Adv. Micro., Nov/Dec 2003, Vol. 30 #6 - Complete

Transcription

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03 ils
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IM gra sid
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AAdvancing
d van ci ng
i croelectronics
MMicroelectronics
Inside the Multichip Module, Hybrid, Electronic Packaging and Surface Mount Industries
Published by IMAPS - International Microelectronics And Packaging
Society & Sidney J. Stein Educational Foundation (www.imaps.org)
Volume 30, No. 6
November/December 2003
Microelectronics - the bridge to the future.
Revolutionary things happen in Boston.
IMAPS 2003
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Advancing Microelectronics
November/December 2003
Features
Microelectronics - the bridge to the future.
IMAPS 2003
Delip “Doug” Bokil
IMAPS 2003 Technical Program
6
7
2003 IMAPS Award Winners
24
2004 Executive Council of IMAPS
26
MMRC Steering Committee
Welcomes 2003 Attendees
30
Revolutionary things happen in Boston.
Departments
President’s Corner..............................................2
From the Editor ..................................................3
Asian News ...................................................... 35
Around the Microcircuit ..................................39
New Products ..................................................40
Companies & People ........................................40
From the Web ..................................................42
Chapter Contacts ............................................42
Calendar of Events ..........................................43
IMAPS Members ..............................................44
Who to Call at IMAPS Headquarters ..............52
Advertiser Hotline ............................................52
Web Advertiser Hotline ..................................52
Michael P. O’Neill
In Memoriam
John W. (Jack) Balde
The Best of Boston
connecting the past, present and future
37
51
IMAPS Europe
European Editor ..................................................5
European News ................................................32
IMAPS - International Microelectronics And Packaging
Society & Sidney J. Stein Educational Foundation
611 2nd Street, NE,Washington, DC 20002
Tel: (202) 548-4001 Fax: (202) 548-6115
E-mail: IMAPS@imaps.org
See us on IMAPS’s Home Page: www.imaps.org
November/December 2003 - Advancing Microelectronics 1
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Looking to the Future - Again!
Peter Barnwell, Ph.D.
Heraeus Incorporated
Circuit Materials
Division
IMAPS
President, 2003
This is my last President’s Column, which
is being written twelve months after taking
over as President just before the Denver
Symposium. By the time you read it I will be
about to finish my term at the Boston
Symposium in November. As is so often the
case I have to ask myself - “where did the
time go”? It has been a busy, demanding and
challenging, but most of all extremely exciting, time and one I would not have missed.
Whilst I could spend time discussing
what has been done during the year this
would merely be a reprise of my other
columns during the year. Suffice to say that
a lot of changes have been made and new
activities have been developed. What is far
more important is to look to the future. I
will be followed as President by Phil Zulueta
who has an outstanding background in our
industry and will make an excellent
President of our Society. Phil and I have on
several occasions discussed the ongoing
need for change and I am particularly
pleased that his strategic plan - posted on
our web site at www.imaps.org - adds significantly to mine. Phil has placed particular
emphasis on enhancing student member-
ship activities, something which is vital to
the future, as we continually need new people and new ideas.
I hope Phil will excuse me for making a
few comments about the future.
I continue to have a passionate belief in
the future of our Society and our industry. I
keep hearing many comments about the difficulties in business and that, when the
recovery comes, we will live in a different
world. Yes, of course we will! - that is the
nature of a high technology business and
there is nothing new here. Everything
changes and it is our ability to embrace that
change and take advantage of it that makes
for success. Our Society has shown itself
willing to make changes in many ways over
the years. Whilst the Annual Symposium is
the focus of our year, there are many other
events for all the members. Our Advanced
Technology Workshops (ATWs), the new
Ceramics Conference and most important
for many, the local chapter meetings. Add
the publications and the international linkage and you will see a society that is not living in the past but moving vigorously forward. We are unique in our breadth of technologies as indicated so clearly by the ATW
topics - a range covered by no other society.
So - IMAPS has a great future leading the critically important world of Microelectronics
Packaging.
BUT - we must continue to change and
develop. There are of course many threats to
our industry and our Society. The only way
we can succeed in spite of these threats is by
vigorous and continual change. I believe that
this change needs to be accelerated and can-
not be achieved if we are timid. So - my message to both IMAPS and our industry is “BE
BOLD”. A bold approach tempered by good
common sense will take us all forward to a
successful future.
Thank You!
In concluding this column, I would like to
thank everyone who has assisted me during
my term in office. There are too many of
these to list individually, so it has to be an
overall thanks, including all our volunteers,
both local and national; all the staff and finally my company Heraeus CMD. All of these
have given me unstinting support; frequently
well beyond the call of duty.
At the same time I would like to take the
opportunity to say farewell to the members
and my many friends in the Society. As you
may be aware, Heraeus CMD has terminated
my contract with them from the end of
November, 2003, which means that during
my term as First Past President I will have
very limited travel opportunities. As I live in
the UK and at present have no serious visibility of work in the industry, this means that
I will probably disappear “in a puff of smoke”
in November. I will nonetheless work as
First Past President in every way that I can,
will attend Council meetings and hope to be
in Long Beach for the 2004 Symposium. But
- I have been in this business a long time, so
I may pop up again somewhere!
Either way - see you in Boston.
Peter Barnwell - peter@barnwell.org.uk
IMAPS Advanced Technology Workshop on
Packaging Copper/Low-K Semiconductors
December 15 - 17, 2003
Red Lion Hanalei Hotel - San Diego, CA
Many benefits have been realized with the successful implementation of Copper metallurgy and Low-K dielectrics into
the front-end manufacturing processes for semiconductors, including: increased device speed, reduced power
consumption, denser circuitry, and reduced cost of manufacturing. This rapid shift from aluminum/oxide to Copper/
Low-K semiconductors has also lead to the immediate need for new technologies in the back-end processes (packaging
& assembly). The technical program for this ATW will focus on the latest packaging and assembly technologies for
Copper/Low-K semiconductors.
Full Program & Registration at www.imaps.org/copper
2 Advancing Microelectronics - November/December 2003
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UPCOMING IMAPS
EVENTS
ATW on Pkg of MEMS & Related
Micro Integrated Nano Systems
November 20 - 22, 2003
Sheraton Boston Hotel
Boston, MA, USA
www.imaps.org/mems
01
ATW on Packaging Copper/Low-K
Semiconductors
December 15-17, 2003
Red Lion Hanalei Hotel
San Diego, CA
www.imaps.org/copper
01
MMRC Winter Conference 2004
January 14-16, 2004
Sheraton San Diego Hotel & Marina San Diego, CA
www.imaps.org/mmrc.htm
01
ATW on Military, Aerospace, Space &
Homeland Security:
Pkg Issues & Applications
March 28-30, 2004
Renaissance Harborplace Hotel Baltimore, MD
www.imaps.org/military
01
IMAPS Ceramics Conference &
Exhibition
April 27-28, 2004
Hyatt Regency Denver - Denver, CO
www.imaps.org/ceramics
01
HiTEC 2004 - High Temperature
Electronics Conference
May 18-20, 2004
Hilton of Santa Fe - Santa Fe, NM
www.imaps.org/callfor/hitec2004.htm
Goodbye, Farewell,
Auf Wiedersehen, Adieu!
Mary McDonald
ISO/QS, Inc.
Editor
As one of my children’s favorite songs
from The Sound of Music says,“The time has
come for me to say goodbye.” As Editor of
Advancing Microelectronics for the past
four years (ohmigosh, has it really been that
long?), I’ve had the opportunity to talk to
many of you in each issue - even if only
through the printed word. I have also had
the privilege of hearing from many of you via
e-mail or in person, sharing your thoughts on
recent issues (both issues of AM, and issues
of interest!)
I’ve enjoyed each and every minute of my
time as editor, but sadly, it is now time for me
to move on to other endeavors, and scatter
my volunteering seed in other locations.
Before I leave, let me take the opportunity to
thank the many folks who helped me out,
both occasionally, and during every issue.
First, I want to thank the many guest editors who line up such incredible articles for
inclusion in each issue. Your knowledge of
the topic and your contacts in the industry
truly prove that many hands make light the
load - you are able to garner outstanding articles, issue after issue, that are of interest to
our readership. Thank you for agreeing to
help out!
Next, I want to thank the contributors
that you read in every issue - Soren Norlyng
as European editor, who has been a strong
supporter of this format, and the various
IMAPS Presidents - who (almost) always get
their editorials in on time and made my job
easy.
Finally, I want to recognize publicly the
work that the incredible IMAPS staff does to
make this magazine a reality. I was fortunate
enough to have worked with Ann Bell for
several years, and am now working with
Doug Paul, to ensure that the magazine is the
best it can be. These tireless staffers work
behind the scenes on layout, advertising, artwork, proofreading, and everything else that
results in the copy you are now reading…
they do it with professionalism, enthusiasm,
and unfailing good humor. Please join me in
thanking them for the great job that they do!
I wish each and every one of our readers
good health, great happiness, and long life to
enjoy both! Goodbye!
FLIP CHIP 2004
CONFERENCE & EXHIBITION
June 21-24, 2004
Austin, Texas
01
Flip Chip 2004 Topical Workshop &
Exhibition
June 21-24, 2004
Austin, TX
www.imapsflipchip.com
Mark Your Calendar Today!!
Sponsored by:
Details COMING SOON to
www.imapsflipchip.com
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Visit us at IMAPS 2003, Booth 710
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Toll-free in the US: 866-326-2637
e-mail: info.dcna@datacon.at, www.datacon.at
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Advancing
Microelectronics
Executive Council
President
Peter G. Barnwell
Heraeus, Inc./Circuit Materials Division
President-Elect
Philip J. Zulueta
Jet Propulsion Laboratory NASA
Vice President of Technology
R.Wayne Johnson, Ph.D.
Alabama Microelectronics Science and
Technology Center Auburn University
Vice President of Information
Aicha Elshabini
University of Arkansas
Secretary
Larry Rexing
Heraeus, Inc./Circuit Materials Division
Treasurer
Steve Capp
Laserage Technology Corp.
Organizational Director
Richard E. Sigliano
Kyocera America Inc.
Southwest Regional Director
Frederick R. Hyatt
Consultant
Northwest Regional Director
Anwar A. Mohammed
Ultra RF
Mid-Atlantic Regional Director
Bruce Romenesko
Applied Physics Lab./Johns Hopkins Univ.
Northeast Regional Director
Susan C.Trulli
MKS Astex Inc.
North Central Regional Director
Gino P. Domenella
CirQon Technologies Corp.
Southeast Regional Director
Mike Newton
Harris Corp.
Southern California Regional Director
David C.Virissimo
DV Technical Sales
South Central Regional Director
Ajay P. Malshe
University of Arkansas (HiDEC-MEEG)
Publications Committee
Publications Committee Chair
Aicha Elshabini
Editor, Advancing Microelectronics
Mary McDonald
ISO/QS, Inc.
European Editor, Advancing Microelectronics
Søren Nørlyng
Micronsult
Editor, International Journal of Microcircuits
and Electronic Packaging
Jerry E. Sergent
Directors
Executive Director
Richard Breck
Director, Information Technology & E-Business
Brian Schieman
Advertising Sales
Douglas E. Paul, Manager, Corporate & Marketing
Advancing Microelectronics (formerly Inside ISHM), is published six times a year and is a benefit of IMAPS membership.
The annual subscription price is $50; $5 for a single copy.
Copyright 2003 by IMAPS—International Microelectronics
And Packaging Society & Sidney J. Stein Educational
Foundation.All rights reserved. Except as defined in 17 USC,
Sec. 107, permision to republish any materials in this publication must be obtained from IMAPS, 611 2nd Street, NE,
Washington, DC 20002.Telephone (202) 548-4001.
European Microelectronics
The new challenges
Søren Nørlyng
MICRONSULT
European Editor
New or new …… in any case, at the same
time we see difficulties with the decreasing
number of delegates and (therefore)
exhibitors coming to our conferences, and
difficulties in introducing new technologies
to the end user. In line with the reduced
lower funds for education, travel and internal
resources the end user becomes more conservative and less willing to stand up and
suggest something different and new.
The slow business climate has definitely
limited the possibilities being innovative and
forward looking - for many of the players
today.
When potential delegates, not having registered are being asked why we do not see
them, you always hear “we are too busy.”
Quite seldom they tell you that they don’t
find the programme of interest or that they
miss certain topics. Quite often we as conference organisers just accept this situation
with some regret.
But we should be more active and ask,
“what is missing, what of interest is not covered, which technologies have your focus
right now?”We are very good asking the people showing up what they like - but we
could probably gain more focusing on the
no-shows and analyse why or where we fail.
It does not help a lot if we, when planning potential topics, only focus on the
(extremely interesting) things to come in the
next few years as embedded active devices,
wearable electronics, stacked flip chips, to
attract the minority from Research Institutes
and fortunate R&D groups with similar tasks.
We should maybe balance these topics with
topics explaining the daily problems. Glob
tops vs. dam and fill, capillary flow underfill
vs. pre-applied underfills, lead-free solder
selection, lead-free solder joints and quality
issues, PWB pad finish, Cu vs Cu/Ni/Au vs.
OSP vs. immersion silver - the thickness and
type for soldering or wirebonding, ball bonding vs wedge bonding, etc., more down-toearth issues. We have to admit that we still
see surprisingly many people being attracted
to seminars or workshops focussing on topics like the above.
Whether we like it or not, solutions to
daily problems will have more attraction
than possible future possibilities.
However another way to spread our
words regarding new technologies, processes and materials could be to get involved or
invited to join “production seminars,” “PWB
designers conferences”even though our contribution in the beginning will be the only
presentation with all the “naughty” words.
My experience tells me that it is doable. It is
a long process and in the beginning you will
be viewed upon as a kind of exotic guest
talking a language hard to understand, but if
you manage to show what competitors and
neighbouring countries are doing, people
will stop thinking you are from another planet.
I have recently been invited to a large
consulting group working with some of the
major handset ODMs.Their main business is
software development (of course), but now
they have realised that their software developers could need some insight in packaging
and interconnection, substrate technologies,
system in package, embedded passive and
actives.This would give them a better feeling
for the surrounding hardware challenges and
possibilities in the applications where their
software is being used.
I like this opening and the happy message
about the IMAPS world for further dissemination of knowledge can be spread.
But I admit, it is a tough road forward, to
listen, plant your seeds, some times on rocky
surface…
Søren Nørlyng
noerlyng@micronsult.dk
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General Chair
Environmental
Systems Products
East Granby, CT
I dislike writing prose - as opposed to
technical writing - as much as I dislike folding clothes, although washing clothes can be
a soul-cleansing experience!
So, this being my last literary masterpiece
on behalf of the IMAPS 2003 Symposium
Committee, I am tempted to proclaim loudly
those famous historical words “Free at last,”
being mindful that they were used in a higher context!
Exhibitors who have already purchased a
booth - thank you for your continuing support, and thanks also to symposium pre-registrants as well.
I do have one last request to make of our
community prior to signing off. And it is this:
prospective exhibitors, please don’t sit on
the fence - the economy is improving and
you should be part of the forward moving
wave and not the undertow!
To my SymCom members, my heart felt
thanks for a job well done and for slugging it
out for the past eighteen months with two
more to go! And, thanks also to our HQ staff.
See you starting 16th-Nov.
Environmental Systems Products
doug.bokil@etest.com
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IMAPS 2003
Microelectronics
the bridge
bridge to
to the
the future.
future.
Microelectronics -- the
Revolutionary things
things happen
happen in
in Boston.
Boston.
Revolutionary
Experience the best that Microelectronics has to offer!
25 Technical Sessions, 18 Professional Development Courses, Hands-on Training Workshops
2.5 Days of Exhibitions
Free Marketing Forum
Welcome Reception - Where Networking Opportunities Abound!
Student Program
Employment Center
Sidney J. Stein Educational Foundation Golf Classic
November 16-20, 2003 Hynes Convention Center, Boston, MA
Program, Exhibition & Registration Info:
www.imaps2003.org * imaps@imaps.org * 202-548-4001
IMAPS 2003 - 36 th International Symposium on Microelectronics
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8 AM - 12:30 PM
Employment Center
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9 AM - Noon
Exhibits Hall Open
2 PM - 5:25 PM
Technical Sessions
(WP1 - WP4)
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1 PM - 4 PM
Interactive Forum
(Poster Session)
(WP5)
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9 AM - 5:30 PM
Employment Center
8 AM - 11:25 AM
Technical Sessions
(THA1 - THA4)
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9 AM - 5 PM
Exhibits Hall Open
8 AM - 9:20 AM
Special Session (THA5)
NSF & SJS Educational
Foundation
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Spouse/Guest Program
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8 AM - 11:25 AM
Technical Sessions
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7 AM - Noon
Registration Open
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IMAPS 2003
Sponsors
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4:30 PM - 5:30 PM
Student/Industry
Reception
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3 PM - 4:30 PM
Student/Industry Panel
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2 PM - 5:25 PM
Technical Sessions
(TP1 - TP5)
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Noon - 1 PM
Lunch in the Exhibit
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November 20
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11:40 AM - 12:15 PM
Awards Ceremony
Annual IMAPS
Membership Meeting
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9 AM - 5:30 PM
Employment Center
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9 AM - 5 PM
Exhibits Hall Open
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9 AM - 11 AM
Student Booth Judging
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Hynes Convention Center,
Bostom, MA
7 AM - 5 PM
Registration Open
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AM Departure
Student Plant Tour
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8:30 AM - 4 PM
Spouse/Guest Program
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Tuesday, November 18, 2003
11:40 - 12:15 pm
Wednesday
November 19
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8 AM - 11:25 AM
Technical Sessions
(TA1 - TA5)
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7 AM - 5 PM
Registration Open
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Annual IMAPS
Membership Meeting &
Awards Ceremony
AT A GLANCE
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Tuesday
November 18
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(at the Sheraton Boston
Hotel)
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6 PM - 8 PM
Welcome Reception
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1 PM - 5 PM
Professional Development Courses (M10)
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9 AM - Noon
Professional Development Courses (M9)
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9 AM - 5 PM
Professional Development Courses (M1 - M8)
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(Instructors & Attendees Only)
EARLY AM
Golf Tournament
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5 PM - 6 PM
PDC Reception
8 AM - 5 PM
Registration Open
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1 PM - 5 PM
Professional Development Courses (S10) FOR STUDENTS
ONLY!
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9 AM - Noon
Professional Development Courses (S9)
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9 AM - 5 PM
Professional Development Courses (S3 - S8)
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Hands-on Workshops
(S1, S2)
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November 17
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Sunday
November 16
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program
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ATW on
MEMS Packaging
November 20-22, 2003
Sheraton Boston Hotel
For more information, visit:
www.imaps.org/mems
Geib Refining
Kester Solder/Northrop Grumman
Kyocera America, Inc.
Litron, Inc.
Natel Engineering
Presidio Components, Inc.
Reldan Metals, Inc.
SEFAR America - MEC Division
Shoei Electronic Materials
Teledyne Microelectronics
Support!
r
u
o
Y
r
o
F
Thank You
Sponsorship opportunities still available.
Visit www.imaps2003.org or contact
Doug Paul at 202-548-8712 or
dpaul@imaps.org
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HANDS-ON PROFESSIONAL
DEVELOPMENT COURSES
The “hands-on” courses are back! In the past these courses have sold out early and were
an overwhelming success. IMAPS, in partnership with the National Training Center for
Microelectronics (NTCm) is again offering technical training sessions designed to provide
attendees with a “hands-on” learning experience. Enroll early as class size is limited!
S1 - Screen Printing (how to)
for Operators and Technicians
Instructor: David Malanga
Heraeus, Inc. - CMDivision
S2 - Wirebonding (how to) for
Operators and Technicians
Instructor: Thomas J. Green,
National Training Center for Microelectronics
Enrollment limited to 10 students
Enrollment limited to 10 students
WorkshopSummary:
This course is designed to focus on the concepts
of screen printing and firing of thick film materials. An overview of the screen printing process
will be given with a “hands on” demonstration to
emphasize printer set up and operation. Screen
print process parameters such as snap off, pressure and print speed and how they effect the
finished print will be explored in detailed. Each
student will have an opportunity to print various types of thick film materials using a variety
of different screens. State of the art microscopes
and thickness profiling equipment will be available to assess the quality of the wet print. The
firing process and its effect on the finished print
will be discussed in detail.
After completing the course, you will be able to:
WorkshopSummary:
This course is intended as a practical “hands-on”
set of laboratory exercises to allow the operators
to really understand the wire bonding process.
An experienced industry instructor will review
the basic manual wire bonder equipment design
and setup and explore how machine settings such
as power, time, force and stage temperature affect the bonding process. Both ultrasonic wedge
and thermosonic ball bonding will be explored
using the industry’s latest manual wire bonders.
Students will also have an opportunity to perform wire pull and ball shear testing and visually
inspect wire bond interconnects to gain further
insights into the process.
After completing the course, you will be able to:
• understand the importance of proper screen
printer set up
• understand the basics of thermosonic and ultrasonic wire bonding
• learn to trouble-shoot screening problems
• recognize visual defects & how to prevent them
• understand the factors that affect wet print
thickness and line resolution
• learn how to do wire pull and ball shear testing
• understand the issues with proper furnace set
up and atmospheric control
• know how to set up and use manual wirebonding
equipment
Who Should Attend:
Who Should Attend:
The course is intended for operators and technicians and others who need to gain a deeper understanding of the thick film printing process.
This course is intended as a beginning to intermediate level course for operators, technicians and
others with limited wire bonding experience interested in a practical “hands-on” tutorial.
PROFESSIONAL
DEVELOPMENT
COURSES
Do you want to broaden and strengthen
your skills and knowledge, optimize your
manufacturing processes, and integrate the
latest advances in materials and
technologies to maintain your strength in
today’s competitive global market? The
Technical Committee of IMAPS is pleased
to present a comprehensive offering of
professional development courses that
provide detailed information on topics of
immediate interest to the Microelectronics
and Packaging community. So please be
sure to choose from the fifteen full day and
two half-day in-depth technical workshops
taught by recognized industry experts. You
will discover the following key ways you
will benefit:
• Better understand the industry’s
fundamental skills and knowledge.
• Be exposed to the rapidly expanding
developments in new materials and
technologies.
• Consult with renowned authorities
about your current R&D or manufacturing
problems and challenges.
• Learn new ways to identify, think about,
and address your problems and
opportunities.
• Great opportunities to interact with
industry experts and other course
attendees.
• Certificate of Attendance and much
more…
A
PROGR
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L
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F
ND
AT
TION A
A
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W W W.
R
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3
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0
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IMAPS
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R E G I S T INIMUM OF $5
M
POSIUM
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$AVE A
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ON YOU
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PDC Courses will be held Sunday, November 16th and Monday, November
17th at the Hynes Convention Center.
All PDCs run 9am - 5pm, unless otherwise noted.
Included with your PDC registration fee:
lunch & refreshment breaks on the day
of your course, all course materials,
PDC Reception on Sunday evening and
a Certificate of Attendance.
IMAPS reserves the right to cancel a
course if the number of attendees is not
sufficient. Refunds will be available for
any cancelled course.
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Sunday, November 16, 2003
S3 - Flip Chip and CSP Technologies –
Constructions, Materials, Assembly and
Reliability
Course Leader:
R. Wayne Johnson, Ph.D.
Auburn University
Course Description: The increasing number of
I/O per semiconductor chip combined with the
product driven requirements of thinner, smaller
and lighter weight have lead the electronics packaging and assembly industry to chip scale packages and flip chip (Flip Chip in Package (FCiP)
and Flip Chip on Laminate (FCoL)) technologies. In fact, many CSPs use FCiP constructions.
This course will begin by examining the drivers
for flip chip and CSP technologies, then examine
the options, their construction and trade-offs. 3D CSPs will also be examined. Substrate design
requirements will be discussed including routing,
and pad design. Major assembly issues are flux
selection for flip chip, solder paste printing for
CSPs, under filling, if necessary, and inspection.
Under filling which is not a traditional SMT assembly process is required for flip chip and often for CSPs. The under fill process and material
options for flip chip and CSP will be examined.
Recently, wafer applied under fill material concepts for FCoL assemblies have been discussed
and this new technology concept will be explored. The replacement of leads by solder
spheres impacts reliability, particularly in thermal cycling and bending, and must be considered
prior to implementing these technologies. The
course will conclude with a discussion of reliability.
Who Should Attend:
This Course is intended for those individuals soon
to be responsible for implementing flip chip assembly, suppliers of materials and equipment for
flip chip assembly and others interested in flip
chip implementation.
S4 - Low Temperature Co-fired Ceramics
(LTCC)
Course Leaders:
Fred D. Barlow and Aicha Elshabini, University of Arkansas
Course Description: This course is a one-day
PDC focusing on the materials, processes, design, and applications of Low Temperature Cofired Ceramics (LTCC). The course will begin
with a brief history and background of the technology. A detailed discussion of the process flow
and processes will cover each step used in the
fabrication of LTCC substrates. A discussion of
the material properties and design guidelines and
considerations will also be covered in detail. Finally, a discussion of the technical advances and
the technical applications of the technology will
outline the relative strengths of LTCC for a number of target markets.
Who Should Attend:
Engineers, managers, and technicians, who desire
to expand their background or strengthen their
understanding of the technology. The course will
not assume any prerequisite background.
S6 - Advanced Organic Substrate Package
Design & Manufacturing for RF &
Broadband Applications
Course Leader:
Hassan Hashemi, Conexant Systems
S5 - Fundamentals of Fabrication & Pkg. of
MEMS, Related Micro & Nano Systems
Course Leader:
Ajay P. Malshe, Ph.D.
HiDEC, University of Arkansas
Course Description: The objectives of this
course are to review design and manufacturing
practices and tradeoffs affecting current and next
generation RF & GHz Packaging using laminate
substrate technologies in single or multiple die
packaging format. The course material is primarily based upon the instructor’s experience on
current practices used for Wireless & GHz IC
packaging for internet infrastructure applications.
The course is designed for engineers or engineering managers who want to understand more about
laminate single or multi chip modules, and the
unique requirements for assuring that packages
can be manufactured in a high volume commercial application and meet stringent electrical and
thermal performance requirements.
Course Description: Fabrication and application specific packaging of micro electromechanical systems (MEMS) is a subject of immense
interest. Their application specific packaging with
other components is challenging and unlike IC
packaging, has a different set of demands from
releasing, dicing-to-interconnection at chip-scale
and manufacturing at wafer-level. This globally
taught course will address silicon and non-silicon
micro fabrication processes and related design details, and packaging of silicon and non-silicon
MEMS and related microsystems. The course
will use a range of novel applications to advocate
the use of various fabrication and packaging processes. The course will also introduce a new area
on the horizon - “nano packaging and manufacturing.”
In the broader scope of the subject, for the 21st
century packaging community, infusion of signals (electrical, optical, chemical, mechanical, etc.),
domains (hermetic, vacuum, fluidic, optical, etc.)
and scales (nano-to-micro-macro) are of significant importance for designing and developing next
generation engineered micro and nano products
as well as for adding value / functions to the existing products. Particularly, key words, namely
MEMS, micro systems and nano technology, have
the captured attention of technology leaders.
MEMS and related micro systems are typically
divided into two application areas: sensors and
actuators. These are applied for a range of applications such as automotive, biomedical, optical,
RF, etc. Examples of systems, devices and related application specific packages, are accelerometers, gyros, DMD, lab-on-a-chip, SMART
drugs, etc. Further, with the major investment
and key advancements in nanotechnology, nano
integrated MEMS and related micro devices and
packages are of major importance to the next generation of engineered electronic systems.
Who should attend?
The course is meant for industry and academic
leaders and investors in science and engineering
with interest in MEMS and related micro and
nano systems. Highly recommended for R&D
scientists, engineers and managers involved in
sensors, actuators, instrumentation and systems
related to micro and nano systems technology.
Graduate students with special interest in the
above areas will also find it useful.
The class will be run informally and interaction
with the attendees is encouraged. Questions and
tangential discussions will be invited.
Who should attend?
The course is intended for both the packaging
expert (Electrical and Mechanical Engineers) as
well as persons new to the field. The course will
concentrate on extending the existing organic substrate infrastructure capability to GHz high volume packaging applications. The information
presented will include the theoretical background
with practical methods for implementing a design. These same techniques can be applied to
other high frequency single or multichip package
designs.
S7 - RF/Microwave Hybrids: Basics,
Materials and Processes
Course Leader:
Richard Brown
Richard Brown Associates, Inc.
Course Description: In recent years, the demands for high frequency systems and products
have been growing at a rapid pace. Coupled with
the continuing development of monolithic integrated circuits, MMICs, are new materials and
process refinement of hybrids. As a result, system and product designers are faced with the
choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete
devices, or more often, somewhere in-between.
This course will begin with a short, non-mathematical review of high frequency basics. Next a
comparison of MMICs and hybrids is presented.
The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be
compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be
introduced. Their effect on impedance, circuit
properties and performance will be discussed.
Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packag-
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ing protocols, such as vias and bonding wires,
will be discussed in light of their influence on RF/
microwave performance. At the completion of
this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit
performance.
of key segments of electronics hierarchy in market needs and new technology development. The
key areas in chip level, package level and board
level as well as critical supporting materials, processes and infrastructure will be highlighted.
Who should attend?
All attendees will receive a textbook entitled: “Ball
Grid Array and Fine Pitch Peripheral Interconnections,” published by Electrochemical Publications, LTD, Great Britain, (List Price US$149)
and a workbook.
This introductory course will benefit those associated with the RF and microwave arena. In particular this course will benefit those with responsibility for design and manufacturing of RF/microwave hybrids. Supervisors, engineers and technicians involved in product development, design
and manufacture are encouraged to attend.
Special Course Materials:
All attendees will receive a set of course notes
and a copy of the Mr. Brown’s text “RF/Microwave Hybrids: Basics, Materials and Processes.”
S8 - Overview of MEMS, MOEMS and
Nano Technology
Course Leader:
Dr. Ken Gilleo, Cookson Electronics
Course Description: This new course reviews
the basics of Micro Electro Mechanical Systems
(MEMS) and Optical-MEMS, or MOEMS.
These two closely related topics are compared to
another emerging field, Nanotechnology. We will
cover the features and benefits of all three as well
as fabrication methods and applications. We’ll
highlight packaging and introduce the latest concepts including low-cost Near-Hermetic Packaging (NHP). The course will also outline diverse
applications and markets. A two-axis MEMS accelerometer will be demonstrated to show the
progress in this field.
Find out what aspects of Nanotech are real and
which are illusionary. Some Nano products are
already on the shelf, others are fantasy. Is MEMS
the biggest event for the decade? Where’s the
volume market for MOEMS, telecom or entertainment? We’ll cover the three technologies, their
pitfalls and promises.
Who should attend?
This capsule view will provide attendees in managerial, marketing, engineering and research capacity a broad understanding of the industry as well
as the quick grasp of the technological thrusts.
S10 - FOR STUDENTS ONLY! - FREE
Microsystems Packaging: Technologies,
Markets and Careers
1/2 Day Course PM • 1 PM - 5:00 PM
Instructors: Prof. Rao R. Tummala, Petit Chair
Professor, Director NSF-PRC, GRA Scholar,
Georgia Institute of Technology; Janet K. Lumpp,
University of Kentucky; Leyla Conrad, Georgia
Institute of Technology
This four-hour course will present the global microelectronics market, past and future technologies that constitute this market, the educational
opportunities that are available and career prospects for a lifelong career around the world in
various industries.
Registration Fees
and Full Details
Available On-Line:
www.imaps2003.org
Who should attend?
Inventors, product developers, innovators, marketing personnel and engineers in electronics,
medical, optics, materials, systems, and military.
1/2 Day Course - AM
S9 runs 9 AM - Noon
S9 - New Developments for Electronic
Packaging and Assembly
Course Leader:
Dr. Jennie S. Hwang
H-Technologies Group, Inc.
Course Description: In this exciting and changing time, the microelectronics industry has responded and will continue to respond to the
needs of competitive products in the global marketplace. The course will provide a capsule view
Monday, November 17, 2003
M1 - Packaging Challenges and Solutions
for 10 Gb/s and 40 Gb/s Systems
Course Leaders:
Roberto Coccioli, Inphi Corporation
Hassan Hashemi, Conexant Systems
Course Description: The objectives of this
course are to review challenges in 10G and 40G
IC packaging considering requirements posed by
mixed IC technologies and system architecture.
Moreover, it is intended to review the technologies available to realize package and board interconnects assessing their relative performance and
their impact on signal integrity on high speed
digital signaling. The course material is based upon
the instructors’ experience on current practices
used for GHz IC packaging for telecom, datacom,
and storage infrastructure applications. The
course is designed for engineers or engineering
managers who want to understand more about
technical challenges of high-speed packaging and
the unique requirements posed on technology
selection and design to assure the achievement of
stringent electrical and thermal performance in
cost-performance efficient manufacturing.
Who should attend?
The course is intended for both the packaging
expert (Electrical and Mechanical Engineers) as
well as persons new to the field. The course will
review the existing substrate infrastructure capability and explore ways to extend its use to high
volume packaging of ICs for telecom, storage,
and datacom applications. The information presented will include the theoretical background
with practical methods for implementing a design. These same techniques can be applied to
other high frequency single or multichip designs.
M2 - Process Engineering Fundamentals
Course Leader:
Thomas J Green
National Training Center for Microelectronics
Course Description: The objective of this
course is to teach the fundamental process engineering tools and techniques needed for the microelectronics packaging industry. The focus of
this course is to provide an overview of the skill
sets required to effectively control and optimize
a microelectronics manufacturing process flow.
The course begins with a review of the common
materials and manufacturing processes used in
the hybrid microelectronics industry including
common assembly processes for RF MMIC
modules and optoelectronic devices. Basic manufacturing processes such as thick and thin film
fabrication, die attach, wire bond and hermetic
seal are reviewed from a materials and processing
standpoint. Next, process characterization and
statistical methodologies are introduced with a
focus on practical applications. The basic concepts of Design of Experiments (DOE) including
set up and analysis of a simple industry fractional factorial experiment is covered. Statistical
Process Control (SPC) techniques and sample
charts are also reviewed with a special emphasis
on Cp and Cpk calculations. Finally, industry
accepted Defect Recognition and Workmanship
Standards are presented.
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Knowing what to look for and how the visual
defects relate to the process is critical from a
quality, reliability and yield perspective. Clear
color photos of excessive probe marks, chip outs,
air bridge damage, die attach and wire bond defects along with numerous other defects will be
presented to the class and discussed in detail.
The last segment of the course is an overview of
the analytical tools and techniques available to
process engineers for failure cause investigation
and as tools in process optimization projects.
Who should attend?
This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and experienced technicians responsible for microelectronics materials and process development and manufacturing
process improvements.
aerospace/defense electronic systems. We cover
traditional packaging materials and the large and
increasing number of advanced materials, including: silicon carbide particle-reinforced aluminum
(Al/SiC) and copper; carbon fiber-reinforced polymer matrix composites; aluminum and copper
reinforced with discontinuous and continuous
carbon fibers; diamond particle-reinforced aluminum, copper and silicon carbide; beryllia particlereinforced beryllium; discontinuous carbon-graphite-reinforced aluminum; silicon-aluminum; silver/
“Invar;” carbon/carbon composites; “natural
graphite;” thermal- annealed- and highly oriented
pyrolitic graphite; “ThermalGraph;” silicon carbide/silicon and others. This course provides an
in-depth discussion of the materials, their properties, the processes by which they are made,
and where they are being used. We also look at
future directions.
Who should attend?
M3 - Advanced Materials for Microelectronic, Optoelectronic and MEMS/MOEMS
Packaging and Thermal Management
Course Leader:
Dr. Carl Zweben
Adv. Pkg. Materials & Composites Consultant
Course Description: Materials impact performance, reliability, manufacturing yield and cost.
Increasingly, traditional packaging materials are
failing to meet the requirements of new microelectronics, optoelectronic and MEMS/MOEMS
packaging designs. In response, numerous advanced composites and monolithic materials have
been, and are continuing to be developed. Property improvements include: thermal conductivities ranging from extremely high (over 4X copper) to very low; low, tailorable coefficients of
thermal expansion; electrical resistivities ranging
from very low to very high; extremely high
strengths and stiffnesses; low densities; and low
cost, net shape fabrication processes. A new thermal interface material has a reported thermal conductivity of 750 W/m.K. Payoffs include: improved thermal performance; reduced thermal
stresses and warpage; improved fiber alignment;
simplified thermal design; possible elimination
of thermal interface materials, liquid cooling and
heat pipes; weight savings up to 85%; size reductions up to 65%; increased reliability; reduced
electromagnetic radiation emissions; increased
manufacturing yield; and potential cost reductions.
Advanced materials, such as Al/SiC metal matrix
composites (first used in packaging by the course
leader) and carbon fiber-reinforced polymer matrix composites, are now being used in a growing
number of high volume commercial and aerospace
production applications at the rate of millions of
piece parts annually. Components include heat
spreaders, microprocessor heat sinks, air-cooled
and liquid-cooled cold plates, microwave modules, power semiconductor modules, optoelectronic packages, and heat pipe over molds. Products using these materials include servers, cellular telephone handsets and base stations, laptop
computers, hybrid and electric vehicles, trains,
wind turbine generators, data storage drives and
Engineers, scientists and managers involved in
microelectronic, optoelectronic and MEMS/
MOEMS packaging design, production and
R&D. Packaging material suppliers.
M4 - Fiber Optics Structures: Design for
Reliability
Course Leader:
E. Suhir
University of Illinois at Chicago and ERS Co.
Course Description: In this course we determine the role of materials, structural attributes
and loading conditions on the mechanical behavior and reliability of optical fiber interconnects,
whether bare, polymer coated or metallized. The
emphasis is on the predictive modeling and the
analytical (“mathematical”), rather than numerical (FEA) approach.
Who should attend?
Engineers and technical managers who encounter
and have to solve various materials, mechanical
and reliability problems in fiber optics engineering. Prior knowledge of stress-strain analysis and
the elementary theory of bending of beams is
desirable, but not required.
This course is the collaborative work of member
companies of the Die Products Consortium
(DPC). The DPC has been active in developing
the infrastructure for the die products industry
for the past 10 years, beginning as a project of
SEMATECH and MCC throughout most of the
90s, and now as an independent consortium helping its members achieve success in die products
markets in the new millennium.
Who should attend?
This course will be beneficial to all managers and
individual contributors from the electronic industry who need fundamental understanding and
broad perspective on die and packaging of die
requirements.
M6 - Wire Bonding in Microelectronics
Course Leader:
George G. Harman,
National Institute of Standards and Technology
Course Description: Wire bond manufacturing
defects range typically from about 1000 to 100
ppm, with exceptions to >10,000 and <50 ppm.
In order to achieve the lower numbers in production, one must understand all of the conditions
that affect both bond yield and reliability (since
they are interrelated). This course will discuss
many large- and small-wire bonding problems, as
well as subjects of specific interest to hybrid/
MCM device bonding. In addition, a number of
advanced topics, such as high yield, fine pitch,
and flex bonding will be covered. New developments (e.g., high frequency ultrasonic bonding),
are included along with a major discussion of wire
bonding to multichip modules and other soft substrates. Wire bond testing and metallurgy (covering both aluminum and gold bonds); intermetallic
compounds; cleaning for yield and reliability; failures resulting from electroplating; mechanical
problems in wire bonding; new bond technologies and developments; how ultrasonic bonds are
formed, and the metallurgy of gold and aluminum
wire. It concludes with methods of implementing TAB and Flip Chip by using wire bonding
techniques.
Who should attend?
M5 - Die Products – Overcoming the
Domination of Moore’s Law
Course Leader:
Larry Gilg, Die Products Consortium
Course Description: Semiconductor die products have evolved from the hybrid era of chip on
board technologies to the stacked, SIP, and wafer-level CSP technologies at the leading edge of
the microelectronics industry. Today’s advanced
packaging technologies rely on expertise developed in the bare die business for testing, screening, packing, shipping, assembly technologies and
standards. This full-day professional development course will cover vital technologies for practitioners in all phases of the advanced packaging
and assembly industry, with a focus on using die
products solutions to achieve smaller form factor, higher performance, and lower cost.
Engineers in R&D, QA, QC, manufacturing, process development, and advanced technicians. It
is assumed that participants have some familiarity with wire bonding and general device assembly technologies.
All attendees will receive a complimentary copy
of Wire Bonding in Microelectronics, by George
Harman, McGraw Hill, NY, 1997 (List price $65),
as well as course notes and explanations.
M7 - Integrated Circuit Packaging Trends
and Assembly Options
Course Leader:
William J. Greig, Greig Associates
Course Description: This course addresses the
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impact of both the Integrated Circuit, and End
Product requirements (“smaller, better, cheaper”),
on packaging, assembly, and substrate interconnects. It focuses on packaging trends, namely, the
Ball Grid Array (BGA) and Chip Scale Package
(CSP), Multichip Packaging (MCP) and alternative formats, Chip On Board (COB), and 3-D
initiatives at both the chip and package levels.
Assembly options available for attachment of the
IC in each case will be discussed with major emphasis on Flip Chip. The course also covers the
High Density Interconnect (HDIs) substrates. The
various substrate technologies (Thick Film, Cofired Ceramic, and Thin Film) that are employed
in the manufacture of packages and component
assemblies for MCPs will be reviewed. Finally,
the latest developments in PWBs, with high density, fine lines, and micro vias employing sequential processing (Build Up Technology – BUT)
will be reviewed. Throughout the course, technical issues will be emphasized and reliability concerns addressed where appropriate.
All attendees will receive a complimentary copy
of the book, “Hybrid Microcircuit Technology
Handbook,” J. Licari, L. Enlow, 2nd Edition, Noyes
Publications, 1998 (List price $125).
Who should attend?
The course provides an overview of microelectronic packaging and assembly and is intended
for individuals in any way involved with electronics manufacturing. While introductory in nature it discusses current status and future trends,
it is directed towards both the experienced or inexperienced engineer and technician, and management personnel with the “need to know.” It should
be of particular interest to those in support activities such as procurement, quality assurance,
marketing and sales, and program office by providing a technology base in support of strategic
planning and implementation.
M8 - Technology of Screen Printing
Course Leaders:
Art Dobie, SEFAR America
Rudy Bacher, DuPont
Course Description: The purpose of this course
is to increase the understanding of the screen printing process thereby improving production yield
and quality. The critical and integrated components for screen, such as frames, screen mesh and
emulsion are presented. Presented are some of
the latest advancements in the screens, the compositions and the printing process that enable
screen printing to meet future circuit density requirements. The course is applications-oriented
in terms of how to optimize the screen printing
process; how to specify and use screens; rheology properties that affect the print; minimizing
printing defects and trouble-shooting problems
related to the screens and the printing process.
Who should attend?
This course is intended for production and
process engineers, and others interested in
learning how to optimize and increase the
uses of the screen printing process.
1/2 Day Course - AM
M9 runs 9 AM - Noon
M9 - Lead-Free Electronic Packaging &
Assembly: Technology and Manufacturing
Course Leader:
Dr. Jennie S. Hwang
H-Technologies Group, Inc.
Course Description: Environment-friendly
manufacturing and end-use products that are ultimately safe at the end of the product life cycle
are essential to technology-business competitiveness. This is a continuing challenge to the industry. Based on the newly released book: “Environment-Friendly Electronics—Lead Free Technology,” this course will cover all relevant topics
and issues including global legislative status, technological base, material fundamentals, product assessment, cost, applications, processes and other
manufacturing considerations. The viable leadfree solder alloys will be ranked in their key performance parameters to facilitate implementation.
The courses will emphasis on practical applications in the SMT infrastructure including reflow
and wave soldering. Information is applicable to
all types of electronic packages and assemblies
including QFP, BGA, flip chip and CSP.
All attendees will receive a copy of the newly
released book entitled: “EnvironmentFriendly Electronics - Lead-free Technology,” published by Electrochemical Publications, LTD, Great Britain (List Price US
$238).
Who should attend?
Management, engineers, technicians, project
managers, purchasing managers, QA engineers, researchers and others involved in
electronics materials, electronics manufacturing and decision-making in forming and
implementing manufacturing strategies
through a general understanding of lead-free
solders and environment-friendly electronics manufacturing.
1/2 Day Course - PM
M10 runs 1 PM - 5 PM
M10 - Advanced Packaging Developments
and Trends
Course Leader:
E. Jan Vardaman
TechSearch International, Inc.
Course Description: The semiconductor industry has seen a major shift from leads to balls
and from wires to bumps. This requires infra-
structure developments and promises new opportunities. This course will cover developments
and trends in area array packages. Ball grid array
(BGA) packages are increasingly found in products including personal computers, portable communications devices, workstations/servers, midrange and high-end computers, network and telecommunications systems, and even automotive
applications. Package trends and new developments are described. Driven by the demand for
smaller, lighter, thinner portable products has
come the development of chip scale packages
(CSPs). Discussed are the various types of CSPs
in volume production and new developments such
as wafer level packages. Flip chip’s advantage
over wire bond interconnection includes higher
density mounting, improved electrical performance, and improved reliability for many applications. New applications for flip chip are described. Also included are trends such as bump
pitch, bump metallurgy, and substrate feature
sizes.
Who should attend?
Managers, engineers, project managers, purchasing managers, sales and marketing personnel.
IMAPS 2003
Employment Center
Due to the success of the Employment
Center at IMAPS 2002, we have decided to sponsor theIMAPS 2003 Employment Center. The Employment
Center will post job openings, collect
resumes, offer on-site interview space
and help schedule interviews at the
potential employer’s request.
Employers need not be present to post
job openings. Send us your job openings and we’ll collect resumes for you.
Postings may be internships or anything from entry level to executive management. Company literature tables are
available to promote your company to
job applicants.
To submit job postings prior to Sunday, November 16, 2003; e-mail job descriptions to Silke Spiesshoefer
(sspiess@uark.edu) or call 479-5753967. After this date, please submit on
site. You may also contact IMAPS
Member Relations - Ann Bell at 202548-8717 (abell@imaps.org) for more
information.
Employment Center Hours (Open one
half hour past exhibit hours):
Nov. 18th: 9a.m.–5:30 p.m.
Nov. 19th: 9a.m.–5:30 p.m.
Nov. 20th: 8a.m.–12:30 p.m.
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TECHNICAL PROGRAM OVERVIEW
Tuesday, November 18, 2003
TA1 - Adv. Materials for Electronics Pkg.
Chair: Herbert Neuhaus, NanoPierce Technologies, Inc.
8 am - 11:25 am
Advanced materials are a key element in microelectronics and packaging. The leading edge of
materials development and application are reported, including Organic Electronics and
OLEDs, LCPs, Opto-Electronic Packaging and
NanoTechnology.
Organic Electronics: An Overview
Philip Garrou, Mitchell Dibbs, Paul Townsend,
David Brennan, Adam Laubach, Dow Chemical Advanced Electronic Materials
Advances in Deposition of OLEP Materials via
Piezoelectric Ink Jet
Linda T. Creagh, Spectra, Inc.; Susanne Heun,
Covion Organic Semiconductors GmbH; Neil
Tallant, Avecia Ltd. - UK
Polymeric Material Solutions and Performance
Criteria for Jettable Fluid Delivery Assembly and
Harsh Environment Protection
Susan Krawiec, Chih-Min Cheng, Robert Palmer,
Emerson & Cuming
The Liquid Crystal Polymer Packaging Solution
Brian Farrell, Paul B. Jaynes, Tom Tiano, Jeremy Bowman, Foster-Miller, Inc.
Novel Failure Mechanism Involving the Motion
of Oxygen ION Vacancies in Chip Capacitors
Roy Tom Coyle, Jr., Northrop Grumman Space
Tech
Thick Film Initiators for Automotive Applications
Walter Smetana, R. Reicher, H. Homolka, Vienna
University of Technology
Cerium Oxide Based Screen-Printed Thick Film
Components as Gamma Radiation Sensors
Khalil Arshak, Olga Korostynska, University of
Limerick
Automotive Module Design with Zero Shrink
Composite LTCC
Frans Lautzenhiser, Heraeus Inc. - Circuit Materials Division; Terry Bloom, CTS Corporation;
Annette Kipka, Christina Modes, Heraeus GmbH
& Co., KG
A Case Study of Lead Free Thick Film Conductors with Lead Free Solders
Theresa D. Sims, Heraeus Inc., Circuit Materials
Division
Performances of High Voltage Screen-Printed ZnO
Varistors
Marie-Pascale Martin, Hélène Debeda-Hickel,
Claude Lucat, Francis Menil, University of Bordeaux
TA3 - Fine-Pitch Interconnection Technologies I
High-Performance Liquid Crystalline Polymer
Printed Circuits
Katsufumi Hiraishi, Katsumi Takata, Isamu
Takarabe, Kazunori Ueda, Nippon Steel Chemical Co., Ltd.
System Packaging for Robust LGA Interconnect
Technology in High Performance Computing
Applications
Mark Hoffmeyer, John G. Torok, John L. Colbert,
John S. Corbin, William L. Brodsky, IBM Corp.
An Approach to Custom CSP Package Fabrication
Joseph W. Soucy, Henry G. Clausen, Charles E.
Busa, Fredrick J. Kasparian, Draper Laboratory
TA4 - Advanced Wirebonding
Chairs: Bruce Romenesko, The Johns Hopkins
University/APL; Lee Levine, Kulicke &
Soffa Ind. Inc.
8 am - 11:25 am
This session deals with the challenges encountered by wire bonding at fine pitch, low temperature and on copper/Low K dielectric surfaces.
Process Optimization for the 0.13 Cu /Low K
(Black Diamond) Dual Damascene Interconnection
Li Hongyu, Su Yong Jie, Tsang Chi Fo, Bliznetsov
Vladimir, Sohan Singh Mehta, Zhang Lin,
Singapore Institute of Microelectronics
Epoxies for Opto-electronic Packaging; Applications and Materials Properties
Michael J. Hodgin, Epoxy Technology, Inc.
Chair: Bruce Romenesko, The Johns Hopkins
University/APL
8 am - 11:25 am
Impact Analysis of Wirebonding on Cu/Low-K
Structures
Chang-Lin Yeh, Yi-Shao Lai, Jenq-Dah Wu, Advanced Semiconductor Engineering, Inc.
Middle-Permittivity Dielectric Compositions for
Functional LTCC Substrate
Jae-Hwan Park, Byung-Kook Kim, Young-Jin
Choi, Dong-soon Shin, Jae-Gwan Park, Korea
Institute of Science and Technology
The papers in this session cover performance
limits of the designs or materials used in high
density interconnections. Package types include
both organic- and ceramic-based packages.
Gold Ball Bonding on Copper Substrates at Ambient Temperatures
Ivan Lum, Naren Noolu, Norman Zhou, University of Waterloo
Quality and Reliability of 100 µm Pitch Flip Chip
ICs on Flexible Substrates with Adhesive Interconnections
J. de Vries, J. van Delft, C. Slob, Philips Center
for Industrial Technology
Wirebonding on Copper Low-k Wafers
Frank Keller, Jon Brunner, Kulicke & Soffa Ind.,
Inc.; Tony Pan, Applied Materials
Electrical and Mechanical Characterization of
Nanotube Filled Conductive Adhesives
Jing Li, Janet K. Lumpp, Moatasem Abu-Haleeqa,
Eric Grulke, University of Kentucky
TA2 - Advanced Thick Film Systems
Chairs: Harry Kellzi, Teledyne Electronic
Technologies; John Menaugh, DuPont
Microcircuit Materials
8 am - 11:25 am
The range of topics includes specialty inks for
radiation sensors and varistors, automotive electronics, designing LTCC modules, lead-free materials and fine line printing for high frequency
applications.
Fine Line Printing Technologies for Microwave
and Millimeter Wave Applications
Liang Chai, Cristie Lopez, Aziz Shaikh,
Shigekatsu Ohnishi, Masahisa Kakinuma, Ferro
Electronic Material Systems
Effects of Package Underfill and Lead-free Solder
on Solder Joint Reliability for Fine-Pitched Array-Molded Ball Grid Array Packages in an Automotive Environment
C. Eric Triplett, Diane Hodges Popps, Thomas
Koschmieder, Motorola, Inc.
Morphology of Ball Bonds at <50 µm Pitch
Lee R. Levine, Jon Brunner, Kulicke & Soffa Ind.
Inc.
EFO BOX Circuit Modification for Free Air Ball
Consistency Improvement
Adithep Rin, AMD (Thailand) Ltd.
The Study of Copper Oxide on ICs Lead Contamination Mechanism
Nopphadol Kongtongnok, AMD Ltd.
A Comparison of Electromigration and Thermal
Fatigue Performance Between Thin and Thick
Film UBM
Po Jen (Robert) Zheng, C.Y. Hung, Z. J. Lee, C.
W. Lee, C. S. Chung, J. D. Wu, Advanced Semiconductor Engineering (ASE), Inc.
TA5 - Passive Integration in LTCC, PWB
and On Chip
BGA Package Warpage Measurement at Elevated
Temperatures Using Shadow Moiré to Support
Advanced Mold Compound Selection
Scott Hayes, Sheila Chopin, Motorola, Inc.
The integration of passive elements into substrates
and packages continues to break new ground.
Examples of passive integration technologies, tech-
Chair: Robert H. Heistand II, AVX Corporation
8 am - 11:25 am
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niques and design attributes are presented for
LTCC, PWB and on chip applications. The final
paper compares LTCC and HDI organic technologies for RF applications.
A 5 to 6.5 GHz LTCC Power Amplifier Module
N. Ilkov, R. Matz, O. Dernovsek, Siemens AG;
W. Bakalski, W. Simbürger, Infineon Technologies AG; P. Weger, Technical University of
Brandenburg
Modeling and Analysis of LTCC Stripline for
Multi-Layer Packaging: Effect of Embedded
Pores and Sharpened Edges
Jae Hyuk Jang, Seung Gyo Chung, Byung Gyu
Chang, Samsung Electro-Mechanics
Performance of Co-Fired Buried Resistors in A6S
Tape
Michail Moroz, Ferro Corporation
Wafer Level Packaging Technology for Low-Loss
On-Chip Transmission Lines and Inductors
Geert Carchon, X. Sun, W. De Raedt, E. Beyne,
IMEC-MCP/HDIP
Laser Trimmed Thin Film NiCr Embedded Resistor Tolerance
Sid Clouser, Jiangtao Wang, Rocky Hilburn,
Gould Electronics
Electrical Performance Advantages of Ultra-Thin
Dielectrics in PCBs
Joel S. Peiffer, 3M
Comparison of HDI Organic and LTTC Substrate
Technology with its Potential for RF Module
Application
Grit Sommer, Gerhard Fotheringham, W. John,
H. Reichl, FhG-IZM Berlin
TP1 - Developments in Materials
Chair: Bin Zou, NanoPierce Technologies, Inc.
2 pm - 5:25 pm
This session reports on the real-world application of some recent materials developments, including lead-free solder, adhesivies for stacked
die, and some new ceramic materials.
Development of Low-K Encapsulating Film for
Stacked Packages
Akiko Matsumura, Kazuki Uwada,Yuji Hotta,
Nitto Denko Corporation
Application of Spacer Filled Silicone Die Adhesive in Stacked Chip Technology
Xuan Li, R. Wayne Johnson, Auburn University; Thomas E. Noll, Michael Watson, Dow
Corning Corporation
Synthesis of Ferroelectric Films for Integral Capacitors - Processing, Characterization and Integration
Devarajan Balaraman, P. Markondeya Raj,
Swapan Bhattacharya, Isaac Abothu, S. Dalmia,
Lixi Wan, Michael D. Sacks, Madhavan
Swaminathan, Rao Tummala, Georgia Institute
of Technology
Cofireable Transfer Tape
Richard L. Wahlers, Alvin Feingold, Merrill Heinz,
Electro Science Laboratories
Lead-Free Solders and Under Bump Metallurgies
for Flip Chip Interconnect
Jong-Kai Lin, Jin-Wook, Jang Scott Hayes,
Motorola, Inc.
The Investigation of Lead Free Package Reliability
Jeffrey C. B. Lee, Advanced Semiconductor Engineering
Lead-Free Soldering Technology Development
Experience: (A programme for the transfer and
development of lead-free soldering technology
between the UK and Taiwan)
Simon Mason, Jason Howlett, TWI Ltd.; Tammy
Tzan, ITRI
TP2 - High Density Packaging
Chairs: Rajen Chanchani, Sandia National
Laboratories; Andrew Strandjord, IC
Interconnect
2 pm - 5:25 pm
New technologies on ultra-thin, high density substrate, 3-D die-stacking and embedded passives
will be presented in this session.
Three-D Vertically Stacked Electronic Structures
for Array Sensors
Raymond A. Fillion, Robert Wojnarowski, Chris
Kapusta, Rich Saia, Kris Kwiatkowski, Jim Lyke,
GE Global Research Center
SIP Solution for High-End Multimedia Cellular
Phone
Heung-Kyu Kwon, Tae-je Cho, Ki-won Choi,
Jong-bo Shim, Se-Nyon Kim, Yoon-Hyuk Lim,
Dong-gil Shin, Un-ha Shin, Se-yong Oh, Samsung
Electronics Co., Ltd.
New Approaches to 3-D Interconnections Systems in Package Applications
Christian M. Val, 3DPlus
TP3 - Fine-Pitch Interconnection Technologies II
Chair: R. Wayne Johnson, Auburn University
2 pm - 5:25 pm
Recent advances in fine pitch interconnection technologies, both flip-chip and wire-bond, will be
discused in this session.
Flip Chip Mounting Technology for MID
Yoshihiko Yagi, Michirou Yoshino, Koujirou
Nakamura, Kazuto Nishida, Yukihiro Otani,
Fumikazu Harazono, Naoto Ikegawa, Matsushita
Electric Industrial Co., Ltd.
Filled No-Flow Underfilling - Process and Materials
Ning-Cheng Lee, Wusheng Yin, Hong-Sik Hwang,
Indium Corporation of America
Very High Pin Count Flip Chip Assembly using
Conductive Polymer Adhesives
James E. Clayton, Polymer Assembly Technology
Novel Fine Pitch Interconnects
Richard LaBennett, MCNC Research and Development Institute (MCNC-RDI)
Application of 35µm Pitch Wire Bonding Technology to High Density Package
Yasuhide Ohno, K.Ohmisha, T.Takado,
K.Noguchi, Kumamoto University
Bondability, Reliability and Yield Benchmarks for
High Volume, Specialty Gold Fine Bonding Wire
Michael Zasowski, Gery Lovitz, Williams Advanced Materials
Laser Direct-Write of Fine Features for Low Temperature Co-fired Ceramic (LTCC) Applications
David Liu, Chengping Zhang, Todd Kegresse,
Scott A. Mathews, John Graves, Potomac
Photonics, Inc.
TP4 - Power Packaging Technologies
Ultra-Thin High-Density Packaging Substrate for
High-Performance CSP and SiP
Tadanori Shimoto, Kazuhiro Baba, Hideya Murai,
Takehiko Maeda, Keiichiro Kata, Wataru Urano,
Hironori Ohta, NEC Corporation
Stencil Printing Technology for 100µM Flip Chip
Bumping
Dionysios Manessis, Rainer Patzelt, Andreas
Ostmann, Rolf Aschenbrenner, Herbert Reichl,
Technical University of Berlin
Industrial Scale Manufacturing Process for Embedding Active Components Inside Organic Substrate
Petteri Palm, Risto Tuominen, Imbera Electronics Oy
Crosstalk of Wiring in very Small 3D Module
Jarmo J. Tanskanen, Janne Toikka, Tampere University of Technology; Eero O. Ristolainen,
Asperation Oy
Chair: Douglas C. Hopkins, State University of
New York at Buffalo
2 pm - 5:25 pm
New heat sink techniques start the session with
one approach using nano-layered foils for 10X
improvement. Unique device packaging approaches are next and include wafer level packaging of power FETs.
Multiscale Multiphysics Analysis of Wirebonds
for Electronic Packaging
Ryszard J. Pryputniewicz, Patrick W. Wilkerson,
Andrzej J. Przekwas, Worcester Polytechnic Institute
Manufacturing and Evaluation of Thermal Expansion Behavior of Discontinuous Pitch Graphite Fiber Reinforced Copper Alloys for CTE
Matching Heat Sink Applications
James A. Cornie, Shiyu Zhang, Metal Matrix Cast
Composite, LLC
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A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting
Timothy P. Weihs, David Van Heerden, Omar
Knio, Reactive NanoTechnologies
Thermal Performance and Microstructure of
Lead-free Solder Die Attach Interface in Power
Device Packages
Dan Huff, Dimos Katsis, K. Stinson-Bagby, GQ Lu, J. Daan van Wyk, Virginia Polytechnic Institute and State University
Eason Chen, Carol Liang, Jeng Yung Lai, Yu-Po
Wang, CS Hsiao, Siliconware Precision Industries
Co., Ltd.
Vertically High Density Interconnection for
Mobile Application
Takayoshi Katahira, Ilkka Kartio, Nokia - Japan
Co., Ltd.; Hiroshi Segawa, Ibiden Co., Ltd.
Wednesday, November 19, 2003
New Generation of Wafer-level Packaging Delivers Higher Levels of Power and Reliability Performance for Power MOSFET Devices
Mohammed Kasem, E. Tjhia, C. Chen, VishaySiliconix
WA1 - MEMS Packaging
Development of SOIC Exposed Pad Package for
Dual Die Power Products
Mervi Paulasto-Kröckel, Anton Kolbeck, Gary
Johnson, Hubert Wieser, Christina Bohm,
Motorola
As microelectromechanical systems (MEMS) become more widely used, new packaging challenges and opportunities continue to arise. This
session covers state-of-the art solutions in MEMS
packaging for inertial, RF, and optical systems.
Development of Silicon-Carbide (SiC) Static-Induction-Transistor (SIT) Based Half-Bridge
Power Converters
Alexander B. Lostetter, Kraig Olejniczak, Alan
Mantooth, Aicha Elshabini, University of Arkansas
Vacuum Packaging of MEMS Inertial Sensors
Thomas F. Marinis, Joseph W. Soucy, Draper
Laboratory
TP5 - Printed Wiring Boards
Chair: Timothy G. Lenihan, TGL Consulting
2 pm - 5:25 pm
The Printed Wiring Board Session is well balanced to cover a broad range of industry needs
and new developments. Topics that will be covered include new processes, fine pitch manufacturing, new materials, design issues, thermal
modeling, reliability evaluations, and systems
applications.
Characteristics of Wet Etching of Copper Foil
for Printed Circuit Boards by using Ferric Chloride Solution
Katsutoshi Matsumoto, Shingo Funahashi, Shoji
Taniguchi, Tohoku University
Electrochemical Migration of Immersion Silver
Finish: Test Vehicle and Material Evaluation
Jiming Zhou, Robert Clawson, Phil Wittmer, Rick
Snyder, Jerry Badgett, Delphi Delco Electronics
Systems
Evaluation of High Temperature Overmold Compounds for Manufacturing of Laminate Based
Leadfree System in Package
Mohammed A. Wasef, Michael J. Anderson,
ANADIGICS Inc.
Chairs: David Galipeau, South Dakota State
University; Janet Lumpp, University of
Kentucky
8 am - 11:25 am
Implementation of a Quality System for a
FABless Semiconductor Company
Mary McDonald, Individual Solution Options/
Quality Services, Inc.; Michael Madden, SigmaTel
Corp.
The Next-Generation Information Exchange
Framework for Electronics Manufacturing: The
Framework Implementation Project from the
Georgia Institute of Technology’s Manufacturing Research Center
Brian Nigro, MAPICS, Inc.
Improvement of Placement Accuracy by Placement Optimization
Timo Liukkonen, Aulis Tuominen, Nokia Networks
Laser Wafer Marking at Die Level
Bo Gu, Jack Gillespie, Rainer Schramn, GSI
Lumonics Inc.
Novel Noninvasive Methodology for Characterization of Packaging for MEMS Inertial Sensors
Ryszard J. Pryputniewicz, Peter Hefti, Adam R.
Siegel, Adam R. Klempner, Cosme Furlong,
Worcester Polytechnic Institute; Thomas F.
Marinis, Joseph W. Soucy, Draper Laboratory
Low Cost Fine Line Mo-Mn Thick Film for
Microwave Applications
Ken Kuang, Lisa Hamel, Kevin Cotner, Kyocera
America, Inc.
Low-Cost Manufacturing/Packaging Process for
MEMS Inertial Sensors
David F. Guillou, IC Mechanics, Inc.
Manufacturability Study of LTCC Integrated
Packages for High Performance, Low Cost RF
SiP Modules
Matthew Hoppe, G. Surbeck. H. Moret, K.
Green, Ditrans Corporation
Low Cost Packaging of MEMS Accelerometers
Lawrence Felton, Michael Duffy, Peter Farrell,
Nicole Hablutzel, Willaim Webster, Analog Devices, Inc.
Impact of Thermal Cycles During the Packaging
Assembly Process on RF MEMS Switch Performance
Ananda De Silva, Lianjun Liu, Henry Hughes,
Motorola Inc.
Low Profile Packaging Solution for RF-MEMS
Suitable for Mass Production
Frank Daeche, Günter Ehrler, Michael Weber,
Andreas Meckes, Robert Aigner, Hans-Joerg
Timme, Infineon Technologies AG
Near Hermetic Air Cavity Plastic Packaging for
Wireless, MEMS and Optical Applications
John W. Roman, RJR Polymers
WA2 - Novel Manufacturing Technology
Manufacturing Fine Pitch Flexible Substrate for
MCM Module
Hyuek-Jae Lee, Jin Yu, KAIST
Chairs: Christina Conway, Rockwell Collins,
Inc.; Bob Palumbo, Kyocera America
8 am - 11:25 am
Board Level Underfill for CSP Applications
Prakorn Vijchulata, AMD Thailand
The pursuit of smaller, more functionalities and
cheaper microelectronics demands low cost and
robust manufacturing. This session highlights the
latest developments in general manufacturing technologies, such as quality system implementation
Thermal Investigation for an Advanced Graphic
Module Board
for fabless operations, manufacturing information exchange and PWB component placement
optimization. This session also reports, from a
manufacturing point of view, the progresses on
laser wafer marking, low cost fine line thick film
and LTCC.
An Investigation of the Properties of Newly
Developed LTCC Materials for their use in Microwave Antenna
Shotaro Watanabe, Kazunari Watanabe,
Katsutoshi Nakayama, Asahi Glass Co., Ltd.
WA3 - Reliability
Chair: John Devaney, Hi-Rel Laboratories
8 am - 11:25 am
This session consists of 7 papers each on a unique
topic, 6 of which touch on an aspect of the reliability of components, substrates or materials used
in the manufacture of various types of hybrids or
multi chip assemblies. The seventh discusses a
novel approach to failure analysis on complex
circuits used in multi chip modules.
Effect of Hydrogen on GaAs MMICs in Hermetic Packages
Dipendra Nath Goswami, Picoswcond Pulse Labs
Failure Analysis on Pad on IO Wire Bond Package with Copper Metal and Low-K Dielectric
Material
Steve Hsiung, Kevan Tan, LSI Logic
Effect of Isothermal Aging on the Intermetallic
Compound Layer Growth in BGA Joints with
Sn-Ag-Cu Solder
Jeong-Won Yoon, Seung-Boo Jung,
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Sungkyunkwan University; Chang-Bae Lee,
Samsung Electro-Mechanics Co., Ltd.
Contact Resistance of Anisotropic Conductive
Adhesives
Ranjith Divigalpitiya, Peter Hogerton, 3M
Canada Company
The Measurement of Ion Diffusion in Epoxy
Molding Compounds used to Encapsulate Microelectronic Devices
Leon Lantz, II, Michael G. Pecht, Mark C. Wood,
University of Maryland at College Park
The Significance of Glass Transition Temperature of Molding Compounds for Screening and
Reliability Qualification of COTS PEMs
Alexander Teverovsky, QSS Group, Inc.
Lien, University of Waterloo
Development of a Process Friendly Film for High
Performance Thermal Management Applications
Andrew P. Collins, Chih-min Cheng, Emerson and
Cuming
Co., Ltd.
A Battery-Less Wireless System uses Ambient
Heat with a Low-Voltage CMOS/SOI DC-DC
Converter
Yoshifumi Yoshida, Seiko Instruments Inc.
Pin Fin Heat Sink Flow Asymmetry and Consequent CFD Compact Model Characterization
Requirements
Paul Gauché, Flomerics Inc.; Paul Hrenchir,
McDATA Corporation
Development of Direct Methanol Fuel Cell
(DMFC) for Electric Power Supply of Portable
Mobile Terminals
Hirohisa Miyamoto, Toshiba Corporation
WA5 - Marketing Forum
Micro Fuel Cells using Carbon Nanohorns: A
Portable Power Source in the Ubiquitous Society
Yoshimi Kubo, NEC
Chairs: Michael P. O’Neill, Heraeus Inc. CMD; Howard Imhof, Metalor Corp.;
Adam Singer, Cookson Electronics
8 am - 11:25 am
Quantitative EDX the Effective Column Short
Failure Analysis for High Density Integrated Circuit Devices
Suntra Anuntapong, Nopphadol Kongtongnok,
AMD Ltd.
The MMRC (Microelectronics Marketing Research Council) will offer a free-of-charge Marketing Forum to all IMAPS 2003 attendees who
wish to participate.
WA4 - Thermal Management
Opening Remarks
Michael O’Neill, Chairman, MMRC Steering
Committee
Chairs: Ajay P. Malshe, University of
Arkansas; Dave Saums, Ceramics Process
Systems Corporation
8 am - 11:25 am
Opportunities for Application Specific and Value
Added Components
Dennis Zogbi, Paumanok Group
Thermal Management of 980 nm and 14xx nm
Pump Lasers
M. Labudovic, Corning Lasertron
Chairs: David Galipeau, South Dakota State
University; Richard Gehman, Honeywell
Sensing and Control
2 pm - 5:25 pm
Broadband Wireless Technology and Opportunities
Jack Browne, Penton Media
Global Electronics Manufacturing - The China
Wild Card
Jan Vardaman, TechSearch International
Sensor and MEMS applications continue to grow
rapidly in traditional markets such as hazardous
gas detection as well as newer areas like biomedical and RF MEMS. This session covers stateof-the-art sensors, systems, materials, and MEMS
structures to measure hazardous gases, automotive emissions, and urinary pressure, as well as
for RF applications.
The Wireless Industry - What’s Hot and What’s
Not
Don Brown, International Wireless Packaging
Consortium
Gasoline Vapor Sensor for Power Vent Water
Heaters
Richard W. Gehman, Honeywell Sensing and
Control
Panel Discussion
Moderator - Jack Browne, Penton Media
Screen-Printed Fe2O3/ZnO Thick Films for Gas
Sensing Applications
Khalil Arshak, Ibrahim Gaidan, University of
Limerick
Impact of Heat Spreading Lids on Flip Chip Thermal Performance; With and Without Heat Sink
Jamil Wakil, IBM Corp.
WA6 - Technology Drivers Trends for
Electronic, Optical, Mechanical and
Chemical Packaging Technologies toward
Ubiquitous Network Age
LTCC Substrates with Internal Cooling Channel
and Heat Exchangers
Marc A. Zampino, Hari Adluru, Yanqing Liu, W.
Kinzy Jones, Florida International University
(Japanese Translated Session)
Chairs: Fumio Miyashiro, PI R&D Co., Ltd.;
Andy London, Heraeus IncorporatedCircuit Materials Division
8 am - 11:25 am
High Performance Dual Redundant (DR) Fan
Modules
Howard Harrison, HB Innovation Ltd.; Fue-Sang
Robot Technologies for Human-Robot Cooperation Systems in Ubiquitous Age
Yasuhisa Hirata, Tohoku University
Ubiquitous Transducers for Health Care and Environmental Analysis
Kohji Mitsubayashi, Tokai University
WP1 - Sensors and MEMS
Packaging is Leading the Recovery
Jim Walker, Gartner Dataquest
The performance of thermal spreaders and heat
sinks must keep pace with the demands of the
electronic industry as “smaller-faster-lighter” is
relentlessly pursued. More efficient and lighter
weight thermal spreaders and heat sinks must
continue to evolve through improvements in conventional technologies and/or the developments
of new materials and technologies to ensure the
efficient thermal management of electronic systems. In this session we have included a wide
range of cutting edge topics addressed through
modeling, experimentation and product development. We invite you to attend this important session, and we look forward to a prolific discussion.
Experiments on Boiling Heat Transfer of Selected
Foams and Other Microstructures for Cooling of
High Flux Electronics
Lewis Gershen, J. Qi, M. Ohadi, J. Kim, S.
Thorpe, University of Maryland
The Status and Future of Optical Circuit Packaging Technology
Osamu Mikami, Tokai University
New applications in Advanced Packaging Technologies, based especially on Nano, MEMS and
sensing Technologies as part of the coming Ubiquitous Network Age. Recently developed examples
such as modules, components, substrates and
materials will be introduced.
Advanced Packaging Technology Trend for Mobile Terminals toward Ubiquitous Age in Japan
Tomiyo Ema, Panasonic Mobile Communications
The Application of Sensors in Automotive Emissions Testing
Delip “Doug” R. Bokil, Environmental Systems
Products Holdings Inc.
Telemetry in Measuring Urinary Bladder Pressure
Bujjibabu Godavarthi, Joan Delalic, Michael R.
Ruggieri, Michel A. Pontari, Temple University
Thermal Characterization of RF MEMS Relay
Switch Design
Ryszard J. Pryputniewicz, Malgorzata S.
Machate, David Rosato, Cosme Furlong, Worcester Polytechnic Institute
Design, Modeling and Simulation of Electrostatic
flexures for Microelectromechanical Systems
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(MEMSEF)
Muhammad Imran, William L. Ables Jr., University of Arkansas at Little Rock
Electrophoretic Photoresist for Patterning Three
Dimensional Structures (How to make groovy
patterns and not mind being in the pits)
Jill E. Steeper, Shipley
WP2 - RF & Microwaves
Chairs: John Gipprich, Northrop Grumman
Corporation; Fred Barlow, University of
Arkansas
2 pm - 5:25 pm
Packaging and integration of RF & Microwave
circuits is a growing and important area. This
session includes presentations covering new packaging methods, material evaluation, and new
materials tailored for these demanding applications. In addition, several speakers will discuss
new filter designs and the integration of these designs into compact product form factors.
New Temperature Calibration Method for Digital Microwave Radio Transceivers
N. Hassaine, L. Villeneuve, F. Concilio, Harris
Corporation
MCMs for Space Application : up to 40 GHz
inside the Multilayer Ceramic
Claude Drevon, Chloé Schaffause, Jean-Louis
Cazaux, Alcatel Space Industries
Application of Uniplanar Structures for High
Frequency Material Characterization
Can Eyup Akgun, Rhonda Franklin Drayton,
University of Minnesota; Dan Amey, Tim
Mobley, DuPont Microcircuit Materials
Embedded Passives in Low-Temperature CoFired Ceramic for RF & Microwave Applications
Michael Folk, S. Kaza, V. Wang, A. Elshabini, F.
Barlow, University of Arkansas
New LTCC Material with Zero TCF and Low
Loss at 15GHz
Yoshio Umayahara, Masaru Iwao, Kazuyoshi
Shindo, Nippon Electric Glass Co., Ltd.
This session will highlight several new developments in ceramic substrates, especially LTCC,
and new inks. Process topics include aqueous
casting, fine line screen printing and a new thermal measurement method.
Lead and Cadmium Free Low Temperature Firing Thick Print Copper Inks
Orville W. Brown, Srinivasan Sridharan, Ferro
Corporation
New Approach to Thermal Conductivity of Thin
Films Measurements by Means of Comparative
Method
Selim Achmatowicz, Elzbieta Zwierkowska, Institute of Electronic Materials Technology;
Wojciech Lobodzinski, The Institute of Pro-Ecologic Electrothermics
A Model of Fine Line Screen-printing on LTCC
Shao-Ju Shih, Ricky Chen, Chiu Kuo-Chuang,
Hung Ying-Chang, Lin Hong-Ching, Industrial
Technology Research Institute
Dielectric and Magnetic LTCC Material System
Uwe Mackens, D. Hennings, B. Schreinemacher,
dock, Joshua Wright, GE Global Research Center
Development of Wafer Level Packaging with Plastic Core Solder Ball
Masto Sumikawa, Rina Murayama, Masashi
Ogawa, Hiroshi Matsubara, Sharp Corporation
Room Temperature Bond for Wafer Level Packaging
Helge W. Luesebrink, Austria Markus
Wimplinger, Chad Brubaker, EV Group, Inc.;
Paul Lindner, Austria Thomas Glinsner, EV
Group GmbH
Wafer-Level Hermetic Cavity Packaging for
MEMS, Optoelectronics, and Sensors
George A. Riley, FlipChips Dot Com
Wafer-Scale Packaging of Opto-Electronic Devices
Daryl Spencer, A. P. Malshe, R. B. Foster, University of Arkansas; C. B. O’Neal, SYCONN
Corporation
Comparative Study on Laser Trimming with Different Wavelengths
Bo Gu, Bruce Couch, J.J. Oh, Paul Chase, GSI
Lumonics Inc.
Front End Compatible WL-CSP-Technology for
RF- and HT-Applications
Klaus Burger, ATMEL Germany GmbH
Development Thermoelectric Detectors on Base
Higher Manganese Silicide (HMS) Films
T. S. Kamilov, A. A. Uzokov, D. K. Kabilov, S. F.
Ganihanov, Tashkent State Aviation Institute; B.
N. Zaveryukhin, R. A. Muminov, Physical Technical-Institute of the Academy of Sciences of
Republic of Uzbekistan; V. V. Klechkovskaya,
Shubnikov Institute of Crystallography
WP5 - Interactive Forum (Poster Session)
Aqueous Tape Casting Processing of Low-Dielectric Constant Cordiertie Based Glass-Ceramics
Mei Sen, Juan Yang, José M. F. Ferreira, University of Aveiro
WP4 - Wafer Level Packaging
LTCC MLC Bandpass Filter using Quarter-Wavelength Hairpin Resonators for WLAN
Gyu-Je Sung, Dong-Hun Yeo, Hankyong National
University
The importance of Wafer Level Packaging to a
number of new and emerging technologies including traditional integrated circuit applications
as well as MEMS and optoelectronic packaging
applications is fueling the drive towards this form
of packaging. This session will cover a host of
applications involving wafer level packaging as
well as some key developments in process technology which make these applications possible.
Chairs: Michael Ehlert, National Semiconductor
LTCC Foundry; Richard Sigliano, Kyocera
America Inc.
2 pm - 5:25 pm
Raymond A. Fillion, Laura Meyer, Kevin
Durocher, Slawomir Rubinsztajn, David Shad-
R. Mauczok, S. Gruhlke, C. Martiny, M. Matters-Kammerer, K. Reimann, Philips Research
Laboratories
Synthesis and Characterization of Particle Filled
LTCC Tape for Wireless Communication Applications
Kyoung-Ho
Lee,
Sun-Young
Kim,
Soonchunhyang University
WP3 - Thick and Thin Film Material
Processing
Harry Hedler, Thorsten Meyer, Wolfgang
Leiberg, Infineon
New Wafer Level Structure for Stress Free Area
Array Solder Attach
Chairs: Michael Toepper, Fraunhofer IZM;
Jamin Ling, ST Assembly and Testing
Services (STATS - US)
2 pm - 5:25 pm
Compliant Wafer Level Packaging - A New Packaging Platform for Memory Products
1 pm - 4pm
EWOD Induced Fluid Flow for Biological Applications
Ryan T. Marinis, Ryszard J. Pryputniewicz,
Worcester Polytechnic Institute
Controlled Laser Ablation of Polyimide Substrates
Peter Gordon, Richard Berenyi, Balint Balogh,
Budapest University of Technology and Economics
Epoxy Flux for Lead-Free Soldering
Ning-Cheng Lee, Wusheng Yin, Indium Corporation of America
MEMS Sensors for Temperature, Pressure, and
Relative Humidity Measurements
Houri Johari, Ryszard J. Pryputniewicz, Worcester Polytechnic Institute
Modeling Fatigue Behavior of Electronically Conductive Filled Adhesive Joints under Cyclic Loading a Novel Modeling Approach for Integrated
Joint Life Prediction
Rajesh R. Gomatam, Lehigh University; Erol
Sancaktar, University of Akron
Thermal Performance Characteristics of
HyerBGA Chip Carrier
Varaprasad Calmidi, Sanjeev Sathe, Endicott Interconnect Technologies, Inc.
Reconfigurable Embedded Test for Improved
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Page 19
System Reliability
Kimberly E. Newman, University of Denver
Development of Au Reflection Film with High
Adhesion for Optical Interconnection between
LSI Chips
Koichi Yokota, Ryohei Satoh, Yoshiharu Iwata,
Kozo Fujimoto, Shogo Ura, Kenji Kintaka, Osaka
University
Jamin Ling, Ted Tessier, Won-Sun Shin, Edward
Law, Isobel Tan, Diane Sahakian, ST Assembly
and Testing Services
SnZnAl Lead-free Solder with High Packaging
Reliability
Masayuki Kitajima, Tadaaki Shono, Satoshi
Masuda, Fujitsu Limited
Passive Component Integration in LTCC
Liang Chai, Aziz Shaikh, Vern Stygar, Ferro Electronic Material Systems
On-Chip Isolation in Wafer-Level Chip-Scale
Packages: Substrate Thinning and Circuit Partitioning by Trenches
S. M. Sinaga, A. Polyakov, M. Bartek, J. N.
Burghartz, Delft University of Technology,
ECTM/DIMES
Analytical and Experimental Characterization of
an Optical MEMS Device
Ryszard J. Pryputniewicz, Cosme Furlong, Emily
J. Pryputniewicz, Worcester Polytechnic Institute
Elimination of Epoxy Resin Bleed Through Thin
Film Plasma Deposition
Martin J. Burmeister, Stellar Microelectronics,
Inc.
Mechanical Strength of Glass Ceramic Substrates
in Land Grid Array Packages
Angelo Villani, Peter Martino, Hewlett-Packard
Company
A Novel Planarization Process for Providing Global Planarity for IC Manufacturing
Wu-Sheng Shih, Mark G. Daffron, Brewer Science, Inc.
Estimation of Sn-3.0Ag-0.5Cu Solder Joint Reliability by Weibull Distribution and Modified
Coffin-Manson Equation
Mitsuharu Yamabe, Toshiba Corporation
Development of Optoelectronic Holography
Techniques for Nondestructive Evaluation of
MEMS at the Wafer Level
Cosme Furlong, Curtis F. Ferguson, Michael J.
Melson, Kevin A. Bruff, Ryszard J.
Pryputniewicz, Worcester Polytechnic Institute
Remote Heat Sink with Temperature Control using a Miniaturized Loop Heat Pipe
Dimitry Khrustalev, Thermacore International,
Subsidiary of Modine Manufacturing Company
Jeff Shakespeare, Consultant
8 am - 11:25 am
Optimization efforts in optoelectronic assembly
processes continue to meet the stringent packaging requirements that surpass those of conventional microelectronic assembly. Novel materials
processing and alignment techniques are presented to solve those packaging challenges.
Novel Optoelectronic Device Packaging Concept
Utilizing Passive Alignment
William P. Kornrumpf, Glenn Forman, Kevin
Durocher, GE Global Research Center; Charles
Kryzak, Brian Leininger, Lockheed Martin
Ink-Jet Printing for Optical/Electrical Interfacing
of VCSEL and PD Arrays
Ting Chen, Donald J. Hayes, David B. Wallace,
MicroFab Technologies, Inc.
Design Optimization of Wedge-Shaped Lensed
Fibers for Fiber-Laser Coupling: Fresnel Reflection and Non-Gaussian Mode Effects
Yongzhi He, Frank G. Shi, University of California, Irvine
Assembly of Fiber Optic Devices using Reactive
Bonding
Omar Knio, David Van Heerden, Tim Weihs,
Reactive NanoTechnologies
Tin-Silver Electroplating of Pb-free Wafer Bumps
Rozalia Beica, Kai Wang, Neil Brown, Shipley
Company; Roger Quon, Tien Cheng, John
Griffith, IBM
Unique Metal-To-Glass Bonding for Hermetic
Packaging of MOEMS and Other Applications
David H. Stark, Electronics Packaging Solutions,
Inc.
Small Form Factor Fiber Optic Transceiver with
Unique Design to Meet EMC/EMI/ESD and
Thermal Requirements
Sunil Priyadarshi, Ihab Khalouf, Kishore Kamath,
Shaun P Scrak, Julie Sheridan, Luminent Inc.
A Study of Nonflow Underfill Flip-Chip Bonding Process for LCP Based COF Components
Satoshi Furuki, Hiroyuki Takahashi, Chihiro
Hatano, Makoto Yamasaki, Nippon Steel Chemical Co., Ltd.
Packaging Challenges of High-Power LEDs for
Solid State Lighting
Shatil Haque, Dan Steigerwald, Serge Rudaz, Bob
Steward, Jerome Bhat, Dave Collins, Frank Wall,
Sudhir Subramanya, Chris Elpedes, Phil Elizondo,
Paul S. Martin, Lumileds Lighting
Dynamic Characterization of NiTiNOL for Interconnection Applications
Shivananda P. Mizar, Ryszard J. Pryputniewicz,
Worcester Polytechnic Institute
Hybrid Approach to Thermal Management of a
FET Power Amplifier
Ryszard J. Pryputniewicz, David Rosato, Cosme
Furlong, Dariusz R. Pryputniewicz, Worcester
Polytechnic Institute
Thermal Management Printed Circuits with FilmBased Substrates offer Advantages in Performance, Cost and Design Flexibility
Jim Fraivillig, Fraivillig Technologies
Failure Modes of Flip Chip Solder Joints under
Current Stressing
Hua Ye, Cemal Basaran, Douglas C. Hopkins,
State University of New York at Buffalo
The Pb-Free SMT Reflow Environment and its
Impact on Multi-Component Module Package
Reliability
Daniel Cavasin, Motorola Semiconductor Product Sector
Quantitative LGA/Substrate Assembly Contact
Study from Pressure Sensitive Film Measurements
Wei Zou, Longworth Hai, IBM
An Objective Assessment of Printed and Plated
Bumping Technologies
Effect of Die-Attach Adhesives on the Stress
Evolution in MEMS Packaging
Junghyun Cho, Satyajit S. Walwadkar, P. W.
Farrell, Lawrence E. Felton, State University of
New York - Binghamton
Flip Chip Reliability for High Temperature Automotive Applications
Tania Braun, K.-F. Becker, M. Koch, V. Bader, R.
Aschenbrenner, H. Reichl, Fraunhofer IZM
Cure Processing Effects on Conductive Epoxy
Adhesives as Solder Alternatives
Wanda O’Hara, Sherri Smith, Chih-Ming Cheng,
Emerson & Cuming
Thursday, November 20, 2003
THA1 - Optoelectronics Packaging and
Processes
Chairs: Shapna Pal, Department of Defense;
X-IGA: Consumer price packaging for 40Gbit/s
Tranceiver Modules?
Georg Meyer-Berg, Ivo Koren, Holger Huebner,
Harry Hedler, Thorsten Meyer, Ulrich Lange,
Infineon Technologies
THA2 - CSP Modeling and Reliability
Chair: Theodore G. Tessier, ST Assembly Test
Services Inc.
8 am - 11:25 am
This session will cover recent advancements in
CSP modeling, reliability and highlight package
level and board level reliability improvements that
have emerged recently.
Board Level Reliability of Various Stacked Die
Chip Scale Packages Configurations
Flynn P. Carson, Bret Zahn, ChipPAC, Inc.
Assembly and Reliability Issues Associated with
Leadless Chip Scale Packages
Muffadal Mukadam, K. Srihari, Binghamton
University; Michael Meilunas, Universal Instruments Corporation
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Page 20
Thermal Cycling Test and Analysis of the
Bumpless Flip Chip Package
Charles W. C. Lin, Sam C. L. Chiang, T. K. Andrew Yang, Bridge Semiconductor Corporation;
John H. L. Pang, X. R. Zhang, T. H. Low, Nanyang
Technological University
Evaluation of Single or Multiple Plasma Clean
Processes Steps on BGA Package Reliability
Jesse Phou, Shawn O’Connor, Trent Thompson,
Motorola
Nanoparticles in Biomicrofluidic Devices
Ryszard J. Pryputniewicz, Zbigniew Sikorski,
Mahesh Athavale, Zhijian Chen, Andrzej J.
Przekwas, Worcester Polytechnic Institute
Progressive Development of Portable Non-Invasive Biomedical Imaging Electronics with Diversified Applications
Sihua Wen, Yuanqing Lin, Kiran Gangavarapu,
Samantha Gaw, Jun Zhang, Gwen Lech, Shoko
Nioka, Britton Chance, University of Penn-
Special Session*
8 am - 9:20 am
*Presentations will be 20 minutes each.
sylvania
The Effects of Solder Composition on Ball Fatigue Strength of Chip Scale Packages
Seung-weon Ha, Flynn Carson, Y. C. Kim, G. S.
Kim, ChipPAC Incorporated
Numerical Simulation of Underfill Cure Evolution in Chip-Scale-Package (CSP) Manufacturing Process
Rajesh R. Gomatam, John Coulter, Lehigh University
NonEpoxy-Based Underfill for CSP Assembly
Paul Morganelli, Robert Frimanson, Douglas
Katze, Emerson & Cuming Specialty Polymers
THA3 - Emerging Technologies
Chair: Kumaraswamy “Jay” Jayaraj, SiWave
Inc.
8 am - 11:25 am
Papers in this session cover a wide spectrum of
emerging packaging technologies including:
nanomaterials, novel materials and assembly
methods.
The Performance of Next Generation Semiconductor Molding Compounds for Array Packaging and Transfer-Molded Flip Chip Encapsulation
Louis P. Rector, Mark Dimke, Henkel Loctite
Electrical Properties of Ferrite/Dielectrics Multilayer EMI Filters using Buffer Layer
Moon Soo Park, Jae Hyuk Jang, Byung Gyu
Chang, Seung Gyo Chung, Samsung Electro-Mechanics
Mechanical Reinforcement for Sphere Attach
Applications
Maureen A. Brown, Richard Jung, Jin Liu, John
Stipp, Amir Fattahian, Sandhya Shashipadme,
Kester-Northrop Grumman
Novel Low-Cost Sol-Gel Derived Nano-structured and Repairable Interconnects
Ankur O. Aggarwal, I. R. Abothu , P. M. Raj, M.
D. Sacks, Rao R. Tummala, Georgia Institute of
Technology
LaPlace - A New Assembly Method using Laser
Heating for Ultra Fine Pitch Devices
Thorsten Teutsch, Ronald G. Blankenhorn,
Ghassem Azdasht, Peter Penke, Guenter Frieb,
Elke Zakel, PacTech USA - Packaging Technologies, Inc.
THA4 - Modeling and CAD
Chair: Luu Nguyen, National Semiconductor
Corp.
8 am - 11:25 am
A good understanding of the performance and
reliability of a new package will need established
analytical as well as semi-empirical simulation
tools. This session addresses the latest development in package thermo-mechanical analysis,
hygro-thermo-mechanical prediction, together
with high frequency electrical package simulation, and a view of the changing role of package
design software.
Analytical Solutions of Thermal Stress Distribution in Plastic Encapsulated IC Packages
Zhongmin Xiao, Biao Wang, Nanyang Technological University
The Effect of Material and Dimension Related
Parameters on the FIT Figures of Interconnections in Reliability Calculations
Klas Andersson, Olli Salmela, Markku
Tammenmaa, Jussi Särkkä, Nokia Research Center
Experimental Physics-Based Structure Integrity
Analysis for Reliability Prediction
Hua Lu, Ryerson Polytechnic University; Jesse
Zhou, Motorola Inc.; Rich Golek, Richgolek Consulting
An Effect on Bump Joint of FC-LFCSP, using
Characterization of Hygro-Mechnical and Thermal-Mechanical Stress
Dae Whan Kim, R. L. Shook, Tong Yan Tee, Fan
X. J. Galloway, ChipPAC
A Novel Modelling Methodology of Bump Arrays for RF and High-Speed Applications
Ivan Ndip, Grit Sommer, Werner John, Herbert
Reichl, Fraunhofer Institute for Reliability and
Microintegration (FhG-IZM)
Techniques of Robust Electrical Package Design
using HFSS
Christopher Gordon, Andy Piloto, Jerry Aguirre,
Paul Garland, Joseph Tallo, Heather Tallo, Rei
Yamada, Derek Mrazek, Kyocera America Inc.
The Changing Role of Software for the Design of
Microelectronic Circuits
Andres Carrasco, CAD Design Software
Computational Modeling of Optical Trapping of
THA5 - National Science Foundation &
Sidney J. Stein Educational Foundation
Chairs: Rao Tummala, Leyla Conrad, Georgia
Institute of Technology
Reliability of Multilayer Capacitors as a Function of Furnace Conditions
Chris Willaims, Alfred University
Fabrication of Microchannels in LTCC
Roxana Estevez, Florida International University
Organic and Inorganic Substrate Materials
Adam Brown, Arizona State University
Improving the Reliability of Active Metal Brazed
Cu/AlN
Beth MacMichael, New York State College of
Ceramics at Alfred University
Authors are NSF/SJS
2003 Award Recipients
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9th Annual Sidney J. Stein
Educational Foundation Golf Classic
Monday, November 17, 2003
PinehillsG olfClub,Plym outh,M A .w w w .pinehillsgolf.com
The9th A nnualIM A PS G olfClassicw illbeheld atPinehillsG olfClub – Plym outh
on M onday,N ovem ber17,2003. The tournam entw illfeature a shotgun start
w ith prizes aw arded to the overallw inners,as w ellas those closestto the pin
and w ith the longestdrive.
Pinehills Golf Club w as created to rivalthe country’s m ostprestigious golf
clubs,bringing w orld class,daily fee golf to N ew England.A n unparalleled
range of com prehensive facilities, attentive service and a com m itm ent to
excellence are the hallm arksofPinehills,w hich isdedicated to offering players
ofalllevels a “totalgolf” experience in keeping w ith the rich traditions ofthe
w orld’s greatestgam e.
Costis$125 perperson before O ctober3,2003,and $150 perperson after.
The cost includes: Round trip Coach Transportation to Links, G reens Fees,
ChoiceofCourse(2),Personalized Bag Tags,GolfCarts,LockerRoom s,Unlim ited
Range Balls,Scoring by a PG A Professional,Bag D rop Service,and LU N CH .
spouse/guest program
Tuesday, November 18, 2003 - 8:30 AM - 4 PM
Historic Plymouth - Travelto Plymouth,A m erica’s first perm anent settlem ent.along
Plym outh’s historic w aterfront,view Plym outh Rock before boarding the Mayflower II,
a full-size replica ofthe ship thatcarried the Pilgrim s to the N ew W orld.U pon arrivalat
Plym outh Plantation,take a self-guided tourofthe 1627 Village and Indian campsite.
A s you step back in tim e,“interpreters” m ake the 17th century com e alive.Then,enjoy
a traditional 17th century luncheon that includes sam pling of English and W am pnoag
dishes. Includes:D eluxe m otor coach Transportation,N arration by a ProfessionalTour
G uide,adm issions to Plym outh Plantation and the M ayflow erII,17th century luncheon.
Wednesday, November 19, 2003 - 8:30 AM - 4 PM
The North Shore: Seaside Villages - A shortdistance from Boston you w illfind som e of
N ew England’s m ost picturesque seaside villages. Experience the uniqueness of
Marblehead,the racing yachtcapitalof the w orld.M arvelatthe breathtaking view s of
the A tlantic O cean and the rocky coastline atCastle Rock on Marblehead Neck.W ind
through Old Town to view period hom es ofthe 17th and 18th centuries.In Salem ,learn
aboutthe im portance the m aritim e industry once had,and the infam ous w itch trials of
1692 asyou tourthrough thisperiod com m unity.Enjoy a guided tourofthe House of the
Seven Gables,the hom e thatw as the inspiration for N athanielH aw thorne’s classic tale
before a group luncheon atthe historic H aw thorne H otel.A fterlunch,there w illbe tim e on
your ow n to stroll am ong the shops at Pickering Warf,or you m ay choose to visit the
Salem W itch M useum orPeabody & Essex M useum w hich housesa vastcollection ofart
and antiquesfrom theChinaTrade.Includes:D eluxem otorcoach Transportation,N arration
by ProfessionalTourG uide,adm ission atthe H ouse ofSeven G ables,Luncheon.
Tuesday & W ednesday only:$200 – A dvance;$250 – O n-site.
PLEASE NOTE: Buses will depart from the Dalton Street Entrance of the Sheraton
Boston Hotel.
ingly.
Tours will involve walking and participants should dress accord-
Comfortable walking shoes and layered clothing are recommended.
Special Event at IMAPS ’03
Microelectronics Marketing
Research Council
MARKETING FORUM
TheM M RC w illofferafree-of-chargeM arketing Forum
to allIM A PS 2003 attendees.TheForum w illbeheld on
W ednesday m orning,N ovem ber19,2003.
2003 w as forecasted as a year of continuing recovery
for various segm ents of the m icroelectronics industry.
This session w ill help clarify if those forecasts have
been fulfilled,w hich technologiesare “hot,” and w hich
continue to struggle.W ith m any com panies resources
stretched thin, how does this im pact their ability to
develop and deliver product? W hatw as the im pactof
w ar,SA RS,and the overallgeopoliticalenvironm enton
our industry? W ith m anufacturing continuing its
m igration to low cost regions, how does this im pact
Y O U R business? These questions and m ore w ill be
addressed.
Speakers w ill discuss their analysis and insights into
variouscurrentand em erging m arketsofinterestto both
current and prospective IM A PS m em bers. Som e of
thesem arketsarePassiveD evices,W LA N ,A utom otive,
Broadband,W ireless,m anufacturing in China,etc.The
Forum w ill feature four presentations w ith a panel
discussion at the end that w ill allow for audience
participation in thisnot to be missed event!
MMRC - addressing the business side of microelectronics and packaging
WA5 - Marketing Forum - 8 am - 11:25 am
Chairs:M ichaelP.O ’N eill,H eraeus Inc.-CM D ;H ow ard
Im hof,M etalorCorp.;A dam Singer,Cookson
Electronics
O pening Rem arks
M ichaelO ’N eill,Chairm an,M M RC Steering Com m ittee
Packaging isLeading the Recovery
Jim W alker,G artnerD ataquest
O pportunitiesforA pplication Specific and Value A dded Com ponents
D ennis Zogbi,Paum anok G roup
Broadband W ireless Technology and O pportunities
Jack Brow ne,Penton M edia
G lobalElectronics M anufacturing -The China W ild Card
Jan Vardam an,TechSearch International
The W ireless Industry - W hat’s H otand W hat’s N ot
D on Brow n,InternationalW ireless Packaging Consortium
PanelD iscussion
M oderator - Jack Brow ne,Penton M edia
Free of Charge for all IMAPS 2003
ATTENDEES!
IN TER ESTED IN EXH IBITIN G ? C O N TAC T IM APS TO D AY •1-202-548-4001 O R EM AIL D PAU L@ IM APS.O R G
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exhibitors
A D Micro-Assembly
ACerS
Accu-Tech Laser Processing,
Inc.
Advance Reproductions Corp.
Advanced Packaging/Pennwell
Corp.
Advanced Technology Group,
Inc.
AI Technology
Alpha Electronics Corp. of
America
American Technical Ceramics
AMI/Presco
Amitron, Inc.
Anter Corp.
Applied Laser Technology,
Inc.
ARGES-USA
Asahi Techno Glass
Aspen Technologies
Asymtek
ATV Technology, Inc.
Azimuth Electronics, Inc.
BTU International
Bandwidth Semiconductor,
LLC
Barry Industries, Inc.
BridgePoint Technical
Manufacturing Corp.
CAD Design Software
CMC Wireless Components
CST of America
CadQal Development
Central Semiconductor Corp.
Centrotherm Atlanta LP
Ceramics Process Systems
Corp.
Ceratek
Chip Supply
Chomerics, Division of Parker
Hanifin
Clark Mini Fastener
Cobehn Systems, Inc.
Coining of America LLC
Colt Refining, Inc.
Convergix
Coorstek
CTS Microelectronics
Curamik Electronics, Inc.
Cyber Technologies/Optical
Systems
Dage Precision Industries, Inc.
Dakota Consulting
Datacon North Ameica, Inc.
Despatch Industries
Deweyl Tool Company, Inc.
(as of 9/24/2003)
Disco Hi-Tec America, Inc.
Dow Corning Corporation
DuPont Microcircuit Materials
Dyconex Ltd.
Dynamics Research
Corporation - Metrigraphics
EKRA America
Eberts Microelectronics, Inc.
Electro Science Labs (ESL),
Inc.
Electro Scientific Industries
(ESI)
ElectroChemical Systems, Inc.
Emerson & Cuming
EMSL Analytical Inc.
Epoxy Technology, Inc.
ES Components, Inc.
ESEC (USA)
EXAKT Technologies, Inc.
F&K Delvotec
Ferro Electronic Materials
Finetech, Inc.
Flow Autoclave Systems, Inc.
Fujipoly America Corporation
Gaiser Tool Co.
Gannon & Scott, Inc.
Geib Refining Corporation
Gelest Inc.
General Metal Finishing Co.,
Inc.
Global SMT & Packaging
Graphite Concepts, Inc.
GSI Lumonics
Haiku Tech, Inc.
Handy & Harman Electronic
Materials Group
Harrop Industries, Inc./A.J.
Carsten Co.
Heidelberg Instruments
Henkel Loctite Corp.
Heraeus Incorporated-Circuit
Materials Division
Hesse & Knipps, Inc.
Hybrid Screen Technologies,
Inc.
Hybrid Sources, Inc.
Indium Corporation of America
Innovative Fabrication, Inc.
Instron Corporation
Interconnect Systems, Inc.
ITT Industries
Ixion Technologies
Kaneka High-Tech Materials
Kester Solder Co.
Kyzen Corp.
Lambda Physik USA, Inc.
Laser Process MFG
Laser Processing Technology,
Inc.
Laser Services, Inc.
Laser Tech, Inc.
Laser Tools & Technics Corp.
Laserage Technology Corp.
Lasereliance Technologies
Litron, Inc.
M/A-COM
March Plasma Systems - a
Nordson Company
Marpet Enterprises, Inc. (MEI)
Mesago Messe Frankfurt
GmbH
Metal Matrix Cast Composite,
LLC
Metallix, Inc.
Micro Hybrid Dimensions Inc.
MicroChem Corp.
MicroConnex Corporation
Micrometrics, Inc.
MicroPen, a Division of
Ohmcraft
MicroScreen LLC
Micro Stamping Corp.
Micross Components Corp.
Microtec Magazine/Witter
Publishing Corp.
Midas Vision Systems, Inc.
Minco Technology Labs, Inc.
Mini-Systems, Inc.
Mitsui Chemicals America, Inc.
NAMICS Technologies, Inc.
NanoPierce Connection
Systems, Inc.
Natel Engineering Co., Inc.
NETZSCH Instruments
Newport Corp., MRSI
NEXX Systems LLC
Nippon Steel Chemical Co.,
Ltd.
NorCom Systems, Inc.
Northeast Electronics Corp.
Northern Illinois University
NTK Technologies, Inc.
Olin Aegis
Oneida Research Services, Inc.
Orthodyne Electronics
Osprey Metals Ltd.
Pac Tech
Pacific Aerospace &
Electronics
Parelec, Inc.
PI R&D Co., Ltd.
Plasma Etch, Inc.
Polaris Electronic Corp.
Potomac Photonics, Inc
Premier Mill, A Lightnin Co.
Presidio Components, Inc.
Prince & Izant Co.
Promerus LLC
Questech Services Corp.
RAAD Technologies, Inc.
Reactive NanoTechnologies
Reldan Metals, Inc.
Remtec, Inc.
Rigsby Screen & Stencil, Inc.
Riv, Inc. - Thick Film Screens
Royce Instruments, Inc.
SUNY-Buffalo
SatCon Electronics
Saxonburg Ceramics, Inc.
SEFAR America - MEC
Division
Semi Dice, Inc.
Semiconductor Equipment
Corp.
Semiconductor International
Semiconductor Packaging
Materials
Sikama International, Inc.
Sinclair Manufacturing Co.
Solid State Equipment Corp.
Sonix Inc.
Sonoscan, Inc.
SST International
Stellar Industries Corp.
SUSS MicroTec
Sypris Test & Measurement,
Inc.
Taitronics, Inc.
Tecan Components Ltd.
Technic, Inc.
Teledyne Interconnect Devices
Teledyne Microelectronics
Thermoset, Lord Chemical
Products
Thick Film Printing Machine
International
Toshiba America Electronic
Components
Transene Company, Inc.
Trebor Instrument Corp.
Utz Technologies, Inc.
UltraSource, Inc.
Unichem Industries, Inc.
Unitek Benchmark, Inc.
Viox Corporation
Vishay Intertechnology, Inc.
Vision Engineering, Inc.
West-Bond, Inc.
Williams Advanced Materials
Zymet, Inc.
See the IMAPS on-line tradeshow at www.imaps2003.org
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Page 24
2003 IMAPS Award Winners
IMAPS is proud to announce that the following distinguished members of the
Society were chosen to receive the prestigious Society Awards for 2003. These recipients will be honored at an Awards Ceremony
at IMAPS 2003.
Nihal Sinnadurai is the recipient of the
2003 Daniel C. Hughes, Jr. Memorial Award
for global contributions in the
development of
packaging techniques and testing of high reliability electronic
and optoelectronic systems,
specifically
contributions
toward
the
invention
of
HAST, Liquid Crystal thermal mapping, cost
effective microelectronics packaging and
reliability testing for high reliability systems,
and for fostering the advancement of professional engineers in the industry.
Dr. Masahide Tsukamoto received the
John Wagnon Technical Achievement Award
for advancing
the state-of-theart in Ceramic
Based CSP Stud
Bump Bonding,
Any Layer Inner
Via
Hole
(ALIVH) interc o n n e c t
technology
and Zero X-Y
Shrinkage Low
Te m p e r a t u r e
Cofired Ceramic Substrate Technology.
Rene Cote was honored with the William
D. Ashman Award for his outstanding
contribution to
the field of
Electronic
Packaging,
through
pioneering work in
resistor-networks, chip and
wire hybrids,
LTCC development, and the
effects of surface chemistry of 96% alumina
substrates on thick film materials performance.
Four Fellow of the Society Awards were
given this year to:
S e l i m
Achmatowicz
for significant
and continuing
contr ibutions
to IMAPS over
the course of
many years, particularly in uniting European
activity.
Don Brown
for
significant
and continuing
contributions to
IMAPS over the
course of many
years, particularly
in his support of
MMRC and technical programs.
Shen-Li Fu for
significant and
continuing contributions
to
IMAPS over the
course of many
years, particularly
his support of the
Asian
Chapter
development.
Harvey Smith
for
significant
and continuing
contributions to
IMAPS over the
course of many
years, particularly his support
of
the
New
England Chapter.
Ferro Corporation has received the 2003
Corporate Recognition Award in appreciation of its dedicated service and in recognition of outstanding contributions to the
advancement and success of IMAPS through
continued corporate involvement with the
MMRC and the CII and technical leadership
in thick film materials, glass materials and
LTCC tapes, thereby advancing the microelectronics industry.
Dr.
Karel
Kurzweil is the
IMAPS
2003
International
Award winner.
The award was
given in recognition of his
long-term
continuing
technical and
organizational
work significantly contributing to the
International growth of the Society, and as
President of the IMAPS European Liaison
Committee.
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9th Annual
Pan Pacific
Microelectronics Symposium
and Tabletop Exhibition
10-12 February 2004 Turtle Bay Resort, Kahuku, Oahu
International Technical Interchange
The Pan Pacific Symposium
focuses on the critical business
markets and technologies of microelectronic packaging, interconnection, microsystems technology and
assembly.
The Pan Pacific Tabletop Exhibition
puts you in contact with global key
decision makers and provides
access and international visibility
for your company and products.
Sponsored by:
SMTA
Surface Mount Technology Association
www.smta.org
952-920-7682
smta@smta.org
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The 2004 Executive Council of IMAPS
Brings a Wealth of Knowledge and Prestige to the Society.
The International Microelectronics And
Packaging Society (IMAPS) is proud to
announce the following members of the
2004 Executive Council.
President, Mr. Phillip J. Zulueta ,
phillip.j.zulueta@jpl.nasa.gov; has been
a member of ISHM/IMAPS since 1979
and has served as Southern California
Regional Director of IMAPS, IMAPS
Technical Sub-Committee Chairman for
Photonics/Optoelectronics Packaging, PastGeneral Chairman for the IMAPS Southern
California Regional Symposium and has held
various offices and appointed positions at
the local chapter level including PastPresident of the Orange Chapter of ISHM
(International
Society
for
Hybrid
Microelectronics). Currently, he manages the
Engineering Assurance and Advanced
Technology Group at Jet Propulsion
Laboratory, Pasadena, CA, where he manages
a team of engineers and technologists
involved in a variety of disciplines that
include: Electronics Packaging Technology,
Non-destructive Evaluation, Manufacturing
Technology Transfer and Certification,
Extreme Cold Temperature Testing, Optical
Metrology and Electro-Static Discharge (ESD)
Awareness and Control. He is also a JPL
Program Element Manager and the
Electronics Packaging Project Manager for
the NASA-wide Electronic Parts and
Packaging Program.That activity involves the
evaluation of new and advanced electronics
packaging technologies for NASA applications. Prior to joining JPL, he was Western
Regional Manager for Electro-Science
Laboratories in King of Prussia, PA, Program
Manager for Ball Aerospace Microelectronics
in Huntington Beach, CA, an Engineering
Group Manager for Hughes Microelectronics
in
Newport
Beach, CA, and
a
Microelectronics Process Engineer for
Northrop Electronics in Hawthorne, CA. His
education includes a Masters degree in
Business Administration from Pepperdine
University and a Bachelor of Science degree
in Materials Engineering from California
State University Long Beach. Phil has also
been a past member of SMTA (Surface Mount
Technology Association) and SID (Society for
Information Display).
President-Elect, Dr. Bruce Romenesko ,
bruce.romenesko@jhuapl.edu;
(Newly
Elected), is currently a Principal Staff
Physicist in the Electronic Services group of
The Johns Hopkins University, Applied
Physics Laboratory. His primary responsibili-
ty is for technology development within the
broader microelectronics arena. Additionally,
he is responsible for packaging and failure
analysis of high reliability electronics, including hybrid microcircuits, surface mounted
devices, and board level assemblies. His previous technical work has been within the
areas of assembly, process development and
substrate fabrication in both hybrid and
board level microelectronics at JHU/APL. His
packaging background also includes the role
of principal packaging engineer for the signal processor box of the Topex spacecraft.
He has recently been active in experimentation in microwave hybrid circuit reliability, in
radiation testing of electronics used in spacecraft programs, in area array packaging technologies, and in reliability testing methods. A
prime recent role has been that of an advisor
on electronics materials, packaging and reliability to a number of US Navy programs. He
holds a BS in Physics and Mathematics from
the University of Wisconsin, and a Ph.D.
degree in Solid State Physics from the
University of Maryland. He joined the
JHU/APL Microelectronics group in 1979.
Dr. Romenesko has published over 40 papers
within physics and microelectronics. He is a
member of IMAPS and IEEE, and serves
IMAPS on the National Technical
Committee’s core committee, as chair of the
NTC’s Interconnections subcommittee, as
associate editor of the International Journal
of Microelectronics and Packaging, and as
the Mid-Atlantic Regional Director. He is also
a member of the publications committee,
and was Technical Chair for IMAPS 2001 symposium in Baltimore. He is a member of a
government, industry and laboratory team
that received a 2001 IR&D 100 award for
instrumentation development.
First Past President, Dr. Peter Barnwell,
pbarnwell@4cmd.com; Peter Barnwell’s long
involvement with IMAPS began as a founding
member of both the UK chapter and the
European Liaison Committee. He served as
President of IMAPS Europe (1999-2001) as
well as spending several years on the IMAPS
UK committee as Chairman (President) and
Treasurer. A founding member of the
Ceramic Interconnect Initiative (CII), Peter
also holds recognition as a Fellow of IMAPS.
He received his B.Sc. Applied Physics from
City University, London, in 1966 and his
Ph.D. in 1973. Her Majesty the Queen
appointed him a Member of the Order of the
British Empire (MBE) in 1984 for services to
industry. Peter’s industrial experience
includes the founding and leadership of two
hybrid microelectronics companies in the
UK and serving as director of two publicly
quoted venture capital organizations. In the
early 1980s he helped lead development of
the surface mount industry in the UK. He
also held positions as Professor and Dean at
Kingston University, England, and worked
with several other universities.
Vice President of Technology, Dr. R.
Wayne Johnson, Johnson@eng.auburn.edu; is
an Alumni Professor of Electrical and
Computer Engineering and Director of the
NSF Center for Advanced Vehicle Electronics
at Auburn University. He has established
teaching and research laboratories at Auburn
for advanced packaging and electronics
assembly. Research efforts are focused on
materials and processing for electronics
assembly with emphasis on harsh environments. He has published and presented
numerous papers at workshops and conferences and in technical journals. He has also
co-edited a book on MCM technology and
written four book chapters in the areas of silicon MCM technology, MCM assembly, hybrid
technology and high temperature packaging.
A member of IMAPS for 23 years,Wayne was
the 1991 President of IMAPS. He received the
1993 John A.Wagnon Technical Achievement
Award, was named a Fellow of the Society in
1994 and received the Daniel C. Hughes, Jr.
Memorial Award in 1997. He is also a member of IEEE, SMTA, and IPC. He received the
B.E. and M.Sc. degrees in 1979 and 1982 from
Vanderbilt University and the Ph.D. degree in
1987 from Auburn University. He has worked
in the microelectronics industry for DuPont,
Eaton, and Amperex.
Vice President of Membership, Dr. Ken
Gilleo (Newly Elected), gilleo@ieee.org;
joined ISHM’s Viking Chapter in the late
1980s while R&D Director at flexible circuit
pioneer Sheldahl (Northfield, MN). But, ISHM
was an odd fit because of his focus on organic flexible circuitry and there was only minor
involvement; occasional chapter presentations. He also became involved with IEPS and
helped to highlight Polymer Thick Film
(PTF). Neither organization was quite right
for the organic materials technologist but the
1996 merger turned out to be the right mix.
Ken joined the new organization a year later,
became active in the New England chapter,
and has served on the Technical Committee
(organize/chair MEMS sessions) for the
IMAPS New England Annual Symposium &
Exhibition for 3 years. This year, he became
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Page 27
more active as Technical Chair for IMAPS
2003, 36th International Symposium on
Microelectronics, and has contributed about
a dozen papers and write the column,
“Kemist’s Korner” for the IMAPS New
England newsletter. Ken’s technical experience includes: Materials expertise includes
formulating, optimizing and characterizing
encapsulants, package seals, flip chip underfill, conductive adhesives, UV-cured systems
and latent thermoset polymers. Hold the
basic patents for novel wafer-level underfill
processes and materials. Pending patents
cover plastic hermetic packaging, mechanical strength enhancement (drop test), and
full hermetic wafer-level inorganic chip
scale packaging. Productive inventor in
printed circuitry, packaging and materials; 3
products have received R&D100 Awards;
these include High Density Multilayer,
Adhesiveless Flex and Chip Scale Packaging
(CSP). Holder of about 29 US patents;
received a record 7 US patents in 2001 on
wafer-level underfill; several MEMS packaging patent applications are pending.
Recognized expert in several areas: Flexible
Circuitry and Electronic Materials, Electronic
Packaging (CSP, Flip Chip, MEMS and
MOEMS).Awarded Atomic Giant 2000 - most
influential person in printed circuit industry.
Invited expert for conference panels. Prolific
author with over 420 articles, papers and
tutorials. Veteran writer with a popular
monthly column (The Bleeding Edge) for
EP&P magazine, Kemists Korner for IMAPSNew
England,
Circuits
UNUSUAL
(CircuiTree) and ET Trends (Circuits
Assembly). A 3 book set on Area Array
Packaging (McGraw-Hill) will be released in
November 2003 bringing the total to 6
books in print. Industrial Forensics (problem
solving) - the top 100 industrial case histories; problems, solutions and strategies will
be published in 2004. Invited speaker/lecturer: Royal Institute of Sweden, Hong-Kong
Productivity Council, Uppsula U., MIT, IFV
(Sweden), Tech. U. Berlin, Orebro U., RIT,
IMEGO (Sweden), DELTA (Denmark),
Worcester Polytechnic Institute, Chalmers
Technical U., and National Physics
Laboratory (UK).
Treasurer, Mr. Edward M. Gildein (Newly
Elected),
edgild@aol.com;
is
CoOwner/Founder of Hybrid-Tek, Inc.,
Clarksburg, NJ. Founded in 1981, Hybrid-Tek,
Inc. is the manufacturer of hybrid thick film
assemblies and related products. Ed is currently President/C.E.O. of Hybrid-Tek, Inc.
He attended Drexel University for electrical
engineering and has been in the industry
since 1960. Prior to Hybrid-Tek, Inc., he was
employed at IRC, RCA, United Aircraft,
Lansdale Microelectronics and Gulton
Industries. While at United Aircraft, he did
the design and layout of the first multi layer
thick film 2 layer printed substrate, which
received a patent in 1968. Ed has been a
Charter Member of ISHM/IMAPS since 1967.
Active in the Keystone Chapter, he has
served various positions: Program Chair,
Treasurer, Vice President and President. He
served as General Chair for ISHM in 1983,
and for ISHM/IMAPS in 1997, both in
Philadelphia. He received the Fellow of the
Society Award in 1983. In 1990, he was the
2nd recipient of the Ira Custman Service
Award, for dedication and service “over and
above” to the Keystone Chapter. Ed served
as Mid-Atlantic Regional Director for 4 years,
Chaired Regional Symposia meetings, sponsored by the Keystone Chapter, as well as
joint meetings with Garden State and Metro
Chapters during the course of the last 32
years. He continues to serve in various
capacities, as required.
Secretary, Mr. Lawrence J. Rexing, lrexing@4cmd.com; Larry Rexing has been a
member of ISHM/IMAPS for over 15 years.
He has 30 years of experience in the thick
film and packaging industry. Larry is currently employed by Heraeus Incorporated,
Circuit Materials Division, as Midwest
Regional Sales Manager, a position he has
held for over four years. He has a BSEE
degree from Purdue University. Larry has
held many leadership positions with the
Indiana chapter, including Chapter
President. Larry has been a member of the
Executive Council and held the position of
North Central Regional Director for four
years. He has co-authored and presented several papers at the regional and local levels.
He also helped organize and initiate the first
MCM Test workshop in Napa Valley.
Northeast Regional Director, Ms. Susan
C. Trulli, strulli@astex.mksinst.com; Susan
Trulli is currently a Senior Scientist at MKS
Astex Products Group in Wilmington, MA.
There she is working on power hybrids and
thermal transfer issues for power supplies
used for plasma generation in semiconductor processing. She has over 23 years of
experience in hybrid microelectronics and
has specialized in microwave microelectronics for commercial, space and military applications from initial design through transition
to production. Prior to working at MKS,
Susan spent many years at Raytheon where
she received the Thomas K. Phillips Award
for Excellence in Technology and the
Raytheon Microelectronics Distinguished
Contribution Award, both in 1996 and the
Advanced Manufacturing Engineering
Council, “Excellence through Performance”
Award in 1988. Susan joined ISHM in 1984
and has been active in her regional New
England chapter. She was elected Secretary
to the New England IMAPS Executive Board
in 1998 and has served as the Microwave
Technology Session Chair for the NE IMAPS
continued on page 28
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continued from page 27
Symposium from 1999 to present. She has
also been an invited session chair and speaker for several Ceramic Initiative Advanced
Technology workshops. Susan has presented
numerous papers on microwave module
design and materials and holds patents and
trade secrets in this area. Susan received her
Baccalaureate from Brown University in
Physics.
North Central Regional Director,
Mr. Gino P. Domenella ; Mr. Domenella
gdomenella@yahoo.com is a seasoned veteran of the thick film industry, and IMAPS
member with over 22 years of service at various leading manufacturers of thick film
products in the Chicago/Milwaukee region.
Areas of focus have included Production
Engineering, Process Engineering, Materials,
Design, Manufacturing, Management and
Operations. He has been involved with ISHM
since college when it had a small but recognized presence in the Chicago/Milwaukee
area. He was the student chapter President
and Treasurer of the student section at
Northern Illinois University. Upon graduation, Gino continued to assist the university
in the operation and renovation of the thick
film lab located on campus and provided and
procured thick film materials for use in the
lab for student projects. He also mentored
several students along the way, who have
successful careers within the industry. Gino
assisted in the organization of the chapter’s
April Technical conference at Northern
Illinois University for four consecutive years.
Within the Chicago/ Milwaukee chapter he
has held the offices of President, Vice
President, Treasurer (multiple terms),
Assistant Treasurer, Symposium Registration
Chair, Nominations Chair and currently holds
the Membership Chair position for the past
several terms. On a National level, he has
been a prior candidate for Regional Director,
has assisted at numerous national and local
meetings and has chaired sessions at the
national meeting in Chicago in 1999.
Currently, as Chapter Membership Officer,
Gino works closely with national to secure
local chapter membership and keep member
status current as well as assisting members of
the IMAPS society. He was recently nominated for Fellow of the Society Award by the
Chicago/Milwaukee Chapter.
Southeast Regional Director, Dr. Ajay P.
Malshe , apm2@engr.uark.edu; Dr. Ajay P.
Malshe, is Associate Professor at the
Department of Mechanical Engineering and
an adjunct faculty at the High Density
Electronics Center (HiDEC), Department of
Electrical Engineering, University of
Arkansas. His three distinct fields of research
and educational interest are integration and
advanced packaging of micro and nanosystems, surface engineering of materials for
advanced manufacturing, and humanmachine interfaces. He has edited two pro-
ceedings, and authored one book chapter,
over one hundred refereed publications and
holds four patents. He is currently an
active member of the International
Microelectronics And Packaging Society
(IMAPS) through the organization of
Advanced Technology Workshops (ATW) on
MEMS Packaging. Currently, he is the
Chairman of the Thermal Management
Technical Sub-committee and also, National
Chair of Topical Technology Workshops for
IMAPS.
Northwest Regional Director, Mr.
Anwar A. Mohammed, anwar.mohammed@
ultrarf.com; (Newly Elected to second term).
Anwar Mohammed graduated in 1977 with a
B.Sc. in Chemical Engineering from Indiana
Institute of Technology in Fort Wayne,
Indiana, and obtained his MBA from St.
Edward’s University in Austin,Texas in 1983.
Anwar has been involved with the microelectronics industry since 1977 when he
joined CTS in Berne, Indiana, as a R& D
Engineer, fresh out of college. He has worked
in different roles in many different companies
like
CTS,
Zenith,
National
Semiconductor, Micro Module Systems,
Spectrian and now he is a Senior Manager at
Ultra RF, a state of the art wireless company
dealing with Si and SiC wireless devices.
Ultra RF is a division of Cree Inc. Anwar has
authored and presented many papers in the
microelectronics field, a good number of
them under the aegis of IMAPS. He has also
co-authored several patents in the microelectronics industry. He has been a member of
IMAPS since 1978 working with the Indiana
Chapter, during his employment with CTS.
He was also the General Vice Chair for IMAPS
during the International Silver Jubilee
Symposium and Conference in San Francisco
in 1992.
Southern California Regional Director,
Mr. David C. Virissimo, dvtech@flash.net;
David Virissimo is owner and president of DV
Technical Sales, a successful manufacturers’
representative firm serving the electronics
industry, since 1995. David received his BS in
computer science from U.C. San Diego in
1984. David has been an active member of
the San Diego Chapters of IMAPS,ACerS and
IEEE/CPMT and currently holds the positions
of co-membership chair and circulation
chair. David served two terms as Chapter
President (1998 & 1999) and two terms as
Program Chair (1996 & 1997) as well as
Chapter Treasurer. David started initial work
to form the UCSD Student Chapter, established in 2000. He was General Chair for
SoCal 2000 Regional Symposium. David
served as Treasurer & Exhibits Chair for
SoCal 1995. He served as Exhibitor Co-Chair
for IMAPS’ 1998 National Symposium.
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The MMRC Steering Committee
Welcomes IMAPS 2003 Attendees
to the 2nd Annual Marketing Forum!
Michael P. O’Neill,
Heraeus/CMD
Chairman
Microelectronics
Marketing
Research Council
Steering
Committee
Welcome to IMAPS 2003!
The Microelectronics Marketing Research
Council (MMRC) is ready for Beantown and
will again sponsor the 2nd annual free-ofcharge Marketing Forum at IMAPS 2003 in
Boston. Last year’s inaugural Forum was well
attended - so well, in fact that we found ourselves bartering with other session chairs to
get a larger room for the anticipated standing
room only crowd. The marketing folks prevailed (hey, negotiating is what we do for a
living!) but when we moved to the larger
room, we filled up that room. So it was at
that point the First Annual Marketing Forum
officially became a standing room only
event. In this day of tight budgets, it was
exciting that this event generated so much
interest and positive feedback. Some attendees debated the opinions of speakers during the panel discussion and after the session
- exactly the interaction we were looking for.
In summary, the Forum was a resounding
success.
A team from the MMRC Steering
Committee took on the challenge to make
the Forum for this year’s symposium even
better. Howard Imhof, Adam Singer, and I
have organized a star-studded lineup for this
year. Doug Paul from IMAPS has gotten the
word out to anyone who will listen, so we
expect even more participation this year!
2003 was forecasted as a year of continuing recovery for various segments of the
microelectronics industry. This session will
help clarify if those forecasts have been fulfilled, which technologies are “hot,” and
which continue to struggle.With many companies resources stretched thin, how does
this impact their ability to develop and deliver product? What was the impact of war,
SARS, and the overall geopolitical environment on our industry? With manufacturing
continuing its migration to low cost regions,
how does this impact YOUR business? These
questions and more will be addressed.
Here is a sampling of what you will hear
at this event:
Jim Walker from Gartner Dataquest will
kick off the event and give a view of where
the packaging industry stands with respect
to economic recovery. Dennis Zogbi - the
expert in analysis of the passive component
market - will review high value applications
for passives. Jack Browne, publisher of
Microwaves & RF, will provide an overview
of what is happening today in the broadband
market. Jan Vardaman, well known for her
international business research in packaging,
will discuss global manufacturing with a
keen eye on the impact of China.And last but
not least, Don Brown from IWPC and IMAPS
Fellow will sum up and talk about which
markets are hot and which are not in wireless. A panel session will bring together the
speakers to discuss their opinions as to outlook for our industry and the impact of the
global economy and other events in our businesses.
The Marketing Forum will be held on
Wednesday morning, November 19, 2003, at
8:30 AM in the Hynes Convention Center in
Boston. If you or your company is working in
Microelectronics and Packaging this is a
Forum you can’t afford to miss.
The next event sponsored by the MMRC
is the annual Winter Conference, taking place
January 14-16 in San Diego, CA.This meeting
will feature 1.5 days of high quality speakers
discussing business conditions and market
trends from an OEM/End User and Packing
300397_imaps.qxd
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Page 31
perspective. The second day will feature a
half day session of market and financial analysts who will give an up to date analysis of
trends and outlook for our industry. Look for
the program details in this issue of
Advancing Microelectronics and on-line at
www.imaps.org/mmrc.htm. This is a mustattend event for those business and marketing executives looking to execute strategies
for 2004 and beyond.
At both of the above events, we’ll fill you
in on the balance of MMRC’s activity. See
you at IMAPS Boston, at our Winter Meeting,
and or course, in the next issue of
Advancing Microelectronics!
In 1987, representatives from the International
Microelectronics and Packaging Society (IMAPS)
and the IPC met to form the Microelectronics
Marketing Research Council (MMRC).The MMRC
targets the industry’s business executives and
marketing professionals through the IMAPS
Organizational Member Community. It provides a
forum for members to organize and support programs designed to analyze the technology and
competitive elements impacting the microelectronic packaging marketplace. The MMRC holds
biannual winter and summer meetings. Drawing
from the expertise of industry experts, these programs focus on market trends and marketing
issues facing our business today and in the future.
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European Activities &
Calendar of Events:
Benelux:
Czech & Slovak:
Meetings Programme:
Meetings Programme:
G
15th European Microelectronics and
Packaging Conference & Exhibition EMPC2005
G
3rd European Microelectronics and
Packaging Symposium with Table Top
Exhibition - EMPS Prague 2004
Drive the future!
Please mark your calendars now for this event,
which will take place in Brugge, Belgium, June
12-15, 2005.
Prague, Czech Republic, June 16-18, 2004
Please mark this event in your diary now.The
location is Diplomat Hotel, only 10 minutes
from the historical down town of Prague.
www.empc2005.be
www.imaps.cz/emps
10th EDS 2003 conference delegates
News from the Chapter:
The international event of Department of
Microelectronics in Brno University of
Technology in the collaboration with IMAPS
Czech and Slovak Chapter, this year, was the
“10th EDS 2003” conference. It was held,
September 9 - 10th, in Brno, the second
biggest town of Czech Republic.
The first day was dedicated to an outstanding
technical session with 8 papers presented by
specialists from Japan, Spain, Sweden, Slovakia
and Czech Republic. On the second day, over
30 posters with electronic devices and systems research and education topics were presented. Social evening in the Boby Centrum
hotel was accompanied by Lada Kerndl band.
The picture above shows the delegates.
France:
G
More information? On IMAPS France?
Events? Membership? Please contact:
Florence Vireton
Bureau IMAPS-France
49 rue Lamartine - 78 035 VERSAILLES cedex
Phone : +33 1 39 67 17 73
Fax : +33 1 39 02 71 93
E-mail : imaps.france@imapsfrance.org
www.imapsfrance.org
Germany:
G
More information? On IMAPS Germany?
Events? Membership? Please contact:
www.imaps.de
Nordic:
Business/Trade/Industry News:
G
Aspocomp sells PWB factory
Aspocomp has sold the fixed assets and inventories of its PCB factory in Teuva to Cibo-Print
Oy. Cibo-Print will retain the plant’s 100
employees. Aspocomp is balancing its PWB
capacity between Europe and Asia. Net sales
from its units in Thailand and China sales are
300397_imaps.qxd
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10:08 AM
Page 33
forecast to reach 45% of total group sales this
year, up from 35% last year.
an international reputation in reliability assurance and microsystems integration.
The Teuva factory made up about 6% of the
company’s net sales.
The new department will be managed jointly
with professor Johan Liu from Chalmers as
head of department.The new centre will have
a professor, a lecturer, a research assistant, ten
research fellows and seven Ph.D. students.
With ten persons in the research staff, the 30
persons will constitute a sufficiently large, critical mass. From IVF, Roger Rörgren will be
appointed as deputy manager.
G
Sonion MEMS
At
the
end
of
August
Sonion,
www.sonion.com, officially opened the new
cleanroom in Roskilde, Denmark. A year after
the first cut of sod was taken, the cleanroom is
now ready to assemble 30 million pieces of
the world’s smallest microphone annually.
Sonion is ready to start production and will
ramp up to full-scale production in 2004.
The opening marks not only the culmination
of a decade used to develop their 3mm3 silicon microphone; it also marks microelectromechanical systems (MEMS) as a new, core
competence for Sonion.
The silicon microphone is the first Sonion
product to be targeted at both of the Sonion
business areas.The microphone is initially targeted at the mobile terminal market, but in
time it will also be targeted against the hearing instrument market.
G
IVF and Chalmers reinforce cooperation
in electronics
The Swedish research institute IVF and the
Chalmers University of Technology have just
recently agreed on cooperating and coordinating their respective departments of electronics production. The new center will have
Potential delegates and table-top exhibitors
should contact the secretariat at 4 The Close,
Bracebridge Heath, Lincoln LN4 2PB.
Tel - 01522 575212
Email - office@imaps.org.uk
More details: www.imaps.org.uk
Business/Trade/Industry News:
G
UK:
Meetings Programme:
G
MICROTECH 2004, March 3-4, 2004
The recent IMAPS - UK committee meeting
endorsed the belief that the primary concentration should be placed on the annual
Microtech Conference and Exhibition Event
and confirmed the details:
ERA Technology was established in 1920 and
provides specialist, high value added, technology-based services including design and
development, testing, assessment and expert
advice. It has 300 staff and had a turnover of
£21.3million in the year to December 2002
and is projecting turnover for 2003 is £23million. ERA has net assets as of September 1st,
2003 of £10.8million, including over £5 million in cash.
Venue - The prestigious Moller Centre in
Cambridge
Dates - 3rd and 4th March 2004
Conference Title - Photonics - Packaging and
Interconnection
The subject matter for the conference which
will be application orientated is expected to
be wide ranging and will include papers on
market trends, emerging technology, sensors,
actuators and optical MEMSs.
ERA sold to Chelton
Technology consultancy, ERA Technology, is
being sold to Marlow-based Chelton, a part of
Cobham plc. Chelton is a manufacturer of
communications equipment, antennas, and
microwave components for both military and
commercial applications with manufacturing
facilities in Europe and North America.
G
Radamec Defence Systems sold to Ultra
In a £6m deal Radamec defence Systems has
been sold to defence firm Ultra Electronics.
Radamec absorbed one of the original independent Thick Film producers - Tectonic of
Wokingham some years ago. Sales director
Roger Upton retired a few years ago and sadly
Bob Webb, the hard pressed production manager, died. Bruce Oakman, technical director
operates his own company Sensit at Bramley.
Market Depression should not mean
Mental Depression.
Visit many of the hybrid manufacturing plants
these days and one receives the impression
that there is a period of free wheeling in place
and that hopefully one day the recession will
end and all will be well The risk is that when
better days arrive things have changed and
what was your money spinning skill a few
years ago is no longer required.There appears
to be nevertheless a fair number of predictions flying around and we should be looking
at where the growth is taking place and telling
the manufacturers in these sectors that we
may have solutions to their problems and here
IMAPS could help with the necessary networking. Some examples are intelligent drives
for heating, ventilating and air-conditioning, a
European market for which is predicted at
$315m in 2009. Wireless LAN’s are booming,
the UK growth for connectors to 2007 is 4.2%.
Sensors and MEMS are both enjoying
increased activity, and the National Statistics
Office reported a 3.3% rise in output for UK
companies in the electrical and optical industries between March and April.
Nevertheless not everyone can last out the
imposed fast and one of the recent casualties
was opto firm Terahertz Photonics, which
hoped to thrive as a manufacturer of optical
backplanes. Marconi’s CEO Mike Parton whilst
confirming that Network Operators are starting to forecast increases, his company in spite
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Page 34
of all the drastic blood letting had a fall in sales
of 30% in the first quarter of the year down to
£367m.
The debate on the merits or otherwise of moving manufacture and indeed R & D to the Far
East continues to make headlines and there
appear to be many good reasons other than
SARS for keeping it local. Quality control and
haphazard component purchase are two reasons given.Then there is lead.A recent survey
by ERA Technology concluded that the British
electronics industry had its head in the sand
over the ban on lead-based solders and components with only 3% of UK companies having
developed lead-free products. The proposed
two year study for which partners
are sought by TWI should therefore be of interest.
The
contact
there
is
Norman.stockham@twi.co.uk. The SMART
group are also proactive in this area as of
course is the National Physical Laboratory and
some companies such as Solectron of
Dunfermline are prepared to share their successful experience via Stephen Mainwaring.
Finally we read the mind-boggling fact that five
Scottish universities are working together to
develop computers in an area of 1mm cube.
The medical market is the target so presumably these will be implanted in the body by
some form of deep acupuncture to provide
endless wireless monitoring. But there it is someone has identified a market and is enthusiastically working towards it.
IMAPS Advanced Technology Workshop on
Military, Aerospace, Space & Homeland Security:
Packaging Issues & Applications
March 28 - 30, 2004
Renaissance Harbor Place Hotel - Baltimore, MD
In our current environment where the focus is on military activities
and homeland security, extensive work is being done to advance
the state-of-the-art in high reliability electronics packaging. The technical program will expand on last year’s successful workshop and
will focus on the latest military, aerospace, space and homeland
security electronic devices, systems, and applications, with particular emphasis on design, fabrication, assembly, testing, and materials
selection operations.
Future details at www.imaps.org/military
BCW
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Lower Temp Lead Free
Solder Needed
In the world wide tendency of lead free
soldering application for the packaging of
circuit boards, most Japanese electronics
firms are moving to use lead free solder for
their products. According to statistics nearly
35% of soldering material has been replaced
by a lead free type.
The standard lead free solder in Japan is
Sn-3Ag-0.5Cu, having a melting point of 219
degC, comparing to 183 degC of conventional eutectic 63Sn-37Pb.This composition was
recommended by JEITA (Japan Electronics
and Information Technology Industry
Association). The adoption of the solder is
being accelerated by three related domestic
laws.
In the actual reflow soldering process the
highest temperature on the board would be
235 degC for making sure the components
get good wetting on all the surfaces of the
board. Since some of the electronics components have 220-230 degC of maximum temperature, they may be destroyed at soldering
process. In addition soldering equipment
must have more precise temperature control
than conventional devices.
Under these circumstances new solder
materials having a lower melting point have
been strongly required. JIEP, affiliated organization with IMAPS Japan, has been active in
the development of low temperature lead
free solder since 1998. Several compositions
were proposed and tested extensively at
manufacturers and research institutions. At
present, the majority of users are interested
in Sn-8Zn-3Bi whose melting point is 197
degC. Maximum process temperature can be
lower than 220 degC.This solder would be a
standard low temperature lead free solder
and several companies such as Sony and
Sharp started to adopt it in their products.
Some modifications for the low temperature solder were made in companies.
Panasonic and Harima used Sn-3.5Ag-0.5Bi8In whose temperature is 206 degC, having
better performance for thermally weak components such as in personal computers, even
In is rather expensive substance. Fig. 1 shows
an example of an application for notebook
computer substrate. Fujitsu worked with Sn8Zn- (small amount) Al whose temperature is
198 degC, good for large size substrates
shown in Fig. 2. On the other hand Hitachi
tested Sn-57Bi-1Ag, having a lower melting
point of 137 degC.
Dr. Sei-ichi Denda
IMAPS Japan
Nagano Institute
of Technology
Fig. 1. Main board of personal computer using
Sn-3.5Ag-0.5Bi-8In solder.
There have been reported some noticeable results with Sn-Zn group materials.
Because Zn is a rather active metal some
chemical reaction could take place. In this
connection flux development is important,
which can protect the soldered area after soldering. The necessity of nitrogen furnace to
prevent Zn oxidation, could be eliminated
due to better performance without nitrogen
obtained. Sn-Zn group solder may lose its
stiffness at high temperature-high humidity
reliability test. Bi caused weakness in joint
when lead plating is done on the component
wires. Fig. 3 shows melting temperature distribution of low temp lead free solder for the
reference.
Fig. 2. Large size (225x365mm) substrate using
Sn-8Zn-Al solder.
Fig. 3. Melting point distribution for low temp
lead free solder.
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Visit
Vishay
ElectroFil
in IMAP ms
Booth 2 S
06
At Vishay Electro-Films, innovation for thin-film, high-density interconnects spans all shapes,
sizes, materials, applications and technical areas. We work with you one-on-one to customdesign the optimum solution for your application.
Production Materials
• aluminum oxide
ceramics
• aluminum nitride
ceramics
• quartz
• silicon
• beryllium oxide
Features
• adhesion layers
• resistor layers
• capacitors
• contact layers
• passivation layers
• single- and double-sided
patterned
• vias
• holes
• airbridges
Technical Expertise
• design and mask layout
• photolithography
• thin-film sputtering
• precious metal plating
• wet and reactive ion
etching
• insulation layering
• passivation and postprocessing of substrates
• laser trimming
• laser cutting and drilling
• quality inspection
Applications
• telecommunications
(antennas, base
stations, cable TV)
• medical (pacemakers)
• defense (avionics, radar
systems)
• space (satellites,
microwave circuits)
• industry (measurement,
high-precision
electronics)
Let Vishay Electro-Films show you freedom of
choice. In addition to HDIs, we specialize in
microwave resistors, resistors on quartz, and
back-contact resistors. Send your applications
and technical requirements to:
Vishay Electro-Films
111 Gilbane Street
Warwick, RI 02886
tel: 401.738.9150;
fax: 401.738.4389
e-mail: electro-films@vishay.com
• Enhanced signal routing
• Size integration
• Improved response conditioning
• Low noise
At Vishay Electro-Films,
nothing stops innovation.
To get an inside look at our new facility and
latest technologies, visit:
www.vishay-efi.com
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In
Memoriam
John W. (Jack) Balde
Just as Advancing Microelectronics
was going to press I heard the shocking
and sad news of the passing of Jack
Balde. Jack was one of the great characters of our industry, known by everybody
and with an outstanding reputation. I
had long known Jack by name, but first
met him properly in January 1995 at a
workshop he was running in Cork,
Ireland. Since then our paths crossed on
many occasions, at conferences in many
countries.
I had the privilege of enjoying many
debates with Jack regarding technology,
our industry and our Society. He always
had a powerful, well reasoned viewpoint.
He was also a tireless worker for our
industry and our Society and had in the
last year launched a new series of books
which were being published in conjunction with IMAPS.
At times Jack could be very demanding, but he was also very fair and well balanced. I remember some years ago
receiving critical comments from him
about a presentation I had given. That
made me very concerned the next time I
saw Jack in my audience! Imagine my
relief when during questioning he stood
up and praised my presentation - obviously his earlier criticism had made me
concentrate and get it right.
As a Past President of IEPS, Jack came
to sit on the IMAPS Advisory Council
when IEPS and ISHM merged. Naturally
he was a strong voice on this Council,
with considerable input to the Society’s
discussions.
He will be greatly missed. A fuller tribute will be published in the next issue of
Advancing Microelectronics.
Peter Barnwell
President
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IMAPS New England
Officers 2003/2004
In June, New England’s IMAPS chapter
elected the officers for term 2003-2004 to
the council. While some are new to the
office, others are coming back for another
term. Please join us in welcoming the following individuals as seen left to right in
the photo:
Robert Slack (Geib Refining),Treasurer
Susan Munyon, President
Tom Marinis (Draper Laboratory),
Vice President
Mark Belanger (Ferro-Ceramic
Grinding),
Secretary
NE IMAPS
Chapter Officers - 2003/04
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Osprey Metals Launches
CE Alloys on East Coast
with D-Tech
Osprey Metals, a leading manufacturer of
lightweight, controlled expansion carrier
plates and housings for use in electronics
packaging, has signed an agreement with
manufacturers’ representative D-TecH,
based in Rochester. D-TecH will represent
Osprey to promote the sale of Osprey CE,AlSi and Si-A1 alloys to the military, aerospace
and communications markets in New
England and the mid-Atlantic states. Osprey
( w w w. o s p r e y m e t a l s . c o m ,
www.cealloys.com) is a member company
of
Sandvik
Materials
Technology
(www.smt.sandvik.com) - a worldwide and
leading manufacturer of specialty materials.
Datacon to Demonstrate
Hybrid Die Bonding Solution
at IMAPS 2003
Datacon North America, Inc., a leading
developer and manufacturer of high-precision semiconductor production systems, will
display its 2200 apm+ multi-chip die bonder
in booth 710 at IMAPS 2003, November 16 18 at the Hynes Convention Center in
Boston. The Datacon 2200 apm+ is the ideal
hybrid die bonding solution, providing military, medical, automotive and optoelectronic
users worldwide with flexibility, accuracy
and minimal space requirements. The
Datacon 2200 apm+ offers these advanced
features: Capacity for over 200 - 2 inch waffle packs, Epoxy dispensing of ultra-small
dots for 10 mil die, .007" to 2" die handling
with 7µm@3s placement accuracy, Multiple
vision algorithms and lighting control and
more. Datacon Semiconductor Equipment
GmbH is part of Datacon Technology AG, an
international group of companies that develops and produces high-precision machines
for leading microelectronics companies
worldwide. Datacon North America, Inc., a
subsidiary of Datacon Technology AG located
in Trevose, Pennsylvania, handles marketing,
sales and technical support in the United
States, Canada and Mexico. For more information, contact Dana Baedke at dana.baedke@datacon.at or 215-245-3052.
DuPont Microcircuit Materials
Adds Embedded/Surface
Resistors to its 943 Low Loss
Green Tape™ Material System
DuPont Microcircuit Materials has
enhanced the value of its 943 Low Loss
For further information, contact: Dennis T.
Hanley at dthtech@worldnet.att.net or
508-763-8056.
Panasonic Factory
Automation (PFA) hires
new Business Manager,
Microelectronics Group
Kevin Bagaline, 45, has joined Panasonic
Factory Automation as business manager for
the company’s Microelectronics Division.
Bagaline will be responsible for sales development of PFA’s broad line of microelectronics products including laser, flip chip,
die attach, wire bonder, plasma cleaning,
metrology and micro-machining technologies that provide PFA’s customers with
enhanced manufacturing of semiconduc-
Green Tape™ material system, used extensively in high-frequency applications, by
commercializing screen printable, co-fired
embedded resistors and post-fired surface
resistors. A complete offering of gold, silver,
and mixed-metal material systems is now
available with blendable embedded resistor
compositions having values of 20 W and 200
W per square. Surface resistor compositions
are available with values between 100 W to
100k W per square in decade increments.
Testing indicates minimal dielectric loss up
to 77GHz and additional tests are planned for
higher frequencies. The DuPont 943 Low
Loss Green Tape™ LTCC System provides a
technology option for high frequency applications that enables high-density functionality, excellent reliability and performance, low
power requirements and low cost interconnect packaging. The system has been qualified for military, automotive, optical, and
telecommunications use. For more information about DuPont 943 Green Tape™ materials and LTCC technology, contact DuPont
Microcircuit Materials at 1-800-557-4505 or
visit www.dupont.com/mcm.
DuPont Microcircuit
Materials Announces
Commercially Available Thick
Film Material System for
Aluminum Nitride
DuPont Microcircuit Materials announces
a commercially available system of thick film
materials for use with aluminum nitride
(AlN) substrates. The complete material system allows circuit designers and manufacturers to take advantage of the benefits of AlN
substrates for electronic applications requir-
tors and other microelectronics applications. Additionally, he will provide consulting-type services to existing and potential
customers to assure they have the right
products for their specific needs. Prior to
joining PFA, Bagaline worked for 15 years at
California-based Asymtek where he most
recently served as global account manager.
PFA, a North American source for electronic
assembly equipment, software and technical
support, provides total business systems
solutions for electronic semiconductor and
packaging companies in the global marketplace through one provider. For more information about PFA, call (847) 468-4000 or
visit www.panasonicfa.com.
ing high thermal dissipation and high power
output. The combination of DuPont thick
film materials and an AlN substrate provides
consistent performance and is a cost-effective alternative to beryllium oxide (BeO) or
thin film AlN systems. Customers who use
the complete thick film material system indicate potential cost savings as high as 35 percent over thin film AlN systems. The full line
of thick film materials for AlN includes gold
and silver-based conductors, resistors,
dielectrics, through-hole fills, brazing, and
encapsulant compositions. The thick film
material system for AlN substrates is ideal for
applications that require high power output,
efficient heat dissipation, and reliable performance. For more information about
DuPont thick film material system for AlN
substrates, contact DuPont Microcircuit
Materials at 1-800-557-4505 or visit
www.dupont.com/mcm.
Fancort Industries
Coplanarity Reforming Tool
Will Salvage Fine Pitch
Gullwing SMDs
The Tooling Division of Fancort Industries
has introduced a precision bench tool that
will reform the leads on almost any SMD to
meet Jedec coplanarity of .004". The tool is
designed to form one side of a SMD up to
2.5" long. The operator can reform a typical
SMD in less than 30 seconds and return the
part to the production line for use on a pick
and place machine. The tool, model number
F-1B/1RC, is designed to clamp the leads during reforming to eliminate stress, and can be
easily adjusted for different package sizes
and variations in standoff height. The pack-
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age is mechanically held in place during
reforming to prevent lifting, and an inexpensive insert can be changed to vary the lead
material thickness, shoulder bend dimension
and heel radii. The tool is mounted in a
Fancort 3300 hand press for ease of use and
portability. For additional information,
contact Robert Antonelli at rantonelli@fancort.com.
INSTRON ® Showcases its
High-Precision Microtest
Systems at IMAPS 2003 - Visit
at Booth #722
Instron®, a leading provider of testing
equipment designed to evaluate mechanical
properties of materials and components, will
showcase its model 5848 MicroTester, at
IMAPS 2003, held November 16-20, in
Boston, MA, at booth #722. Designed for testing microelectronic devices, MEMS, photonic
and other small components, the 5848
MicroTester provides precise load and displacement measurement capability combined with excellent cyclic performance.
Applications for Instron’s model 5848
include semiconductor die shear and pull
tests, tensile testing of fine wires, flex testing
of circuit boards and substrates, and peel
tests of thin films and substrates. With a load
capacity of 2 kN, the system provides the
sub-micron position measurement accuracy
and ultra high-precision load and position
control capability required for static testing
of micro-components. It is also designed to
deliver the dynamic performance needed for
cyclic fatigue testing. Instron® is a leading
provider of testing equipment for the material testing and structural testing markets. For
more information, call 800-564-8378 ext.
5390; email info_news@instron.com or visit
www.instron.com/pr.
Micro-Metric, Inc.’s
Automated MicroLine 600
Now Standard with Microsoft
WindowsTM 2000
The automated MicroLine 600 non-contact measurement system from Micro-Metric,
Inc. is now available with Windows 2000
capability. The system provides both depth
and linewidth measurement for semiconductor wafers. MicroLine 600 measures
linewidths of 0.5-40 µm at 100x, and 10-800
µm at 5x. Application programs included
with the MicroLine 600 are written using
Micro-Metric’s powerful Measurement
Control Language (MCL)©. This text-based
language controls all functions of the
MicroLine 600. Program files are easy to read
and allow users to modify existing programs
or create their own programs to control the
system’s operation. Founded in 1979, MicroMetric produces high-accuracy, non-contact
measurement and assembly systems.
Products include automated and manual critical dimension measurement systems, noncontact coordinate measurement systems,
and micro-positioning assembly systems.
For more information, contact Micro-Metric,
Inc. at Tel: 408-452-8505, 800-490-3333;
info@micro-metric.com; or visit www.micrometric.com.
Panasonic Factory
Automation’s (PFA) New Line
of Products Helping Customers
Operate More Efficiently;
Microelectronics Group Offering
One-Stop Approach
Demonstrating a strong commitment
to the semiconductor and packaging industry, Panasonic Factory Automation’s
Microelectronics Division has recently introduced a host of products designed to make
the company a “one-stop” shop for its manufacturing clients. Specifically, PFA now offers
a “Clean Room” that makes it possible to
properly conduct sample testing in an optimal environment. The Clean Room provides
the controls necessary to test samples and
return results within days rather than weeks.
Its temperature control system provides the
necessary stability for laser management and
other precision components that require
high-accuracy management. Although still in
its early stages of use, the Clean Room has
demonstrated the potential for other
machines, including next generation flip-chip bonders, die bonders
and laser scribers.
Panasonic Factory
Automation
Company, a North
A m e r i c a n
source for electronic
assembly
equipment, software and technical
support, provides
total business systems solutions for
e l e c t r o n i c
semiconductor
and
packaging
companies in the
global marketplace
through
one
provider. For more
information, call
(847) 468-4000 or
visit www.panasonicfa.com.
SUSS MicroTec and
AVANEX’s Two-Year
Partnership Comes to Fruition
with First System to Combine
Passive and Active Alignment
SUSS MicroTec launched its new high
accuracy automatic flip chip bonding system
optimized for cost-effective volume production of optoelectronics modules with a bonding and post bonding accuracy of 0.5
micron.The new bonder called TRIAD 05 AP
was developed in cooperation with AVANEX
during a two-year project. Equipped with
one bonding head, it achieves a throughput
of up to 200 units per hour.With the option
of two bonding heads throughput increases
to over 350 units per hour. The TRIAD 05 AP
accepts piece parts with sizes in the range
between 0.1 and 10 mm and with a thickness
up to 30 mm. The newly designed machine
is the world’s first bonding system able to
perform passive alignment as well as active
alignment for fine tuning. SUSS MicroTec is a
leading supplier of production and process
technology for the semi-conductor industry.
More information about SUSS MicroTec and
its products is available from its web site at
www.suss.com.
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At the National Training Center
for Microelectronics NTCµ (pronounced “NTC micro”) , we
understand your needs.We’re
ready to help you and your
employees meet the challenges
of modern manufacturing with
practical “hands-on” training
courses and innovative, customized in-plant educational programs. NTCµ courses, renowned for their clear, concise and
practical presentation, provide you with useful information that
helps you get the job done. Link to NTCµ on page 1 of the
IMAPS Web Site or at http://www.northampton.edu/ntc/
Litron Inc. provides laser Hermetic sealing
contract welding services and sells laser
hermetic sealing systems and is an affiliate
of PTI Industries and the Nitor
Corporation. PTI Industries is a NAD-CAPapproved non-destructive testing facility service the aerospace,
medical, and general machining industries for more than 18
years. Nitor Corporation is a laser marketing facility that holds
certifications with the major aerospace and aircraft engine manufacturers. Nitor also is a major supplier to the medical instrument and device manufacturing industries.
BTU International provides thermal
process solutions for the electronic assembly and semiconductor packaging markets.The equipment consists of: solder
reflow and curing furnaces for PC Board
Assembly; thermal systems used in semiconductor packaging
and sealing, as well as in the processing of multi-chip and ceramic components. BTU also develops custom equipment for specialty applications needing high-temperature and atmospherecontrol such as: brazing, sintering of ceramics and aluminum
alloys, nuclear fuels, and the deposition of precise thin film coatings. Link to BTU on page 1 of the IMAPS Web Site or at
www.btu.com
AMI offers a full spectrum of precision
screen printing equipment for Hybrid
Circuit,Advanced Packaging, and SMT
applications. Models range from entry
level printers through fully integrated, inline automated closed loop systems. In addition to this popular
line of screen printers,AMI manufactures dedicated vision alignment systems, handling and automation systems, in-line conveyor dryers, and printing supplies such as squeegees and cleaning
cloths. Link to AMI on page 1 of the IMAPS Web Site or at
www.ami-presco.com.
The National
Training
Center for
Microelectronics
NTCµ
BTU
Litron
Link to Litron from the IMAPS Industry Guide Homepage
or at www.litron.com
AMI
Meeting Information? Upcoming Tours?
Vendor Nights? Symposia? Get Involved!
CHAPTER
Angel
REGION
South West
Capital
Central Texas
Chicago/Milwaukee
Garden State
Southeast
Southeast
North Central
Northeast
Great Lakes
Indiana
Keystone
New England
NorCal
Northwest
Orange
North Central
North Central
Northeast
Northeast
North West
North West
South West
Phoenix
Rocky Mountain
San Diego
Tri Valley
Tucson
Viking
South West
South West
South West
South West
South West
North Central
CONTACT
Mr. Maurice Lowery
COMPANY
Northrop Grumman
Space Technology
Mr. Keith Sellers
Trace Laboratories - East
Dr. Robert Knipe
Galaxy Microsystems, Inc.
Mr. Kevin P. Ledvina
Hytel Group Inc.
Dr.Alan M. Lyons
Bell Laboratories Lucent Technologies
Mr.Adam Schubring
Visteon Corporation
Mr. Neal F.Thomas
TT electronics
Mr. Lee R. Levine
Kulicke & Soffa Industries, Inc.
Ms. Susan M. Munyon
CMC Wireless Components
Mr. John Zhang
Tyco
Mr. Charles W. Saulsberry Boeing
Mr.William Gaines
Northrop Grumman,
Electronic Systems Space Sys Div.
Mr. Steve W. Greathouse Intel Corp. CH 6-437
Mr. Jim Leonard
University of Colorado at Denver
Mr. Steven J.Adamson
Asymtek
Mr. Gopal R.Vadrevu
Northrop Grumman
Mr. J. P. Bradley
Mr. Martin Nora
Peterson-Nora Sales
TELEPHONE E-MAIL
310-814-1890 maurice.lowery@ngc.com
410-584-9099
512-339-4204
847-683-5455
908-582-6316
ksellers@tracelabs.com
rbknipe@galaxymicrosystems.com
kledvina@hytel.com
aml@lucent.com
313-755-1769
574-206-1228
215-784-6036
978-466-6336
408-624-3044
253-773-6291
626-812-2199
aschubri@visteon.com
nfthomas@prodigy.net
levilr@direcway.com
smunyon@cmcwireless.com
zhangjo@tycoelectronics.com
saulsberrycw@juno.com
william.gaines@NorthropGrumman.com
480-554-5624
303-674-5878
760-930-7274
818-715-3793
520-743-9295
651-351-9040
Steve.W.Greathouse@intel.com
jleonard1@mindspring.com
sadamson@asymtek.com
gopal.vadrevu@ngc.com
Jbradley550@aol.com
MartyNora@comcast.net
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November ‘03 through October ‘05
Begins
Ends
Event
Location
Sponsor
Contact
Email
Event URL
11/16/03
11/20/03 IMAPS 03
Boston, MA
IMAPS
IMAPS
imaps@imaps.org
http://www.imaps2003.org
11/20/03
11/22/03 ATW on MEMS
Packaging
Boston, MA
IMAPS
IMAPS
imaps@imaps.org
http://www.imaps.org/mems/
11/25/03
11/25/03 IMAPS San Diego
Chapter Meeting
San Diego, CA
IMAPS
San Diego
Ken Kuang
ken.kuang@kyocera.com
http://www.imaps.org/
chapters/sandiego.htm
12/5/03
12/5/03
Boxborough,
MA
IMAPS
New England
Harvey Smith
harveys@imapsne.org
http://www.imapsne.org
12/15/03
12/17/03 ATW on Packaging
Copper/Low-K
Semiconductors
San Diego, CA
IMAPS
IMAPS
imaps@imaps.org
callfor/copper2003.htm
1/14/04
1/16/04
Microelectronics
Marketing Research
Council Winter
Meeting
San Diego, CA
IMAPS
IMAPS
imaps@imaps.org
http://www.imaps.org/mmrc.htm
3/28/04
3/30/04
ATW on Military,
Aerospace, Space &
Homeland Security:
Pkg Issues &
Applications
Baltimore, MD
IMAPS
IMAPS
imaps@imaps.org
http://www.imaps.org
4/27/04
4/28/04
IMAPS Ceramics
Conference
Denver, CO
IMAPS
IMAPS
imaps@imaps.org
5/6/04
5/6/04
IMAPS New England
31st Annual
Symposium
& Exhibition
Boxborough,
MA
IMAPS
New England
Harvey Smith
harveys@imapsne.org
http://www.imapsne.org
5/11/04
5/11/04
SoCal 2004
Pasadena, CA
IMAPS Orange
August Villegas
avillegas@leachint.com
5/18/04
5/20/04
IMAPS High Temp
Electronics
Conference
(HiTEC 2004)
Santa Fe, NM
IMAPS
6/3/04
6/3/04
IMAPS Keystone
Symposium
Bethlehem, PA
IMAPS Keystone
6/21/04
6/24/04
Flip Chip 2004
Austin, TX
IMAPS
6/16/04
6/18/04
EMPS 2004
Prague, Czech
Republic
11/16/04
11/18/04 IMAPS 2004
Long Beach, CA IMAPS
9/29/05
10/1/05
Philadelphia, PA
Visit
IMAPS New England
Chapter Annual
Holiday & Awards
Meeting
IMAPS 2005
IMAPS
www.imaps.org
imaps@imaps.org
callfor/hitec2004.htm
http://www.elainc.com/
keystone.htm
IMAPS
imaps@imaps.org
http://www.imapsflipchip.com
sedlaka@feec.vutbr.cz
http://www.imaps.cz/emps
IMAPS
imaps@imaps.org
IMAPS
imaps@imaps.org
for an up-to-date interactive calendar.
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Welcome New IMAPS Members!
July and August 2003
ORGANIZATIONAL
CadQal Development, Inc.
Colt Refining, Inc.
Dynamics Research
Corporation Metrigraphics
EKRA America
Handy & Harman Electronic
Materials Group
Hesse & Knipps, Inc.
Hong Kong Productivity
Council
Innovative Fabrication, Inc.
Intel Corporation
Laser Tools & Technics
Corp.
Micrometrics, Inc.
NAMICS Technologies, Inc.
ANGEL
Fletcher, Sharon
BENELUX
de Vries, Hans
CAPITAL
Herman, David
Underhill, Elijah
CENTRAL TEXAS
Smith, Jerry
CHINA
Law, Siu Lun
Tseng,Walter
FRANCE
Lecarpentier, Gilbert
GARDEN STATE
Kim, Steve
GEORGIA INSTITUTE OF
TECHNOLOGY
Ogawa,Tsuyoshi
METROPOLITAN
Fiore, Stephen
Hwang, Hong-Sik
GERMANY
Burger, Klaus
NEW ENGLAND
Asari,Takuma
Barnum, David
Beardsley, Donald
Bigelow, Mike
Coughlin, Mitch
Euvrard, Eric
Hall, Steven
Langan, Donna
Marshall, Charles
Martin, James
Ohara,Tetsuo
Singh, Raj
Slattery, Patrick
INDIANA
Bartos, Ed
JAPAN
Matsumura,Akiko
Yamabe, Mitsuharu
KEYSTONE
Bitting, Donald
Bubel, Joseph
Collins,Thomas
Gupta,Vikas
Kimbrell, James
Pafford, Margaret
Petucci-Samija, Maria
NO CHAPTER AFFILIATION PHOENIX
SOUTH CENTRAL
Erturk, Hakan
Rodriquez, Luis
Evans, Bob
Lame, Soroosh
NORDIC
Liu, Kai
Xia, Chuan
SAN DIEGO
NORTH TEXAS
Hayashi, Kazuo
Chaney, Brad
TAIWAN
NORTHERN CALIFORNIA
Chou,Anita
Issak, Ghyath
UNIVERSITY OF
Jensen, Richard
ARKANSAS
Wakelin, Suzanne
Manasreh, Omar
NORTHWEST
UNIVERSITY OF
Hodges, Eric
MARYLAND
Nelson, Nicholas
Shahparnia, Shahrooz
NO CHAPTER AFFILIATION
NORTH CENTRAL
Baum,Thomas
First Time Membership Renewals...
Thank You for Your Support!
July and August 2003
We appreciate and know the importance of our members’ continued support of IMAPS and the microelectronics and packaging industries. Our members’
participation has enabled IMAPS to bring leading technical programs, workshops, courses, and symposia into the forefront of the industry and throughout
the world. It is this consistent support that has helped IMAPS achieve its position as the world’s largest electronic packaging society. IMAPS member support increases the value of the society to the microelectronics industry and increases the value of the society to you and your fellow IMAPS members.
Therefore, we have devoted this section to recognizing those individuals who have renewed their support to IMAPS for the first time, as they join us in
advancing and expanding the use of microelectronics through the dissemination of information and the promotion of the values of the technology.
ORGANIZATIONAL
Abbott Furnace Company
MRA Laboratories, Inc.
UOP LLC
BENELUX
Sinaga, Saoer
CALIFORNIA ORANGE
Lin,Yaomin
CAN-AM
Lyn, Rob
CAROLINAS
Oliver, Glenn
CENTRAL TEXAS
Schilling, Glen
CHICAGO/MILWAUKEE
Bedard, Robert
CHINA
Shih, Shao-Ju
GARDEN STATE
Nicoletta, Dino
GERMANY
Mackens, Uwe
Paulasto-Krockel, Mervi
GREAT LAKES
(formerly Michigan)
Russell, Brian
INDIANA
Ma, Ning
Mariner, John
INTERNATIONAL
Foote, Roger
Linder, Christian
Luedtke,Arndt
ISRAEL
Birnbaum, David
JAPAN
Takahashi, Kenji
KEYSTONE
Dornadula, Divya
Gelsick, Mike
METROPOLITAN
Adams, Kathy
Nurmi, Robert
Schake, Jeffrey
NEW ENGLAND
Antalek, John
Bailey, Jennifer
Morrison, Richard
Padrubny, Dzmitry
NORTHERN CALIFORNIA
Wengrow,Adam
SINGAPORE
Xiao, Zhongmin
NORTHWEST
Yuan, Gang
TUCSON
Jha, Sunil
PENN STATE UNIVERSITY
Baker,Amanda
UNIVERSITY OF
KENTUCKY
DeSilva, Niranjali
PHOENIX
Heckman, Jim
NO CHAPTER AFFILIATION Macken, John
NORTH CENTRAL
SAN DIEGO STATE
Haviland, Nick
UNIVERSITY
NORTH TEXAS
Arterberry, John
Hossain, Mohammad
Kushnarev, Boris
Kusama,Tsugiya
UNIVERSITY OF TEXAS
(AUSTIN)
Tsang, Robin
VIKING
Misra, Sanjay
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Ceramic Interconnect Technology:
The Next Generation
& TTabletop
abletop Exhibition
April 27 - 28, 2004
Denver, Colorado
General Chair:
Dr. Samuel J. Horowitz
DuPont Electronic & Communications Technology
samuel.j.horowitz@usa.dupont.com
Sponsored by:
International Microelectronics And Packaging Society (IMAPS)
The Ceramic Interconnect Initiative (CII)
Endorsed by:
The American Ceramics Society (ACerS)
Technical Program Chairs:
Mike Ehlert
National Semiconductor
michael.ehlert@nsc.com
Dr. Duane Dimos
Sandia National Laboratory
dbdimos@sandia.gov
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. The
growth of wireless communications to its current pervasive position in both developed and developing nations and extending from
microwave to millimeter wave continues to create a host of opportunities for which ceramic technology is enabling. At the same
time, demand for bandwidth driven by the Internet and data communications has sparked increased need for optical communication
equipment and many new interconnect and packaging applications for performance at 40 Gb/sec and beyond. Ceramic is uniquely
suited for these applications as well.
Automotive under the hood electronics for engine/transmission control, communications and safety applications continue to
drive the growth of ceramic in automotive applications. In the MEMS, sensor and energy areas, innovative new applications, which
rely on enabling ceramic technology, are moving from the laboratory to commercial status.
Conventional ceramic technologies such as thick film, thin film, plated copper and high temperature cofired ceramic are
being revolutionized and extended by the development of low temperature cofired ceramics, photo patterning and embedded passive
component materials and processes that allow increased circuit density and functionality and improved performance. These
advances are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensor, and
energy.
The conference will once again have a renowned group of speakers representing leading global industrial, academic and
government laboratories presenting up-to-the-minute developments across the spectrum of ceramics applications.
Abstract Cut-off Date: December 5, 2003
Papers are invited on all ceramic subjects including:
· Portable wireless applications including Bluetooth Wireless
Data Communications applications
· Base stations
· Broadband and mm wave
· Military and homeland security applications
· Fiber optic and electro-optic applications
· Automotive applications
· MEMS and energy applications
· Materials
· Integrated passives
· Design, modeling and simulation
· Testing
· Thermal properties
· Assembly
· Mechanical design and reliability issues
· Micro fluidics applications
· Novel applications - new developments
Please submit your 250-300 word abstract electronically by December 5, 2003, using the on-line form at www.imaps.org/
abstracts.htm. If you are having problems with the on-line submittal form, please e-mail Jackki Morris-Joyner at jmorris@imaps.org
or call 305-382-8433.
Future Details on-line at www.imaps.org/ceramics
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IMAPS 2003
Proceedings
Order Your Copy Today!
○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Order Form
Book: $140 member price, $215 non-member price*
CD-ROM: $90 member price, $165 non-member price*
*non-member price includes 1 year IMAPS Membership
(All publications add $7 to ship in US; overseas add $25)
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IMAPS Offers ON-LINE Professional Development Course!
Boss Won’t Let You Travel? Leg Chained To Your Desk? No Problem!
You can obtain quality technical training on a flexible schedule from the privacy of your office or home.
Introduction to Hybrid Microelectronics
Dr. Jerry E. Sergent
Course Overview - Topics include an introduction to hybrid microelectronics; substrates; thick film, thin film, and other metallization
technologies; circuit assembly & packaging; reliability & failure analysis; hybrid facilities; and design procedures.
Who Should Participate - Those people new or peripheral to the hybrid industry, members of electronics design groups (including
management), purchasers of hybrids or electronic components, those who sell hybrid circuits or related equipment and materials, and
those who are using or manufacturing hybrids.
Registration - Registration provides 30 days of access to on-line course. Optional purchase of Dr. Sergent’s book, Handbook to Hybrid
Microelectronics, discounted to $59 when purchased with course registration.
Member Registration
Non-Member Registration
Y $175 (course only)
Y $300 (course & 1 year IMAPS membership)
REGISTER ON-LINE at http://www.imaps.org/pdcol/pdcol.html
or by calling IMAPS at 202-548-4001.
IMAPS * 611 2nd St., NE * Washington, DC 20002 * 202-548-4001 * imaps@imaps.org * www.imaps.org
The popular and informative IMAPS Industry Guide is on-line at
www.imaps.org/indguide
Key it in and check it out....It’s all there!!
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Page 51
The Best of Boston
Connecting the past, present and future.
Boston is
known as
one of the
most
historical,
cultural and
intellectual
centers of
our country.
Boston, more
than any
other
American
city, is where out nation’s history began.
There are many points of historical interest
to visit while in Boson and most can be
explored by foot – giving Boston its name
“America’s Walking City.” Some of the
names carrying a patriotic ring include
Boston Common, The Freedom Trail, Boston
Harbor, Beacon Hill and the famous Faneuil
Hall Marketplace. Boston’s North End is a
treasure trove of significant Revolutionary
War sites. Ben Franklin and Paul Revere
were both prominent North Enders. Sill
standing in the North End are Paul Revere’s
home and the famous Old North Church
whose tower lit the message “one if by land
and two if by sea.”
Boston is
New
England’s
biggest city.
Everyone
knows
something
about this
cosmopolitan
city. The
Boston Tea
Party,
Harvard,
“Cheers.”
But there’s
far more.
Boston feels
very European, and takes great pride in its
history, culture, picturesque cobbled streets
and brownstone buildings. And culture
abounds in Boston as well as history. The
city is home to many famous museums –
The Boston Museum of Fine Arts,The
Isabella Stewart Gardner Museum, and the
museum at the John F. Kennedy Library are
but a few of the many cultural sites that
abound in the greater Boston area. And
then there’s music, music, music. It’s
perhaps the most musical city in the
country, home to the world famous Boston
Pops and the Boston Symphony Orchestra
housed in Symphony Hall within walking
distance from the Hynes and area hotels.
You will
experience
the
beginning
of a
spectacular
New
England fall
when the
daytime
warm
temperatures
slip to crisp
autumn nights. Follow the Freedom Trail
and tread on the same cobblestones that
John Hancock, Ben Franklin, John and Sam
Adams and Paul Revere once walked over
two centuries ago. Visit the decks of the
USS Constitution or visit the gas lit Newbury
Street chic boutiques and cafes just one
block away from the Hynes Convention
Center and Copley Square. From the great
scrod and lobster to the wonderful Italian
cuisine of the charming “North End” to the
quaint Irish pubs, there is an endless choice
of local selections to keep your appetite
satisfied for a lifetime.
Convention
Center is
“The City
Under
Glass.”
Here you
will find an
amazing
array of
shops and
an exciting
variety of
food at some of Boston’s most impressive
restaurants. All in the heart of Boston’s
fashionable Back Bay. Visit the Shops at
Prudential Center at 800 Boylston Street and
experience our city under glass.
If the days full of symposium activities and
Boston’s
local sights
haven’t
tired you
enough,
there’s
plenty of
nightlife.
You can
just sit back
and enjoy
the street entertainment and people watch
at the famous Fanueil Hall and Quincy
Marketplace or enjoy the fun at one of the
neighborhood pubs. There’s a large variety
of jazz clubs and discos to choose from, too.
Conveniently connected to the Hynes
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IMAPS’ Ad Hotline is provided as a courtesy
to our advertisers and readers.Although
every attempt is made to ensure accuracy, the
information contained herein cannot be
guaranteed.
ADVERTISER
CONTACT
TELEPHONE
EMAIL
WEBSITE
PAGE
AMI/Presco
Paul Hary
908-722-7100
phary@ami-presco.com
www.ami-presco.com
6
Bandwidth Semiconductor, LLC
William Glick
603-689-1235
bglick@bandwidthsemi.com
ww.bandwidthsemi.com
28
Datacon North America, Inc.
Dana Baedke
215-245-3050
dana.baedke@datacon.at
www.datacon.at
4
Harrop Industries, Inc.
Paul Timmel
614-231-3621
pjtimmel@harropusa.com
www.harropusa.com
39
IPC
Kim Sterling
847-509-9700
KimSterling@ipc.org
www.goapex.com
Cover 2
Barbara Hamm
858-576-2793
barbara.hamm@kyocera.com
www.kyocera.com/kai
Cover 4
Laser Tech, Inc.
Jerol Peterson
715-483-1636
jpeterson@laser-tech-inc.com
www.laser-tech-inc.com
37
grobertson@mini-systems.com www.mini-systeminc.com
Mini-Systems, Inc.
Glen Robertson
508-695-0203
National Electronic Alloys
Ed Postolowski
201-337-9400
www.nealloys.com/
49
27
OSE Inc.
Jerry Roach
714-964-4859
jerry_roach@ose-usa.com
www.ose-usa.com
34
Probotech, Inc.
C. Edward Poisel
317-849-6197
edpoisel@probotech.com
www.probotech.com
33
SMTA
JoAnn Stromberg
952-920-7682
joann@smta.org
www.smta.org
25
VIA electronic GmbH
Franz Bechtold
+49 36601 81529
f.bechtold@via-electronic.de
www.via-electronic.de
32
Vishay Electro-Films
Bill Cuviello
401-738-9150
www.vishay-efi.com
36
Web Advertiser Hotline (www.imaps.org)
ADVERTISER
CONTACT
EMAIL
ONLINE
Affiliated Manufacturers, Inc.
Paul Hary
sales@ami-presco.com
www.ami-presco.com
BTU International
Betty Twombly
sales@btulcom
www.btu.com
Litron, Inc.
Ron Lalli
rlalli@litron.com
www.litron.com
National Training Center
for Microelectronics
Tom Green
tgreen@northampton.edu
www.northampton.edu/ntc
Who to Call at IMAPS
Member
Relations &
Customer
Service
Information
Services
Administrative
Services
Ann Bell, Manager, Membership & Public Relations, (202) 548-8717, abell@imaps.org, Member Relations, Public
Relations
Douglas Paul, Manager, Corporate Relations & Marketing, (202) 548-8712, dpaul@imaps.org, Corporate Member
Relations,Advertising Sales, Exhibit Sales, Foundation Raising, Sponsorships, Society Marketing
Angela Johnson, Meetings Manager, (202) 548-8716, ajohnson@imaps.org, Meetings Arrangements, Registration,
Hotel Issues
Brian Schieman, Director, Information Technology & E-Business, (202) 548-8715, bschieman@imaps.org,
Web Site Development, Database Development,Technical Support, Network Manager
Rayma Gollopp, Customer Service Specialist, (202) 548-8711, rgollopp@imaps.org, Members Services
Administration, Dues Processing, Membership Invoicing, Foundation Contributions, Data Entry, Mail
Processing,Address Changes,Telephone Support
Jackki Morris-Joyner, Technical Program Manager, (305) 382-8433, jmorris@imaps.org, Technical Program
Development and Coordination, ATWs, PDCs, Calls for Papers, Speaker Communications, Proceedings
Publication, Event Program Activities
Richard Breck, Executive Director, (202) 548-8707, rb1959@aol.com, Strategic Planning, Contracts and
Negotiations, Legal Issues, Policy Development, Intersociety Liaisons, Customer Complaints
Rich Mohn, Operations Manager, (202) 548-8703, rmohn@imaps.org, Financial Management,Accounts Payable,
Accounts Receivable, Human Resources, Employee Benefits, Budget Issues, Business Services, Facilities
Management, Publications Sales
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Adv. Micro., Nov/Dec 2003, Vol. 30 #6 - Complete

Transcription

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