Barco design rules and PCB classification

Plot
25 September 2013
Who are we?
2
Barco company structure
Four core divisions, five wholly-owned ventures
Entertainment
Digital signage
3
Healthcare
Lighting
Control rooms &
Simulation
LED
ATM software
Defense &
Aerospace
Design services
Barco Presence
AMERICAS
NORTH AMERICA
United States
California
Georgia
Ohio
Oregon
Texas
Canada
SOUTH AMERICA
Argentina
Brazil
Colombia
Mexico
Gray = R&D and/or Manufacturing
Red = Sales office
4
EMEA
Belgium
Denmark
APAC
ASIA
China
France
India
Germany
Japan
Israel
Malaysia
Italy
Singapore
Poland
Russia
South-Korea
Taiwan
Spain
Sweden
Switzerland
Turkey
UAE
United Kingdom
PACIFIC
Australia
Barco Flagship Products
500,000+
25,000+
500,000+
40,000+
10,000+
Medical displays
in the field
Digital projectors
in movie theaters
LED pixels for
U2’s 360° tour
Display cubes
in control rooms
Displays in
air traffic control
5
Barco Technologies
43,000
10 million
unlimited
10 million:1
Lumens for
world’s brightest
cinema projector
Pixels of
grayscale
perfection
Number of
sources with
Barco’s
networked control
rooms concept
Contrast ratio in
Barco’s simulation
projectors
71°C
Our rugged
displays can
withstand
temperatures
this high
10x
More silent than
competition in its
class
Agenda
7

Introduction

Engineering parameters for PBA design

What information is needed to be specified?

Passport

Barco design rules and PBA classification

Barco design rules and PCB classification
Agenda
8

Introduction

Engineering parameters for PBA design

What information is needed to be specified?

Passport

Barco design rules and PBA classification

Barco design rules and PCB classification
Introduction

Due to
Reliability issues of PBA’s in the past
Lack of knowledge of PBA and PCB technologies
Too many iterations in PCB design phase
Too many revisions of the PBA before final production

We need to improve and act up front
In order to capture possible issues at the start of the project
To define the process requirements for the PBA at the EMS
To improve the manufacturability of the board
To collect the capabilities and processes at the EMS and PCB manufacturers in order to
select an appropriate supplier for a certain complexity of the PBA
9
Introduction
 A NPI PBA PCB workgroup has been established




Engineering
Purchase
SQA / QA
Support EDM
 An integration into the existing NPI workflow is set up
 Checklist at each milestone
 Concept
/ Design / Prototyping
/ Industrialization
/ Production
 Preliminary Design Review / Critical Design Review / Formal Qualification Review
 Tools to help Engineering
 Passport Tool
 Via calculator
 How to route full populated BGA
•
•
•
10
Minimum track width
Vias use
How many layers needed?
Agenda
11

Introduction

Engineering parameters for PBA design

What information is needed to be specified?

Passport

Barco design rules and PBA classification

Barco design rules and PCB classification
Engineering parameters for PBA design
 Complexity of the board
–
–
–
Components can lead to higher classes
Trace widths and clearance rules
Incompatible cu-thickness versus track width – clearances to keep in mind!
Track Class
Min track width
Min track width in (BGA) footprint fanout area
Min copper spacing
Min. pad-to-pad & pad-to-via land
(except BGA footprint=min. copper spacing)
Min. routing distance to cu outer layers min
Min. routing distance to cu inner layers min
Maximum Cu thickness (to be etched)
T300
300
300
300
T250
250
250
250
T200
200
200
200
T150
150
150
150
300
350
300
105
250
350
300
70
200
350
300
70
200
350
300
35
• Electro migration and corrosion issues, due to
•
•
•
Voltage
Moisture
Ionic contamination
•
-
Component selection
»
»
Incompatible solder profiles: low temperature components selected ?
Mix of lead finishes?
 Impedance: layer stackup
–
–
–
12
Available thicknesses of laminates
Preliminary calculation of the impendence: no exotic clearances / thicknesses
Definition of plane / signal layers : cu balancing
T125 T125+ T100 T100+
125
125
100
100
125
100
100
80
125
125
100
100
200
300
250
18
200
300
250
18
150
250
200
18
150
250
200
18
T80
80
80
80
125
200
200
12
Engineering parameters for PBA design
 Material selection
–
–
–
CAF resistant requirement
FR4 material: thermal load on the board due to stuffing and during operation
Dimension of the boards: mouse bites position, mechanical restrictions
 Contamination level impact on
–
–
Conformal coating
 other design rules: cleaning, no entrapment of contamination?
 areas, what kind of coating is best for my application?
Low standoff components lead to impossible flux outgassing
 Bill of material complexity
–
–
–
Component choice and impact in the design
What are the possible soldering methods for these components: reflow, wave, selective soldering …
 restrictions: design guidelines ?
But also:
 mechanical stress: location of critical components -> stycast, underfill?
 Component on the board: placement in critical areas, such as height restrictions, vibration issues?
 Testing
–
–
In Circuit Testing: design rules to be met!
Boundary Scan: component selection!
 Environmental application
–
–
13
Thermal cycles: on / off during application
Environmental application: humidity, salty environment, …
Agenda
 Introduction
 Engineering parameters for PBA design
 What information is needed to be specified?
 Passport
 Barco design rules and PBA classification
 Barco design rules and PCB classification
14
What information needs to be specified
 PCB level
–
–
–
–
–
–
–
–
–
Tolerances: drill, board dimension, positioning
Thickness of the board + tolerances
Panel information
Impedance values
Copper thicknesses
Minimum laminate specification: thermal requirements due to PbFree soldering
Finish
Standard references
…
 PBA level
– 100% test coverage needed for this design on by using
 AOI
 X-Ray
 FP, …
– Designed for Dual Wave, Reflow, Selective Soldering, Mini Wave
– Designed for Boundary Scan, In Circuit Test, Functional Test
– Where to fix (stycast) components?
– Which components need underfill (due to mechanical stress)
– Conformal coating: final acceptable contamination level of assembled board to be met
– Labeling information
– Standard references
– …
15
What information needs to be specified
 EMS and PCB manufacturing acceptance levels
– Quality acceptance criteria for Class 2 or Class 3 applications





According IPC 600: for printed boards
According IPC 610 & J-STD-001 : for assembled boards
Accepted repair conditions
Accepted cleaning & cleanliness testing
Accepted contamination level unless otherwise defined
– Quality acceptance criteria for used materials





16
Material selection method
Process selection method
Flux classes (J-STD-004)
– Surface Insulation Resistance (SIR) / electro migration test results
Components
– Component selection method (RoHS / SAC compatibility)
Repair compatibility control method
Oops …

How to design the PBA






What type of components are used
What kind of stuffing is required
What IPC class is requested
How is the PCB being build up?
What are the needed standards to refer to?
….
Check
Check
Check
Check
Check
Check
Check
Check
Check
Check
Check
Check
Check
Check
Check
Technology
BOM
PBA PCB capability
Manufacturability
Design rules
Processes
Testability
Reliability
Cost
EMC
Safety
SI
PI
Mechanical restrictions
…
And, yes … Designed according functional requirements from customer
17
Agenda
 Introduction
 Engineering parameters for PBA design
 What information is needed to be specified?
 Passport
 Barco design rules and PBA classification
 Barco design rules and PCB classification
18
Passport
 Design requirements
– Component selection determines as well the PCB classification as well as the
capabilities to stuff them at the EMS


Can EMS stuff 0201? Are they able to stuff heavy SMD with 0201 at the same time? Is this
possible anyway?
uBGA pitch 0,8mm will need denser routing & smaller via pad then 1mm BGA
– Routing PCB design will define the final complexity of the PCB



Annular ring of vias: Class II or Class III?
Track width and clearances
Mask classes
 Process complexity at EMS and PCB manufacturing
– Processes at EMS and PCB manufacturers available








19
Mix of components can need special stencils (stepped stencil)
Is it possible to glue heavy SMD components before reflow?
Selective wave soldering with pallets ? Selective soldering (fountain) ?
Can Boundary Scan being performed?
Can AOI being performed ?
Can PCB manufacturer handle 80um routing and clearances?
Can PCB manufacturer handle annular ring of 125um?
…
Passport
 Design definitions: Design requirements
 How is the PBA and PCB being buildup & designed ?
 Process requirements towards EMS and PCB manufacturer
 What is needed as process requirement and capability to stuff and manufacturer the board?
OUTPUT
INPUTS: Engineer
Passport
Tool
R&D design
requirements for PBA
Database
•
•
20
Mapping
Supplier
competence matrix
•
List of Barco suppliers,
•
According to the design
requirements
•
List of needed process
availability at supplier
Passport: Example
 PBA Design Requirements
Requirements PBA
PBA Design Options & Attributes
Guideline
PBA Width (Y in mm)
108.5 Width is the lower of the 2 values
PBA Length (X in mm)
332.4 Length is the higher of the 2 values
RoHS compliant
Y
Only Avionics and Life critical devices deviates from this rule
REACH Declaration
Y
Lead-free soldered
Y
IPC Class 2 PBA
Y
Default Class
Y
Mid / High Performance Laminates
PBA build-up (IPC-CM-770)
Top SMD: Reflow + Bottom SMD: Reflow + TH: Selective
BOM build-up (component)
Y
Standard
Leadless IC
Y
Press-fit
Y
Through Hole Component
Y
Testing
ICT
Y
Functional Testing
Y
Boundary Scan
Coating Treatment
Coating Materials
Mechanical Fixation
Specials
BOM build-up (Specials)
21
Proven technology: Chips down to 0402 and/or peripherals down to
0,5mm pitch and/or BGA down to 0,8mm pitch and/or QFN down to
0.5mm pitch and/or LGA down to 0.8mm
Standard components + QFN < 0.5mm pitch and/or LGA < 0.8mm ->
repair issues!
Passport: Example
 PCB Design Requirements
Requirements PCB
PCB Design Options & Attributes
PCB Width (Y in mm)
PCB Lenght (X in mm)
Guideline
108.5
Width is the lower of the 2 values. Check cost wrt panelization, in order to have efficient
panel usage at the PCB manufacturer, no exotic dimensions!
332.4
Lenght is the higher of the 2 values. Check cost wrt panelization, in order to have
efficient panel usage at the PCB manufacturer, no exotic dimensions!
1.6
PCB Thickness (mm)
PCB Thickness Tolerance
IPC Class 2 PCB
Lead-free soldered
High reliability
Controlled Impedance
UL Qualification
Cu foil thickness on outer layers (µm)
Cu thickness inner layers (µm)
Solder Mask
Solder Mask Color
Silkscreen color
PCB complexity
Layer count
Density Track/Clr class
Annular Ring Via Class
10
Y
Y
Y
Y
Y
17
35
Y
Green
White
12
T150
V150
SM75
Solder Mask Class
Specials
V-scoring
Mouse bite
22
Y
Y
Below 1,8mm is the reference, severe restrictions when above (via choice: must have
bigger drill size (more restriction on BGA fanout's!!!), through mounted component ->
length of lead is critical to obtain class 2 or class 3 solder requirements!!)
10% is the standard, 7% used for PCIExpress, 5% increases the cost dramatically and
will reduce manufacturers.
Standard / Mid / High Performance Laminates
Mid / High Performance Laminates. impact on laminate choices: when life time
requirement > 10y at least Mid performance
You still need to take into account impact of laminates for all allowed PCB
manufacturers during SI check!
Standard Cu thickness on outer layers is 18um, deposition of 25um. Clearances and
track width definition increases with Cu thickness due to plating and etching
Standard Cu thickness on outer layers is 35um. Clearances and trackwidth definition
increases with Cu thickness etching
Take Cu Thickness into account: MAXIMUM to be etched away! For T80 -> Cu 12u; For
T100+ till T125 -> Cu 18u; For T150 -> Cu 35u; For T200 and T250 -> Cu 70u; For
T300 -> Cu 105u
Calculate: V???=(Minimum ViaPad in design- Final Drill Dia - 150u)/2; PCB Class 2
requirement: Vxxx-> annular ring needed = xxx, PCB Class 3: Vxxx -> annular ring
needed = xxx + 25um
Manufacturing limits to solder mask definition are related to the mask registration
and/or direct imaging capability, the resolution of solder mask definition process and
the adhesion of small solder mask dams to the PCB surface.
Passport: Example
 Process Requirements for EMS
Process
Level
Logistics: J-STD-001 Class 2 assembly
Required
Logistics: Lead-free soldering
Required
Logistics: RoHS/Reach compatible traceability
Required
Placement: BGA down to 0.8mm pitch
Required
Placement: Chip down to 0402
Required
Placement: Peripheral leaded down to 0.5mm pitch
Required
Placement: Press-fit
Required
Placement: QFN down to 0.5mm pitch - LGA down to 0.8mm
Required
Placement: Through-hole in-line/off-line/manual
Required
Processes: Convective reflow soldering
Required
Processes: Stencil thickness range 125/150
Required
Processes: Through hole
Required
Options
125
150
Selective wave soldering (pallets)
Selective soldering (fountain)
Selective dip soldering
Repair: Area Array components (BGA) >= 0.8mm pitch
Required
Repair: Leadless components (QFN, LGA)
Required
Repair: Passives, small active components,...
Required
Repair: Peripherally leaded components (QFP, SOIC,...)
Required
Testing: AOI
Required
Testing: Boundary Scan
Required
Testing: Functional Test
Required
Testing: ICT
Required
Processes: Local Paste Application
Option
Process
Value
Max PBA Height (mm)
108.5
Max PBA Width (mm)
332.4
Min PBA Height (mm)
108.5
Min PBA Width (mm)
332.4
23
Solder paste jetting
Passport: Example
 Process Requirements for PCB manufacturer
Process
Finish: SnPb HASL
Finish: Pb Free
Level
Not Allowed
Required
Logistics: Cleaning: contamination control
Logistics: Impedance control
Logistics: IPC-601X/IPC-A-600 Class 2 manufacturing
Logistics: PCB moisture control IPC-1601
Logistics: RoHS/Reach compatible traceability
Logistics: UL qualification
Material: IPC-4101 qualified laminates (lead-free)
Required
Required
Required
Required
Required
Required
Required
Material: Solder mask IPC-SM-840 qualified
Via Type: Via back drill
Process
Cu-thicknesses inner layers (laminates)
Cu-thicknesses outer layers (foil)
Density class (annular ring/segment)
Density class (track/clr)
Density class annular via
Max PCB Height (mm)
Max PCB Width (mm)
Max Thickness (mm)
Max. number of layers
Min PCB Height (mm)
Min PCB Width (mm)
Min Thickness (mm)
Silk screen Color
Solder Mask Color
Thickness Tolerance
Required
Option: only for impedance requested
Value
35
17
SM75
T150
V150
108.5
332.4
1.6
12
108.5
332.4
1.6
White
Green
10
24
Options
Lead-free HASL
ENIG NiAu IPC-4552
ImAg IPC-4553
ImSn IPC-4554
OSP
Other
L Laminate
M Laminate
H Laminate
Passport: Example
 EMS Suppliers & PCB manufacturers
PCB / PBA
EMS 1
EMS 2
EMS 3
EMS 4
EMS 5
EMS 6
PCB 1
X
X
PCB 2
X
X
PCB 3
X
PCB 4
X
X
PCB 5
X
X
PCB 6
X
PCB 7
PCB 8
X
X
X
X
All listed EMS & PCB can manufacture the PBA and PCB according available
processes and capabilities
 X: PCB manufacturer is subcontractor of corresponding EMS
25
EMS 7
Agenda
 Introduction
 Engineering parameters for PBA design
 What information is needed to be specified?
 Passport
 Barco design rules and PBA classification
 Barco design rules and PCB classification
26
Barco design rules and PBA classification
Barco PBA manufacturing classification (design rules)
Barco Performance class (Alloys, repair-alloy, flux?)
Barco Technical requirements (processes)
Request & match of these classifications to EMS suppliers (Purchase &
PCB Group)
Better or new parameters for requirements for the PBA
Adapt classification to optimize costs and yield
Component matching PBA
27
Agenda
 Introduction
 Engineering parameters for PBA design
 What information is needed to be specified?
 Passport
 Barco design rules and PBA classification
 Barco design rules and PCB classification
28
Barco design rules and PCB classification
Barco PCB manufacturing classification (design rules)
Barco Laminate Performance class (material)
Barco Technical requirements (process)
Request & match of these classifications to EMS suppliers (Purchase &
PCB Group)
EMS responsible and accountable for PCB
Reduced list of suppliers per PCB (Correct AML
Cost indication for different Barco classes
Adapt Barco classification to optimize cost
(best cost for same class)
(*) AML= Approved Manufacturer List
29
(*))
Questions?
30
Thank you!
31
EDM Event 04 October 2013
www.youtube.com/BarcoTV
www.twitter.com/Barco
www.facebook.com/Barco