Document 6535405

Toshiba Starts Sample Shipments of Industry’s First Embedded NAND Flash
Memory Modules compliant with UFS Ver. 2.0
JEDEC UFS Ver.2.0 standard compliant embedded memories combine up to 64GB
NAND and a controller in a single package
Düsseldorf, 28th April 2014 – Toshiba Electronics Europe has started sample shipments of
32-gigabyte and 64-gigabyte (GB) embedded NAND flash memory modules compliant with
the JEDEC UFS[1] Ver.2.0 standard, the first company in the industry[2] to do so. The product
supports maximum transfer rates up to 11.6Gbps by integrating two 5.8Gbps High-speed
MIPI M-PHY®[3] HS-G3 I/F data lanes - an optional feature of UFS Ver. 2.0.
The modules achieve ultra-high read/write performance with read speeds reaching 650MB/s
and write speeds reaching 180MB/s. The faster transfer speeds can shorten the time taken
to launch many kinds of applications, shoot digital still images, and play and download large
data movie and music files on mobile products like smartphones or tablets.
The modules are sealed in a small 153 ball FBGA package measuring just 11.5mm x
13.0mm x 1.0mm for the 32GB die and 11.5mm x 13.0mm x 1.2mm for the 64GB die and
have a signal layout compliant with JEDEC UFS Ver.2.0. The modules are rated for an
operating temperature of -25°C to +85°C and support memory core voltages of 2.7V to 3.6V.
Demand continues to grow for large density, high-performance chips that support high
resolution video, driven by improved data-processing speeds in host chipsets and wider
bandwidths for wireless connectivity in a wide range of digital consumer products, including
smartphones and tablet PCs.
The JEDEC UFS Ver.2.0 compliant interface handles essential functions, including writing
block management, error correction and driver software. It simplifies system development,
allowing manufacturers to minimize development costs and speed up time to market for new
and upgraded products.
Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership
by being first in the industry to deliver samples with a high performance UFS module.
Toshiba will schedule mass production and add other densities to the line-up in response to
market demand.
[1] Universal Flash Storage is a product category for a class of embedded memory products built to
the JEDEC UFS standard specification.
[2] For embedded NAND flash memory modules, as of April 2014. Toshiba survey.
®
®
[3] MIPI and M-PHY are trademarks, servicemarks, registered trademarks, and/or registered
servicemarks owned by MIPI Alliance.
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About Toshiba
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation,
which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry's broadest IC
and discrete product lines including high-end memory, microcontrollers, ASICs and ASSPs for automotive,
multimedia, industrial, telecoms and networking applications. The company also has a wide range of power
semiconductor solutions. TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing,
marketing and sales and now has headquarters in Düsseldorf, Germany, with subsidiaries in France, Italy, Spain,
Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr.
Takashi Nagasawa.
Toshiba Corporation is a world leader and innovator in pioneering high technology, a diversified manufacturer
and marketer of advanced electronic and electrical products spanning digital consumer products; electronic
devices and components; power systems, including nuclear energy; industrial and social infrastructure systems;
and home appliances. Founded in 1875, Toshiba today operates a global network of more than 590 companies,
with 206,000 employees worldwide and annual sales surpassing US$61 billion.
For more information visit Toshiba Electronics Europe's web site at www.toshiba-components.com
Contact details for publication:
Toshiba Electronics Europe, Hansaallee 181, D-40549 Düsseldorf, Germany
Tel: +49 (0) 211 5296 0 Fax: +49 (0) 211 5296 792197
Web: http://www.toshiba-components.com/pressoffice/index.asp
E-mail: Memory: memory-ic@toshiba-components.com
Contact details for editorial enquiries:
Henning Rausch, Toshiba Electronics Europe
Tel: +49 (211) 5296 117
E-mail: HRausch@tee.toshiba.de
Issued by:
Andrew Town / Matt Wilkinson, Pinnacle Marketing Communications Ltd
Tel: +44 (0) 20 8429 6546 / +44 (0) 20 8429 6548 Fax: +44 (0) 20 8868 4373.
Web: www.pinnacle-marketing.com
E-mail: a.town@pinnaclemarcom.com or m.wilkinson@pinnaclemarcom.com
April 2014
Ref. 6513/A