MacuSpec VF Series - MacDermid | Electronics Solutions

MacuSpec VF Series
Electrolytic Copper Metallization
PTH And Micro Via-Bility
In A Single Bath
MacDermid MacuSpec VF Series is a unique, production
proven process that is specifically engineered to be the
most effective method to simultaneously plate through
holes and fill blind microvias in one bath. Developed for
fabricators and OEMs that require increased productivity
and faster ROI, it eliminates an entire process sequence for
greater application flexibility, while increasing overall bath
life 400%.
Pattern and panel plate capable, MacuSpec VF Series
is a dropin solution that provides exceptionally wide
capabilities, including double deep vias of 1.4:1 aspect
ratios, and surface copper of less than 25 microns. Able to
minimize surface copper, it requires no planarization, and
reliably delivers through hole micro distribution of 87%
at 6:1 aspect ratio. MacuSpec VF Series deposits the right
amount of copper at the knee of the holes, with no cracks
after 6x solder shock.
When it comes to the most efficient way to plate through
holes and fill blind microvias, count on one company MacDermid.
Key Features
• Simultaneously fills blind microvias and
plates through holes
• Optimized for pattern and panel plate capabilities
• Minimizes copper deposition of the surface,
eliminating need for planarization
• Increases overall bath life 400%
• Reliable thermal cycle performance
• Wider operating window
• Meets IPC specification
MacuSpec VF Series
Electrolytic Copper Metallization
Wider Operating Window.
Greater Versatility. Lower
Total Cost. Proven Effective.
Increase production efficiencies and reduce
total costs with MacuSpec VF Series, the
electrolytic copper metallization solution
that is used by many of the world’s largest
electronics manufacturers to simultaneously
plate through holes and fill blind microvias in
one bath. It produces a bright, fine-grained,
ductile deposit with excellent physical properties
while increasing bath life 400%. Supported by
MacDermid’s renowned hands-on global
technical service, MacuSpec VF Series does
it all for less.
MacuSpec VF Series Reliability
Reliability Test
Conditions
Results
Thermal Stress
IPC TM-650 2.6.8
(6x 10 second solder float @288°C)
PASS
Interconnect
Stress testing
IPC TM-650 2.6.26
(6x precondition @ 260°C ,
ambient to 190°C 1000 cycles)
PASS
Thermal Cycle Test
IPC -6012C class 3
(-40°C to 140°C, 1000 cycles)
PASS
MacuSpec VF Series can fill 150 micron diameter by 100 micron deep blind micro
vias, while plating through holes at the same time in pattern plate mode.
245 Freight Street, Waterbury, CT 06702 USA • Telephone: +1 203.575.5700 • electronics.macdermid.com
© 2014 MacDermid, Inc. All rights reserved. All trademarks are the property of their respective owners.