integrated technology corporation

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Providing Leading Edge Technology to Meet Your Future Requirements Today
PROBE CARD METROLOGY
HIGH TEMPERATURE TESTING
OF PROBE CARDS
Rod Schwartz
Dan Kosecki
VP & Technical Director
VP Software Development
Integrated Technology Corporation
Integrated Technology Corporation
4/9/2002
Copyright April 2002 - ITC
www.inttechcorp.com
INTEGRATED TECHNOLOGY CORPORATION
Purpose
• To show the effects of temperature
on probe card parameters
• To prove the usefulness of high
temperature probe card metrology
• To highlight some differences in
probe card technology &
construction
4/9/2002
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Equipment & Samples
• Probilt PB3500 Probe Card Analyzer with Hot
Chuck Option
• Epoxy Ring Cards
– 3 Identical Cards
– J971 Type
– Designed for High Temperature
• Form Factor Card
– Logic Array
• Membrane Card
– Logic Array
4/9/2002
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Hot Chuck Block Diagram
HPCDA
Supply
Air Filter
&
Heater
Heated Air Control
Heated Air Flow
Computer
Interface
Hot Chuck
System
Controller
Probe Card
Hot Chuck
4/9/2002
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Hot Chuck System Controller
4/9/2002
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Heated Measurement Chuck
4/9/2002
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Heated Air “Top-Hat”
4/9/2002
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Bottom of “Top-Hat”
4/9/2002
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“Top-Hat” & Adapter
4/9/2002
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Hot Chuck Specifications
Control
Point
Minimum Maximum Control
Stability
Temp.
Temp.
Heated
Chuck
Room
125 C
+/- 1.0 C
Heated
Air
Stream
Room
125 C
+/- 1.0 C
4/9/2002
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Metrology Environment
Heated Air Flow
Pogo Pins
Retainer
Pogo Pins
Heated Chuck
Planarity
Adjustors
Heater Strips
&
Thermal Barrier
Camera & Optics
X,Y,Z Stage
4/9/2002
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Subchuck
Probe Card Construction
PCB Aperture
PCB
R ing
Ring Aperture
E p o xy
Probe Tip Depth
Probe
PC
Bo tto
Surfa
Probe Details
R ing
H ighest
Probe
P lanarity
Probe W ire
Diam eter
E p o xy
Lowest
Probe
Tip
Length
E p o xy
Clearance
Tip Diam eter
Tip Shape
F lat
E-tip (Radiused)
Figure 3: PCB and Epoxy Ring Assembly
4/9/2002
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Probe Ring
4/9/2002
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Large Ceramic Probe Ring
4/9/2002
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Large Array on Probe Card
4/9/2002
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Cross Section View
CHUCK
TEMP.
25 C
25 C
120 C
80 C
10 mils
60 C
1000 mils
1004 mils
4/9/2002
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Pitch Change with Temp
CHUCK
TEMP
25 C
120 C
70 u
80 u
4/9/2002
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Alignment Shifts (3 Cards)
•
•
•
•
•
•
•
Averages of 6 groups of 5 probes
3 groups each side, evenly spaced
Boxes represent +/- 5 microns movement
Lines represent direction and magnitude
of movement (25 °C to 125 °C)
The “+” is 25 °C location
#11-Red, #12-Blue, #14-Green
Repeatability of multiple runs affected by
stabilization time
4/9/2002
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Epoxy Ring Probe Card
4/9/2002
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Epoxy Card Array
X,Y Pad Coordinates
6000
4000
Y (m icrons)
2000
0
-6000
-4000
-2000
0
2000
4000
6000
-2000
-4000
-6000
X (m icrons)
4/9/2002
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Alignment Shift (Epoxy Card)
*Box = +/- 10u
*The + in center of box is 25
°C location
*Each line is 5 probe average
*Card 11 – Red
*Card 12 – Blue
*Card 13 – Green
*Length of line represents
the shift in position from
25 °C to 125 °C.
4/9/2002
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Other Shifts (Epoxy Card)
Parameter
Card 11
Card 12
Card 14
Z Shift
-221 u
-147 u
-148 u
Planar
Window
Leakage
Increase
55u (25)
50u (125)
6-10 uA
58u (25)
54u (125)
6-9 uA
30u (25)
33u (125)
6-10 uA
4/9/2002
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Memory Card
Probes at 25, 36, 70 & 90 °C
Probes Movement with Temperature
Yoffset (microns)
15
10
Series1
5
Series2
0
-10
-5
0
10
20
30
Series3
-10
Xoffset (microns)
4/9/2002
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Form Factor Micro Spring
MLC Connections
Space Transformer
Micro-Spring
Truncated Pyramid
Probe Tip
Contact Paddle
4/9/2002
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Form Factor Probe Card
4/9/2002
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Form Factor Array
X,Y Pad Coordinates
6000
4000
Y (microns)
2000
0
-8000
-6000
-4000
-2000
0
2000
4000
6000
8000
-2000
-4000
-6000
X (microns)
4/9/2002
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Alignment Shifts (FFI)
*Box = +/- 10u
°C location
*Each line is a single probe
*Length of line represents
the shift in position from 25
°C to 125 °C.
4/9/2002
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Other Shifts (FFI)
Parameter
FFI Card Value
Z Shift
-160 microns
Planar Window
36 microns (25°C)
48 microns (125 °C)
0.4 to 0.6 uA
Leakage Increase
4/9/2002
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Form Factor Results
•
•
•
•
Fairly predictable results
Larger shift than epoxy ring
Not as consistent as expected
Data on only one card should not be
taken as representative of type
4/9/2002
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Membrane Probe Head
Window (opt)
Probe
Frame
Springs
PCB
Membrane
Plunger
Bumps
4/9/2002
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Membrane Array
X,Y Pad Coordinates
15000
10000
Y (microns)
5000
0
-15000
-10000
-5000
0
5000
10000
15000
-5000
-10000
-15000
X (microns)
4/9/2002
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Alignment Shifts (Membrane)
*Box = +/- 10u
°C location
*Each line is a single probe
*Length of line represents the
shift in position from 25 °C to
100 °C.
4/9/2002
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Other Shifts (Membrane)
Parameter
FFI Card Value
Z Shift
-145 microns
Planar Window
72 microns (25°C)
71 microns (100 °C)
Not Run
Leakage Increase
4/9/2002
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Membrane Results
• Mylar expands and probes move a
lot
• Very well behaved – predictable
results
• More temperature sensitive than
other technologies
• Requires card to be designed for
temperature of use
4/9/2002
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Cobra Probe Card
4/9/2002
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Cobra Head Cross Section
Metalization
Space
Transformer
Upper
Die
Mylar
Lower
Die
"Cobra"
Probe Needle
4/9/2002
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Cobra Considerations
• Lower die is close to wafer
– Heats up considerably
– Test time vs. Index Time changes
heating
• Mylar insulator may move
• Probe stresses
4/9/2002
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Conclusions
• Probe movement for most technologies
with temperature is NOT predictable, but
it IS repeatable
• Epoxy card construction techniques can
make a significant difference in
temperature performance
• FFI cards are more predictable than
epoxy, but there are still variations
4/9/2002
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Conclusions (2)
• Membrane card is the most
predictable
• Membrane card has largest shifts
with temperature
4/9/2002
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Future Studies
•
•
•
•
•
Other Probe Card Technologies
Scrub Mark vs. Analyzer Data
Probe Material Variations
Card Construction Techniques
Path of Probe Movement vs. Temperature
Change
• Stabilization Times vs. Repeatability
4/9/2002
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Acknowledgements
• Bill Williams – Motorola
– Thanks for supplying cards for this
study.
• Russ Allred - ITC
– Data Collection
• Hoa Do Thai - ITC
– Data Collection
4/9/2002
www.inttechcorp.com

integrated technology corporation

Transcription

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