FEM analysis of surface flaw of wire during drawing - SIGMA-NOT
Transcription
FEM analysis of surface flaw of wire during drawing - SIGMA-NOT
S. 136 HUTNIK - WIADOMOŚCI HUTNICZE and measured values shows that for the axial component the simulated stress based on the anisotropic model is very close to the measured one, whereas, for the tangential component there is some discrepancy between the calculated values from FE models and the measured result. The reason is probably due to the yariances in the measured peak positions caused by the curvature of the wire surface when the ę angle was 45 and 90 degrees. It has to be pointed out that it is of no use to take the shear stress components cr 13 and (723 into account during the measurements. They are obliged to be zero at the surface and because of the axial symmetry. Indeed, when these components were considered as unknowns during the stress measurement, <7 13 = 5 (<5(cr13) = 1) MPa, <723 = —5(<5(<r 23 ) = 1) MPa was found, i.e. they are nearly zero. 6. Conclusions. The finite-element method has been applied in the simulation of wire drawing process to predict the distribution of residual stresses in drawn wires. In the FE models, a good description of the materiał behaviour is needed to achieve a high level of accuracy. For textured materials, instead of isotropic yield criterion, a texture based anisotropic yield locus can be incorporated into the model to describe the anisotropic plastic behaviour of the materiał. Good agreement has been reached between the calculated axial residual stress and the result measured by X-ray diffraction on the surface of the drawn wire. 7. Acknowledgements. The authors wish to acknowledge the financial support of the Flemish Institute for the promotion of scientific-technological research in industry (IWT). Literaturę 1. Shemenski R.M.: Wire Journal International, April 1999, 166 Nr 2 2. Hoferlin E., Van Bael A., Van Houtte P., Teodosiu C.: Proc. Numisheet'99, edited by C. Gelin and P. Picart, p. 91 3. Von Bael A.: PhD Thesis, Department MTM, Katholieke Universiteit Leuven, Belgium (1994) 4. Van Houtte P., Hę S., Mei F., Sarban A.: Mat. Sci. Forum, Vol. 404-407, 2002, 205-214 5. Hę S., Von Bael A., Van Houtte, P., Mei F., Decleyre W., Sarban A.: Proc. of Numiform 2001, Toyohashi, Japan, June 18-20 2001, edited by K. Mori, p. 481 6. Van Houtte P., Mols K., Von Bael A., Aernoudt E.: Textures and Microstructures, Vol. 11, 1989, 23 7. Bunge H. J.: Texture Analysis in Materiał Science: Mathematical Methods. Butterworths, London 1982 8. Li S., Hoferlin E.. Van Bael A., Van Houtte P., Teodosiu C.: Int. J. Plasticity, Vol. 19, 2003, 647-674 9. YanHoutteP., YanBaelA., WintersJ.,AemoudtE.,HallF., th Wang N., Pillinger L, Hartley P., Sturgess C. E. N.: Proc. 13 Ris0 International Symposium on Materiał Science, edited by S.I. Andersen et al. (1992), p. 161 10. Li S., Hoferlin S., YanBaelS., A. andYan Houtte P.: Pioc.oi Numiform 2001, Toyohashi, Japan, June 18-20 2001, edited by K. Mori, p. 215 11. Noyan I. C., Cohen J. B.: Residual Stress-Measurement by Diffraction and Interpretation. Springer Yerlag, New York (1987) 12. Van Houtte P., De Buyser L: Acta Metali. Vol. 41, 1993, 323 13. Von Acker K.: PhD Thesis, Department MTM, Katholieke Uniyersiteit Leuven, Belgium (1996) KAZUNARI YOSHIDA UKD 621.778:519.6:620.191:669-426:669-428:621.753.5:616:669-124:629.1.01 Department of Precision Engineering, School of Engineering Tokai Uniyersity TETSUO SHINOHARA Graduate Student, Graduate School of Engineering, Tokai University FEM analysis of surface flaw of wire during drawing used in spring of automobile and medical instrument Analiza numeryczna metodą elementów skończonych wad powierzchni drutów ciągnionych przeznaczonych na sprężyny w przemyśle motoryzacyjnym i na narzędzia medyczne The high surface ąuality of drawn wire and rods have been reąuired from the field of automobile, machinę and medical test. Using three-dimensional FEA, this study analyzed wire breaks that occurred in the drawing fine wires containing inclusion and flaws on the wire surface. The growth and disappearance mechanisms of flaws such as transversal cracks and scratches on a wire surface during wire drawing were investigated. Od drutów i prętów przeznaczonych do produkcji w przemyśle motoryzacyjnym i medycznym wymagana jest wysoka jakość powierzchni. W pracy przedstawiono trój-osiowy model odkształcenia dala, analizowano pęknięcia występujące w cienkich drutach zawierających wtrącenia oraz wady powierzchni. Badano wzrost i mechanizm zanikania pęknięć poprzecznych i rys powstających na powierzchni drutu podczas procesu ciągnienia. Key words: surface flaw, springs Słowa kluczowe: wady powierzchni, sprężyny 1. Introduction. Technological advancement in the field of semiconductors has been remarkable, and research on the production of superfine wire of 10^30^m diameter is being actively carried out. The minimum diameter and the use of some superfine wires on 2005 r. HUTNIK - WIADOMOŚCI HUTNICZE the market and in the laboratory in Japan are given in Table 1. Market demands also include reduction of processing cost [1]. One of the factors that directly influence the increase of processing cost is wire breaks during the drawing process [2-18]. At the production site, inclusions present in the wire, flaws on the wire surface, back tension and inferior die shape have been noted to induce wire breaks, however, several issues remain to be resolved [19]. In this study, authors focused on wire-breaks caused by inclusions, flaws on the wire surface and presence of yoids in the wire (Fig. 1). Based on the results of previous studies [2,11,12,17], inclusions are considered to comprise oxides and carbon compounds present during casting, particles such as Fe and/or Cr compounds from fractured and worn-out tools, and Si and Al oxides. Using three-dimensional FEA, this study examined (1) the influence of inclusions and voids when these are located away from the center of the wire on wire breaks, and (2) growth of flaws on the wire surface due to wire drawing. 2. Model and materiał properties used for FEA. The materiał properties used in FEA for the drawing of superfine copper wire are summarized in Table 2. 2.1. Drawing of a wire with inclusions or voids which are located away from the center of the wire. The authors preyiously reported the analytical results for an inclusion present at the center of a wire (Fig. 2). Fig. 3 a shows an analytical model in which an inclusion or void is located away from the center of the wire. The mother wire is composed of copper and has a diameter d0 of 100 um. Sińce the inclusion is much harder than copper, the inclusion was assumed to be a cemented carbide. In order to simplify the calculation of FEA the inclusion was a rectangular parallelepiped with the dimensions a = 50 um, b = 20 ^m and c — 20/im. The position of this inclusion is represented by h0/r0 (ratio of distance from the center of the wire to the center of the inclusion, h „, to radius of the wire, r0). When h0/r0 = O, the inclusion exists at the center of the wire, and when it is 0.8, the inclusion is tangential to the wire surface. The influence of h0/r0 on wire breaks was examined by changing h0/r0. Similar to the case of inclusions, an analysis was carried out for a void located away from the center of the wire, S. 137 having the same dimensions as the inclusion. The drawing conditions were half-die angle = 6 deg and reduction per pass Re = 20 %. 2.2. Growth offlaw on wire surface by drawing. Fig. 3b shows models of artificial transversal cracks used for experiments. For the easy way to perform this experiment, the authors use the following dimensions: diameter d = 10 mm, width in the axial direction a = 2 mm, width in the circumferential direction b = 8.5 mm, and depth c = 2.5 mm. The shape of the cracks and their effects on the wires after multi-pass drawing were investigated. 3. Analysis results and discussion 3.1. Influence of inclusion and void located away from the Fig. 2. Sphere inclusion Rys. 2. Wtrącenie o kształcie kulistym a) Die Flaw 25 um Fig. 1. Wire breaks in ultra fine wire drawing and check mark on wire surface Rys. 1. Pęknięcia w procesie ciągnienia ultracienkich drutów i rysa powstająca na powierzchni drutu Fig. 3. Drawing model of 3-dimention a - Inclusion or void which is not in center, b - Flaw on wire surface Rys. 3. Trójosiowy model odkształcenia dala a - Wtrącenie lub wada, która nie jest umieszczona w środku drutu, b — Wada na powierzchni drutu T a b l e 1. Minimum diameter of superfine wires in Japan Tabela 1. Minimalne średnice supercienkich drutów produkowanych w Japonii Materiał Special mild steel Diameter (ura) Market Use of the products Laboratory Mild carbon steel -15 -100 High carbon steel 150-16 100-10 30-15 20-10 Screen mesh, mesh of the filter, wire ropę 100-50 10-5 Mesh of the filter, wire ropę, stiffening wire Fishing linę, antenna Stainless steel Titanium Shape-memory alloy -40 -12 Fishing linę - Screw. pin, bolt, electronic wire Amorphous 20-15 -10 30-10 Gold 50-15 -15 Copper 15-10 Aluminum 30-20 15-7 -20 Steel cord, sawing wire, cable, spring Sensor, stiffening wire Bonding wire Electronic wire, bonding wire Electronic wire, bonding wire S. 138 Nr 2 HUTNIK - WIADOMOŚCI HUTNICZE Drawing direction T a b l e 2. Materiał property for FEA Tablica 2. Własności materiału wykorzystane w procesie modelowania metodą elementów skończonych. Materiał Young's modulus E/MPa Initialyield stress <ry/MPa Fig. 4. Mesh deformation of drawn wire contains an inclusion Rys. 4. Siatka odkształcenia opisującą proces ciągnienia drutu zawierającego wtrącenie 90.0 88.0 - 2 - 1 0 1 Position of the axłal wire a/x Fig. 5. Wire diameter changes during wire drawing with an inclusion Rys. 5. Zmiany średnicy drutu podczas procesu ciągnienia drutów z wytrąceniami (a) h 0 /r 0 =0 (b) Vr0=0.2 (c) h 0 /r 0 =0.4 (d) h0/r0=0.6 Fig. 6. Hydrostatic stress distributions during wire drawing with an inclusion Rys. 6. Rozkład naprężeń hydrostatycznych w procesie ciągnienia drutów z wtrąceniami b) Inclusion Void Fig. 7. Wire misalignment during drawing with an inclusion and a void and shape of drawn wire a ~ Mesh deformation. b - Shape of drawn wire Rys. 7. Niewspóiosiowość drutu podczas procesu ciągnienia drutów z wtrąceniami i z wadą a - Odkształcenie siatki, b - Ksztah ; u^nwnego drutu Poisson's ratio v Wire Inclusion Copper 106300 Cemented carbide 588400 228 0.34 1570 0.20 center of the wire. Using three-dimensional FEA, the influence of inclusions which are located away from the center on wire breaks was investigated keeping the size of the inclusion constant (Fig. 3a). Fig. 4 shows mesh deformation of a wire, in which an inclusion is positioned at h0/r0 = 0.6, after one-pass drawing. Similar to the case of two-dimensional FEA, when a wire is drawn which has an inclusion located away from the center, necking readily occurs in front of the inclusion. Fig. 5 shows the change in the diameter of the drawn wire (dn = \rnl + |r„ 2 |). The abscissa in Fig. 4 indicates the position in the drawing direction; it is O at the center of the inclusion, and 0.5 and —0.5 at the front and back ends of the inclusion, respectively. When a wire with this type of inclusion is drawn, necking occurs in front of the inclusion and bending occurs throughout the wire. The degrees of necking and bending increase as the inclusion approaches the surface of the wire. It is considered that when the inclusion reaches the surface of the wire, the wire is subjected to stress concentration due to process deformation, leading to an increased degree of necking. The hydrostatic stress distribution of the wire as the inclusion passes through the die is shown in Fig. 6. High tension is generated in front of and behind the inclusion. The closer the inclusion is to the surface of the wire, the higher the compressive stress. As indicated in Fig. 6, the authors find that when an inclusion is present in a wire, the wire is subjected to non-uniform processing. Hence. the behaviour and bending of a wire with an inclusion or void during drawing were examined. Fig. 7 shows a schematic diagram of the introduction of the wire into a die and bending of the wire after processing, for h0/r„ = 0.6. As shown in the figurę, when an inclusion or void passes through a die, the back of the wire is introduced into the die with a certain angle of deviation. When the wire contains an inclusion, the back of the wire is deflected to the side which contains the inclusion; on the other hand, when the wire contains a void, the back of the wire is deflected to the side which does not contain the void. The closer the inclusion or void is to the surface of the wire, the greater the amount of deflection. In addition, bending occurs in the wire after drawing. When the inclusion or void is located away from the center, the processing condition of the wire in the radial direction is non-uniform. Accordingly, deflection at the back of the wire arises, as well as non-uniform processing and residual stress in the drawn wire, leading to bending of the wire. 3.2. Growth of transversal crack in wire surface by repeated drawing. The authors investigated the growth process of flaws by repeated drawing, assuming the presence of a transversal crack on the surface of a wire rod. First a 2-mm-deep traversal crack was formed on an elemental wire rod (q> 10 mm) and wire drawing with a die half-angle a of 6 deg and a one-pass reduction R/P of 20 % was repeated. Fig. 8 shows a schematic of the growth process of transversal cracks. Even when the total reduction Rt approaches 90 %, the linear scratch and satin-finished surface concavity remain; this fact suggests that once a deep crack is developed, it does not disappear easily under generał drawing conditions. Next, the growth of the flaw was obseryed on the axial cross section (Fig. 9). Fig. 9 shows micrographs of the wire rod after 2, 4, 8 and 15 passes of drawing. The corner of the flaw (circled in Fig. 9b) is subjected to shearing deformation as explained above and slanting of the flaw is induced. After repeated drawing, the length of 2005 r. HUTNIK - WIADOMOŚCI HUTNICZE Transversal crack Drawing direction S. 139 ly drawn, the flaw grows into a defect shape which is similar to that of a check mark. Acknowledgnient. This work has been supported by Japan Society for the Promotion of Science (No. 15360393). We sincerely thank Mr. K. Maeda at MSC Software Japan Co., Ltd. References Rt = 90% Fig. 8. Schematic diagram of growth process of surface crack by repeated drawing Rys. 8. Schematyczny diagram procesu wzrostu defektów powierzchniowych w kolejnych ciągach (d)<|>1.7mm ISpass. Rt=97.1°/ Fig. 9. Micrographs of flaw in cross section of wire after 2 to 15 passed of drawing Rys. 9. Mikrografia płynięcia na przekroju poprzecznym drutu po 2 i 15 ciągach the oyerlap flaw increases. The oyerlap flaw rolls over the wire surface which may lead to peeling of the wire subjected to 15 drawing passes. 4. Conclusions. The influence of inclusions and voids located away from the center of the wire on wire breaks, and the growth of a flaw on the wire surface, were analyzed by FEA. Authors reached the following conclusions: a. 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