIC
OPERATIONS
Compare
Index
lleg
Decrement
Index
Reg
DEX
Stack
Pntr
OES
Increment
Irldex
Reg
INx
Irlcrement
Stack
Pntr
INS
Load Index
Reg
Load Stack
3
8E
3
LoS
Reg
ST X
Store Stack
Pntr
STS
Irldx
Reg
Stack
. lrldx
Prltr
Pntr
TXS
Rea
TSX
I
T
CE
Pntr
Stack
F
LOX
Irldex
Store
=
OP
CPX
Decrement
o IE(
ME
—
3
—
OP
9C
—
4
—
.
Y
lNOEX
EXTNO
—
I
OP-=
OP
—
3
DE
4
2
EE
62
FE
5
3
3
9E
4
2
BE
5
3
5
2
AE
T
EF
62
DF
1 ‘2
FF
6
3
9F
5
2
AF
7
BF
6
3
—
—
2
Ifi
BOOLEAN/Arithmetic
—
—
09
4
34
4
08
4
31
4
35
4
30
—
4
—
OPERATION
H
CO ND.
RELATIVE
—
INOEX
EXTNO
I
N
COOE
T T
—T T
I
H
N —
z
—
—
—
IMPLIEO
—
—
COOE
m
‘LIED
<
y
AC62
—
Z
REG
V
C
REG.
10
If <Zero
20
N@V=l
●
●
●
9
Branchlf
M!nus
2B
N=l
●
●
●
●
Branchlf
Not Equal
Zero
26
2=0
●
●
●
●
If Overflow
Clear
2B
●
●
●
●
Set
●
●
*
●
T
●
*
●
●
●
●
●
*
●
●
●
●
●
●
●
●
●
●
●
●
●
●
#
●
●
●
●
●
●
●
●
●
OPERATIONS
MNEMONIC
OP
—
Branch
Always
20
None
●
●
●
●
Branch
If Carry
Clear
24
C=o
●
●
0
●
Branch
Ii Carry
Set
25
C=l
●
●
●
●
Branch
If = Zero
27
2=1
●
●
●
●
Branch
If >Zero
2C
N@V=O
●
●
●
●
Branch
II > Zero
2E
z+[N@V)=O
●
●
●
●
22
C+z=o
●
●
●
●
2F
Z+(N@V)=l
●
●
●
●
C+z=l
●
●
●
●
Branchlf
Branch
Higher
If <Zero
Branchlf
Branch
Lowr
Or&me
23
J?
Branch
If Ovetilow
29
V=o
V=l
Branch
If Plus
2A
N=o
Branch
To Subroutine
80
Branch
Jump
Jump
To Subroutine
9
No Operalion
From
Interrupt
Return
From
Subroutine
Operations
(Figure 16)
3
01
Return
MftWre
See Special
3
Advances
Prog, Cntr.
Only
—
3B
Wait fOr Interrupt
—
m
MOTOROLA
—
See Special
3E
Semiconductor
15
Operations
(Figure 16)
Products Inc. —
●
*
●
*
●
,
●
O
●
*
●
*
●
*
●
*
●
*
●
*
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●
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●
39
3F
Interrupt
6
Vc
☛
●
● 1*
●
9*
*
●
—
I
FIGURE 16 – SPECIAL OPERATIONS
SPECIAL OPERATIONS
JSR,
JUMP
TO
SUBROUTINE:
Main
,— Pc
Program
Stack
1P
+
---
SP–2
[n+2]
SP-1
[.+21
L
H
Ha”d[”+2]LFormn+2
SP
‘K
= 8-Bit
Unsigned
[.+2]
Value
~
Main Program
~
n
EXTND
[
BSR,
+
“+1
SP- 1
SP
TO
MaIn
80
“+1
*
“+2
RTI,
L
+
Main
SP-- 1
SP
Instr
7- Bit Signed
FROM
Stack
SP-2
K = Offset’
FROM
RETURN
&
Program
= BSR
Next
H
‘K=
RETURN
[.+3]
SUBROUTINE:
n
RTS,
[n+3]H
H
“+3
~
JUMP:
Stack
SP-2
“+2
BRANCH
JMP,
H
,1+2
Value;
H
Formed
[n+2]
H
[n+21
L
From
[n+2]
Hand
[n+2]L
SUBROUTINE:
—.
INTERRUPT:
,.j&
Stack
‘:*
1
I
Condltlon
Code
1
H
Acmllr
Acmltr
I
B
A
Index
Reql$Ier(XH)
Index
Register
pCH
pCL
.+.?>
. .?..’?’:*’,)* TABLE 6 – CONDITION
‘$?.,,
‘,,*,t-*
,,:,,..
**1
,,,.
CODE REGISTER MANIPULATION
INSTRUCTIONS
CO ND.
,t..i.
IMPLIED
OPERATIONS
MNEMONIC
OP
-
=
BOOLEAN
OPERATION
CO OEREG
5
4
3
2
1
0
H
I
N
z
v
c
CLC
Oc
2
1
0 -c
●
●
*
●
●
R
CLI
OE
2
1
0-1
●
R
●
●
●
●
Clear Overflow
CLV
DA
2
1
o-v
●
Set Carry
SEC
00
2
I
1-.
SEI
OF
2
1
1 1
Set Ouerflow
SEV
OB
2
1
1
Acmltr
TAP
06
2
1
A-CCR
TPA
07
2
1
CCR
Clear Carry
Clear Interrupl
&t
Interrupt
Mask
Mask
A+CCR
CCR -+ Acmltr
A
CO NO ITION
CODE
REGISTER
NOTES:
[Bltsel
C
●
●
9
R
●
●
●
●
s
●
s
●
.
●
●
●
●
s
●
● I9
-*V
ftest[st
●
●
—@—
●
o
-,A
rueandc
●
1
(Bit Vl
Test
Result
=lOOOOOOOq
7
(Bit
(B!t Cl
Test
Result
#OOOOOOOO~
8
(Bit V)
Test: 2’scomplement
3
(Bit C)
Test
Decimal
9
(B!t N)
Test:
(Not
cleared
10
(All)
4
(Bit V)
Test:
Operand
=10000
11
(Bit
5
(Bit V)
Test: Operand
=Olllllll
6
(B,t V)
Test: Setequalto
12
(All)
ualueof
most s[gnlficant
If prevlouslv
BCD
Character
greater
than rl!ne~
set )
OOOprior
toexecut(on?
pr!ortoexecut[on?
result of N@ Caftershdt
hasoccurred
MOTOROLA
Test: Sign bat of most significant
16
(MS)
from
bvte = 1?
subtracttonof
MS bvtes~
Code Register
from
Stack.
(See Special
Dperatlonsl
Set when interrupt occurs. If previously set, a Non Maskable
IS required
to ex!t the wait state
Interrupt
Set accordjng
Semiconductor
@
ouerflow
Result less than zero7(Blt15=l)
Load Condlt!on
1)
.1.
learedotherw(se)
2
N)
I*
to the contents
of Accumulator
Producfs Inc.
A.
.-
TABLE
7 –
INSTRUCTION
ADDRESSING
,-.
MODES
AND
ASSOCIATED
EXECUTION
. . .,.
- .,
MachineCycle)
TIMES
( I Imes In
ABA
ADC
ADD
AND
ASL
ASR
BCC
BCS
BEA
BGE
BGT
BHI
BIT
BLE
BLS
BLT
BM I
BNE
BPL
BRA
BSR
BVC
BVS
CBA
CLC
CLI
CLR
CLV
CMP
COM
CPX
DAA
DEC
DES
DEX
EOR
●
xc
X*
x
20
☛
●
2
:
:
2345.
2345,
.67..
..67..
****
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●
●
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2
:*O
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.
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●
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9
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●
●
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*****
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4
4
4
4
4
4
.
4
4
4
4
4
4
4
8
4
4
2*
2.
2,
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Swl
TAB
TAP
TBA
TPA
TST
TSX
TSX
WAI
●
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●
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●
****
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12
2
2
2
2
2..67
●
●
●
****
***O
*9**
:
4
9
NOTE
MOTOROLA
@
Semiconductor
17
Products Inc.
I
SUMMARY
OF CYCLE-BY-CYCLE
OPERATION
-.
Table 8 provides
present
a detailed
on the address
description
of the information
bus, data bus, v@id memory
as the control
program
is executed.
The information
categorized
in groups according
to addressing
modes
address
line (VMA), and the read/write
line (R/W) during each cycle
for each instruction.
This information
is useful in compating
actual with expetted results during debug of both software
and hardware
ADC
ADD
AND
BIT
CMP
EOR
LDA
ORA
SBC
SUB
2
CPX
LDS
LDX
3
number of cycles per instruction.
with the same addressing
mode
ecute
in the same
manner;
(In general, instructions
and number of cycles ex-
exceptions
are indicateq,
in the
“o;~k,.,
*;.f,~./t.,}\:R.~<
,,,,>
<r,
/,:.,:
,,..... J.,
.J’k.
:<+,,\i.?:.<~
table. )
1
1
Op Code Address
1
2
1
Op Code Address + 1
1
Op Code Address
is
and
:3,,
‘ ‘::
Op cd%>
~. ,
, t/+\.\t\e,\
~~~q~~~ta
,... ..,}
..~}:,,. ,~\
. .<,.,
~~
.:.hi
‘*::?i:>,
~ $“‘
.
$: s*@,.,
1
$%, P Code
1
1
2
1
Op Code Address + 1
3
1
Op Code Address + 2
1
1
1
1
1
1
1
Op Code
1
1
1
1
1
1
Op Code
,$”%
‘Operand
‘:~..!$<t
\ +).
.~,/t’,&
1,
Operand
,.i.,..:~~
.\,,>\,.
Data (High Order BVte)
Data (Low Order Bvte)
DIRECT
ADC
ADD
AND
BIT
CMP
EOR
LDA
ORA
SBC
SUB
2
3
3
CPX
LDS
LDX
4
1
1
STA
I
Address of Operand
Operand
Data
Address of Operand
Operand
Data (High Order
BVte}
Operand
Data (Low Order
Byte)
.-
Op Code
Destination
4
Irrelevant
Address
Data (Note
1)
Data from Accumulator
STS
STX
Op Code
1,
‘+%$YP
Op Code
+
I
5
,.<,:
.x
:.?.
Address+
1
?O
Address of Operand
1
Address of Operand
1
Address of Operand
Address of Operand
0
0
Register Data (High Order BVte)
Irrelevant
Data (Note
1)
Register Data (Low Order Byte)
:,:.;
INDEXED
JMP
5
1
1
Op Code Address
2
1
Op Code Address + 1
3
0
Index
Register
4
0
Index
Register Plus Offset
1
1
Op Code Address
2
1
Op Code Address + 1
3
0
0
Index
Register
Index
Register Plus Offset
Index Register Plus Offset
4
3
1
1
1
0
Index
Register
4
0
Index
Register Plus Offset
5
1
1
Index Register Plus Offset
5
CPX
LDS
LDX
1
2
6
6
(w/o Carry)
(w/o Carry)
Op Code Address
Op Code Address + 1
(w/o CarrV)
Index Register Plus Offset + 1
MOTOROLA
Semiconductor
18
-————
+ 1
1
1
1
1
Offset
1
Irrelevant
Data (Note
1)
1
1
1
1
Irrelevant
Data (Note
1)
Op Code
Op Code
Offset
Irrelevant
Data (Note
1)
1
Irrelevant
Data (Note
1)
1
1
1
1
Operand
Irrelevant
Data (Note
1)
1
Irrelevant
Data (Note
1)
1
1
Operand
Data (High Order BVte)
Ooerand
Data (Low Order
Data
Op Code
Offset
Products Inc.
Bvte)
-.
PACKAGE DIMENSIONS
L SUFFIX
CERAMIC
PACKAGE
CASE
71W5
NOTES
1. POSITIONAL
TOLERANCE
OF LEAOS (0),
SHALL BE WITHIN 0.25 mm (0.010) AT
MAXIMUM
MATERIAL
CO NO ITION, IN
RELATION TO SEATING PLANE ANO
EACH OTHER.
2. DIMENSION
LTOCENTEROFLEAOS
WHEN FORMEO PARALLEL.
3. OIMENSION
B DOES NOT INCLUOE
MOLD FLASH.
,-
Motorola
out of the
reserves
the right
application
to make
changes
or use of anv product
to any products
or circuit
herein
described
to improve
herein;
neither
reliability,
does
Semiconductor
3501
ED BLUESTEIN
BLVD.,
function
it convevanv
or design,
license
Motorola
under
does
its patent
not assume
rights
any Iiabilitvarising
nor the
rights
of others.
Products Inc.
AUSTIN,
TEXAS
78721
●
A SUBSIDIARY
OF MOTOROLA
INC.
“S-981,-*,
—
TABLE
Address Mode
and Instructions
INDEXED
..
Cycle
#
Cycles
OPERATIONS
VMA
Line
SUMMARY
(CONTINUED)
R/~
Line
Address Bus
Data Bus
(Continued)
1
1
Op Code Address
1
OP Code
2
Op Code Address + 1
1
Offset
3
0
Index Register
1
Irrelevant
Data (Note
1)
4
0
0
Index Register Plus Offset
1
Irrelevant
Data (Note
1)
Index Register Plus Offset
1
Irrelevant
Data (Note
1)
1
STA
6
5
Index Register Plus Offset
0
Op Code Address
1
2
Op Code Address + 1
3
0
Index Register
4
0
Index Register Plus Offset
1
1
1
5
1
Index
6
0
Index Register Plus Offset
1
Index
0
1
LSR
NEG
ROL
ROR
TST
7
(w/o Carry}
1
1
1
6
ASL
ASR
CLR
COM
DEC
INC
8 –
7
110
(w/o Carry)
Register Plus Offset
1
Register Plus Offset
Note
3)
STS
STX
7
JS R
1
1
Op Code Address
2
1
Op Code Address + 1
3
0
Index
4
0
Index Register Plus Offset
5
Index Register Plus Offset
6
0
1
7
1
1
1
1
2
3
4
8
5
—.
6
7
8
Register
(w/o Carry)
. ..!
,,$
,<$>:$,,+
Index Register Plus Offset
...<
..\,!”~:
‘ .?,.
~~’:.
.{,?
Index Register Pl@ Offset + 1
.<~$.,
.!,:
~a?
Op Code Address
~&$>t~rx,,
Irrelevant
Data (Note
1)
Irrelevant
Data (Note
1)
Operand
Data (High Order BVte)
Operand
Data (Low Order Byte)
Op Code
Offset
0
1
1
Irrelevant
0
0
0
Irrelevant
Data (Note
1)
Irrelevant
Data (Note
1)
Irrelevant
Data (Note
1)
Data (Note
11
Return
Address
(Low Order
Byte)
Return
Address
(High Order
Byte]
1
EXTENDED
1
JMP
ADC
ADD
AND
BIT
CMP
EOR
LDA
ORA
SOC
SUB
1
5
ASL
ASR
CLR
COM
DEC
INC
LSR
NEG
ROL
ROR
TST
6
m
I
Op Code
1
JumD Address (Low Order Bvte)
Jump Address (High Order Byte)
Op Code Address
1
Op Code
Op Code Address + 1
1
1
1
1
Address of Operand
(High Order
Address of Operand
(Low Order Byte}
Op Code Address + 2
Byte)
1
Address of Operand
1
1
1
1
1
Op Code Address
Op Code Address + 1
1
Address of Operand
(High Order BVte)
Op Code Address + 2
1
1
1
1
1
1
1
0
Address of Operand
( Low Order Byte)
Address of Operand
Address of ODerand
+ 1
Operand
Data
Op Code
Operand
Data (High Order
Ouerand
Data (Low Order Bvte)
Byte)
1
1
Op Code Address
2
1
Op Code Address + 1
3
1
Op Code Address + 2
4
0
1
Operand
Destination
Address
5
Operand
Destination
Address
1
1
Op Code Address
2
Op Code Address + 1
1
Address of Operand
(High Order BVte)
3
1
1
Op Code Address + 2
Address of Operand
( Low Order BVte)
4
1
Address of Operand
Current
5
0
110
Address of Operand
1
1
1
Address of Operand
0
New Operand
6
f
1
1
T
Op Code
Destination
Address (High Order Byte)
Destination
Address (Low Order Byte)
Irrelevant
Data (Note
Op Code
Irrelevant
Operand
Semiconductor
19
Data
Data (Note
1)
Data (Note 3)
(Not
3)
MOrOROLA
1)
Data from Accumulator
Products Inc.
TABLE 8 – OPERATIONS
Address Mode
and I rsstructions
EXTENDED
Cycles
Cycle
#
SUMMARY
(CONTINUED)
Rm
VMA
Line
Address Bus
Line
I
I
Data Bus
(Continued)
1
1
1
Op Code Address
Op Code
Op Code Address + 1
Address of Operand
(High Order 8yte)
Op Code Address + 2
Address of Operand
4
0
Address of Operand
Irrelevant
(Low Order ~$~:)
.,’i.\’\t.
:,!,:.?
..,,4,.:,
...,,.~
1)
.:;::<, .~)
i:,,
5
1
1
Address of Operand
1
STS
STX
2
3
6
6
JS R
Operand
Data (High Order $,Y#&
+ 1
Operand
Data ( LOW ~q,$~;<~~
OP Code Address+
1
Op Code Address+
2
Subroutine
Address
Op Cod:~{
7
1
1
1
1
1
0
8
0
Op Code Address + 2
;#wevant
9
—1
Op Code Address + 2
‘~ddress of Subroutine
1
T
2
3
4
5
6
T
Op Code
Op Code Address
Starting
N>~?nstruction
Stack Pointer
– 1
Return’’#&ess
...$
. !?!?,y\,,’’?*a
RS~~n”’~Wdress
Stack Pointer
– 2
$~~~yd%t
Data
Stack Pointer
( Low Order BVte)
(High Order
(Note
1)
Data (Note
1)
Byte)
(Low Order Byte)
INHERENT
ABA
ASL
ASR
CBA
CLC
CL I
CLR
CLV
COM
DAA
DEC
iNC
LSR
NEG
NOP
ROL
ROR
SBA
SEC
SE I
SEV
TAB
T-AP
TBA
TPA
TST
2
2
I
Op Code
1
OP Code of Next
1
1
0
0
Op Code
Op Code of Next
4
2
Data (Note
1)
Irrelevant
Data (Note
1)
OP Code of Next
., ,‘s
3
~~~a-ck Pointer
4
Stack
Pointer
– 1
Data
Accumulator
Data
Op Code Address
Op Code Address + 1
Op Code of Next
Stack Pointer
Irrelevant
Stack Pointer
Operand
+ 1
Instruction
Accumulator
Op Code
Instruction
Data (Note
1)
Data from Stack
Op Code
Op Code Address + 1
1
1
1
1
1
1
Index
1
Irrelevant
Data
New Stack Pointer
1
Irrelevant
Data
Op Code Address
Op Code
Address of Next Instruction
Order BVte)
(High
Address of Next
Order Byte)
(Low
Op Code Address
Op Code Address + 1
Stack Pointer
New Index Register
Op Code Address
Register
3
Stack Pointer
4
Stack Pointer
+ 1
1
1
1
1
5
Stack Pointer
+ 2
1
Op Code Address + 1
5
Instruction
Irrelevant
Op Code
1
PSH
MOTOROLA
Semiconductor
@
20
——
Instruction
I
T
+
.“.,.,.$!...>,,..
~,i \,i+
~:a
,+,y .
Address of Subr@$~’e$~figh
Order BVte)
.J.. isl~:
,,,.,.
Address of ~$r&@jl*e
(Low Order BVte)
1
9
Address of Operand
Data (Note
Op Code of Next
Instruction
Irrelevant
Data (Note
1)
Irrelevant
Data (Note
1)
Op Code
Op Code of Next
Instruction
Irrelevant
Data (Note 2)
Irrelevant
Data (Note
1)
Instruction
Products Inc.
I
TABLE
I
Address Mode
and Instructions
INHERENT
Cycles
Cycle
#
8 –
OPERATIONS
VMA
Line
SUMMARY
(CONCLUDED)
R/~
Line
Address Bus
Data Bus
I
.——
. ....—.—.,
(Continued)
WA I
9
RTI
10
Swl
1
Op Code
1
Op Code of Next
o
Return
– 1
0
Return
– 2
0
Index
Register
(Low Order BVte)
Stack Pointer
– 3
0
Index Register
(High Order BVte)
1
Stack Pointer
– 4
0
Contents
of Accumulator
8
1
Stack Pointer
– 5
0
Contents
of Accumulator
9
1
Stack Pointer
– 6
1
1
1
Op Code Address
2
1
OP Code Address+
3
1
Stack Pointer
4
1
Stack Pointer
5
1
Stack Pointer
6
1
7
Address (High Order Byte)
B $, ~<’!+;‘
<\.., \,v*.t~
of Cond. Codqz@e~~Ste~
*,.?,.,?;
~ ~:
‘: ~~!,
Op Code
,.:. ~~s\
1
1
OP Code Address
1
Op Code Address + 1
1
Irrelevant
1
1rrelevant
3
0
Stack Pointer
1
Stack Pointer
t 1
1
5
1
Stack Pointer
+ 2
1
6
1
Stack Pointer
+ 3
1
7
1
Stack Pointer
+ 4
8
1
Stack Pointer
+ 5
9
1
10
1
–‘$
1-
$$,,,
es:<.\.*:<2~,
,<,.t,.-+<:, ~
A
Contents
1
4
Instruction
Address (Low Order Byte)
2
Data ( N~~~;#,)$,~”+v
Da~~~fl&~&$’~
:s’..>~**
Contents of. Con~$~ode
Register
Stack
.~+;i~<
‘\,; Q-}~.
Cont@fi&t~ Accumulator
B from
\ ,,,~:$,
G~$~@’ts,of Accumulator
A from
a:<~
;~~~-%egister
from Stack (High
‘$t~f~~
from
Stack
Stack
Order
1
1
2
1
3
1
4
1
f$k~,,,
Index Register from Stack (Low Order
‘~~’”” ‘BVte)
,,,:..,.,$.
~,.- ‘t. ~k?\
3. 1
Next Instruction Address from Stack
Stack Pointer + 6
~,,.:,.
‘*:\L
>,,,.* ,/.>?
(High Order Byte)
.~’
JJ
‘“
~.i,..
,,*
1
Next
Instruction Address from Stack
Stack Pointer + 7
,..:. ,,;.J.
.,.$,.,
,N:>t,>
“
(Low Order Evte)
.i.~,:lx
..:.Y.:<:
,,.\
..~
Op Code
1
Op Code Address
$\, ~“aiy.
1
Irrelevant Data (Note 1 )
Op Code Address + 1% ;,% ,Jj
,,$,,%L,*,,.+
.?$T\,,:*G$:,
o Return Address (Low Order BVte)
Stack Pointer
V,,t
o Return Address (High Order BVte)
Stack Pointer – 1 “~$
1
Stack Poi,~~r
5
Stack PQfri~$,–
*.,,,
1
Sta~*~$er
—
‘:J.
1
$$a:@ @nter
–
, .$ :%t~h:$ointer
_
.$.~,.. .\, t:,!+,,
~
,:%;w~:;,.@tack Pointer –
6
12
1
7
8
9
lQ
o
0
0
3
1
4
0
0
5
6
7
Index Register
(Low Order Byte)
Index Register
(High Order
Contents
BVte)
of Accumulator
A
Contents
of Accumulator
B
Contents
of Cond. Code Ragister
1
Irrelevant
1 1’*:+* *$$ ‘Vector
.>.<+Y,..:
~{.~$?,,
Address FFFA
(Hex)
1
Address of Subroutine
BVte)
(High Order
Vector
Address FFFB
(Hex)
1
Address of Subroutine
BVte)
(Low Order
~ ,2,*G,:
\ >~y
~$,,1>
,,‘.-.,.
h,+
RELATIVE
,~,. s?,
..$,+,., .,,
,,.:,,>
~~,.Fy
BCC
BHI
BN E
,..,!~~ \$,:.
BCS
BLE
BPL
~,+.~:
~ !>
-., ,t,~ 4
BEQ
BLS
BRA
,?\ $.$*
....$
BGE
BLT
BVC
‘.$?,‘$:,
>.,.:.~
BGT
BM I
BV~$~J~~k,
.’.’,.. ‘,
\’\.,,
.? +i?.
BSR
,.‘“:?,*{.
“:i,$* .
\iy?:)~:~$i,
,~!’ ,<,..?.
w+., ,$;
.:3~.d,\,.\
I
..,,!,
~$x’+.
.,*\ ,*
~<..
~<::<:.,4i..\:t.r:,
8
$.+ye\\
.>,3.
, .’.1<$.,
\,j ;:;>+>~
‘.>$
,$
r;
‘
1
Data (Note
1)
1
1
Op Code Address
1
Op Code
2
1
OP Code Address + 1
1
Branch Offset
3
0
Op Code Address + 2
1
Irrelevant
Data (Note
1)
4
0
Branch Address
1
Irrelevant
Data (Note
1)
1
1
Op Code Address
1
Op Code
2
1
Op Code Address + 1
1
Branch Offset
3
0
Return
1
Irrelevant
4
1
Stack Pointer
Return
Address (Low Order BVte)
Return
Address (High Order BVte)
Address of Main Program
Data (Nota
1)
5
1
Stack Pointer
– 1
o
0
6
Stack Pointer
– 2
1
Irrelevant
Data (Note
7
0
0
1
Irrelevant
Data (Note
1)
8
0
Subroutine
1
Irrelevant
Data (Note
1)
Return
Address of Main Program
Address
(Note 4)
1)
NOTES:
1. If device
Depending
which
IS addressed
during
on bus capacitance,
2. Data is Ignored by the MPU.
3. For TST, VMA= O and Operand
4. MS BVte of Address
this cycle
uses VMA,
then the Data
data from the previous cvcle may be retained
Bus will go to the high-impedance
three-state
condition
on the Data Bus.
data does not change.
Bus= MS Byte of Address
of BSR instruction
MOTOROLA
and LS Byte of Address
Semiconductor
@
21
Bus= LS Byte of Sub-Routine
Products Inc.
Address.