Organization Chart (July 2016)

Transcription

Organizational Chart
China
Europe
Japan
Korea
North America
Taiwan
Last updated: July 6, 2016
Global Technical Committee
and
TC Chapters
Locale
Global
technical committee
China
Europe
N orth
Taiwan
America
Japan
Korea
EH&S
TCC
WG
TCC
Facilities
TCC
TCC
TCC
TCC
Gases
TCC
TCC
CFG
TCC
Liquid Chemicals
TCC
TCC
CFG
TCC
FPD Materials & Components
TCC
TCC
TCC
TCC
FPD Metrology
TCC
TCC
TCC
TCC
MEMS / NEMS
TCC
Legend:
TCC — the Locale has a TC Chapter of the global technical committee.
CFG — the Locale has a TC Chapter Formation Group, as defined in PM 6.5, of the global technical committee.
Note 1: An underlined Locale has an RSC and may also be referred as a Region (e.g., Europe Region ).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
Locale
Global
technical committee
China
Europe
Traceability
Japan
Korea
TCC
N orth
Taiwan
America
TCC
Information & Control
TCC
TCC
Metrics
TCC
TCC
TCC
Physical Interfaces & Carriers
TCC
TCC
TCC
Automation Technology
TCC
TCC
TCC
TCC
TCC
TCC
TCC
TCC
Photovoltaic
PV Materials
TCC
TCC
TCC
TCC
TCC
Legend:
Note 1: An underlined Locale has ab RSC and may also be referred as a Region (e.g., Europe Region ).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (indicated in red rectangles).
Locale
Global
technical committee
China
Europe
Micropatterning
(Microlithography*)
Japan
Korea
N orth
Taiwan
America
TCC
TCC
Silicon Wafer
TCC
TCC
TCC
Compound Semiconductor
Materials
TCC
TCC
TCC
HB-LED
TCC
CFG
WG
3DS-IC
TCC
Assembly & Packaging
(Packaging**)
TCC
Automated Test Equipment
(Test***)
TCC
TCC
TCC
TCC
TCC
Legend:
Note 1: An underlined Locale has an RSC and may also be referred as a Region (e.g., Europe Region ).
Note 2: Some TC Chapters of different global technical committees jointly hold a meeting (red rectangles).
* In NA, Micropatterning is traditionally called Microlithography.
** In Japan, Assembly & Packaging is traditionally called Packaging.
*** In Japan, Automated Test Equipment is traditionally called Test.
Regional Standards Committee (RSC)
Organizations
SEMI Europe RSC Organization
Co-chairs: Bert Planting - ASML, Werner Bergholz – International Standards Consulting
Vice-chair: Frank Petzold - Trustsec
Europe Chapter of Automation
Technology Global Technical Committee
C: Christian Hoffmann - PEER Group
Europe Chapter of Compound Semiconductor
Materials Global Technical Committee
C: Arnd Weber - SiCrystal
Europe Chapter of Gases Global
Technical Committee
C: Jean-Marie Collard - Solvay Chemicals
C: Gordon Ferrier – Gordon F Consulting
Europe Chapter of Liquid Chemicals
C: Gordon Ferrier – Gordon F Consulting
Europe Chapter of Information & Control
C: Alfred Honold - InReCon
C: Frank Petzold - Trustsec
Europe Chapter of Metrics Global Technical
Committee
C: Lothar Pfitzner - FhG IISB
Europe Chapter of Physical Interfaces &
Carriers Global Technical Committee
Europe Chapter of PV Materials Global
Technical Committee
C: Peter Wagner - Consultant
C: Huber Aulich - Solar Valley
Europe Chapter of Silicon Wafer Global
Technical Committee
C: Werner Bergholz – International Standards
Consulting
C: Fritz Passek - Siltronic
SEMI Japan RSC Organization
Co-Chair: Kenji Yamagata - Daifuku, Naoyuki Kawai - The University of Tokyo
Vice Chair: Supika Mashiro - TEL
Japan Chapter of 3DS-IC Global
Technical Committee
C: Masahiro Tsuriya -iNEMI
C: Haruo Shimamoto - AIST
Japan Chapter of Automation
C: Terry Asakawa -TEL
C: Naoki Ito - Mitsubishi Electric
C: Makoto Ishikawa - Nisshinbo Mechatronics
Japan Chapter of FPD Metrology Global
Technical Committee
C: Ryoichi Watanabe - Japan Display
C: Akira Kawaguchi - Otsuka Electronics
Japan Chapter of Information & Control
C: Takayuki Nishimura - SCREEN Semiconductor
Solutions
C: Mitsuhiro Matsuda - Hitachi Kokusai Electric
Japan Chapter of PV Global
Technical Committee
C: Kazuhiko Kashima – Kashima
Engineering
C: Masaaki Yamamichi - AIST
Japan Chapter of PV Materials
C: Takashi Ishihara - Mitsubishi Electric
Engineering
C: Tetsuo Fukuda - AIST
Special Groups
Reporting to the JRSC
Standardization Process
Improvement (SPI)
L: Supika Mahiro -TEL
FPD Coordination Group
Japan Chapter of Compound Semiconductor
C: Masayoshi Obara - Shin-Etsu Handotai
Japan Chapter of Environmental Health
& Safety Global Technical Committee
C: Supika Mashiro - TEL
C: Hidetoshi Sakura - Intel
C: Moray Crawford - Hatsuta Seisakusho
Japan Chapter of Gases & Facilities
Technical Committee
Japan Chapter of Liquid Chemicals
C: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN Semiconductor
Solutions
Japan Chapter of Metrics
C: Toshio Murakami – Murakami
Corporation
Japan Chapter of Micropatterning
C: Hiromichi Enami - Hitachi High-Technologies
C: Isao Suzuki - MKS Japan
C: Morihisa Hoga - Dainippon Printing
Japan Chapter of FPD Materials &
Components Global Technical Committee
Japan Chapter of Assembly &
Packaging Global Technical Committee
C: Tadahiro Furukawa - Yamagata University
C: Yoshihiko Shibahara - FUJIFILM
C: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
Japan Chapter of Physical Interfaces &
C: Tsuyoshi Nagashima - Miraial
C: Tsutomu Okabe - TDK
C: Kenji Yamagata - DAIFUKU
Japan Chapter of Silicon Wafer
C: Naoyuki Kawai - The University of Tokyo
C: Tetsuya Nakai - SUMCO
Japan Chapter of Traceability
C: Yoichi Iga - Freelance
C: Hirokazu Tsunobuchi - Keyence
L: Yoshitada Nogami - SK
Electronics
L: Makoto Yamamoto - Muratec
SEMI North America (NA) RSC Organization - NA Locale
Co-Chairs: Steve Lewis – LPCimineli & Chris Evanston – Salus Engineering
Vice-Chairs: Brian Rubow – Cimetrix
NA Chapter of 3DS-IC Global
Technical Committee
C: Richard Allen - NIST
C: Sesh Ramaswami - Applied Materials
C: Chris Moore - BayTech-Resor
NA Chapter of Automated Test
Equipment Global Technical Committee
C: Ajay Khoche - Khoche Consulting
NA Chapter of Compound Semiconductor
C: Russ Kremer - Freiberger Compound Materials
C: James Oliver - Northrop Grumman
NA Chapter of Environmental Health &
Safety Global Technical Committee
C: Chris Evanston - Salus Engineering
C: Sean Larsen - Lam Research
C: Bert Planting - ASML
NA Chapter of Facilities Global
Technical Committee
C: Steve Lewis - LPCiminelli
NA Chapter of Gases
C: Mohamed Saleem - Fujikin
NA Chapter of HB-LED Global
Technical Committee
C: Iain Black - Philips
C: Mike Feng - Silian
NA Chapter of Information & Control
C: Jack Ghiselli - Ghiselli Consulting
C: Brian Rubow - Cimetrix
C: Lance Rist - RistTex
NA Chapter of Liquid Chemicals
C: Frank Flowers - PeroxyChem
NA Chapter of MEMS/NEMS
C: Win Baylies - BayTech-Resor
C: Steve Martell - Sonoscan
NA Chapter of Metrics Global
Technical Committee
C: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
NA Chapter of Microlithography
C: Wes Erck - Wes Erck & Associates
C: Bryan Barnes - NIST
NA Chapter of Photovoltaic
C: James Moyne - University of
Michigan
NA Chapter of PV Materials
C: Lori Nye
C: Hugh Gotts - Air Liquide
NA Chapter of Physical Interfaces &
C: Matt Fuller - Entegris
C: Stefan Radloff - Intel
NA Chapter of Silicon Wafer
C: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein
NA Chapter of Traceability
C: Yaw Obeng - NIST
NA RSC Technical Architect
Board
Michigan
C: Yaw Obeng - NIST
SEMI North America RSC Organization – China Locale
China Chapter of PV Global
Technical Committee
C: Guangchun Zhang CanadianSolar
C: Jun Liu - China Electronics
Standardization Institute
China Chapter of HB-LED
C: Yong Ji - Guizhou Haotian
Optoelectronics Technology
C: Weizhi Cai - San an
Optoelectronic
SEMI North America RSC Organization – Korea Locale
Korea HB-LED CFG
L: HyeongSoo Park - SEMES
L: Jong Hyeob Baek - KOPTI
Korea Chapter of FPD Materials &
Components Technical Committee
C: JongSeo Lee - Samsung Display
C: II-Ho (William) Kim - Light
Measurement Solution
Korea Chapter of FPD Metrology
C: JongSeo Lee - Samsung Display
Korea Chapter of Global Facilities
Technical Committee
C: Kwang Sun Kim - KUT
Korea Chapter of Information &
Control Global Technical Committee
C: Hyungsu Kim - Doople
C: Chul Hong Ahn - SK hynix
C: Gun Woo Lee - Lam Research
SEMI North America RSC Organization – Taiwan Locale
Taiwan Chapter of 3DS-IC
C: Wendy Chen - King Yuan
Electronics
C: Chien-Chung Lin – ITRI
C: Roger Hwang - ASE
Taiwan Chapter of EHS Global
Technical Committee
C:Shuh-Woei Yu - SAHTECH
C: Fang-Ming Hsu - TSMC
Taiwan Chapter of Flat Panel Display
C: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu - TDMDA
Taiwan Chapter of Information and
C:Robert Chien - TSMC
Taiwan Chapter of Photovoltaic
C : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolar
C : Ray Sung - UL Taiwan
ISC Taiwan Advisor
Tzeng-Yow Lin - CMS/ITRI
Organization of Each TC Chapter
3DS-IC Global Technical Committee
NA TC Chapter of 3DS-IC
C: Richard Allen - NIST
C: Sesh Ramaswami - Applied
Materials
3DS-IC Bonded Wafer
Stack TF
L: Richard Allen - NIST
Taiwan TC Chapter of 3DS-IC
C: Chien-Chung Lin - ITRI
C: Wendy Chen - King Yuan
Electronics
C: Roger Hwang - ASE
C: Masahiro Tsuriya -iNEMI
C: Haruo Shimamoto - AIST
Steering Group
Testing TF
L: Ming-Chin Tsai - KYEC
L: Li-Heng Lee - ITRI
3DS-IC Inspection and
Metrology TF
L: Victor Vartanian SEMATECH
L: David Read - NIST
JA TC Chapter of 3DS-IC
Middle End Process TF
L: Arthur Chen - NTUST
L: PJ Tzeng - ITRI
L: Jerry Yang - SEMATECH
L: Yoshihiro Tomita - Intel
L: Masahiro Tsuriya – iNEMI
L: Eiji Yoshino – Hitachi High
Technologies
Assembly & Packaging Global Technical Committee
Japan TC Chapter of Assembly &
Packaging Technical Committee
C: Kazunori Kato - AiT
C: Masahiro Tsuriya - iNEMI
JA 450 mm ATDP TF
Fiducial Mark
Interoperability TF
L: Akihito Kawai - Disco
L: Sumio Masuchi - Disco
L: Sumio Masuchi - Disco
5 Year Review TF
Thin Chip Handling TF
L: Hideki Suzuki - Shin-Etsu
Polymer
L: Haruo Shimamoto - AIST
L: Masahiro Tsuriya - iNEMI
L: Kazunori Kato - AiT
Automation Technology Global Technical Committee
Europe TC Chapter of Automation
C: Christian Hoffman - PEER Group
Global Equipment Interface
Specification (EIS) TF
L: Carsten Born - VITRONIC GmbH
PV Wafer Traceability TF
L: TBD
= Global Task Force
Japan TC Chapter of Automation
C: Makoto Ishikawa - Nisshinbo Mechatronics
C: Naoki Ito - Mitsubishi Electric
C: Terry Asakawa - TEL
Global Equipment Interface
Specification (EIS) TF
L: Makoto Ishikawa - Nisshinbo
Mechatronics
Automated Test Equipment Global Technical Committee
NA TC Chapter of Automated Test
Equipment Technical Committee
C: Ajay Khoche - Khoche Consulting
Standard Test Data
Format (STDF) TF
L: Ajay Khoche - Khoche
Consulting
Test Cell Communcations
TF
L: Len Van Eck - LTXCredence
L: Mark Roos - Roos
Instruments
Compound Semiconductor Materials (CSM)
Europe TC Chapter of CSM
C: Arnd Weber - SiCrystal
Contactless Resistivity
and Mobility Mapping TF
L: Wolfgang Jantz - Semimap
Japan TC Chapter of CSM
C: Masayoshi Obara - Shin-Etsu
Handotai
C: open
NA TC Chapter of CSM Global
Technical Committee
C: Russ Kremer - Freiberger
Compound Materials
C: James Oliver - Northrop
Grumman
GaN TF
International SiC TF
L: Taizo Hoshino - Nippon Steel
& Sumikin Materials
L: Judy Kronwasser - NOVASiC
Silicon Carbide TF
Sapphire Substrate TF
L: Open
SiC TF
L: Arnd Weber - SiCrystal
L: Toshiro Kotaki - Namiki
Precision Jewel
5 Year Review TF
L: TBD
Global 200 mm GaAs
Wafer Specification TF
L: TBD
= Global Task Force
Environmental, Health & Safety (EHS)
Japan TC Chapter of EHS
C: Supika Mashiro - TEL
C: Hidetoshi Sakura – Independent
C: Moray Crawford - Hatsuta
Seisakusho
Taiwan TC Chapter of EHS
C: Shuh-Wei Yu - SAHTECH
C: Fang-Ming Hsu - TSMC
EHS TC Chapter
Advisor
Roger Wu - UMC
FPD Safety Subcommittee
FPD System Safety TF
L: Naokatsu Nishiguchi
- SCREEN Semiconductor
Solutions
GHG Emission
Characterization TF
L: George Hoshi - TEL
L: C. C. Huang - SAHTECH
Global S23 Revision TF
L: George Hoshi - TEL
Gas and Chemical Safety
TF
L: Benny Chen - AUO
L: Heng-Li Sue - SAHTECH
L: Moony Lee - UMC
Seismic Protection
TF
L: Naokatsu Nishiguchi SCREEN Semiconductor
Solutions
Environmental
Sustainability TF
L: Tony C. H. Lu - ITRI
L: C Y Huang - TSMC
STEP Planning WG
L: Kenji Sugihara - Panasonic
SDRCM (S Documents REG-PG-SM
Conformance Maintenance) TF
L: Supika Mashiro - TEL
PV Safety
TF
L: Eddie Wu - Nexpower
Seismic TF
L: K. C. Tsai - NCREE
L: J. S. Hwang - NCREE
L: D. W. Sun - TSMC
= Global Task Force
LED Safety
TF
L: Eric Lin - Epistar
Equipment Safety TF
L: Benny Chen - AUO
L: Juo Cho - AUO
L: Alice Lin – CMO
L: Colin Shen – Mxic
L: C.C. Huang – SAHTECH
L: Eddie Wu – Nexpw
L: Eric Lin - Epistar
Environmental, Health & Safety Global Technical Committee
NA TC Chapter of EHS Global
Technical Committee
C: Chris Evanston - Salus Engineering
C: Sean Larsen - Lam Research
C: Bert Planting - ASML
Manufacturing Equipment Safety
Subcommittee
S6 Revision TF
L: John Visty - Salus
Engineering
L: Glenn Holbrook - TUV SUD
S10 Revision TF
L: Eric Sklar - Safety Guru
L: Mark Fessler - Tokyo
Electron
C: Cliff Greenberg - Nikon Precision
C: Andrew Giles - ESTEC
C: Lauren Crane - KLA-Tencor
S22 Revision TF
L: Chris Evanston - Salus
Engineering
L: Sean Larsen - Lam Research
Lifting Equipment TF
Ergonomics TF
L: Ron Macklin - Macklin &
Associates
L: Paul Schwab - Texas
Instruments
Seismic Liaison TF
L: Lauren Crane – Tokyo
Electron
Energetic Materials EHS
TF
L: Steve Trammell - EORM
L: Andy McIntyre – BSI Group
Control of Hazardous
Energy (CoHE) Task Force
L: Andrew Giles - ESTEC
L: Mark Fessler - Tokyo
Electron
Associates
Fire Protection TF
L: Matt Wyman - Koetter Fire
Device Removal Shipment
TF
S2 Ladders & Steps TF
Associates
L: Carl Wong - AKT
L: Lindy Austin - Salus
Engineering
S2 Interlock Reliability TF
S2 Chemical Exposure TF
L: Bert Planting - ASML
L: Tom Pilz - Pilz GmbH
Engineering
S2 Non-Ionizing Radiation
TF
Engineering
Global S23 TF
L: Lauren Crane - KLA-Tencor
= Global Task Force
Facilities Global Technical Committee
Japan TC Chapter of Facilities
Korea TC Chapter of Facilities
C: Hiromichi Enami - Hitachi High
Technologies
C: Kwang Sun Kim - KUT
NA TC Chapter of Facilities
C: Steve Lewis - LPCiminelli
F51 Revision TF
F1 Revision TF
L: Shuji Moriya - TEL
Yamanashi
L: Yoshifumi Machii - Fujikin
Equipment Cleanness TF
L: Dalia Vernikovsky - Applied
Seals North America
L: TBD
Building Information Modeling (BIM) for
Semiconductor Capital Equipment TF
L: Ben Bruce - Applied Materials
FPD Metrology Global Technical Committee
Japan TC Chapter of FPD Metrology
C: Ryoichi Watanabe - Japan Display
C: Akira Kawaguchi - Otsuka Electronics
Korea TC Chapter of FPD Metrology
C: JongSeo Lee - Samsung
Display
C: Tzeng-Yow Lin - CMS/ITRI
C: Jia-Ming Liu - TDMDA
Flexible Display TF
D31 Revision TF
L: Keizo Ochi - Konica Minolta
Taiwan TC Chapter of FPD Metrology
Perceptual Viewing Angle
TF
L: Myongyoung Lee - LG
Electronics
L: Sheng-Po Wang – ITRI
L: Scott Tu – AUO
Transparent Display TF
Perceptual Image Quality
TF
L: Jongho Chong - Samsung
Display
Transparent Display TF
L:JongSeo Lee - Samsung
Display
L: Pei-Li Sun – NTUST
FPD Materials & Components Global Technical Committee
Japan TC Chapter of FPD Materials &
Components Global Technical Committee
C: Tadahiro Furukawa - Yamagata University
C: Yoshihiko Shibahara - Fujifilm
Flexible Display TF
L: Haruhiko Itoh - Teijin
L: Tadahiro Furukawa Yamagata University
FPD Mask TF
L: Kazuya Shiojiri - SK
Electronics
L: Hirofumi Ihara - HOYA
FPD Color Filter TF
L: Tadahiro Furukawa Yamagata University
Polarizing Film TF
L: Toshihito Otsuka - Sanritz
L: Yoshihiko Shibahara Fujifilm
L: Motoshige Tatsumi - Nitto
Denko
Korea TC Chapter of FPD Materials
& Component Technical Committee
C: JongSeo Lee - Samsung
Display
Gases Global Technical Committee
Europe TC Chapter of Gases
C: Jean-Marie Collard - Solvay
Chemicals
C: Gordon Ferrier - Gordon F
Consulting
Japan TC Chapter of Gases
C: Hiromichi Enami - Hitachi High
Technologies
Korea Gas & Liquid Chemicals
CFG
C: Mohamed Saleem - Fujikin
L: TBD
Filters & Purifiers TF
Gas Panel Test Method TF
NA TC Chapter of Gases
L: Mohamed Saleem - Fujikin
Materials of Construction
Gas Delivery Systems TF
L: Bill Kiikvee - AP TECH
L: Shuji Moriya - TEL
Yamanashi
5 Year Review TF
Heater Jacket TF
L: David Colquhoun - BriskHeat
Pressure Measurement TF
L: Joyce Chen - UCT
L: Jeff Christian - WIKA
Live Gas Flow Rate TF
L: Moriya Shuji - TEL Yamanashi
L: Shimizu Tetsuo - Horiba STEC
L: Ishihara Seiji - Flow Techno
Service
Mass Flow Controller TF
L: Mohamed Saleem - Fujikin
Gases Specification TF
L: Open
Surface Mount Sandwich
Component Dimensions TF
L: Matt Milburn - UCT
HB-LED Global Technical Committee
China TC Chapter of HB-LED
C: Yong Ji - Guizhou Haotian
C: Weizhi Cai - San an
Optoelectronic
Korea HB-LED CFG
NA TC Chapter of HB-LED
L: HyeongSoo Park - SEMES
L: Jong Hyeob Baek - KOPTI
C: Iain Black - Philips
C: Mike Feng - Silian
Single Crystal Sapphire TF
L: Yong Ji - Guizhou Haotian
L: Xinhong Yang - AURORA
Sapphire Single Crystal Ingot
TF
L: Hongo Zuo – AURORA
Patterned Sapphire
Substrate (PSS) TF
HB-LED Wafer TF
L: Win Bayles - BayTech-Resor
L: Win Bayles - BayTech-Resor
HB-LED Equipment
Communication Interfaces TF
L: Brian Rubow - Cimetrix
GaN based LED Epitaxial Wafer
TF
L: Jiangobo Wang – HC
SEMITEK
Sapphire Single Crystal
Orientation Task Force
L: Songbin Zhao - DDXDF
HB-LED Impurities and Defects
in Sapphire Wafers TF
L: Luke Glinski - GT Advanced
Technologies
HB-LED Source Materials
TF
L: Paul Ahn – Veeco
L: H.B. Joo -Aixtron
L: Sungjin Jun - LG Innotek
L: Deok-gil - Samsung
Electronics
HB-LED Assembly TF
L: Paul Reid - Kulicke & Soffa
HB-LED Equipment
Automation Interfaces TF
L: Daniel Babbs - Brooks
Automation
L: Jeff Felipe - Entegris
Test Methods TF
L: Peter Wagner - Self
Information & Control Global Technical Committee
Europe TC Chapter of Information &
Korea TC Chapter of Information &
Japan TC Chapter of Information &
C: Takayuki Nishimura - SCREEN
Semiconductor Solutions
C: Mitsuhiro Matsuda - Hitachi Kokusai
Electric
Adviser: Mitch Sakamoto - Consultant
TA
Hiroshi Kondo - Murata
Machinery
Tadashi Mochizuki - TEL
Process Control Systems
TF
L: Martin Schellenberger - FhG
IISB
Equipment Information
System Security TF
L: Mitch Sakamoto - Consultant
Japan I&CC Maintenance
TF
C: Hyungsu Kim - Doople
C: Chul Hong Ahn - SK hynix
C: Gun Woo Lee - Lam Research
GEM300 TF
L: Jong Sub Shim - ASM
L: Chang Yul Cho - SEMES
L: Byoung Min Im - TEL Korea
L: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
DDA TF
L: Hyungsu Kim - Doople
Fiducial Mark
Interoperability TF
L: Mitsuhiro Matsuda - Hitachi
Kokusai Electric
GEM300 TF
L: Yoshihisa Takasaki SCREEN Semiconductor
Solutions
L: Yuko Toyoshima - Hitachi
High-Technologies
Information & Control Global Technical Committee
NA TC Chapter of Information &
C: Brian Rubow - Cimetrix
C: Jack Ghiselli - Ghiselli Consulting
C: Lance Rist - RistTex
Taiwan TC Chapter of Information &
C: Robert Chien - TSMC
GEM 300 TF
Diagnostic Data
Acquisition (DDA) TF
L: Gino Crispieri - Consultant
Energy Saving Equipment
Communication TF
L: Mike Czerniak - Edwards
Vacuum
Sensor Bus TF
L : Robin Liao - TSMC
Michigan
Equipment Information
TF
Process Control System
Architecture (PCS) TF
L : Robin Liao - TSMC
L: James Moyne - University of
Michigan
L: Chris Maloney - Intel
Backend Factory Integration
TF
GEM300 TF
L: Ivan Chen - TSMC
Liquid Chemicals Global Technical Committee
Europe TC Chapter of Liquid Chemicals
C: Gordon Ferrier - Tiger Optics
Japan TC Chapter of Liquid Chemicals
C: Hiroshi Tomita - Toshiba
C: Hiroyuki Araki - SCREEN Semiconductor
Solutions
Korea Gas & Liquids
Chemicals CFG
L: TBD
NA TC Chapter of Liquid Chemicals
Liquid Filter TF
Permeation Tubes for Trace
Moisture Calibration TF
L: Jean-Marie Collard - Solvay
Chemicals
L: Jim Mc Kinley - KIN-TEK
L: Takuya Nagafuchi - Nihon
Entegris
L: Takehito Mizuno - Nihon Pall
Liquid Chemicals
Subcommittee
Precursor Specifications
TF
L: Paul Williams - SAFC Hitech
C: open
Liquid-Borne Particle
Counter TF
L: Kaoru Kondo - RION
L: Kazutoshi Kato - PMS
Liquid Chemical Distribution
Subcommittee
Analytical Methods TF
L: Frank Flowers - PeroxyChem
High Purity Liquid
Assemblies & Systems TF
L: David Kandiyeli - Mega Fluid
Systems
L: Koh Murai - Mega Fluid
Systems
Diaphragm Valve TF
Solvents in Advanced
Processes TF
L: TBD
L: Shigeru Ohsugi - CKD
L: Kimihito Sasao - Advance
Electric
Welding Fitting TF
L: Kimihito Sasao - Advance
Electric
L: Takashi Hasegawa - KITZ
SCT
SEMI F40 Rewrite TF
Determining Roughness
of Polymer Surfaces TF
UPW Filter Performance
TF
L: Slava Libman - Air Liquide
Ultrapure Liquid
Evaluation Study Group
L: Kaoru Kondo - Rion
L: Hiroshi Sugawara - Organo
L: Don Hadder Jr. - Intel
L: Gunter Moeller - Arkema
Group
SEMI IX Resin TF
High Polymer Materials &
Compnents TF
L: James Henry - Arkema
Group
L: Ian Francisco - Lam
Research
SEMI F63 Rewrite TF
MEMS/NEMS Global Technical Committee
NA TC Chapter of MEMS/NEMS
C: Steve Martell - Sonoscan
Packaging TF
L: Steve Martell - Sonoscan
Wafer Bond TF
L: Win Baylies - BayTech-Resor
International MEMS
Terminology TF
L: Steven Martell - Sonoscan
Material Characterization
TF
Microfluidics TF
L: Mark Tondra - Diagnostic
Biosensors
Reliability TF
L: Open
MEMS Substrate TF
L: Chris Moore–BayTech-Resor
= Global Task Force
Metrics Global Technical Committee
Europe TC Chapter of Metrics
C: Lothar Pfitzner - FhG IISB
NA TC Chapter of Metrics
Japan TC Chapter of Metrics
C: David Bouldin - Fab Consulting
C: Mark Frankfurth - Cymer
TE: Carolyn Busing - Self
TE: Chona Shumate - Cymer
TA: Greg Francis - Cymer
C: Toshio Murakami - Murakami
Corporation
Int'l Environmental
Contamination Control TF
L: Mikio Furukawa - Shin-Etsu
Polymer
Cycle Time Metrics TF
L: Kenichiro Mukai - Applied
Materials Japan
Metrics Education & Adoption
(MEA) Subc (inactive)
ESD/ESC TF
C: TBD
L: Toshio Murakami Murakumi Corporation
EMC Study Group
L: Koji Ochi - Noise Laboratory
ESD/ESC TF (inactive)
L: Arnold Steinman - Electronics
Workshop
L: Chuck McClain – Micron
EMC TF
L: Vladimir Kraz - BestESD
Technical Services
L: Mark Frankfurth - Cymer
Equipment RAMP Metrics
TF
L: David Busing - Consultant
L: Steven Meyer - Intel
= Global Task Force
Equipment Training &
Documentation TF
L: Mark Cohran - Intel
L: Malthi Venkat - Nikon Precision
Factory Level Productivity
Metrics TF (inactive)
L: Ron Billings - Georgia Tech/
FABQ
L: Jim Irwin - I/C Irwin Consulting
Equipment Cost of
Ownership TF (inactive)
L: David Jimenez - WWK
L: David Bouldin - Fab Consulting
Micropatterning Global Technical Committee
Japan TC Chapter of Micropatterning
C: Morihisa Hoga - Dainippon Printing
Mask Data Format for
Mask Tools TF
L: Toshio Suzuki - Dainippon
Printing
5 Year Review TF
L: Morihisa Hoga - Dainippon
Printing
NA TC Chapter of Microlithography
C: Wes Erck - Wes Erck &
Associates
C: Bryan Barnes - NIST
Data Path TF
L: Thomas Grebinski - OASIS
Tooling
L: Kurt Wampler - ASML
Extreme Ultraviolet (EUV)
Mask TF
L: David Chan - SEMATECH
Extreme Ultraviolet (EUV)
Fiducial Mark TF
L: Long He - SEMATECH
Photovoltaic Global Technical Committee
China TC Chapter of PV
C: Guangchun Zhang CanadianSolar
C: Jun Liu - China Electronics
Standardization Institute
Crystalline Silicon Solar Cell TF
L: Dengyuan Song - YingLi Energy
L: Rulong Chen - Suntech
L: Xianwu Cai - 48th Institute
PV Diffusion Furnace Test
Methods TF
L: Liangyu Liu - CETC-48
L: Xianwu Cai - CETC-48
L: Jianyu Zheng – SevenStar
L: Qian Cao – CETC-48
Japan TC Chapter of Global PV
Technical Committee
C: Kazuhiko Kashima - Kashima
Engineering
C: Masaaki Yamamichi - AIST
PV Silicon Raw Materials
TF
L: Xiaoxia Liu - GCL
L: Dongxu Chu - SINOSICO
L: Li He - CPVT
L: Wei Zhou - Trina Solar
L: Liang Luo - Hunan Red Solar
L: Zhen Zhang - Hohai University
L: Jingbing Zhu - Suntech
Michigan
PV Package Performance
TF
Taiwan TC Chapter of PV
C : B. N. Chuang - CMS/ITRI
C : J.S. Chen - TeraSolar
C : Ray Sung - UL Taiwan
Building Integrated
Photovoltaic (BIPV) TF
L: C.C.Lin - PV Guider
L: T.C. Wu - CMS/ITRI
L: Ivan Chou - Hulket
L: K.T.Lee - King Design
L: C.C.Lin - PV Guider
L: D. R. Huang - NDHU
L: Ivan Chou - Hulket
L: K.T.Lee - King Design
L: K. Han Ke - Grain System
PV Reliability Test Method
TF
Organic & Dye Sensitized
Solar Cell TF
PV Silicon Wafer TF
L: Yuepeng Wan - GCL
L: Liangping Deng - LONGi
L: Jingang Lu – HI-TECH
Thin Film PV Module TF
PV Module TF
NA TC Chapter of Global PV
Technical Committee
L: Yaohua Mai – Hebei
University
L: Xinwei Niu - Chint Solar
L: Jian Ding - Hanergy
L: H.S. Wu – CMS/ITRI
CIGS Solar Cell TF
Multi-Wire Saws TF
L: Jingying Jia - National
Engineering Research Center
for Photovoltaic Equipment
L: Xianwu Cai - CETC 48th
Institute
L: Zhixin Li – LCT
L: Honglin Sui - CETC-48
L: D. R. Huang – NDHU
L: T.C. Wu – CMS/ITRI
L: Jason Shin – King Design
L: William Hou – Sunshine PV
L : D. R. Huang - NDHU
L: Kevin Chou – Everlight
L: Jason Shin – King Design
L: Y. M. Yang – NCKU
L: H.S. Koo – MUST
L: C. G. Wu – NCU
L: C. C. Tsao – INER
PV Materials Global Technical Committee
EU TC Chapter of PV Materials
JA TC Chapter of PV Materials
C: Huber Aulich - Solar Valley
C: Takashi Ishihara - Mitsubishi
Electric
Engineering
C: Tetsuo Fukuda - AIST
Int l PV Analytical Test Methods,
Metrology, and Inspection TF
L: TBD
Japan PV Materials TF
L: Tetsuo Fukuda - AIST
L: Takashi Ishihara - Mitsubishi
Electronic
PV Silicon Materials TF
L: Peter Wagner - Consultant
= Global Task Force
NA TC Chapter of PV Materials
C: Lori Nye
C: Hugh Gotts - Air Liquide
Electronics US
Int l PV Analytical Test Methods,
Metrology, and Inspection TF
L: Hugh Gotts - Air Liquide Electronics US
L: Ron Sinton - Sinton Instruments
L: Chris Moore - BayTech-Resor
Physical Interfaces & Carriers Global Technical Committee
Europe TC Chapter of Physical Interfaces &
International Reticle SMIF Pod
& Loadport Interoperability TF
L: Jan Rothe - GLOBALFOUNDRIES
Japan TC Chapter of Physical Interfaces &
C: Tsuyoshi Nagashima - Miraial
C: Tsutomu Okabe - TDK
C: Kenji Yamagata - DAIFUKU
TA: Shoji Komatsu – Acteon NEXT
NA TC Chapter of Physical Interfaces & Carriers
C: Matt Fuller - Entegris
C: Stefan Radloff - Intel
International Process Module
Physical Interface (IPPI) TF
International 450 mm PIC
TF
L: Richard Oechsner - Fraunhofer
L: Shoji Komatsu – Acteon
NEXT
Global PIC Maintenance
TF
International Reticle SMIF Pod
& Loadport Interoperability TF
NEXT
L: Jan Rothe - GLOBALFOUNDRIES
International 450 mm PIC
TF
L: Melvin Jung - Intel
NEXT
International 450 mm
Shipping Box TF
L: Tom Quinn - Intel
Fiducial Mark Interoperability
TF
Glboal PIC Maintenance
TF
L: Larry Hartsough - UA
Associates
NA 450mm Shipping Box
TF
L: Tom Quinn - Intel
EUV Reticle Handling TF
450mm ATDP TF
L: Stefan Radloff - Intel
= Global Task Force
L: Long He - SEMATECH
L: David Chan - SEMATECH
L: John Zimmerman - ASML
L: Kazuya Ota - Nikon
Silicon Wafer Global Technical Committee
NA TC Chapter of Si Wafer
Europe TC Chapter of Si Wafer
C: Dinesh Gupta - STA
C: Noel Poduje - SMS
VC: Mike Goldstein
TE: Murray Bullis - Materials &
Metrology
C: Werner Bergholz - Jacobs
University of Bremen
C: Fritz Passek - Siltronic
International Advanced
Surface Inspection TF
L: Frank Riedel - Siltronic
Wafer Geometry TF
L: Fritz Passek - Siltronic
International Terminology
TF
International Test
Methods TF
International Annealed
Wafers TF
L: Dinesh Gupta - STA
International Epitaxial
Wafers TF
International Polished
Wafers TF
L: John Valley - SunEdison
Semiconductor
L: Mike Goldstein
International SOI Wafers
TF
L: Bich-Yen Nguyen - SOITEC
TF
L: TBD
International Test
Methods TF
Wafer Geometry TF
L: Noel Poduje - SMS
L: Jaydeep Sinha
International Automated
Advance Surface Inspection TF
L: Kurt Haller – KLA-Tencor
Wafers TF
= Global Task Force
Silicon Wafer Global Technical Committee
Japan TC Chapter of Si Wafer
C: Naoyuki Kawai - The University of
Tokyo
C: Tetsuya Nakai - SUMCO
TF
L: Tetsuya Nakai - SUMCO
International Annealed
Wafers TF
L: Koji Araki - GlobalWafers
Japan
International Test Method
TF
JA Shipping Box TF
L: Ryuji Takeda GlobalWafers Japan
NEXT
L: Tsuyoshi Nagashima - Mirial
Japan Test Method TF
International SOI Wafers
TF
L: Atsushi Ogura - Meiji
University
L: Tetsuya Nakai – SUMCO
International Epitaxial
Wafers TF
L: Naohisa Toda - Shin-Etsu
Handotai
L: Ryuji Takeda - GlobalWafers
Japan
L: Tsuyoshi Otsuki Shin-Etsu
Handotai
L: Mikako Omata - SCAS
International 450 mm
Shipping Box TF
NEXT
GOI WG
L: Tsuyoshi Otsuki - Shin-Etsu
Handotai
Wafers TF
L: Yasutoshi Takamoti GlobalWafers Japan
Fiducial Mark
Interoperability TF
L: Tetsuya Nakai - SUMCO
Surface Organic
Contaminant Analysis WG
L: Mikako Omata - Sumika
Chemical Analysis Service
Surface Metal Chemical
Analysis WG
L: Ryuji Takeda - GlobalWafers
Japan
L: Ryo Machida - Sumika
Chemical Analysis Service
BMD DZ WG
L: Satoshi Akiyama – Raytex
Optima
L: Kazuo Moriya - Raytex
= Global Task Force
Bulk Heavy Metal Analysis by
Electrical Measurement WG
L: Shingo Sumie - KOBELCO
L: Masaru Akamatsu - KOBELCO
Wafer Geometry TF
Optima
Japan JWG TF
L: Masanori Yoshise Freelance
Optima
Surface Inspection TF
L: Masami Ikota - Hitachi High
Technologies
Traceability Global Technical Committee
Japan TC Chapter of Traceability
C: Yoichi Iga - Freelance
C: Hirokazu Tsunobuchi - Keyence
5 Year Review
TF
L: Hirokazu Tsunobuchi Keyence
Fiducial Mark
Interoperability TF
L: Hirokazu Tsunobuchi Keyence
NA TC Chapter of Traceability
C: Yaw Obeng - NIST
5 Year Review TF
L: Win Baylies - BayTech-Resor

Organization Chart (July 2016)

Transcription

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