october 7-8, 2014 october 9, 2014 ESD ASSociAtion REgionAl tutoRiAlS

ESD Association Regional Tutorials
October 7-8, 2014
ESD Device Design Essentials
October 9, 2014
Advanced ESD Characterization and Test Methods
Fraunhofer Institution for Modular Solid State Technologies EMFT
Hansastr. 27d, 80686 Munich, Germany • Lunch and refreshments provided.
Register Online at www.esda.org/onlineregistrations.html
Be proactive! Get engaged! Learn from industry professionals to
experience device protection technologies and limitations.
ESD Device Design Essentials
October 7-8, 2014
Instructors: Gianluca Boselli, Texas Instruments;
Harald Gossner, Intel Corporation
This two-day seminar consists of concentrated versions of twelve ESDA
tutorials which comprise the ESDA Device Design Certification Program.
Gianluca Boselli
•ESD On-Chip Protection in Advanced Technologies
•SPICE-Based ESD Protection Design Utilizing Diodes and Active MOSFET Rail Clamp Circuits
•EOS/ESD Failure Models and Mechanisms
•On-Chip ESD Protection in RF Technologies
•Charged Device Model Phenomena and Design
•Latch-up Physics and Design
•Circuit Modeling and Simulation for On-Chip Protection
•Troubleshooting On-Chip ESD Failures
•Device Testing--IC Component Level: HBM, CDM, MM, and TLP
•Impact of Technology Scaling on ESD High Current Phenomena and Implications for Robust ESD Design
•Transmission Line Pulse Measurements: Parametric Analyzer for ESD On-Chip Protection
•System Level ESD/EMI: Testing to IEC and other Standards
Harald Gossner
Day 1 October 7
PART I (8:00 AM-Noon)
This part reviews the fundamentals of ESD testing,
high-current physics, and ESD modeling. The focus is on device-level (HBM, CDM, MM, TLP) and
system level testing, impact of technology scaling
on ESD high current phenomena, as well as circuit
modeling and simulation for on-chip protection.
PART II (1:00 PM-5:00)
The principles from part I are then applied to ESD
Protection Design. This part describes ESD on-chip
protection in advanced technologies, SPICE-based
ESD protection design utilizing diodes, and active
MOSFET rail clamp circuits.
Day 2 October 8
PART III (8:00 AM-Noon)
This part describes special ESD design cases, including Charged Device Model (CDM) phenomena
and design, on-chip ESD protection in RF Technologies, and latch-up physics and design.
PART IV (1:00 PM-5:00)
The final section discusses EOS/ESD failure models and mechanisms. The seminar concludes with
practical examples for troubleshooting of on-chip
ESD failures.
3/12/2014
Setting the Global Standards for Static Control!
EOS/ESD Association Inc. • 7900 Turin Rd Bld 3 • Rome NY 13440
Phone 315-339-6937 • Fax 315-339-6793 • info@esda.org • www.esda.org
ESD Association Regional Tutorials
October 7-8, 2014
ESD Device Design Essentials
October 9, 2014
Advanced ESD Characterization and Test Methods
Fraunhofer Institution for Modular Solid State Technologies EMFT
Hansastr. 27d, 80686 Munich, Germany • Lunch and refreshments provided.
Register Online at www.esda.org/onlineregistrations.html
Advanced ESD Characterization
and Test Methods
October 9, 2014
Instructors: Horst A. Gieser and Heinrich Wolf,
pAdvanced ESD Characterization
9:00 a.m. - 10:30 a.m.
How to gain accurate insight in the electrical behavior of protection elements and of elements to be
protected. DC characterization, electrothermal characterization, (very fast) transmission line pulsing,
repetitive ps-Pulsing. Results using the Agilent 62 GHz Single Shot Oscilloscope, Failure criteria leakage
and RF-degradation.
pESD Failure Reproduction and Alternative Models
10:30 a.m. - 12:00 Noon
How to look at a failure and how to reproduce it. CDM-Pitfalls; Capacitive Coupled TLP; Cable Discharge;
Charged Board Model; ESD from Outside - straight through passivation ESD on LEDs.
pLab Experience
1:00 p.m. - 5:00 p.m.
Learn to know your structures in the ATIS test lab and discuss the results with the speakers and your
colleagues. Learn to know characterization equipment and methods.
Pls. contact heinrich.wolf@emft.fraunhofer.de to discuss your individual test wishes at least before
October 1, 2013 and send some devices to be tested during a demonstration at the workshop. The
speakers reserve the right to prioritize projects in view of interest to the audience.
3/12/2014
Setting the Global Standards for Static Control!
EOS/ESD Association Inc. • 7900 Turin Rd Bld 3 • Rome NY 13440
Phone 315-339-6937 • Fax 315-339-6793 • info@esda.org • www.esda.org
ESD Association Regional Tutorials
October 7-8, 2014
ESD Device Design Essentials
October 9, 2014
Advanced ESD Characterization and Test Methods
Fraunhofer Institution for Modular Solid State Technologies EMFT
Hansastr. 27d, 80686 Munich, Germany • Lunch and refreshments provided.
Register Online at www.esda.org/onlineregistrations.html
About the instructors
Gianluca Boselli completed his Master in EE at the University of Parma, Italy, in 1996. In 2001 he completed his Ph.D. at the University
of Twente, The Netherlands. In 2001 he joined Texas Instruments, Dallas, Texas, where he focused on ESD and Latch-up development
for advanced CMOS technologies. Recently his responsibilities extended into ESD development of Analog technologies. He authored
several papers in the area of ESD and Latch-up. He presented his work at major conferences, including EOS/ESD Symposium, IEDM,
and IRPS. He also presented several invited papers and/or tutorials at the EOS/ESD Symposium, IRPS, IEDM, ESREF and RCJ. Dr.
Boselli has been the recipient of the “Best Paper Award” on behalf of Microelectronics Reliability Journal in 2000. He received “The Best
Paper Award” at the EOS/ESD Symposium 2002. He also received the “The Best Presentation Award” at the EOS/ESD Symposium in
2002 and in 2006. Dr. Boselli is a member of ESD Association and an IEEE senior member. He is currently a member of the Board of
Directors of the ESD Association, where he is the Symposium Business Unit Manager. Dr. Boselli serves on the TPC of the EOS/ESD
Symposium, IRPS and ESREF. Dr. Boselli has served as TPC Chair at the EOS/ESD Symposium 2006, Vice-General Chair at the EOS/
ESD Symposium 2007 and General Chair at the EOS/ESD Symposium 2008. Dr. Boselli holds fourteen patents with several pending.
Dr. Boselli serves in the Editorial Board of the IEEE Transactions on Device and Materials Reliability (T-DMR).
Harald Gossner is Intel Architecture Group Principal Engineer for ESD. He received his degree in physics (Dipl. Phys.) from the LudwigMaximilians-University, Munich in 1990 and his Ph. D. in electrical engineering from the Universität der Bundeswehr, Munich in 1995. For
15 years he has worked on the development of ESD protection concepts for bipolar, BiCMOS and CMOS technologies with Siemens
and Infineon Technologies. Recently, he has joined Intel Mobile Communications overseeing the development of robust mobile systems
there. Harald Gossner has authored and coauthored more than 100 technical papers and one book in the field of ESD and device
physics. He holds 30 patents on the same topic. He received the best paper award of EOSESD 2005. He has served in several conference committees of IEDM, IEW and EOSESD Symposium, where he is currently technical program chair. He is member of the board of
directors of ESD Association. In 2006 he became cofounder of the Industry Council on ESD Target Levels. Since then he is co-chairing
this committee of 50 leading electronics and IC companies.
Horst A. Gieser is head of the ATIS (Analysis and Test of Integrated Systems) team at the Fraunhofer-Institution for Modular Solid State
Technologies EMFT (the former Munich branch of Fraunhofer-Institute for Reliability and Microintegration until June 30, 2010). He received his diploma in Electrical Engineering and his Ph.D. from the Technical University in Munich. He has authored and contributed to
more than 55 publications. Four papers in the field of electrostatic discharge (ESD) won awards at international conferences. Currently,
he is chairing the ESD FORUM e.V. www.esdforum.de, the German non-profit ESD association furthering the exchange of scientific
and professional experience. He has been serving in organizing several international conferences and workshops. Further interests
are in the field of reliability and failure analysis of devices, circuits, and systems as well as characterization techniques with ultra-short
transients. For lateral and vertical integration of modules and systems his team has been working on Aerosol Jet Printing, through silicon
vias, and polymer electronics.
Heinrich Wolf received his diploma degree in Electrical Engineering from the Technical University of Munich (TUM) and his PhD from the
Technical University of Berlin, Germany. He joined the Chair of Integrated Circuits at the TUM as a member of the scientific staff working
on Electrostatic Discharge (ESD) related issues. This involved modeling of ESD-protection elements, parameter extraction techniques
and test chip design. In 1999 he joined Munich branch of the Fraunhofer Institute for Reliability and Microintegration (IZM) which became
the Institution for Solid State Technologies EMFT in 2010. He was involved in the investigation of ESD phenomena for CMOS and Smart
Power Technologies. Furthermore he published on the development of ESD test methods and tester characterization. Currently he is
coordinating the ESD related activities at the EMFT and is also working in the field of RF transmission line design which includes simulation and characterization up to 110 GHz. Furthermore, he serves for the TPC of the EOS/ESD Symposium and the IEW.
3/12/2014
Setting the Global Standards for Static Control!
EOS/ESD Association Inc. • 7900 Turin Rd Bld 3 • Rome NY 13440
Phone 315-339-6937 • Fax 315-339-6793 • info@esda.org • www.esda.org
ESD Association Regional Tutorials
October 7-8, 2014 - ESD Device Design Essentials
October 9, 2014 - Advanced ESD Characterization and Test Methods
Fraunhofer Institution for Modular Solid State Technologies EMFT
Hansastr. 27d, 80686 Munich, Germany • Lunch and refreshments provided.
Register Online at www.esda.org/onlineregistrations.html
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Setting the Global Standards for Static Control!
EOS/ESD Association Inc. • 7900 Turin Rd Bld 3 • Rome NY 13440
Phone 315-339-6937 • Fax 315-339-6793 • info@esda.org • www.esda.org