LM362A

Transcription

LM362A

Application Note
Samsung Electronics
LM362A (3623)
rev0.0
Index
Page
1. Introduction
1.1 Product Description
1.1.1 High Power LED (HPL) vs Middle Power LED (MPL)
5
1.1.2 Economically powerful solution – LM362A
7
1.2 Product Information
1.2.1 Feature and Dimension
8
1.2.2 Product code and binning
9
1.2.3 Spectrum Distribution
11
1.2.4 Polar Intensity Diagram
11
1.3 Applicable Lighting Fixture
1.3.1 Luminous output vs the number of packages
12
1.3.2 Package array guide for Bulb and Down Light
14
2. Package Characteristics
15
2.1 Electrical Characteristics
2.2 Optical Characteristics
2.2.1 Characteristic examples for single package driving
16
2.2.2 5000K measurement data mounted on Metal PCB
21
23
2.2.4 5000K measurement data mounted on FR PCB
24
25
2
Page
3. Package array performance
3.1 Module performance
26
3.1.1 Module Devise under Test (DUT)
26
3.1.2 Electrical power consumption
27
3.2 5000K 68Ra performance graph
3.2.1 50mA driving current
28
28
29
29
30
30
31
31
32
32
33
33
3
Page
4. Application
4.1 PKG Array Guide
34
4.2 Application - Example
36
4.3 Lens Solution
39
5. Caution
5.1 Mechanical Considerations
5.1.1 Handling Guide
41
5.1.2 Recommended Land Pattern
42
5.1.3 SMT Set
43
5.1.4 Reflow Profile
44
6. Appendix
6.1 Risk of Sulfurization (or Tarnishing)
45
6.2 Discoloration of LED
52
64
7. Revision History
4
1.1.1 High Power LED (HPL) vs Middle Power LED (MPL)
There are many kinds of LED packages and module products in
the LED industry. In the lighting industry, there are mainly two
different package types, one is middle power LED package (MPL)
and the other is high power LED package (HPL). Usually MPL is
composed of conventional LED chip and lead-frame package. HPL
is composed of vertical LED chip and heat-slug package or ceramic
package. Ceramic substrate package, small and compact size, is
much more popular rather than heat slug package.
Normally MPL power dissipation is about 0.2W~0.3W and HPL is
1~2W. Size of these two kinds of packages are similar, but
properties of optic and thermal are very different.
Phosphor
Lens
Mold
Phosphor
Lead-Frame
Ceramic
[ MPL package structure ]
[ HPL package structure ]
Light emitting
Light emitting
Heat dissipation
Heat dissipation
[ MPL light and heat visual ratio]
[ HPL light and heat visual ratio]
5
Due to good spreading effects of thermal and optic properties,
MPL is a powerful solution for the following applications: flat light
engines, LED Linear Tubes, bulbs and others. The thermal
dissipation and optical properties of the MPL allow customers to
use it with FR-PCB as a cost effective solution; instead of MetalPCB.
Light emitting
[ Module for multi-MPL concept]
Heat dissipation
If users want to get high luminous flux from a compact board area,
then HPL is a very powerful solution. HPL is suitable for 2nd lens
applications to optimize the optical flux in a wider beam angle,
especially for outdoor products; or for focusing the optical flux in
applications such as : flash lights/torches, MR, and PAR
applications. Therefore high reliability and thermal management
of HPL is the main design issue.
Light emitting
Heat dissipation
[ Module for multi-HPL concept]
2nd Lens
[ HPL 2nd lens effect for outdoor and MR, PAR ]
6
1.1.2 Economically powerful solution – LM362A
Especially in case of bulb and down light application, there’s so
many light sources that could be possible. HPL and MPL have each
advantage and disadvantage aspects of thermal, optical and cost.
HPL has high reliability properties, but it is a little bit more
expensive solution. On the contrary to HPL, MPL is inexpensive
solution, but it has low reliability properties especially on compact
board area.
LM362A has both strong points, reliability from HPL and
inexpensive platform from MPL.
LM362A is designed for indoor and outdoor lightings such as bulb,
ceiling lighting, down light etc. And it can provide stable
performance and long lifetime. Above all, LM362A is economically
compatible solution.
MPL
Low Power
Power Up
Low Cost
required
[Feature]
LM362A
Economically
powerful
solution
7
HPL
High Power
Cost Down
High Cost
required
[Feature]
1.2.1 Feature and Dimension
With very small package dimension size, designer can get superior
performance from LM362A.
- Lead Frame Type LED Package : 3.6 x 2.3 x 0.6t mm
- Superior Performance : 133lm/W, 80lm, 0.6W @100mA, 5000K
Anode (+)
LED
Zener
Diode
Cathode (-)
LM362A is very attractive solution for the compatible TCO (total
cost of ownership).
- 2 Die per PKG : higher lumen output with small total footprint
- GaN / Al2O3 Chip & SMD type package with long time reliability
- Eco-friendly : RoHS compliant
Top View
Side View
[ LM362A Package Dimension ]
8
Bottom View
1.2.2 Product code and binning
LM362A has full color line-up.
Product Code
CCT [K]
CRI (Min.)
SPMWHT325AD5YBW0S0
2700
80
SPMWHT325AD5YBV0S0
3000
80
SPMWHT325AD5YBU0S0
3500
80
SPMWHT325AD5YBT0S0
4000
80
SPMWHT325AD5YBR0S0
5000
80
SPMWHT325AD3YBR0S0
5000
68
SPMWHT325AD5YBQ0S0
5700
80
SPMWHT325AD5YBP0S0
6500
80
LM362A has 3 kinds of parameter binning, - Voltage, Flux, Color
110
Luminous Flux Rank - S1. S2,S3
@If=100mA, Ts=25℃
100
90
S3
S2
S1
80
70
60
9
(80Ra)
P0-6500K
(80Ra)
Q0-5700K
(68Ra)
R0-5000
(80Ra)
R0-5000K
(80Ra)
T0-4000K
(80Ra)
U0-3500K
(80Ra)
V0-3000K
(80Ra)
50
W0-2700K
Luminous Flux [lm]
- Luminous flux (Iv (Φv)) is divided by 3 rank – S1, S2, S3
- Forward voltage(VF) is divided to 5 rank - A1,A2,A3,A4,A5
A1
5.4
5.6
A2
5.8
A3
A4
6
6.2
A5
6.4
6.6
6.8
Forward Voltage [V]
- Color CIE binning is according to ANSI bin and suitable for
lighting application.
- As for 5000K, 5700K, 6500K, 8 sub bins are operated.
As for 2700K, 3000K, 3500K, 4000K, 16 sub bins are operated.
0.45
2700K
0.43
3000K
3500K
0.41
4000K
Cy
0.39
5000K
W
V
5700K
0.37
Black
Body Locus
U
ANSI
C78.377A
T
6500K
0.35
0.33
R
Q
0.31
P
0.29
0.29
0.33
10
0.37
0.41
Cx
0.45
0.49
1.2.3 Spectrum Distribution
Optical spectrum of LM362A are shown at each CCT 3000K and
5000K. Measured data is just for representative reference only.
※ CCT: 3000K (X: 0.4360, Y: 0.3985)
※ CCT: 5000K (X: 0.3463, Y:
0.3584)
1.2.4 Polar Intensity Diagram
Viewing angle describes the spatial distribution and the value is
120°(FWHM, Full width at half maximum), FWHM is the difference
between the angles corresponding to 50% of the maximum
intensity.
11
1.3.1 Luminous output vs the number of packages
In the non-directional application
such as bulb, down light and flood
light , user can design compatible
and powerful lighting product.
In the directional application such as
MR, PAR, user can design lighting
product economically using LM362A
and correlated 2nd lens.
For a reference, user can refer to the relations with luminous flux
and the number of packages sampling by typical rank (Φ,VF).
LM362A 2700K Power
Consumption Range per
package number
LM362A 2700K Luminous Flux Range per
package number
80
200mA_w/o_optic_loss
200mA_w_loss
100mA_w_loss
6000
5000
Consumption power [W]
Luminous Flux [lm]
7000
4000
3000
2000
70
60
50
40
30
20
1000
10
0
0
1
6
11 16 21 26 31 36 41 46 51
power @200mA
power @100mA
1 6 11 16 21 26 31 36 41 46 51
Package number
Package number
12
For example, in case of
CCT 5000K and 68Ra, if
the number of 21
packages is used, user
can expect that the
power
consumption
will be 12.6W, and
luminous flux will be
1680lm (100mA typ.) to
2940lm (200mA max.)
without optic overlap
loss which is varied
with the thermal and
optic condition.
LM362A 5000K (Ra80) Luminous Flux Range
per package number
Luminous Flux [lm]
7000
200mA_w_loss
100mA_w_loss
6000
5000
4000
3000
2000
1000
0
1
6
11 16 21 26 31 36 41 46 51
Package number
LM362A 5000K (Ra68) Luminous Flux Range
per package number
7000
Luminous Flux [lm]
MP36S can be driven
at 100mA typically and
get 133lm/W for 5000K,
68Ra. To get more
efficacy, driving current
could be chosen under
typical value. If the
aspect of cost is prior
to the efficiency quality,
then user can drive
current until 200mA
maximum value which
should be operated
under derating curve
printed on datasheet.
200mA_w_loss
100mA_w_loss
6000
5000
4000
3000
2000
1000
0
1
13
6
11 16 21 26 31 36 41 46 51
Package number
1.3.2 Package array guide for Bulb and Down Light
Bulb
Luminous Flux [lm]
Traditional
Lamp Grade Set target PKG target
CCT
(3000K ~
5000K)
CRI
80
Driving Current per PKG
50 mA
100 mA
530~560
16EA
8EA
6EA
5EA
810
950~1000
28EA
15EA
11EA
9EA
75W
1100
1290~1360
38EA
20EA
14EA
11EA
100W
1600
1880~1980
54EA
30EA
21EA
17EA
150W
2000
2340~2470
68EA
36EA
26EA
21EA
at Ts 75℃
at Ts 25℃
40W
450
60W
150 mA 200 mA
Number of Packages
Down Light
CCT
(3000K ~ 5000K)
CRI
80
Driving Current per PKG
Luminous Flux [lm]
Set target
PKG target
at 75℃
at 25℃
1100
50 mA
100 mA
150 mA 200 mA
1430~1510
42EA
22EA
16EA
13EA
2000
2600~2750
76EA
40EA
29EA
23EA
3000
3900~4120
116EA
60EA
43EA
34EA
4000
5200~5500
150EA
80EA
57EA
45EA
Number of Packages
※ These table for lighting design should be considered about real module size and thermal
resistance from LED solder point to heat sink
※ Heat sink performance (System thermal resistance) should meet package Ts point on 75℃
These boundary condition is following up on derating curve printed at page.17
※ Adopted luminous loss rate for Bulb
: Thermal 5%, Optic 10% for 3000K
Thermal 10%, Optic 10% for 5000K
※ Adopted luminous loss rate for Down Light
: Thermal 5%, Optic 10%, Fixture 10% for 3000K
Thermal 10%, Optic 10%, Fixture 10% for 5000K
14
2.1 Electrical Characteristics
Ts point
Copper electrothermal pad
Forward Current vs. Forward Volatge
250
Ts 90℃ 75℃ 50℃ 25℃
Forward Current (mA)
In order to get stable
lighting output, LED should
be driven by constant
current.
And
forward
voltage of LED is varied with
driving current and junction
temperature. Therefore if
constant current is driven,
forward voltage will be
dropped as temperature
goes up. Ts is a temperature
of solder point beside
package lead.
200
150
100
50
0
5.00 5.20 5.40 5.60 5.80 6.00 6.20 6.40
Forward Voltage (V)
The consumption power of LED is also
varied as per temperature.
Consumption power is slightly
changed
lower
according
to
temperature and thermal system at
each constant current.
MP36S power consumption
Power Consumption [W]
MP36S VF @McPCB 5000K
7.0
Vf [V]
6.5
6.0
5.5
5.0
25℃
50℃
75℃
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
50mA
100mA
150mA
200mA
25℃ 50℃ 75℃ 90℃
Ts
90℃
Ts
15
2.2.1 Characteristic examples for single package driving
CCT 5000K, CRI 73
CCT 3000K, CRI 84
McPCB
(Metal printed
circuit board)
Thermal resistance :
FR-PCB
(FR printed
circuit board)
The specification and typical characteristics of LM362A are presented
on datasheet. This application note shows more various properties and
dynamic operation trends as changing as several input parameters and
PCB material and temperature.
Four kinds of DUT have been tested and optical measured data was
different as per each thermal resistance and CCT and driving current.
Thermal resistance is related with package structure and PCB and
bonding materials. To make white color, phosphor is used and this has
various temperature properties. As changing driving current, luminous
and thermal efficacy also varies. Actually these measured
characteristics might be different depending on concrete case by case.
Therefore attention is needed. As these test data was measured from
the base on some samples not mass samples, it should be used for
reference only.
16
LED Chip
Chip attach material to substrate
Lead-Frame (substrate)
Molding
Solder to PCB
PCB Solder Pads
PCB Dielectric layer
Phosphor
Bonding wire
TJ : Junction Temp.
TLF : Lead Frame substrate
PLED : Thermal Source
RJ-LF
TS : Solder Temp.
RLF-S
RJS : Junction-Solder
RSB : Solder to Board
TB : Board Temp.
Aluminium or FR Plate
Classical TIM to heat-sink
TC : Case Temp.
RBC : Board to Case
Heat Sink
RCA : Case to Air
TA : Ambient Temp.
Tambient : Thermal Ground
Normally lighting fixture using LED as a lighting source has a ordinary
structure that consist of PCB for electrical connection and heat sink for
heat transfer. Originally LED is semiconductor component which means
the performance of LED has very close relations with thermal and
driving bias condition.
Most of LED packages need to be mounted on PCB (Printed Circuit
Board) to flow current into LED for driving. But PCB has a dielectric layer
which makes negative performance against heat transfer. PCB substrate
material, FR or metal, including dielectric material and it’s thickness of
PCB is important to LED reliability and performance. If same LED
packages are used, different characteristics are shown according to PCB
type which is main factor to decide thermal resistance of system.
Material has it’s own thermal conductivity and when different
materials are connected by bonding material, there’s thermal resistance.
Even if each material has good thermal conductivity, it is possible to get
poor thermal resistance regarding to bonding material and quality
between each different material.
17
LED lighting fixture has many thermal resistances. Rpackage is thermal
resistance within only package inner structure which include junction,
chip substrate, package substrate, bonding material and phosphor
effect etc. RJS is thermal resistance between chip junction and solder
point and usually used as a package thermal resistance. RSB is that of
solder to PCB board, RBC is that of board to case. RCA is case to ambient.
3000K_Metal-PCB
5000K_Metal-PCB
3000K_FR-PCB
5000K_FR-PCB
10000
100
1
0.01
0.0001
1E-06
0
A
B 10 C
D
E
20
F
30
G
40
H
50
Rpackage
C
RJS
D
E
RSB RBC RCA
F
RJS
G
RSB
H
RBC
RCA
Each thermal resistances of four cases of test device, 3000K CCT
samples on metal or FR PCB and 5000K CCT on metal or FR PCB, are
presented. Thermal resistance within package only, Rpackage, is similar
like as ‘B’ point between each case, but RJS regarding with PCB type is
different. In metal PCB case, RJS is ‘C’ point but case of FR PCB is ‘F’
point.
Package characteristics can be easily changeable through these
different thermal resistances which defined by material and
manufacture process quality and driving current under various Ts
conditions.
18
We can expect and calculate drivable current and ambient
temperature ranges. If driving current is 100mA and system thermal
resistance is 46℃/W, then 105℃ Tj (junction temperature) could be
known at 80℃ Ta (ambient temperature) condition.
Driving Range at Rth(j-a) 46℃/W
(under Tj maximum)
Forward current [mA]
250
Tj=78℃
Tj=106℃ Tj=125℃
200
Tj=71℃
Tj=100℃
150
Tj=66℃
Tj=125℃
Tj=105℃
50mA
Tj=125℃
100
Tj=72℃
Tj=102℃
Tj=125℃
100mA
150mA
200mA
50
0
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140
Ambient Temperature [℃]
Boundary condition like as derating curve for maximum driving current
could be drawn by connecting point in Tj maximum at each different
system thermal resistance.
Derating Curve
Forward current [mA]
250
200
Rth(j-a) 20″/W
Rth(j-a) 40″/W
150
Rth(j-a) 60″/W
Rth(j-a) 80″/W
100
Rth(j-a) 100″/W
Max. Current
50
0
0
10 20 30 40 50 60 70 80 90 100 110 120 130 140
Ambient Temperature [℃]
19
Color shift @100mA, 5000K
0.362
McPCB
0.360
FRPCB
0.358
50℃
0.354
90℃
0.350
0.348
50℃
75℃
Ts temperature
75℃
McPCB
FRPCB
90℃
0.346
90℃
50℃
75℃
0.352
25℃
25℃
25℃
0.356
Cy
Relative luminous Flux
Relative output @100mA, 5000K
1.1
1.05
1
0.95
0.9
0.85
0.8
0.75
0.7
0.338 0.340 0.342 0.344 0.346 0.348 0.350
Cx
The test results of same rank samples at 5000K CCT show different
characteristics between case of mounting on Metal PCB and FR PCB.
Due to different ability of heat dissipation, characteristic curves show
different performance as per TS temperature. These results are caused
by the thermal degradation performance of LED chip and phosphor
which convert blue power to white light.
Color shift @100mA, 3000K
0.404
McPCB
25℃
0.402
FRPCB
50℃
0.400
Cy
Relative luminous Flux
Relative output @100mA, 3000K
1.1
1.05
1
0.95
0.9
0.85
0.8
0.75
0.7
0.398
0.396
25℃
75℃
90℃
90℃
FRPCB
0.394
25℃
50℃
75℃
Ts temperature
90℃
0.434
0.436
McPCB
0.438
Cx
0.440
0.442
In case of warm white, also thermal characteristics are possible
differently with cool white’s. Normally several kinds of phosphors
could be mixed in single package and then as per phosphor mixing
ratio, thermal performance could be different.
20
Relative Luminous Flux (%)
Relative Luminous Flux vs. Forward Current
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
50
100
150
Forward Current (mA)
200
As increase driving current, the gradient of relative luminous flux curve
drops due to thermal effects. If LM362A is mounted on metal PCB, at
75℃ Ts condition, final luminous flux is about 90% of initial value. At
50℃ Ts case, 95% relative luminous output is expected. Current
deviation is not that large at each Ts, but at 90℃ Ts, as current increase
the relative output gap becomes to larger. In view of design point,
LM362A should be considered under these various driving conditions.
LM362A degradation ratio
160
140
120
100
80
60
40
20
0
25℃
50℃
Ts
75℃
90℃
Luminous degradation ratio
[%]
Luminous Flux [lm]
LM362A Luminous Flux
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
50mA
100mA
150mA
200mA
25℃
50℃
75℃
Ts
90℃
※ The value is measured from typical binning rank.
Real design result is possible to be changed from the table depends on each rank
21
LM362A Efficacy
LM362A Efficacy
160
160
150
150
50mA
140
100mA
120
110
150mA
100
200mA
90
Efficacy [lm/W]
130
25℃
130
50℃
120
110
75℃
100
90℃
90
80
80
25℃
50℃
75℃
Ts
90℃
50mA 100mA 150mA 200mA
Current
When LM362A is driving at 100mA and 25℃ Ts condition, 63.5lm
133lm/W efficacy could be obtainable. As Ts goes on 75℃, 56.8lm
126lm/W is expected and power consumption comes to low slightly.
Important characteristics is color shift performance related with Ts
condition and thermal resistance. Color shift trends has close
connection with phosphor performance against CCT, Ts condition,
driving current and system thermal resistance. In addition to these
factors, depending on which diffuser is used at the fixture level, the
direction of color shift could be various. Therefore color shift degree
should be considered at initial design stage.
Color shift
0.40
0.39
R0
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.33 0.34
Color shift
0.362
0.360
25℃
0.358
Cy
y
Efficacy [lm/W]
140
50℃
0.356
0.354
75℃
0.352
0.350
0.348
x
0.35
0.346
0.36
90℃
50mA
100mA
150mA
200mA
0.338 0.340 0.342 0.344 0.346 0.348 0.350
Cx
22
160
140
120
100
80
60
40
20
0
50mA
100mA
150mA
200mA
25℃ 50℃ 75℃ 90℃
Ts
110%
105%
100%
95%
90%
85%
80%
75%
70%
[%]
Luminous Flux [lm]
200mA
LM362A Efficacy
50mA
100mA
150mA
200mA
Efficacy [lm/W]
Efficacy [lm/W]
150mA
160
150
140
130
120
110
100
90
80
25℃
50℃
75℃
90℃
50mA 100mA150mA200mA
Current
25℃ 50℃ 75℃ 90℃
Ts
Color shift
0.404
0.43
0.42
100mA
25℃ 50℃ 75℃ 90℃
Ts
LM362A Efficacy
160
150
140
130
120
110
100
90
80
50mA
Color shift
0.402
V0
0.400
y
Cy
0.41
0.40
0.398
0.396
0.39
25℃
50℃
75℃
90℃
0.394
0.38
0.41 0.42 0.43 0.44 0.45 0.46
0.434 0.436 0.438 0.440 0.442
Cx
※ The value is measuredx from typical binning rank.
23
50mA
100mA
150mA
200mA
160
140
120
100
80
60
40
20
0
110%
105%
100%
95%
90%
85%
80%
75%
70%
[%]
Luminous Flux [lm]
50mA
100mA
150mA
200mA
25℃
50℃
75℃
Ts
90℃
Efficacy [lm/W]
100mA
150mA
200mA
0.38
50℃
75℃
90℃
Color shift
0.362
25℃
0.360
R0
0.358
Cy
0.37
0.354
0.35
0.352
0.34
0.350
0.33
0.348
0.34
0.35
50℃
0.356
0.36
0.32
0.33
25℃
50mA 100mA 150mA 200mA
Current
Color shift
0.39
200mA
160
150
140
130
120
110
100
90
80
90℃
0.40
y
Efficacy [lm/W]
50mA
75℃
Ts
150mA
LM362A Efficacy
160
150
140
130
120
110
100
90
80
50℃
100mA
25℃ 50℃ 75℃ 90℃
Ts
LM362A Efficacy
25℃
50mA
100mA
75℃
90℃
0.346
0.36
0.338 0.340 0.342 0.344 0.346 0.348 0.350
x
Cx
24
50mA
150mA
200mA
50mA
100mA
150mA
200mA
25℃
50℃
75℃
Ts
90℃
[%]
Luminous Flux [lm]
160
140
120
100
80
60
40
20
0
110%
105%
100%
95%
90%
85%
80%
75%
70%
Efficacy [lm/W]
50mA
100mA
150mA
200mA
200mA
50℃
75℃
Ts
90℃
160
150
140
130
120
110
100
90
80
25℃
50℃
75℃
90℃
50mA 100mA 150mA 200mA
Current
Color shift
Color shift
0.404
0.43
0.402
V0
0.400
Cy
0.41
y
Efficacy [lm/W]
150mA
LM362A Efficacy
25℃ 50℃ 75℃ 90℃
Ts
0.42
100mA
25℃
LM362A Efficacy
160
150
140
130
120
110
100
90
80
50mA
0.40
0.398
0.39
0.396
0.38
0.41 0.42 0.43 0.44 0.45 0.46
0.394
25℃
50℃
100mA
150mA
75℃
200mA
90℃
0.434 0.436 0.438 0.440 0.442
Cx
x
25
50mA
3.1.1 Module Devise under Test (DUT)
Ts temperature at solder point
5000K 80Ra 6s X 8p array
3000K 80Ra 6s X 8p array
In order to show various module performance, typical rank samples
were chosen and tested. From one module, 5 array cases were made
and measured depend on each driving current and Ts temperature.
The purpose of these test is focused on concentrating light source for
bulb and down light. And the result is just for reference value due to
using typical values. in real design, there’s so various cases by Vf,
color, luminous flux rank and especially system thermal resistance.
1EA
(1sX1p)
6EA
(6sX1p)
12EA
(6sX2p)
26
24EA
(6sX4p)
48EA
(6sX8p)
3.1.2 Electrical power consumption
Total Power vs Number of PKGs
LED forward voltage, Vf is
changing depend on solder
temperature and biased current.
In case of module, parasitic
resistance of pcb board also
effects on LED forward voltage.
But middle power led operating
under 0.6W is less influenced by
that kind of parasitic resistance
rather than high power led
operating over 1W
The power consumption value
of table shows slightly change as
to each input current and
temperature.
These
fine
changes is from forward voltage
characteristics of single LED.
And solder material, assembly
process including SMT(surface
mount technologies) process
can effects on LED forward
voltage, and then power
consumption could be increased
by parasitic resistance factor.
Total Power Consumption [W]
70.0
200mA
60.0
50.0
150mA
40.0
30.0
100mA
20.0
50mA
10.0
0.0
1
6
12
24
48
50mA 25℃
0.3
1.7
3.4
6.9
13.8
50mA 50℃
0.3
1.7
3.4
6.8
13.5
50mA 75℃
0.3
1.7
3.3
6.7
13.3
50mA 90℃
0.3
1.6
3.3
6.6
13.2
100mA 25℃
0.6
3.6
7.2
14.5
29.0
100mA 50℃
0.6
3.5
7.1
14.2
28.4
100mA 75℃
0.6
3.5
6.9
13.9
27.9
100mA 90℃
0.6
3.4
6.9
13.8
27.6
150mA 25℃
0.9
5.6
11.2
22.5
45.1
150mA 50℃
0.9
5.5
11.0
22.0
44.1
150mA 75℃
0.9
5.4
10.8
21.6
43.2
150mA 90℃
0.9
5.3
10.7
21.4
42.8
200mA 25℃
1.3
7.7
15.4
30.9
61.9
200mA 50℃
1.3
7.5
15.0
30.2
60.5
200mA 75℃
1.2
7.4
14.8
29.6
59.4
200mA 90℃
1.2
7.3
14.6
29.4
58.8
Number of Packages
27
2500
2000
1500
1000
500
0
1
6
12
24
48
25℃
43
259
527
1062
2108
50℃
41
248
501
1011
2019
75℃
40
238
480
967
90℃
39
233
471
948
Luminous Efficacy [lm]
Total Luminous Flux [lm]
Luminous Flux vs Number of PKGs
Luminous Efficacy vs Number of PKGs
160
150
140
130
120
110
100
1
6
12
24
48
25℃
151
150
153
153
152
50℃
148
147
148
149
149
1927
75℃
144
143
144
145
145
1892
90℃
142
141
143
144
143
4000
3000
2000
1000
0
1
6
12
24
48
25℃
80
480
975
1953
3895
50℃
76
459
927
1866
3734
75℃
73
439
889
1787
90℃
72
429
869
1745
160
150
140
130
120
110
100
1
6
12
24
48
25℃
133
133
135
135
134
50℃
130
130
131
132
132
3572
75℃
127
127
128
128
128
3487
90℃
126
125
127
127
126
※ Each temperature means Ts temperature at solder point
28
6000
5000
4000
3000
2000
1000
0
1
6
12
24
48
25℃
113
677
1380
2762
5509
50℃
108
648
1314
2637
5277
75℃
103
620
1255
2525
90℃
100
600
1213
2440
160
150
140
130
120
110
100
1
6
12
24
48
25℃
120
121
123
123
122
50℃
118
118
120
120
120
5046
75℃
115
116
117
117
117
4877
90℃
113
113
114
114
114
7000
6000
5000
4000
3000
2000
1000
0
1
6
12
24
48
25℃
143
859
1749
3498
6976
50℃
137
824
1671
3348
6699
75℃
131
787
1595
3201
90℃
125
751
1525
3062
160
150
140
130
120
110
100
1
6
12
24
48
25℃
111
112
114
113
113
50℃
109
110
111
111
111
6399
75℃
106
107
108
108
108
6119
90℃
103
103
104
104
104
29
2000
1500
1000
500
0
1
6
12
24
48
25℃
36
216
439
885
1757
50℃
34
204
412
832
1661
75℃
32
193
390
786
90℃
31
188
380
766
130
120
110
100
90
80
1
6
12
24
48
25℃
126
125
127
128
127
50℃
121
121
122
123
123
1566
75℃
117
116
117
118
117
1528
90℃
115
114
115
116
116
4000
3000
2000
1000
0
1
6
12
24
48
25℃
71
426
866
1735
3460
50℃
67
403
814
1638
3278
75℃
63
381
771
1550
90℃
62
370
749
1503
130
120
110
100
90
80
1
6
12
24
48
25℃
118
118
120
120
119
50℃
114
114
115
116
116
3097
75℃
110
110
111
111
111
3004
90℃
108
108
109
109
109
30
5000
4000
3000
2000
1000
0
1
6
12
24
48
25℃
96
576
1175
2351
4689
50℃
91
545
1106
2219
4440
75℃
86
515
1043
2098
90℃
82
493
998
2008
130
120
110
100
90
80
1
6
12
24
48
25℃
102
103
105
104
104
50℃
99
100
101
101
101
4194
75℃
96
96
97
97
97
4013
90℃
93
93
94
94
94
6000
5000
4000
3000
2000
1000
0
1
6
12
24
48
25℃
121
726
1479
2957
5897
50℃
115
688
1396
2797
5598
75℃
108
650
1316
2641
90℃
102
610
1240
2489
130
120
110
100
90
80
1
6
12
24
48
25℃
94
94
96
96
95
50℃
91
92
93
93
93
5279
75℃
88
88
89
89
89
4975
90℃
84
84
85
85
85
31
2000
1500
1000
500
0
1
6
12
24
48
25℃
35
211
428
863
1713
50℃
35
208
420
848
1692
75℃
34
204
413
831
90℃
33
200
405
816
130
120
110
100
90
80
1
6
12
24
48
25℃
123
122
124
125
124
50℃
124
123
124
125
125
1656
75℃
124
123
124
125
124
1629
90℃
123
122
123
124
123
4000
3000
2000
1000
0
1
6
12
24
48
25℃
65
390
793
1588
3168
50℃
64
384
776
1562
3125
75℃
63
376
762
1532
90℃
61
369
747
1499
130
120
110
100
90
80
1
6
12
24
48
25℃
108
108
110
109
109
50℃
109
109
110
110
110
3062
75℃
109
109
110
110
110
2996
90℃
108
107
109
109
109
32
5000
4000
3000
2000
1000
0
1
6
12
24
48
25℃
92
550
1122
2244
4476
50℃
90
541
1097
2200
4403
75℃
88
529
1070
2152
90℃
86
517
1047
2106
130
120
110
100
90
80
1
6
12
24
48
25℃
98
98
100
100
99
50℃
99
99
100
100
100
4302
75℃
98
98
100
100
99
4208
90℃
98
97
98
98
98
6000
5000
4000
3000
2000
1000
0
1
6
12
24
48
25℃
116
698
1422
2843
5670
50℃
114
687
1393
2791
5585
75℃
112
670
1358
2725
90℃
109
656
1333
2676
130
120
110
100
90
80
1
6
12
24
48
25℃
90
91
92
92
92
50℃
91
92
93
92
92
5447
75℃
91
91
92
92
92
5348
90℃
90
90
91
91
91
33
4.1 Symmetric and asymmetric array for Package
1) Asymmetric of Lens
Lens
PKG Array
Light distribution
Result
0° ~ 180° : 26°
Lens
Target
90° ~ 270° : 28.8°
( 25° )
Asymmetric : 2.8°
0° ~ 180° : 40.4°
Lens
Target
90° ~ 270° : 43.4°
( 40° )
Asymmetric : 3°
- Array in one direction : Asymmetric
- Gap : 2.8° ~ 3°
34
4.1 Symmetric and asymmetric array for Package
2) Symmetric of Lens
Lens
PKG Array
Light distribution
Result
0° ~ 180° : 28°
Lens
Target
90° ~ 270° : 28°
( 25° )
Symmetric
0° ~ 180° : 42°
Lens
Target
90° ~ 270° : 42°
( 40° )
Symmetric
- Bi- Directional array : Symmetric
35
4.2 Lighting Example
1) MR16 – Lens Type
Product
MR16
Item
Data
Target Flux
( Lm )
250
LED PKG Q’ty
( Ea )
4
Power
Consumption
(W)
3
Replacement
Halogen 25W
Array
Light
distribution
Array
Light
distribution
2) PAR20 – Lens Type
Product
PAR20
Item
Data
Target Flux
( Lm )
400
LED PKG Q’ty
( Ea )
8
Power
Consumption
(W)
5.8
Replacement
Halogen PAR 20
36
3) PAR30 – Lens Type
Product
PAR30
Item
Data
Target Flux
( Lm )
700
LED PKG Q’ty
( Ea )
12
Power
Consumption
(W)
8.7
Replacement
Halogen PAR 30
Array
Light
distribution
Array
Light
distribution
4) Bulb – Diffuser Cap Type
Product
Bulb
1000lm
Item
Data
Target Flux
( Lm )
1000
LED PKG Q’ty
( Ea )
16
Power
Consumption
(W)
11.6
Replacement
Halogen 75W
Lamp
37
5) DLE(Down light Engine ) -12W
Product
Down
light
Engine
Item
Data
Target Flux
( Lm )
1037
LED PKG Q’ty ( Ea )
16
Power Consumption
(W)
11.6
Replacement
Samsung DLE 20W
With diffuser
Array
6) DLE(Down light Engine ) – 21W
Product
Down
light
Engine
Item
Data
Target Flux
( Lm )
1776
LED PKG Q’ty ( Ea )
28
Power Consumption
(W)
20.2
Replacement
Samsung DLE 30W
With diffuser
38
Array
4.3 Lens Solution
Baikang (www.baikang.cn)
Product Code
Type
BK-LED-767
8 in1
Beam
Angle
17 °
Material
Size(mm)
Application
PMMA
Φ80*11.08
PAR30 / PAR38
39
Picture
4.3 Lens Solution
OK Lens (www.lensled.com)
Product Code
OK-L91CR0925Z 111
OK-L91CR0940Z 112
OK-L73CR0625Z 109
OK-L73CR0640Z 110
OK-L32CR0530J
Type
Beam
Angle
Material
Size(mm)
Application
9 in1
25°
PMMA
Φ90.6*18.5
PAR30 / PAR38
9 in1
40 °
PMMA
Φ90.6*18.5
PAR30 / PAR38
6 in1
25 °
PMMA
Φ73.3*15.4
PAR30
6 in1
40 °
PMMA
Φ73.3*15.4
PAR30
5 in 1
50 °
PMMA
Φ32*7.5
MR16 / GU10
40
Picture
5.1.1 Handling Guide
Please use tweezers to grab MP36S at the base. Do not
touch the silicon mold side with the tweezers or fingers.
Correct Handling
Incorrect Handling
41
5.1.2 Recommended Land Pattern
42
5.1.3 SMT Set
 Taping
Start
End
More than 40 mm
Unloaded tape
Mounted with More than 100~200)mm Leading part more than
Flash LED
Unloaded tape
(200~400)mm
(1) Quantity : The quantity/reel to be 4,000 pcs.
(2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2㎜
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7 N when the cover tape is turned off
from the carrier tape at 10℃ angle to be the carrier tape.
(4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package
43
5.1.4 Reflow Profile
 Reflow conditions and work guide
Below reflow profile is recommended for reflow soldering.
Conditions can be changed in various soldering equipment and PCB.
It is recommended that users follow the reflow guide line of a solder
manufacturer
 For Manual Soldering
Not more than 5 seconds @MAX300 ℃, under soldering iron.
44
 Injurious chemicals to SLED MP36S silicone
LM362A
45
 Packing guide (After SMT)
1
2
3
1) Use the PP or PET tray
(Corrugated paper tray is NOT allowed)
2) Include the silica gel
3) Block Sulfur from the outside (using the anti-static vinyl)
※ Recommended wrapping paper box is PP.
(If corrugated paper Box is used, Sulfur must be less than 850ppm)
[anti-static vinyl]
PE
MBB-80
-
Best
Alternative
Tray
PP
PET
Anti-static vinyl
MBB
PE
Out Box
PP
Corrugated paper box
(less than 850PPM)
46
 Type & cause of Ag L/F discoloration
Discoloration
example
Ag2S
The material
of cause
Sulfur
/ Sulfur compound
AgCl
Primary source
Penetration route
Organic rubber,
Penetrate the silicon,
Corrugated paper,
interface between
Solder cream
L/F and Reflector
Cl
FR1(PCB),
/ Cl compound
NH4Cl
Diffusion of Corrosive Gas
(H2S, Cl2)
Penetrate the silicon
interface between
L/F and Reflector
Result of Ag2S, AgCl creation
1. Luminance aging
2. Color Shift
3. Bonding strength is
Silicon
Chip
Reflector
Ag plating layer
Lead Frame (Cu)
47
weaken between
silicon and Ag Layer
 The example of organic rubber failure (5630PKG)
Partial PKG discoloration
due to organic rubber
* Refer the below revised specification
Risk of Sulfurization (or Tarnishing)
Samsung LED's lead frame based package products (such as mid
power and HV AC) contain silver (Ag) plated lead frames. Silver may
turn black (or tarnish) when exposed to substances such as sulfur,
chlorine, or other halogen compounds.
Sulfurization of the lead frame may result in reduction of lumen output,
color shift and an open circuit in some extreme cases.
Do not store or use such lead frame LED's together with oxidizing
substances listed above.
The following examples could be sources of such substances: rubber,
corrugate paper, solder cream etc.
48
 The example of Corrugated paper Tray failure(5252 PKG)
PKG
Sulfurization
The result of corrugated
paper EDX analysis,
Sulfur is included more
than 1,700 PPM
49
 Consideration of S/Cl noxious properties by PCB
Test / Condition
TGA
(Thermogravimetric
analysis)
IC
(Ion Chromatography)
Conclusion
CEM1
CM1
FR4
FR1
The mass reduction from
initial state
(Roomtemperature~280℃)
4%
< 1%
25%
The mass reduction from
initial state
(Stored 1hr @280℃)
29%
24%
35%
-
-
69.4
The Cl quantity that eluted
by water
(Unit : ug / PCB)
• Normal PCB : When the PCB is heated by 280℃,
the heat resistance is good.
• Faulty PCB : When the PCB is heated by 280℃, 25%
of the weight lose out.
So, a lot of out gas is detected,
and plenty of Cl is detected.
FR1
The result of FR1 EDX analysis,
Cl ingredient is included more
than 30,000 PPM
50
 Conclusion
Samsung LED's lead frame based package products (such as mid
power and HV AC) contain silver (Ag) plated lead frames. Silver may
turn black (or tarnish) when exposed to substances such as
sulfur, chlorine, or other halogen compounds.
Sulfurization of the lead frame may result in reduction of lumen
output, color shift and an open circuit in some extreme cases.
Do not store or use such lead frame LED's together with oxidizing
substances listed above.
The following examples could be sources of such substances:
rubber, corrugate paper, solder cream etc.
51
6.2 Discoloration of LED in operation
Volatile organic chemicals can make the fast degradation
of luminous flux in LED lightings.
This phenomena locally should occur in physically closed
system, which means space without air movement. The
operation of LED should lead to elevate temperature in
close system. In two conditions, the volatile organic
chemicals can vaporize and diffuse in the system.
This diffusion of VOCs can affect normal operation in LEDs.
The bulbs in below figure shows the discoloration of LED in
bulbs and the inner surface of itself.
Discoloration of LED
Normal LED Bulbs
Abnormal LED Bulbs
Clear
chips
52
Black
colored
chips
6.2 Discoloration of LED_ Cause
Conditions
1.Generation of VOCs
- VOC(volatile organic compounds)s possibly can generate from the
silicone encapsulant itself and other materials, such as glue(sealing
material), conformal coating, O-ring and potting materials.
2. Enveloped in Closed system(Sealed system without air movement)
- In any sealed system, the vapor of VOC can diffuse in entire closed
system.
3. Diffusion of VOCs
- VOCs can diffuse into the silicone encapsulant of LED, which should
result from the weak binding force between molecules. And the
free space within silicone is helpful to the diffusion of VOCs .
The weak binding energy and the free space is related with cured
silicone. This means the more gas-permeable state. The black color
just on the surface of LED chip is the where highest temperature.
Black colored
surface of LED chip
53
6.2 Discoloration of LED_ Reversibility
- The discolor in LED can disappear during the normal operation in ambient
atmosphere. (below table)
- It seems that VOCs can outgas from the inside of encapsulant.
- The reversible reaction should demonstrate that VOCs could not
chemically react with any parts in LED
[Table] Recovery of appearance in discolored LED
Time(hr)
spl1
spl2
0
24
48
72
96
120
144
168
54
spl3
spl4
spl5
6.2 Discoloration of LED_ Solutions
Recommending Open System Design for Free Air Ventilation
: Easy to outgas VOCs(Contaminating materials on LED)
- When customer use adhesive for cover, please secure open system as
shown below.
Full Dotting
(Not Recommended)
Partial Dotting
(Recommended)
Recommending Expansion of Contact Area for Efficient Heat
Transfer
: To control acceleration of contamination in accordance with
temperature
PKG Fixing
Plate
Contact Area
(Not Recommended)
Side View
Case
Enlarged View
Contact Area
(Recommended)
Substances Information inducing VOCs
Source : XLAMP Chemical
Compatibility(CREE Inc.)
6.2 Discoloration of LED_ Example
Minimizing factor and environment of contamination
Epoxy Adhesive
Transformation of Adhesive Material in
accordance with temperature
Example of using
epoxy adhesive
- Please use silicon affiliated adhesive at a minimum quantity.
- Flux(Rosin) in solder paste when combining wire to
PCB can make discoloration on LED by thermal and
lighting acceleration factor.
We recommend cleaning procedure using
IPA(Isopropyl Alcohol) after soldering.
62
6.2 Discoloration of LED_ Example
Designing efficient thermal Design
- Inefficient thermal design makes increasing of temperature. And it make
acceleration and becoming permanent of contamination.
- Samsung recommends all-in-one heat sink type to control redundant
chemical material and secure efficient thermal design. All-in-one type is
excellent for heat transfer function. Please refer to below pictures
All-in-one Heat Sink Design of
Samsung E17 Base Bulb
- Buck converter of good efficiency also helps keeping down of temperature.
63
Writer
Date
Revision History
2012.08.03
New Version
64
Drawn
Approved
Y.J. Lee
D.M. Jeon

LM362A

Transcription

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