Optical, sensing and laser related applications of Osprey CE alloys

Transcription

Optical, sensing and laser related
applications of Osprey CE alloys
Dr Andrew Ogilvy, Sandvik Osprey Ltd.
Presented by
Stu Weinshanker, Advanced Packaging Associates, Inc.
IMAPS/IEEE-CPMT
/
Advanced
d
d Technology
h l
Workshop
k h on
Optoelectronic Packaging
June 29 - 30, 2011
M D
McDonnell
ll Douglas
D
l Engineering
E i
i Auditorium
A dit i
University of California - Irvine
Irvine, California
Sandvik Materials Technology
Copyright 2011 Sandvik Osprey Ltd - Confidential and Proprietary
What are the CE Alloys
Public Domain Examples
Who is Sandvik Osprey
Requirements for Optical Substrates
1.
Matched CTE to active optical devices, passive elements
1.
2.
Isotropy – same properties in all directions
Low thermal distortion
1.
2.
3.
4.
High thermal conductivity
Low density
1.
2.
5.
6.
7.
8.
9.
High stiffness
Low CTE
Enables rapid movement
Useful for airborne or mobile applications
Good machinability
Weldable
Plateable, Suitable for conversion coatings
Vacuum Compatability
Readily availabile
Controlled Expansion Aluminium Alloys
The material can be designed to match any required expansion
rate from 17ppm/oC down to 5ppm/oC …
CE Alloys replace -
CE Alloy Type
CE17
Stainless Steel / Copper
CE15
CE13
AlBeMet
CE11
CE9
CE7
Steel
Titanium
Alumina / Sapphire
CE5
Aluminium Nitride
Coefficient of Thermal Expansion (ppm/oC)
Controlled Expansion Aluminium Alloys
Standard alloys CTE match
common active, passive opto materials
G N( )
GaN(c)
AlN
Nd Vanate (c)
Y YAG
YrYAG
AlGaN GaAs
Sapphire
NdYAG
TiO2 (a)
Cr Forsterite
YbYAG
TiO2(c)
CE5 CE6 CE7 CE8 CE9
Nd Vanate (a)
CE11
CE Alloy Microstructure
Range of Standard Materials
100 
CE7 (30% Al)
CE11 (50% Al)
Two co-continuous phases
CE17 (73% Al)
Insufficient Si to form
continuous phase
The CE Alloys ARE NOT AlSiC
CE7
Typical AlSiC Microstructure 1
AlSiC is a Composite: Engineered materials made from two or more constituent materials that
remain separate and distinct on a macroscopic level while forming a single component.
http://en.wikipedia.org/wiki/Composite_material
An alloy is a combination, either in solution or compound, of two or more elements, at least
one of which is a metal, and where the resulting material has metallic properties. An alloy
with two components is called a binary alloy. http://en.wikipedia.org/wiki/Alloy
1–
from http://www.alsic.com
OSPREY CE ALLOYS ENABLED BY
Proprietary Spray Forming Technology
 Homogeneous/Isotropic Properties




molten alloy gas atomized
sprayed to form solid billet
rapid solidification - fine structure
product is homogeneous and isotropic
Thermal Expansion
as Function
F
ti off T
Temperature
t
Osprey CE alloys between -77°C (-196K) and 127°C (400K)
25
Aluminium
u
u
Silicon
CE7 (Al-70Si)
CE11 (Al-50Si)
CE17 (Al-27Si)
C TE , p
ppm/°C
20
15
10
5
0
-300
-200
-100
0
100
200
Temperature, °C
OSPREY CE ALLOYS OFFER: High
Hi h

Thermal
Th
lC
Conductivity
d i i
thermal
conductivity 120-170W/mK
Kovar
Titanium
Conductivity of packaging materials
Alumina
CE7
CE17
CE Alloys
Al-68SiC
Cu90%W
%
0
50
100
150
W/mK
200
OSPREY CE ALLOYS OFFER: Lightweight

the lightest thermal management materials available
Cu90%W
Kovar
Titanium
Al i
Alumina
Al-68SiC
CE Alloys
0
5
10
15
Density of packaging alloys
g/cc
20
Specific stiffness
Material
Specific Stiffness
annealed condition
• Specific
S
ifi stiffness
tiff
(more properly called
specific
p
modulus)) is
Young's
modulus/density
• Most commonly used
for comparing materials
so the
th units
it are nott
important.
CE7 – CE17
53 - 35
Molybdenum
Al 6061
Stainless Steel
CP Titanium
K
Kovar®
®
85W-Cu
Al G hi
Al-Graphite
32
25
25
24
16
15
35 ((x-y)) 28 (z)
( )
http://www-materials.eng.cam.ac.uk/mpsite/properties/non-IE/stiffness.html
Machining CE alloys

All the CE alloys can be machined



Rate of machining dependant on Si
content




Conventional CNC machines with solid
carbide tooling
Electro-discharge
g machining
g
CE17 ~ AA6061 speeds
d
CE11 ~ 50% AA6061 speeds
CE7 ~ 20% AA 6061 speeds
Tolerances depend on machine
Joining techniques

CE alloys can be joined using most techniques used
to jjoin conventional aluminium alloyy


Diffusion bonding
Welding (up to 50% Si)





Brazing


MIG/TIG
Laser
E-beam
FSW
Al alloy, vacuum-based
Soldering


Conventional soldering of plated surface
Diffusional Soldering
Plating
g
 Plateable alloys
all the CE alloys can be plated
 plating with Ni, Au and Ag
 modified process to that used for plating Al alloys

Standard aluminum process
Modified Process
Modified
difi d clean
l
etch
h and
d activate
i
Zi t
Zincate
Ni Plate
Pl t
B k 200ºC
Bake
A plate
Au
l t
Conversion Coatings
g
 Anodising
2.5 enhanced anodize
Can be made electrically insulating (500V or more)
with
ith an inorganic
i
i coating
ti
Black Chrome Finish

Optical Black Chrome

Guaranteed asorptivity of 0.97 at
wavelengths
g of 1.5,, 2.5 microns.

Actual measured reflectance
(MSNT) at 1064nm was 0.000%
Osprey CE Alloy Plate
Typical Production Route
Spray-form
Billet
HIP
Billet
Block
Saw
Slice
EDM
Ni/Au Plate
or CNC
Pl t
Plate
Product
Typical Requirements
for Optical Substrates
CE7
CE9
CE11
Kovar
®
AlN
Al2O3
Ti
AlSiC
6061
Al
AlGraphite
CTE Matching
Mech Stability
Mech Stiffness
Isotropic
Low Density
Good Thermals
Machinable
Plateable
Weldable
Vacuum Compat
Th S
The
Sandvik
d ik O
Osprey CE alloys
ll
uniquely
i
l satisfy
ti f ALL requirements
i
t
Laser Range Finder


Multiple customers consider
high Si CE alloys as the
material of choice to support
laser filters and other optical
components,
co
po e s, manage
ge heat
e oon
precision laser benches
Selection criteria:





Matched CTE over wide
temperature range
Machinable to extremely tight
tolerances, precision flatness
Stiff
iff and
d thermally
h
ll stable
bl
Light weight – mobile
applications
Compatible with preferred
adhesive systems
Typical laser rangefinder
Pallet for laser system
High Energy Solid State Laser Benches


Army Research Laboratory selected CE7 as
the optimal heat sink / pallet / bench
material for high energy solid state laser
systems.
systems
CE7 Selection criteria:





Machinability
Stiffness
Density
Thermal conductivity increase when cooled to
cryogenic operating range
Superior CTE match over wide temperature
range
Yag Crystal
Astronomy CCD IR Imagers




Camera covers one degree field of
view (4x full moon area)
Array of 64 CCD Si-based detectors
giving 1G pixel image
Active on-chip image motion
correction Individual CCD tiles
supported on CE5 frames
CE5 S
Selection
l ti criteria:
it i




Each element of
the array tips and
tilts to
compensate for
mirror and
atmospheric
distortion
Machinability
Stability, stiffness
Thermal conductivity increase when
cooled to cryogenic operating range
Superior CTE match over wide
temperature range
CE5 Frame with CCD chip attached
Laser Pump
p Package
g for MOMA*
* Mars Organic Molecule Analyser


Package
g designed
g
for the
high power NdYAG laser
pump on the MOMA
instrument in Pasteur
payload on ESA Exomars
mission.
CE7 selection criteria:





Weight
Machinability
CTE match
Stiffness
Thermal
h
l conductivity
d i i
Teledyne Dalsa X-Ray
X Ray Detectors



TELEDYNE DALSA CMOS X-Ray detectors are created
from individual crystalline Si CMOS sensor ‘tiles’.
The CMOS detector is attached to a CE7 machined plate
plate.
This plate acts as a mechanical support and heat sink. The
flatness, stiffness and CTE are the most important design
features
Th
These
“buttable”
“b bl ” sensors are designed
d i d with
i h flexibility
fl ibili in
i mind
i d
for assembly intolarge two-dimensional arrays with less than
one pixel spacing in between individual sensors.
Plated carrier for Xray detector
23X28CM DALSA FULL FIELD DIGITAL MAMOGRAPHY CMOS
DETECTOR, FEATURING A 2X3 ARRAY OF CMOS IMAGE SENSOR TILES
WITH A 33 MICRON PIXEL PITCH. TOTAL RESOLUTION : 60MP
Teledyne Dalsa X-Ray
X Ray Detectors


The Helios10 MD is packaged in a custom-molded housing
with a slim cassette form factor and integrated handle.
Designed with portable imaging applications in mind, it weighs
less than 3 kg and is easily positioned using just one hand.
Space Telescope Components


Telescope support tube machined
from single CE13M billet
Low cost replacement material
for AlBeMet
AlBeMet
162
CE13M
Density g/cc
2.1
2.65
Specific Stiffness
92
35
Relative Cost
10
1
X-Ray
X
Ray Lithography Table

Largest CEalloy part





1200mm x 1100mm x
200mm
A
Approx
700k
700kg fi
finished
ih d
CE11 alloy
Final machining and
polished to fine finish
Total flatness tolerance of
7 micron over the top
surface
CE6 Wafers for High Brightness LED
W f llevell carriers
Wafer
i
Expansion of CE alloys and Sapphire
Normalised to 25oC
Property
Sapphire
CE6
CTE 25 – 500oC
58
5.8
62
6.2
Density g/cc
4.0
2.45
Bend Strength MPa
450
150
3.5
Young’s Modulus GPa
350
130
3
Thermal Conductivity W/mK
35
110
Electrical Resistivity μ Ω.cm
1014
115
Platability
Poor
Good
1
Machinability (CNC.EDM)
Poor
Good
0.5
Price
6
1
dL/Lo x 10
-3
3
4
2.5
2
1.5
0
0
100
200
300
400
500
o
Temp C
Typical wafer stack for HBLEDs
6”
SRM 732
Epitaxial Layers
Reflective layer

Au bond layer
CE6 Substrate/ contact
CE6
CE7
CE5
After bonding CE6/ Epi and Sapphire
wafers remain flat
CE6 Wafers for concentrator PV Cells
Large Di
L
Die (10 x 10mm)
10
)
requires support
and thermal management
CE6 matched to III/V CTE
Current Wafer Developments



Production of 6” CE6 alloy wafers
has
as sstarted
a ed
Wafers produced down to 200
microns
Polished, coated and plated wafers
maunfactured

S tt d coatings
Sputtered
ti
(on
( polished
li h d wafer)
f )




Si, SiC and C
Ti/Pd/Ni/Au
Cr/Pd/Ni/Au
Electroless plating (on polished wafer)

Ni/Au
4”, 6” and 8” wafers
Sandvik Osprey
p y CE Alloys
y
Custom Controlled Expansion
Microelectronic Packaging Solutions
• Custom turnkey components
• Machined, Plated, Hermetic Feedthroughs
• US-based option for Export Controlled Articles
• Significant
Si ifi t inventory
i
t
off Standard
St d d Compositions
C
iti
Sandvik in 2010 …

Sales US$ 12 billion

50,000 Employees in 130 Countries

Products with high R&D and Added Value

Global Leader in Selected Areas

Cutting
C
tti T
Tools;
l Mining
Mi i andd Construction;
C t ti
p
y Steels, Engineered
g
Materials
Specialty
Sandvik Osprey
p y Activities Today
y
Powders Group
World Leading
M
Manufacturer
f t
off G
Gas
Atomised Powders
Spray Form / CE
Alloys Group
Controlled Expansion
Alloys for Electronic
Packaging and More
Thank you for your attention
http://www.smt.sandvik.com/osprey
http://www smt sandvik com/osprey
http://www.cealloys.com

Optical, sensing and laser related applications of Osprey CE alloys

Transcription

Similar documents

Musterseite_A3-Prospekt:MR300 series

Silego Technology - Globalpress Electronics Summit

OL396 Gunwharf Quay

sandvik alpha™ rock drilling tool system

Sandvik Prisec™ HSI Crushers - Sandvik Mining and Construction

Sandvik Breakers in Action - Sandvik Mining and Construction

wolfram bergbau und hütten ag 2015

Sandvik Jaw Crushers - Sandvik Mining and Construction