NXP Semiconductors

NXP Semiconductors
Secure Connections for a Smarter World
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Plot workgroup meeting
June 26, 2014
Secure Connections for a Smarter World
Connected Car
Cyber Security
Portable & Wearable
Internet of Things
NXP Semiconductors
The electronics industry is being driven by four mega trends that are helping shape our society:
Energy Efficiency, Connected Devices, Security and Health. Connecting to these trends and enabling
Secure Connections for a Smarter World, NXP Semiconductors (NASDAQ: NXPI) creates solutions for
the Connected Car, Cyber Security, Portable & Wearable and the Internet of Things.
Through our innovations, customers across a wide variety of industries – including automotive, security,
connected devices, lighting, industrial and infrastructure – are able to differentiate their products
through features, cost of ownership and/or time-to-market. With operations in more than 25 countries,
NXP posted revenue of $4.82 billion in 2013. Additional information can be found on www.nxp.com
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Strong innovation track record
Our innovations are used in a wide range of applications (1/2)
Automotive
Identification
Consumer
Computing
In-vehicle networking
Secure identity
TV
Tablet PCs
Car access & immobilizers
Secure transactions
Note-/Netbooks
Car entertainment
Tagging & authentication
Satellite, Cable, Terrestrial
and IP set-top boxes
Satellite outdoor units
Power supplies
Solid State Lighting
Telematics
Desktops
Monitors and peripherals
Speed & Angular Sensors
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Strong innovation track record
Our innovations are used in a wide range of applications (2/2)
Wireless infra
Wireless base stations
Lighting
Industrial
Mobile
Smart grid
Mobile devices
Point-to-point
Lighting drivers
(CFL, LED)
White goods
Portable power supplies
CATV infrastructure
Lighting networks
Broadcasting
Home / building
automation
Personal health
Backlighting
Chargers
Power supplies
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NXP Quality Lab Infrastructure
lab locations
Manchester
RQC Nijmegen
Hamburg
Caen
Gratkorn
Tokyo
RQC Kaohsiung
Hong Kong/Guandong
RQC Bangkok
Cabuyao
Singapore
Seremban
NXP Development Location
NXP Manufacturing Location
Labs provide Quality Services to NXP Businesses & Operations
Higher level competences & capabilities are available in the Regional Quality Centers.
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Manager RQC
Leon Sintnicolaas
Q&R Development, Capex
Reliability Competence
Nebojsa Jankovic
Rene Rongen
Project Management
Capacity Management
Ronald Schravendeel
Ton Pörteners
RQC Kaohsiung
RQC Nijmegen
RQC Bangkok
Sharon Chen
Peter Vullings
Keith Sarault
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Manager RQC Nijmegen
Peter Vullings
HR
Quality Systems
Stijn Bonnes
Leon Winters
F&A
Secretary Support
Linda Lengowski
Ingrid Haefkens
Reliability
Process & Material Analysis
Failure Analysis
FA S&C
Group leader
PMA CPA & SPA
Group leader
REL A&I
Group leader
Johan Knol
Leon van Nimwegen
Jan Wijers
FA A&M
Group leader
PMA PME
Group leader
REL PSI / ESD
Group leader
Bas Bongers
Peter Vullings
Ronald Minkhorst
FA TSG
Group leader
Marcel vd Straaten
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RQC Four Pillars
Failure Analysis
Process- and Material Analysis
Reliability
Problem Solving and Problem Prevention
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RQC Nijmegen Failure Analysis and Silicon Debug
Analysis of design and manufacturing problems. Options for design modification.
Hamamatsu Phemos-1000 PEM
EFA – Electrical Failure Analysis Techniques
Fault localization using tester and various analysis techniques
EFA Techniques:
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Electrical testing
Electron-Beam testing (E-beam)
Agilent 93000 Electrical tester
Photo-emission Microscopy (PEM)
Optical Beam Induced Resistance Change (OBIRCH)
Time Resolved photon Emission (TRE)
Resistive Interconnect Localization (RIL)
Soft Defect Localization (SDL)
Laser Assisted Device Alteration (LADA)
Semicaps SOM-3000 RIL / SDL / LADA
Magnetic Current Imaging
Charge Contrast in FIB/SEM
TRE - Emiscope
Liquid Crystal diagnostics
Microprobing
Nano-probing in SEM/FIB chamber
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RQC Nijmegen Failure Analysis and Silicon Debug
Analysis of design and manufacturing problems. Options for design modification.
NSC PS103S
Chemical Decap
PFA - Physical Failure Analysis Techniques
Physical FA-techniques
– Dual-beam Focused-Ion-Beam(FIB) for x-section and
circuit modification
– Parallel Electron Energy Loss Spectroscopy (PEELS)
– Hi-resolution Scanning Electron Microscopy (SEM)
– Hi-resolution Transmission Electron Microscopy (TEM)
– Scanning/Energy Filtering TEM (S/EF-TEM)
– Energy Dispersive X-Ray spectroscopy (EDX)
– Scanning Acoustical Microscopy (SCAT)
– (Confocal) optical microscopy
– Hi-resolution 3D X-Ray
Tecnai F-30 TEM
Hamamatsu C9107
Backside Polishing
FEI Vectra Vision &
FIB200/800/835 FIB
for x-sections and
front & backside
circuit modification
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RQC Nijmegen Process- and Materials Analysis
Chemical- and Physical Analysis capabilties and competences for fast root
cause analysis and prevention of quality problems.
IonTOF ToF-SIMS
Applications
Device substrate characterization and crystal defect analysis
Composition analysis of devices, chemicals and materials
Contamination analysis; surfaces, chemicals, materials
Chemical and Physical Analysis Techniques
– SEM/EDX, TEM/EDX, AFM and FTIR; composition of devices/solids
– XTT/XRT, SIRD, µPCD and preferential etch for substrate
characterization and analysis of crystal defects
– ICP-OES, GFAAS , (VPD)-ICP-MS and ToF-SIMS for analysis of
metallic (trace) contamination in solids and liquids
– IC for analysis of anionic contamination in solids and liquids
– GC-MS, HPLC, FTIR, TOC and ToF-SIMS for characterization of
organics and analysis of organic contamination
– Auger spectroscopy
HP - HPLC
VPD - ICPMS
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RQC - Reliability
Reliability test Equipment:
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Operation open air
Operation chamber
Humidity biased (THB/HAST)
Humidity unbiased (Precon/UHAST)
Thermo mechanical (TMCL)
Mechanical testing (Drop/Vibr,)
Thermal test (LTSL/HTSL)
Electrical robustness test (AMR/ESD)
Analyses (SCAT)
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