New Fab Design Concepts – Facilities Council

Future Semiconductor Fab Discussion
Hsinchu City, Taiwan
September 13, 2011
Terry R. Behrens PE
Michael O’Halloran PE
Contacts:
Terry R. Behrens Terry.Behrens@ch2m.com
Michael O’Halloran Michael.ohalloran@ch2m.com
Agenda
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Introduction to CH2M HILL (formerly known as IDC)
Discussion – What is the Future Fab?
Future Fab Design Drives and Requirements
A “concept” of the Future Fab
Strategy for designing fabs
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CH2M HILL Engineers Inc.
• Prior to 2005 …… IDC was one of the family of CH2M HILL
Companies Ltd.
– IDC focus - non-federal work
• In 2005 CH2M HILL Ltd. bought Lockwood Green and merged all
non-federal engineering entities into one entity, CH2M HILL
Engineers Inc.
• CH2M HILL Inc. does federal engineering
• CH2M HILL Ltd. Also owns other companies doing variously
………….. union / non-union / federal / non-federal / operations /
construction.
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CH2M HILL
Established in 1946 by three engineers and a professor, CH2M HILL operated
from its very beginning on four simple values: take care of clients, deliver great
work, do right by employees, and stay true to our integrity and honesty.
Holly Cornell
James Howland
Burke Hayes
Fred Merryfield
Clair Hill
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Where We Are Today
More than 25,000 employees working in 84 countries around the world.
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Combined Cycle Power Projects
Origin Energy
Darling Downs Project
Queensland, Australia
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EPC Contractor 630 MW combined
cycle project in a 3X1 configuration
Utilizing GE 9E combustion turbines.
The project is in a remote area, about
100 miles west of Brisbane and
required a man camp for construction.
Noise limitations of high importance.
Empire Generating Co, LLC
Empire Project
Rensselaer, New York
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EPC Contractor for a 640 MW
2x1 combined cycle
Sole source open book, closed book
approach
Boring under the Hudson River with a
cooling water intake structure
Miles of transmission, gas
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Golden Ears Bridge
Client: Golden Crossing General Partnership
Location: Vancouver, British Columbia, Canada
Project Scope
 Large, complex
infrastructure project
including 1 kilometer
cable-stay bridge
 Innovative procurement
due to shortage of local
skilled labor
 Design-build-operatefinance delivery method
 Joint venture
partner with major
European firm
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Panama Canal Expansion Program
Client: Panama Canal Authority (ACP)
Location: Republic of Panama
Project Scope
 New locks and navigational channels
for both Pacific and Atlantic entrances
 Widening and deepening of Gatun
Lake, Deepening of Gaillard Cut
 Assist client with management
of contracts and procurements
 Develop, install, and maintain Program
Management Information System
 Provide construction oversight,
including quality, safety, and operability
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London 2012 Olympic and Paralympic Games
Client: Olympic Delivery Authority
Location: London, England
Project Scope
 7-year program
 One of three firms comprising
the consortium, CLM Delivery
Partner
 Providing global engineering,
construction, and program
management expertise
 Transport program that
integrates London’s air, road,
and rail networks
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An Industry Leader
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Program Management
Semiconductors
Manufacturing
Environmental Firms
Pipelines
Sewerage and Solid
Waste
• Site Assessment and
Compliance
• Wastewater Treatment
• Water Supply | Treatment
•
Recognized by “Engineering News Record”
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Discussion – What is the Future Fab?
Design Drivers & Requirements
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Semiconductor technology is evolving ….
more/different technologies
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Various Manufacturers Have Different Technology Needs
Advanced CMOS Logic Manufacturing Technology Capability in 2011
as identified by iSuppli Research
Altis Semiconductor
Dongbu HiTek
Grace Semiconductor
SMIC
UMC
TSMC
Globalfoundries
Seiko Epson
Freescale
Infineon
Sony
Texas Instruments
Renesas (NEC)
IBM
Fujitsu
Toshiba
STMicroelectronics
Intel
Samsung
Dongbu HiTek
Grace Semiconductor
SMIC
UMC
TSMC
Globalfoundries
Seiko Epson
Freescale
Infineon
Sony
Texas Instruments
Renesas (NEC)
IBM
Fujitsu
Toshiba
STMicroelectronics
Intel
Samsung
130
nanometer
90
nanometer
SMIC
UMC
TSMC
Globalfoundries
Infineon
Sony
Texas Instruments
Renesas (NEC)
IBM
Fujitsu
Toshiba
STMicroelectronics
Intel
Samsung
SMIC
UMC
TSMC
Globalfoundries
Renesas (NEC)
IBM
Fujitsu
Toshiba
STMicroelectronics
Intel
Samsung
65
nanometer
45/40
nanometer
32/28
nanometer
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22/20
nanometer
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The point is:
Future Fab is Different to Various Manufacturers
• 300mm conventional CMOS
• 200mm or 300mm non-CMOS technology
• 300mm with provision for EUV
• 300mm with provision for 450 mm
• Provision for 450mm and EUV
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Fab Size – Principal Driver is Technology (example analysis)
Plan for a moving target
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Planning for future 450mm compounds the uncertainty
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Fab Size – 450 mm compatible
(30% increase example analysis)
~36,000
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Large Fab Area Brings Two Primary Issues
(suspend your concern about technology for a moment)
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Capacity of Central Systems
– Impact on distribution scheme
– Impact of volume on structures
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Exiting Issues
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Typical Fab of Late 1990s
~100,000+ ft2 (10,000+ m2)
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Because of Technology Migration
Width Today = Length of Yesterday
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Because of Technology Migration
Width Today = Length of Yesterday
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Because of Technology Migration
Width Today = Length of Yesterday
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Facility Takeaway:
Horizontal Exiting
Multiple Utility “Mains” Feed from Side
Fire wall
Or
Stair Towers
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Technology Roadmaps (independent of diameter)
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Facility Takeaway:
More specialty systems & waste treatment (Hydrogen)
More water
Higher electrical load = More cooling load
Vacuum Thermal Processing tends to use Inert Gas
•More new materials
•More Thermal Processing
•More Single Wafer Processing
•More Vacuum Processing
Expect more of the same going forward!
SOURCE:9/14/2011
IBM
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Likely EUV & 450mm Facility Impacts
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Bigger! (bigger tools, more floor space)
Fab floor loading ~750 lbs/sq ft
Minimum move-in height in sub-fab 9’
AMHS ceiling grid loads increased
Increased ceiling heights, >17’ – 18’ (EUV)
Increased power requirements (EUV)
Potential increase in H2
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16 ft to 18 ft +
Depends on use of Basement & Trenches
~16 ft now
Plan 18ft - Driver:
•larger pipe and duct
•9 ft EUV equipment
•More abatement
•Possible mezzanines for vac. pumps
2ft to 4ft max
Target 2 ½ ft to 1m
>17 ft - 18ft EUV Crane
Current 14ft TwinScan
Key Vertical Dimensions
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Floor Loading
AMHS Load depends on Strategy
•Limit ~0.15 degree slope (2.6%)
•Plan for AMHS in Probe
High load access floor tile
(Now in Photo and Implant)
Structural load 750 lb/ft2
EUV driver
Vibration of 250 is probably OK
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300 mm Tool Move-In Path
2.8m*
(9’ 4”)
6.8m
(22’ 6”)
6.0m
(19’ 9”)
Uncrate
Room
Circa 2003
IDC Recommendations:
• Dimensions shown are minimum
• Increase dimensions so as to improve tool installation
speed and efficiency
• Provide adequate queue before and after uncrate room
2.5m*
(8’ 4”)
Wipe Down
Room
2.5m*
(8’ 4”)
6.0m
(19’ 9”)
Turning
Radius
2.5m*
(8’ 4”)
3.0m
(9’ 10”)
6.8m
(22’ 6”)
* Door Height 2.7m (8’ 10”)
131103 Presentation.ppt
IDC Confidential
Revised Tool Move-In Path
10’ very tight, 12’ better
2.8m*
(9’ 4”)
Lift >10x15, >25,000 lbs
6.8m
(22’ 6”)
6.0m
(19’ 9”)
15’ x 15’
12’
IDC Recommendations:
Uncrate
Room
• Dimensions shown are minimum
• Increase dimensions so as to improve tool installation
speed and efficiency
• Provide adequate queue before and after uncrate room
2.5m*
(8’ 4”)
Wipe Down
Room
2.5m*
(8’ 4”)
6.0m
(19’ 9”)
Turning
Radius
2.5m*
(8’ 4”)
3.0m
(9’ 10”)
6.8m
(22’ 6”)
* Door Height 2.7m (8’ 10”)
ICH2M HILL Confidential
300mm v 450mm AMHS Relative Dimensions
Roughly 1.3x delta
Base data courtesy
Murata Machinery
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300mm v 450mm AMHS Relative load
450mm
SI
300mm
Truss Center Line (m, ft)
Bay Length (m, ft)
Area of Truss Bay (m2, ft2)
Track Hanger Pitch (m, ft)
UTB / STB Hanger Pitch (m, ft)
7.3
61.0
445.9
1.2
0.6
IMP
24.0
200
4800.0
4
2
Case 1 Pitch (m, ft)
Case 2 Pitch (m, ft)
Case 3 Pitch (m, ft)
0.64
1.28
1.92
2.1
4.2
6.3
SI
7.3
61.0
445.9
1.2
0.6
IMP
24.0
200.0
4800.0
4.0
2.0
0.5
0.92
1.26
1.6
3.0
4.1
Peak Weight per line Case 1 (kg, lb)
Peak Weight per line Case 2 (kg, lb)
Peak Weight per line Case 3 (kg, lb)
19,629
19,141
32,553
43,195
42,122
71,634
15,233
14,807
21,573
33,522
32,583
47,473
Dead Weight per line Case 1 (kg, lb)
Dead Weight per line Case 2 (kg, lb)
Dead Weight per line Case 3 (kg, lb)
2,621
8,778
14,935
5,768
19,317
32,866
1,341
6,340
9,510
2,951
13,951
20,927
No Lines Case 1
No Lines Case 2
No Lines Case 3
Full load with vehicle (peak)
2
2
Weight per Area Case 1 (kg/m , lb/ft )
Weight per Area Case 2 (kg/m 2, lb/ft2)
Weight per Area Case 3 (kg/m 2, lb/ft2)
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5
3
na
na
na
14
7
5
na
na
na
ratio
484.20
214.62
219.00
98.99
43.88
44.77
375.76
166.02
145.13
76.82
33.94
29.67
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0.22
0.23
0.34
Base data courtesy
Murata Machinery
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300mm v 450mm AMHS Ceiling Load Analysis
Select AMHS strategy – Stocker Intensive OR Highly Distributed
Model operation ….. Determine Ceiling Load
•Significant difference between strategies
•Little difference between 300mm & 450mm lbs/ft2 (kg/m2) – FOR THE SAME STRATEGY
Truss Center Line (m, ft)
Bay Length (m, ft)
Area of Truss Bay (m2, ft2)
Track Hanger Pitch (m, ft)
UTB / STB Hanger Pitch (m, ft)
SI
7.3
61.0
445.9
1.2
0.6
IMP
24.0
200
4800.0
4
2
Case 1 Pitch (m, ft)
Case 2 Pitch (m, ft)
Case 3 Pitch (m, ft)
0.64
1.28
1.92
2.1
4.2
6.3
SI
7.3
61.0
445.9
1.2
0.6
IMP
24.0
200.0
4800.0
4.0
2.0
0.5
0.92
1.26
1.6
3.0
4.1
Peak Weight per line Case 1 (kg, lb)
Peak Weight per line Case 2 (kg, lb)
Peak Weight per line Case 3 (kg, lb)
19,629
19,141
32,553
43,195
42,122
71,634
15,233
14,807
21,573
33,522
32,583
47,473
Dead Weight per line Case 1 (kg, lb)
Dead Weight per line Case 2 (kg, lb)
Dead Weight per line Case 3 (kg, lb)
2,621
8,778
14,935
5,768
19,317
32,866
1,341
6,340
9,510
2,951
13,951
20,927
No Lines Case 1
No Lines Case 2
No Lines Case 3
Full load with vehicle (peak)
Weight per Area Case 1 (kg/m 2, lb/ft2)
Weight per Area Case 2 (kg/m 2, lb/ft2)
Weight per Area Case 3 (kg/m 2, lb/ft2)
11
5
3
na
na
na
14
7
5
na
na
na
ratio
484.20
214.62
219.00
98.99
43.88
44.77
375.76
166.02
145.13
76.82
33.94
29.67
0.22
0.23
0.34
Base data courtesy
Murata Machinery
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Cleanroom Span
Exiting Strategy with fire wall or stair tower
In Center of fab allows ~300 ft + Span
600 ft fab width
No technical limit to span
•Trade off of structural cost w/ usable tool area
•AMHS people are comfortable with ~200 ft bay length
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Building Construction Technology
will not Restrict the Industry
1,000,000 ft2 Cleanroom
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Other Issues
Airborne Molecular Contamination (AMC)
AMC Contamintation - No Chemical Filtration
AMC Contamintation - With Chemical Filtration on select RAHs
Concentration (ppm)
0
75
150
225
300
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Cleanroom Air Flow Diagram
Outside air
Pre-clean
Chamber
Chem.
Filter
At the FFU is
most expensive
filtration. Should
be avoided
Chem.
Filter
Fan
FFU
Tool
Minienvironment
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Sustainable Opportunities LEED Checklist
Skylight/Daylight
Photovoltaic
Panels
Green Roof
Overhang
Storm Water
Retention
Bio Swale
Pervious
Material
Drought
Tolerant
Landscaping
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CH2M HILL Confidential
Battery Storage for Peak Shaving and Renewable Energy
Stability Control
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Ice Storage System for Peak Power Reduction
CH2M HILL Design for semiconductor manufacturing
Stand by Chillers designed for Low
temperature use
Add :
•2 Heat exchangers
•Ice Storage Tank
•Pumps, piping & controls
Mode of Operation:
•Chillers make ice at non-peak time (night)
•During peak ice cools normal cooling
water system by heat exchanger
•If needed – Low temperature chillers
operate as part of normal cooling water
system
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The Issues related to Energy are too important for
“The Old Way of Thinking” & “Business as Usual”
“Energy is the single most important challenge
facing humanity today.”
Nobel Laureate Rick Smalley, April 2004,
Testimony to U.S. Senate
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Compass Fab of Future
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Future Semiconductor Fab Discussion
Hsinchu City, Taiwan
September 13, 2011
Terry R. Behrens PE
Michael O’Halloran PE
Contacts:
Terry R. Behrens Terry.Behrens@ch2m.com
Michael O’Halloran Michael.ohalloran@ch2m.com
Design Approach
Fast
Flexible
Customer Specific
Rapid Prototyping
Every Facility is Unique
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Every project sits at a different site, with different constraints and
opportunities.
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Every Client has different Objectives and a different starting point
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The models are simple enough to be easily manipulated and changed, but
complex enough to reflect the real challenges of the design problem in
terms of spaces, systems, and equipment.
Laboratory Suites
Office Buildings
Pharmaceutical Facilities
Data Centers
Research Buildings
Nano Research Facilities
From concept to 3D design
& Building Information Modeling