Grinding - IIT Bombay
Transcription
Grinding - IIT Bombay
Grinding and Finishing Illegitimi non carborundum ver. 1 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 1 Overview • Processes • Analysis ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 2 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 3 Horizontal Grinding ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 4 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 5 Horizontal grinding Vertical grinding ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 6 Centered grinding Centerless grinding ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 7 Creep Feed Grinding • Full depth and stock is removed with one or two passes at low work speed • Very high forces are generated • High rigidity and power Advantages • Increased accuracy • Efficiency • Improved surface finish • Burr reduction • Reduced stress and fatigue ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 8 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 9 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 10 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 11 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 12 Grinding Wheels ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 13 Grinding Wheels ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 14 Grinding Wheel Information ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 15 Correctly Mounted Wheel ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 16 Grinding Wheel Surface ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 17 Grind Wheel Dressing ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 18 Grinding Wheel Dressing ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 19 Grinding Chips ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 20 Chip formation geometry w l t D q t d V l v ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 21 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Chip geometry • As with rolling contact length, the chip length, l – D = wheel diameter, d = depth of cut l Dd • Material removal rate, MRR – v = workpiece velocity, d = depth of cut, b = width of cut MRR v d b ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 23 Material removal rate • The chips have a triangular cross-section, and ratio (r) of chip thickness (t) to chip width w (w) w r 10 to 20 t t l • So, the average volume per chip 1 1 1 Volchip w t l wtl 2 2 4 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 24 Chips • The number of chips removed per unit time (n), where c = number of cutting edges (grains) per unit area (typ. 0.1 to 10 per mm2, and V = peripheral wheel velocity n V bc ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 25 Combining MRR v d b n Volchip 1 v d b Vbc wtl 4 w r t l Dd 1 vd b V cb r t t Dd 4 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 26 Chip thickness 4v d t V cr Dd 2 or 4v t V cr d D ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 27 Specific grinding energy, u • Consist of chip formation, plowing, and sliding u uchip u plowing usliding ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 28 Total grinding force • Get force from power Power u MRR Fgrinding V u v d b v d b Fgrinding u V ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 29 Total grinding force • From empirical results, as t decreases, the friction component of u increases 1 u t or 1 u K1 t substituting 1 v d b Fgrinding K1 t V ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 30 Total grinding force Substituting for t v d b Fgrinding K1 V 4v d V cr D 1 rearranging d cr v Fgrinding K1 b Dd 4V ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. 31 ME 6222: Manufacturing Processes and Singh/Melkote/Colton Systems Prof. J.S. Colton © GIT 2006 Force on a grain • The force per grain can be calculated Fgrain u Area 1 Fgrain u wt 2 w rt and 1 u K1 t 1 1 Fgrain K1 r t t t 2 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 32 Force on a grain substituting for t, and rearranging K1 4v Fgrain r 2 V cr d D vr d Fgrain K1 V c D ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. 33 ME 6222: Manufacturing Processes and Singh/Melkote/Colton Systems Prof. J.S. Colton © GIT 2006 Grinding temperature • Temperature rise goes with energy delivered per unit area Energy input T K2 area u bl d 1 T K2 K2 K1 d bl t T K1 K2 d 1 4v d Vcr D ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 34 Grinding temperature • Rearranging ∆𝑇 = 3 𝐾1 𝐾2 𝑑 4 𝑉𝑐𝑟 𝐷 4𝑣 • Temperatures can be up to 1600oC, but for a short time. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 35 Grinding – Ex. 1-1 • You are grinding a steel, which has a specific grinding energy (u) of 35 W-s/mm3. • The grinding wheel rotates at 3600 rpm, has a diameter (D) of 150 mm, thickness (b) of 25 mm, and (c) 5 grains per mm2. The motor has a power of 2 kW. • The work piece moves (v) at 1.5 m/min. The chip thickness ratio (r) is 10. • Determine the grinding force and force per grain. • Determine the temperature (K2 is 0.2oK-mm/N). Room temperature is 20oC. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 36 Grinding – Ex. 1-2 • First we need to calculate the depth of cut. We can do this from the power. Power u MRR u v d b 2 W s m min 6 mm 2000 W 35 1.5 d 25 mm 10 3 2 min 60 sec mm m d 91.4 106 m ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 37 Grinding – Ex. 1-3 • Now for the total grinding force v d b Fgrinding u V mm 3 1500 91 . 4 10 mm 25 mm W s min Fgrinding 35 m mm3 3600 rev 150 mm min rev 1000 mm Fgrinding 70.7 N ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 38 Grinding – Ex. 1-4 • Next, the force per grain 1 Fgrain u wt 2 and w rt 1 Fgrain u r t t 2 we need t t 4v V cr mm d 91.4 103 mm min mm grains D 150 mm 3600 150 5 10 min mm2 4 1500 t 1.32 103 mm ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 39 Grinding – Ex. 1-5 • Substituting 1 1 3 2 Fgrain u r t t 35 10 1.32 10 2 2 4 Fgrain 3.05 10 J / mm ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 40 Grinding – Ex. 1-6 • For the temperature, we need K1 and K2. K2 is given, so we need to calculate K1. 1 1 1 1 Fgrain u r t t K1 r t t K1 r t 2 t 2 2 1 3.0510 N K1 10 1.32106 m 2 3 N K1 46.2 10 m 1 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 41 Grinding – Ex. 1-7 • substituting 1 T K2 K1 d t T 0.2 K m N 1 6 46.2 91 . 4 10 m 640K 6 N m 1.32 10 m T Tinitial T 20 640 660C ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 42 Honing and Superfinishing Honing tool used to improve the surface finish of bored or ground holes. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Schematic illustrations of the superfinishing process for a cylindrical part. (a) Cylindrical mircohoning, (b) Centerless microhoning. Lapping (a) Schematic illustration of the lapping process. (b) Production lapping on flat surfaces. (c) Production lapping on cylindrical surfaces. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Polishing Using Magnetic Fields Schematic illustration of polishing of balls and rollers using magnetic fields. (a) Magnetic float polishing of ceramic balls. (b) Magnetic-field-assisted polishing of rollers. Source: R. Komanduri, M. Doc, and M. Fox. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Abrasive-Flow Machining Schematic illustration of abrasive flow machining to deburr a turbine impeller. The arrows indicate movement of the abrasive media. Note the special fixture, which is usually different for each part design. Source: Extrude Hone Corp. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Robotic Deburring A deburring operation on a robot-held die-cast part for an outboard motor housing, using a grinding wheel. Abrasive belts or flexible abrasive radial-wheel brushes can also be used for such operations. Source: Courtesy of Acme Manufacturing Company and Manufacturing Engineering Magazine, Society of Manufacturing Engineers. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Conformal Hydrodynamic Nanopolishing: Case-study Applications Challenges • Most processes can polish only flat surfaces; concave/profiled surfaces • Defence & Nuclear are difficult to superfinish • Concave surface on hard brittle • Electronics materials, such as single crystal • Industrial sapphire can not be finished via form Existing Methods grinding due to process-induced cracks • Diamond Turning • Diamond turning center can be used • Precision Grinding for non ferrous materials but it is a • Lapping super-precision machine-tool (The equipment cost is ~ 20 crores besides • Ion Beam Polishing • Spot Hydrodynamic Polishing the expensive operational cost) • Optics ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 1 Conformal Hydrodynamic Nanopolishing Process and Machine Process Description • • • • Improvement over existing spot hydrodynamic polishing methods Superfinish hard and brittle concave surfaces, specially, sapphire and hardened steels Mitigates existing surface microcracks Polishing action due to elastohydrodynamic film in the slurry submerged rotating conformal contact (silicone ball in the cavitynd being polished) 12st Generation Conformal Hydrodynamic Nanopolishing Machin Delivered to Precison Engineering Division BARC Generation (designed and fabricated in the Machine Tools Lab at IIT Bombay) ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 2 Novelty and Technology Breakthrough • Existing hydrodynamic polishing employs spot polishing unable to polish small cavities (< 6mm in dia) – More than 3 degrees of freedom required to polish the entire cavity effectively – Small actuation system and polishing tool is required • Conformal contact has a rotating soft tool which conforms to the shape of the cavity • Axis of this tool is inclined at 45˚ and the workpiece is rotated inside a slurry filled tank which ensures non-zero relative motion between tool and workpiece at every location in the cavity • The entire cavity can be polished at once which will be much cheaper and faster than programming the tool path • Alternative to expensive Diamond Turning • Can finish wide range of materials ceramics (sapphire, glass) and hardened steels ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 3 Technology Outcomes • • • • • Superfinished surfaces in steels (< 3nm 3D surface roughness) Crack-free surface of < 100 nm 3D surface roughness in single crystal sapphire cavity Process knowhow and machine transferred to Precision Engineering Division, BARC for strategic applications in a nuclear device The superfinished obtained at a fraction of cost of Diamond turning It can also be used by gem polishers which could reduce the health hazard by reducing the dust inhalation and automation is possible Nanometric finish on hardened steel Crack-free superfinished surface on single crystal sapphire cavity ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 4 ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Economics of Grinding and Finishing Operations Increase in the cost of machining and finishing a part as a function of the surface finish required. This is the main reason that the surface finish specified on parts should not be any finer than necessary for the part to function properly. ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton Summary • Overview of processes • Analysis of process • Example problem ME 338: Manufacturing Processes II Instructor: Ramesh Singh; Notes: Profs. Singh/Melkote/Colton 54