Embedded Highlights

Transcription

Embedded Highlights

Committed to excellence
Embedded Highlights
V3.1
Combine Technologies
Realize EMBEDDED Designs
The perfect symbiosis for wireless internet connectivity, powerful
mainboards, professional displays and innovative storage solutions.
Content
Breaking News: Intel® – Rutronik's new Franchise Partner
Breaking News: M2.COM – A new open standard is born
3
6
7
Boards & Systems . . . . . . . . . . . . . . . . . . . . . . 8
Boards
08 – 15
Embedded Systems
16 – 17
Power Supplies
Power Supplies
Electric Double Layer Caps
18
18 – 22
24 – 27
Sensors
74 – 93
Electromechanical Components
Connectors
Relays
Fuses, Switches, Main Filter
Fans, Heatsinks
Batteries, Battery Holders
118 – 125
120 – 122
122
123
124
125
Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . 28-55
Flash Products
Memory Modules
Hard Disc Drives
Optical Drives
Consult – Know-how. Built-in.
The technical competence from Rutronik
Worldwide and individual consulting on the spot: by competent
sales staff, application engineers and product specialists.
Components – Variety. Built-in.
The product portfolio from Rutronik
Wide product range of semiconductors, passive and
electromechanical components, storage, displays & boards and
wireless technologies for optimum coverage of your needs.
Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Logistics – Reliability. Built-in.
TFT Displays
Passive LCD
Monitors
The delivery service from Rutronik
58 – 67
68 – 71
72 – 73
Wireless . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
GSM
GNSS
WIFI
Bluetooth
ANT
RFID
Antennas
Special Wireless Technologies
2 | Boards & Systems | Storage | Displays | Wireless
96 – 103
104
105 – 107
108 – 109
110
112 – 113
114 – 116
117
Innovative and flexible solutions: from supply chain management
to individual logistics systems.
Quality – Security. Built-in.
Quality management without compromise
The integrated management system (IMS) encompasses
quality control, environmental protection and occupational
health and safety.
Combine Technologies – Realize EMBEDDED Designs
RUTRONIK EMBEDDED – the most reliable option for future-orientated purchase of embedded components from one hand.
We are well-known as distributor of embedded boards & systems, power supplies, storage components, TFT displays, passive
LCD´s, professional monitors, as well as wireless connectivity solutions, sensors and all needed electromechanical components
to build up an intelligent embedded system for the emerging IoT market.
Boards & Systems
_______________________________________________________
Storage
____________________________________________________
■ Embedded Boards & Systems
Whether industrial mainboards, single board computers,
computer-on-modules or complete embedded systems, like
panel PCs, box PCs, 19” rack systems, or industrial monitors for
harsh environments, with our selected partners we cover almost
any customers requirement.
■ Power Supplies
One of the most critical part in any embedded system is the
power supply, so that a reliable partner is needed, to build up
a reliable system. RUTRONIK EMBEDDED is taking care of
this issue with its partners. So we can provide solutions with
medical approvals as well as standard industrial power supplies
in the well-known standards and as open frame solutions.
More and more systems in the IoT market need to resist against
power grid failures with an uninterruptable power supply.
This can be realized by a classic battery driven UPS or by Super
Caps. Our specialists can guide you through your system design,
starting with the power supply and ending with the intelligent
platform above.
■ Sensors
Embedded applications often collect environmental data or have
to provide an HMI. The sensor portfolio includes magnetic, optical and MEMS sensors, e.g. from market and innovation leaders
Bosch Sensortec and STMicroelectronics. So called application
specific sensor nodes (ASSNs) running fusion software combine different sensor types in a single package with up to nine
degrees of freedom (DoF). Integrated proximity and ambient
light sensors in combination with infrared LEDs provide touchless gesture control functionality. With this portfolio and our
sensor expertise, we are offering the optimum solution for your
application.
■ Electromechanical Components
The whole world of IoT can’t work without connectors and hard
wiring, so at the end, RUTRONIK EMBEDDED is also taking
care of your wired connectivity. Even inside an embedded system
or DIN-rail mounted, we can provide you the needed solutions
in combination with all the other components.
Flash memories become more and more important in industrial applications, even as a simple 2.5” SSD or as a flash
card in different form factors. Also HDDs, RAM and ODDs
for industrial and rough applications with high reliability
in industrial grade quality and with a reasonable longevity,
are still needed. With our partners we can provide all of the
demanded solutions in a good balance between reliability and
price.
Boards & Systems | Storage | Displays | Wireless
Displays & Monitors
____________________________________________________
With our portfolio of active TFT solutions, passive LCDs and
professional monitors, we can fulfill almost every demand for
the visible front-end of an embedded system. Standards are
also available, as well as full customized solutions. Especially
with passive LCDs we still can offer different technologies to
take care of the uncountable new and smart entry level designs
for the IoT market. The latest touch technologies, as well as the
best picture quality, RUTRONIK EMBEDDED is offering a
huge portfolio for your embedded system design.
Wireless
____________________________________________________
Make your application embedded by connecting it wirelessly
to the Internet of Things. RUTRONIK EMBEDDED has the
newest solutions for using a smartphone, WiFi access point or
a mobile communication network as gateway for your device.
Our understanding of the right wireless solution covers hardware, drivers or transmission protocol, application profiles,
security aspects, certifications, long-term considerations as
well as political aspects regarding standards, compatiblity and
consortia.
www.rutronik.com/EMBEDDED | 3
Boards & Systems
Storage
Displays
Wireless
Individual System Solutions
The performance of embedded systems is growing disproportionately; one of the reasons for this is the improvement of intelligent
sensors and actuators. There are more and more autonomous systems which record and process data, responding very specifically
to it. When the systems are networked together wirelessly or wired via IP protocol this creates the Internet of Things. Machines,
systems, appliances and small smart everyday objects will become part of the so-called Cyber Physical Systems (CPS) in the future.
All systems are characterised by certain common characteristics: Programming capability, storage capacity, functional
user interfaces and communication links. Embedded systems
require integrated vision when selecting the components
because there are complex dependencies between the real
physical and the virtual digital world.
■
Boards & Systems
based on ever faster, more powerful, smaller and energysaving components. Suitable and standardised power supplies,
sensors and electromechanical components which guarantee
functional reliability even under extreme operating conditions
■
RUTRONIK EMBEDDED complies stringently with this integrated
analysis, enabling it to develop always the right solution.
Storage
solutions in compact sizes with any number of read/write
cycles with the highest storage density
■
Displays
and touch systems, which provide the user a perfect visualisation and operation of the real world and facilitate intuitive
operation and the interaction of extremely complex systems
HMI
■
Human Machine
Interface
Wireless
technologies facilitate the global linking of processes and
databases in all conventional transmission standards and in
a matter of seconds
DISPLAYS
EMBEDDED HARDWARE
· Power
· Processor
· Flash DRAM SRAM
· External device
EMBEDDED
SOFTWARE
interface controller
WIRELESS
CONNECTIVITY
Cyber Physical Systems (CPS) comprise the networking of
embedded systems via wired or wireless communications networks
www.rutronik.com/EMBEDDED
Boards & Systems
Storage
The Result:
more capabilities
Displays
Wireless
Breaking News
Intel® – Rutronik's new Franchise Partner
With beginning of 2016, Rutronik becomes authorised distributor for Intel®. The broad range of products that Intel® offers to the
embedded market, completes our portfolio in different product ranges. To give a first overview, you can find below some interesting
new products, that fills the gap. If integrated end-to-end IoT solutions from MCU frontend level to the cloud servers with an
outstanding integrated security chain, trend-setting flash technologies implemented in the latest Intel® SSD-drives, the well known
NUC boxes and boards or high-performance processors for top level computing solutions, Intel® stands for quality, reliability and
game-changing technology.
Below we wants to give just a short overview over the possibilities, more to come in the next RUTRONIK EMBEDDED catalogue.
Don't hesitate to get in touch with your RUTRONIK contact for Intel® products.
Boards & Systems
Storage
Wireless
M2.COM – A new open standard is born…
The IoT era brings new opportunities to traditional industries and drives business evolution to create next-generation products and
services. For massive deployment of fundamental IoT devices such as sensors and sensor nodes, it’s essential to rework network
infrastructures to enable wireless connectivity as well as devices with processing capabilities, allowing for remote management and
monitoring. Of course this will take time and effort. To enable a diversity of IoT applications, an open standard for sensors and
sensor nodes is needed; it’s important and beneficial to IoT development when sensor makers and module makers work together to
standardize the platforms and technologies.
M2.COM is a brand new platform form factor for sensors. It adopts the standardized, frequently used M.2 form factor and is defined
as an evolutionary module that combines general wireless connectivity with additional built-in computing ability powered by MCU.
Open Standard
dard
sor Platfom
for IoT Sensor
Linecard Boards & Systems
RUTRONIK EMBEDDED offers a huge portfolio of mainboards, specially designed for industrial and semi industrial applications.
The selection ranges from industrial mainboards, single board computers, computer-on-modules (COM), PC/104, blade computers,
PICMG and backplanes, IPC and servers to box and panel PCs and HMI. These include ARM-based solutions as well as boards
with the latest x86 processors.
Linecard
Boards & Systems
x
x
x
Slot
S
l Single Board Computers (PICMG / PCI / ISA)
x
x
Backplanes (PICMG / PCI / ISA)
B
x
x
Blade Computing Platforms (CompactPCI / TCA / VME)
B
x
Embedded Server
x
Embedded Box-PC's (x86 / ARM)
x
x
Embedded Panel PC's / Touch Panel PC's (x86 / ARM)
x
x
Desktop PC's
x
x
x
x
x
VIA
x
x
Seco
x
Single
S
i
Board Computer (2.5" / 3.5" / 5.25" / NUC)
Intel
BaseB
a / Evaluationboards (COMe / Q7 /SMARC / ARM)
FSP
x
Fujitsu
x
F&S
x
x
ES&S
x
Computer
C
om
on Modules (COMe / Q7 / SMARC / ARM)
EKL
Industrial Mainboards (mITX / mATX / ATX)
eCount
DFI
Technologies
Advantech
Types
Mainboards / Embedded Boards
x
x
x
x
x
x
x
x
x
x
x
x
Embedded Systems
Network Switches
x
Mobile PC's / Industrial Tablet PC's
x
Industrial Monitors / Industrial Touch Monitors
x
x
x
x
x
x
x
x
x
x
x
Industrial Printers
Industrial Chassis
x
x
x
Accessories
Digital LVDS Controller (Scaler)
x
Controller Cards (Digital / Analog / Mixed Signal)
x
Graphic Cards
x
Network Cards
x
Coolers & Heatspreaders
x
x
Cables & Adapters
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Power Supplies
Industrial PC (IPC)
x
Redundant Power Supplies
x
AC/DC Adapter
x
DC/DC Converters
x
Uninterruptable Power Supplies (UPS)
x
P
Processors
Mobile
x
Desktop
x
Server
x
Linecard
Embedded Boards and
Systems in general
RUTRONIK EMBEDDED is a reliable partner for embedded
boards and systems for more than 10 years and we are well
experienced in the demands of the embedded market and in
the industrial automation market. We are working strongly
together with our approved partners for embedded boards,
COM modules, box PC’s and all other embedded parts. Our
focus and major experience is on industrial motherboards,
SBC’s, embedded boards with RISC technology and computer
on modules. In addition to these major product sectors we are
also providing complete kit solutions, comprising TFT, board,
storage components and cables, so our customers are able to
get the complete parts for an embedded system from one hand.
If customers don’t want to design their own systems, we are
also able to provide complete systems from our well known
partners. On the next pages we will give you a short overview
about the current portfolio of these opportunities. If you can’t
find a matching solution, don’t hesitate to get in touch with
your personal contact at RUTRONIK EMBEDDED to tell us
your demands and be sure, in most of the cases we are able to
provide you a solution.
With our partners we are able to fulfil the demands of the
embedded market, which are:
■ Fixed „Bill of Material“
■ Long product availability with 5+ years
■ Reliable PCN and EOL handling
■ Wide temperature range from 0°C to +60°C
■ Industrial temperature range from -40°C to +85°C
for special applications
■ Availability of kit-solutions from distributor side
■ Design-in support for hardware & software
from distributor side
■ Logistic solutions from distributor side
■ Reliable RMA handling
Boards
Industrial Motherboards
ATX Form Factor
The well-known ATX format from Intel is the form factor
with a huge market share because of the massive availability
from many vendors and the easy ability for mounting in
standard workstation cases.
Important available Features:
■ Implementations of iAMT, IPMI, TXT, vPro
■ Temperature range from 0°C to +60°C
■ Sockets for PCIe, PCI and on special boards even ISA
■ Onboard graphics
■ Dual LAN
■ RS 232/485 serial ports even on newest chipsets
Boards in ATX format are running with x86 processors
from Intel and AMD with different chipsets and the major
fields of applications are:
■ Industrial workstations
■ Industrial server platforms
■ Robot controlling platforms
■ Medical workstations
■ Video surveillance systems
■ Data storage servers
Micro-ATX Form Factor
The micro-ATX format is derived from the ATX format but
a bit smaller and with fewer opportunities for card slots.
The feature set of such boards is similar to the full ATX
versions and the major fields of applications are:
■ Industrial wall mountable PC’s
■ Medical PC’s
■ ATM’s
■ Cashier systems
■ Ticketing machines for railway- and bus stations
Boards
Industrial Motherboards
Mini-ITX Form Factor
The mini-ITX format is developed from VIA and has
currently a really huge and constantly expanding market share.
This format is for instance recommended for redesigns of
former EPIC- and 5.25” board designs due to nearly the same
size and the better availability of different chipsets and
processor solutions.
Due to the massive growing market for smart applications and
digital signage solutions the mini-ITX now is not longer only
available with x86 processors but also with ARM based RISC
processor designs.
■ Implementations of DASH, iAMT, IPMI, TXT, vPro
■ Temperature range from 0°C to +60°C
■ Sockets for PCIe and PCI
■ Dual LAN
■ Fanless designs
■ Single rail DC power supplies
■ Low power consumption
■ Big range of solutions from low performing
to high performing systems with mobile chipsets
Currently, we can provide chipsets from AMD, Intel and VIA
with x86 processors in several performance levels and even RISC
processor designs with ARM solutions. Due to this huge range of
available different solutions the major fields of applications are:
■ Digital signage solutions
■ Wall mountable fanless PC’s
■ Smart medical applications
■ Mobile medical appliances
■ Panel- and touch panel PC’s
■ Multimedia applications like music servers
■ Home automation
■ Mobile military solutions
■ Kiosk and ATM solutions
Boards
Embedded SBC’s
2.5” Form Factor (Pico-ITX)
3.5” form factor
The 2.5” format is currently the SBC design with the smallest
footprint and should be the most interesting form factor for
future applications. We can provide solutions from our partners
with several chipset and processor architectures, from low performing x86 designs to newest ARM based RISC solutions.
The 3.5” format is currently the major common form factor
on the embedded market. The small footprint and the easy
mountability are the most interesting features which gives the
focus on this SBC format.
■ Smallest available footprint like a 2.5” hard disk
■ Temperature range from 0°C to +60°C and
from -20°C to +80°C for special applications
■ Fanless designs
With the 2.5” format the design of a smart application with
less demands in space is quite simple because of the different
available chipsets and the major benefits of this form factor
which are the complete connectability with most of the needed interfaces, the fanless design and the ability to mount such
boards behind screens or in very small boxes. This gives the
chance to design such boards into many interesting applications and the major fields of applications are:
■ HMI’s
■ Small fanless box PC’s
■ Car PC systems
■ Smart mobile solutions
■ Industrial automation
■ Controlling systems
■ Industrial communication
systems
■ Small footprint like a 3.5” hard disk
■ Temperature range from 0°C to +60°C and
from -20°C to +80°C for special applications
■ Dual LAN
■ Fanless designs
The opportunities for 3.5” boards are uncountable and these
boards are integrated. in many small embedded PC’s. Our partners
also use these boards for most of their fanless box PC’s. From low
performing AMD Geode LX800 designs over Intel ATOM based
design and AMD G-series designs with potential graphic cores up
to solutions with ARM based RISC designs the field of available
solutions is quite big and the major fields of applications are:
■ HMI’s
■ Small fanless box PC’s
■ Car PC systems
■ Industrial automation
■ Controlling systems
Boards
Computer on Modules
Computer on Modules is a field of solutions with different
designs and especially for x86 solutions there are several standards available. The idea behind is to allow a design with a special customized base board and the possibility for upgrading only
the processor and chipset to a higher performing or even a newer
design. If a system builder has demands in special foot print base
boards, like a circle for instance, or if he wants to have only the
needed interfaces on his base board, or if he wants to design a system with the ability for easy upgrading to newer platforms over
a couple of years, COM’s are recommended. Due to the available
standards, mainly for x86 designs, it should be also easy to switch
between board suppliers. The drag which is making these solutions only interesting for systems with a high yearly quantity, higher than 500 pcs/year for x86 designs and higher than 100 pcs/year
for ARM based designs is the demand in designing the own base
board. Due to the costs for such a base board design COM’s are not
recommended for designs with low quantities.
■ Reliable standards for x86 designs like ETX, COM-Express, Q7
■ Smart ARM based solutions for many applications
■ Temperature range from 0°C to +60°C and from
-40°C to +85°C for special applications
■ Easy to change within one family
■ Really embedded design for ruggedized systems
■ Long time availability due to the standards for x86
The field of available COM modules is a big range of
solutions with different chipsets, processor architectures and
form factors. For x86 platforms the currently major common
standard is COM-Express with the three available sizes from basic
and compact to mini. For ARM based RISC designs is currently
no standard fixed and each manufacturer is promoting his
own design.
With our partners we are addressing the following major fields
of applications:
■ Embedded PC’s for DIN rails
■ Smart HMI’s
■ RISC based small touch and display solutions from
3.5” to 7” screen size
■ Computing devices for the transportation market
■ Smart grid controlling devices for energy grids
■ Gaming applications
■ Digital signage devices
Boards
PC/104 Embedded Boards
The PC/104 form factor is one of the oldest available board
format in the industrial automation field with a standardized
footprint and a standardized connector layout and pinout for
the ISA bus. To implement the PCI bus, a newer standard was
founded, called PC/104 Plus, which is currently still available from some vendors. As the PC/104 boards are designed to
build stacks without any demand for a backplane, these solutions are mainly interesting for rough environments with higher demands in shock and vibration reliability.
This is the reason for the decreasing field of manufacturers for
PC/104 boards. Currently we have still 3 partners for this format and the major fields of applications are:
■ Embedded PC’s for DIN rails
■ PC environments for the transportation market
■ Systems with demands in good shock & vibration reliability
■ Customized I/O cards with special bus systems like
CAN, PROFIBUS etc.
■ Systems with demands for ISA bus
With this design it’s possible to stack I/O modules together
with CPU modules. This makes this design really flexible for
many special projects.
■ Good reliability in shock and vibration
■ Stackable solution without backplane or baseboard
■ Temperature range from 0°C to +60°C and from
-40°C to +85°C for special applications
■ Huge field of compatible I/O solutions
■ Really embedded design for ruggedized systems
Due to the decreasing distribution of legacy bus systems in the
field and the better availability of COM modules, the demands
for PC/104 designs should also decrease in the next years.
Boards
Embedded Systems
RUTRONIK EMBEDDED is not a system manufacturer or
even a system vendor but with our partners we are able to
distribute complete systems for customers who don’t want to
design their own solutions. As the demands for complete
systems are different from customer to customer, we work
together with our partners to define so called „build to order
systems“ to have the opportunity to deliver the same system
for a long time. In the following we want to give some ideas
for complete system solutions.
Embedded box PC’s
Embedded box PC’s have a rapidly growing market share
because of the small footprint and in most cases the fanless
design. As a customer doesn’t need to do his own CE approval
and all other required tests for a system, with
a box PC he can reduce his time to market significant.
In combination with open frame display solutions it’s much
easier to configure a HMI or maybe an industrial panel PC.
Otherwise a box PC doesn’t have to be close to the display,
like a board with a LVDS interface for instance, what makes
such designs more flexible for bigger installations in the
industrial automation.
■ Complete design without any need for approval and
tests for customers
■ Reliable fanless designs
■ Different mounting solutions
■ Easy replaceable because of the compact design
Embedded box PC’s can be used in several applications and
there are many different solutions available. Together with
our partners for embedded box PC’s we can provide solutions
for most of the market fields and the major fields of applications are:
■ Fanless box PC’s for cloudy and dusty environments
■ Digital signage PC’s for POI and POS systems
■ PC’s for machines with a low yearly quantity,
like big automation centres
Boards
Panel- and Touch Panel-PCs
Industrial Servers
In addition to our kit solutions with boards and displays we offer
also complete solutions which can be ordered as an „out of the
box“ running system. With our partners we have many different
solutions, starting at 3.5” TFT size and scaling up to 19” TFT size.
Some systems are available with IP65 specification for marine
and offshore applications. Otherwise we can provide EN50155
compatible solutions for the transportation market. As this solutions are complete PC’s with all needed components, with our
partners we are able to offer these systems together with an
installed operating system. If there is a demand for a „bare bone“
to assemble at customer side, this is also possible.
As RUTRONIK EMBEDDED is a solution provider for the
complete field of industrial IT equipment, we are also providing
server systems for those customers, who don’t want to design
their own systems. Industrial server systems are designed for
24/7 usage with demands for a wider temperature range and
a longterm availability.
tests for customers
■ Big range of available screen sizes and performance levels
■ Different touch technologies
■ VESA and front mounting solutions
■ Applicable with installed operating systems
tests for customers
■ Long-term availability
■ Wide range of available performance levels
■ 19” rack mountable systems and
even standard cases available
■ Applicable with installed operating systems
The applications for Panel- and Touch panel- PC’s are
uncountable but with the available solutions from our
partners the major fields of applications are:
■ HMI’s and industrial control devices
■ POI and POS systems
■ Embedded devices for the transportation market in trains
and busses for instance
■ Marine grade applications and off shore running systems
■ Medical clients
Industrial servers are mainly needed in bigger IT
installations in factories and measuring laboratories
and the major fields of applications are:
■ Communication servers for collecting digital data in
industrial networks
■ Storage of measurement data
■ Storage servers in video surveillance networks
From entry level systems with fanless Intel ATOM designs to
high-end dual CPU systems we have a wide range of available
solutions.
Boards
Power Supply –
the Heart of the System
Since Rutronik understands its role in the embedded market
as a provider of all components, that are needed to build an
embedded system, power supplies round off our portfolio to
meet the demands for one stop sourcing.
The field of industrial power supplies is huge and it’s the
job of an embedded partner to support customers from the
beginning of a project to its mass production stage.
In the following we are providing an overview of the different
fields of power supplies to show our competence and to give
our customers an idea what they can expect.
Industrial PC (IPC) Power Supplies
A typical IPC Power Supply is converting AC or DC voltage
into the ATX standard output voltages, so that it can power
up a standard Industrial Mainboard in mini-ITX, micro-ATX
or ATX form factor used in all possible industrial applications.
Under FSP IPC Power Supply portfolio, there are a lot of different form factors and power levels available. We also supply fanless ATX PSU, DC/DC ATX PSU, and special designed
PSU for POE or medical applications. The power consumption of the target system has to be investigated and calculated
well. Also the chassis dimension and the cooling solution has
to be considered in order to match with the Power Supply.
1U Form Factor
A 1U PSU is designed for 1U rack mount server or desktop
chassis with a max height of 40.5 mm.
■ Wattage: 250W – 750W
■ 80 Plus Efficiency Levels: Standard/Bronze/Gold/Platinum
■ Cable assembly: project based customization possible
■ Medical versions available
■ Typical applications: 1U 19” rack mountable systems
(Industrial Servers, Telecom Devices)
2U Form Factor
With a height of max 70 mm, the 2U PSU is designed for 19”
rack mountable systems with demand for more internal drive
bays and more interface cards.
■ 80 Plus Efficiency Levels:
Standard/Bronze/Gold/Platinum
■ Typical applications: 2U 19” rack mountable systems
(Industrial Servers, Network Appliances, Data Center)
Power Supply
Flex Form Factor
The Flex format is often used in small computer cases and
sometimes called “mini-ITX” PSU. It can be used with a
mini-ITX board, to reduce the system dimensions and so it’s
better for custom designs with its compact size. Now with
Flex form factor we could achieve to supply up to 400W
power max.
■ 80 Plus Efficiency Levels: Standard/Bronze/Silver/Gold
■ Typical applications: small systems with mini-ITX boards
(POS/POI, Digital Signage, Small IPC, KIOSK)
ATX PS/2
■ The most popular form factor in the IT market is the typical ATX PSU, also called PS/2. Here we have the biggest
portfolio up to 1.200 W for high performance workstations.
■ Wattage: 250W – 1.200W
■ 80 Plus Efficiency Levels:
Standard/Bronze/Silver/Gold/Platinum
■ Typical applications: typical PC Systems and Workstations,
mainly combined with ATX Boards (IPC’s, Industrial Automation, Industrial Workstations, Gaming)
Redundant Solutions
For a better Fail-Safe performance sometimes it’s necessary to
use a redundant PSU to take care of the system runtime in the
maintenance of the PSU itself. So the second (redundant) part
can take over the job from the down one. Therefor we provide several designs from slim compact 1U (1HE) form factor
up to solutions for high performance servers or workstations
with high power load up to 1.400 W. Interesting are also the
versions in standard ATX PS/2 format with 190x150x86 mm,
that can be used in standard ATX chassis.
■ Wattage: 80W – 1.400W
■ 80 Plus Efficiency Levels: Standard/Silver/Gold/Platinum
■ Typical applications: systems with demand for redundancy
(Data Center, Networking, Surveillance, Storage Server,
Broadcasting)
Power Supply
Power Supply –
AC/DC Adapter
Even when the PSU shouldn’t be integrated into the system itself,
an AC/DC adapter is recommended. So the variety of possible
applications is huge, same as our adapter provided by FSP Group.
In your daily life we can find external AC/DC power supplies
everywhere e.g. for mobile phones, tablets or notebooks.
Also a lot of medical devices are getting their power from AC/DC
adapters. FSP AC/DC adapter wide range portfolio offers high
efficiency, high altitude and slim size for special applications &
medical application.
Wall Mount Adapters
The easiest & lightest way to bring the converted DC power
to a system is a Wall Mount Adapter that is plugged into an
AC wall socket with only one DC cable to the device.
■ Output DC Voltages: 5V / 6V / 9V / 12V / 15V / 24V
■ Typical applications: typical transportable systems and
systems with special demands regarding EMC
(Tablets, Charger, Medical Devices, Set-top Box)
Desktop Adapters
If more power is needed and if it’s useful for the environment
and the application itself, a Desktop Adapter is the more sufficient way to drive a device without integrating a PSU with
DC voltages.
■ Output DC Voltages:
5V / 9V / 12V / 15V / 19V / 24V / 30V / 36V / 48V
■ Typical applications: systems without an integrated PSU and
a demand for more than 24W (Notebooks, Medical Devices,
POS/POI, Digital Signage, Thermal Printer)
Power Supply
DC/DC Converters
Open Frame Solutions
To convert a Single voltage DC power into the ATX voltages
for a Mainboard, a DC/DC converter might be the smallest
and easiest solution. It can be mounted into small cases and
approved together with the whole system. In combination
with one of our AC/DC Adapters it could be an interesting
solution to drive a mini-ITX board with ATX voltage input
with an external PSU to reduce the size of the chassis.
■ Input DC Voltages: 12V
■ Output Voltages:
ATX (+3.3V / +5V / +12V / -12V / 5V Stdby)
■ Typical applications: systems without an integrated PSU and
the demand for ATX voltages
(POS/POI, Digital Signage, Industrial Printer Systems)
When it comes to specific custom chassis designs or voltage combinations, it can’t be served from one of the former
shown standards, an Open Frame PSU could be the best solution compared to a complete separate and fully custom designed PSU. The field of available solutions is various and there
are many different combinations between AC or DC input
and DC output possible. To give an idea about this area of
PSU solutions we show in the following only the big range
in general. To find the best compromise between size, power
and availability, we support you in your projects as detailed as
possible.
ITX Solutions
To integrate a PSU into a small custom chassis without external converters an ITX solution can fulfill the requirements
better than any other solution. It combines the AC input with
the ATX output voltages in an efficient way in one solution,
suitable in small chassis.
■ Output Voltages:
ATX (+3,3V / +5V / +12V / -12V / 5V Stdby)
■ Typical applications: systems with the demand for ATX voltages and less on space, where the PSU can’t or shouldn’t be
external (Industrial Printer Systems, Small IPC’s, Portables)
Other Open Frame Solutions
The more specific a system solution is designed, the more
specific the PSU has to be. To cut down the costs for a fully custom design for an AC/DC converter, we offer a broad
range of open frame solutions in 2” by 4” and smaller, with or
without a metal case around. Many solutions are also available for the medical market.
■ Wattage: 25W – 1.100W
■ Output Single DC Voltages: diverse from 3.3V to 48V
■ Output Multi DC Voltages: diverse from 3.3V to 48V in dual
or triple voltage designs
■ Typical applications: custom system designs with integrated PSU to drive Boards and peripheral components, like
TFT’s, thermal printers or FAN’s (Medical Systems, Industrial Automation, Gaming, Specific Systems with demand
for DC voltages)
Power Supply
Power Supply –
Uninterruptable Power Supplies (UPS)
If a system has to be available also in cases, when the power grid
is down and if there is demand for taking care of a reliable system
shutdown in power failure situations an UPS is needed. We can
propose also typical UPS solutions for the industrial market and
we will show you in the following the range of available designs.
Line Interactive Solutions
As a typical solution with pure sine wave AC output, line interactive UPS systems are recommended for various applications
to take care of power failures in industrial power grids.
It stabilizes the power to any IT installation.
■ Wattage: 880W / 1.6kW / 2.4kW
■ Chassis Designs: Rack / Tower
■ Typical applications: systems with demand for availability
in case of power failures (Industrial Workstations, Industrial
Servers, Medical Systems)
Online Solutions
For higher demands in case of reliability, throughput and for
Input Power Factor Correction and if it’s necessary to cover
also current fluctuations in the power grid, online systems are
the more powerful and more reliable solutions.
Such systems can also be used in combination with generators
and are recommended in real industrial power grids, like factories with many different machines with high lagging loads
or even in generator grids.
■ Wattage:
800W / 1.6kW / 1.8kW / 2.4kW / 2.7kW / 4.8kW / 5.4kW
8.0kW / 9.0kW / 16kW / 24kW / 30kW - 210kW
■ Chassis Designs: Rack / Tower
■ Typical applications: systems with demand for highest
availability in case of power failures (Industrial Networks,
Industrial Servers, Server Farms, Complete Networks)
Power Supply
explore the market trends
Electric Double Layer Capacitors (EDLC)
Electric Double Layer Capacitors (EDLC) also known as Ultracapacitors, Goldcaps or Supercapacitors are proven rechargeable alternative energy storage devices. The EDLC-Technology is not a new one and was developed in the middle of the last century, but now the
technology becomes more and more important and the number of different applications are uncountable. The Electric Double Layer
Capacitors are mainly used in tandem with a battery but in some cases the real option is to replace the battery. The EDLC´s are an ideal
source of back-up and peak-power.
Aluminium foil
L
Activated Carbon
L
Seperator
The charge in an Ultracapacitor is stored electrostatically by
separating positive and negative charges. This means they do
not use a chemical reaction to store energy.
That´s the reason why an Electric Double Layer Capacitor can
be charged and discharged up to 1,000,000 times and much
faster than a Battery.
M
Electrode
N
Electrolyte
Electrode
Aluminium lead
The stacked types called “Coin”, however, generally offer a
capacitor voltage of 5.5V (integrating cells in row).
Available with capacities of up to 1.5 F, these cells are used
especially in RTC applications and memory backup
Packing (Rubber)
Electrode
Basically, there are two different types of constructions: On the
one hand the stacked and on the other hand the wound construction forms. The construction of the wound types is similar to the construction of ordinary radial electrolytic capacitors. Available with a maximum cell voltage between 2.1 and
3.0 V, capacities of up to 3400F can be reached with these cells.
Case
(Aluminium)
Electrode
Seperator
Paper/PP
Current corrector
(Aluminium foil)
Electrode
(Activated carbon)
Seperator
The key point of this technology is the special
electrode with its surface coated with activated
carbon. The porous structure of this coating
expands the surface significantly and allows a
capacity up to thousands of Farad. The Electric
Double Layer Capacitor does not have a typical
dielectric rather it uses the electrolyte solution as
a function of the dielectric.
Benefits
■ Fast charge-/discharge cycles (only a few seconds)
■ High charge-/discharge currents (up to hundreds of A)
■ Long lifetime (up to over 1 million cycles)
■ Very long operating lifetime (up to 10 years and even more)
■ No memory effect
■ Reliable operation in harsh environments
■ Wide operating temperature range (-40°C up to +85°C)
■ Virtually maintenance free
■ Higher energy vs. electrolytic
■ Higher power vs. batteries
■ No problems due to over-charging (only voltage-limitation)
■ No charge control circuit necessary (only voltage-limitation)
■ Series- and parallel-connection possible
Comparison to batteries
Type
Time of charge
Time of discharge
Spec. energy [Wh/kg]
Lifetime [cycles]
Spec. power [W/kg]
Efficiency
Batteries
EDLC
Conv. Capacitors
1 to 5 h
0.3 to 30 s
10-3 to 10-6 s
0.3 to 3 h
0.3 to 30 s
10-3 to 10-6 s
20 to > 100
< 10
< 0.1
1000
~ 1000000
~ 1000000
< 1000
> 10000
> 100000
0.7 to 0.85
0.9 to 0.98
> 0.95
Electric Double Layer Capacitors (EDLC)
Typical shapes
Technology
Flat packs
SMD
Coin
Radial / lead
Snap-In
Screw/Weldable
Module
Capacitance
0.0068F– 1F
0.020F – 0.47F
0.047F – 1.5F
1.0F – 100F
100F – 400F
650F – 3400F
variable
Temperature
-20/-25 –
70/75/85°C
-10/ -25 – 60/70°C
-25/-40 – 70/85°C
-25/-40 –
60/65/70/85°C
-25/-40 –
60/65/70/85°C
-25/-40 –
60/65/85°C
-40 – 60/65°C
mA / A
μA
μA / mA
mA / A
A
A
A
Flat packs
SMD
Coin
Radial / lead
Snap-In
Operating currents
Portfolio
Technology
Screw/Weldable
Module
AVX
Cooper Bussmann
KORCHIP
MAXWELL
NEC-TOKIN
NESSCAP
Panasonic
Samwha
Murata
Examples
Focus supplier
Ŷ Bar code scanner Ŷ Subsidiary
Ŷ Metering
power suply
Ŷ Personal locators Ŷ Memory backup
during battery
(GPS/GSM)
Ŷ Wireless Modems
exchange
Ŷ RTC
Ŷ Bike Light
2nd source
Ŷ Backup
of CMOS
microcomputers
Ŷ Memory backup
Ŷ RTC
Ŷ Metering
Ŷ UPS
Ŷ Garden Light
Ŷ Toys
Ŷ Solar battery
operated circuits
Ŷ Metering
Ŷ Emergency Light
Ŷ UPS
Ŷ Wind mill
Ŷ Electric Car
Ŷ Electric
Scooter
Ŷ Power Tools
Ŷ UPS
Ŷ Wind mill
Ŷ Electric Car
Ŷ Electric
Scooter
Ŷ Power Tools
Ŷ UPS
Ŷ Wind mill
Ŷ Electric Car
Ŷ Electric
Scooter
Ŷ Power Tools
On Demand
nt
rre
Tem
pe
r
Cu
e
ur
t
a
Product
Lifetime
Voltage
Lifetime advantage against batteries
Due to the liquid electrolyte inside of the Electric Double Layer
Capacitor they have a life behaviour similar to conventional
Electrolytic Capacitors. Over many years the Electric Double Layer
Capacitor will dry out. In spite of everything the EDLC offers a
much higher lifetime than batteries.
Electric Double Layer Capacitor life is predominantly affected by
a combination of operating voltage and operating temperature.
A decrease of the ambient temperature by 10°C will increase the
lifetime of the Double Layer Capacitor by a factor of two similar to
the Electrolytic Capacitors. This allows you to reach a lifetime of
up to 10 years and even more.
The basic End-Of-Life failure mode for an EDLC is a decrease
in capacitance and/or an increase in ESR. It has to be considered
that each manufacturer has his own End-Of-Life-Criteria. The life
specified by industry standards is a 20% decrease in capacitance
and / or 100% increase in resistance.
Linecard Storages & Memories
Hard disks, flash memory, DRAM modules and optical drives in
all technologies and sizes which are explicitly suitable for industrial
applications. Hard disks still remain a popular medium for storing
data securely for long periods. However, flash-based memory
solutions are the first choice for applications which are exposed
to stronger vibrations or shocks. A number of factors determine
selection of the appropriate memory.
Transcend
Toshiba
Teac
Swissbit
Panasonic
Technology
Intel
Type
Apacer
Storage Technologies
Memory Modules
3
SDRAM
DDR Modules
3
3
3
DDR 2 Modules
3
3
3
DDR 3 Modules
3
3
3
DDR 4 Modules
3
3
3
SD / micro SD
3
3
3
Compact Flash / CFast
3
3
3
Flash Module (USB / PATA /
SATA)
3
3
3
USB Sticks
3
SSD (2.5"/mSATA/M.2/PCI-E)
3
Flash Memory
3
3
3
3
3
3
3
Hard Disk Drives
HDD 2.5"
3
HDD 3.5"
3
Extern USB
3
3
Optical Drives
CD
3
DVD
3
BluRay
3
Medical Recorder
3
Card Reader
3
Accessories
Linecard
3
ESMT / EliteMT
Toshiba
FRAM
Flash
STMicroelectronics
3
Rohm/
Lapis/Kionix
Renesas
Nanya
Microchip
Serial
Fujitsu
EEPROM
EON
Technology
ESMT/
EliteMT
Type
Alliance
Memory
Memory Technologies
Serial NOR
3
3
3
Parallel NOR
3
3
3
NAND
3
3
3
e.MMC
3
SD / micro SD
3
Compact Flash / CFast
Flash Module (USB/PATA/SATA)
SSD (2.5“ / mSATA / M.2)
USB Sticks
SDRAM
SDRAM
3
3
DDR
3
3
3
DDR2
3
3
3
DDR3
3
3
3
3
DDR4
Mobile SDRAM
Mobile DDR SDRAM
3
3
3
3
3
Mobile DDR2SDRAM
3
Mobile DDR3SDRAM
3
SDRAM
DDR
DDR 2
DDR 3
DDR 4
SRAM
Low Power
3
3
Fast
3
3
Synchronous
3
Serial
3
NVRAM
3
Linecard
3
What really counts for
a flash card
“How is it possible, that one card works in an application
and another one suddenly fails in the same application,
although according to the product code, it is the same
card?”
Unfortunately, it happens far too often that flash cards
from one and the same manufacturer sometimes fail in
an application. How is it possible, that one card works in
an application and another one suddenly fails in the same
application, although according to the product code, it is the
same card?
There is a simple and plausible answer to this question.
A flash card‘s function has 4 main characteristics which
must be considered: The PCB, the Flash Chips, the controller
and the firmware. The so-called bill of materials (BOM).
When these 4 components are put together you have a
finished flash card that is ready for use.
In the industry, before an application goes into production,
a sample is tested to establish the functionality. If the tests are
successful, the item will be approved for purchase by the
development department. If a batch should suddenly have
a BOM that differs from the tested sample, the card may
completely fail in the application owing to incompatibility. This can be compared with a small faulty cog in a large
mechanism.
In other words: production stops and significant costs result.
This is not just a theoretical scenario. Almost all manufacturers frequently change their BOM to reduce costs, without publishing this or marking the items. Without further
ado, new firmware is introduced for example, or a new controller, which can have catastrophic consequences in certain
applications. Cards from manufacturers like these are not
suited for industrial applications.
The leading manufactures Swissbit and Apacer have by
contrast addressed this problem and have focussed on the
industrial market.
They offer special industrial compact flash cards and
guarantee a fixed bill of materials, so that all of the cards
supplied will be identical to the tested samples with no
changes being made without a published product change
notification (PCN).
To guarantee and check this continuity, Swissbit item designations, specify exactly which controller and which flash chips
etc. are used. If anything in the BOM is changed, the item
designation is also changed.
In addition to the fixed BOM, Swissbit and Apacer exclusively use flash chips with SLC technology as, in contrast to the
cheaper MLC technology, these are suitable for industrial use
due to longer life, higher speed, lower error rate and lower
power consumption.
Storage
Control Gate
Control Gate
Word Line
Word Line
Floating Gate
Floating Gate
+20V program
Oxid Layer
Oxid Layer
Source
Source
Drain
Drain
eeeeeeeeeeeeee
n
n
eeeeeeeeeeeeee
p
Bit Line
n
n
p
Bit Line
+20V erase
Program of a Flash Cell
Erase of a Flash Cell
Flash Type
SLC
E-MLC
MLC
TLC
Bit per cell
1 Bit
2 Bit
2 Bit
3 Bit
~24-72bit
ECC requirement
~4-40bit
Up to 40bit
~8-40bit
Design Structure
24 nm
2x nm
15 nm
11 nm
Structure change
~36 months
~24 months
~12 months
12 months
Up to 10 year
1 year @ life end
Up to 10 year
3 months @ life end
Up to 10 year
1 year @ life end
Up to 1 year
1/2 Year @ life end
500
Data retention
Program/Erase PEcycle
100.000
30.000
3.000
Industrial Temperature Range
X
X
X
Fixed BOM (Bill of Materials)
XX
X
X
Low Power Consumption
XX
X
X
-
X
XX
Longevity products
XX
X
Write Performance
XXX
X
X
MLC (SLC Mode)
MLC
1
11
Cost per GB
XXX
NAND Flash Technology
(Reliability vs. Cost)
Reliability
SLC
SLC
1
10
MLC
01
TLC
0
Cost
0
Storage
00
TLC
111
110
101
100
011
010
001
000
Founded in 1997
Headquartered in Taiwan
Offices in 6 countries
483+ employees worldwide
Production in own manufactory
ISO 9001, ISO 14001,
OHSAS 18001, IECQ CQ080000
Apacer – Industrial Memory Solutions
Market studies show that Apacer offers reliable, innovative, trendy and youthful products, fully living up to its promise. Using its witty
slogan “Access the Best” to represent its effort to enhance brand value, Apacer dedicates itself in providing the best products and services.
“Access” literally suggests total convenience and freedom in data reading, sharing and communication, while “Best” represents unparalleled quality. Apacer in fact promises users improved digital experiences with its line of memory modules and peripherals.
Storage Technologies – Overview
M.2 SSD
1.8" / 2.5" SSD
mSATA/mSATA mini
Half-slim SSD
Flash Modules
SD Cards
MicroSD Cards
CF Cards
CFast Cards
USB Sticks
DDR1
DDR2
DDR3
DDR4
Storage
DRAM Module
Apacer’s DRAM module technology development is focused on vertically integrating know-how
h in the semiconductor industry, which
allows it to manufacture memory modules that satisfy the requirements of both quality and performance, yet can be easily
integrated
ily integ
into various platforms.As leading memory module maker, Apacer has long been devoted to the industrial computer field, particularly
the embedded systems.
Today, Apacer is happy to announce the qualification of a series of DDR3 Memory modules on the following Fujitsu motherboards :
Classic Desktop Series
DRAM Modules – successfull qualified on the above mentioned motherboards:
D3220-B μATX, B85, LGA1150
D3221-B μATX, Q85, LGA1150
Apacer Part Number
Capacity
Modules
78.C2GCM.4030C
8GB
DDR3 SODIMM 10600-9 512×8
Extended Lifecycle Series
78.C1GET.4010C
D3222-B μATX, Q87, LGA1150
78.B2GCM.4000C
DDR3 UDIMM 12800-11 512×8
4GB
78.B1GET.4000C
Industrial Series
D3231-S μATX, Q87, LGA1150
D3235-S ATX, H81, LGA1150
D3236-S ATX, Q87, LGA1150
D3313-S Mini-ITX, Q170, LGA1150
78.A1GE3.4000C
DDR3 SODIMM 10600-9 512×8
DDR3 UDIMM 12800-11 512×8
2GB
DDR3 UDIMM 12800-11 256×8
78.A2GC9.4000C
A2GC9.4000C
DDR3 SODIMM 10600-9 256×8
78.A2GD8.4010C
A2GD8.4010C
DDR3 SODIMM 10600-9 256×1
78.A1GK2.4000C
A1GK2.4000C
DDR3 UDIMM 12800-11 256×16
Storage
Industrial SSD Solutions
Global Wear-Leveling Technology
Advanced Wear-Leveling Technology
■ TRIM Support
■ Thermal Sensor (Optional)
■ Power Failure Recovery
■ S.M.A.R.T Function
■ High Performance
■ Advanced Wear-Leveling technology
■ Integrated Power Management
■ Support S.M.A.R.T function
■ Support NVMe 1.1
■ SFF-8639 connector
Model Name
PM110-25
Model Name
SM140-25
SM130-25
Interface
PCIe Gen3 x4
Interface
SATA 3 (6Gb/s)
SATA 3 (Gb/s)
SATA 3 (6Gb/s)
Form Factor
2.5"
Form Factor
2.5"
2.5"
2.5"
Transfer mode
15Gb/sec.
Capacity
64GB to 256GB
512GB to 2TB
8GB to 256GB
Capacity
128GB to 2TB
NAND Support
TO 15nm MLC
TO 15nm MLC
TO 32/24nm SLC
NAND Support
TO 15nm MLC
External DRAM
Yes
Yes
Est. R/W Speed
(MB/sec)
2500/1200
Yes (High Speed Type)
No (Standard Speed Type)
550/530
530/445
No
Est. R/W Speed
(MB/sec)
520/380
Wide Temp.
(-40°C~85°C)
Wide Temp
(-40°C~ 85°C)
Yes
Yes
Yes
SFD25A
Core Analyzer Technology
SSDWidget
Apacer Core Analyzer is a state-of-the-art technology to
assist industrial clients to adapt most optimal SSD and design
more reliable system solutions.
Anytime, Anywhere Monitor SSD
By using Core Analyzer, SSD itself can record actual usage
scenarios including sequential/random read/write, analyze
user behaviors, workload and data structure.
<1K
2K
4K
Workload Analysis
Read
Analyze Host read/
write
behavior without you
knowing it.
Write
Sequential
8K
16 K
SSDWidget is high comprehensive, all-around application program innovated by Apacer, which includes S.M.A.R.T function,
drive scan, disk erase and mobile monitoring.
S.M.A.R.T function of SSDWidget facilitate users to monitor
SSD lifetime and analyze workload. Significant S.M.A.R.T attributes are supported including initial bad block count, total later
bad block count, maxmium erase count, average erase count,
power on hours and power cycles, which serve as important references for SSD lifetime anticipation. With the rise of smart mobile
devices, a SSDWidget App enables users to monitor Apacer SSDs
without being bounded by time and space constraints.
Random
32 K
64 K
128 K
Write behavior Suggestion
Reduce the writing of small files to avoid erase count
raisedrapidly.
Better Solution
Recommend a better SSD solution suitable for your application.
Storage
Industrial Flash Disc Modules
SATA Disc Module
SDM5 7P/180D LP2
■
■
■
■
■
SDM4 7P/180D MP
Interface: SATA 3.0 (6Gb/s)
Capacity: 8GB~32GB
R/W: Up to 290/265 MB/s
Less than 1U height
VA Options:
- SMART Utility (Core Technology)
- Wide Temp./ HW write protect
■
■
■
■
■
■
■
■
■
■
Capacity: 2GB~32GB
R/W: Up to 85/80 MB/s
Less than 1U height
VA Options:
- Wide Temp.
PATA Disc Module
Interface: ATA/IDE
Capacity: 4GB~64GB
VA Options:
- Smart Utility / Conformal
- Coating
■
■
■
■
■
Capacity: 4GB~64GB
Less than 1U height
VA Options:
- Wide Temp.
M.2 Disc Module
ADM5S 44P/270D-M
■
■
■
■
P/180D RUH
SDM4 7P/180D
SDM4 7P/90D LPH
Capacity: 2GB~32GB
Middle profile
VA Options:
- Wide Temp./ HW write protect
ADM5S 44P/180D MPH-M
■
■
■
■
Interface: ATA/IDE
Capacity: 128MB~8GB
VA Options:
- Coating
ADM5S 44P/90D-M
■
■
■
■
Interface: ATA/IDE
Capacity: 4GB~64GB
VA Options:
- Coating
2242 P100-M / 2260 P200-M / 2280 P201-M
■ Interface: SATA 6Gb/s
■ Capacity: 2242-8GB~256GB /
2260/80-16GB~256GB
■ R/W: Up to 520/180 MB/s
■ Global Wear-Leveling technology
■ Built-in 72-bit per 1K bytes BCH ECC
■ Power Failure Recovery
■ S.M.A.R.T. Function
■ Trim support
USB Disc Module
UDMII Plus (Type C)
■
■
■
■
■
Interface: USB 2.0
Connector Pitch: 2.54 mm
Capacity: 4GB~64GB
VA Options:
- Conformal Coating
UDMII Plus (Type D LP)
■
■
■
■
■
■
Interface: USB 2.0
Capacity: 256MB~32GB
Less than 1U height
VA Options:
- Conformal Coating
- Wide Temp.
UDMII Plus (Type E)
■
■
■
■
■
Interface: USB 2.0
Capacity: 256MB~32GB
VA Options:
- Conformal Coating
- Wide Temp.
Storage
UDMII Plus-M (Type C)
■
■
■
■
■
Interface: USB 2.0
Capacity: 4GB~64GB
VA Options:
- Conformal Coating
■ Founded in 2001
■ Headquartered in
Bronschhofen, Switzerland
■ 10 countries
■ 200+ employees
worldwide
■ Production
Made in Germany
■ Certificates:
ISO 9001,
ISO 14001,
ISO/TS 16949
Swissbit – Leading Expertise in Memory Products
Information is fundamental to every modern organisation and protecting data integrity and security is more important than ever.
For over 20 years Swissbit has been providing embedded memory and storage solutions that safeguard knowledge. Our secure solutions are
tailored to meet the needs of the most demanding market segments including Industrial, Automotive, Networking/Communications, Security.
All products meet the highest quality criteria and performance benchmarks. More than 3000 customers worldwide rely on our expertise and
technology – every day.
M.2 SSD
2.5” SSD
mSATA SSD
Half-slim SSD
eUSB Flash Mod.
SD Cards
MicroSD Cards
CF Cards
CFast Cards
USB Sticks
DDR
DDR2
DDR3
DDR4
Storage
Swissbit System Competency
CONCEPTION
■ Market analysis
■ Product definition
■ Product features
■ Feasibility studies
DEVELOPMENT
■ Hardware
■ Firmware
■ Design for
test & production
■ Prototyping
■ Software tools
■ Test development
VERIFICATION
■ Product verification
(DVT)
■ Debugging
■ Optimization
■ Compliance testing
■ Compatibility testing
QUALIFICATION
■ Reliability (RDT)
■ Life time
calculation
■ Joint customer
qualification
PRODUCTION
& TEST
■ In-House production & test
■ 100% final test
(-40 to +85°C)
■ Yield management
■ Subcontractor management
■ Logistics
Swissbit owns all core processes from the conception to volume production of our products. This allows us to design and produce
optimal solutions for demanding applications.
Swissbit Life Time Monitoring
(Swissbit Lifetime Monitoring) for Windows is a utility program that reads status information from Swissbit products. It uses
S.M.A.R.T. (Self-Monitoring, Analysis and Reporting Technology) and USB vendor specific commands to gather life time information. Swissbit delivers a Windows/Linux tool (free of charge) A SBLTM software library / API for Windows and/or Linux, is available
for a small one-time fee
Advantages Software Library:
■ Simple programming interface (C library)
■ Hides the complexity of the operating system API
(Enumeration of the drives, identification and SMART
Commands)
■ Hides the complexity of the S.M.A.R.T. structures, Parsing
and validation is done in the library
■ Identical API for all supported operating systems and
Device types
Storage
Product Life Cycle Management
Swissbit conducts a sophisticated product life cycle management for all products, aiming at providing best possible longevity and visibility to our customers
SUSTAINING
EOL
RAMP
Our Promises
Component selection
with focus on:
■ Reliability and longevity
■ Industry-standard interfaces and form
factors combined with special feature set
■ All Swissbit products feature frozen
BOM BOM Change = PN Change
From End-of-Life to the next
Generation
■ Maximum longevity
■ Minimum number of PCNs
■ Early sampling of new version
■ Long transition time, allowing
customers to do scheduled & thorough re-qualification
■ Long advance notice &
LTB/LTS periods
■ Suggestion of best suitable alternative
■ Long transition period
■ Early sampling of new product
MLC SSD SATA
mSATA (MO-300) | SLIM SATA (MO-297) | New M.2 SSDs | X-60 SATA III Series
Swissbit’s mSATA (MO-300), SLIM SATA (MO297), and the new M.2 SSDs are ideal solutions
for embedded applications requiring solid state
storage in smaller, removable form factors. This
SATA SSD modules offer a long service life combined with controlled BOM and a change notification process. Each unit undergoes extensive
testing over the full temperature range before
being released for shipment.
Series Name
X-60m
X-60s
X-60ms
Type
mo-300
full size
mo-297
slim sata
m.2
2242 / 2260 / 2280
X-60s
X-60ms
Series Name
X-60m
Interface Data Transfer
Mode
SATA III - 6 Gbit/s
ATA8
Connector
52 pos. Edge Connector
PCI Express (PCIe) mini
Flash Type
The X-60 SATA III series is Swissbit’s solution
for high performance, cost sensitive, high capacity markets. The SSD modules will be available as mSATA (X-60m), SLIM SATA (X-60s),
and M.2 (X-60m2). They were designed for all
industrial, NetCom, and automotive applications requiring high data transfer rates up to
525 MB/s in sequential access and 79,000 IOPS
in 4 KB random access. In addition, they offer a
wide range of features such as Swissbit’s proven
Power Fail Safety, ATA security feature set, Data
Care Management tools, a Windows or Linux
tool and SDK for detailed S.M.A.R.T.-based Life
Time Monitoring, NCQ, TRIM, advanced wear
leveling and bad block management and in-field
firmware update functionality.
15 + 7 pin Serial
ATA Connector
75 pos. Edge Connector
B & M key
MLC
Density Range
8 GB - 480 GB
Data Retention
30 GB - 240 GB (2242)
30 GB - 480 GB (2260/2280)
10 years @ life begin | 1 year @ life end
Endurance
max. 1.9 TBW per GB drive capacity (per JESD219)
Operating Temperature
Commercial: 0°C to +70°C, Industrial: -40°C to +85°C
Storage Temperature
-50°C to +95°C
Performance
Burst Rate (MB/s)
up to 600
Sequential Read (MB/s)
up to 525
Sequential Write (MB/s)
up to 450
Random 4KB Read (IOPS)
up to 75,000
Random 4KB Write (IOPS)
up to 79,000
Voltage
3.3 V ± 5 %
5 V ± 10 %
3.3 V ± 5 %
Power Consumption
typ 450 mA
max 800 mA
ldle 110 mA
typ 300 mA
max 550 mA
Idle 60 mA
typ 450 mA
max 800 mA
Idle 110mA
Features & Tools
Proven Power Fail Safety
NCQ, TRIM
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Storage
Technical Support & Quality – SWISSBIT 360˚ Customer Service
Thanks to our full dedication to Automotive, NetCom or Industrial & Embedded segments, Swissbit can offer a comprehensive set of
services for SwissMemory™ products tailored to the specific requirements of our customers.
m
mes
Short reaction times
rtt
RMA support
Quality reports (4D / 8D)
System failure analysis
Solution-driven support
PLC management
In field FW updates
PRESALES
AFTERSALES
CUSTOMER
Experienced sales
ales team
xperience
Embedded market experience
Dedicated accountt services
ps to CMs
Existing relationships
D
Design
/ concept consulting
Qualification cycle support
Hands-on FAE support
ProvidingA evaluation units
Joint qualification
Customization & customer
sp
specific
features
Predict
Predictive analytics forecasting process
On time fulfillment process
VMI / SM
SMI programs
3PL / distribution
dis
networks
Web based
base WW product availability service
SALES
CFast™ Cards MLC
F-60 & F-50 Series
CFast™ cards combine two existing industry standards into a single product: the CompactFlash™ (CF) card form factor and the Serial
ATA (SATA) interface commonly used in hard disks.
CFast™ cards can replace both HDDs and CompactFlash™ cards in applications requiring small form factors, high endurance and the
ability to withstand shock, vibration, extreme temperatures (-40°C to +85°C), high altitude and rough environmental conditions.
Swissbit’s CFast™ cards provide rugged storage for embedded and industrial systems where performance, data and system reliability,
power fail protection and flexibility are important design considerations.
Series
F-60
Form-Factor(s)
F-50
CFast 2.0 (Type 1 Housing)
Physical Dim. (mm)
36.4 x 42.8 x 3.6
Interface
Con. Pin Count
Data Retention
SATA III (6Gb/s)
24 (Total), 4 (Data), 17 (Power)
10 years @ life begin; 1 year @ life end
Capacity Range
8, 16, 30, 60, 120, 240 GB
8, 16, 32, 64, 128 GB
Overprovisioning
12%
7%
520/ 340 MB/s
70K / 35K IOPS
500 / 150 MB/s
30K / 30K IOPS
Performance*
SR / SW: MB/s
RR / RW: IOPS
NAND Technology
Voltage, Power
Endurance, DWPD (TBW*)
MLC, ECC: 40b/1KB, P/E: 3K,
DR: 1yr at EOL, support thru CY18
3.3V ± 5%, 1.3W (Active)
3.3V ± 5%, Max 1.2W (Active)
0.3 (150)
0.2 (100)
Optimized for
Highest performance and
high endurance
@ MLC price level
Industrial use case endurance
and performance
@ most competitive price
Feature & Tools
Proven Power Fail Safety
NCQ, TRIM
Advanced Wear Leveling & Bad Block management
In-field firmware update
SBLTM Tool & SDK for S.M.A.R.T. based Life Time Monitoring
Storage
Block Mode vs. Page Mode / Performance
Performance test show that the random write data rate of a page based MLC SD card is up to 200 times higher than a block based MLC
card. Block based SLC cards benefit from a smaller block size for SLC components than MLC chips.
The endurance of the page based S-45/S-45u card is up to 100x higher than comparable block based MLC cards in the market.
The busy time is directly proportional to the duration of the internal write operation and is significantly reduced for S-45 due to the
small page write.
Topic
Block based
MLC
Block based
SLC
Page based
FW complexity
low
low
high
Sequential
performance
high
highest
small reduction
Random write perf.
poor
medium
high
high
300-1000
medium
100-300
low
4-10
WAF
Endurance
normal
high
10-100x
Retention
normal
normal
normal
Busy time
long
medium
short
SD / microSD Products
Shape
Series
Interface
S-200/
S-220 SLC
S-45 MLC
S-450 SLC
S-300u SLC
S-200u SLC
S-45u MLC
S-450u SLC
SD 2.0
SD 3.0 UHS-I
SD 3.0 UHS-I
SD 2.0
SD 2.0
SD 3.0 UHS-I
SD 3.0 UHS-I
Class 6 / 10
Class 10
Class 10
Class 6 / 10
Class 6
Class 10
Class 10
Industrial Temp. Range
9
9
9
9
9
9
9
Power Fail Safety
(Operation / FW update)
9/-
9/ 9
9/ 9
9/-
9/-
9/ 9
9/ 9
Static & Dynamic Wear
leveling
9/ 9
9/ 9
9/ 9
9/ 9
9/ 9
9/ 9
9/ 9
Bad Block Management
9
9
9
Speed Class (up to)
9
9
9
9
Read Retry
9
9
9
9
Autonomous auto refresh
9
9
9
9
Read disturb management
9
9
9
9
Limited
9
9
Limited
9
9
9
9
9
9
9
9
Block
Page
Block
Block
Page
Block
ECC monitoring
Life Time Monitoring
WAF Reduction
Block
9
High speed sequential
mode
9
9
High IOPS rate
9
9
Longevity
SPI Mode*
Limited
9
Limited
Limited
9
9
9
Limited
Limited
*SPI = Serial Peripheral Interface
Storage
SE
VE
FE
PE
DP
Standard Edition
Voice Edition
FIPS Edition
Premium Edition
Data Protection
8 GB | 16 GB
8 GB | 16 GB
8 GB | 16 GB
--
8 GB | 16 GB
32 GB
8 GB | 16 GB
8 GB | 16 GB
8 GB* | 16 GB*
8 GB | 16 GB
4 GB | 8 GB
16 GB | 32 GB
64 GB
8 GB | 16 GB
8 GB | 16 GB
8 GB* | 16 GB*
8 GB | 16 GB
4 GB | 8 GB
16 GB | 32 GB
SD Card plus Security
4 GB | 8 GB
16 GB | 32 GB
4 GB | 8 GB
16 GB | 32 GB
4 GB* | 8 GB*
16 GB* | 32 GB*
4 GB | 8 GB
16 GB | 32 GB
4 GB | 8 GB
16 GB | 32 GB
PS-450U
512 MB | 2 GB
512 MB | 2 GB
512 MB*| 2 GB*
512 MB | 2 GB
512 MB | 2 GB
4 GB | 8 GB
Security Product Matrix
MOBILE / PC
PS-100U
Micro SD Card plus Security
PS-45
SD Card plus Security
MEDICAL
AUTOMOTIVE
PS-45U
Micro SD Card plus Security
PS-450
INDUSTRIAL
Micro SD Card plus Securityy
* On requestt
Security
The security product series of Swissbit
addresses the growing demand for mobile
and portable security. The products combine reliable storage and security functions in one single device. As every system does need storage the combination
with high security features is able to turn
systems into secure systems efficiently.
Swissbit is known as high quality flash
memory storage vendor. With the security series solution providers in the mobile security, medical, telecommunication,
payment, banking and industrial market
get the opportunity to build high security
solutions just by using our security products.
Valuable data like sensitive files, emails,
photos and even voice calls can be protected by encryption, access protection or
made resistant against tampering by digital signature. Know how protection and
licensing capabilities serve to monetize
investments. Depending on the use case
the best fitting product can be chosen.
SECURE VOICE
Secure Voice calls are a requirement for confidential communication. Swissbit Security products
are optimal for fast, secure, user
friendly secure voice solutions.
Security Features
TRUE HARDWARE RNG
True random numbers are generated
inside the secure element. True randomness is the key prerequisite for secure
systems to prevent brute force attacks.
ELLIPTIC CURVE CRYPTOGRAPHY SUPPORT
Elliptic curves are faster and more
efficient than RSA cryptography.
DIGITAL SIGNATURE AND
VERFICATION
Digital signatures are very popular and
inevitable to protect against data or
code manipulation.
SECURE CD-ROM
The flash memory can be partially
or totally switched to read-only.
This function ensures that, e.g.,
important data can be modified
only after PIN authentication.
HARDWARE BASED DATA
ENCRYPTION
Hardware based security is key when
it comes to replaceability, simple workflows, and trusted runtime environments.
MOBILE BANKING AND EPURSE
Swissbit Security products for mobile banking and payment offer strong
authentication and offline security.
DEVICE PROTECTION BY
DUAL FACTOR AUTHENTICATION
The user needs to have the card and
know the PIN.
Storage
DATA PROTECTION AND
ENCRYPTION
Various data protection modes
ensure privacy of stored data.
The card offers a data safe function with strong AES encryption
and PIN access protection.
SECURE LOGGING
In large, hidden storage, any
system event log, tax data,
consumption data, or audit trails
can be stored securely in writeonce mode, queue mode, or
random access mode.
2 Factories
14 offices in 8 countries
16 Mio. Products each month
ISO/TS16949 certified
100% In-house Development
& Manufacturing
Transcend – Good memories start here
Transcend Information. Inc. was founded in 1988 by Mr. Chung-Won Shu, Peter, with its headquarters in Taipei, Taiwan. Today,
Transcend has become a leading global brand of digital storage, multimedia and industrial products with 14 offices worldwide.
Not only do we design, develop, and manufacture all of our own products, but we also market and sell them. At Transcend, we
uphold the highest quality and believe in professional service. As a customer-focused company, Transcend has the ability to quickly
respond to the market's changing needs.
M.2 SSD
2.5” SSD
mSATA SSD
mSATA mini SSD
Half-slim SSD
SD/MicroSD Cards
CF Cards
CFast Cards
Flash Modules
USB Sticks
DDR1
DDR2
DDR3
DDR4
eMMC
Storage
Customization Service
General Customizable Items
■ Fixed BOM / Fixed FW
■ Customized Sticker (SSD/SD…)
■ Customized Logo (Flash drive/microSD…)
■ Preload Data on Storage Devices (SSD/HDD/SD/JetFlash…)
■ Customized memory module PCB 30u” gold-plated contact pins
■ Customized FW setting (SSD/CF/SD…)
■ Other Special Requests…
Customization Management
Based on well-organized system
■ Keep the same customized content for repeat order
■ Ensure consistent information at every stage
Transcend Expertise –
Reliable Customization Services
Fixed BOM Management
■ Transcend Information System
■ Customized part number
■ PCN (Product Change Notice)
Customized Solutions
■ Hardware
■ Firmware
■ Software
Storage
Worldwide Support
Global ERP System
■ 20+ years of industrial
experience
■ 100+ highly trained engineers
Standard
Memory Modules
Industrial Temperature
Memory Modules
Low Voltage
Memory Modules
Workstation
Memory Modules
Low Profile
Memory Modules
DDR4 Industrial DRAM Module Series
An Optimized Solution for IPC
Reliable Stability for 24/7 Operations
Low Voltage for Reduced Power Consumption
Compared to personal computers, IPC deals with a larger database for a longer period of time without failure. Transcend DDR4
industrial DRAM modules are rugged enough to resist shock, heat
and electromagnetic disturbance.
Transcend DDR4 industrial DRAM modules run ultra lowvoltage of 1.2V, reducing the electrical load of the memory
bus and consuming up to 40% less power compared to 1.5V
standard DDR3 DIMMs.
30u" gold fingers plated on the printed circuit board significantly
improve the electrical conductivity of Transcend DDR4 industrial
DRAM modules. Additionally, each DRAM is equipped with two
more robust error correcting codes including Cyclic Redundancy
Check (CRC) for data reliability and on-chip parity detection for
the integrity of command and address.
This prolongs the life of servers and workstations, and protects
the environment by consuming less energy. Furthermore, since
each module generates less heat, systems can operate with
reduced temperatures and increase the overall reliability of the
module.
Transcend DDR4 industrial DRAM modules are constructed with
the new generation of DRAM chips that doubled the density and
capacity, delivering stable performance and durability.
Stringent Testing for Guaranteed Quality
Additionally, Transcend DDR4 DRAM modules offer high speed
transmission of 2133MHz and up to 17GB/s of memory bandwidth, aiming to roll out the system performance to its maximum
data transfer speeds.
Transcend DDR4 industrial DRAM modules are fully
compliant with JEDEC (Joint Electron Device Engineering
Council) standards and undergo strenuous 64 bit kernel,
single-core and multi-core testing to be compatible with the
latest Intel's 6th generation Skylake processor, Intel Xeon
E5-2600 v3 server family processor and Haswell-E CPU with
X99 chipset.
All DDR4 models carry Transcend's Limited Lifetime
Warranty.
Storage
From DDR3 to DDR4
Lower Power Consumption
■ DDR4 operates at operating voltage of 1.2V,
reduced 11% than at 1.35V of DDR3L
■ 37% less power consumption than DDR3L when
running an identical process at the same speed
Lower power consumption means:
■ Longer battery life (good for mobile computers)
■ Lower energy costs (good for data centers and
large-scale applications)
■ Reduced system temperatures
Storage
HDDs & SSDs
for Industrial & Automotive Environments
HDDs
Toshiba's MQ01AADxxxC series of 2.5-inch, 4,200 rpm HDD are
designed for the demanding automotive environments and industrial applications. The rugged design of the MQ01AADxxxC enables optimized operation at higher altitudes, greater temperature
ranges and vibrational conditions compared to normal HDDs for
PCs (MQ01ABD series). The MQ01AADxxxC is available in capacities up to 320 GB.
Key Features
■ Altitude (Operating):
-300 to +5,650 m
■ Temperature Range:
-30 to +85 °C (operating),
-40 to +95 °C (non-operating)
■ Vibrations of up to
3 G (29.4 m/s2)
■ 3.0 Gbit/s SATA Interface
■ Small Form Factor Design
SSDs
Solid State Drive HG6K Series –
Industrial Temperature Version
Key Features
■ Hot-Plug/OS-Aware Hot Removal
■ ClickConnect (a latch solution for internal cabled system
application) supported /2.5-inch only)
■ Deterministic Zeroing TRIM supported
■ SED model supports TCG OPAL ver. 2.0 and Wipe Technology based on AES 256 hardware
■ WWN (World Wide Name) supported
■ Strong & highly-efficient ECC named
Quadruple Swing-By Code (QSBC)
■ Serial ATA DIPM (Device Initiated Power Management),
HIPM (Host Initiated Power Management) and Device Sleep
are supported for reduced power consumption
■ Read only mode supported for emergency
■ Form Factor: 2.5-inch (7.0 mmH), mSATA™ Module,
M.2 2280-D2 (Double-sided)
■ Capacity: 2.5-inch (7.0mmH) = 60/128/256/512 GB
mSATA™ Module = 60/128/256 GB
M.2 2280-D2 (Double-sided) = 60/128/256/512 GB
■ Temperature: 2.5-inch (7.0 mmH) =
Operating: -40°C – 85°C (case temperature)
- Non-operating: -40°C – 85°C
- mSATA™ Module/ M.2 280-D2 (Double-sided) =
- Operating: -40°C – 85°C (components temperature)
- Non-operating: -40°C – 85°C
Storage
Hard Disk Drives
Surveillance Hard Disk Drive
The MD04ABA-V series delivers Toshiba’s first 5TB surveillance- class HDDs. The power efficient, 3.5-inch, low RPM HDD supports
up to 32 high definition cameras¹ and 24x7 operation.
The series is built for use in surveillance digital video recorders
(SDVR), surveillance network video recorders (SDVR) and hybrid
SDVR. In addition, the rotational vibration (RV)
sensors makes the HDDs suitable for use in RAID/ multi-HDD based
surveillance platforms.
The massive capacity points of 4TB or 5TB give now the
flexibility to retain higher resolution surveillance
video data for longer periods using fewer HDDs, helping
to maintain a smaller storage footprint and lower energy
costs. The drives also feature excellent Power efficiency
with a power consumption value of 6.5 W (read/write).
1) Number of surveillance cameras support capability is defined by performance simulation with high definition
cameras as 2MiB/s bit rate.
Form Factor
Product Family
Capacity (GB)
RPM
Cache
(MG)
Warranty
Remark
MTTF
Workloads
3.5“ Surveillance HDD
MD03ACAxxxV
2,000 - 4,000 GB
7200
64
3
512 Byte native
1,000,000 hours
110 TB/y
MD04ACAxxx
4,000 - 6,000 GB
128
2
512 Byte emulation
600,000 hours
55 TB/y
MD04ABAxxxV
4,000 - 5,000 GB
64
3
512 Byte emulation
1,000,000 hours
110 TB/y
Low Spin
Enterprise HDD
Enterprise Performance HDDs for high-performance server and storage systems that require quick response and rapid data transfer.
Enterprise Capacity HDDs have large capacity and are used in storage systems and data centers which require large amount of data
storage capacity.Toshiba provides several classes of enterprise HDDs to support both mission and business critical applications that
demand reliable performance in 24x7 operationing environments.
Form Factor
Product Family
Capacity (GB)
RPM
Cache
(MG)
Warranty
Remark
MTTF
Workloads
3.5“ Enterprise Capacity HDD
MG03SCAxxx
1,000 - 4,000 GB
7,200
64
5
512 Byte native
1,200,000 hours
550 TB/y
MG03ACAxxx
1,000 - 4,000 GB
4kByte native
1,400,000 hours
3.5“ Enterprise Cloud HDD
MG04SCAxxxx
2,000 - 5,000 GB
MG04ACAxxxx
2,000 - 6,000 GB
AL14SEBxxxN
300 - 1200 GB
10,500
128
AL13SXBxxxx
300 - 600 GB
15,000
64
128
AL13SEBxxx
300 - 900 GB
10,500
64
MC04ACAxxxE
2,000 - 6,000 GB
7200
128
512Byte native
3
Storage
512 Byte Emulated
2,000,000 hours
7.9 PB/y
800,000 hours
180 TB/y
Solid State Drive HG6Z
Series 3rd Generation for Industrial & Automotive Environments
Key Features
■ Hot-Plug/OS-Aware Hot Removal
■ ClickConnect (a latch solution for internal cabled system
application supported /2.5-inch only)
■ Deterministic Zeroing TRIM supported
■ SED model supports TCG OPAL ver. 2.0 and Wipe
Technology based on AES 256 hardware
■ WWN (World Wide Name) supported
Form Factor
Connector Type
■ Strong & highly-efficient ECC named QSBC™¹
■ Serial ATA DIPM (Device Initiated Power Management),
HIPM (Host Initiated Power Management) and Device Sleep
are supported for reduced power consumption
■ Read only mode supported for emergency
NOTE: 1) QSBC is a trademark of Toshiba Corporation
2.5-inch
(7.0 mmH)
M.2 2280-D2
(Double-sided)
Standard SATA
Memory
M.2 B-M
TOSHIBA MLC 15nm NAND flash memory
Interface*¹
Capacity*¹
ACS-2, SATA revision 3.1 1.5/3/6 Gbit/s
128/256/512/1024 GB
Performance*¹*²
Supply Voltage
Power Consumption
Temperature
128/256/512 GB
Sequential Read: up to 534 MB/s{510 MiB/s}
Sequential Write: up to 482 MB/s{460 MiB/s}
5.0 V ±5 %
3.3 V ±5 %
Active: 3.3 W typ.
Idle: 125 mW typ. (128/256/512 GB)
Idle: 260 mW typ. (1024 GB)
Active: 3.0 W typ.
Idle: 65 mW typ.
Operating: 0°C - 70°C
(case temperature)
Non-operating: -40°C - 85°C
Operating: 0°C - 80°C
(components temperature)
Non-operating: -40°C - 85°C
Shock
14.7 km/s² {1500 G} at 0.5 ms
Vibration
Operating / Non-operating: 196 m/s² {20 G} at 10-2,000 Hz
Reliability
Mean Time to Failure (MTTF): 1,500,000 hours
Product Life: Approximately 5 years
Size
Weight
More Features
100.0 mm x 69.85 mm x 7.0 mm
80.0 mm x 22.0 mm x 3.58 mm
49 - 54 g typ.
7.0 - 7.6 g typ.
■
■
■
■
Translation mode which enables any drive configuration
28-bit LBA mode commands and 48-bit LBA mode commands support
Automatic retries and corrections for read errors
NCQ (Native Command Queuing) function supported
Compliance
UL, CSA, TÜV, KC, BSMI, CE, RCM
1) 1 MB = 1,000,000 bytes, 1 GB = 1,000,000,000 bytes, 1 Gbit = 1,000,000,000 bits
2) 1 MiB (mebibytes) = 220 bytes = 1,048,576 bytes
Optical
StorageDrives
Enterprise SSD (eSSD)
Enterprise SSDs are suitable for high-performance Tier 0 computing, server and storage systems that require high level of performance and reliability. Toshiba Enterprise SSDs equip the NAND flash memory (NAND) and controller developed by Toshiba and
offer high reliability, data protection incorporating power-loss-protection and encryption technology to support enterprise environments and applications. Light weight and low power consumption will make the systems more energy efficient.
Enterprise Value Endurance SSD
High performance enterprise-class solid state storage providing
higher level of endurance for write-intensive applications
and systems, such as write caching, acceleration and OLTP
(On-Line Transaction Process) services.
High performance enterprise-class solid state storage with
balanced random write performance and endurance for virtualized
server and storage applications and generic enterprise applications.
Enterprise Read Intensive SSD
PLP (Power Loss Protection)
High performance enterprise-class solid state storage with balanced sequential read & write performance and write endurance
for archiving systems and lower workload services (E-mail, file
share, etc.) at cloud data center.
Some of Toshiba Storage Products equip Power Loss Protection
(PLP) technology to help protect against data loss in the event of
unexpected power loss.
Model Number
Formatted
Capacity
DWPD*¹
Enterprise High Endurance SSD
NAND Type
Interface Sustained 64 KiB*²*³
Sequential Read
Sustained 4 KiB*²*³*
Sequential Write Random Read
[IOPS]
Power Cons.*
PLP*
Random Write
[IOPS)
Environm.
Temp.*
Enterprise High Endurance SSD
PX04SHBxxx
200 - 1,600 GB
25
A19nm e-MLC SAS-3.0
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
120,000 - 125,000 3.2 W Typ.
PLP
0 to 55 °C
PX04SHQxxx
200 - 1,600 GB
25
A19nm e-MLC SAS-3.0
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
120,000 - 125,000 3.2 W Typ.
PLP
0 to 55 °C
Enterprise Mid Endurance SSD
PX04SMBxxx
400 - 3,200 GB
10
A19nm e-MLC SAS-3.0
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
85,000 - 90,000
3.2 W Typ.
PLP
0 to 55 °C
PX04SMQxxx
400 - 3,200 GB
10
A19nm e-MLC SAS-3.0
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
85,000 - 90,000
3.2 W Typ.
PLP
0 to 55 °C
PX04PMxxxx
800 - 3,200 GB
10
A19nm e-MLC Pcle 3.0
3,100 MiB/s
2,350 MiB/s
660,000
185,000
6.0 W Typ.
PLP
0 to 55 °C
Enterprise Value Endurance SSD
PX03SVxxxx
400 - 1,600 GB
3
19nm e-MLC
PX04SVBxxx
480 - 3,840 GB
3
A19nm e-MLC SAS-3.0
SAS-12.0
820 - 830 MiB/s
380 MiB/s
90,000
26,000
2.7 - 3.6 W Typ.
PLP
0 to 55 °C
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
55,000 - 60,000
3.2 W Typ.
PLP
0 to 55 °C
PX04SVQxxx
480 - 3,840 GB
3
A19nm e-MLC SAS-3.0
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
55,000 - 60,000
3.2 W Typ.
PLP
0 to 55 °C
THNSNJxxxPCSZ
200 - 800 GB
3
A19nm MLC
SAS-3.2
500 MiB/s
270 - 400 MiB/s
75,000
20,000 - 30,000
1.0 W Typ.
PLP
0 to 55 °C
SAS-12.0
Enterprise Read Intensive SSD
PX03SNxxxx
200 - 1,600 GB
1
19nm e-MLC
PX04SRBxxx
480 - 3,840 GB
1
A19nm e-MLC SAS-3.0
1060 - 1100 MiB/s
380 MiB/s
130,000
26,000
2.7 - 3.6 W Typ.
PLP
0 to 55 °C
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
22,000
3.2 W Typ.
PLP
0 to 55 °C
PX04SRQxxx
480 - 3,840 GB
1
A19nm e-MLC SAS-3.0
1,500 - 1900 MiB/s
750 - 850 MiB/s
270,000
22,000
3.2 W Typ.
PLP
0 to 55 °C
THNSNJxxxPCSZ
120 - 960 GB
1
A19nm MLC
SATA-3.2
500 MiB/s
120 - 400 MiB/s
75,000
4,000 - 14,000
1.0 W Typ.
PLP
0 to 55 °C
THNSNJxxxPCS3
120 - 480 GB
1
A19nm MLC
SATA 6.0
500 MiB/s
270 - 400 MiB/s
75,000
8,500 - 12,500
1.0 W Typ.
PLP
0 to 55 °C
1) DWPD: Drive Write Per Day. One full drive write per day means the drive can be written and
4) IOPS: Input Output Per Second (or the number of I/O operations per second)
re-written to full capacity once a day every day for five years, the stated product warranty period.
Actual results may vary due to system configuration, usage and other factors.
2) 12.0 Gbit/s interface speed by dual port
5) Power Consumption (Ready)
6) Power Loss Protection
7): Environmental Temperature (Operating)
3) Read and write speed may vary depending on the host device, read and write conditions, and
file size.
Storage
Intel Solid-State Drive Product Families
Consumer
Data Center
Professional
Solid-State Drives – CONSUMER
Impressive performance with NVMe/PCIe and SATA for
enthusiasts and mainstream consumers
Target Applications
■ High end desktop
■ Enthusiast
■ Workstation Uses
■ Performance gaming
■ Digital content creation
■ Engineering: FEA, fluid dynamics, CAD
■ Mobile computing
■ Embedded applications – ATMs, digital signage
TM
Intel Consumer
Series
SSD 535
Series
SSD 540s
Series
Connector
SATA 3.0 6Gb/s
Form Factor
2.5“ /M.2
Capacity
Sequential R/W
Random
4K R/W
SSD 600p
Series
SSD 750
Series
PCIe 3.0 x4
M.2
2
HHHL AIC / 2.5“ U2
56 GB
120 GB
256 GB
400 GB
120 GB
180 GB
360 GB
800 GB
180 GB
240 GB
512 GB
1.2 TB
1 TB
240 GB
360 GB
360 GB
480 GB
480 GB
1 TB
M.2
2.5”
Up to
Up to
540/490 MB/S 540/480 MB/S
Up to
1900/650
MB/S
Up to
2400/1200 MB/S
Up to
41K/80K IOPS
Up to
90K/80K IOPS
Up to
130K/100K
IOPS
Up to
440K/290K IOPS
3D Nand
NAND
16nm MLC
16nm TLC
Endurance
40 GB/day
for 5 Years
40 GB/day
for 5 Years
20nm MLC
70 GB/day
for 5 Years
Temp. Operating
0°C to 70°C
Warranty
5 Years
2.5”
x4 HHHL Add in card
Hard Disc Drives
Embedded
Solid-State Drives – DATA CENTER
Consistently amazing performance for NVMe™/ PCIe® and SATA with broad industry compatibility,
and robust enterprise RAS features
Target Applications
■ High availability Storage System
■ Enterprise mission critical applications
■ High Performance Computing
■ Database
■ Big Data Analytics
■ Virtualization
■ Cloud storage
■ Webserver
TM
2.5"
2
5"
x4 HHHL Add in card
Intel SSD Data Center
Series
SSD DC S3510
Serie
SSD DC S3610
Serie
Form Factor
2.5“
2.5“ / 1.8“
2.5“
Capacity
80 GB
100 GB
200 GB
400 GB
400 GB
400 GB
1.6 TB
120 GB
200 GB
400 GB
1.2 TB
800 GB
800 GB
3.2 TB
240 GB
400 GB
800 GB
2 TB
1.2 TB
1.6 TB
4 TB
480 GB
480 GB
1.2 TB
1.6 TB
2 TB
800 GB
800 GB
1.2 TB
1.2 TB
Connector
SSD DC S3710
Serie
SSD DC P3500
Serie
SSD DC P3600
Serie
SATA
SSD DC P3700
Serie
SSD DC P3608
Serie
PCIe 3.0 x4
HHHL AIC /2.5“ U2
HHHL AIC
2 TB
1.6 TB
1.6 TB
Sequential R/W
Up to
500/400 MB/s
Up to
540/520 MB/s
Up to
5050/520 MB/s
Up to
2500/1700 MB/s
Up to
2600/1700 MB/s
Up to
2800/2000 MB/s
Up to
5000/3000 MB/s
Random 4K R/W
Up to
68K/20K IOPS
Up to
84K/28K IOPS
Up to
85K/45K IOPS
Up to 450K/35K
IOPS
Up to 450K/56K
IOPS
Up to 460K/175K
IOPS
Up to 850K/150K
IOPS
NAND
16nm
Endurance
0.3 DWPD
20nm HET MLC
3 DWPD
10 DWPD
20nm
0.3 DWPD
Temp. Operating
0°C to 70°C
Warranty
5 Years
Hard Disc Drives
20nm HET MLC
3 DWPD
10 DWPD
3 DWPD
Intel Solid-State Drive Product Families
Consumer
Data Center
Professional
Solid-State Drives – PROFESSIONAL
Enhanced security and remote manageability with vPro™
integration for the corporate client
Target Applications
■ Workstation Applications
■ Thin and light form factors: UltrabookTM, business tablets,
2-in-1s
■ Desktop and all-in-ones
■ Managed mini-PCs / Intel NUC
■ Managed client
■ Corporate IT
Intel Professional
Serie
SSD Pro
1500 Series
Connector
SSD Pro
5400s Series
SSD Pro
6000p Series
SATA 3.0 6Gb/s
Form Factor
Capacity
SSD Pro
2500 Series
2.5“/M.2
M.2
80 GB
120 GB
120 GB
256 GB
120 GB
128 GB
180 GB
340 GB
180 GB
180 GB
240 GB
512 GB
240 GB
240 GB
360 GB
710 GB
360 GB
256 GB
480 GB
1 TB
480 GB
360 GB
1 TB
2.5”
480 GB
Sequential R/W Up to 540/480 Up to 540/490 Up to 560/400
MB/S
MB/S
MB/S
Random
4K R/W
Up to
24K/80K IOPS
Up to
24K/80K IOPS
Up to 1900/650
MB/S
Up to
72K/36K IOPS
Up to
130K/100K IOPS
3D Nand
NAND
20nm MLC
20nm MLC
16nm TLC
Endurance
20 GB/day for
5 Years
20 GB/day for
5 Years
40 GB/day for
5 Years
Temp.
Operating
0°C to 70°C
Warranty
5 Years
M.2
Hard Disc Drives
Embedded
Solid-State Drives – EMBEDDED
OT and embedded applications
applic
Low power, lower capacities all with Intel reliability for IOT
Target Applications
■ Digital signage
■ POS, Kiosk, Vending, etc
■ Medical Technology
■ Security Technology
■ Automation Engineering
■ Access Controls
■ Metering
■ Weighing Technology
M.2
M.
.2
2 5”
2,5”
TM
Intel Embedded
Series
SSD E5410S Series
SSD E6000p Series
Connector
SATA 3.0 6Gb/s
PCIe 3.0 x4
SSDE5420s Series
SSD E5400s Series
SATA 3.0 6Gb/s
Form Factor
2.5“
M.2
2.5“ /M.2
2.5“ /M.2
Capacity
80 GB
160 GB
150 GB
48 GB
120 GB
256 GB
240 GB
80 GB
120 GB
180 GB
Sequential R/W
Up to 500/460 MB/S
Up to 1900/650 MB/S
Up to 450/450 MB/S
Up to 540/480 MB/S
Random 4K R/W
Up to 68K/20K IOPS
Up to 130K/100K IOPS
Up to 65K/20K IOPS
Up to 90K/80K IOPS
NAND
16nm MLC
3D Nand
3D Nand
16nm TLC
Endurance
Temp. Operating
0°C to 70°C
Warranty
5 Years
Hard Disc Drives
Shadowless lamp
with camera
HD Medical Video Recorder
Surgical
microscopes
Based on many years of experience and product knowledge
of medical imaging and recording, TEAC introduces the
UR-4MD and UR-50BD, the solution for undiluted highdefinition medical recording.
Laparoscope
Operating room
Urological
endoscopes
Excellent quality recording provided by
TEAC UR-4MD and UR-50BD
maximizes the efficiency of
studies.
Arthroscope
Hysteroscope
UR-4MD
■ Intuitive & Easy To Use
■ Auto-sensing detects I/O & Video Resolution “automatically”
■ Wide range of recording resolutions
- 640x480~1920x1080 (30Hz/29.97Hz):
Undiluted recoding resolution
- 1920x1200 (Resize to 1728x1080): Supported Input resolution
■ Multiple HD & SD inputs/outputs
(SDI, DVI-D, S-Video and Composite)
■ Simultaneous recording to multiple media
(up to 2 External USB drives & 1 Internal HD)
■ Networking (FTP & CIFS) RJ45 10/100/1000 Ethernet
■ Remote control, Foot-switch, Card/Barcode reader and
Keyboard (Optional)
■ Compliance with Medical Standards
Microscope
Camera unit
Recorder
rder
Storage
Optical Drives –
Ideal for Industrial Applications
Advantages at a glance
■ Space-saving “SlimLine”
housing
■ Attractive design
■ Innovative technology
■ Has been on the market
as long as the PC
■ Very high quality standard
■ Long life cycle
■ High compatibility
■ Modified to industrial
standards
■ Custom solutions possible
DV-W5600 –
Industrial Writer
DV-W28SS-B93 –
Slim Slot Loading DVD / CD Recorder
TEAC’s new professional DV-W5600 is the world’s
most efficient and accurate CD/DVD recorder and verifier
for qualified applications. It offers hundred per cent
quality control for all discs. Originally designed for PC
use, DV-W5600 has some special functions added to fulfil
requirements in industrial use.
TEAC´s slimline 8x DVD-Recorder DV-W28SS-W offers the
most comfortable slot-in mechanism for your convenience. DVW28SS-W combines fast DVD-recording, smooth DVD video
playback with impressive CD-ROM performance.
Equipped with TEAC’s typical very long
product lifecycle
a stable and reliable platform is
assured.
Features
■ SATA Interface
■ High accuracy of try open position
■ Reduces the mis-loading of the disc by Auto-Loader
■ Improving the throughput by immediate transition to verify mode
■ Very quick verify mode
■ Fast tray operation
■ Improvement of reliability and maintenance system
■ Support new discs by adjusting new write strategies
■ Error report by blinking LED
■ Accumulative turn-on time on Laser Diode
■ Measure PI/PO error
■ Total Power-on-Hour, CD/DVD write/read
accumulate time
Whether you are watching high definition movies, listening
music or playing DVD
D title, the TEAC 8x slimline DVD-Recorder DV-W28SS-W with
th its robust
r bust
and extremely reliable
le slot-in
mechanism is the perfect
rffect
multimedia companion
o
on
for your notebook or
PC.
Disc Diameter
12cm
Interface
SerialATA Revision 3.1
Access Time
0
C O
140ms
typ CD-ROM
150ms typ DVD-ROM
Data Buffer
1MB
Loading Mechanism
Slot Loading Type
Ambient Temp.
Operating: 5 to 45 °C
Relative Humidity
Operating: 10 to 80% (non-condensing)
Non Operating: 10 to 95% (non-condensing)
Transportation: 10 to 95% (non-condensing)
Current
Consumtion
Standby/Sleep: 50mA (Avarage current max.)
During starting / Seek: 1500mA
(Max spikes less then 1ms)
MTBF
60.000POH (10% duty)
Safety Standards
Approved by UL, CUL, TÜV, CE and BSMI
Storage
Linecard Displays
For up-to-date HMI solutions, RUTRONIK EMBEDDED offers all types of TFT & LCD displays with separate or integrated touch
function in all technologies. These include high-end and low-cost models, displays for indoor and outdoor use with excellent clarity
of display even in direct sunlight, expanded temperature range and a high degree of robustness. The sizes range from diagonals of
2.4 to 90 inches for active TFT and many different passive LCD solutions. Also semi and full customization is possible.
Character- and Graphicmodules
x
x
Customized Modules
x
x
Turn Key Solutions
x
ES&S
DLC
x
DMC
Displaytech
x
Technology
Advantech
Type
Alpha Display
Displays & Accessories
TFT-Displays
TFT-Displays
Smart Panels incl. Controller
x
x
SKD-Kits incl. Controller, Cable, Power Supply
x
x
Professional Monitors
Passive LC-Displays
OLED's
x
Bi-Stable Displays
Accessories
Inverter
Cables and Connectors
x
x
Touches
x
Linecard
Tianma
Tianma – NLT
URT
YB
Varitronix
TDK
Sharp
Powersystems
Ecodream
Higgstec
HanTouch
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Linecard
ch
Tou
p
a
d
C
ude
incl
TFT Technology by TNE
SFT Technology
Standard Industrial Line
(Super Fine TFT)
■ Long-term availability
■ Long time phase-out-strategy
for industrial applications
■ 3.3 V operation
■ True Colour with brilliant
colours
■ Dual clock interface
for EMI reduction
■ Flicker-free
■ Fast response times
■ Wider viewing angle with
Super-Fine technology
(up/down ±85°)
Interface
Inch
RGB LVDS SFT EVT
CM
Technolgy Resolution
Backlight
Touch incl.
LED CCFL res. cap.
5.7
15
X
X
QVGA / VGA
X
6.5
17
X
X
X
VGA / XGA
X
7
18
X
X
WQVGA / WVGA
X
8
20
X
WVGA
X
8.4
21
VGA / SVGA / XGA
X
8.9
22
X
WSVGA
X
9
23
X
X
WVGA / Full HD
X
10.4
26
X
X
VGA / SVGA / XGA
X
X
10.6
26.5
X
X
WXGA
X
X
12.1
31
X
X
X
SVGA / XGA / WXGA
X
X
X
XGA
X
X
X
X
X
X
X
X
X
15
38
X
X
15.3
39
X
X
WXGA
15.6
40
X
X
FWXGA / Full HD
X
17
43
X
SXGA
X
19
48
X
X
SXGA
X
21.3
53
X
X
UXGA / QXGA
X
X
X
Interface
Inch
RGB LVDS SFT EVT
CM
X
Technolgy Resolution
Backlight
Touch incl.
LED CCFL res. cap.
7
18
X
WVGA
X
8.4
21
X
SVGA
X
10.4
26
X
SVGA
12.1
31
X
SVGA / XGA
X
15
38
X
XGA
X
TNE offers products with pixel density of up to 200 pixels/
inch and resolution of up to 5M pixel displays. That means
customers enjoy faithful reproduction of high-precision
images down to the finest details – from the fine text and
lines of CAD and DTP to the delicate nuances of nature
images and imaging data for medical purposes.
Quick response
TNE is developing the SFT technology, which features low
dependence on response time between gray-scale levels, to
achieve uninterrupted full-motion video.
Ultra-wide viewing angle, reduced color shift
Basic Line
Display Size
With the SA-SFT and UA-SFT technologies TNE has
achieved improved panel transmissivity, resulting in higher
luminance and wider color gamut displays allowing
customers to view clear and vivid color images in bright
environments.
High definition
TFT Standard Industrial Line
Display Size
High luminance, wide color gamut
LCDs with SFT Technology feature a new ultra-wide 170°
(right/left and up/down) viewing angle while minimizing the
color shift phenomenon that occurs as luminance changes
with viewing angle. The result is a new and definitive benchmark in image quality with virtually no color deviation a great picture no matter how you look at it.
* Still available, but EOL
TFT Displays
T-EVT
R-EVT
Transmissive
Transmitted Light
Reflected Light
Transmitted Light
Reflected Light
Transmitted Light
Transparent
Electrode
Backlight Unit
Transparent Electrode
Transflective Film
EVT Technology
(Enhanced View TFT)
Reflective Electrode
Projected Capacitive
Touch Panel
R-EVT guarantees high-visibility in all
outdoor light environments
PCAP by TNE as a one-stop shop solution
R-EVT maximizes the high ambient light visibility features
of a reflective-type LCD along with the low ambient light
visibility features of a transmissive-type LCD to deliver high
picture quality in all possible light environments.
R-EVT: Reflective EVT
T-EVT: Transmissive EVT
TNE provides factory installed touch panels which have an
external touch controller as option. Thanks to the in-house
design and manufacturing capabilities they are able to offer high
quality, integrated PCAP products direct from the factory as a
one stop shop solution with full factory warranty.
T-EVT brings you the clearest, sharpest pictures
under the sun
This revolutionary new T-EVT is a transmissive type that
guarantees bright, easy-viewing displays even in bright sunlight. It’s the history-making forerunner of a new generation
of LCDs unaffected by changes in natural light - for bright,
vivid color displays anytime.
TNE provides factory tuned PCAP products, drivers and offer
special tuning software as part of TNE total PCAP solutions,
in order to better support customer´s needs and help ease
adoption of TNE´s PCAP based modules.
Due to the fact that the requirements of the customers are very
individually, most requests need to be handled as a custom
solution. Customized options are different surface film, optical
bonding and customized cover glasses.
TFT Displays
TFT Technology by U.R.T.
Product Portfolio Touch
U.R.T. products are widely applied in a broad range of applications and markets.
Size
With advancing technologies in digital, dot matrix and graphic
LCD panels and modules, U.R.T. is always committed
to produce LCD products with the highest level of contrast,
wide viewing angles, long life, and high reliability.
Res. Touch
Proj. cap. Touch
3.5“ (8.89 cm)
X
X
4.3“ (11 cm)
X
X
5.7“ (14.48 cm)
X
X
7“ (17.78 cm)
X
X
Product Portfolio TFT
Display Size
Interface
Inch
CM
2.4
6
CPU
X
RGB
Resolution
LVDS
2.8
7.1
X
3.5
8.9
X
X
4.3
11
X
X
5.7
14.5
X
X
X
7
17.8
X
X
X
SPI
X
Backlight
Lifetime
Touch incl.
LED
hours
res.
QVGA
X
10k
X
cap.
QVGA
X
20k
X
X
QVGA
X
50k
X
X
WQVGA
X
50k
X
X
QVGA / VGA
X
50k
X
X
WVGA
X
50k
X
X
TFT Displays
TFT Technology by Yeebo
Yeebo with the headquarter located in Hong Kong is producing with multiple, highly automated production lines
which have latest state of the art equipment to meet the
requirements of most applications.
With their experienced and professional design team they
are able to tailor their service to meet every individual
need from the customers. With a portfolio with a focus on
1,44” up to 7” and some additional panels up to 12,1” they
meet the requested sizes and features for the European
industrial market.
TFT Portfolio
Size
inch
cm
Resolution
Interface
1.44
3.6
128x128
CPU
1.5
3.8
160x240
serial 8 bit
1.77
4.5
128x160
CPU
2.0
5
176x220 / 240x320 /
160x240
CPU / RGB /
serial 8 bit
2.4
6
240x320 / 160x234 /
CPU / RGB / SPI
2.7
6.9
320x240
RGB
2.8
7
240x320 / 320x64
CPU / RGB / SPI
3.0
7.6
240x320
serial 8 bit
3.2
8.1
240x320
RGB
3.5
8.9
320x240 / 320x480
SPI / RGB / MCU
/ MIPI
4.0
10
480x800
RGB / MIPI
4.3
11
480x272
RGB
X
4.5
11.5
480x854
MIPI
X
5.0
12.7
800x480 / 480x272
RGB
X
X
5.5
14
720x1280
MIPI
7,0
17,8
800x480 / 800x1280 /
1024x600
RGB / MIPI /
LVDS
X
X
8,0
20,3
800x1280
MIPI
9,0
23
800x480
RGB
10,1
25,7
1280x800 / 1024x600
LVDS
12,1
31
1024x768
LVDS
TFT Displays
Res.
Touch
Cap.
Touch
X
X
X
X
X
X
TFTs & OLEDs
Rutronik‘s new partner DLC offers monochrome, TFT and
OLEDs including further components related to displays. DLCs
convinces with its wide range of products, especially in the field
of TFTs and OLEDs. We are able to offer a big choice of transflective, high-brightness and IPS technologies and guarantee
excellent viewing angles and high temperature ranges. Our collection boasts more than 200 TFT and monochrome displays,
as well as over 20 models of monochrome OLED displays, all of
which are available in sizes ranging from 1.4 to 19 inches.
Size
RGB/MPU-Interface
MPU
LVDS-Interface
Resolution
LED-BL
1.44" (3.66cm)
x
128x128
x
1.77" (4.50cm)
x
128x160
x
2" (5.08cm)
x
176x220, 240x320
x
2.2" (5.59cm)
x
240x320
x
x
240x320
x
960x240
x
2.4" (6.10 cm)
2.5" (6.35cm)
x
Touch
x
2.8" (7.11cm)
x
240x320
x
x
3.2" (8.13cm)
x
x
QVGA
x
x
3.5" (8.89cm)
x
x
QVGA / 320x480 / VGA
x
x
x
480x800
x
x
WQVGA
x
WQVGA
x
4.0" (10.2cm)
4.3" (11cm)
x
4.7" (11.94cm)
x
WQVGA / VGA / WVGA
x
5.6" (14.22cm)
x
x
VGA
x
5" (12.70cm)
x
x
5.7" (14.48cm)
x
QVGA / VGA
x
x
6.0" (15.24cm)
x
WVGA
x
x
6.2" (15.75cm)
x
6.5" (16.51cm)
x
7" (17.78cm)
x
8" (20.32cm)
x
8.4" (21.37cm)
x
WVGA
x
x
VGA
x
x
WVGA / WSVGA
x
x
x
SVGA / WVGA / XGA
x
x
x
SVGA
x
9.0" (22.86cm)
x
x
WXGA
x
x
9.7" (24.64cm)
x
x
XGA
x
x
x
WSVGA / WXGA
x
x
WVGA
x
10.1" (25.65cm)
10.2" (25.91cm)
x
10.4" (26.42cm)
x
x
SVGA / XGA
x
x
11.6" (29.47cm)
x
WSVGA
x
x
12.1" (30.73cm)
x
SVGA
x
x
15.0" (38.1cm)
x
XGA
x
x
17.0" (43.18cm)
x
SXGA
19.0" (48.26cm)
x
SXGA
TFT Displays
x
OLEDs offer many
advantages over both
LCDs and LEDs:
The plastic, organic layers of an OLED are thinner, lighter and
more flexible than the crystalline layers in an LED or LCD.
Because the light-emitting layers of an OLED are lighter, the substrate of an OLED can be flexible instead of rigid. OLED substrates
can be plastic rather than the glass used for LEDs and LCDs.
OLEDs are brighter than LEDs. Because the organic layers of an
OLED are much thinner than the corresponding inorganic crystal
layers of an LED, the conductive and emissive layers of an OLED
can be multi-layered. Also, LEDs and LCDs require glass for support, and glass absorbs some light. OLEDs do not require glass.
OLEDs do not require backlighting like LCDs. LCDs work by
selectively blocking areas of the backlight to make the images that
you see, while OLEDs generate light themselves.
Because OLEDs do not require backlighting, they consume much
less power than LCDs. This is especially important for batteryoperated devices such as cell phones.
OLEDs are easier to produce and can be made to larger sizes.
Because OLEDs are essentially plastics, they can be made into large, thin sheets. It is much more difficult to grow and lay down so
many liquid crystals.
OLEDs have large fields of view, about 170 degrees. Because LCDs
work by blocking light, they have an inherent viewing obstacle
from certain angles. OLEDs produce their own light, so they have a
much wider viewing range.
DLC P/N
Size (Inch)
Dot Format
A.A. (mm)
Outline Size (mm)
Interface
Colors
Remarks
DLC0066ANOG-1
0.66
64x48
13.42x10.06
18.46x18.10
Parellel/SPI/I2C
Blue
Monochrome
DLC0091CNOG-W
0.91
128x32
22.384x5.584
30.00x15.50
SPI/I2C
White/Blue
Monochrome
DLC0095AVOG
0.95
96x64
20.14x13.42
24.80x22.42
Parellel/SPI
Full Color
Passive Color
DLC0095ENOG-W
0.95
96x64
19.95x13.42
24.90x22.95
Parellel/SPI/I2C
White
Monochrome
DLC0096AVOG
0.96
128x64
21.74x11.18
15.40x26.70
Parellel/SPI/I2C
White/Blue
Monochrome
DLC0104AVOG-W-1
1.04
128x32
25.58x6.38
30.40x24.30
Parellel/SPI/I2C
White
Monochrome
DLC0110ANOG-W
1.10
128x36
26.86x7.54
31.40x16.20
Parellel/SPI/I2C
White
Monochrome
DLC0110BNOG
1.10
96x96
19.852x19.852
25.90x30.10
Parellel/SPI/I2C
Full Color
Passive color
DLC0113AUOG-Y
1.13
128x128
28.80x28.80
37.62x41.31
Parallel/Serial
Yellow/Green
Passive Color
DLC0127ANOF
1.27
128x96
25.71x19.28
33.70x26.90
Parellel/SPI
Full Color
Passive Color
DLC0130ANOG-W
1.30
128x64
29.42x14.70
34.50x23.00
Parellel/SPI/I2C
White
Monochrome
DLC0145BNOF
1.45
160x128
28.78x23.02
35.80x30.80
Parallel/SPI/RGB
Full Color
Passive Color
DLC0146AVOF
1.46
128x128
26.28x26.28
33.50x54.33
SPI
Full Color
Passive Color
DLC0150BNOF
1.50
128x128
26.86x26.86
33.80x34.00
Parallel/SPI
Full Color
Passive Color
DLC0154BNOG
1.54
128x64
35.06x17.52
45.24x29.14
Parellel/SPI/I2C
Yellow/White
Monochrome
DLC0169ANOF
1.69
160x128
33.58x26.87
39.90x34.00
Parallel/RGB/SPI
Full Color
Passive Color
DLC0223ANOG
2.23
128x32
55.02x13.10
62.00x24.00
Parellel/SPI/I2C
Blue/Yellow
Monochrome
DLC0240ACOG-3
2.40
240x320
36.72x48.96
44.72x59.46
MPU/Serial/RGB
Full Color
Passive Color
DLC0242AVOG
2.42
128x64
55.01x27.49
60.50x55.60
Parellel/SPI/I2C
Yellow/White
Monochrome
DLC0242BNOG
2.42
128x64
55.01x27.49
60.50x37.00
Parellel/SPI
Yellow/Green
Passive Color
DLC0270ANOF-1
2.70
128x64
61.41x30.69
73.00x41.86
Parellel/SPI
Yellow
Monochrome
DLC0270ANOF-W
2.70
128x64
61.41x30.69
73.00x41.86
Parallel/SPI
White
Passive Color
DLC0280ANOF
2.80
256x64
69.10x17.26
84.00x25.80
Parallel/SPI
Yellow/Blue
Monochrome
DLC0293ANOG
2.93
20x2
73.52x11.52
84.50x19.28
Parallel/SPI/I2C
White/Yellow
Characters
DLC0312ANOF
3.12
256x64
76.78x19.18
88.00x27.80
Parallel/SPI
G/B/W/Y
Monochrome
DLC0550ANOF
5.50
256x64
135.65x33.89
146.00x45.00
Parallel/SPI
Green
Monochrome
TFT Displays
TFT Color Modules
TFT Color Modules
The following TFT Color graphic modules are produced in their
own TFT factory in Shanghai. This will greatly benefit Tianma
and their customers by guaranteeing long-term availability
of the products.
With currently three 4.5 TFT production lines and one 5.0G TFT
production line Tianma Group is now one of the largest manufacturers of small and medium size TFT modules worldwide.
Display Size
Interface
CPU
RGB
Tianma‘s products offer a lot of technical advantages such as
wide viewing angle, high contrast, high brightness and fast
response time and are produced for industrial, telecommunication
and automotive applications.
■ High Brightness
■ Long life time
■ High reliability
■ Semi-customized
■ Long supply guarantee
Resolution
Inch
CM
1.44
3.7
LVDS
SPI
X
Backlight
Lifetime
LED
hours
128x128
X
20k
1.6
4.1
MIPI
256x320
X
20k
1.77
4.5
X
128x160
X
20k
2.0
5.1
176x220
X
20k
2.2
5.6
QVGA
X
20k
2.4
6.1
X
QVGA
X
20k
2.8
7.1
X
QVGA
X
20k
3.0
7.6
X
QVGA
X
20k
X
X
X
Touch incl.
res.
X
X
3.5
8.9
X
QVGA /VGA
X
20k
X
3.7
9.4
X
VGA
X
50k
X
4.0
10.2
X
WVGA
X
20k
4.3
10.9
X
WQVGA
X
20k
4.6
11.7
MIPI
720x1280
X
20k
MIPI
720x1280 / VGA / WVGA
X
20k / 50k
MIPI
720x1280
X
20k
320x234
X
20k
MIPI
QVGA / VGA / 720x1280
X
50k
WVGA
X
20k
X
5.0
12.7
5.5
14.0
5.6
14.2
X
5.7
14.5
X
6.2
15.7
X
6.5
16.5
X
VGA
X
30k
7.0
17.8
X
X
WVGA / WSVGA
X
20k
8.0
20.3
X
X
SVGA / XGA
X
20k
8.4
21.3
X
X
SVGA
X
50k / 30k
10.4
26.4
X
SVGA
X
50k
15.0
38.1
X
XGA
X
tbd.
TFT Displays
cap.
X
X
X
X
X
X
X
X
X
TFT Technology by Alpha Display
Alpha Display
■ Founded 2004 in Seoul, South Korea. Products are interesting for customers who need complete solutions (plug and play versions).
Alpha Display is supplier and manufacturer. Applications could be: Information systems (train/buses), vending machines, gaming
machines, industrial infoterminals.
Industrial Displays
Transportation (Railway & Vehcile Display)
■ Available as open frame, chassis frame,
panel mount, rack mount
■ 5.7“ - 32“ panel - VGA to WQXGA resolution
■ Integrated A/D Board / Inverter
■ RGB, DVI & Composite input
■ ROHS, CE Compliance
■ 8.4“ - 32“ panel - SVGA to full HD resolution
■ RGB, DVI, HDMI, Display port, Video Input
■ Various touch screen &
protection glass available
Super Slim Display
Sunlight Readable Display
■ 12.1“ - 24“ Panel- SVGA to Full HD, WUXGA resolution
■ Slimmer thinkness design
■ Various touch screen & protection glass available
■ Intergrated A/D Board /Inverter
■ 15“, 19“ and 32“ panel available
■ High brightness 1000cd/m²
■ RGB, DVI, HDMI, Display port, Video Input
Water-Proof Monitor
Panel PCs
■ 15“ - 19“ panel - XGA to SXGA resolution
■ ALL IP65 (NEMA4) GRADE
■ Intergrated A/D Board / Inverter
■ Industrial grade PC
■ Ultra slim wall mount type
■ CPU: Intel Atom N270 / D525 Processor
TFT Displays
Touch Systems
Resistive Touch Technologies
A resistive touch sensor has two layers that are not in
contact with each other
■ An outside flexible layer, coated on the inside
with a conductor, e.g. ITO (Indium Tin Oxide)
■ Non-conductive separator "dots", e.g. mica or silica,
small enough to not be noticeable
■ An inside supporting layer of glass,
coated on its face with conductor (ITO)
Around the outside of the viewing area is a printed circuit
pattern. When the outside flexible layer is pressed against
the inside layer, the resulting voltages can be measured in
more than one direction. By comparing these voltages to
the starting voltage, the point where the touch happened
can be calculated. Resistive sensors are simple and relatively
inexpensive. The flex required to push the surfaces together
can eventually fail the flexible layer.
The flex requires some pressure, so force is required to
make contact. The presence of two layers in addition to
the LCD can reduce brightness by 10-20%. On the plus side,
a new flexible glass outer layer is now available to improve wear and chemical resistance. Overall, the technology is
simple and predictable, so resistive sensors remain the most
common form of touch sensor.
4 wire resistive
4 wire Glas / Glas
5 wire resistive
Inch
cm
Inch
cm
Inch
cm
2.9 - 4
7.4 - 10.2
5
12.7
6.5
16.2
4.3
11
5.7
14.5
7
17.8
5.7
14.5
7
17.8
8.4
21.4
6.4
16.3
8.4
21.3
10.4
26.4
7
17.8
10.4
24.5
12.1
30.7
7.5
19
12.4
30.7
15
38.1
8
20.3
15.1
38.5
17
43.2
8.4
21.3
17.1
43.5
19
48.3
10.4
26.5
Available as Clear type,
and as AG/AR type
20.1
51
12.1
30.8
22
55.9
15
38.1
24
61
17
43.2
19
48.3
USB Controller:
ETP-MB-5000UECG
RS-232 Contr.:
ETP-MB-5000RECG
USB Controller: HT-EBU4-3
RS-232 Contr.: HT-EBS4-2
TFT Displays
Capacitive Touch Technologies
A capacitive touch sensor is a simple supporting sheet of
glass with a conductive coating on one side. Around
the outside of the viewing area is a printed circuit pattern.
This pattern sets a charge across the surface, which is disturbed
by the finger touching the screen. There are various
technologies that detect the touch differently: some can even
detect near-touches without making contact. All capacitive
sensing methods look for electrical disturbance, so the electrical
characteristics of the touching object are important.
One finger is much like another, but a glove, a stylus or other
types of objects may change the response or not respond at all.
Capacitive sensors are built right on a single glass layer. They
don't break down by from flexing, but they may be subject to
abrasion of the ITO coating. The single layer transmits light well,
so brightness reduction is only 5-15%. The contact requires no
pressure, so the force required to make touch is insignificant.
SAW-Touch
Cap. Touch
IR Touch
Inch
cm
Inch
cm
Inch
cm
5.8
14.7
8.4
21.4
15
38.1
6.8
17.3
10.4
26.4
17
43.2
7.3
18.5
12.1
30.8
19
48.3
8.5
21.6
15
38.1
32
81.3
10.8
27.4
17
43.2
42
106.7
12.4
31.5
19
48.3
Options: AG / AR, 6mm Glas
15.7
39.9
21
53.3
17.5
44.5
22
55.9
19.4
49.3
22.4
56.9
Controller: HAT-EBUS-2
Options: clear, AG or AR
and antivandalism type
26.3
66.8
31.8
80.8
Controller: C-3100
Proj. Cap. Touch
Projected Capacitive Technology
Projected Capacitive Touch (PCT, also PCAP) technology
is a variant of capacitive touch technology. This technology
allows two points recognition and light touch inputs. Work
with gloves as well as cover glass make flat designs possible.
These features make the technology a good choice for
industrial and medical applications.
Inch
cm
5.7
15.5
6.5
16.4
7 wide
17.8
8.4
21.3
9 wide
23
10.4
26.4
12.1
30.8
15
38.1
17
43.2
19
48.3
22 wide
55.9
Features
■ High durability
■ High transmission
■ Water resistance
■ Two points touch is available
■ Input with glove is possible
■ High resolution
Controller USB/RS232
available
TFT Displays
Passive LCD Modules
Rutronik’s application team – the engineering bridge to a wide
field of display solutions with an excellent supplier portfolio.
The main area of activities of our display department is to
offer customised solutions. Due to our experience in the
display market we will provide you with the best solution and
the most suitable manufacturers for your requirements.
The philosophy of the display department is to give you our
best engineering consultancy in project work. We are the
worldwide interface between customers, suppliers, R+D,
Quality Management, Production and Purchase Department.
Technology
Dot Color /
Background
Features
TN, HTN
black / grey
optional other
TN (Twisted Nematic) / HTN (Higher Twisted Nematic)
is the most cost-effective technology
STN / grey,
silver, blue
dark blue /
yellow green
STN (Super Twisted Nematic) twisting angle up to 270°
which gives almost ideal steepness of the
characteristic optoelectronic curves improvement of
the viewing angle
FSTN
black / white
FSTN (Film Super Twisted Nematic) high-contrast black
and white representation by utilization of a
decelerating film more cost-effective, lighter and flatter
than DSTN
Vertical Alignment
Optional /
black
VA, super black background, super wide viewing angle,
high contrast ratio
FSC
Optional /
positive,
negative
FSC (Field Sequential Colour) No need of colour filter,
low power consumption
FFSTN
black / white
negative
FFSTN (Double Film Super Twisted Nematic)
high-contrast black and white negative
mode display optimal performance with white or
multicolor backlights more cost-effective,
lighter and flatter than DSTN ISTN for best contrast
through the whole temp. range
CSTN
color
FSTN with color filter mask (passive matrix) passive
driven not matrix white LED or CCFL illumination
ASTN
color/dark
compensation retardation film, low transmittance &
high contrast
TN (Twisted Nematic) Displays
STN, Yellow-Green
G
STN, Blue mode
d
FSTN, positive, white Backlight
FSC (Field Sequential Colour)
FSTN, graphic
g
ght
LCD, RGB Backlight
t
tion
with FPC Connection
Vertical
Alignment
with differentt
backlights
Passive LCD
LCD Standard Modules
Liquid crystal displays, in the form of passive matrix LCD´s,
are increasingly found in all areas of everyday life.
Their use is no longer restricted to technical applications.
We are able to fulfil your standard passive LCD requirements
with a lot of different module types. In which you can choose
several individual parameters, like nearly all kinds of backlight
colours, different temperature ranges and different technologies.
We cover the most common alphanumeric and graphic LCD
sizes. All displays are available in transmissive, transflective
and eflective mode.
Passive LCD Modules from Displaytech
FSTN with green backlight
ght
STN yellow-green,
ll
positive
ii
STN blue
uue
e mode,
mode
positive, white Backlight
yellow greenn
STN yellow-green,
positive, yellow-green Backlight
STN, COG
STN
FSTN, negative,
negative
white Backlight
FSTN, negative, blue Backlight
Characters x
Lines
Model Number
Module Size
W x H [mm]
View. Area
W x H [mm]
16 x 1
161A
80.0 x 36.0
64.5 x 13.8
16 x 2
162A
80.0 x 36.0
64.5 x 13.8
16 x 2
162B
84.0 x 44.0
65.6 x 16.0
16 x 2
162C
80.0 x 36.0
64.5 x 14.8
16 x 2
162COG
66.0 x 27.7
61.0 x 15.7
16 x 2
162D
85.0 x 30.0
62.0 x 16.0
16 x 2
162E
80.0 x 36.0
65.6 x 16.0
16 x 2
162F
122.0 x 44.0
99.0 x 24.0
16 x 4
164A
87.0 x 60.0
61.8 x 25.2
20 x 2
202A
116.0 x 37.0
85.0 x 19.8
20 x 2
202B
122.0 x 44.0
99.0 x 24.0
20 x 4
204A
98.0 x 60.0
76.0 x 25.2
20 x 4
204B
98.0 x 60.0
76.0 x 25.2
24 x 2
242A
118.0 x 36.0
93.5 x 15.8
40 x 2
402A
182.0 x 33.5
154.5 x 15.8
Displaytech offers a wide variety of standard display products to meet the
requirements of your specific application. From monochrome graphic displays
to segmented TN LCDs, Displaytech has many standard products that are
commercially available off the shelf and suitable for most industrial, medical
and consumer products.
Each of the standard products is unique due to the display technology, diagonal
size or integrated display controller. To simplify your search for the perfect
display, Displaytech provides all documentation relevant to each LCD module
on the specific product page. Next to each product you will find the following
items: data sheets for both the display and the integrated driver IC.
Passive LCD
LCD Standard Modules
Passive LCD Modules from Displaytech
Diagonal Size [Dots]
Model Number
Module Size
W x H [mm]
View. Area
W x H [mm]
122 x 32
32122A
65.6 x 29.2
54.8 x 19.1
122 x 32
32122B
56.1 x 29.2
49.1 x 19.0
128 x 32
32128A
41.3 x 19.7
36.1 x 9.9
160 x 32
32160A
100.0 x 38.8
80.0 x 20.5
128 x 64
64128K
58.2 x 41.7
50.0 x 25.0
128 x 64
64128KX
58.2 x 41.7
50.0 x 25.0
128 x 64
64128L
68.8 x 49.2
60.6 x 33.1
128 x 64
64128LX
68.8 x 49.2
60.6 x 33.1
128 x 64
64128M
77.4 x 52.4
70.0 x 40.0
128 x 64
64128MX
77.4 x 52.4
70.0 x 40.0
128 x 64
64128N
74.0 x 41.7
50.0 x 25.0
128 x 64
64128P
93.0 x 70.0
70.7 x 38.8
128 x 64
64128Q
75.0 x 52.7
60.0 x 32.5
240 x 64
64240B
180.0 x 65.0
132.6 x 39.0
240 x 64
64240C
144.9 x 56.4
132.6 x 39.0
320 x 240 3.9" QVGA
240320E
91.5 x 70.5
80.55 x 61.1
320 x 240
240320FP
91.4 x 109.7
100.0 x 76.0
320 x 240 4.7" QVGA
240320G
109.7 x 91.4
100.0 x 76.0
320 x 240 3.9" QVGA
240320H
9.0 x 70.5
80.5 x 61.1
320 x 240
240320JP
70.5 x 91.5
61.1 x 80.55
240 x 128
128240A
144.0 x 104.0
114.0 x 64.0
240 x 128
128240C
77.4 x 52.4
70.0 x 35.0
240 x 128
128240D
98.7 x 67.7
92.0 x 53.0
FSTN, graphic LCD
LCD,
D
fl ti
positive mode, reflective
FSTN, graphic LCD,
negative mode, RGB backlight
CD
CD,
D
FSTN, graphic L
LCD,
te backlight
blue mode, white
FSTN, graphic L
LCD,
CD
CD
CD,
e white backlight
ght
htt
negative mode,
ey mode,
STN, grey
kli ht
white backlight
FSTN, graphic
ic
c LCD,
ht
RGB backlight
TN, graphic LCD,
LCD
CD,
D
FSTN,
e mode
blue
mode, white backlight
FSTN, graphic
raphic
phic LCD,
CD
D
cklight
amber backlight
Displaytech offers a full line of monochrome COG and graphic LCD modules
with or without your choice of backlight. Our selection of 128x64, 128x32,
128x240 and 240x64 graphic FSTN LCD modules are our most popular! The
popularity of these displays allows Displaytech to offer highly competitive
pricing and flexible stocking options.
Passive LCD
EBN
OFF
ON
AC
Custom Design LCD Modules
Electric
Feld
Custom Design LCD Modules
Vertical Alignment
Customized Displays are manufactured according to the
specification of our customers. Depending up on the size of
the LCD panel and the LCD technology a reasonable minimum order quantity is required.
With the Vertical Alignment technology the Liquid Crystal
molecules are perpendicular. Vertical Alignment leads to a
very dark background and wide viewing angle.
Suitable for low and medium information content,
automotive, industrial and medical applications.
Module Technologies
Main Advantages of Vertical Alignment:
■ Super black background
■ Suitable for all kinds of colour
■ Super high contrast ratio
■ backlight and white backlight
■ Super wide viewing angle ■ Wide temperature range
(-30°C - 85°C )
Rutronik´s partners are implementing a variety of integrated circuit mounting techniques in designs of printed circuit
boards used with standard and custom made liquid crystal
modules. The company has a full production line for incorporating surface mount technology (SMT), chip on board
(COB), tape automated bonding (TAB) and flexible print
circuit (FPC). TIANMA contributes solutions to the markets
burgeoning demand for chip on glass (COG) technology.
Field Sequential Colour (FSC)
With the new FSC-Technology there is no need to insert
Colour Filters to portray the coloured Icons. In a FSC
module a conventional TN-Cell is combined with a RGB
Backlight. The 3 colours of the LED Backlight are sequentially switched on.
The frequency of the Backlight is synchronous with the
frequency of the display segments. As a result you can
show up to 8 different colours (black, blue, green, cyan,
red, magenta, yellow or white).
Main Advantages of FSC:
■ No need of Colour Filters
■ LCD glass is very economical due to
■ the TN COG technology
■ No need of High-end Microprocessors
Display Accessories
Rutronik is also able to supply different accessories for your
LCD´s from our selected suppliers, as well as integration of
turn key components.
It is possible to add other components like keys, LED´s or
special connectors to a custom design LCD module.
With these options Rutronik and our partners can offer the
complete solution to customers.
Connectors
■ Rubber
■ Connector
■ Pins
■ FPC
■ Heatseal
Backlight
■ LED
■ CFL
■ EL
Bezel
■ Plastic
■ Metal
Touchpanel
■ Resistive
Conductor
Insulator
Customized Displays are manufactured according to the specification of our
customers. Depending upon the size of the LCD panel and LCD technology a
reasonable minimum order quantity is required. Our team will consult you with
the most fitting supplier for your customized LCD project. We will support you
for the whole project-life-time, beginning from the first drawings up to the first
samples producion and final mass producion.
Passive LCD
Professional Monitors
BIG PAD – It’s the smarter way to work together on projects, share ideas and
enjoy more effective meetings.
PN-70TB3/TC3
PN-70TA3
■ 176,6 cm diagonal (70")
■ 1.920 x 1.080 pixels
■ Infrared 10-point-touch up to 4 user
(TC3: 6-point-touch)
■ Contrast 3.000:1
■ Edge LED
■ Including whiteboard software
■ Including Touch Display Link 2.0 (TB3 only)
■ Max. power consumption: 225 W
■ 1.920 x 1.080 pixels
■ Infrared 10-point-touch up to 4 user
■ Contrast 3.000:1
■ Edge LED
■ Including whiteboard software
■ Touch Display Link 2.0 pre-installed
■ Quick start with embedded computer
PN-60TB3
PN-80TC3
■ 1.920 x 1.080 pixels
■ Direct LED
■ P-cap touch
■ Max. power
consumption: 260 W
PN-60TA3
■ Touch Display Link 2.0 pre-installed
■ Quick start with embedded computer
Touch Pen Adapter & Touch Pen
Monitors
80˝
70˝
60˝
■ Boardrooms
■ Educational Rooms
■ Presentation Rooms
■ Classroom Interactions
Accessories
BIG PAD
Mobile stand 60"-80"
Wall mounting, lockable
Wireless keyboard & mouse
Fujitsu Esprimo Q520 PC (incl. OS)
Monitors
HDMI cable
Linecard Sensors
The Sensor market is growing constantly and is nowadays one of the most important growth drivers. One of the main technologies enabling innovative applications or even new features is Microelectromechanical Systems (MEMS). With accelerometers, gyroscopes, microphones and pressure sensors of STMicroelectronics and Bosch, our linecard includes the MEMS market
leaders and technology drivers. Our mission is to enable our customers to create the most innovative and efficient products in
their markets.
Rutronik Sensor Specialist & more ...
Bosch
Bosch
Automotive Sensortec
Electronics
Magnetic
Hall Switch
BYD
Comus
standard
Diodes
Inc.
a
programmable
I
C
I
C
Epson
Everlight
a
differential
Hall Linear
Magneto
Resistive
MEMS
I
LiteOn
Melexis
C
A
I
C
A
I
C
A
I
C
A
I
C
A
I
C
A
I
C
A
I
C
C
standard
I
C
I
C
programmable, analog
A
I
C
A
I
C
programmable, digital
A
I
C
A
I
C
A
I
C
I
with EC
C
without EC
I
C
I
C
Gyro
A
I
C
I
C
Pressure
A
I
C
I
C
analog
I
C
digital
I
C
eCompass
I
C
I
C
I
C
Accel + Gyro
A
I
C
A
I
C
I
C
I
C
Ambient Light
I
C
Transmissive
Reflective
Shunt monitors
A
I
I
C
A
I
C
I
C
A
I
C
I
C
A
I
C
A
I
C
I
C
I
C
I
C
I
C
I
C
I
C
I
C
I
C
Sensor modules
analog
a
C
a
I
C
I
C
I
C
I
C
a
I
C
I
C
I
C
a
I
C
I
C
I
C
A
I
C
I
C
I
C
I
Hall based ICs
Temperature
A
Intersil
C
I
Proximity
Current
Infineon
I
C
> 6 DoF
Optical
C
I
A
x DoF
Modules
I
2x, one package
Acceleration
Microphone
Honeywell
I
C
I
C
I
C
I
C
C
digital
I
Humidity, Gas, Flow
A
Linecard
C
Automotive qualified preferred
a
Automotive qualified on request
Microchip
Micronas
A
I
C
A
I
C
A
I
C
A
I
C
A
I
C
A
I
C
A
I
C
Murata
NJRC
Omron
Osram
Panasonic
a
I
Rohm
Kionix
C
I
Sensirion
STMicroelectronics
Vishay
C
standard
Hall Switch
I
differential
2x, one package
I
standard
Hall Linear
programmable, analog
programmable, digital
I
C
with EC
Magneto
Resistive
without EC
A
I
C
a
I
C
A
I
C
Acceleration
A
I
C
a
I
C
A
I
C
Gyro
A
I
C
I
C
a
I
C
a
I
C
analog
I
a
A
I
I
C
a
I
I
a
I
C
C
C
a
C
C
a
I
C
digital
I
C
a
I
C
eCompass
a
I
C
a
I
C
Accel + Gyro
a
I
C
a
I
C
I
C
I
C
a
I
C
I
C
I
C
a
I
C
I
C
I
C
a
I
C
I
C
I
I
Microphone
x DoF Modules
> 6 DoF
C
A
I
MEMS
Pressure
a
A
A
Magnetic
programmable
I
C
Ambient Light
I
C
Proximity
I
C
Transmissive
I
C
C
Reflective
Shunt monitors
C
Optical
Current
Hall based ICs
Sensor modules
a
I
C
a
I
C
I
a
I
Industrial
I
C
I
C
C
C
a
I
C
a
I
C
I
C
I
C
I
C
analog
Temperature
digital
I
C
Humidity, Gas, Flow
Consumer
Linecard
MEMS –
Application Board
MEMS Sensors
Compatible with all available Bosch Sensortec
MEMS shuttle boards
Accelerometer
Senses the linear acceleration (m/s2), tilt, shocks, free fall,
direction detection, vibrations, linear displacement
Gyroscope
Measures the angular rate (°/s, dps), number of revolution
(spin), rotation of mechanical part
Barometric pressure sensor
Measures absolute atmospheric pressure (mbar),
altitude variation, free fall
■ Versatile, universal demonstration and develompent
environment for Bosch Sensortec sensor products
■ Graphical user interface
■ USB 2.0 full speed interface
■ Flexible power supply
(USB bus powered and battery with charger logic)
Geo-magnetic sensor
Senses the magnetic field (Gauss), pointing absolute
positioning
Microphone
Measures sound and noise (dB) with a high quality level
x DoF Modules
Combination of two or more MEMS sensor types in
one package offering multiple Degrees of Freedom (DoF)
Humidity sensor
Measures the amount of water in air. Used units for
humidity measurement are Relative Humidity (RH) and
Parts Per Million (PPM).
Applications
Mobile
Scrolling, compensated compass, gaming, wireless pedometer,
image stabilization, freefall detection, health monitoring, context
awareness, alarms, activity monitoring, vibration monitoring,
temperature, navigation, weather
forecast, augmented reality
Outdoor & Fitness
Health monitoring,
context awareness,
activity monitoring,
temperature, altimetry
Imaging
Image stabilization, freefall
detection, augmented
reality
Sensors
Home Entertainment
Gaming, scrolling
STEVAL-MKI109V2 –
eMotion Motherboard
Based on the STM32F103RE compatible with all
ST MEMS adapters
■ Compatible with all available ST MEMS adapter boards
■ Controlled by the STM32F103RET6 high
h
performance ARM Cortex™-M3 MCU
■ USB 2.0 full-speed compliant
nt
X-NUCLEO-IKS01A1
MEMS and environmental
tal sensor expansion board for
STM32 Nucleo
The X-NUCLEO-IKS01A11 is a MEMS inertial
and environmental sensorr evaluation board
system and embeds:
■ LSM6DS3 by connectingg the
STEVAL-MKI160V1 DIL24
L24 adapter
■ LSM6DS0TR 3-axis accelerometer
elerometer
+ 3-axis gyroscope
■ HTS221 humidity sensorr
■ LPS25H pressure sensorr
■ LIS3MDL 3-axis magnetometer
tometer
Security
Tampering detection,
wake-up for security
devices, anti-theft
systems
Home Appliances
Vibration monitoring,
temperature, fluid level
management, detections
of shocks, vibrations,
water levels
Industrial & Logistics
Context awareness, alarms,
vibration monitoring,
Out-of-plane detection, fall down
detection, data/goods logger,
“intelligent pallet”
Sensors
Augmented Reality
Augmented reality, compensated
compass, wireless pedometer, image
stabilization, freefall detection, health
monitoring, context awareness,
alarms, activity monitoring, vibration
monitoring, temperature, navigation,
weather forecast, gaming
MEMS Sensors
STMicroelectronics is recognized as a leader in consumer and mobile
market with more than 9 billion MEMS already delivered. Based on ST
advanced proprietary technologies, MEMS address the most innovative
features required on the market. Housed in ultra-compact packages, ST
MEMS achieve a high level of motion-control detection, embedding the
most useful smart functions at minimal power consumption.
Low Power
Accelerometers
High Perform. & High-g
Accelerometers
Industrial Accelerometers
celero
& Gyroscope
e
LIS3DHTR, LIS2DH12TR,
LIS2DE12TR
LIS3DSHTR, LIS2HH12TR, LIS2DGTR*
IIS2DH, IIS328DQ
Q
I3G4250D
Features
■ 3-Axis SPI/I²C accelerometer
■ Selectable full scales: ±2 to ±16 g
■ 12-bit resolution
■ 8-bit resolution for LIS2DE12
■ Embedded FIFO
■ Temperature sensor and self-test
■ Ultra-low power consumption:
- 6 μA in Low Power mode (50 Hz)
- 2 μA in Active mode (1 Hz)
- 0.5 μA in Low Power down mode
Packages
■ LIS3DHTR: 3x3x1 mm³ (LGA-16)
■ LIS2DH12TR, LIS2DE12TR:
2x2x1 mm³ (LGA-12)
Applications
■ Power management
■ Smart user interface
■ Fitness Tracker
H3LIS331DL, H3LIS100DL
Features
Features
■ Selectable full scales: ±2 to ±16 g
■ 14-bit high resolution (LISxxx)
■ 12-bit high resolution (H3LISxxx)
■ Low Noise
■ Selectable full scales: from ±2 to ±16 g
■ Programmable interrupts
LIS3DSHTR
■ 2 state machines embedded with 2 interrupt generators
Highlights
■ 10 years longevity Commitment
■ High Performance and High Quality
even in the harsh industrial environment
LIS2DGTR
■ Pedometer & motion detect. algorithms
■ 256/768 level FIFO
IIS328DQ
■ Extended Temp. Range: -40° to +105°C
■ Package QFN 24L 4x4x1.8 mm³
H3LIS331DL/100DL
■ High g sensor full scale:
±100, ±200, or ±400
00 g;
±100 g for H3LIS100DL
100DL
IIS2DH
■ Ultra-low power consumption – down
to 2 μA
■ Embedded FIFO
■ Package LGA 12L 2x2x1 mm³
Packages
■ 3x3x1 mm³ (LGA-16)
-16)
■ LIS2xxx: 2x2x1 mm³
m³ (LGA-12)
Applications
■ Shock and vibrations
on
ns
monitoring
■ Precise motion
sensing
I3G4250D
■ Selectable full scale 245/500/2000 dps
■ High stability of zero-rate level and
sensitivity
and time
nsitivity over temperature
temp
■ Package
ckage
GA16 4x4x1.1 m
m³
m
LGA16
mm³
* coming soon
Sensors
Automotive
Accelerometer and IMU
AIS328DQ, AIS3624DQ: Automotive
Features
■ AIS328DQ: ±2 to ±8g
■ AIS3624DQ: ±6 to ±24g
■ 12-bit resolution, low power
consump. (<10 μA at 10Hz ODR)
■ AEC-Q100
■ Extended temp. range: -40 to 105 °C
■ QFPN 24L 4x4x1.8 mm³ package
■ Self-test function
ASM330XLH**
Automotive 6-axis IMU
■ VCC: 2.0 V to 3.6 V
■ Power-down and sleep modes
■ 3 independent acceleration channels
and 3 angular rate channels
■ ±2/±4/±8/±16 g selectable full scales
■ ±125/±245/±500/±1000/±2000 dps
selectable full scales
■ Temperature range -40°C to 85°C
■ AEC-Q100 qualification
■ LGA-16L (3x3x1.1mm)
Applications
■ Security systems & tolling systems
■ Motion activated functions
ons
■ Intelligent power savingg
■ Inertial navigation
cs boxes
oxes
■ Telematics
Gyroscopes
6-axis e-Compass
L3GD20HTR, L2G2ISTR: Performance
A3G4250D: Automotive
LSM303CTR, LSM303AHTR*,
LSM303AGRTR
Features
■ 3-Axis SPI/I²C gyroscope
■ High precision, 16-bit resolution
■ High perform. & high stability over temp.
■ Programmable low and high pass filters
Features L3GD20HTR
■ ±250, ±500, ±2000 dps full-scale range
■ Low noise 0.011 dps/√Hz
■ 3x3x1 mm³ (LGA-16)
Features L2G2ISTR
■ ±100 dps / ±200 dps full-scale range
■ Low noise 0.007 dps/√Hz
■ 9.09 kHz Output data rate
■ 2.3x2.3x0.7 mm³ (LGA-16)
3-Axis Magnetic Sensor
■ Full scale selectable
±2 to ±16 Gs (LSM303CTR)
±2 to ±30 Gs
(LSM303AHTR, LSM303AGRTR)
■ For standalone magnetometer
see LIS3MDL
3-Axis Accelerometer
■ From ±2 to ±16g
■ Embedded FIFO and temp. sensor
Features A3G4250D
■ ±245dps full-scale
■ AEC-Q100
■ 4x4x1.1 mm³ (LGA-16)
Applications
■ Image
g Stabilization and virtual realityy
■ Motion control and robotics
■ GPS navigation and
Vehicle tracking
**scheduled
for end 2015
Features
■ 6-Axis SPI/I²C eCompass
■ 16-bit data output
■ 2x2x1 mm³ (LGA-12)
■ Ultra Low Power:
LSM303AHTR, LSM303AGRTR
Applications
■ Compensated compass
■ Map rotation and position detection
■ Indoor and outdoor navigation
■ Magnetic signature movement
recognition
■ Distance Measurement
* coming
i soon
Sensors
OPEN.MEMS
MEMS and environmental sensor
s
expansion board for STM32
32
2 Nucleo
Sensor Fusion software library.
rary.
Open.MEMS is a free and easy-to-use sofware program
for the development of best-in-class MEMS and sensor
applications.
They combine data from several sensors achieving the high
level of accuracy required by portable and wearable devices
and other emerging applications, such as the IoT.
The osxMotionFX sensor fusion library is designed for use a combination
of boards: NUCLEO-F401RE (STM32F401 MCU board) +
X-NUCLEO-IKS01A1 (sensor expansion board)
■ LSM6DS0TR 3-axis accelerometer + 3-axis gyroscope
■ LIS3MDL 3-axis magnetometer
■ HTS221 humidity sensor
■ LPS25H pressure sensor
■ LSM6DS3 by connecting the STEVAL-MKI160V1 DIL24 adapter
6-Axis Inertial Module
9-Axis Inertial Modules
LSM6DS3TR
LSM9DS1TR
Features
■ Low power mode down
to 0.6 mA including gyro
■ Lowest noise
■ 4 Interrupt lines for gyroscope and accel.
■ Embedded 8 kBytes smart FIFO
■ Embedded digital functions
■ Embedded filters
Applications
■ Smart remote control
■ Enhanced GPS navigation system
■ Movement recognition and intelligent
power saving
■ ±2 to ±16 g FS
■ Ultra low noise 90μg/√Hz
■ ODR up to 6.66 kHz
3-Axis Gyroscope
■ ±125 to ±2000 dps FS
■ Ultra low noise 0.007 dps/√Hz
■ ODR up to 1.66 kHz
■ 2.5x3x0.83 mm³
(LGA-14L)
Features
■ 9-Axis SPI/I²C inertial module
■ Power down mode, low power mode
■ 2 Embedded FIFO s and temp. sensor
■ 3.5x3x1 mm³ (LGA-24L)
■ ±2, ±4, ±8, ±16 g FS
3-Axis Gyroscope
3-A
■±
±245, ±500, ±2000 dps FS
3-Axis Magnetometer
3-A
■±
±4, ±8, ±12, ±16 Gs
Applications
Ap
■ SSmart remote control
■E
Enhanced GPS navigation system
■ In
Indoor navigation
■ 9 degrees of freedom for movement
reconstruction, recognition
re
and intelligent power saving
an
ele
ess
www.rutr
ro
Barometric Pressure
Humidity & Temperature
Microphones
LPS25HB
HTS221, HTS221E
Digital: MP34DT01
Analog: MP33AB01 / MP33AB01H
Features
Features
■ 260 to 1260 mbar pressure range
■ Hermetic sealed package
■ High-resolution mode: 0.01 mbar
RMS (1 Pa)
■ SPI/I²C interfaces
■ Low power consumption:
- Low resolution mode: 4 μA
- High resolution mode: 25 μA
■ High overpressure capability:
20x full scale
■ Embedded temp. compensation
■ 24-bit ADC
■ Output data rate:
1 to 25 Hz
■ 2.5x2.5x1 mm³ (HCLGA-10L)
■ 0 to 100% relative humidity
-40 to +120°C temp. range
■ Humidity accuracy:
± 4.5% RH; (20 to 80% RH)
± 3% RH for HTS221E
■ Temperature accuracy:
± 0.5 °C; (+15 to +40 °C)
■ Low power consumption: 2 μA (1Hz)
■ Digital out (I2C/SPI)
■ Small and tiny package: 2x2x0.9 mm
Applications
Applications
■ Weather station
■ HVAC
■ Respiratory equipment, humidifiers
■ Gas sensors measurement correction
■ Asset tracking
■ Weather station
■ Indoor and outdoor localization
■ Indoor navigation
■ Sport watch and altitude
measurement
Features MP34DT01
■ Digital interface (PDM)
■ Omni-directional sensitivity
■ Signal to noise ratio:
63dB (A-weighted @ 1KHz, 1Pa)
■ Acoustic overload point: 120dBSPL
■ Flat freq. response: 20 Hz to 20 kHz
■ 3x4x1 mm³ (HCLGA)
Features MP33AB01 / MP33AB01H
■ Analog interface
■ Omni-directional sensitivity
■ Signal to noise ratio:
- MP33AB01: 63 dB
- MP33AB01H: 66 dB
■ Acoustic overload point: 120 dBSPL
■ Flat frequency response over
■ 20 Hz to 20 kHz
■ 3.7x2.95x1.0 mm³ (RHLGA)
Applications
■ Noise cancelling headset
■ Context awareness
■ Speech recognition
■ Interphones & alarm
Sensors
wake-up on motion
orientation detection
freefall detection
tap/double tap sensing
display profile switching
Acceleration Sensors
3 axis acceleration sensors enable you to add new features to your application (e.g. freefall, tap/double tap detection) or just reduce the power
consumption (wake up on motion).
Bosch Sensortec
Parameter
BMA280
BMA255
BMA250E
Digital resolution
14-bit
12-bit
10-bit
BMA222E
8-bit
Measurement range
±2 g, ±4 g, ±8 g, ±16 g
±2 g, ±4 g, ±8 g, ±16 g
±2 g, ±4 g, ±8 g, ±16 g
±2 g, ±4 g, ±8 g, ±16 g
Sensitivity (calibrated)
±2 g: 4096 LSB/g
±4 g: 2048 LSB/g
±8 g: 1024 LSB/g
±16 g: 512 LSB/g
±2 g: 1024 LSB/g
±4 g: 512 LSB/g
±8 g: 256 LSB/g
±16 g: 128 LSB/g
±2 g: 256 LSB/g
±4 g: 128 LSB/g
±8 g: 64 LSB/g
±16 g: 32 LSB/g
±2 g: 64 LSB/g
±4 g: 32 LSB/g
±8 g: 16 LSB/g
±16 g: 8 LSB/g
Zero-g offset (over lifetime)
±50 mg
±60 mg
±80 mg
±100 mg
Bandwidths (programmable)
8Hz to 500Hz
8Hz to 1kHz
8Hz to 1kHz
8Hz to 1kHz
Interface
SPI & I²C, 2x digital interrupt pins
Supply Voltage
1.62 V to 3.6 V
1.62 V to 3.6 V
1.62 V to 3.6 V
1.62 V to 3.6 V
Temperature range
-40 … +85 °C
-40 … +85 °C
-40 … +85 °C
-40 … +85 °C
Current consumption (full operation)
130 μA (@ 2 kHz data rate)
Current consumption (low-power mode)
6.5 μA (@ 40 Hz data rate)
6.5 μA (@ 40 Hz data rate)
7 μA (@ 40 Hz data rate)
7 μA (@ 40 Hz data rate)
LGA package
2 x 2 x 0.95 mm³
2 x 2 x 0.95 mm³
2 x 2 x 0.95 mm³
2 x 2 x 0.95 mm³
STMicroelectronics
Parameter
LIS3DSH
LIS3DHTR
LIS2DH12TR
LIS2HH12
AIS328DQ
H3LIS331DL
Digital resolution
14-bit
12-bit
12-bit
14-bit
12-bit
12-bit
Measuerment ranges
±2 g, ±4 g,
±8 g, ±16 g
±2 g, ±4 g,
±8 g, ±16 g
±2 g, ±4 g,
±8 g, ±16 g
±2 g, ±4 g, ±8 g
±2 g, ±4 g,
±8 g
±100 g, ±200 g,
±400 g
AEC-Q100
no
no
no
no
yes
no
Zero-g offset
±40mg
±40mg
±40 mg
±30 mg
±200mg (x,y axes);
±300mg (z-axis)
±1000 mg
Bandwidths
3.125 Hz to 1.6 kHz
1Hz to 5kHz
1 Hz to 5.3 kHz
10 Hz to 800 Hz
0.5 Hz to 1 kHz
0.5 Hz to 1 kHz
Interface
I2C/SPI digital output interface
I2C/SPI digital output
interface
I²C/SPI digital output
interface
interface
I2C/SPI digital output
interface
interface
2.16 V to 3.6 V
Supply Voltage
1.71 V to 3.6 V
1.71 V to 3.6 V
1.71 V to 3.6 V
1.71 V to 3.6 V
2.4 V to 3.6 V
Temp. range
-40 … +85 °C
-40 … +85 °C
-40 … +85 °C
-40 … +85 °C
-40 … +105 °C
-40 … +85 °C
Current consumption
225 μA (1.6kHz ODR)
11 μA (3.125 Hz ODR)
in normal mode
11 μA
(50Hz ODR)
in normal mode
11 μA
(50 Hz ODR)
in normal mode
110 μA
(50 Hz ODR) in active
mode
200 to 450 μA
in normal mode
300 μA
in normal mode
Package [mm³]
LGA-16 (3x3x1)
LGA-16 (3x3x1)
LGA-12 (2x2x1)
LGA-12 (2x2x1)
QFPN (4x4x1.8)
TFLGA (3x3x1)
Operation monitoring:
■ Free-fall & shock, rotation detection (emergency shut off)
■ Vibration detection (maintenance management)
■ Motion detection, position change (security / anti-theft )
■ Advanced power management (battery powered devices)
■ Orientation detection (on/off on defined position)
■ Activity monitoring (patient-, animal monitoring, body fall)
Human Machine Interface:
■ Display profile switching
■ Tap / double-tap sensing
(new features)
■ Flat detection (muting)
Sensors
Others:
■ Step-counting, tilt compensation
■ Movement detection (remote control)
■ Data-logger
(driving style, fleet management)
■ Professional and domestic alarms
■ Home automation, robots
x DoF Modules
We see an increasing trend to integrate different sensor types on a board or into a single package, having a system with multiple
Degrees of Freedom (DoF).
6-Axis eCompass
3D Accelerometer and 3D Magnetometer Modules
Type
Supplier
Acceleration digital resolution
LSM303CTR
BMC150
STMicroelectronics
Bosch
14-bit
12-bit
±2g, ±4g, ±8g
±2g, ±4g, ±8g, ±16g
Magnetic range
±16 G
±13 G (x,y-axis), ±25 G (z-axis)
Digital interfaces
SPI, I²C
SPI (4-wire, 3-wire), I²C
Programmable interrupt generators
x
x
Embedded FIFO
x
x
Embedded temp. Sensor
x
x
LGA-12 (2x2x1 mm³)
LGA-14 (2.2 x 2.2 x 0.95 mm³)
LSM6DS3
BMI160
STMicroelectronics
Bosch
Acceleration measurement range
Package
Inertial Measurement Unit
3D Accelerometer and 3D Gyroscope
Type
Supplier
Acceleration digital resolution
Acceleration measurement range
Gyroscope resolution
Gyroscope measurement range
16-bit
16-bit
±2g, ±4g, ±8g, ±16g
±2g, ±4g, ±8g, ±16g
16-bit
16-bit
±125, ±245, ±500, ±1000, ±2000°/s
±125, 250, 500, 1000, 2000°/s
x
x
Digital Interfaces
SPI, I²C
SPI, I²C
Embedded FIFO
x
x
Embedded temperature sensor
x
x
LGA-14L (2.5 x 3 x 0.83 mm³)
LGA-14 (2.5x3.0x0.8 mm³)
Programmable interrupt generators
Package
INEMO-M1
Features
■ Compact design: 13 x 13 x 2 mm³
■ L3GD20: 3-axis digital gyroscope
■ LSM303DLHC: 6-axis geomagnetic module
■ STM32F103REY: WLCSP, ARM®-based 32-bit MCU
■ LDS3985M33R: low noise LDO
■ Flexible interfaces: CAN, USART, SPI, I²C,
full-speed USB 2.0
■ Free ADC channels for external inputs
iNEMO 9DoF system-on-board
The INEMO-M1 is the smallest 9-axis
system-on-board (SoB) of the iNEMO
module family. It integrates multiple ST sensors with
a powerful computational core: a 6-axis geomagnetic
module, a 3-axis gyroscope and an ARM® μC
Sensors
MEMS Sensors
Acceleration
Kionix accelerometers provide industry-leading performance and quality for consumer electronics, industrial, health and fitness,
and automotive applications. Kionix accelerometers are available in 2x2x0.9 mm, 3x3x0.9 mm, 3x5x0.9 mm, and 5x5x1.2 mm packages.
In addition to proven expertise in accelerometer design and performance, Kionix also provides embedded algorithms, such as tap
detection, screen rotation, gesture recognition, and activity monitoring, supplying additional value to our customers.
Product
Axis
Full Scale G Range
Interface Output
Size (mm), Pins, and
Package Type
Current Consumption
Features
KX023
3
User-selectable 2g, 4g, 8g
Digital SPI/I²C
3x3x0.9mm, 16-pin, LGA
10-130 μA
Directional Tap/Double-Tap™, Device Orientation Detection, Excellent
Temperature Performance, Low Current Consumption, Embedded
FIFO/FILO buffer, Digital High-Pass Filter Outputs, User-configurable
wake-up function
KX23H
3
Digital SPI/I²C
10-135 μA
Low Noise, Enhanced integrated Directional Tap/Double-Tap™, and
Device-orientation Algorithms
KX112
3
Digital SPI/I²C
10-130 μA
Small Footprint, Directional Tap/Double-Tap™, Excellent Temperature
Performance, Embedded FIFO/FILO buffer, Digital High-Pass Filter
Outputs, User-configurable wake-up function
KXCJB
3
Digital (I²C)
KX022
3
Digital SPI/I²C
10-130 μA
Small Footprint, Directional Tap/Double-Tap™, Excellent Temperature
Performance, Embedded FIFO/FILO buffer, Digital High-Pass Filter
Outputs, User-configurable wake-up function
KXCNL
3
User-selectable 2g, 4g, 6g, 8g
Digital (I²C)
8-250 μA
Dual User-programmable State Machines, Low Power, Low Noise,
Unmatched User Flexibility and Programmability
KXCJA
3
Digital (I²C)
10-135 μA
High Stability, Low Power, Low Noise, Wakeup Interrupt, Excellent
Temperature Performance, Ultra Thin
KXCJK
3
Digital (I²C)
10-135 μA
High Stability, Wakeup Interrupt, Excellent Temperature Performance,
Low Current Consumption
KXTJ2
3
Digital (I²C)
10-135 μA
High Stability, Low Power, Low Noise, Wakeup Interrupt,
Small Footprint
KXCJ9
3
User-selectable 2g, 4g, 8g, 16g
Digital (I²C)
10-135 μA
High Stability, Low Power, Low Noise, Wakeup Interrupt,
Excellent Temperature Performance
KXTC9
3
1.5g - 6g
Analog
170-310 μA
Low Power, Factory Programmable Internal Low Pass Filter
KXR94
3
1.0g - 4g
Multiplexed Analog or
Digital (SPI)
5x5x1.2mm, 14-pin, DFN
500-1400 μA
Excellent Temperature Performance, Low Noise Density
KXRB5
3
1.5g - 6g
Multiplexed Analog or
Digital (SPI)
300-700 μA
Auxiliary Input to Multiplexer or ADC, Low Noise Density
KXD94
3
5g - 15g
Multiplexed Analog
5x5x1.2mm, 14-pin, DFN
0.70 - 1.50 mA
Internal 1kHz Filter or User-definable Bandwidth, Mid-range
acceleration measurements
High Stability, Low Power, Low Noise, Wakeup Interrupt, Excellent
Temperature Performance, Ultra Thin
Sensors
KXCJB
KX112
KMX61
Thinnest 3x3 mm Accelerometer
Thinnest 2x2 mm Accelerometer
6-axis Combo Device
■ Selectable full scales: ± 2g, 4g, 8g
■ Up to 14-bit resolution
■ 1.8V to 3.6V operating supply range
■ Ultra-low power:
- < 1 μA in standby
- 10 μA at low power
- 135 μA at high resolution
■ 3x3x0.45mm³ (LGA-10)
■ Selectable full scale: ± 2g, 4g, 8g
■ Up to 16-bit resolution
■ Scalable power consumption
as low as 2μA
■ 2x2x0.6 mm³ (LGA-12)
Accelerometer/Magnetometer
■ Ultra Low Power: 1 μA in standby;
130 μA (accelerometer only), 350 μA
(magnetom. only) and 450μA Max
(combined)
■ Digital (I2C), 3x3x0.9mm, 16-Pin, LGA
■ 512-byte FIFO buffer with
watermarking capability
■ User-selectable ± 2g, 4g, 8g full-sale
accelerometer range
■ Embedded temperature sensor
■ User-selectable ODR from
0.781Hz-1.6KHz
■ Outputs with up to 14-bit resolution
■ Supply voltages 1.8 V to 3.3 V
Embedded Functionality
■ Programmable low-pass filter
■ User-configurable wake-up function
■ Internal voltage regulator
Applications
■ Payment and Smart Cards
■ Wearable Devices and Patches
■ Badges and Proximity Cards
■ SIM Cards, Keys
■ Embedded on or in surfaces
■ Device Orientation
■ Directional Tap/Double-Tap™
■ Freefall
Applications
■ Smartphones and Mobile Devices
■ Laptops
■ Gaming and
Virtual Reality
■ Health and Fitness
nesss
■ Wearables
KX23H
3-axis very low power Accelerometer with Sensor Hub or Primary MCU
■ ARM Cortex™-M0 32MHz
■ 128 kB Flash ROM / 16 kB SRAM
■ Power consumption (MCU): 2.5μA (sleep);
1.5mA @ 32kHz; 6mA @ 32MHz
■ Power consumption (accel.):
(
) 1μA@
μ @ standby;
2μA@3.1Hz;
146μA@1.6KHz
■ Selectable full scales: ±2g, 4g, 8g
■ Data Rate 0.781Hz to 1.6KHz
■ 16-bit resolution
■ Internal voltage regulator
■ High Shock Survivability (10,000g)
■ Excellent Temperature Performance
■ 3x3x0.9 mm³
Sensors
■ Device Orientation
■ Directional Tap/Double-Tap™
■ Freefall
Applications
■ Smartphones and Mobile Devices
■ Gaming and Virtual Reality
■ Health and Fitness
■ Laptops
■ Wearables
Pressure Sensor
BM1383GLV
Piezo-resistive Pressure Sensor
Rohm’s BM1383GLV piezo-resistive pressure sensors which offer pressure accuracy and stable measurement at both low and high
temperatures due to a built-in temperature correction function. Built with Rohm’s MEMs technology the piezo-resistive sensing element
outputs a signal which is proportional to atmospheric pressure. This signal is processed by integrated logic to yield accurate pressure
information which is stable for the full temperature range. The sensor offers low power consumption especially for high accurate
measurements.
Features
The build-in I²C interface provides access to the measurement
■ Piezo-resistive pressure sensor
results in any kind of mobile or battery driven application.
■ Pressure range is from 300hPa to 1100hPa
■ Built-in temperature and offset compensation function
The sensor can detect differences in height (altitude) through pres■ I²C interfaces.
sure changes and capture movement data which suit them for use
■ Small package 2.5 x 2.5 x 0.95 mm
in wearable devices, activity monitors, altimeters and advanced
■ Temp. Range -40° to 85°C
detection for indoor navigation in smartphones and tablets.
Key Specifications
They feature a supply voltage of 1.71 to 3.6V, an average current
■ Pressure Range:
300hPa to 1100hPa
of 5μA.
■ Relative Pressure Accuracy:
±0.12hPa (Typ)
■ Absolute Pressure Accuracy:
±1hPa (Typ)
■ Average Current Consumption: 3.7μA (Typ)
BM1383
TOUT
TIN
DREG
Memory
VSS
VDD
INT
Pressure Sensor
Mux
ADC
signal
processing
SDA
SCL
HOST
2
IC
Temperature
Sensor
Clock
NC1
NC0
TEST1
TEST0
TENTATIVE
ROHM CO.,LTD
CONFIDENTIAL
ROHM CO.,LTD
Sensors
Optical Sensors
UV Sensor
IR Image Sensor
ML8511
ML8540
The ML8511 is a UV light sensor,
which is suitable for acquiring UV
intensity indoors or outdoors. The
ML8511 is equipped with an internal
amplifier, which converts photo-current
to voltage depending on the UV intensity. This unique feature offers an easy
interface to external circuits such as
ADC. In the power down mode, typical
standby current is 0.1μA, thus enabling
a longer battery life.
The ML8540 is a medium-resolution
(approximately 2,000 pixels) infrared
image sensor that allows noncontact
temperature measurement of an object
and easy obtaining of thermal images.
The ML8540 receives infrared rays
from an object at 48×47 (2,256) pixels
resolution, converts them into voltage through a thermopile, and selects
pixels in accordance with external
CPU clocks to output signals.
Features
■ Optical sensor for UV-A and UV-B
■ Analog voltage output
■ Low supply current (300μA typ.) and
Low standby current (0.1μA typ.)
■ Small and thin surface mount package
(4.0mm x 3.7mm x 0.73mm)
Features
■ A simple-to-use infrared image
sensor for taking thermal images at
2000 pixels
■ Uncooled, small & low power
consumption
■ Surface mount package
(8.5mm x 8.5mm x 1.85mm)
Color Sensor
BH1745
Applications
Smart phone, smart watch, smart band,
healthcare electronics, weather station
Applications
■ Energy-saving in BEMS/HEMS
■ Security / health monitoring
■ Non-contact thermometer
Sensors
BH1745NUC is a digital color sensor IC
with I²C bus interface. This IC senses Red,
Green and Blue light and converts them to
digital values.
Features
■ Excellent IR Cut Characteristics,
IRCut Filter
■ High Sensitivity and Wide Dynamic
Range (0.005 – 40k lx)
■ Supports Low Transmittance Window
■ I²C Bus Interface (f/s mode support)
■ Low Current by Power Down Function
■ Rejecting 50Hz/60Hz Light Noise
■ 1.8V Logic Interface
■ Programmable Interrupt Function
■ Selection of 2 I²C slave addresses
Applications
LCD TV, Mobile phone, NOTE PC,
Tablet PC, Portable, Game machine,
ine,
Digital
Digital camera, Dig
gital video
o camera,
camera
PDA, LCD display
Quaternion | Linear Acceleration | Rotation |
Gravity
Robust Heading
BNO055 – Intelligent Absolute Orientation Sensors
The BNO055 is the first in a new family of Application Specific Sensor Nodes (ASSN) implementing an intelligent 9-axis
“Absolute Orientation Sensor”, which includes sensors and sensor fusion in a single package.
The BNO055 is a System in Package (SiP), integrating a triaxial 12-bit accelerometer, a triaxial 16-bit gyroscope with a range of ±2000
degrees per second, a triaxial geomagnetic sensor and a 32-bit microcontroller running the company’s BSX3.0 FusionLib software.
At just 5.2 x 3.8 x 1.1 mm3, it is significantly smaller than comparable discrete or system-on-board solutions. By integrating sensors and
sensor fusion in a single device, the BNO055 eases the integration process for customers, freeing them from the complexities of multivendor solutions so they can spend more time on product innovation, including novel applications such as wearable hardware.
It is also the perfect choice for augmented reality, more immersive gaming, personal health and fitness, indoor navigation and any
other application requiring context awareness.
High number of operation modes
■ IMU which gives you relative position in 3D space without
bothering about magnetic effects
■ eCompass mode providing you with absolute orientation
data ensuring at the same time low power consumption
■ 9 DoF mode combining best of two previous modes
It is immune to magnetic disturbance thanks to gyro and
does not drift thanks to gyroscope recalibration with use
of magnetic field data
What makes the difference?
■ Hardware and software co-design enables high performance
with low power consumption
■ Quaternion communication is 10x more efficient than raw data
■ Integrated sensor fusion software reduces customer development costs and time
■ All components in one package leads to simplified system
integration and faster time to market
■ Footprint is significantly reduced compared to discrete and
system on board solutions
Applications
■ Augmented reality
■ Gaming
■ Personal health and fitness
■ Indoor Navigation
■ Context awareness
■ Absolute Positioning
■ Movement Profiles
■ Sensor Hub
■ All apps of single
devices
BNO055 Shuttle Board
0330.SB0.184
Sensors
Accelerometers | Geomagnetic Sensors
Gyroscopes | Inertial Measurement Unit
Barometric Pressure Sensors | eCompass
MEMS Sensors
IMU
Gyroscope
eCompass
BMI160 - Inertial Measurement Unit
BMG160
BMC150
Features
■ 6-Axis SPI/I²C inertial module
- 3-Axis accelerometer
- 3-Axis gyroscope
■ Package: LGA-14 (2.5 x 3.0 x 0.8 mm³)
■ FIFO size: 1024 byte
■ 2x digital interrupt pins
Features
■ 3-Axis SPI/I2C gyroscope
■ 5 selectable full Scales:
±125, ±250, ±500, ±1000, ±2000 dps
■ Digital resolution of 16 bit
■ 2 digital interrupt pins
■ Low noise
■ High stability over temperature
■ Supply voltage: 2.4 V to 3.6 V
■ Ultra small package 3x3 mm² LGA
Features
■ 6-Axis eCompass
■ SPI/I²C Interface
■ 4 interrupt pins
■ Small package 2.2x2.2mm² LGA
Applications
■ Navigation systems
■ Motion and activity measurement
■ Optical image stabilization
■ Computer peripherals
■ Man-machine interfaces
■ Virtual reality features
■ Remote controllers
■ 10 bit resolution
■ g-range: ±2 ±4 ±8 ±16g
■ FIFO data buffer: 32 samples/axis
■ ±2, ±4, ±8, ±16 g full scale
3-Axis Gyroscope
■ ±125, ±250, ±500, ±1000,
±2000 dps full scale
Applications
■ Augmented reality
■ Indoor navigation, pedestrian
dead-reckoning and step-counting
■ Optical image stabilization
■ Activity monitoring
■ Vibration measurement
■ Advanced power management for
mobile devices
■ Shock and free-fall detection
■ Flat detection, tap
p sensing,
ensing,
menu scrolling
BMG160 allows low-noise measurement
of angular rates in three perpendicular
axes. The zero-rate offset and offset stability over temperature of the BMG160
are outstanding.
Sensors
3-Axis Magnetic Sensor
■ Measurement range: ±1300μT
(x-,y-axis), ±2500μT (z-axis)
■ Resolution: 0.3μT
Applications
■ Compensated compass
■ Map rotation and position detection
■ Indoor and outdoor navigation
■ Magnetic signature recognition
■ Movement reconstruction,
recognition
BioMon Sensor SFH 7050
High Signal Quality for reliable Measurements
SFH 7050 is the first integrated optical sensor from OSRAM Opto Semiconductors for automatic fitness tracking. It includes three
light emitting diodes of different wavelengths, which are based on high-efficiency chip technology. The measurement starts or stops
automatically when the sensor touches skin or is removed from the skin.
Minimum tolerances for consistent measurements
Each of the three emitters is based on highly efficient thinfilm chip technology with narrow spectral bandwidths of
around 30 nm. The red LED has a specified wavelength tolerance of only ±3 nm.
Features
■ Multi chip package featuring
aturin
ng
tectorr
3 emitters and one detector
■ Wavelength of emitters:
rs:
- Red: 660 nm
- Green: 530 nm
- Infrared: 940 nm
■ Small package (WxDxH)
xH)
4.7 mm x 2.5 mm x 0.99 mm
■ Light Barrier to block optical crosstalk
Compact photodiode for small components
The photodiode integrated in the sensor has an active surface of
1.3 mm x 1.3 mm. On the one hand the diode is therefore very
sensitive to light, and on the other it enables an extremely compact component to be produced. Its high linearity and excellent
signal-to-noise ratio are particularly noteworthy.
The infrared LED can also be used in combination with the photodiode as a proximity sensor to start or stop the measurement
automatically as soon as the sensor touches or is removed from
the skin. The integrated optical barrier prevents crosstalk from
the three LEDs to the photodiode and therefore corruption of the
optical signal or the entire measurement.
Applications
A
■H
Heart rate monitoring
■ Pulse oximetry
■ Proximity sensor
Sensors
d
3-in-1 Time-of-Flight Module: Gesture, ALS and Proximity
The VL6180X is the latest product based on ST’s patented FlightSenseTM technology. It is the only product on market proposing
a distance measurement with a time-of-flight measurement principle, inside a tiny QFN module and at low power.
While all conventionnal sensors are only
measuring a signal strenght (photons
counting) and substracting parasitics such
as ambient infrared light, the VL6180X
provides an accurate and absolute distance
by measuring the time it takes the photons to
travel from the VL6180X emitter to the target,
and then back to the VL6180X, at speed of light.
The true distance, in millimeters, is directly
available in an output register (I2C).
Key Benefits & Benefits
■ Fully integrated: IR emitter, Ranging
sensor and ALS, gesture control
capable. No need of external LEDs
■ SPAD array based (single photon
avalanche diode):
unique product on market
■ Ranging:
100mm typical, up to 400mm 1)
■ Independent of target and colour
reflectance:
work with black colour, gloves, etc.
System Block
Diagram
VL6180X Evaluation & Development KIT
■ Standalone mode or PC interface
■ Free evaluation software and
documentation
■ API and binary example included
■ Compatible with STM32 NUCLEOTM
and ArduinoTM
Part Number
VL6180XV0NR/1
Package size
Operating range
ALS range
Power consumption
Supply voltage
Optimum operating
temperature
4.8 x 2.8 x 1 mm
0 to > 100 mm
up to 400 mm 1)
< 1 Lux up to 100 kLux
Standby: < 1 μA
ALS: < 300 μA (active)
Ranging: 30 μA (low power)
to 1.87mA (active) 2)
2.6 to 3.0 V
-20 to +70 °C
1) with calibration depending on final application and hardware |
2) continuous ranging (10Hz, 5cm, grey target 17%)
Sensors
VEML6030X01
30X01
X01
VEML6070
VEML6040
Light Sensors (Ambient, UV & RGB)
Vishay’s light sensors put the “smart” into smart devices. Advantages of Vishay sensors include best-in-class performance, in-house chip
manufacturing and assembly including AEC-Q101 automotive grade product lines, and comprehensive range of package types for a wide
range of applications.
Ambient Light Sensor
UV Light Sensor
RGBW Color Sensor
VEML6030X01
VEML6070
VEML6040
Features
■ Dimensions: 2 mm x 2 mm x 0.85 mm
■ Operating temperature: -40°C to 110°C
■ Vdd: 2.5 – 3.6V
■ 6 pin, SMD PCB based package
■ Output type: I²C bus and Interrupt
■ AEC-Q101 qualified
Features & Benefits
■ Dimensions: 2.35 x 1.8 x 1.0 mm
■ Integr. modules: signal conditioning IC
■ Converts solar UV light intensity to
digital data
■ Excellent UV sensitivity and linearity via
FiltronTM technology
■ Excellent temperature compensation
■ High dynamic detection resolution
■ Immunity on fluorescent light flicker
software shutdown mode control
■ Package: OPLGA
■ Temperature compensation:
-40 to +85 °C
■ Output type: I²C bus
■ Operation voltage: 2.7 V to 5.5 V
Features & Benefits
■ Dimensions: 2.0 x 1.25 x 1.0 mm
■ Integr. modules: Signal conditioning IC
■ FiltronTM technology provides a
spectrum matching real human eye
responses
■ Fluorescent light flicker immunity
■ Provides 16-bit res. for each channel
■ Selectable max. detection range
(360, 721, 1442, 2883, 5767, or 11796) lux
with highest sensitivity 0.0056 lux/step
■ Package: OPLGA
■ Temp. compensation: -40 to +85 °C
■ Output type: I²C bus
■ Operation voltage: 2.5 V to 3.6 V
Applications
■ Solar UV indicator
■ Cosmetic / outdoor sport handheld
product
■ Consumer products
Applications
■ Handheld device
■ Notebook
■ Consumer device
■ Industrial and mechanical application
Benefits
■ Optical on-chip coating to match human
eye sensitivity
■ 16-bit dynamic range for ambient light
detection supports dark lens design
■ ALS output tolerance ≤ 10%
■ Good linear behavior for lux levels from
0.005 lx to about 167 Klx
Applications
■ Control display brightness
■ Rear View Mirror dimming
■ Lighting control
Sensors
VCNL4020X01
VSMF2890RGX01
VSMF2890RGX01
Gesture Control
The Optoelectronics group of Vishay introduced a new gesture control sensor board that uses a digital proximity sensor and two
discrete infrared emitters to cost-effectively add touchless swipe right, swipe left, proximity, and tap control to any device. The gesture
board is being demonstrated in a special demo kit that is available for order.
Proximity Function
■ Built-in infrared emitter and photopin-diode for proximity function
■ Programmable LED drive current:
10 to 200 mA in 10 mA steps
Applications
■ Display control
■ Monitor sleep, wake function
■ Touchless light switch
■ Refrigerator water, ice dispenser
External Infrared-Emitter
VSMY98545
■ Wavelength: λP = 850 nm
■ Angle of half intensity: φ = ±45°
■ High power
■ 16-bit effective resolution for
proximity detection range ensures
excellent cross talk immunity
■ Excellent ambient light suppression
■ Paper towel & soap dispenser
■ Toilet flushing, water faucet
■ Industrial door or latch switch
■ Automotive for presence detection
Ambient Light Function
■ Built-in ambient light photo-pin-diode with
close-to human eye sensitivity
■ 16-bit dynamic range from 0.25 lx to 16 klx
■ 100 Hz and 120 Hz flicker noise rejection
Applications
■ Ambient light sensor for dimming and
adjusting display brightness level or any kind
of lighting application
■ Light on/off, dimming, color change
External Infrared-Emitter
VSMF2890..GX01
■ Wavelength: λP = 890 nm
■ Angle of half intensity: φ = ±12°
■ Low power, high speed
■ AEC Q101 qualified
Sensors
Linecard Wireless
Intel
x
x
Murata
Infineon
x
Microchip
IDtronic
GNS
Fujitsu
Dynastream
CEP
Suppliers
Advantech
Make your application EMBEDDED by connecting it wirelessly to the Internet of Things. RUTRONIK EMBEDDED has the
newest solutions for using a smartphone, WiFi access point or a mobile communication network as gateway for your device.
Our understanding of the right wireless solution covers hardware, drivers or transmission protocol, application profiles, security
aspects, certifications, long- term considerations as well as political aspects regarding standards, compatiblity and consortia.
RFID
Active
Passive
x
ISM/SRD
Transceivers
x
x
x
x
Transmitters
Receivers
Software Stack
x
x
x
x
x
ZigBee®
Chip Sets
x
Modules
x
x
Software Stack
Bluetooth®
Modules
x
x
x
x
Bluetooth SMART
x
x
x
x
x
Chips
x
x
WLAN
Chip Sets
Modules
x
x
x
Software Stack
GSM/UMTS/LTE
Chips
Modules
x
x
Terminals
With integr. GPS
x
x
x
GNSS
Chips
Modules
Telematic & Telemetry
x
x
x
x
x
Security
Trusted Computing
x
x
Authentification
Special Wireless Technologies
TMC
ADS-B
x
x
TransferJet®
Accessories
Adapter Cables
Antennas
x
x
Connectors
SIM-card Holders
Linecard
WWW.RFDIGITAL.COM
Telic
Others
ZMDI
Toshiba
Telit
ST
Silex
Rohm
RF Digital
Repine
Panasonic
Nordic
Telematik & Telemetrie
x
x
x
x
x
x
x
x
x
x
x
x
x
x
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x
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x
x
x
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x
x
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x
x
x
x
x
x
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x
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Linecard
xE910 Mini PCIe Cards
The xE910 Mini PCIe data-card is a product series available in three different technologies: LTE, HSPA+ and EV-DO, providing
connected device makers maximum range of options for Global cellular operator support. It is particularly well-suited for devices with
high throughput requirements such as mobile computing, kiosks, PDAs, e-readers, tablet PCs, and consumer electronics in general.
Family Concept
The mini PCIe form factor has become a popular standard adopted by connected device manufacturers to easily integrate wireless
connectivity into their devices for commercial and industrial computer markets.
Key Benefits
■ Standard Mini PCIe Data-card form factor
■ LTE technology interchangeable with HSPA+ or
EV-DO counterpart
■ Ideally suited for devices such as PDAs, mobile resource
management (MRM), logistics, POS terminals, trackers,
wireless backup for DSL modems and gateways
■ Rx diversity which allows the end-device to be equipped with two distinct cellular antennas improving the
quality and reliability of the wireless connectivity
■ Over-the-Air firmware update
■ Battery-friendly 1.8V GPI
Interfaces
■ USB 2.0 HS
■ USIM/SIM connection –
class B and class C
■ SIM holder (option)
■ DVI (Digital Voice Interf.
through the 52 pin edge
connector)
■ Wake
■ W_Disable
■ Led_wwan
GSM
Environmental
■ Dimensions: 51 x 30 x 3.2 mm,
51 x 30 x 4.8 mm (with optional
sim-holder)
■ Weight: 10 grams
■ Temperature range: -40 to +85°C
■ REACH and RoHS compliant
HE910 Mini PCIe
Supported Frequencies:
■ GSM | GPRS | EDGE:
850, 900, 1800, 1900
■ UMTS | HSPA: 800 / 850*, 900, AWS
1700, 1900, 2100 MHz
Bands B6 and B19 (800 MHz) are a subset
of B5 (850 MHz) and supported as well
■ Optional high sensitivity GPS | A-GPS
receiver (SUPL 1.0)
■ Rx Diversity
■ 3GPP release 7 compliant
■ SIM appl. Tool Kits 3GPP TS 51.014
■ Built-in UDP / TCP / FTP / SMTP stack
■ IP stack with TCP and UDP protocol
■ Standard and extended AT command set
■ Available variants:
- Voice, Data and GPS
- Data-Only
Data
HSPA category 6 in uplink and up to
category 14 in downlink
■ Uplink up to 5.76 Mbps
■ Downlink up to 21.0 Mbps
DE910 Mini PCIe
Electrical & Sensitivity
■ Output power
- Class 4
(2 W, 33 dBm)
@ GSM 850 / 900
- Class 1
(1 W, 30 dBm)
@ GSM 1800 / 1900
- Class 3
(0.25 W, 24 dBm) @ UMTS
- Class E2
(0.5 W, 27 dBm)
@ EDGE 850 / 900
- Class E2
(0.4 W, 26 dBm)
@ EDGE 1800 / 1900
■ Supply voltage 3.3 VDC +/- 9%
■ Sensitivity
-108 dBm @ UMTS
-107 dBm @ GSM 850 / 900 MHz
-106 dBm @ DCS1800GS900 MHz
GSM
Features
■ Dual-band EV-DO Rev.A
800/1900 MHz
■ Dual-mode GPS (standalone & gpsOne®) and
GLONASS
■ Standard and Telit Unified AT command sets
■ RX diversity for increased performance
■ Built-in UDP/TCP/IP stack
■ Full voice support includes
■ 2-way SMS support
Data
■ LTE cat.3
■ CDMA 1xRTT / EV-DO Rev. A
■ Air interface IS-95A/B and CDMA 2000
■ 1x EVDO (Rev. A) data up to 3.1 Mbps
■ Downlink and 1.8 Mbps Uplink
■ Supply voltage: 3.3 VDC +/- 9%
■ Sensitivity: - CDMA 1x: < -108 dBm
- 1x EV-DO: < -109 dBm
■ Maximum RF output power:
- 24 dBm [typical] for EVDO
- 24.4 dBm [typical] for 1x
LE910 Mini PCIe
LE910 V2 MiniPCIe
Supported frequencies:
■ EUG variant (European)
- LTE: 800 (B20) / 1800 (B3) / 2600 (B7)
- UMTS | HSPA: 900, 2100 MHz
■ NAG variant (NA market – AT&T)
- LTE: 700 (B17) / 850 (B5) / AWS1700 (B4) / 1900 (B2)
- UMTS | HSPA: 850, 1900 MHz
- GSM | GPRS | EDGE: 850, 1900 MHz
■ NVG variant (NA market - Verizon)
- LTE: 700 (B13) / AWS1700 (B4)
- UMTS | HSPA: 850, 1900 MHz
■ Embedded GPS | GLONASS receiver
■ Rx Diversity and MIMO 2x2
■ 3GPP release 9 compliant
■ SIM application Tool Kits 3GPP TS 51.014
■ Built-in UDP / TCP / FTP / SMTP stack
■ IP stack with TCP and UDP protocol
■ Standard and extended AT command set
Supported frequencies:
Data
■ Output power
LTE cat.3
- Class 4 (2 W, 33 dBm) @ GSM 850 / 900
■ Uplink
- Class 1 (1 W, 30 dBm) @ GSM 1800 / 1900
up to 50 Mbps
- Class E2 (0.5 W, 27 dBm)
■ Downlink up to
@ EDGE 850 / 900
100 Mbpsps
- Class E2 (0.4 W, 26 dBm)
■ HSPA+
@ EDGE 1800 / 1900
■ Uplink
Class
3 (0.25 W, 24 dBm) @ UMTS
up to 5.76 Mbps
Class
3 (0.2 W, 23 dBm) @ LTE
■ Downlink
■ Supply voltage
up to 42 Mbps
3.3 VDC +/- 9%
■ EU variant (European)
- LTE: 800 (B20) / 900 (B8) / 1800 (B3) / 2100 (B1) / 2600 (B7)
- UMTS | HSPA: 900, 2100 MHz
- GSM | GPRS | EDGE: 900, 1800 MHz
■ NA variant (NA market - AT&T)
- LTE: 700 (B17/B12/B13) / 850 (B5) / AWS1700 (B4) / 1900 (B2)
- UMTS | HSPA: 850, 1900 MHz
■ SV variant (NA market - Verizon)
- LTE: 700 (B13) / AWS1700 (B4) / 1900 (B2)
■ AU variant (Australian)
- LTE: 700 (B28) / 1800 (B3) / 2600 (B7)
■ LTE FDD Cat.4, 3GPP release 9 compliant
■ Rx Diversity and MIMO DL 2x2
■ SIM application Tool Kit
3GPP TS 51.014
■ Serial port multiplexer 3GPP TS27.010
■ SMS over IMS
■ Built in UDP/TCP/FTP/SMTP stack
■ Control via AT commands according to 3GPP TS 27.005,
27.007 and Telit Custom
■ AT commands
Data
■ LTE Cat.4
■ Uplink up to 50 Mbps
■ Downlink up to 150 Mbps
■ DC-HSPA+ 42 Mbps
■ (Supported on the variants
with 3G fallback)
GSM
■ Output power
- Class 3 (0.2 W, 23 dBm)
@LT E
■ Supply voltage
3.3 VDC +/- 9%
LN93x Series
LN93x Series
M.2 Data Cards for Mobile Computing
LN930 Variant
The M.2 family data-cards deliver high speed data rates on
LTE and offer a cellular connection for PC OEM device
manufactures. M.2 form factor data-card is particularly wellsuited for devices with very high throughput requirements
such as, PDAs, e-readers, tablets, and mobile computing or
consumer electronics in general. The M.2 family data cards
are a natural transition from the Mini Card PCI and Half Mini
Card to a smaller form factor. The M.2 family is optimized for
mobile computing world with lower power consumption and
high speed USB interfaces. M.2 family data cards support multiple operating systems and has several unique Intel features
such as Adaptive Clocking, Selective Suspend, Link Power
Management, and Dynamic Power Thermal Management.
The LN930 M.2 module achieves download rates to 150 Mbps
through support of 3GPP release 9. There are two variant of the
LN930 M.2 LTE data card to support the various RF frequency
bands and band combinations deployed worldwide.
■ LN930 LTE Module –
North America, Europe, roaming in Asia Pacific
■ LN930-AP LTE APAC Module – Asia Pacific
Overview
Types
LN930 / LN930-AP
Technology
LTE FDD cat. 4 W-CDMA
2G
Bands
M.2 Control
■ Full_Card_Power_On_Off
■ Reset#
■ W_DISABLE#
■ LED #1
■ DPR (Body SAR)
■ Wake on WWAN
■ GNSS Disable
Carrier
Aggregation
N/A
LTE
LN930: 1-5, 7, 8, 13, 17, 18, 19, 20
LN930-AP:
1, 3,8, 9, 11, 18, 19, 21, 26
LN930-AU: 1, 3, 7, 8, 20, 28
CDMA
N/A
3G
LN930: 1, 2, 4, 5, 8
LN930-AP: 1, 6, 8, 11, 19
LN930-AU: 1,8
LN932 Variant
The LN932 M.2 module achieves download rates to 300 Mbps
through support of 3GPP release 10 LTE Carrier Aggregation. There are two variants of the LN932 M.2 LTE Advanced
data card to support the various RF frequency bands and band
combinations deployed worldwide.
■ LN932 LTE Advanced Module – North America, Europe,
roaming in Asia Pacific.
■ LN932-AP M.2 APAC LTE Advanced Module – Asia Pacific
2G
LN930: 2, 3, 5, 8
LTE FDD:
DL: 150 Mbps,
UL: 50 Mbps
Data throughput
HSPA+:
DL: 42 Mbps,
UL: 5.7 Mbps
Operating temperature
-10 °C to +55 °C
Application Interface
MBIM, C-AT/NCM
USB
USB 2.0 HS
GSM
EFT/POS
and Vending
Security
Applications
Electricity, Gas and Water
Metering Applications
Digital Signage
Medical Applications
M2M Terminals
GSM and UMTS Terminals for M2M Applications
CEP’s GSM and UMTS terminals are targeted towards professional and industrial M2M applications which require wireless connectivity provided in a robust and reliable casing.
Key Features
■ Modules based on Telit or Cinterion
■ Dual band and quad band support for 2G (GSM/GPRS)
■ Dual band or penta band support for 3G (UMTS and HSPA/HSPA+)
■ Industry standard RS232 interface on all products
■ USB 2.0 interface for UMTS devices to facilitate HSPA+ high-speed
data transmission
■ Ultra-low power consumption mode in selected products for
battery-powered applications
Key Benefits
■ By integrating terminals from CEP, you can fully focus on
the core competencies required in your specific application
area and avoid the cost of developing, testing and certifying
terminal related functionality
■ CEP terminals also enable you to cost-effectively enhance and
upgrade existing installations with a wireless M2M interface
■ Easily swap 2G with 3G terminals when required by having a
real migration path for these mobile network technologies
Categories
Features
GT864 E
GT864 Quad
GT864 PY
HT910 E
HT910 G
CT63 E
CT63 NG
HT63 E
Modules
Supplier
Telit
Telit
Telit
Telit
Telit
Cinterion
Cinterion
Cinterion
Category
Product Category
Basic 2G
Basic 2G
Advanced 2G
UMTS/HSPA
UMTS/HSPA
Basic 2G
Basic 2G
UMTS/HSPA
General
Part Number
06600
06001
06002
06301
06303
06500
06508
06501
Air Interface
2G Frequency Band
2G Dual (900/
1800 MHz)
2G Quad
2G Quad
2G Dual (900/
1800 MHz)
2G Quad
2G Dual (900/
1800 MHz)
2G Quad
2G Dual (900/
1800 MHz)
3G Frequency Band
3G Dual (900/
2100 MHz)
3G Penta
3G Dual (900/
2100 MHz)
HSPA DL
7.2 Mbit/s
21 Mbit/s
7.2 Mbit/s
HSPA UL
5.7 Mbit/s
5.7 Mbit/s
D-Sub (9-pin)
D-Sub (9-pin)
Mini-USB
Mini-USB
Interfaces
RS232 Interface
D-Sub (9-pin)
D-Sub (9-pin)
D-Sub (9-pin)
Audio (analog)
Mini-USB
Mini-USB
Antenna
FME
FME
FME
FME
FME
LEDs
1 GSM +
2 Configurable
1 GSM +
2 Configurable
1 GSM +
2 Configurable
1 GSM +
2 Configurable
1 GSM +
2 Configurable
USB 2.0
Robust 1.8/3 Volt SIM Card
Holder
Software
t
Firmware Update
Input/
Outputs
t
Python
FOTA
TCP/IP Stack
FOTA
t
Hardware
Characeristics
Certificates
t
Python
FOTA
t
D-Sub (9-pin)
Mini-USB
Mini-USB
FME
FME
FME
1 GSM
1 GSM +
2 Configurable
1 GSM +
2 Configurable
t
t
t
Python
FOTA
t
Java
FOTA
Serial
t
t
t
Analog Inputs
1
1
1
Digital Inputs
4
Serial / USB
t
Serial / USB
t
t
1
Outputs
Electrical
Characeristics
D-Sub (9-pin)
Mini-USB
t
Programmable
5.7 Mbit/s
D-Sub (9-pin)
Voltage Range
5V - 32V
5V - 36V
5V - 36V
5V - 32V
5V - 32V
5V - 32V
5V - 32V
5V - 32V
Standby (@ 12V)
8.9 mA (*)
≈ 18 mA (*)
≈ 18 mA (*)
≈ 20 mA (*)
≈ 23 mA (*)
< 20 mA (*)
≈ 15.7 mA (*)
≈ 22 mA (*)
Low Power Mode (@ 12V)
< 3 mA (*)
≈ 10 mA (*)
≈ 11 mA (*)
≈ 2 mA (*)
≈ 1.3 mA (*)
< 2 mA (*)
Operating Temp.
-30 to +75°C
-30 to +75°C
-30 to +75°C
-30 to +80°C
-30 to +80°C
-40 to +80°C
-40 to +80°C
-40 to +80°C
Size
77x66x26 mm
77x66x26 mm
77x66x26 mm
77x66x26 mm
77x66x26 mm
77x66x26 mm
77x66x26 mm
77x66x26 mm
Weight
80g
80g
80g
80g
80g
80g
80g
80g
CE
t
t
t
e1
t
t
FCC
t
t
t
t
t
t
t
*) Measurement averaged (including peaks) over a 1 min measurement intervall.
GSM
GSM Telemetry Devices
STD32 & STD35 - CEP’s Telemetry Terminals for remote control and monitoring
The STD32 & the STD35 are telemetry devices targeted towards alarming applications via SMS or E-mail and to switch output relays
via call, SMS or a smartphone App.
Key Benefits
■ Digital inputs offered to monitor status information. In case
of an alarm, the terminals will automatically send an SMS or
E-mail to up to 5 recipients. The relays outputs can either be
activated with a free of charge call and/or via SMS
■ Toll free phone call function
■ Up to several hundred users configurable
■ Easy configuration via SMS, Configtool and Smartphone App
for Android. As a separate available accessory the configuration
tool allows you to set all parameters on the device via PC
■ Water protected and robust housing
Key Features
Product
Interfaces
Antenna
Power Supply
Power Consumption
Dimension
Operating Temp.
Certificates
Weight
STD32
■ 2 Digital inputs (galvanically isolated)
■ 2 Relais
(6A with max. 230V)
■ RS232 interface
■ Robust SIM card holder
(1.8/3V)
■ LED‘s for status information
FME
5 to 32V SC
GSM ON: 40 mA @ 12V
150 x 65 x 45 mm
-30°C to +70°C
■ CE
■ RoHS
80g
STD35
■ 3 Digital Inputs
■ 2 Analogue inputs
(12 bit resolution max. 230V)
■ 5 Relais (2A with max. 30V)
■ Integrated backup battery
■ RS232 interface
■ Robust SIM card holder (1.8/3V)
■ LED‘s for status information
■ 7 to 32V DC
■ LiPo-Backup-Battery
(660 mAh)
GSM On: 56 mA @ 12V
150 x 65 x 45 mm
-30°C to +70°C
■ CE
■ RoHS
80g
Application Fields
■ Sprinkling Systems
■ Heating Systems
■ Pumps
■ Gates
■ Entry Areas
GSM
m2mAIR Mobile
Connectivity and Value Added Services.
m2m AIR Mobile
Connectivity and Value Added Services
m2mAIR is a business unit of the Telit Communication PLC and dedicated to mobile network connectivity. It includes resources for
business and operations in support of m2m application deployment in the mobile network environment. This all-inclusive service suite
includes a broad products and service matrix which is based on three pillars that together form a total, end-to-end customer solution:
m2mAIR mobile Portfolio
Pure
Connectivity
Bundled
connectivity
SIM only
SIM + Module
Module-only
services
(just the Value
Added Services
component)
Development Kits
■ Starter Kit:
■ Pilot Kit:
■ Evalution Kit:
includes 1 SIM
includes up to
1 SIM Card included
Card, Test duration: 100 SIM Cards,
with Telit’s Evalutation
4-6 weeks
Test duration:
Kit, Test duration up
up to 3 months
to 12 months
Telit‘s development kits are offered which ensure an optimal
testing duration timeframe tailored to the customers’ needs
Core:
Here:
Offers both standard and tailored communication and rate plans + access to ePortal for
convenient management of your accounts
Mobile based positioning, location information
even without GPS/GNSS
Intelligence:
Web-based service designed to provide
customers a quick and easy way to analyze the
business performance of m2m deployments
ePortal:
Allows full & easy to manage oversight of the
SIM Card, as it is the central hub to activate
and suspend SIM Cards, manage user profiles
and data traffic and perform SIM inventory
managment
Aware:
Helps to mitigate critical and catastropic events
involving multiple devices in multiple geographies with a set of risk-management tools
Module Management:
Boost:
Allows customers to gain remote access to a set
of diagnostics and troubleshooting capabilities.
This includes services to manage module inventory & perform mobile network diagnostics
Improves network performance & extends the
battery life of your devices by selecting the highest quality connection available when roaming
GSM
EWM-C118HD01E
EWM-C118HD01E
EWM-C109F6G1E
GSM
EWM-C118HD01E
EWM-C109F601E
EWM-C109F6G1E
Wide-Temp 3.75G HSPA,
Half-size mini PCIe Card
with integrated SIM holder
Wide-Temp 3.75G HSPA,
Full-size mini PCIe Card
with integrated SIM holder
Wide-Temp 3.75G HSPA
and GPS, 2-in-1,
Full-size Mini PCIe Card
with SIM Card holder
Features
■ Technology:
HUSPA (5.76 Mb/s)
HSDPA (7.2 Mb/s)
■ Bands:
UMTS/HSPA 900/2100 MHz
GSM/EDGE 900/1800 MHz
■ Interface:
UART/USB
U.FL –R-SMT 50Ω antenna connector
UICC/SIM card interface
■ Audio:
Analog Audio
Digital Audio (4-wire I2C)
Functions
■ Cell Locate
■ Integrated SIM holder (Option)
■ Network indication
■ Embedded TCP/UDP
■ FTP, HTTP
■ SSL
■ AssistNow software
■ FW update via serial
Module
Type
Technology
Bands
Interface
Audio
Function
EWM-C109F6G1E
EWM-C109F601E
HSUPA [Mb/s]
5.76
5.76
HSDPA [Mb/s]
7.2
7.2
800/850/900/
1700/1900/2100
800/850/900/
1700/1900/2100
GPRS/EDGE quad-band
X
X
UART
1
1
USB
1
1
U.FL-R-SMT 50Ω antenna connector
2
1
UICC/SIM card interface
1
1
Digital Audio (4-wire I2C)
X
X
GPS / A-GPS
X
Integrated SIM holder
X
X
Network indication
X
X
Embedded TCP/UDP
X
X
FTP, HTTP
X
X
SSL
X
X
Software
X
X
FW update via serial
X
X
UMTS/HSPA [MHz]
Analog Audio
GSM
GNSS
EWM-G108H01E
2JR02ba2
RAS 1575
Standalone multi-GNSS
Mini PCIe Card
GNSS USB Receiver with
Telit SL869 Receiver
GPS USB Receiver
Antenna with Telit SE 880
Features
■ Multi-GNSS
(GPS, GLONASS, QZSS, Galileo)
■ < 1s acquisition
■ -162dBm cold start acquisition
sensitivity
■ 5Hz update rate
■ Open sky cold start 29 second / Aided
starts 5 second
■ Signal detection better than -160dBm
■ SBAS:WAAS, EGNOS, MSAS
■ Accuracy 2.5m CEP
■ RoHS compliance
■ 1 USB V2.0
V2 0
Features
■ Interface: USB 2.0
■ Cable length: up to 10m
■ Impedance: 50 Ohms
■ Polarization: RHCP
■ Gain: 3dBiC
■ Voltage supply: 3.7V to 6V
■ Current: 65mA Max.
■ Operating temperature:
-45°C to +85°C
Features
■ Cable length: 3000 mm ± 50 mm
■ Polarization: RHCP
■ Antenna gain at Elevation
- 90°: + 2,0 dBic min.
- 20°: -5,0 dBic min.
■ Voltage supply: 5 ± 0.5 V (USB)
■ Current:
- Low power mode
(Tracking 1 Hz): 10mA
- Average full power tracking in LDO
mode: 35mA
- Average full power tracking in
switcher mode: 28mA
■ Operating temperature:
-40°C to +75°C
GNSS
WIFI
EWM-W135H01E / EWM-W135F01E
EWM-W158F01E
Extended Temperature
802.11 a/b/g/n dual band 2Tx/2Rx
MIMO Mini PCIe Card
Industrial Temperature
MIMO Full-size Mini PCIe Card
Features
■ Main Chipset: Atheros AR9382
■ Interface: PCI Express mini-card rev. 1.2
■ Data Rate: Up to 300 Mbps
■ Security: 64/128/152 bit WEP, WPA,
WPA2, 802.1x, AES-CCM & TKIP
■ OS Supported:
Windows XP/ Vista/ 7 (32 and 64 bit)
■ Operating Temperature: -10 to +70°C
Features
■ Main Chipset: Atheros AR9592-AR1B
■ Security: 64/128-bits WEP, WPA, WPA2, 802.1x,
TKIP and AES
■ OS Supported: Windows XP/Vista/7/8/8.1
■ Operating Temperature: -40 to 85°C
EWM-W153H01E
EWM-W155H01E
802.11 b/g/n + Bluetooth 4.0
Half-size Mini PCIe Card
MIMO + Bluetooth 4.0
Half-size Mini PCIe Card
d
Features
■ Main Chipset: Atheros AR9485 and
AR3012
■ WLAN Signal Protocol: PCIe Differential
■ Bluetooth Signal Protocol: USB Differential
■ Security: 64/128/152-bit WEP, 802.1x, TKIP and AES
■ OS Supported: Windows 2000/ XP/ Vista/ 7
■ Operating Temperature: 0 to +60°C
Features
■ Main Chipset: Atheros AR9462
■ WLAN Signal Protocol: PCIe Differential
■ Bluetooth Signal Protocol: USB Differential
■ Security: 64/128/152-bit WEP, 802.1x, TKIP and AES
■ OS Supported: Windows XP/Vista/7/8/8.1
■ Operating Temperature: 0 to 70°C
WIFI
WIFI
SX-PCEGN
SX-PCEAN
SX-PCEAC
802.11 b/g/n PCI
Express WLAN Module
802.11 a/b/g/n PCI
Express WLAN Module
802.11 a/b/g/n/ac
PCI Express WLAN Module
Features
■ Atheros AR9287 highly integrated
chipset
■ IEEE 802.11b/g/n compliant 2.4GHz
single band
■ Full MIMO performance with data rate
up to 300Mbps
■ PCI Express Half-Mini Card compliant
■ PCI Express Mini Card 1.1 compliant
■ Driver offering includes Linux,
Windows 7 and Embedded XP
■ Linux supplicant available for
WPA/WPA2-PSK & 802.1x EAP
■ Customer Driver development
available
■ IEEE 802.11e QOS support
Features
■ Atheros AR9280 highly integrated
chipset
■ IEEE 802.11a/b/g/n compliant 2.4/5
GHz dual band
■ Full MIMO performance with data rate
up to 300 Mbps
■ PCI Express Half-Mini Card compliant
■ PCI Express Mini Card 1.2 compliant
■ Driver offering includes Linux, Windows 7 and Embedded XP
■ Linux supplicant available on request
for WPA/WPA2-PSK & 802.1x EAP
■ Customized Driver development
available on request
■ IEEE
EEE 802.11e QOS support
Features
■ Qualcomm Atheros QCA9880 chipset
■ 3x3 SU-MIMO enhances high speed
and stability
■ IEEE 802.11ac(Wave1)/a/n
■ Wide band 80MHz mode
■ High density modulation mode
(256QAM)
■ Max data transfer rate: 1.3Gbps
WIFI
SX-570/580
SX-680
Enterprise 802.11 n
Connectivity for
Battery Operated Devices
2x2 High Performance
802.11 a/b/g/n
Embedded Wireless Bridge Module
Features:
■ 802.11a/b/g/n (SX-580) or 802.11b/g/n (SX-570)
■ Based on Qualcomm Atheros AR6003
■ Reduced power consumption
■ Serial or Ethernet to Wi-Fi
■ Industry-leading enterprise security including WPA,
WPA2, WEP plus 802.1x
02.11x authentication
■ Linux operating system
em
m with
user programmability
ty
■ No driver development
entt
necessary
■ Quick time to market
et
Features:
■ IEEE 802.11a/b/g/n compl. Dual Band Wi-Fi Radio (2.4/5GHz)
■ Dual antenna (U.FL) and full 2x2, MIMO support for connection rates up to 300Mbps
■ IEEE 802.3 Gigabit Ethernet interface (auto select)
■ Supports two operating modes (software selective)
- Single Client Mode:
Connecting one wired-LAN device to wireless LAN
- Multi-Client Mode: Connecting up to 16 units of wired LAN
devices to wireless LAN viaa HUB
from the wired LAN port
■ Enterprise-level wireless security
urity
(WPA/WPA2-Enterprise, 802.1x)
2.1x)
SX-500-1033
SX-ND-4350WAN
Wireless Serial Device Server
Network Display Adapter
Features
■ Device Interface: Single serial port: RS-232
■ Network Interface: IEEE 802.11b/g
■ Security: WPA and WPA2 (personal and enterprise modes),
PAP, MS-CHAPv2, 802.1x EAP with TLS/TTLS/ LEAP/
PEAP/FAST, WEP
■ Variable data rates: 54, 48, 36, 24, 18, 12, 11, 9, 6, 5.5, 2
and 1 Mbps
■ Serial Port Emulator software
(Windows 2000/XP/Server 2003 32 bit)
■ ExtendView Utility (GUI)
■ Simple Network
o
ork
Management Protocol (SNMP)
MIB I + II; IP
P
■ Firmware
upgrade via
TCP/IP
Features
■ Wireless LAN access point
■ Immediate response to touch input and video, without
visible latency
■ Bidirectional data transfer with various USB devices
■ Support for Full HD resolution
■ Software that allows to search for NetDA devices, connect to
and disconnect from monitors and query connection status
■ Screen Sharing to any browser in same network
WIFI
SX-ND-4350WAN is a wireless interactive
display adapter, and also functions
as a wireless access point.
The product connects to the
network and the display in
a presentation or classroom
environment.
À la Card Products...
+
OR
RFD77201 Slmblee™
Sl bl ™
7-pin
DIP Adapter
RFD77203 Slmblee™
29-pin
Breakout Board
RFD22121
Required USB
Programming Shield
Simblee™ by RF Digital
The IoT for Connecting Everyone and Everything – IoT4EE
Cortex™ ARM® M0 | 2.4 GHz Transceiver | Standalone BLE Module
RF Digital believe that technology should be transparent and
seamless, so they created Simblee™, an innovative new product line
that will radically change how we interact with the physical world.
With Simblee™, things and people can work in a cooperative, and
familiar way. This product makes it possible for device developers
to embed mobile apps in the device themselves, passing interface
information over Bluetooth™ Smart to a generic framework Simblee™ for Mobile app on a mobile device.
Simblee Components
Like RFduino, Simblee can be programmed using Arduino
IDE. Simblee™ extends the sketch format used by RFduino by
also including mobile app generation on the same page allowing one convenient programing environment for both hardware.
RFD77801
Simblee Starter Kit
Kits includes:
■ 1x RFD77201 Simblee 7-Pin DIP
■ 1x RFD22121 USB Programming Shield
■ 1x RFD22122
RGB LED/Button Shield
RFD77101
Simblee SMT Module
RFD77201
7 GPIO Breakout
RFD77203
RFD
D7
29 GPIO
GPIO Breakout
Bluetooth®
Example Apps for Apple and Android are available
WWW.RFDIGITAL.COM
Features & Benefits
■ Interact with everything around you without having to
download native apps
■ Easily create IOS and Android apps without using Xcode
or the Android SDK
■ Hardware code and mobile are both on the same page of
code
■ Device functionality, app functionality, cloud functionality
all in one session
■ Creative phone & tablet apps are as easy as blinking an LED
■ Create true end-to-end IoT products and accelerate your
design time
The RFduino shields
hields and accessories can also be acquired individually
RFduino DIP Module
RFD22102
BTOOTH1244
RFduino USB Shield
RFD22121
BTOOTH1245
RFduino RGB LED/Button Shield
RFD22122
BTOOTH1246
RFduino Servo Shield
RFD22123
BTOOTH1247
RFduino PCB USB Shield
RFD22124
BTOOTH1248
RFduino Proto Shield
RFD22125
BTOOTH1249
RFduino Dual AAA Battery Shield
RFD22126
BTOOTH1250
RFduino Single AAA Battery Shield
RFD22127
BTOOTH1251
RFduino CR2032 Coin Battery Shield
RFD22128
BTOOTH1252
RFduino Micro SD Shield
RFD22130
BTOOTH1253
RFduino Dual Relay Shield
RFD22131
BTOOTH1254
Bluetooth®
ANT TM
What is ANTTM
ANT USB Stick – ANT USB-m
ANT™ is a practical wireless sensor network protocol. It offers
an ultra-low-power, short-range wireless technology running
on the 2.4 GHz ISM band. It handles peer-to-peer, star, tree
and fixed mesh topologies. Application examples for ad-hoc
mesh techniques are also available.
Key Benefits
■ The ANTUSB-m is a USB dongle that provides a quick and
easy solution for Windows PC, Mac and Android equipment
with an USB type A port to connect to ANT wireless networks
■ Provides enhanced ANT core features, such as proximity
search and frequency agility
■ Up to 8 ANT channels available
■ WHQL certified Windows driver for
Windows XP, Vista, 7 and 8
■ No driver installation required on Mac OS X10 and above
More Information
www.rutronik-tec.com/ant
Tree:
Slave
Slave
Key Features
■ 78 selectable RF channel
■ ANT channel combined message rate up to 190Hz
(8byte data playload)
■ Minimum message rate per ANT channel 0.5Hz
■ Burst transfer rate up to 60Kbps (true data throughput)
■ -40°C to +85°C operating temperature
To LAN or
Internet
Slave
Central
controller masters
Slave
Star:
Slave
Slave
Slave
Peer-to-Peer:
Master
Slave
Slave
Slave
To LAN or
Internet
To LAN or
Internet
Mesh:
To LAN or
Internet
B
A
G
Master
F
C
D
E
IA
H
Each node is a repeater
Application Fields
Applications running on computers or equipment often act as
the hub node of a network. Through the use of the ANT USB
stick the application can receive, store, analyze and display data
collected from ANT sensors or other wearable or portable hub
devices, e.g. watches and bike computers.
The application may also serve as the gateway to the Internet for
cloud computing.
The ANTUSB-m is a miniature design. When plugged in, the
majority of the body is buried inside the computer or equipment.
ANT
next generation
e-commerce with
personal service.
Order online and receive personalised on-site support.
FASTER
MORE PERSO
NAL
EASIER
www.rutronik24.com
www.rutronik24.com
RFID
Pen Stick Reader EVO
Desktop Reader EVO
The iDTRONIC Pen Stick Reader EVO is an easyto-use RFID read/write device which uses the USB
2.0 interface for high speed data transfer. One special feature of the Pen Stick Reader EVO is the LED
illuminated endcap, turning on during the reading
process. Additionally, Keyboard Emulation (KEMU)
is optional for all Versions..
iDTRONIC’s Desktop Reader EVO is an easy-to-use
RFID Reader/Writer which uses the USB 2.0 interface for high speed data transfer. A Multi-LED
illuminated frame is included, turning on during
reading process. It comes with a
full SDK and a MS Windows based
application SW. Additionally,
Keyboard Emulation (KEMU) is
optional for all Versions.
Product Features
■ Dimensions: 84.5 x 36 x 11.55 mm
■ Housing-Material: ABS
■ Power Supply: 5 VDC, via USB
■ Operating Systems: Win XP, 7; Linux
■ Antenna: Integrated
Product Features
■ Dimensions: 125 x 70 x 26 mm
■ Housing-Material: ABS
■ Power Supply: 5 VDC , via USB
■ Operating Systems: Windows XP/7, Linux
■ Antenna: Integrated
■ Interface: USB 2.0, cable length 1.2 m
The Pen Stick Reader is available in the following versions:
The Desktop Reader EVO is available in the following versions:
Freq.-Range
Frequency
Standard
UHF
868 – 916 MHz
ISO 18000-6C
incl. Class 1 Gen 2
HF
13.56 MHz
ISO 14443A/B ISO
15693
MIFARE Family
LF
125 kHz
ISO 11784
ISO 11785
Freq.-Range Supported Standards / Card Types
UHF
HF
MIFARE® Classic 1K, 4K; MIFARE Ultralight®;
MIFARE Pro; AT88RF020; 66CL160S;
SR176; SRIX4K (TYPE-B); I-Code2;
TI RFid Tag-it HF-I; EM4135; EM4034
Read only UID of all other ISO 14443A/B,
ISO 15693 cards
LF
ISO 18000-6C incl. Class1 Gen2
ISO 11784, ISO 11785
LEGIC
ISO 14443A/B; ISO 15693;
LEGIC Prime/Advant
TEMIC
TEMIC 55x7
RFID
Special Tags
On-metal tags,
high temperature tags,
UHF hard tags, nail tags, etc..
Transponder Applications Examples
ISO and Hybrid Cards
Available 125 kHz, 13.56 MHz
and UHF IC technologies.
Cards can be customized with
different personalization and encoding options.
Keyfobs and Wristbands
All keyfobs and wristbands aree
waterproof and can be printed and personalized.
Smartlabels and Tickets
Adhesive labels 13.56 MHz
and UHF, CD/DVD labels and
paper tickets.
Disctags
These tags are all available with different
diameters, with printing and with/without
centre hole.
BLUEBOX Professional RFID
Passive RFID Transponders – Overview
BLUEBOX Professional RFID is a family of highly sophisticated RFID Controllers, Readers, Antennas and Solutions
allowing easy system integration.
With its large portfolio of chips iDTRONIC covers the total
frequency bandwith of LF, HF and UHF RFID Transponders.
BLUEBOX Unique Advantages:
■ Ruggedized product design and enclosures
(All components minimum IP65 or IP54)
■ Available for
- UHF 860–960 MHz (ISO18000-6C, EPC Class1 Gen2),
- HF 13.56 MHz (ISO15693, ISO14443) and
- LF 125 kHz standards
■ Solutions for Near Field, Short-, Mid- and Long-Range appl.
■ Contr. with integr. antenna or for running 1, 2 and 4 antennas
■ Extended range of application specific antennas
■ Outstanding read / write performance and reading distances
■ Possibility of using different RFID standards in parallel in one
application
■ Multiple Interface Options (RS232/485, Ethernet, Profibus, etc.)
■ Integrated Webserver for remote access to Controller
■ Suitable for Stand-Alone operation
■ Integrated I/O ports
■ Micro SD slot for memory extension
■ Diagnostic interface
■ Several Standard Read Modes like Buffered Read Mode, Scan
Mode, Notification Mode, RSSI Mode
■ Unique SDK for all BLUEBOX products
■ BLUEBOX SHOW applications software
■ M12 connections for trouble-free and secure connection
and installation (optional RJ45 for UHF CX Controller)
Freq.
IC Version
ISO-Standard
Memory Cap.
LF
EM4200
ISO 11785 (FDX-B)
8 Byte
EM4450/4550
ISO 11784 / 85
125 Byte
Atmel Temic 5567
ISO/IEC 11784/785
28 Byte
NXP Hitag 1
ISO 10536.1.
256 Byte
NXP Hitag 2
ISO 10536.1.
32 Byte
NXP Hitag S256
ISO 11784 / 85
32 Byte
HF
HF
UHF
NXP Hitag S2048
ISO 11784 / 85
256 Byte
NXP Mifare Ultralight (UL)
ISO 14443 A
64 Byte
NXP Mifare Ultralight (UL) C
ISO 14443 A
192 Byte
NXP Mifare Classic Mini
ISO 14443 A (1-3)
320 Byte
NXP Mifare Classic 1K
ISO 14443 A
1024 Byte
NXP Mifare Classic 4K
ISO 14443 A
4096 Byte
NXP Mifare MF1S20 (mini)
ISO 14443 A
320 Byte
NXP Mifare MF1S50 (1K)
ISO 14443 A
1024 Byte
NXP Mifare MF1S70 (4K)
ISO 14443 A
4096 Byte
NXP Mifare DESFire EV1 (2K)
ISO 14443 A (1-3)
2048 Bytes
ISO 14443 A (1-3)
4096 Byte
ISO 14443 A (1-3)
8192 Byte
NXP I-Code SLI
ISO 15693
128 Byte
NXP I-Code SLI-S
ISO 15693
256 Byte
LEGIC MIM256
ISO 14443 A
256 Byte
LEGIC MIM1024
ISO 14443 A
1024 Byte
TI Tag-it HF-I
ISO 15693
256 Byte
LEGIC Advant 1024
ISO 14443 / 15693
128 Byte
LEGIC Advant 2048
ISO 14443 / 15693
256 Byte
STM SRI512
ISO 14443 B
64 Byte
STM LRI2K
ISO 15693
256 Byte
STM SRI4K
ISO 14443 B
512 Byte
NXP NTAG203
ISO/IEC 14443A
168 Byte
Alien UHF Higgs 3 Gen2
ISO/IEC 18000-6C
64 Byte
UHF U-Code Gen2
ISO 18000-6C
16 Byte
Freq.-Range
Desktop
D k
Reader
Various
V
Controller
C t ll with
it
integrated Antenna
Various Controller
C t ll with
ith up to
4 ports for external Antenna
M30 Cylindrical
Reader (metal)
etal)
Various M18/M30
Cylindrical Antennas
Antenna
Various other short range, mid
range and long range Antennas
LF Reading Distance LF
Up to 10 cm
Up to 15 cm
Up to 30 cm
Up to 8 cm
Up to 11 cm
Up to 23 cm
HF Reading Distance
Up to 15 cm
Up to 15 cm
Up to 15 cm
Up to 12 cm
Up to 6 cm
Up to 30 cm
UHF Reading Distance
Up to 30 cm
Up to 3 m
Up to 10 m
-
Up to 20 cm
Up to 10 m
RFID
Antennas
Home Automation
Security
Antennas
Adhesive antennas
Type
CA-C09-1
Type
CA-C09-1
Standard:
GSM/UMTS/LTE
Standard:
GSM
Frequency: 850, 900, 1800, 1900, 2100 and 2600 MHz
Frequency: 900 and 1800MHz
Gain:
2.1 dB
Gain:
2,5 dB
VSWR:
<2:1
VSWR:
<1:5
Available in different cable lengths and different connector
types
Available in different cable lengths and different
connector types
Holemounted antennas
Type
2J664
Type
2J662
Standard:
GSM/UMTS
Standard:
Bluetooth/Wlan
Frequency: 850, 900, 1800, 1900 and 2100 MHz
Frequency: 2.4 and 5.5 MHz
Gain:
2.2 dB
Gain:
5.0 dB
VSWR:
<2:1
VSWR:
<2:1
connector types
connector types
Type
2J661
Type
2J660B - BG
Standard:
GPS
Standard:
GSM/UMTS and GPS (BG: GPS/Glonass)
Frequency:
1575 MHz
Frequency: 850, 900, 1800, 1900, 2100 MHz and
1575.42MHz
Gain:
26 dB at 3V
Gain:
2.2 dB (GSM/UMTS) and 26,0 (GNSS)
Supply
voltage
2.7-5.5V
Supply
voltage
2.7-5.5V
VSWR:
<1.5:1
VSWR:
<2:1 (GSM) and <1.2:1 (GNSS)
connector types
connector types
Antennas
Antennas
Magnetic antennas
PCB antennas
Type
2J301M
Type
2J0X5PCB
Standard:
GSM/UMTS
Standard:
GSM
Frequency: 850, 900, 1800, 1900 and 2100MHz
Gain:
2.2 dB
Gain:
0 dB
VSWR:
<2:1
VSWR:
<2:1
connector types
connector types
Type
C02MT07
Type
2JMAS01
Standard:
GSM
Standard:
GSM/UMTS
Gain:
0 dB
Gain:
0 dB
VSWR:
<1:5
VSWR:
<2.5:1
connector types
connector types
Type
2J431G
Type
ANT8010JLC1B1516A
Standard:
GPS/Glonass
Standard:
GPS/Glonass
Frequency: 1575 and 1602 MHz
Frequency: 1575 and 1602 MHz
Gain:
26 dB at 3V
Gain:
20.7 dB
Supply
voltage
2.2-5.5V
Supply
voltage
2.7-3.3V
VSWR:
<1.2:1
VSWR:
<2:1
connector types
Cable length 100mm with Ipex (U.FL) connector
Type
GPS-01
Type
2JMAS05
Standard:
GPS
Standard:
Bluetooth / Wlan
Frequency: 1575 MHz
Frequency: 2.4 GHz
Gain:
28 dB at 3V
Gain:
2.2 dB
Supply
voltage
2.6-5.5V
VSWR:
<1.5:1
VSWR:
<2,0:1
connector types
connector types
Type
2J3015M
Type
ANTX100P001B24553
Standard:
ISM
Standard:
Bluetooth / Wlan
Frequency: 868 MHz
Frequency: 2.4 and 5.5 GHz
Gain:
3 dB
Gain:
4,6 dB
VSWR:
<1.5:5
VSWR:
<2.5:1
connector types
Cable length 100mm with Ipex (U.FL) connector
Antennas
Antennas
Stub antennas
Swivel antennas
Type
2J020
Type
2JW031
Standard:
GSM/UMTS
Standard:
GSM/UMTS
Gain:
2.1 dB
Gain:
3.0 dB
VSWR:
<2:1
VSWR:
<2:1
Available in different connector types
Type
W-231
Type
W-79B
Standard:
GSM
Standard:
GSM
Frequency: 850, 900, 1800 and 1900 MHz
Gain:
0 dB
Gain:
0 dB
VSWR:
<2.5:1
VSWR:
<2.5:1
Type
PF-14
Type
PF-14
Standard:
Bluetooth / Wlan
Standard:
Bluetooth / Wlan
Frequency: 2.4 GHz
Frequency: 2.4 GHz
Gain:
0 dB
Gain:
0 dB
VSWR:
<2:1
VSWR:
<2:1
Flexible antennas
Type
105263
Standard:
GSM/UMTS/LTE
Frequency
850, 900, 1800, 1900, 2100 and 2600
MHz
Gain:
1.3 dB
Available in different cable lengths with Molex
connector (U.FL)
Type
47950
Type
105262
Standard:
Bluetooth / Wlan
Standard:
ISM
Frequency
2,4 and 5,5 GHz
Frequency
868 and 915 MHz
Gain:
2,9 dB
Gain:
0.4 dB
Available in different cable lengths with Molex connector (U.FL)
Available in different cable lengths with Molex
connector (U.FL)
Antennas
www.rutronik.com/ EMBEDDED
TransferJet™
TransferJet™ is a cable-less data transfer technology within the 4.48GHz frequency band featuring ease of use, safe communication
and ultra fast data transfer. The physical layer transmission rate is 560 Mbps, maximum data throughput is 375 Mbps using very little
transmit power – at or below -70 dBm/MHz. As such the purpose of TransferJet™ is data downloading, viewing, sharing and synchronisation amongst the vast community of digital equipment.
The operation is very intuitive and quite simple: Two devices
are brought into physical proximity so that files are transferred
automatically. TransferJet™ has the ability to discover the other
TransferJet™ device as soon it comes within range. So there
is no need for complex setup, device pairing, passwords or the
use of access points. Point-to-point connectivity with no
host/target relationship. Data transfer can take place between
mobile phones and stationary PCs, as well as between any kind
of mobile/handheld devices as in the examples below.
TransferJet™ can maintain the highest possible wireless link by automatically adjusting the data transmission rate, even if conditions
deteriorate. In addition to this since TransferJet™ is a close proximity wireless system that radiates very low-power radio waves, it
causes virtually no interference to other wireless systems, and there
is no impact on performance even if multiple users simultaneously
use TransferJet™ in nearby areas.
A short transmission distance (typically 3-4cm) means user
can specify and restrict which other devices can be connected. Short transmission distance minimizes leakage of data,
without the need for complex security measures or setup procedures. Users can register their electronic products to enable
TransferJet™ to recognize and connect to specific devices only,
preventing unintended unauthorized access.
Transfer Jet Product Portfolio
Module:
TJM35420XLQ
MicroSDIO Card:
TJM35420USQ
USB Adapter:
TJEU00AWMX
microUSB Adapter:
TJEU00AMUB
iOS Adapter:
TJEU00LTB
TransferJet™ and the TransferJet Logo are trademarks of the TransferJet Consortium
Special Wireless Techn.
www.rutronik.com/ EMBEDDED | 117
Linecard
On request, RUTRONIK EMBEDDED will also put together individual kits for you which precisely meet the specific needs of your application. In addition to the primary components, these also contain all necessary inverters, cables, connection solutions and power supplies.
We adapt the peripheral products precisely to your requirements, thereby offering you in cooperation with our partners a tailored solution
for your system.
Sumida
Schurter
Sauro
Preci-Dip
Pancon
Omron
MPE Garry
Molex
Lumberg
Keystone
JAE
GradConn
x
FCI
Ì
x
C&K
Assmann
WSW
Ì
AVX
Amphenol
Infocom
Amphenol
Industrial
Adam Tech
3M
Connectors & Cables
Cables & Cable Assemblies
Ì
Flat Cable
FFC/FPC
x
Coaxial Cable
IDC Cable
Ì
Cable Assembly
x
x
x
Ì
Ì
Ì
Ì
Ì
Ì
Ì
Ì
Ì
x
Ì
x
x
x
Rectangular Connectors
x
Battery Connector
Ì
x
x
x
Ì
x
Ì
Ì
x
x
Ì
Ì
x
x
x
Ì
x
Ì
x
x
DIN Connector
Ì
x
Board to Board Connector
x
x
Wire to Board Connector
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Ì
Ì
x
x
x
x
Wire to Wire Connector
Power Connector
x
IDC Connector
FFC Connector
x
PLCC/ IC Socket
Terminal Block
Ì
x
x
Ì
x
x
Ì
x
x
x
x
Ì
x
x
x
x
Ì
x
x
x
Ì
Ì
x
Ì
Ì
x
x
Ì
x
x
Ì
x
Ì
x
x
Ì
x
I/O Connectors
x
x
x
x
Memory-/SmartCard Connector
x
x
Ì
x
Ì
USB Connector
x
Ì
x
x
Audio / Video Connector
x
Ì
x
x
Modular Jacks
x
Ì
x
x
x
x
x
x
Ì
x
Ì
x
x
Ì
x
Ì
x
x
x
SATA Connector
Coaxial Connector
x
High Speed Connector
x
Customized Solution
x
Ì
D-Sub Connector
x
x
x
Ì
x
Ì
Ì
x
Ì
x
x
Ì
Ì
x
x
Ì
x
x
Ì
x
x
x
Ì
x
Ì
Ì
Ì
x
Ì
x
Circular Connectors
x
Industrial Connector
x
Signal Connector
x
Audio Connector
x
Focus
x
x
x
x
x
x
x
x
x
x
x
x
Ì
Sensor / Valve Connector
Ì
x
Ì
Mil Connector
x
x
x
x
x
Ì
x
x
Ì
Ì
x
available
Linecard
Song Chuan
SIBA
Schurter
Saft
Relpol
Panasonic
Omron
Ì
Ì
Ì
Ì
Ì
Ì
x
x
x
Ì
x
Ì
Ì
Ì
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Ì
Ì
Ì
x
x
x
Ì
Ì
Ì
Ì
Ì
x
Ì
Ì
Ì
Ì
Ì
Ì
Ì
Ì
x
Ì
Ì
x
Ì
Ì
Ì
x
Ì
Ì
x
x
x
x
x
x
x
x
Ì
Ì
Ì
Ì
Ì
Ì
x
x
x
x
NEC Tokin
Molex
Littelfuse
Ì
Ì
x
Ì
Ì
Ì
Ì
Ì
Ì
Ì
x
Ì
Ì
x
x
x
Ì
Ì
Ì
x
Ì
x
Ì
Ì
x
x
x
x
x
x
x
Ì
Ì
x
x
x
x
Ì
x
Ì
Ì
Ì
x
x
Ì
x
x
x
Knitter
Keystone
Jamicon
Fujitsu
EEMB
Eaton
Diptronics
Delta
COTO
Conquer
Comus
C&K
BMZ
B.B.Battery
Assmann WSW
ADDA
Í
Ì
Nickel Metalhydride
Lithium Metal Primary
Lead Acid
Alkaline Primary
Battery Holder
Focus
x
x
based on Lithium or Nickel Technologies
Ì
Finder
Relays
Signal Relay
HF Relay
Power Relay
Automotive Relay
Security Relay
PhotoMos Relay
Solid State Relay
Reed Relay
High Voltage Reed Relay
Reed Contact
Proximity Switch
Tilt & Tip-Over Switch
Timer
Industr. Relay PCB + DIN Rail
Socket PCB + DIN Rail
Fuses
5x20 / 6.3x32
Automotive Fuse
Subminiature Fuse
SMT Fuse
Resettable Fuse
Fuseholder
Pico Fuse
Switches
Tact Switch
DIP Switch
Slide Switch
Pushbutton Switch
Rotary Switch
Rotary Coded Switch
Encoder Switch
Toggle Switch
Keypad
Navigation Switch
Industrial Switch
Rocker Switch
Detection Switch
Microswitch/Snapacting Switch
Thermal Management
AC Fan
DC Fan
CPU Cooler
Blower
Heatsink
Heat Contacting Foil
Heat Pad
Batteries
Rechargeable Batterypacks
Adam Tech
3M
Relays, Fuses, Switches, Thermal Management & Batteries
x
x
x
x
Ì
Ì
Ì
Ì
Ì
x
x
Ì
Ì
available
Linecard
I/O Connector
USB3.1 (Type C) Connector
DX07
Electromechanical
Components
I/O Connector
USB 3.0 Connector
Features
Benefits
Meets High – Durability – Class (5000
mating cycles) requirements of USB 3.0
specifications
Sustains robust, reliable connectivity
ctivit over
high frequencies specifications of mating
and unmating
Meets all USB 3.0 specifications faster
than USB 2.0 and ensures devices are
sufficiently powered when required
Provides data rates up to 10 times
High-temperature, halogen- free plastic
material used in housing solder-mount
compatibility in application processes
Withstands IR reflow temperatures of
up to 255°C while maintaining
A variety of PCB- mount designs in upright,
vertical and right-angle orientation
Gives greater design flexibility and higher
degree of designs freedom to customers
Wide range of contact heights
(from 0.36 to 6.09mm) applications
For greater vertical space-savings in
low-profile and other
Wire to Wire Connector
Heavymate, MPN Series
erie C146
■ Hybrid interconnection
ion
■ High current up to 250A
■ Pole size from 3 up to
280 poles
■ Voltage up to 1000V
■ IP65 to IP68
■ High corrosion resistance
■ Superior contact technology
(Radsok & stamped contacts)
■ Very robust & vibration proof
housing
plug with
paddle card
receptacle front view
receptacle
top mount
Features
receptacle
■ New small form factor
■ Scales for future USB bus performance
■ Supports scalable applications
■ USB3.1 signaling supported 10Gbps currently à 20Gbps in
future
■ User friendly- Reversible insertion
■ No spring contacts in receptacle
(Consider the damage risk for device)
■ Friction lock equipped
■ Enhanced EMI performance
■ Power delivery supported (3A / 5A)
Board-to-Board Connector
ector
FCiAirMax VSE
E
Features
■ Provides AirMax system
em migration path for up to 25 Gb/s
Gb
per differential pair
■ FCI technologies for a shield-less design with no metallic
plates and closely edge-coupled differential pairs combined
with innovative design improvements yield low loss and
crosstalk
■ Fully backwards mating-compatible interfaces to existing
AirMax VSE connectors with minimal changes to connector
PCB footprints
■ Maintains pin assignment flexibility of AirMax VSE open
pin field design
■ Connectors with 3, 4 or 5 signal pairs/column will enable
backplane or coplanar applications
■ Available power and guide modules complement signal
connector offering
■ Compatible with Hard Metric equipment design practice
Connectors
Wire to Board Connector
I/O Connector
Series 70-9296
Single contacts
■ Flat
■ Low cost
■ Coplanar
■ PCB mating
Series 00-9296
Poke Home Vertical Top Entry
■ Unique 1-piece vertical WTB
to compete with 2-piece
Series 9176-500
Single IDC contact
■ Low cost ■ Gas tight
■ Single
MTJ-DUSB-88J01-FS-LV-M18 1
Adam Tech Combination Mod Jack with
Dual USB are a perfect choice stacked
design to save PCB real estate. Features
include High Performance for Maximum
EMI suppression and many LED color
options.
The option for Integrated magnetics add yet another way to
save space on the PC board and increase efficiency.
Series 9176-700
Capped IDC
■ Integrated
■ Simplifies
cap
assembly
Series 70-9159
Single 2pc contacts
■ Flat
■ Coplanar
PCB mating
■ Low cost
Accessory
Interface Module
e
Features
■ Reliable signal transmission
sion
solution
ssol
for
automation applications
■ Compact design
■ Eliminates long installation timess and
and costly
l wiring errors
■ Over 15 times faster than traditional “point-to-point” wiring
■ Regardless of interface on the controller side (D-sub, FRC,
RJ45, DIN strips etc.), interface to field devices is through 1:1
terminal blocks
■ Modules simplify interconnections between system I/O cards
and field equipment
High Power Connectors
RADLOK™
Features
■ DC Voltage Rating: 1000V;
V;;
Current Rating: 70A - 400A
A
■ High cycle durability (500 mating cycles))
■ Tool-Free Mechanical Locking
ki
■ Operating temperature -40°C to +125°C
Features
■ Quick locking feature to replace a cable lug
■ Pre-assembled and supplied with cable
■ Reliable, easy to install, rugged, and cost effective
■ Available in colors orange, red, and black
Accessory
Benefits
■ Safe and maintenance-free connection of signal lines
■ Space-saving, high-density wiring
■ Time saving and economical
■ Reduced labor costs
■ Available in standard configurations, or can be readily built
for customer requirements
■ Quick wiring, commissioning and troubleshooting.
Simple and time-saving
SRC (Boxes)
The SRC Din Rail Boxes are suitable
for fitting electronic devices which
can be hooked perpendicularly on the
DIN EN 50022 rail. They are made from a PC/ABS UL94-V0
self-extinguishing and recyclable mix.
Connectors
Electromechanical
Components
Mini I/O Connector
DZ02 Series
Memory-/
SmartCard Connectors
AVX/Kyocera 5000 Series
Connector group that includes connectors for standard
PCMCIA for PCs, CF complete with
h header, ejector,
push-push type SD, and SIM connectors.
ectors.
Series
PCMCIA 5027, XQD 5867,
CF Header 5610, CF Header 5620,
SD/MMC 5638, SD/MMC 5738,
microSD 5138, SIM 5036, microSIM 5236
Features
■ Push-on lock structure with superior operability
■ Supports SMT mounting with excellent coplanarity
■ Structure that prevents solder flux scattering by covering
bottom surface of contact area with an outer shell
■ Supports automated mounting with an embossed tape for
receptacle
■ 8 positions; 0.5A per terminal; 30V; -40 to +85°C; SMT
Applications:
Servo amplifiers, motion controllers, PLC (Programmable Logic
Controller), and other industrial machinery applications
Relays
Industrial Relays
Focus at Rutronik
F
R
is the Power Relay Group.
Rutronik offers a broad range of high quality products for all applications as well as special approved parts for white good applications,
home automation, renewable energy, and industrial exercise. Our suppliers provide all approvals like UL, VDE, CSA, TÜV etc.
We offer different contact materials so you can select the best solution for your need. All available coil voltages can be offered.
Applications
■
■
■
■
■
Fans (motors)
Door motors
Alarm lighting
Contact loads
Pump motors
■
■
■
■
Heater element
Lighting applications
Smart meter
White goods
Connectors, Relays
Fuses
Main Filter
SMD-Chip Fuses
1-stage Filter for 1- and 3-phase Systems
DIN Rail Mounting
SCHURTER offers a broad range of high-quality chip fuses,
which are developed specially for low-loss and precise overcurrent protection in secondary circuitry.
uitry.
try.
Type
USFF 1206, USF 1206,
USI 1206, UST 1206,
USF 0603, USF 0402
Features and benefits
■ Numerous current ratings
gs from 50mA to 25A
■ High rated voltages up to 125VAC/VDC
■ High breaking capacity of up to 600A (internal tests)
■ Super-Quick-Acting (FF), Quick-Acting (F) and Time-Lag (T)
versions
■ Precise, low power dissipation, resistant to vibrations and pulses
Applications
■ Secondary protection on SMD
PCBs
■ Industrial electronics
■ Smart meters
■ Battery protection
■ Sensors
■ Lighting
■ Mobile devices
■ Semiconductor
protection
Description
■ Chassis: DIN raill montage
■ Line filter in industrial version, 1 stage, high attenuation
■ Especially effective against asymmetrical interferences in the
frequency range
■ From 100kHz up to 30MHz
■ Easy and time saving handling
Characteristics
■ Protection against interference voltage from the mains
■ Possible interferences generated in the equipment are
strongly attenuated
■ Especially designed for electric switch and control cabinets
■ Suitable for use in equipment according to IEC/UL 60950
Approvals
■ VDE Certification
■ UL File
Switches2
DIP & Code Switches
C&K Components is a leader in interface and switch technology. C&K offers more than 55,000 part numbers that are built, priced and
delivered as standard catalog items, including tactile, navigation, detect, toggle, rocker, pushbutton, rotary, key, slide, DIP, thumbwheel
and illuminated switch products, along with smart card and high-reliability connectors. C&K has built its reputation as a customerfocused organization, providing superior support, flexibility and solutions at competitive prices. Whether it’s a standard, special or
custom product, C&K will deliver a cost-effective
ccomponent for all application-specific requirements.
CRD Series
RTE Series
10mm DIP Coded Rotary Switches
Low Profile Rotary DIP Switches
■ Process sealed – withstands
soldering and cleaning
■ Thru-hole & surface mount
models
■ Crisp, positive detent ensures
actuation
■ Miniature size with robust
metal cover
■ 2, 3, 4, 10 and 16 positions
■ Variety of codings available
■ Vertical and reverse versions
■ Computer & peripherals
■ RoHS compliant
■ Mechan. life:
30,000 steps min.
■ Operating Temperature:
-20°C to 85°C
Fuses, Switches, Main Filter
■ RoHS compliantt
■ Mechanical life:
RTE02/03: 1,500 actuations;
tu
RTE04/10/16: 20,000 actuations
DC Fans
AC Fans
Fan – Serie AFB
Serie JA / KA
■ Dimensions:
40x40x10 mm – 120x120x38 mm
■ Voltages: 5/12/24/48 V
■ Bearing: 2 Ball
■ Dimensions:
80x80x25 mm – 172x150x51 mm
■ Voltages: 110 / 220 V
■ Bearing: Sleeve / 2 Ball
DC Fans
DC Fans
Blower – Series BFB
Series JF / KF
■ Dimensions:
30x30x10 mm – 159x165x40 mm
■ Voltages: 5/12/24/48 V
■ Bearing: 2 Ball
■ Dimensions:
25x25x10 mm – 140x140x25 mm
■ Voltages: 5/12/24/48 V
■ Bearing: Sleeve / HTLS / 2 Ball
Heatsinks
Heatsinks with solder Pin
Attachable Heatsinks
Small Heatsinks
■ With solder pin
■ Retaining spring for transistors
■ Delivered in black anodized
finish
■ Thermal resistance 6 to 16K/W
■ For TO-220 packages
with straight solder pin
with angled solder pin
■ Thermal resistance >16K/W
■ Heatsinks for IC-module
■ U-heatsinks for transistor TO-220 packages
■ Special heats. for TO-220/SOT-32 packages
■ SMD heatsink for D-Pak packages
■ Stamped finger-shaped heatsinks
■ Thermal resistance > 16K/W
Stamped CPU Heatsink
For PGA (pin grid array), BGA (ball grid
array) and other high power components.
The new development series is a combination of cross-cut and finger-shaped
heatsinks. Optimally used to mount the
heatsink on the PCS via „Push Pins“.
Advantages
The advantage of this new heatsink design
improves the air convection.
Heatsink on PCB
Optional
■ Alternative material thickness
■ Modifications of all dimensions and
perforations
■ Special surface treatments
■ Customer made heatsink attachement
methods
Fans, Heatsinks
Stamped CPU heatsink
Stamped CPU heatsink +
thermal pad
Batteries
Lithium Metal Coin Cells
Features
Wide portfolio of coin sizes and
variety of pin types
Benefits
Different ways of contacting at different space
Long-term energy,
reliability and storability
■ Low self discharge rates
■ High energy desities up to
375 Wh/kg
■ Wide temperature range
Direct support at the world
leading manufacturer of lithium
metal coin cells
Unique diversity of technologies
Type
High quality, best technical
solution, safety and conformity
Special series for lasting
back-up (BR), rechargeable
usage (VL,ML,MT), high
temp. up to 125°C (BR-A)
Primary battery
Material Anode
Rechargeable battery
CR
BR
VL
ML
MT
MnO2
(CF)n
V2O5
LixMnOy
LixOy
Material Kathode
Li
Li
LiAl
LiAl
LixTiOy
Nom. Voltage (V)
3.0
3.0
3.0
3.0
1.5
Operating temp. range (°C)
–30 to +60
–30 to +80
–20 to +60
–20 to +60
–10 to +60
Self-discharge (per year) under standard
conditions
1.0%
1.0%
2.0%
2.0%
2.0%
Average discharge voltage (V)
-
-
2.85
2.5
1.2
Charge voltage (V)
-
-
3.25 to 3.55
2.8 to 3.2
1.6 to 2.6
Cut-off voltage (V)
2.0
2.0
2.5
2.0
1.0
Charge-discharge cycles
-
-
1,000 charge/discharge partly
(charge/discharge for 10% of
discharge depth )
1,000 charge/discharge partly
(charge/discharge for 10% of
discharge depth )
500 charge/discharge up to 1V
or discharge limit voltage (charge/
discharge for 100% of discharge
depth )
Battery Holders
Variety of Battery Holders
Coin, horizontal
Coin, vertical
Coin, retainer
Batteries, Battery Holders
Coin, contact
Five good reasons for
choosing Rutronik24
Order online and receive personalised on-site
support. We offer Catalog, Procurement,
Mass Quotation and Product Change Notifications.
1.
Personal support
You got it.
With Rutronik24 we have created a modular platform
that significantly simplifies your business processes.
The advantages of rapid online orders are combined
with a personal advisory service, tailored to your
needs. This has not replaced our personal service;
on the contrary: We are adding to it.
2.
Catalog
All roads
lead to us.
Are you looking for a particular electronic component?
Our Rutronik24 catalog will guide you reliably to the right choice:
Our Product Groups Search will enable you to find the product you
are looking for in a maximum of three steps. The product groups
are divided into semiconductors, passive and electromechanical
components, storage technologies, displays & boards as well as
wireless technologies. Using the full-text and part number search,
you can select results after entering parts of the product or manufacturer‘s name.
3.
Procurement
Everything
at a glance.
The Rutronik24 “Procurement” module provides you
with a complete overview of your orders, item lists,
stocks, contracts and delivery times. You can conveniently download all the lists in Excel format and import
them into your inventory control system, for example.
Take the opportunity to save time.
Advantages
for Developers
■ Search and filter according to a maximum of
12 technical parameters
■ Full text and part number search
■ Data sheets, product links, application manuals
■ Alternative replacement items suggested, e.g.
with discontinued components
for Buyers
■ Quotation request or direct ordering with the delivery
and payment conditions agreed with Rutronik
■ Position your complete component list in the mass
quotation tool and receive a complete offer
■ Direct contact with your Rutronik contact person –
worldwide
Visit us at
www.rutronik24.com
4.
Mass quotation
Everything in just
a few seconds.
Rutronik24 offers you the opportunity to access all the
information about our products very quickly. We have
developed the “Mass quotation” tool for the fast and
simple evaluation of your individual material. Upload
your comprehensive item lists to our system in one
file and this will then be returned to you, complete with
current prices and additional information, just a few
moments later.
5.
PCN
Everything from
a single source.
Be fully informed of changes. Our Rutronik24 “PCN”
module keeps you up-to-date with current product
changes from our manufacturers. Not only do you have
access to an extensive PCN database, but the product
changes are also linked directly to the respective product. This gives you the opportunity to react in good
time to the changes.
Germany – Headquarters
Rutronik Elektronische Bauelemente GmbH | Industriestraße 2 | 75228 Ispringen / Pforzheim
Tel. +49 7231 801-0 | Fax +49 7231 82282 | E-Mail: rutronik@rutronik.com | www.rutronik.com
Frankfurt
Frankfurter Straße 151 c
63303 Dreieich
Tel. +49 6103 2 70 03-0
Hannover
Rendsburger Straße 32
30659 Hannover
Tel. +49 511 228507-0
Nürnberg
Südwestpark 10/12
90449 Nürnberg
Tel. +49 911 6 88 68-0
Dresden
Radeburger Straße 172
01109 Dresden
Tel. +49 351 20 53 30-0
Freiburg
Basler Landstraße 8
79111 Freiburg
Tel. +49 761 61 16 77-0
Mannheim
Amselstraße 33
68307 Mannheim
Tel. +49 621 76 21 26-0
Ostwestfalen
Brockweg 133
33332 Gütersloh
Tel. +49 5241 2 32 71-0
Erfurt
Flughafenstraße 4
99092 Erfurt
Tel. +49 361 2 28 36-30
Hamburg
Neue Gröningerstraße 10
20457 Hamburg
Tel. +49 40 3 59 60 06-20
München
Landsberger Straße 392
81241 München
Tel. +49 89 88 99 91-0
Ratingen
Gothaer Straße 2
40880 Ratingen
Tel. +49 2102 99 00-0
France
Rutronik S.A.S
6, Mail de l’Europe
78170 La Celle St Cloud
Tel. +33 1 30 08 33 00
rutronik_sas@rutronik.com
Bordeaux
Tel. +33 5 57 26 40 00
Grenoble
Tel. +33 4 76 61 00 90
Le Mans
Tel. +33 2 43 78 16 97
Lyon
Tel. +33 4 72 76 80 00
Poitiers
Tel. +33 5 49 52 88 88
Rennes
Tel. +33 2 23 45 14 40
Strasbourg
Tel. +33 3 88 78 12 12
Netherlands
Rutronik Elektronische
Bauelemente GmbH
Papland 4a
4206 CL Gorinchem
Tel. +31 183 64 60-50
Slovakia
Bauelemente GmbH, o.z.
Lazovná 11
97401 Banská Bystrica
Tel. +421 48 4 72 23-00
Norway
Bauelemente GmbH
Olav Helsets vei 6
0694 Oslo
Tel. +47 22 76 79 20
Slovenia
Bauelemente GmbH
Motnica 5, 1236 Trzin
Tel. +386 1 5 61 09 80
European branches:
Austria
Bauelemente Ges. m. b. H.
Durisolstraße 11
4600 Wels
Tel. +43 7242 4 49 01
Belgium
Rutronik Belgium BVBA
Keppekouter 1
Ninovesteenweg 198
9320 Erembodegem-Aalst
Tel. +32 53 60 65 90
Bulgaria
Bauelemente GmbH
Blvd. Nikola Vaptzarov 35
Business Center Lozenec
Floor 1, Office No 1B
1407 Sofia
Tel. +35 92 974 86 46
Czech Republic
Bauelemente CZ s.r.o.
Brno
Pražákova 1008/69, 15. f loor
639 00 Brno
Tel. +420 5 4 54 24-681
Prague
Na Pankraci 1638/43
140 00 Praha 4
Tel. +420 2 33 34 31 20
Denmark
Bauelemente GmbH
Herstedøstervej 27-29
2620 Albertslund
Tel. +45 7020 19 63
Estonia
Bauelemente GmbH
Vaksali 17A
50410 Tartu
Tel. +372 7370951
Finland
Bauelemente GmbH
Malminkaari 5
00700 Helsinki
Tel. +358 9 32 91 22 00
RUSOL GmbH & Co. KG
Industriestraße 2
75228 Ispringen
Tel. +49 (0) 7231 801-2910
rusol@rusol.com
www.rusol.com
International branches:
Hungary
Rutronik Magyarország Kft.
Alíz utca 1
1117 Budapest
Tel. +36 1 371 06 66
Italy
Rutronik Italia S.r.l.
21, Via Caldera
Centro Direzionale S.Siro
20153 Milano (MI)
Tel. +39 02 4 09 51-1
italia_MI@rutronik.com
Poland
Rutronik Polska Sp. z o.o.
ul. Bojkowska 37
44-101 Gliwice
Tel. +48 32 4 61 20 00
Gdynia
ul. Batorego 28-32
81-366 Gdynia
Tel. +48 58 7 83 20-20
Warsaw
ul. Broniewskiego 3
01-785 Warszawa
Tel. +48 22 462 70-50
Portugal
Bauelemente GmbH
Av. General Humberto Delgado
Porta 8, 1ºAndar, Sala R
4760-012 V. N. Famalicão
Tel. +351 252 3 12-336
Bologna
Tel. +39 051 6 46 32 00
Romania
Bauelemente GmbH
Martin Luther Str. no. 2, 3rd floor
300054 Timişoara
Tel. +40 25 64 01 240
Florence
Tel. +39 055 8 82 73 32
Bucureşti
Tel. +40 314 25 38 39
Ancona
Tel. +39 071 2 91 62 18
Padua
Tel. +39 049 8 69 78 00
Rome
Tel. +39 06 228 782-1
Turin
Tel. +39 011 9 02 20 00
Lithuania
Bauelemente GmbH
Raudondvario pl.76
47182 Kaunas
Tel. +370 37 26 17 80
Russia
Rutronik
Beteiligungsgesellschaft mbH
Levoberejnaya sreet 12
Hotel Soyuz, office 314
125445 Moscow
Tel. +7(499) 963 31 84
Serbia
Bauelemente GmbH
YUBC Bul. Mihajla
Pupina 10z/IV, 11070 Beograd
Tel. +381 11 311 33 66-3
Spain
Rutronik España S.L.
Barcelona
C/ Marqués de Sentmenat 54 - 58,
3a Planta - 1o, 08029 Barcelona
Tel. +34 93 4 44 24 12
Madrid
C/ Santa Leonor 65, Avalon Parque
Empresarial, Edificio A28307, Pta 4
28037 Madrid
Tel. +34 91 3 00 55 28
USA
Rutronik Inc.
3 Summit Park Drive, Suite 535
Cleveland, Ohio 44131
Tel.: +1 216 328 8900
Mexico
Rutronik Mexico S.A. DE C.V.
Av. Armando Birlaing Shaffler
No. 2001 Piso 8 A-II
Corp. Central Park Torre 1, Centro Sur
76090 QUERETARO, Qro.
Tel. +52 442 103 1800
China
Rutronik Electronics (Shenzhen)
Co., Ltd
Shenzhen
Room 807, Excellence Bldg.,
No. 98, Fuhua 1 Road
Futian Distr., Shenzhen
Tel. +86 755 8240 7106
San Sebastián
Po Ubarburu, 71 - 1oE
20115 Astigarraga/Guipuzcoa
Tel. +34 943 40 45 28
Shanghai
Room 1710, Dongchen Tower
No. 60, Mudan Road
Pudong New Distr., Shanghai
Tel. +86 216 8869 910
Sweden
Rutronik Nordic AB
Kista Science Tower
Färögatan 33
16451 Kista
Tel. +46 8 50 55 49 00
Chengdu
Room no. 407, 4F
No. 31 Zong Fu Street
610016 Chengdu
Tel. +86 28 8651 2214
Switzerland
Bauelemente AG
Volketswil
Brunnenstrasse 1
8604 Volketswil
Tel. +41 44 9 47 37 37
Yverdon-les-Bains
Rue Galilée 15,
1400 Yverdon-les-Bains
Tel. +41 24 4 23 91 40
Turkey
in foundation
Tel. +49 7231 801-1751
rutronik_tr@rutronik.com
United Kingdom & Ireland
Rutronik UK Ltd.
1-3 The Courtyard, Calvin Street
The Valley, Bolton
BL1 8PB, Lancashire, UK
Tel. +44 1204 363311
Hong Kong
Rutronik Electronics Asia HK Ltd.
Hong Kong
54/F, Hopewell Centre
183 Queens Road East, Wan Chai
Hong Kong
Tel. +852 5337 0119
Taiwan
Rutronik Electronics Asia HK Ltd.
Taipei (Taiwan representative office)
8F, No. 367, Fuxing N. Rd.,
Songshan Dist, Taipei City,
10543 Taiwan
Tel. +886 (2) 2175 2936
Thailand
Bauelemente GmbH
2/1 Soi Rom Klao 25/2
Rom Klao Road, Khlongsamprawet
Ladkrabang, 10520 Bangkok
Tel. +66 2 737 6423
Q06 ENG | KNA | Specifications subject to change without notice.
Please note, there could be some limitations for some franchised product lines in several countries. For more information, please contact our sales team.
Berlin
Justus-von-Liebig-Straße 7
12489 Berlin
Tel. +49 30 8 09 27 16-0

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