16 Position Turret Handler

NX16
16 Position Turret Handler
T he hi g h throu g hput
solution for complete
finishin g process
Hi gh Pro d uc tiv ity
n
Up to 45,000 uph
n
Complete finishing solution:
- Full Vision inspection
- Test Contacting
- Electrical Tester (Discrete)
- Auto Reel Changer
F l ex i b i l i ty
n
Modular finishing process
configuration: 16 turret positions
n
Wide applicable device range
(0.3 x 0.6 to 10 x 30 mm):
- Discrete
- Power discrete
- DFN
- QFN
- SOIC
- LED
- MEMS
NX16
16 Position Turret Handler
Process Capabilities
Input
Tape and Reel, Auto Reel Changer, Tube
Conversion time: 30 min to 70 min (typical)
Automatic rejection and replacement in tape (optional)
2nd Tape and Reel with flip-flop (optional)
Auto Reel Changer (optional)
Processes
User Interface
Device Orientation, Test Contacting, Electrical Tester
(Discrete), LED optical test (Ambient and Temperature
85°C), Laser marking, 6 Sides Vision inspection, Bulk
Sorting, Tube Sorting
Movable Windows-based color touchscreen
Input, Bowl, Tube, MultiTrack
Output
Native Vision Inspection
2D, 5S, 3D, Mark, Surface, Color, In-Tape,
Code reader, LED dedicated solution
Test Contacting
Flat Test Kelvin / Flat Test Non-Kelvin
Clamping Test
Small Device dedicated solution including Kelvin
Pogo pin socket
LED dedicated solution
Language: English and Chinese (simplified),
other upon request (optional)
Keyboard, mouse (optional)
Handler status indicator light (green, yellow, red)
Native Vision: dedicated monitor, keyboard, mouse
Interface
Network: Ethernet capability
I/O parallel interface for Tester and Laser
SECS GEM (optional)
GPIB (optional)
ESD
Specifications
According to ANSI / ESD SP10.1
Device Range
ESD Class 0 (optional)
Discrete Leaded: 1 x 0.6 mm to 6 x 6 mm /
thickness ≥ 0.38 mm
Power Requirements
Power discrete: 5 x 5 mm to 10 x 30 mm /
thickness ≥ 0.38 mm
110VAC 60Hz, One Phase, 2 kVA (optional)
Discrete DFN: 0.3 x 0.6 mm to 12 x 12 mm /
thickness ≥ 0.30 mm
Air Requirements
QFN: 1 x 1 mm to 12 x 12 mm /
thickness ≥ 0.30 mm
Air consumption: 5 m3/h (typical)
240VAC 50Hz, One Phase, 2 kVA
120VAC 60Hz, Two Phases w/o Neutral, 2 kVA (optional)
Pressure range: 6 bar ± 0.5 bar
SOIC: 3 x 4.9 mm to 17 x 17 mm /
thickness ≥ 0.90 mm
Vacuum Requirements
LED: 1.5 x 1.5 mm to 12 x 12 mm /
thickness ≥ 0.30 mm
Consumption: 420 l/min (typical)
Contacting Force
Dimensions (typical)
3N to 17N with springs
Up to 77N with air forcer (optional)
Index Time
40 ms to 100 ms depending on device and process
Throughput
Vacuum Network: - 0.5 bars ± 10%
Vacuum Pump (optional)
2 frame configuration:
Overall dimension: 1.3 x 1.6 x 2.05 m
Floor space requirement: 1.8 x 1.7 x 2.05 m
Weight: net 650 kg / gross 1,000 kg
3 frame configuration:
Overall dimension: 1.3 x 1.8 x 2.05 m
Floor space requirement: 1.8 x 2.0 x 2.05 m
Weight: net 1,000 kg / gross 1,500 kg
Discrete Leaded: up to 45,000 uph
Power discrete: up to 20,000 uph
Discrete DFN: up to 40,000 uph
QFN: up to 40,000 uph / up to 21,000 uph with
extra force pusher
SOIC: up to 25,000 uph
LED: up to 25,000 uph
Standards
Productivity
2006/95/EC Low Voltage
MTBA: > 1 h (typical)
MTBF: > 168 h (typical)
2006/42/EC Machinery
2004/108/EC Electromagnetic compatibility (EMC)
Cohu Semiconductor Equipment Group
12367 Crosthwaite Circle, Poway, CA 92064-6817
Tel. 858.848.8000 Email: info@cohuseg.com
Specifications subject to change without notice.
For detailed performance specifications, please contact Cohu SEG.
8332531 Rev A 0713
For global sales locations and support, please visit
www.cohuseg.com