TechSearch International, Inc.

The New Markets for SiP
E. Jan Vardaman
President
TechSearch International, Inc.
www.techsearchinc.com
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System-in-Package Overview
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The success of SiP is the realization of the MCM and MCP dream
– At every MCM conference someone would say “What we need is a product
driver”
– The product driver is finally here and it is wireless communications
– The format today is the mobile phone
– Ten years from now the format with be something different, but it will have some
of the basic communication features of the mobile phone, the iPod, etc.
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The lesson we have learned: It is not technology push, but market pull that
determines the successful introduction of new technologies
– SiP is a great example
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Is 3D integration the future for SiP?
– Rao Tummala of Georgia Tech calls this SOP
– Wafer-to-wafer stacking of different technologies?
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Apple’s iPod Nano
Source: Adapted from Impress Corporation
Source: Apple Computer Inc.
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iPod Nano contains SDRAM, processor, memory controller, switching regulator, power
management IC, etc. packaged in CSPs.
CSPs are underfilled
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Agenda
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Definition of SiP
– SiP has many different meanings
– Stacked die packages, multichip packages, stacked packages, etc.
– SiP vs. SoC is not the question
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Drivers for SiP
– Greater functionality in a smaller area is the driver for consumer and portable
products
– High performance is the main driver for computers, telecommunications, and
military/aerospace
– Some applications such as medical driven by both
– Applications, such as network systems, driven by the need to decrease
motherboard layer counts and complexity
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Examples of SiP
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Mobile phones
Consumer product such as camcorders and cameras
Military
High performance SiP applications such as computers and network systems
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What is System-in-Package?
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SiP is a functional system or subsystem assembled into a single package
– Contains one or more die
– More than just memory die, contains logic
– Typically combined with other components such as passives, filters, antennas,
and/or mechanical parts
– Components are mounted together on a substrate to create a customized, highly
integrated product for a specific application
– Die may be stacked, but stacking is not required
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SiPs may utilize a combination of advanced packaging including
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Bare die (wire bond or flip chip)
Wafer level packages
Pre-packaged die such as CSP
Stacked packages
Stacked die
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Why SiPs?
Source: Renesas Technology
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System-in-Package Applications
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Mobile phones
MP3 players
Digital still cameras
Digital camcorders
Personal digital assistants
Laptop computers
Mid-range consumer products
Automotive electronics
Medical electronics
Industrial applications
Defense electronics
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Major Applications for SiPs
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Applications include portable consumer products such as
digital camcorders and cameras
– Sony’s DCR-IP220 (logic and SRAM)
– Sony’s Cyber-Shot digital camera (logic/flash and logic
SDRAM)
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Mobile phone are the volume driver
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Logic and memory combo
Digital baseband section
Transceiver section
RF section
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SiP Configurations
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Stacked die inside CSP (thinnest solution)
Package-on-Package (PoP)
Package-in-Package (PiP) or stacked module package
Planar constructions
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Stacked Die CSP
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Thinnest solution
Die are typically thinned and stacked inside the package
Package contains two or more die
Semiconductor maker or subcontractor packages die
Wire bond is most common, increasing use of flip chip
Substrate is typically flex circuit or laminate
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TI’s SiP
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TI’s processor and SDRAM stacked in package
TI’s digital baseband and SRAM stacked die package found in
Nokia’s 6225 CDMA phone
Package also found in Nokia’s N-Gage GSM platform
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palmOne’s Tungsten‘ T3
Source: palmOne.
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Package-on-Package
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Individual packages are stacked on top of each other
– Separate package for logic
– Separate package for memory
Infrastructure developments were required
Standardization of pin-out footprints for the top stacked
package was necessary
Required development of package stacking equipment
IC package subcontractor or board level assembly service
provider does stacking of packages
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Amkor’s PoP
Source: Amkor
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Intel’s Folded Stacked Configurations
Source: Intel
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Intel’s SiP in Motorola’s E680 Tri-band phone
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Folded flex technology has been adopted in Motorola’s E680 Triband phone
Folded flex uses two-metal layer tape
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Package-in-Package (PiP)
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Two or more packages assembled together and overmolded so
end result is a single package that interconnects to the product
board
Also called a stacked module package by Qualcomm
Typically more expensive than stacked die package, but allows for
flexibility in configuration of the memory
Allows memory to be fully tested before assembly
Done by IC package subcontractor
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Package-in-Package Structure
Source: STATSChipPAC.
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Package-in-Package
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PiP in production in systems by Qualcomm
Subcontractors include STATSChipPAC and Amkor
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Stacked Module Package (SMP)
Source: Qualcomm.
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Internal Stacking Module (ISM)
Source: Qualcomm
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SIP Engine Package Comparison
Source: Qualcomm
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Skyworks SiP
Source: Skyworks
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SyChip’s SiP
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SyChip’s Module is A WLAN IEEE 802.11g Embedded Module for Mobile
Phones, PDAs, Media Devices and Gaming Terminals
True Plug-and-Play
– All software included
– User does not need RF design capability
– Incorporates WiFi, VoIP, Bluetooth
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Production Version used in PDAs
– Small footprint 12.6 x 15.8 mm with 1.7mm height
– Includes Baseband/MAC processor, VCO, PA, RF-Transceiver, Balun, EEPROM,
Clock Oscillator, T/R Switch, Bandpass filter and SW Driver
– Packaged in QFN-like structure
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New version targeted for Mobile Phones
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Small footprint 10 x 10 mm with 1.0mm height
Includes all components and software
Devices are flip chip mounted
Substrate includes integrated passives
Packaged as CSP mounted on substrate with solder balls
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SyChip’s SiP in QFN-like Structure
Source: SyChip
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SyChip’s SiP IPD
Source: SyChip
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Medical Applications for SiP
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Applications
– Pacemakers, defibrillators, and other implantable devices
– Portable defibrillators
– Wireless communications inside the implantable (Zarlink has RF
transceiver designed to link implantable to base station)
– X-ray detectors for nuclear medicine and ultrasound equipment
(Philips expected to use SiP, thin film with integrated passives)
– Smart pills (capsule endoscopy)
– Hearing aids
MSE’s example
– MSE test module 11mm x 11mm x 1.5mm with 169 solder balls on a
0.8mm pitch
– Includes stacked die (ASIC processor/controller and SRAM)
– Substrate is a BT-resin, 4-layer
Zarlink’s example
– Based on technology developed from Telecom SiP
– Mixed IC technology (SiGe, CMOS)
– Provides better performance (shorter interconnect lengths)
– Small size 1-inch x 1-inch SMT package
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Cisco’s SiP Concept
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PCBs for network systems have increased in layer count from 16 to 26
layers from 1999 to 2004
– Number of nets per board has grown from 5,000 to 13,000
– Typical board power increase from 170 W to 450 W per card
– IC wiring density advancing at a rate of 22% per year, doubling
every 3 years
– Number of tracks per layer on PCB increases only 7% per year,
doubling only after 10 years
– Non uniform scaling drives PCB layer count increase
SiP can drive the complexity from the printed circuit board into the
module
– Smaller footprint of high-end wiring
– Potential for reduction in system boards through reduced layer
counts
Demonstrator module with 3 signal layers (10 total), no terminations
– Module size of 72 mm x 55 mm
– ASIC bare die plus 8 memory
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Cisco’s SiP
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Conclusions
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Drivers for SiPs
– Greater functionality in a smaller area for consumer and portable products
– High performance solution where custom solutions are affordable
– SiPs will enable layer count reduction in system boards
Different configurations are used
– Planar with no die stacking
– Stacked die inside the package
– Package stacking
Growth of SiP is anticipated in many applications
– Mobile phones for the highest volumes
– Portable products such as digital cameras and camcorders feature a variety
of package configurations
– Computers
– Telecommunications and network systems
– Medical
– Industrial applications and home appliances
– Automotive
– Military/aerospace
© 2006 TechSearch International, Inc.