radian - Heatsinks

HS1800 Series
Aluminum Plate Fin BGA Heatsinks
Index
Removable Heatsinks for BGA Chipsets
HS1800 Series 1
INL Series
3
INM-W Series 5
HS2000-60 Series 7
Embedding a copper insert (figure 7) into the
base of a heat sink can effectively increase the
heat spreading and lower the thermal resistance.
Unlike other heatsink companies, Radian is using a precision cold-forging technology to embed
the copper piece into the base, so there is literally no
interface imperfection between the copper insert
and the heat sink. A copper insert heat sink
can be the ideal choice in applications where
the heat source is significantly smaller than the
footprint of the heat sink.
HS2000-80 Series 9
INM-P Series
11
INM-PCU Series 13
Small Round Pin 15
37.5004 Series
16
Pushpin Heatsinks
17
Tailored Design Assistance
CPU Coolers
18
F Series
19
DCDC Series
23
Custom Designs
25
With highly versatile machining (figure 6)
capabilities, Radian provides high precision
heatsinks with complex features, contours,
cut-outs and through-holes. Combined with a
full range of finishing and volume production
capabilities, Radian is your reliable source for
quality, affordable machined heatsinks.
figure 6
Mechanical Outline Drawing
The HS1800 Series of aluminum plate fin BGA
heatsinks are high efficiency cooling products which
are ideal for linear air flow environments.
These devices mount with EZ Snap™ mounting clips
and / or thermal tape to provide optimum cooling
for various package sizes and airflow. These offthe-shelf, high efficiency solutions are easy to
install and require no special board modifications
or complex assemblies.
(See 2nd page for “LW” & “H” dimensional values)
Features:
Heatsink
* Constructed of extruded aluminum AL6063 for optimum heat transfer
Optional
Thermal
Interface
Material
* High efficiency aluminum plate fin design provides low pressure-drop characteristics
K
Optional
EZ-SnapTM
Mounting Clip
LW
* Ideal for linear air flow environments
* Designed specifically for BGAs and other surface mount packages
* Optional EZ-SnapTM mounting clip is constructed of UL94-V0 rated nylon
(2.5mm)
Radian has a strong thermal engineering team
equipped with state-of-the-art CFD software and
figure 7
workstations to assist you throughout the product
development process. Our highly experienced engineers,
who have advanced degrees in thermal engineering, will work with you on thermal analysis,
design optimization, manufacturing method and material selection, and ensure that your
product will have the best performance, manufacturing cost and overall quality.
LW = Length & Width of Heatsink
H = Overall Height of Heatsink
K = Keep-Out Area* (2.5mm)
H
* clearance required for optional EZ Snap Clips
* Use Clip Tool HS8063 to attach or remove heatsink assembly directly to BGA Chip
* Finished with black anodize plating
* Selected clip & thermal pad options are pre-
assembled at the factory
EZ SnapTM Mounting Clip
CLIPS DIRECTLY TO BGA CHIP WITH HS8063 CLIP TOOL
See page 2 for fitting chip heights. Consult factory for unique chip height requirements
Chip Height
Radian Heatsinks
A division of Intricast Co., Inc.
www.radianheatsinks.com
radian
BUY ON-LINE AT:
www.radianstore.com
ISO 9001:2000 Certified
radiansales@radianheatsinks.com
Minimum 0.4mm clearance
of chip above the board
Radian is able to produce functional prototypes for most designs in one to three weeks, at a
modest cost. By providing you with a working model of your design, Radian effectively helps
you resolve design issues before any investments in finalizing system design or hard tooling
are solidified.
Expedient Support & Expertise
2
Note 1: Chip height measurements exclude ball dimensions (0.4mm)
Note 2: Chip must have 0.4mm clearance above the board for clip to adhere properly. Clips for 0.3mm clearance are also available, please contact Radian sales for more details.
Note 3: Maintain keep-out clearance of 2.5mm around chip for clip to adhere properly
tel: (800) 689-2802
Rapid Prototyping
fax: (408) 988-0683
As a division of Intricast Company, Inc., Radian is part of a organization that has serviced
the electronics industry since 1974. After years of acclimating our business to meet your
rapid time-to-market requirements, our experienced customer service department is always
prepared to assist you in solving your next thermal challenge.
Radian Heatsinks
A division of Intricast Co., Inc.
www.radianheatsinks.com
radian
BUY ON-LINE AT:
www.radianstore.com
ISO 9001:2000 Certified
radiansales@radianheatsinks.com
26
Radian Heatsinks
Meet your time to Market goals with our tailored design assistance and Rapid Prototyping. We also offer
complimentary thermal analysis.
21
Custom Capabilities
Radian Heatsinks employs the most suitable combination of manufacturing techniques and pin shapes to achieve
your thermal specifications. We are equipped with a broad ranges of production capabilities, so your design is not
constrained to any single manufacturing process. This flexibility allows us to build the most cost-effective, high
performing thermal solution for your application.
We are capable of many manufacturing processes. Such as thin fin extrusion,
investment casting, die casting, precision forging, skiving, stamping and custom
machining.
figure 1
Our Thin Fin Extrusions (figure 1) provide increased surface areas over
traditional extrusions. With fin thicknesses as low as 0.016”, our extruded
heatsinks are densely finned, providing optimum performance and maximized
surface areas. Traditional extruded heatsinks have an aspect ratio of up to
8:1. Radian has pushed the limits of heatsink extrusions and can now reach
aspect ratios of up to 25:1. Extruded out
of AL6063 Alloy, our heatsinks thermal
conductivity can reach up to 220 W/m-K.
The Skived Fin (figure 2) process combines special cutting tools and a controlled
shaving technique to produce heatsinks from a single block of material, such as
copper or aluminum. The typical result is a thin-finned heatsink, with a dense
population of uniformly shaped and distributed fins. In certain applications, Fin
Skiving can offer cost saving, high-efficiency cooling alternatives to high aspect
ratio extrusions and folded fin assemblies.
Stamped Fin (figure 3 & figure 4) heatsinks are made from
sheets of aluminum or copper, where the metal is stamped into
a particular configuration based on the intended application.
For maximum design flexibility, fins can be stamped into a
broad range of geometries and thicknesses. Optimal for
medium to high volume programs, Stamped Fin Technology
offers an economical approach for producing high efficiency,
lightweight heatsinks in small package sizes.
figure 3
23
25
27
29
31
32.5
figure 2
Heat pipe (figure 4
& figure 5) is a highly
conductive metal tube
that can quickly transfer heat from one point to another. A typical
sintered heat pipe has anti-gravity properties and contains no
moving part. When integrated into a heat sink unit, the heat pipe
can quietly transfer a large amount of heat from the heat
source to a location where metal fins can be
conveniently placed. Radian
has the capabilities
to
design
and
manufacture a variety
figure 4
of high efficiency heat
pipe heat sinks that are
used in telecommunication,
supercomputing, laptop computer and LED lighting applications.
figure 5
Part Number (1)
Length &
Width of
Heatsink
(mm)
Heatsink
Part
Number
HS1800EB
HS1801EB
HS1802EB
HS1803EB
HS1804EB
HS1805EB
HS1806EB
35
HS1807EB
37.5
Optional Tape / Pad (2)
Part
Number
3M8815
-or-
-or-
P0705
T710
P1728
3M8815
-or-
-or-
P1705
T710
P1328
3M8815
-or-
-or-
P1305
T710
P1828
3M8815
-or-
-or-
P1805
T710
P4928
3M8815
-or-
-or-
P4905
T710
P4728
3M8815
-or-
-or-
P4705
T710
P1228
3M8815
8.5
6.7
4.3
3.4
12.7
8.5
5.8
1.5-2.1*
12.7
8.5
4.9
3.0
2.4
K24
1.5-2.1*
12.7
11.3
4.5
2.7
2.1
K43
2.4-3.0*
12.7
14.1
3.8
2.2
1.7
K38
1.5-2.1*
12.7
14.1
3.5
2.1
1.6
P3828
3M8815
-or-
-or-
P3805
T710
1.5-2.1*
1.7-2.3*
2.5-3.1*
12.7
19.8
2.9
3.4-4.0*
3.2-3.8*
4.1-4.7*
P1528
3M8815
K26
1.5-2.1*
3M8815
-or-
-or-
P4005
T710
P2028
3M8815
-or-
-or-
P2005
T710
P1628
3M8815
-or-
-or-
P1605
T710
2.8
K23
4.9-5.5*
P4028
3.6
HS1800 Series
Aluminum Plate Fin
BGA Heatsinks
Passive BGA Cooler Products:
INL Series:
27-37.5mm plate fin (aluminum) ideal
for linear air flow
INM-W Series
19-45mm elliptical fin (aluminum)
ideal for linear airflow and where
multiple heatsinks are utilized
HS2000-60 Series:
21-45mm round pin (aluminum) ideal
for omni directional air flow
12.7
17.0
3.3
1.9
1.7
1.4-2.0*
1.7-2.3*
2.5-3.1*
12.7
22.6
2.4
1.4
3.4-4.0*
3.2-3.8*
4.1-4.7*
K40
0.8-1.4*
1.4-2.0*
2.7-3.3*
K28
1.5-2.1*
1.3
2.6
1.5
1.2
K27
K54
K55
K30
K36
K56
K41
INM-P Series:
27-42.5mm round pin (aluminum)
ideal for omni-directional air flow
INM-PCU Series:
19-42.5mm round pin (copper) ideal
for omni directional air flow
Small Round Pin:
12.7-25.4mm round pin (aluminum)
ideal for omni directional air flow
37.5004 Series:
37.5mm round pin (aluminum or
copper) ideal for omni directional air
flow
Pushpin Heatsinks:
Pushpin heatsinks (aluminum) ideal
for linear air flow
Our experienced engineers and
production specialists are dedicated
to the design and manufacture
of cooling solutions to match our
customers specific thermal issues,
quickly and cost-effectively.
Features of our services include:
12.7
22.6
2.9-3.5*
K31
1.5
HS2000-80 Series:
21-45mm round pin (aluminum) ideal
for omni directional air flow
Custom Design and
Manufacturing Services:
K45
12.7
12.7
25.5
31.1
2.2
2.1
1.3
1.2
1.0
0.9
0.9
*Free engineering consultation
*Complimentary thermal analysis (computational fluid dynamics and design simulation/modeling)
*Wide range of technologies
including: investment casting;
die casting; precision forging; skived fin; extrusions; stamped fin; and custom machining
*Rapid prototyping services to
deliver concept models in as
little as 2-5 business days and working prototypes in 1-3 weeks
Contact Radian Heatsinks to discuss
your specific requirement today.
Notes:
1) Example Part Numbers:
HS1807EBP3805K35
35 x 12.7mm Heatsink with Optional K35 Mounting Clip for 3.2-3.8mm chip heights & T710 Thermally Conductive
HS1800EBK21
21 x 12.7mm Heatsink with Optional K21 Mounting Clip for 1.5-2.1mm chip heights
HS1803EB
27 x 12.7mm Heatsink only
HS1801EBP0728
23 x 12.7mm Heatsink with 3M8815 a thermally conductive adhesive tape
2) Optional thermal interface materials are defined as follows:
T710 - Thermally conductive phase change pad for use with mounting clip (Chomerics Part # T710)
3M8815 - Thermally conductive adhesive tape
3) Mounting clips are constructed of UL94-VO rated nylon material.
4) Thermal data provided are for reference only. Actual cooling performance may vary by application.
5) Contact Radian to discuss unique heatsink, clip and interface requirements.
6) Specifications are subject to change without notice.
* Contact Radian for mounting clips to fit chip heights not displayed above.
tel: (800) 689-2802
25
12.7
K25
K51
K52
K29
K35
K53
HS1811EB
600
LFM
K34
T710
45
400
LFM
-or-
P1505
2.5-3.1*
200
LFM
T710
-or-
42.5
HS1810EB
K22
1.5-2.1*
Weight
(g)
P1205
-or-
K21
Height
(mm)
-or-
HS1808EB
40 HS1809EB
Optional Mounting Clip
Interface
Part
Fits Chip
Material Number (3) Height (mm)
P0728
Thermal Resistance
Theta_SA (C/W)
fax: (408) 988-0683
Radian Heatsinks
A division of Intricast Co., Inc.
www.radianheatsinks.com
radian
BUY ON-LINE AT:
www.radianstore.com
ISO 9001:2000 Certified
radiansales@radianheatsinks.com