Chipbond Technology
Transcription
Chipbond Technology
Test & Assembly│Taiwan April 6, 2015 COMPANY NOTE Chipbond Technology 6147 TT / 6147.TWO Market Cap Avg Daily Turnover Free Float US$1,333m US$10.83m 84.2% NT$41,287m NT$341.6m 648.4 m shares Current NT$63.60 Target NT$72.00 Prev. Target NT$63.00 Up/Downside 13.2% Conviction| Connected with resolution rides Notes from the Field ———————————————————————————————————————— James CHEN T (886) 2 8729 8382 E james.chen@cimb.com Eric LIN T (886) 2 8729 8380 E eric.lin@cimb.com Company Visit Channel Check Expert Opinion Customer Views ———————————————————————————————————————— Show Style "View Doc Map" Contents BACKGROUND ................................................................... 5 OUTLOOK ............................................................................ 7 RISKS................................................................................. 11 FINANCIALS ...................................................................... 12 VALUATION AND RECOMMENDATION .......................... 12 Price Close 115.0 65.0 107.0 60.0 99.0 55.0 91.0 50.0 83.0 45.0 30 75.0 Vol m 20 10 Jul-14 Oct-14 Jan-15 Source: Bloomberg 52-week share price range 63.60 68.20 47.20 72.00 Current Target We reinitiate Chipbond with an Add rating and a NT$72 target, based on 2.1x CY15 EV/CE on a mid-term ROCE assumption of 15.1%. As the world’s largest driver IC backend services provider with a 45% market share, Chipbond is poised to benefit from the continued uptrend in 4K TVs and the resolution upgrades in smartphones. The company’s margin expansion is mounted over an increasing utilisation rate, the bottoming of Simpal’s tape business and the potential growth engines from TDDIs/PMICs. After years of market consolidation, Chipbond remains the leading DDI backend service provider with 45% global market share. Under an oligopolistic market structure and stable pricing outlook, we are positive on Chipbond, with the optimistic outlook driven by the resolution upgrades in TV and Mobiles. 4K TVs lift DDI demand TV accounted for 50% of Chipbond’s sales in FY14. We forecast Chipbond’s TV sales to grow more than 20% yoy in anticipation of a doubling of 4K penetration rate to 16% in 2015. As there is no aggressive capex ahead for bumping capacity, we believe that a severe pricing deterioration in the DDI backend industry is unlikely in FY15. We expect the strong TV DDI orders to improve the company’s utilisation rate, prompt Simpal profitability and advance overall gross margin expansion by 2.6% pts to 26.7% in FY15. iPhone growth sustained The mobile segment took 25% of Chipbond’s sales in FY14. Chipbond probably remained the sole backend service provider for next-gen iPhones and we expect Chipbond to enjoy 19% shipment growth in FY15. We forecast Apple’s sales contribution to account for 15% of total sales in 2015, compared to 14% in 2014. In the near term, the decline for iPhones is likely to slow down to c.5% qoq in 2Q15 compared to a 14-17% qoq decline during the past two years. Reinitiate with Add Chipbond trades at 1.7x FY15 P/BV vs. its 5-year average of 1.8x. Its share price is up 8.3% YTD, outperforming the panel stocks amid the recent noise over the TV panel price. Downside should be limited due to solid fundamentals on the 4K story. We reinitiate the stock with an Add rating and target price of NT$72, which implies a 13% upside. Financial Summary Relative to TAIEX (RHS) 70.0 Apr-14 | Revenue (NT$m) Net Profit (NT$m) Normalised EPS (NT$) Normalised EPS Growth FD Normalised P/E (x) Price To Sales (x) DPS (NT$) Dividend Yield EV/EBITDA (x) P/FCFE (x) Net Gearing P/BV (x) ROE % Change In Normalised EPS Estimates Normalised EPS/consensus EPS (x) Dec-13A 15,811 2,501 4.14 (4.4%) 15.81 2.43 2.79 4.39% 8.64 5.74 24.1% 1.88 12.6% Dec-14A 17,683 2,550 3.95 (4.6%) 16.18 2.32 2.66 4.19% 7.77 NA 18.9% 1.78 11.3% Dec-15F 19,879 3,183 4.93 24.8% 12.97 2.07 3.32 5.23% 6.46 13.46 12.5% 1.68 13.3% (5.3%) 1.01 Dec-16F 22,623 3,712 5.75 16.6% 11.12 1.81 3.88 6.09% 5.35 8.40 1.5% 1.58 14.6% (17.6%) 1.01 Dec-17F 23,684 3,823 5.92 3.0% 10.80 1.73 3.99 6.28% 4.74 7.26 (9.7%) 1.50 14.2% SOURCE: CIMB, COMPANY REPORTS IMPORTANT DISCLOSURES, INCLUDING ANY REQUIRED RESEARCH CERTIFICATIONS, ARE PROVIDED AT THE END OF THIS REPORT. Designed by Eight, Powered by EFA Chipbond Technology│Taiwan April 6, 2015 PEER COMPARISON Research Coverage Bloomberg Code 2311 TT 6147 TT 3034 TT 2325 TT Advanced Semiconductor Chipbond Technology Novatek Microelectronics Corp Siliconware Precision Market TW TW TW TW Recommendation HOLD ADD ADD REDUCE Rolling P/BV (x) Target Price 47.00 72.0 194.0 52.0 Upside 10.1% 13.2% 18.3% 0.8% 30.0 4.00 25.0 3.50 3.00 20.0 2.50 15.0 2.00 1.50 10.0 1.00 5.0 0.50 Jan-12 Jan-13 Jan-14 0.0 Jan-11 Jan-15 Jan-12 Jan-13 Jan-14 Jan-15 Advanced Semiconductor Chipbond Technology Advanced Semiconductor Chipbond Technology Novatek Microelectronics Corp Siliconware Precision Novatek Microelectronics Corp Siliconware Precision Peer Aggregate: P/BV vs ROE Peer Aggregate: 12-mth Fwd FD P/E vs FD EPS Growth 2.50 20.0% 2.00 16.0% 1.50 12.0% 1.00 8.0% 0.50 0.00 Jan-11 Price 42.70 63.6 164.0 51.6 12-month Forward Rolling FD P/E (x) 4.50 0.00 Jan-11 Mkt Cap US$m 10,838 1,333 3,222 5,192 4.0% 0.0% Jan-12 Jan-13 Rolling P/BV (x) (lhs) Jan-14 Jan-15 18.0 70% 16.0 59% 14.0 48% 12.0 37% 10.0 26% 8.0 14% 6.0 3% 4.0 -8% 2.0 -19% 0.0 Jan-11 Jan-16 ROE (See Footnote) (rhs) -30% Jan-12 Jan-13 Jan-14 12-mth Fwd FD P/E (x) (See Footnote) (lhs) Jan-15 Jan-16 FD EPS Growth (See Footnote) (rhs) Valuation Advanced Semiconductor Chipbond Technology Novatek Microelectronics Corp Siliconware Precision FD P/E (x) (See Footnote) Dec-14 Dec-15 Dec-16 14.85 13.27 12.04 16.18 12.97 11.12 14.17 12.48 11.16 14.99 13.24 12.46 Dec-14 2.24 1.78 3.56 2.27 P/BV (x) Dec-15 2.09 1.68 3.20 2.19 Dec-16 1.95 1.58 2.95 2.10 Dec-14 7.28 7.77 10.16 6.36 EV/EBITDA (x) Dec-15 6.47 6.46 8.69 5.66 Dec-16 5.66 5.35 7.88 5.06 Dec-16 16.7% 14.6% 28.1% 17.2% Dividend Yield Dec-14 Dec-15 4.43% 4.75% 4.19% 5.23% 3.66% 4.27% 5.82% 6.17% Dec-16 5.23% 6.09% 4.92% 6.59% Growth and Returns Advanced Semiconductor Chipbond Technology Novatek Microelectronics Corp Siliconware Precision FD EPS Growth Dec-14 47.9% -2.3% 51.2% 82.9% (See Footnote) Dec-15 Dec-16 11.9% 10.2% 24.8% 16.6% 13.6% 11.8% 13.2% 6.2% ROE (See Footnote) Dec-14 Dec-15 17.2% 16.3% 11.3% 13.3% 27.3% 27.6% 16.1% 16.7% SOURCE: CIMB, COMPANY REPORTS Calculations are performed using EFA™ Monthly Interpolated Annualisation and Aggregation algorithms to December year ends. NPAT/EPS values for calculations and valuations are based on recurring and normalised values for GAAP and IFRS accounting standard companies respectively. 2 Chipbond Technology│Taiwan April 6, 2015 BY THE NUMBERS Share price info Share px perf. (%) Relative Absolute 1M 5.8 5.8 3M 6.6 9.7 Major shareholders 12M 9.3 17.1 % held Compal Electronics, Inc. 5.6 Cathay Life Insurance Co., Ltd. 5.1 Nan Shan Life Insurance Co., Ltd. 4.9 P/BV vs ROE 12-mth Fwd FD Normalised P/E vs FD Normalised EPS Growth 3.00 25.0% 25.0 300% 2.50 20.8% 20.0 220% 2.00 16.7% 15.0 140% 1.50 12.5% 1.00 8.3% 10.0 60% 0.50 4.2% 5.0 -20% 0.00 Jan-11 Jan-12 Jan-13 Jan-14 Jan-15 Jan-16 0.0% 0.0 Jan-11 Jan-12 Jan-13 Jan-14 Jan-15 Jan-16 -100% Rolling P/BV (x) (lhs) 12-mth Fwd Rolling FD Normalised P/E (x) (lhs) ROE (See Footnote) (rhs) Diluted Normalised EPS Growth (rhs) Profit & Loss Simpal reported net loss of around NT$520m in 2014 (NT$0.8 loss per share). (NT$m) Total Net Revenues Gross Profit Operating EBITDA Depreciation And Amortisation Operating EBIT Financial Income/(Expense) Pretax Income/(Loss) from Assoc. Non-Operating Income/(Expense) Profit Before Tax (pre-EI) Exceptional Items Pre-tax Profit Taxation Exceptional Income - post-tax Profit After Tax Minority Interests Preferred Dividends FX Gain/(Loss) - post tax Other Adjustments - post-tax Preference Dividends (Australia) Net Profit Normalised Net Profit Fully Diluted Normalised Profit Dec-13A 15,811 3,816 5,153 (2,448) 2,705 45 0 506 3,255 Dec-14A 17,683 4,260 5,971 (2,970) 3,001 341 0 117 3,458 Dec-15F 19,879 5,307 6,985 (3,078) 3,907 375 0 0 4,282 Dec-16F 22,623 6,187 7,940 (3,345) 4,596 375 0 0 4,971 Dec-17F 23,684 6,406 8,310 (3,570) 4,741 375 0 0 5,116 3,255 (648) 3,458 (815) 4,282 (998) 4,971 (1,159) 5,116 (1,193) 2,607 (106) 2,643 (94) 3,284 (100) 3,812 (100) 3,923 (100) 2,501 2,607 2,501 2,550 2,643 2,550 3,183 3,284 3,183 3,712 3,812 3,712 3,823 3,923 3,823 Cash Flow Chipbond is guiding for NT$2bn capex for 2015, of which 60-70% is budgeted for chip probers to fulfil the demand of the PPI upgrades in mobiles. (NT$m) EBITDA Cash Flow from Invt. & Assoc. Change In Working Capital (Incr)/Decr in Total Provisions Other Non-Cash (Income)/Expense Other Operating Cashflow Net Interest (Paid)/Received Tax Paid Cashflow From Operations Capex Disposals Of FAs/subsidiaries Acq. Of Subsidiaries/investments Other Investing Cashflow Cash Flow From Investing Debt Raised/(repaid) Proceeds From Issue Of Shares Shares Repurchased Dividends Paid Preferred Dividends Other Financing Cashflow Cash Flow From Financing Total Cash Generated Free Cashflow To Equity Free Cashflow To Firm Dec-13A 5,153 Dec-14A 5,971 Dec-15F 6,985 Dec-16F 7,940 Dec-17F 8,310 (507) (1,294) (240) (306) 1,082 45 (648) 5,890 (3,531) 50 0 (1,865) (5,346) 6,349 0 0 (1,551) 389 341 (815) 5,378 (1,280) 17 0 (2,813) (4,076) (1,801) 0 0 (1,686) 0 375 (998) 5,067 (2,000) 0 0 0 (2,000) 0 0 0 (1,719) 0 375 (1,159) 6,917 (2,000) 0 0 0 (2,000) 0 0 0 (2,146) 0 375 (1,193) 7,187 (1,500) 0 0 0 (1,500) 0 0 0 (2,502) (3,412) 1,387 1,930 6,893 690 1,262 (2,226) (924) (499) 1,536 0 (1,719) 1,348 3,067 3,267 0 (2,146) 2,771 4,917 5,117 0 (2,502) 3,185 5,687 5,887 258 SOURCE: CIMB RESEARCH, COMPANY 3 Chipbond Technology│Taiwan April 6, 2015 BY THE NUMBERS Balance Sheet Chipbond merged Simpal on Oct 13, with 52 m shares issued (8% dilution). (NT$m) Total Cash And Equivalents Total Debtors Inventories Total Other Current Assets Total Current Assets Fixed Assets Total Investments Intangible Assets Total Other Non-Current Assets Total Non-current Assets Short-term Debt Current Portion of Long-Term Debt Total Creditors Other Current Liabilities Total Current Liabilities Total Long-term Debt Hybrid Debt - Debt Component Total Other Non-Current Liabilities Total Non-current Liabilities Total Provisions Total Liabilities Shareholders' Equity Minority Interests Total Equity Dec-13A 7,006 4,130 1,272 4,088 16,496 13,923 28 0 7,783 21,733 4,872 762 932 1,717 8,283 6,826 Dec-14A 6,129 4,809 1,030 7,283 19,251 12,903 10 0 7,928 20,842 5,828 0 862 3,956 10,647 4,830 Dec-15F 7,477 6,010 1,430 7,283 22,200 11,857 10 0 7,897 19,764 5,828 0 1,169 3,956 10,954 4,830 Dec-16F 10,248 6,248 1,477 7,283 25,257 10,543 10 0 7,865 18,419 5,828 0 1,215 3,956 10,999 4,830 Dec-17F 13,434 6,545 1,550 7,283 28,811 8,505 10 0 7,834 16,350 5,828 0 1,278 3,956 11,062 4,830 479 7,304 0 15,587 21,983 659 22,642 652 5,482 0 16,129 23,165 798 23,963 652 5,482 0 16,436 24,630 899 25,528 652 5,482 0 16,482 26,196 999 27,195 652 5,482 0 16,545 27,517 1,099 28,616 Dec-13A 5.3% (8.7%) 32.6% (8.41) 33.91 18.47 19.9% 67.4% 97.60 36.61 25.34 10.4% 9.8% Dec-14A 11.8% 15.9% 33.8% (6.98) 35.69 12.80 23.6% 67.4% 92.26 31.30 24.40 7.9% 10.3% Dec-15F 12.4% 17.0% 35.1% (4.90) 37.94 19.53 23.3% 67.4% 99.33 30.81 25.44 10.1% 12.7% Dec-16F 13.8% 13.7% 35.1% (0.63) 40.35 22.98 23.3% 67.4% 99.16 32.37 26.54 11.7% 14.0% Dec-17F 4.7% 4.7% 35.1% 4.28 42.39 23.70 23.3% 67.4% 98.58 31.97 26.33 12.6% 13.8% Dec-13A N/A 7.6% N/A N/A N/A -9.2% N/A N/A Dec-14A N/A 3.7% N/A N/A N/A 10.2% N/A N/A Dec-15F N/A 11.8% N/A N/A N/A 9.1% N/A N/A Dec-16F N/A 21.2% N/A N/A N/A 20.8% N/A N/A Dec-17F N/A 10.8% N/A N/A N/A 16.2% N/A N/A Key Ratios Our assumption of 20% growth in TV, 12% growth in mobile, and 6-8% yoy decline in IT and tablet lead to a forecast of 12.4% growth for 2015 sales. Revenue Growth Operating EBITDA Growth Operating EBITDA Margin Net Cash Per Share (NT$) BVPS (NT$) Gross Interest Cover Effective Tax Rate Net Dividend Payout Ratio Accounts Receivables Days Inventory Days Accounts Payables Days ROIC (%) ROCE (%) Key Drivers ASP Change (%, Main Product) Unit sales growth (%, main prod) No. Of Lines (main Product) Rev per line (US$, main prod) ASP chg (%, 2ndary prod) Unit sales grth (%, 2ndary prod) No. Of Lines (secondary Product) Rev per line (US$, 2ndary prod) SOURCE: CIMB RESEARCH, COMPANY 4 Chipbond Technology│Taiwan April 6, 2015 Moving with res-migration BACKGROUND Oligopolistic in DDI backend service Chipbond specialises in backend packaging and testing for display driver IC (DDI) and intends to diversify its product lines into power management chip (PMIC) and touch display driver IC (TDDI) in 2015 and beyond. After years of market consolidation, the leading two DDI packaging/testing houses, Chipbond and ChipMOS (8150.TT, NR), together have 70% of the market (Chipbond: 45%; ChipMOS: 25%). The rest goes to Korean plays such as Nepes (033640.KS, NR) with 18% share and LB Semicon (061970.KS, NR) with 4% share. Chipbond’s revenues registered sequential growth throughout 2014, thanks to the 3.2% annual growth in worldwide TV panels and the 27% unit growth in global smartphones. Figure 1: Peer comparisons Companies Recomm. Mkt cap (US$bn) Price (Local cur) EBITDA Margin (%) ROE (%) P/E (x) P/BV (x) EV/EBITDA FY14 FY15 FY16 FY14 FY15 FY16 FY14 FY15 FY16 FY14 FY15 FY16 FY14 FY15 FY16 Chipbond ADD 1.3 63.6 33.8 35.1 35.1 11.1 13.0 14.2 16.1 12.9 11.1 1.8 1.7 1.6 7.8 6.5 5.3 ChipMOS n.a. 1.2 44.0 30.7 31.5 30.8 16.3 17.2 17.5 12.4 11.6 10.4 2.1 1.9 1.7 5.2 4.8 4.2 Nepes n.a. 176.9 8,860.0 14.2 18.8 21.2 -6.1 12.9 17.0 -27.6 12.1 8.0 1.6 1.4 1.2 7.8 4.8 3.6 SPIL REDUCE 5.2 51.6 31.6 33.5 34.1 15.3 16.4 16.8 14.8 13.3 12.5 2.3 2.2 2.1 6.4 5.7 5.1 ASE HOLD 10.8 42.7 21.5 20.4 20.9 15.1 15.1 15.5 14.9 13.8 12.5 2.2 2.1 1.9 7.3 6.5 5.7 AUO ADD 4.9 15.8 19.4 20.0 18.2 10.0 10.1 6.2 8.4 7.7 12.3 0.8 0.8 0.8 2.9 2.7 3.0 Innolux ADD 5.0 15.6 20.8 21.1 18.5 9.1 9.7 5.7 6.9 6.2 9.6 0.6 0.6 0.5 2.4 2.0 1.7 Novatek ADD 3.2 164.0 15.4 15.5 15.8 25.7 26.3 27.0 13.9 12.2 10.9 3.6 3.2 2.9 10.2 8.7 7.9 SOURCE: CIMB RESEARCH, COMPANY Compared to other Taiwan OSAT companies such as ASE (2311.TT, Hold) and SPIL (2325.TT, Reduce), Chipbond and ChipMOS are deeply rooted in DDI backend services and their growth drivers are, therefore, different from those for ASE and SPIL. ASE is strengthening its System-in-Package (SiP) capabilities and expects to drive growth in wearable and automotive applications. SPIL, on the other hand, is likely to invest in additional capacities for flip chip and bumping, which will hinge on volume from communication and game consoles. The material, process and equipment used in DDI packaging are not compatible with that used in ASE and SPIL, leading to an oligopolistic market structure (Chipbond and ChipMOS) with limited competition. Given the high level of product concentration (90% display-related), Chipbond’s revenues are strongly correlated with the rise and fall of the panel industry. Chipbond’s top-tier clients include Novatek, Himax, Raydium and Renesas which make up nearly 53% of the global DDI market and together contributed 60-65% of Chipbond’s sales. Chipbond is the industry leader with 48% bumping capacity. We believe that severe pricing deterioration in the DDI backend market is unlikely in the next 12 months, considering that Chipbond is operating in an oligopolistic market and there is no aggressive capex ahead for bumping capacity. In terms of sales breakdown, Chipbond’s 2014 revenue was 50%, 25%, 15% and 10% generated by TV, mobile, IT and tablet applications, respectively. In terms of process, Chipbond’s 2014 revenue was 28%, 23%, 16%, 13%, 11% and 9% derived from 8-inch bumping, Chip-on-Film (COF), Tape, 12-inch bumping, Chip-on-Glass (COG) and testing services (see Figures 2 & 3). Since Chipbond has mitigated the gold price fluctuation risk to clients years ago, the company’s earnings quality will depend on the capacity utilisation rate (CUR) and forex rate. 5 Chipbond Technology│Taiwan April 6, 2015 Figure 2: Product mix in 2014A-2015F Figure 3: Technology breakdown in 2014A-2015F 100% 100% 90% 80% 12% 15% 10% 70% 60% 9% 10% 11% 10% 13% 11% 16% 17% 23% 25% 28% 28% 2014A 2015F 90% 8% 80% 70% 25% 25% 60% 50% 50% 40% 40% 30% 30% 54% 50% 20% 20% 10% 10% 0% 0% 2014 2015F TV Mobile IT 8" bumping Tablet COF Tape 12" bumping SOURCE: CIMB RESEARCH, COMPANY The bumping material, process and the equipment used in DDI packaging are not compatible with that used in other OSAT peers (such as ASE & SPIL), leading to an oligopoly (Chipbond and ChipMOS) with limited competition. COG Testing SOURCE: CIMB RESEARCH, COMPANY Figure 4: Display driver backend suppliers’ market share Chipbond ChipMOS Nepes LB Semicon Others SOURCE: CIMB RESEARCH, COMPANY Acquired Simpal to ensure tape sourcing stability Chipbond believes that the 4K TV boom will lead to a supply constraint in tape material and hopes that the favourable pricing will accelerate Simpal’s breakeven. Chipbond's decision to acquire Simpal in 2013 was aimed at securing tape sourcing stability for COF packaging. Simpal should become more integrated to offer a better cost structure to its customers. Due to the low yield and low loading rate, this deal may looks dilutive as Simpal had reported a net loss of around NT$520m, leading to NT$0.8 loss per share in FY14. Moving forward, we expect the 4K TV uptrend to improve Simpal’s business, helping the 100%-held subsidiary to bottom out in 2H15. In the near term, Chipbond targets to improve Simpal’s production yield from 80% to 90% and expects to pass customer qualification by 2Q15. 6 Chipbond Technology│Taiwan April 6, 2015 Figure 5: Illustration of Chipbond’s business segments Tape TV 8-inch bumping Chip on Film testing 12-inch bumping Mobile/Tablet/NB Chip on Glass SOURCE: CIMB RESEARCH, COMPANY Disciplined capacity expansion We estimate that gross margin will improve 0.8-1.0% pts yoy if capex/sales is maintained at 10% and depreciation & amortisation/sales is reduced to 15% in FY15 (vs. 17% in FY14). In 2014, Chipbond’s and ChipMOS’s capex declined 43% to NT$3.9bn in total and Chipbond’s capex/sales ratio fell 15% pts to 7% in 2014. For 2015, Chipbond is guiding for NT$2bn in capex, of which 60-70% is budgeted for wafer probers to deal with the longer testing time arising from growing IC complexity. Chipbond’s FY14 depreciation was around NT$3.0bn and the company projects FY15’s depreciation to stay at a broadly similar level of NT$2.9bn as the 8-inch bumping lines are probably fully depreciated. Strong iPhone offset soft TV demand in 4Q14 In all, the buoyant mobile demand likely offset the downward adjustment in large-sized panels and thus sustained margins with the better product mix in 4Q14. Chipbond disclosed a 4Q14 EPS of NT$1.29 on revenue of NT$4.5bn. Gross margin came in at 25.9%, compared to 26.0% in 3Q14. Chipbond’s Chip-on–Glass (COG) utilisation rose 3% pts qoq to 88% and the 12-inch gold bumping lines operated at full capacity (c. 103%) in 4Q14, thanks to Chipbond’s major customer, Renesas Electronics, which was the sole DDI supplier for iPhone6/6Plus. In contrast, Chipbond’s 8-inch bumping and Chip-on-Film (COF)’s utilisation rate fell 1-2% pts qoq to 55% in 4Q14 due to soft TV DDI demand. While China and Korean TV brands overbooked TV panels in 2H14, the IC supply chain had to slow down a bit to digest the accumulated IC inventory. OUTLOOK Multiple earnings drivers in 2015 We project 12.4% revenue growth for Chipbond in FY15 based on our assumption of 20% growth in TV, 12% growth in mobile and a 6-8% yoy decline in IT/tablet. Note that TV and mobile applications will remain the critical growth drivers and the new growth engines such as PMIC and TDDI will not contribute significant earnings in FY15 due to a limited customer base in the initial stage. 1) Rapid 4K penetration rate offers long-term DDI growth We believe Chipbond’s gross margin expansion (estimated 2.3% pts yoy increase to 26.4% in FY15) comes mostly from the CUR uptrend and is likely to expand Chipbond’s FY15 operating profits by 31%. We expect the 4K TV penetration rate to double in 2015 to 16%, which is likely to boost Chipbond’s TV sales by 20%. Based on that, we expect TV sales to account for 54% of the total, up from 50% in FY14. Thanks to the optimistic TV demand outlook, the company’s CUR in 8-inch bumping and COF packaging can be raised to 66% and 70% in FY15 from 60% and 55% in FY14, respectively. 2) Simpal bottoming out in 2H15 with estimated EPS of NT$0.5 to NT$0.6 7 Chipbond Technology│Taiwan April 6, 2015 We estimate that the combined effects of rising CUR, improving production yield and favourable pricing on potential supply constraints can help Simpal to contribute net profits of NT$300m-400m in FY15, representing NT$0.5-0.6 in EPS. Simpal used to be an earnings drag but we think that it could reach breakeven by 2Q15 if the tape yield can be improved from 80% to 90% and passed the customer qualification. We expect Simpal’s tape business to account for 17% of total sales in FY15, compared to 16% in FY14. 3) iPhone remains vital to mobile application We forecast that Chipbond’s mobile sales will increase 12% and advance Apple’s sales contribution to 15% in 2015, up from 14% in 2014. Mobile accounted for around 25% of total sales in FY14, of which half came from iPhones and the rest was mostly generated by white box products. Since the next-gen iPhone scheduled in 3Q15 may continue to use Renesas’s DDI, we believe Chipbond will remain the sole backend service provider and enjoy the 19% unit upside in iPhone shipments in 2015. 4) PPI upgrades will keep the testing tools at full loading The pursuit of high-end panels by mobile brands and the severe price competition initiated by display makers will together accelerate the HD-above resolution penetration in smartphones and benefit Chipbond with a full loading rate in testing service, as well as a higher operating rate in 12-inch bumping and COG packaging business. The penetration of HD-above resolution in smartphones is likely to soar 16% pts to 53.9% in 2015. Chinese mobile brands are increasing their adoption of the higher-res low temperature polysilicon (LTPS) panels to differentiate themselves on hardware specs. In the meantime, Samsung is following closely behind LTPS panels with an aggressive pricing strategy to promote their AMOLED displays. 5) PMIC and TDDI are new growth engines with meagre contribution in FY15 The development of in-cell displays will accelerate the adoption of TDDI. The advantages of adopting TDDI include less power consumption, faster operating speed and less loading burden on application processors. The larger footprint of TDDI will increase the wafer usage and is good for Chipbond due to more bumping wafers and longer testing time. TDDI development is likely to be led by Synpatics (SYNA US, NR), followed by FocalTech (5280 TT, NR) and Novatek (3034 TT, Add). When these Taiwan IC makers can successfully provide cost-effective solutions to the market in 2015, we would expect rapid TDDI migration in 2016 onwards. The PMIC business is likely to yield a margin higher than Chipbond’s average margin, at ~30%. It may also help to improve Chipbond’s underutilised 8-inch bumping capacity but we do not expect meaningful revenue contribution before 2H16 due to a small customer base (ex. Richtek (6286 TT, NR) and GMT (8081 TT, NR) likely accounted for low-single digit share of PMIC market) and a longer qualification time. 1H15 outlook TV offsets the soft mobile demand in 1Q15 and is likely to bring about a recovery in 2Q15. While seasonal weakness was expected in the first quarter, we estimate Chipbond to report a moderate qoq sales decline of 5% (compared to the company’s guidance of 5-10% qoq decline) as the TV replenishment dynamics after CNY likely offset the soft IT and mobile demand. Due to a lower CUR, 1Q15 gross margin of 24.9% will be lower than 4Q14’s 25.9%. In 1Q15, we observed a sharp order decline in mobile panels due to a c.30% qoq downward adjustment in iPhone6/6Plus. For large-sized panels, Taiwan panel makers may see high single-digit to low-teens qoq decline in 1Q15, with the significant drop in tablets and IT (NB/MNT) displays. In 2Q15, TV will lead the departure from the weak seasonal tendencies. We assume that the TV replenishment for the Golden Week Holiday, accompanied by the tape yield improvement in Simpal and the sustained iPhone demand, 8 Chipbond Technology│Taiwan April 6, 2015 will increase Chipbond’s sales by 10% qoq and advance its gross margin to 26.1%, better than 25.9% in 4Q14. Our research suggests that TV panel inventory likely stayed at the four-week normal level by Mar 15 and the healthy inventory level seems to initiate an early pull-in momentum for the upcoming 1 May holiday demand. While we think that a significant demand recovery in IT sector is unlikely in 2Q15, TV will lead the recovery with 13% qoq growth while panel makers have seen better order visibility during the second quarter. For mobile, we believe the decline for iPhones will probably be around 5% qoq in 2Q15, less than the 14-17% qoq decline seen during the past two years. Demand analysis – TV 4K’s rapid penetration will continue to propel global DDI consumption. In terms of unit shipments, TV DDI increased 6.4% to around 2.5bn units in 2014. We expect total TV DDI shipments to increase by 21% in 2015, 17% in 2016 and 13% in 2017. Catalyst 1: Doubling of 4K penetration rate in FY15 We expect 4K TV panels to enjoy 112-117% yoy growth to 42m-46m units and result in a 16% penetration rate in our base-case scenario estimates of 260m global TV shipments (+4.3% yoy) in 2015. 4K TVs are attracting attention due to the better image quality reproduction and a higher degree of realism. Thanks to the faster adoption in China and the aggressive promotion from TV brands, 4K TV penetration reached 10.2% in 4Q14, a significant leap from 3.2% in 1Q14. We expect 4K penetration to rise further in 2015 and beyond as panel makers introduce smaller-sized UHD panels at favourable prices to the mainstream market and target a 100% 4K adoption in 50”-above models. Catalyst 2: DDI no. in a 50”+ 4K TV can be 3-3.5x that of a FHD set While overall 4K panels account for only 7.8% of the global TV market in 2014, 4K penetration in the 50”-above models saw a 17% pts yoy increase to 25% in 2014. We believe the 50”-above segment will act as an important driver of the global TV DDI usage in 2015 onwards as it will need double source drivers to be placed on both sides of the TV to enable smoother image data transmission throughout the larger screen. Under identical conditions, the DDI numbers in a 50”+ 4K model will likely be around 3-3.5 times that of a FHD set. In terms of the unit shipments, TV driver ICs increased 6.4% yoy to around 2.5bn in 2014, and we expected the total TV DDI units to grow 21%/17%/13% yoy sequentially in 2015/2016/2017. The growth momentum will be mostly triggered by the 50”-above models whose yoy growth rate is even more significant at around 48%/30%/17% in 2015/2016/2017 (see. Fig. 6). Figure 6: TV DDI unit shipment forecast 2012-2017F 4500 70% (unit: million units) 3,998 4000 60% 3,548 3500 3,044 50% 3000 2,362 2,317 2500 2,515 40% 2000 1,674 1,101 1000 20% 746 550 500 30% 1,435 1500 10% 348 0 0% 2012 2013 50"+ DDI units 2014 Total TV DDI units 2015F 2016F yoy % (50"+) 2017F yoy % (TTL) SOURCE: CIMB RESEARCH, COMPANY 9 Chipbond Technology│Taiwan April 6, 2015 Catalyst 3: Narrowing price premium of 4K TVs Another key factor behind the increase in 4K TV shipments is the narrowing price gap between UHD and FHD models to an expected 1.1-1.2x from 1.5-1.6x a year ago. Rapidly falling prices are causing TV makers to push ever more elaborate features. Among the higher-end models that command a premium price, newly-introduced features like high dynamic range (HDR), high colour saturation (HCG) via quantum dots (QD) technology, curved and the ultra-slim sets will feature prominently this year. In addition, the overall ecosystem is becoming more “mature” with several TV brands (like Samsung, Sony, Panasonic and Sharp) and content providers (Disney, Fox, Warner Bros., Netflix and DirecTV) now teaming up in a 4K alliance to define 4K standards and offer 4K video streaming services digitally or via internet. In the future, if OLED TV becomes price competitive when overall manufacturing has reached an economical scale, we can expect severe price competition between TFT and OLED TV to further expand 4K prevalence. Figure 7: UHD/FHD price gap 1,200 Figure 8: TV technology migration (X) Panel price ($) 1.24 1.24 1,000 1.23 1.23 800 1.22 600 1.22 1.21 400 1.21 1.20 200 1.20 0 1.19 Jan-14 Mar-14 May-14 65" FHD Jul-14 Sep-14 65" UHD Nov-14 Jan-15 Mar-15 UHD/FHD (X) SOURCE: CIMB RESEARCH, COMPANY SOURCE: CIMB RESEARCH, TOPOLOGY Demand analysis – Mobile The shift in consumer tastes towards higher resolution and bigger screen smartphones will support Chipbond’s 12-inch bumping and COG business, helping mobile sales grow 12.4% yoy in 2015. In terms of 12-inch gold bumping capacity, Chipbond accounted for nearly 48% of the market share, followed by ChipMOS’s 25%. In 2014, around 25% of the company’s revenues were generated by mobile, and over half was contributed by iPhones (c. 13-14% to the total). Catalyst 1: Mobile resolution upgrades continue We expect the HD+ mobile display penetration in 2015/2016/2017 to reach 53.9%/61.4%/68.0%, up from 17%/38% in 2013/2014. While a number of followers tried to match Apple with low-priced FHD models (like the 5.5” Meizu Note and the 5.7” Xiaomi Note), we expect the resolution upgrades from HD720 to FHD to accelerate in 2015 and benefit Chipbond with the full loading rate in wafer testing and higher CUR in 12-inch bumping and COG packaging. CIMB expects global smartphone shipments to increase 12%/9% yoy to 1.45/1.59 billion units in 2015/2016, which will translate to 59% and 25% growth upside in HD+ resolution panels. As such, Chipbond said 60-70% of its FY15 capex will be invested in testing machines to fulfill the increasing demand driven by IC complexity. In our view, 5” FHD panels will become the standard requirement for mainstream models in 2015. Moreover, the WQHD panels (2,560 x 1,440) are also furthering its way into the high-end panel segment with even larger screens of 5.5”-6.0” starting by 2015 (see Fig. 9). Catalyst 2: c.19% yoy growth in iPhone shipments 10 Chipbond Technology│Taiwan April 6, 2015 Note that Chipbond is currently the sole DDI backend service provider for iPhone6 & 6Plus, and the orders from Renesas have made Chipbond's 12-inch bumping and COG packaging lines operate in high gear in 4Q14 (103% and 88% respectively). Despite market rumours that the next-gen iPhone is likely to adopt TDDI instead of the current discrete IC solutions (i.e. individual touch control from Broadcom plus display driver from Renesas), our studies suggest that TDDI would not be adopted in 2015, while the integration of touch controller and display driver may take longer than expected, and there are no significant spec changes in panels for the iPhone6S. In this case, Renesas will likely remain the DDI supplier and Chipbond will continue to stay in the supply chain in 2015. Figure 9: The mobile resolution trend in each price segment Figure 10: Mobile shipment forecast by resolution 2013-2016 2,500 (mn,units) Device ASP (RMB) 2011 2012 2013 2014 2015 >3000 4.5" QHD 5" HD720 5" FHD 5" HD720 5.5" WQHD 6" WQHD 6" WQHD 1500-3000 4.5" QHD 4.5" HD720 5" HD720 5.5" FHD 5.5" WQHD 1000-1499 4" WVGA 4.5" QHD 4.7" HD720 5" FHD 5.5" HD720 5.5" FHD 5" FHD 700-999 3.5" HVGA 4" WVGA 4.5" QHD 4.5" FWVGA 5" HD720 5" FWVGA 5.5" HD720 5" HD720 500 3.5" HVGA 4" WVGA 4.5" FWVGA 4.7" HD720 5" FWVGA - 2,000 1,500 <700 1,000 2013 UHD WQHD 2014F FHD SOURCE: CIMB RESEARCH, COMPANY HD 2015F WXGA QHD WVGA 2016F Under WVGA SOURCE: CIMB RESEARCH, TOPOLOGY RISKS 4K momentum may slow if market matures The 4K penetration rate in 50”+ TV has reached 25.3% in 2014 and we expect the penetration rate to speed up significantly to 44%/58%/75% in 2015/2016/ 2017. According to panel makers, an eventual 100% penetration rate for 50”+ models is likely. As mentioned before, the 50”+ segment will act as an important factor to drive the global TV DDI as the DDI numbers in a 50”+ 4K model will likely be up to 3-3.5 times that of a FHD set. For Chipbond whose 8-inch bumping and COF was under-utilised at a 45-55% range in 2014, we expect the strong 4K momentum to solidly support Chipbond’s margins through CUR increases. DDI’s channel output increases There are some concerns that the DDI content in each 4K TV is reduced if the output channels of each DDI is increased. However, in our view, adopting higher channel DDI may not be cost effective for panel makers in terms of total BOM. On the other hand, while most of the 4K TVs aiming at the high-end market are featured with slim borders, those DDIs with higher channel outputs will require more fan-out spacing (i.e. the fan out from the chip pads will get wider if the channel output is increased) and thus will not be able to be mounted on the small space of the narrow border design. As such, although the TV market may see mid-single digit unit growth in 2015, we still expect DDI consumption to outpace the TV sets’ growth momentum with a 21% yoy growth rate based on our calculations. 11 Chipbond Technology│Taiwan April 6, 2015 FINANCIALS ROCE improves on rising CUR In Fig.12, we can see that the EBIT margins of Chipbond and ChipMOS were about the same in 4Q14; the lower ROCE in Chipbond indicates a less efficient capital turnover compared to ChipMOS. ChipMOS has experienced a great year in FY14, thanks to double-digit growth in the memory business, solid relationship with Micron and the healthy demand from specialty DRAM and Flash. Compared to ChipMOS, Chipbond’s 8-inch bumping and COF capacity was running on low gear while the 4K industry was still in the early stages. Moving forward, with 4K upside anticipated in 2015 as penetration rate rises, we expect better operating efficiency to boost Chipbond’s ROCE to 18%, up from 14% in 2014. We expect Chipbond’s gross margin to improve in the next two years due to the earnings expansion from increasing CUR on 8-inch bumping/COF, the steady depreciation expenses to sales and the turnaround of its tape business. The company’s FY15 revenue is expected to grow 12.4% yoy to NT$19.9bn and its net profit climb 25% yoy to NT$3.2bn, representing an EPS of NT$4.9. Chipbond’s gross margin in 2014 was maintained at 24.1% mainly due to the growing sales contribution from mobile (from 22% in 2013 to 24% in 2014), the improving COF loading rate (from 63% by 2013 to 85% by 2014) and the weaker NT$. Figure 11: ROCE comparison Figure 12: Operating margin comparison 25.0% 8.0% 7.0% 20.0% 6.0% 5.0% 15.0% 4.0% 10.0% 3.0% 2.0% 5.0% 1.0% 0.0% 0.0% 1Q13 2Q13 Chipbond 3Q13 4Q13 ChipMOS 1Q14 ASE 2Q14 1Q13 3Q14 2Q13 Chipbond SPIL 3Q13 4Q13 1Q14 ChipMOS SOURCE: CIMB RESEARCH, COMPANY 2Q14 ASE 3Q14 4Q14 SPIL SOURCE: CIMB RESEARCH, COMPANY VALUATION AND RECOMMENDATION Chipbond currently trades at 1.7x FY15 P/BV vs. its 5-year average of 1.8x. Its share price risen 8.3% YTD, outperforming the panel stocks amid the recent noise over the TV panel price. Our target price of NT$72 is based on our assumption of 2.1x FY15 EV/CE and mid-term ROE of 15.1%, which translates into 1.8x FY15 P/BV and 14.7x FY15 P/E. The stock is currently trading at 1.7x P/BV and 13x FY15 P/E at 13% ROE, compared to ChipMOS which is trading at 1.9x P/BV and 11.6x FY15 P/E with 16.0% ROE. We think Chipbond, as an industry leader with market share dominance, is undervalued. We reinitiate Chipbond with an Add rating. 12 Chipbond Technology│Taiwan April 6, 2015 Figure 13: Prospective P/BV 3.5 Figure 14: Prospective P/E 25.0 (X) (X) 3.0 20.0 2.5 15.0 2.0 1.5 10.0 1.0 5.0 0.5 0.0 Jan-10 Jan-11 Jan-12 Jan-13 Jan-14 Jan-15 0.0 Jan-10 Jan-16 Jan-11 Jan-12 Jan-13 SOURCE: CIMB RESEARCH, COMPANY Jan-14 Jan-15 Jan-16 SOURCE: CIMB RESEARCH, COMPANY Figure 15: Chipbond’s quarterly consolidated P&L, key assumptions and valuations (NT$bn) Revenues Gross profit Operating profit Net profit EPS (NT$) Margins (%) Gross Operating Growth (% qoq, % yoy) Revenues Gross profit Operating profit EPS Key assumptions Wafer output (m pcs) Chip output (m pcs) 1Q14A 4.2 0.9 0.6 0.5 0.8 2Q14A 4.3 1.0 0.7 0.5 0.7 3Q14A 4.7 1.2 0.9 0.8 1.2 4Q14A 4.5 1.2 0.8 0.8 1.3 1Q15F 4.3 1.1 0.8 0.6 1.0 2Q15F 4.7 1.2 0.9 0.7 1.1 3Q15F 5.4 1.5 1.1 0.9 1.4 4Q15F 5.5 1.5 1.1 0.9 1.4 FY14A 17.7 4.3 3.0 2.5 3.9 FY15F 19.9 5.3 3.9 3.2 4.9 FY16F 22.6 6.2 4.6 3.7 5.7 FY17F 23.7 6.4 4.7 3.8 5.9 21.2 13.7 22.9 15.9 26.0 19.1 25.9 18.7 24.9 17.8 26.1 19.1 27.4 20.4 27.8 20.8 24.1 17.0 26.7 19.7 27.3 20.3 27.0 20.0 8.5 18.7 26.1 13.5 4.2 12.6 20.9 -9.9 8.0 22.4 30.0 65.9 -4.0 -4.0 -5.9 10.5 -5.4 -9.1 -10.2 -24.7 9.9 15.1 17.8 16.5 16.0 21.8 24.2 22.7 1.6 3.1 3.3 3.1 11.8 11.6 10.9 -4.6 12.4 24.6 30.2 24.8 13.8 16.6 17.6 16.6 4.7 3.5 3.2 3.0 586 532 588 559 633 605 613 612 515 531 575 580 681 678 720 729 2,420 2,308 2,704 2,518 3,277 3,042 3,630 3,536 SOURCE: CIMB RESEARCH, COMPANY Figure 16: Overview of display driver supply chain Novatek DDI design 3034 TT, ADD TSMC IC Process 2330 TT, ADD Film suppliers IC bumping Shindo 5753: Tokyo, NR Chipbond 6147 TT, ADD 8150 TT, NR Himax HIMX US, NR Vanguard 5347 TT, NR Mitsui 8031: Tokyo, NR ChipMOS Samsung 005930 KS, ADD UMC 2303 TT, ADD JMC Electrics 19% owned by ChipMOS LB Semicon 061970 KS, NR Orise 3545 TT, NR Megnachip MX US, NR Simpal 100% owned by Chipbind Nepes Ilitek 3598 TT, NR PSC 5346 TT, NR Samsung Techwin 012450 KS, NR Radium 3592 TT, NR Samsung 005930 KS, ADD LG Innotek Parade 4966 TT, ADD 033640 KS, NR 011070 KS, ADD Synaptics (Renesas) SYNA US, NR SOURCE: CIMB RESEARCH, COMPANY 13 Chipbond Technology│Taiwan April 6, 2015 APPENDIX 4K penetration will continue to propel DDI consumption 4K generally requires 2-to-3 times display drivers over FHD 4K2K, which is also known as ultra-high definition (UHD), is generally of 3,840 x 2,160 pixels with a 16:9 aspect ratio. Since 4K resolution is four times the FHD (1,920 x 1,080), it might sometimes be dubbed as Quad Full High-Definition (QFHD). In general, a thin-film transistor (TFT) liquid crystal display (LCD) of 4K2K resolutions include 2,160 gate lines and 3,840 source lines, which are orthogonally intersected with each pixel unit composed of R/G/B elements. In order to drive the pixel unit in TFT LCD, it will require gate drivers to generate control signals to activate TFT in corresponding scan lines, and source drivers to input operation voltages to determine the luminance of each pixel on the scan lines. For the DDI numbers per 4K TV, it will need 12 source drivers of 960 channels (3,840*3/1026; 3 for R/G/B in each pixel unit) and 8 gate drivers of 540 channels (2,160/540*2; 2 for doubling gate drivers, totalling 20 drivers to drive a common 4K TV). In the same case, it will need 8 drivers in a FHD model instead (DDI usage in UHD/FHD: 2.5x, see Figs. 5&6), making the UHD/FHD DDI multiple to 2.5 times. Figure 18: Est. DDI consumption in 50”+ TV model Figure 17: Est. DDI multiple between UHD/FHD Resolution 1920 Source Driver 1080 Gate Driver Total DDI no. Resolution Channel outputs 1920 Source Driver 1080 Gate Driver Total DDI no. Channel outputs 960 540 960 540 DDI no. 6 2 8 DDI no. 6 2 8 Resolution Source Driver Gate Driver Total DDI no. Resolution Source Driver Gate Driver Total DDI no. 3840 1080 DDI no. Channel outputs 960 12 3840 540 8 UHD/FHD driver no. multiple 1080 DDI no. 20 2.5 Channel outputs 1206 720 19 6 UHD/FHD driver no. multiple 25 3.1 (*double gate for UHD, and double source in 50+" models) (*double gate for UHD, and double source in 50+" models) SOURCE: CIMB RESEARCH, COMPANY SOURCE: CIMB RESEARCH, COMPANY 16%/25%/33% 4K penetration in 2015/2016/2017 4K TVs are attracting attention due to the better image quality reproduction with a higher degree of realism. Thanks to the faster adoption in China and the aggressive promotion from TV brands, 4K TV penetration had reached 10.2% by 4Q14, a significant leap from 3.2% by 1Q14. We expect the 4K penetration to accelerate in 2015 as panel makers introduce smaller-sized UHD panels at favourable prices for the mainstream market. In that case, we expect 4K TV panels to grow by 112-117% yoy to 42m-46m units and result in a 16% penetration rate in our base-case scenario estimates of 260m global TV shipments (+4.3% yoy) in 2015. Our 4K estimates based on basic, positive and aggressive scenarios are illustrated in Figs. 17 & 18. 14 Chipbond Technology│Taiwan April 6, 2015 Figure 19: UHD penetration trend 2013-2017F Figure 20: UHD TV shipment forecasts under different scenarios (%) 30 100 Est. UHD penetration rate (%) 33%, 34%, 35% 95 92 89 Est. UHD penetration rate (%) Units (m) 90 25 25%, 26%, 27% 80 66 70 20 72 Est. UHD penetration rate (%) 16%, 17%, 18% 46 42 44 60 15 69 50 40 10 30 19 20 5 10 3 0 4Q17F 3Q17F 2Q17F 1Q17F 4Q16F 3Q16F 2Q16F 1Q16F 4Q15F 3Q15F 2Q15F 4Q14 1Q15F 3Q14 2Q14 1Q14 4Q13 3Q13 2Q13 1Q13 0 2013A 2014A Base case Based case Positive case 2015F Positive 2016F 2017F Aggressive Aggressive case SOURCE: CIMB RESEARCH, COMPANY SOURCE: CIMB RESEARCH, COMPANY The popularity of in-cell touch panel may increase the adoption of TDDI In the field of display driver IC and touch controller, two major acquisitions occurred in 2014. Synaptic took over the small and medium-sized driver IC business of Renesas, and FocalTech acquired Orise aiming at the integrated touch/display driver IC solution. As shown in Fig.21, we found the industry consolidation may help to overcome the complexity in the traditional touch display supply chain. The ongoing market integration in “touch module and TFT diplay”, and “touch controller and display driver” will likely streamline the supply chain management in the future. Figure 21: The introduction of TDDI will streamline the supply chain Testing Testing Foundry Foundry Driver IC Design Touch IC Design TDDI Design Touch Panel Display Panel Display Panel AP Design Mobile OEM AP Design Mobile Brand Mobile OEM Mobile Brand SOURCE: CIMB RESEARCH, TOPOLOGY Apple was the pioneer in adopting in-cell touch displays in iPhones in 2012, and likely consumed around 40% of the global LTPS capacity in 2014 as iPhone accounted for 9.8% of the 2014 market share. The new-added LTPS capacity from China, Taiwan and Japan panel makers in 2015-2016 raised some oversupply concerns, and thus we have seen panel makers aggressively developing out-cell (touch on color filter) and in-cell (touch embedded in TFT arrays) touch displays (see Fig.22) with LTPS to ease the risk of supply glut. 15 Chipbond Technology│Taiwan April 6, 2015 Figure 22: Illustration of in-cell/out-cell display; TDDI and individual DDI and touch controller Cover Glass Cover Glass DDI Touch sensor TFT LCD TDDI Touch sensor TFT LCD In-cell touch display + TDDI Touch controller Out-cell touch module + TFT-LCD & Discrete DDI + touch controller SOURCE: CIMB RESEARCH, COMPANY Compared to out-cell, we found panel makers are now accelerating the in-cell panel development with the “self-capacitance” technology which likely avoided the infringement with Apple’s “ mutual- capacitance” patent. More than that, panel makers are trying to manufacture in-cell displays without adding further photo masks to maintain the cost and save the margins. In the end, those panel makers believe the touch function will be an add-on features in LCD display at no extra cost to the end-customer. In that case, it will help panel makers to secure margins within the LCD displays and wash the individual touch module houses out of the supply chain. The development of in-cell displays will accelerate the adoption of TDDI. The advantages of adopting TDDI include less power consumption, faster operating speed and less load on application processor. The larger footprint of TDDI will also increase the wafer numbers, benefitting Chipbond from more wafers in bumping and longer testing time due to IC complexity. TDDI development is likely led by Synpatics, followed by FocalTech (5280 TT, NR) and Novatek (3034 TT, Add). Once the Taiwan IC makers successfully provide cost-effective solutions to the market by 2015, we can foresee a rapid introduction of TDDI from 2016 onwards. 16 Chipbond Technology│Taiwan April 6, 2015 #01 DISCLAIMER This report is not directed to, or intended for distribution to or use by, any person or entity who is a citizen or resident of or located in any locality, state, country or other jurisdiction where such distribution, publication, availability or use would be contrary to law or regulation. By accepting this report, the recipient hereof represents and warrants that he is entitled to receive such report in accordance with the restrictions set forth below and agrees to be bound by the limitations contained herein (including the “Restrictions on Distributions” set out below). Any failure to comply with these limitations may constitute a violation of law. This publication is being supplied to you strictly on the basis that it will remain confidential. 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CIMB Securities (Thailand) Co., Ltd. may act or acts as Market Maker and issuer including offering of Derivative Warrants Underlying securities of the following securities. Investors should carefully read and study the details of the derivative warrants in the prospectus before making investment decisions. AAV, ADVANC, AIT, AMATA, ANAN, AOT, AP, ASP, BANPU, BAY, BBL, BCH, BCP, BEC, BECL, BGH, BH, BIGC, BJC, BJCHI, BLAND, BMCL, BTS, CENTEL, CK, CPALL, CPF, CPN, DELTA, DEMCO, DTAC, EARTH, EGCO, ERW, GFPT, GLOBAL, GLOW, GUNKUL, HANA, HEMRAJ, HMPRO, ICHI, IFEC, INTUCH, IRPC, ITD, IVL, JAS, KBANK, KCE, KKP, KTB, KTC, KTIS, LH, LOXLEY, LPN, M, MAJOR, MC, MEGA, MINT, NOK, PS, PSL, PTG, PTT, PTTEP, PTTGC, QH, RATCH, RML, ROBINS, SAMART, SAWAD, SCB, SCC, SCCC, SF, SGP, SIM, SIRI, SPALI, SPCG, SRICHA, STA, STEC, STPI, SVI, TCAP, THAI, THCOM, THREL, TICON, TISCO, TMB, TOP, TPIPL, TTA, TTCL, TTW, TUF, UV, VGI, TRUE. 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Score Range: Description: 90 - 100 Excellent 80 - 89 Very Good 70 - 79 Good Below 70 or N/A No Survey Result United Arab Emirates: The distributor of this report has not been approved or licensed by the UAE Central Bank or any other relevant licensing 19 Chipbond Technology│Taiwan April 6, 2015 authorities or governmental agencies in the United Arab Emirates. This report is strictly private and confidential and has not been reviewed by, deposited or registered with UAE Central Bank or any other licensing authority or governmental agencies in the United Arab Emirates. This report is being issued outside the United Arab Emirates to a limited number of institutional investors and must not be provided to any person other than the original recipient and may not be reproduced or used for any other purpose. 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Distribution of stock ratings and investment banking clients for quarter ended on 31 December 2014 1586 companies under coverage for quarter ended on 31 December 2014 Rating Distribution (%) Investment Banking clients (%) Add 58.4% 6.0% Hold 29.4% 4.3% Reduce 12.2% 1.0% Spitzer Chart for stock being researched ( 2 year data ) Chipbond Technology (6147 TT) Hold Neutral Dec-13 63.00 50.00 61.00 70.00 75.00 na 88.0 Recommendations & Target Price 83.0 78.0 73.0 68.0 63.0 58.0 53.0 48.0 43.0 Add Outperform 38.0 Apr-13 Aug-13 56.00 Price Close Reduce Underperform Apr-14 20 Trading Buy Aug-14 Trading sell Dec-14 Not Rated Chipbond Technology│Taiwan April 6, 2015 Corporate Governance Report of Thai Listed Companies (CGR). CG Rating by the Thai Institute of Directors Association (Thai IOD) in 2014. AAV – Very Good, ADVANC – Very Good, AEONTS – not available, AMATA - Good, ANAN – Very Good, AOT – Very Good, AP - Good, ASK – Very Good, ASP – Very Good, BANPU – Very Good , BAY – Very Good , BBL – Very Good, BCH – not available, BCP - Excellent, BEAUTY – Good, BEC - Good, BECL – Very Good, BGH - not available, BH - Good, BIGC - Very Good, BJC – Good, BLA – Very Good, BMCL - Very Good, BTS - Excellent, CCET – Good, CENTEL – Very Good, CHG – not available, CK – Very Good, CPALL – not available, CPF – Very Good, CPN - Excellent, DELTA - Very Good, DEMCO – Good, DTAC – Very Good, EA - Good, ECL – not available, EGCO - Excellent, GFPT - Very Good, GLOBAL - Good, GLOW - Good, GRAMMY - Excellent, HANA Excellent, HEMRAJ – Very Good, HMPRO - Very Good, ICHI - not available, INTUCH - Excellent, ITD – Good, IVL - Excellent, JAS – not available, JUBILE – not available, KAMART – not available, KBANK - Excellent, KCE - Very Good, KGI – Good, KKP – Excellent, KTB - Excellent, KTC – Good, LH - Very Good, LPN – Very Good, M - not available, MAJOR - Good, MAKRO – Good, MBKET – Good, MC – Very Good, MCOT – Very Good, MEGA – Good, MINT Excellent, OFM – Very Good, OISHI – Good, PS – Very Good, PSL - Excellent, PTT - Excellent, PTTEP - Excellent, PTTGC - Excellent, QH – Very Good, RATCH – Very Good, ROBINS – Very Good, RS – Very Good, SAMART - Excellent, SAPPE - not available, SAT – Excellent, SAWAD – not available, SC – Excellent, SCB - Excellent, SCBLIF – Good, SCC – Very Good, SCCC - Good, SIM - Excellent, SIRI - Good, SPALI - Excellent, STA – Very Good, STEC - Good, SVI – Very Good, TASCO – Good, TCAP – Very Good, THAI – Very Good, THANI – Very Good, THCOM – Very Good, THRE – not available, THREL – Good, TICON – Good, TISCO - Excellent, TK – Very Good, TMB - Excellent, TOP - Excellent, TRUE – Very Good, TTW – Very Good, TUF - Good, VGI – Very Good, WORK – not available. CIMB Recommendation Framework Stock Ratings Definition: Add The stock’s total return is expected to exceed 10% over the next 12 months. Hold The stock’s total return is expected to be between 0% and positive 10% over the next 12 months. Reduce The stock’s total return is expected to fall below 0% or more over the next 12 months. The total expected return of a stock is defined as the sum of the: (i) percentage difference between the target price and the current price and (ii) the forward net dividend yields of the stock. Stock price targets have an investment horizon of 12 months. Sector Ratings Overweight Neutral Underweight Definition: An Overweight rating means stocks in the sector have, on a market cap-weighted basis, a positive absolute recommendation. A Neutral rating means stocks in the sector have, on a market cap-weighted basis, a neutral absolute recommendation. An Underweight rating means stocks in the sector have, on a market cap-weighted basis, a negative absolute recommendation. Country Ratings Overweight Neutral Underweight Definition: An Overweight rating means investors should be positioned with an above-market weight in this country relative to benchmark. A Neutral rating means investors should be positioned with a neutral weight in this country relative to benchmark. An Underweight rating means investors should be positioned with a below-market weight in this country relative to benchmark. *Prior to December 2013 CIMB recommendation framework for stocks listed on the Singapore Stock Exchange, Bursa Malaysia, Stock Exchange of Thailand, Jakarta Stock Exchange, Australian Securities Exchange, Taiwan Stock Exchange and National Stock Exchange of India/Bombay Stock Exchange were based on a stock’s total return relative to the relevant benchmarks total return. Outperform: expected to exceed by 5% or more over the next 12 months. Neutral: expected to be within +/-5% over the next 12 months. Underperform: expected to be below by 5% or more over the next 12 months. Trading Buy: expected to exceed by 3% or more over the next 3 months. Trading Sell: expected to be below by 3% or more over the next 3 months. For stocks listed on Korea Exchange, Hong Kong Stock Exchange and China listings on the Singapore Stock Exchange. Outperform: Expected positive total returns of 10% or more over the next 12 months. Neutral: Expected total returns of between -10% and +10% over the next 12 months. Underperform: Expected negative total returns of 10% or more over the next 12 months. Trading Buy: Expected positive total returns of 10% or more over the next 3 months. Trading Sell: Expected negative total returns of 10% or more over the next 3 months. 21