Automotive Electronics Product Information

Automotive Electronics
Product Information
MB0405A
MOSFET B6 bridge for BLDC drives
Product in development
Features
 Robust, molded module solution for BLDC motors in
engine cooling, HVAC, Automatic transmission actuators
and others.
 Normal level MOSFETs, 40V (optional 60V or 80V),
N-Channel-Type, 100% avalanche tested
Customer benefits:
 B6 bridge MOSFET module with integrated shunt and
slug-up cooling
 Quick mounting
 Improves system safety and system reliability
 50% less space compared to discrete solution
 Shunt resistor in common ground path
 On-chip temperature sensor (optional)
 Optimized internal impedances for reduced voltage
overshoot and better phase balance
 Optimized thermal connection for just one contact area
per module
 SMT package for standard PCB mounting
 Narrow mechanical tolerances for slug-up on pcb:
opposite side of pcb can be fully utilized.
 ROHS compliant, halogen-free
The compact MB0405A is designed to drive 3-phase BLDC
motors.
The modules is specifically designed for environments
where high currents have to be handled, space is limited,
Product Overview
Parameter
Value
heat dissipation is critical and high reliability is a must.
Package and Semiconductors have been developed by
Bosch, the expert for automotive electronics.
MB0405A is part of Bosch’s new range of MCPP (Multi-chip
Power Package) modules.
Maximum Drain Source
voltage
DC drain current
On-state resistance
On-chip temperature
sensor (optional)
Shunt resistance
(customer specific)
Operating temperature
VDS
40
V
ID
50
30
A
Ron
3.2
9
mΩ
Tk
-4.71
mV/K
RS
1
2
Tj
-40 .. +175
mΩ
°C
Automotive Electronics | MB0405A – MOSFET B6 bridge for BLDC drives
Block Diagram
Key parameters
MOSFETs
Pulsed drain current ID,pulse
typ.
Value
Unit
t.b.d.
A
Gate source voltage VGS
+/- 20
V
Total Gate Charge Qg
t.b.d.
nC
<300
W
t.b.d.
W
(Tc=25°C)
Power dissipation Ptot
(TC=25°C)
Power dissipation Ptot
(THS=25°C, RthJ-HS=4.4K/W in test
application)
Pinout
Package
TQFP package, SMD technology
18 mm (L) x 18 (W) x 2 mm (H)
Soldering / Mounting:
Reflow soldering
Thermal contact to heatsink (e.g. metal housing) via
insulating thermal grease material
Spacer on cooling surface for thermal interface thickness
control
Samples:
Engineering samples are available from Q1/2015
Regional sales
Europe/Japan
USA/Canada
China
Korea
contacts
bosch.semiconductors@de.bosch.com
bosch.semiconductors@us.bosch.com
bosch.semiconductors@cn.bosch.com
bosch.semiconductors@kr.bosch.com
www.bosch-semiconductors.com
www.bosch-sensors.com
Robert Bosch GmbH
AE/MKC
Postfach 13 42
72703 Reutlingen
Germany
www.bosch.de
© Robert Bosch GmbH 12/2014. All rights reserved, also regarding any disposal, exploitation, reproduction, editing, distribution, as well as in the event of applications
for industrial property rights. The information provided is for information purposes only and does not constitute a legal obligation or a warranty, express or implied,
concerning quality, marketability or suitability for a specific purpose. The designs incorporated in vehicles and the performance of the designs may vary depending on
the vehicle manufacturer's specifications and requirements for the product. We reserve the right to make product changes, adaptations and modifications without
prior notice.