PCB Depaneling Laser System LPKF MicroLine 350Ci

Transcription

PCB Depaneling Laser System LPKF MicroLine 350Ci
PCB Depaneling Laser System
LPKF MicroLine 350Ci
■ Depaneling without mechanical stress
■ Dust free environment
■ Cut intricate shapes
■ More usable space for component placement
■ Superior throughput
Lase
r
cu
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Stress-free cutting and improved productivity:
Introducing laser technology for depaneling
Depaneling of modern HD circuit boards can be frustrating.
Avoiding damaging small, sensitive components, maintaining
the close tolerances required by densely packed boards and
avoiding the pollution caused by mechanical routers are all
part of the challenge.
The LPKF MicroLine 350Ci meets these challenges by
using laser technology for depaneling and routing. Non-contact
cutting with a laser means no mechanical stress on the boards
or components, no debris, and no extra cost for tooling. The
high positioning accuracy of the 350Ci allows for component
placement closer to the edge of a board. The laser beam is
able to cut intricate shapes and also increases the net usable
area on the panels.
Produce more challenging designs
The MicroLine 350Ci will cut intricate shapes without any
mechanical impact on the circuit. PCB designers will enjoy the
liberty to place components closer to the edge of the board or
to utilize more intricate shapes to better fit the form factor of
the final product.
Cutting arbitrary shapes with
High productivity
smallest tool diameters
The superior cutting speed of the MicroLine 350Ci provides
better overall productivity than traditional depaneling methods,
especially with thinner materials.
Superior quality and instant turnaround
Laser cutting is significantly more precise than other depaneling methods. It doesn’t generate any debris or dust that could
affect sensitive electronic components. The system works
straight from CAD data and does not require specific tooling,
so even small quantities can be produced instantly.
Feed Rate (millimeter per sec.)
Maximum Cutting Speed FR4
400
350
300
250
200
150
100
50
0.5
1
Material Thickness (millimeter)
1.5
LPKF MicroLine 350Ci – Integrate Tomorrow’s Technology
in Today’s Production Line
The dual camera system provides instant fiducial recognition on the entire working area
for optimal productivity.
The integrated dust and fume
extraction provides a clean working environment for guaranteed
superior production quality.
The cartridge loading system
accommodates custom holding
fixtures for maximum efficiency.
Compact and easy to integrate
With its small footprint the LPKF MicroLine 350Ci can be
easily integrated into an existing PCB assembly line or used
as a stand-alone system. The software features extensive
laser control functions combined with an easy-to-use GUI for
day-to-day operation.
LPKF has been providing prototyping and production equipment to the electronic industry for almost 30 years. Our systems are designed with superior precision, minimum maintenance requirements and maximum uptime in mind. LPKF
provides a directly employed worldwide service staff supporting
you every step of the way.
The intuitive CAM software is
easy to use and compatible with
all industry standards including
Gerber, ODB++, DXF, Excellon,
HP-GL, and others.
Specifications LPKF MicroLine 350Ci
Working area
17.3" x 12.2" (440 mm x 310 mm); z-axis: 1.2" (30 mm)
Overall accuracy
±20 µm
Laser source
CO2 laser
Laser safety
Class 1
Machine Dimensions (W/H/D)
W 50" (1,264 mm) x H 66" (1,670 mm) x D 80" (2,023 mm)
Weight
approx. 3527 lbs. (1,600 kg)
Facility connections
Power
3 phase 400 V + N + PE, 50/60 Hz, 32 A, power consumption 8 kVA
Chiller
DI water, 2.5 kVA, min. 7 l/min, 23 °C ±1 °C
Fume extraction
150 CFM (250 m3/h)@80” w.c. (20,000 pa), 3 psi (0.2 bar), carbon filtration required
Air
90 psi (6 bar)
Applications
Semiautomatic depanelization of populated
circuit boards.
Materials
FR4 (G10), FR3, FR2, Polyester, Polyimid, PMMA, Polyamid, Prepreg
Maximum material thickness
0.8” (2 mm)
Maximum component height
top side 1.2” (30 mm)
bottom side 0.6” (15 mm)
LPKF Laser & Electronics
28220 SW Boberg Rd.
Wilsonville, OR 97070
USA
Phone (503) 454-4200
Toll-free 1-800-345-LPKF (5753)
info@lpkfusa.com
www.lpkfusa.com
custom designed loading station available
LPKF-Distributor
LPKF AG, 117562-1005-EN
Automated material handling