Temescal BJD-1800 E-Beam Evaporator

Temescal BJD-1800 E-Beam
Evaporator 1
System Overview
- Cryo-pumped for typical base pressures in the
low 10e-7 Torr range.
- Four pockets in the rotating hearth of the
electron gun which allows deposition of up to
four materials under one pump down.
- Thickness and deposition rate are controlled by
an Inficon IC/5 Deposition Controller.
- Nano3 provides a wide variety of materials for
e-beam deposition.
- This system is a mostly MANUAL system. Most
parameters need to be adjusted by the user.
- Only high-vacuum compatible samples are
permitted in this system. Zinc, brass, plastic
substrates, tape (expect for Nano3 supplied
Kapton tape) are NOT permitted. Photoresists
MUST be hard baked.
1
Upon Approaching the System
Figure 1
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-
Figure 2
Make sure the cryo pump temperature is 20K or less on the temperature gauge (Figure 1).
If not, stop and notify staff.
Make sure that the IG1 pressure is less that 1 x 10^-6 Torr (“High vacuum”; Figure 2). If not, stop
and notify staff.
Users are required to leave the system at high vacuum after deposition and are not allowed to
leave until the pressure has dropped to 1 x 10^-6 Torr or less.
Look at the logbook (Figure 3, next page) and make sure the person ahead of you has finished
and signed out. Legibly fill in your name (first and last name), the date, the load time, and the
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material you plan to deposit.
Upon Approaching the System
Figure 3
3
Venting the System
Figure 4
Figure 5
- Make sure the “Vent Switch” on the
Vacuum Control is in the “Auto” (up)
position (see left red arrow in Figure 4).
- Push the “Auto Stop” Button (right red
arrow in Figure 4). The system will
automatically vent (it will close the high
vac valve and roughing valve, and open
the high vac vent valve). As the system
vents, the IG1 gauge (Figure 5) will turn
off, and the PG1 gauge will begin to
display a pressure reading, slowly
increasing to ~760 Torr (atmospheric
pressure).
- The Ion Gauge (“IG1”) reads pressures
between 10^-4 Torr and 10^-12 Torr,
and the Pirani Gauge (“PG1”) can reads
pressures from slightly above
atmospheric to 10^-4 Torr.
4
Venting the System
Top
View Port Slide
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Crystal Monitor
Once the system is vented you will
open the lid. Be careful as it is heavy.
Once the lid is open (Figure 6), check
that a large clean glass slide has been
installed over the viewport. This
protects the viewport from being
coated with material, which would
make it impossibly to view inside the
system from outside once the system in
again evacuated. Do not forget the
glass slide; a coated viewport will need
to be replaced and is very expensive.
If you have to replace the slide because
it is coated, be careful that you insert
the new slide correctly, and the corner
does not get caught on the viewport.
Bottom
Figure 6
5
Checking the Quartz Crystal Monitor
1
2
3
Figure 7
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Figure 8
The Quartz Crystal Monitor (QCM) is used to measure the deposition rate and the thickness deposited.
Look at the IC/5 Controller and the keypad next to it (Figure 7). Then press the F2 Button next to “Sensors”.
In the sensors screen, you will see two lines, the first one is the only one that matters. Look at the “LIFE” column (Figure 8),
the reading should be between 0-10, if it is over 10, the crystal needs to be replaced.
“Life” is a measure of the amount of material deposit on the surface of the crystal. Increasing thickness of deposit affects the
accuracy of the measurement. The loss in accuracy is minimal up to “Life” readings of 10. Heavier materials, such as nickel,
will drain the crystal life faster than lighter elements, such as aluminum.
If the crystal needs to be replaced, notify staff.
Users ARE NOT allowed to change the crystal on this system.
Press the F6 button next to “Operate” to return to the home screen (Figure 7).
Note that the code “xtal fail” will show on the bottom right of both the home and sensors screen if the crystal is improperly
seated or broken. This also means the crystal needs to be replaced.
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Checking the Materials
Open
Close
Figure 9
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Figure 10
Move the shutter control switch to “OPEN” to open the shutter (Figure 9). Look into the chamber.
Verify that the material in the crucible in the indicated pocket (Figure 10) matches with the magnetic
tag on the door (Figure 11, next page). The material is inscribed on the bottom of the crucible (Figure
12, next page).
If they do not match or you want a different material, look for the crucibles and tags for E-Beam 1 in
the cage opposite the machines. NOTE that E-Beams 1 and 2 have different crucibles and tags.
E-Beam 1 takes larger crucibles in general but actually has 3 sizes of crucibles.
7
Checking the Materials
Figure 11
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Figure 12
Once you are satisfied with the material, turn the turret source selector CLOCKWISE to the next crucible; this means if you are
starting at A, then go to B, check the crucible, then go to C, check the crucible, then go to D, check the crucible, and then go
back to A (Figure 9, previous page).
DO NOT turn the turret selector backwards (COUNTERCLOCKWISE) as you will damage the selector.
Verify or change each material as desired and make sure you put up the corresponding tag for that material. Put unwanted
materials back in their respective empty cases.
Be efficient and put materials into turret pockets in the same order you will deposit them in.
When you finish, close the shutter by setting the switch to “close” (Figure 9).
The only two materials not inscribed on the bottom of the crucible are chromium and gold. Chromium comes in greyish green
pieces which evaporate individually and do not melt. Gold is colored differently than the other metals but behaves similarly as
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the others during evaporation.
Loading Your Sample (Default Sample Plate)
Default
Sample
Plate
Clips
Figure 13
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Figure 14
The default sample plate is shown in Figure 13. Your sample will be attached to the plate facing
downward.
We recommend that all samples be clipped to the plate with screws and clips. Use of Kapton
tape is not explicitly forbidden but it is not recommended (Figure 14).
We advise against the use of Kapton tape because its adhesive will outgas under vacuum
(especially as the sample heats up during evaporation) and contribute contaminants to your
sample. Furthermore, as the sample temperature increases, the adhesion of the tape may also
sufficiently weaken for your sample to fall off the holder. At minimum, the reduced adhesion will
affect the heat transfer from your sample to the sample holder, causing it to overheat more
readily.
If you do use Kapton tape, you MUST clean the holder of all tape residue after use.
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Loading Your Sample (Alternate Sample Holders)
Sample Holder
With Thermocouple
Small Sample
Holder
Heat Shield
Figure 15
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Figure 16
There are two other sample plates/holders that can be used in E-Beam 1. The plate shown in
Figure 15 has a round cut-out in the center to hold small sample holders (not provided). The
small sample holders can, for example, be configured to mount samples at angles.
The sample holder shown in Figure 16 is fitted with a thermocouple for temperature
measurement. This holder also allows you to cool samples with coolant. The heat shield
helps to reduce the heat load on the holder during evaporation by lowering the heat
reflected from the sample lid. Samples mounted to this particular holder are further away
from the electron gun, and real deposition rate/thickness is about ½ lower than recorded by
the IC/5 controller. You should to a test run to determine the exact correction factor.
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Contact Nano3 staff for details on how to use these alternate sample holders.
Pumping Down the System
Auto Start
Auto Stop
Figure 17
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Figure 18
Before pumping down the system, check the sealing surface of the lid and the o-ring by visually inspecting
for debris (usually shiny small metal flakes if any) and running a clean glove along the surfaces.
If something needs to be cleaned off, use one of the soft polyester cleanroom wipes NOT the stiffer,
polycellulose cleanroom wipes (these would shed particles on the o-ring).
DO NOT USE ANY SOLVENT, only dry wipes.
Close the lid of the system gently, make sure it is seated well, and then turn the mechanical pump switch on
by pulling it up (Figure 17).
Wait five to ten seconds, then press “Auto Start” (Figure 18). Waiting prevents an imbalance of pressures in
the roughing line and the chamber, which can cause roughing pump oil to leak back into and contaminate 11
the system.
Pumping Down the System
Numbers in small font indicates gauge warmup
Figure 19
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Figure 20
The system will rough pump down to about 62-63 mTorr (displayed on the PG1 readout, Figure 19), at which point the
system will close the roughing valve. The system will then sit idle for about 5 seconds to perform a leak check. If the
system drifts above 70 mTorr (the leak test failed), the system will repeat the leak check. This process will repeat over
and over, and so the user must vent the system by pressing auto stop (Figure 18, previous slide), wait until the system
is vented, and then check the o-ring and sealing surface again before attempting to pump the system again.
When the system passes the check, the high vacuum valve will automatically open, and the PG1 reading will drop to 0
(Figure 19). At the same time, IG1 display will start to display numbers in small fonts as the gauge warms up. When
the IG1 readout switches to large font and displays a pressure reading, turn off (down) the mechanical pump switch
(Figure 20).
In general, the system should take about 20 minutes to fully pump down. If the system was open for an extended
period of time, or if samples outgas, this time will increase.
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Material Properties
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The system pressure will affect the qualities of the evaporated films. With lower
systems pressures, fewer contaminants from residual gas (mostly water) will be
incorporated into the deposited films.
Wait for the system pressure to drop below 9x10^-7 Torr before evaporating any
material. When you evaporate highly reactive materials such as titanium or chromium,
you will notice that the pressure rapidly drops during deposition because the deposited
material will readily bind residual gas molecules. During evaporation of less reactive
materials, such as gold, silver, etc., you will not tend to see this. Titanium or chromium
are frequently used as adhesion layers for subsequently evaporated materials, and you
may want to let the pressure drop as low as possible to make sure that the adhesion
layer is not oxidized before you begin evaporation of the second material.
For materials with high melting points more electron beam power must typically be
used in order to evaporate. This tends to increase the chamber temperature, causing a
pressure increase and decreasing film quality. You should wait to attain a pressure as
low as possible before evaporation of these materials (below 1x10^-7 Torr).
The electron beam power used will affect surface roughness, density, grain size, etc.
Typically, deposition at higher rates (i.e. more power, e.g. 4 angstroms/sec) results in
rougher surfaces and lower film density. Deposition at lower rates (i.e. less power, e.g.
0.5 angstroms/sec) tends to result in smoother, denser films.
You are encouraged to run dummy samples in the system to optimize film quality for
your application.
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Programing the Deposition Controller
Active Process
2
1
Figure 21
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Figure 22
1. WHILE THE MACHINE IS PUMPING DOWN, look at the IC/5 Deposition Controller and the
keypad next to it. Then press the F6 Button next to “Program” (Figure 21).
2. Then press F2 next to “Process Directory” (Figure 22).
3. Use the up and down arrow keys to scroll through the materials and select the material
you want to run. Scrolling through the bottom takes you back to the top of the page. If your
material is not listed on this page, press F1 next to “Page Forward” to see more pages of
materials (Figures 23 and 24, both on next page).
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Programing the Deposition Controller
3
4
5
Figure 23
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Figure 24
4. Once the material is selected, press F4 next to “Select Active Process”. The active process
listed in the upper right hand corner of the screen should now reflect the process that was
selected (Figures 22, on previous page, and 24).
5. Press F6 for “Program” and F6 again for “Operate” to return to the home page (Figure 24).
Be sure the home page reads the material that was selected in the middle top, and be sure
the material in question is in the turret selected (turn the turret to it if needed). Do not
forget to turn the turret to the current material when depositing different materials in a row.
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Turning on the Beam
Power
Switch
Figure 25
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Figure 26
Now that the pressure is correct, the deposition process can begin.
Turn on the main power circuit breaker switch (lift up until it clicks) on the high voltage power supply
next to the system. Note that this might take a forceful touch (Figures 25 and 26).
Make sure you can feel or hear the fan turn on inside the grate on top of the power supply. This fan
cools the power coils and is essential. If it does not turn on, turn off the power switch (press down)
and notify staff immediately. DO NOT continue the deposition process, you will damage the system.
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Turning on the Beam
Interlock Switches
Air
Key
Figure 27
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-
Go to the “High Voltage Control” and turn the key to the “On” position (Figure 27).
ALL six buttons above the key should light up immediately. These are interlock switches which indicate faults in
specific parts of the system. In general, when the key is turned, the first light to turn off is the core fault. DO NOT
continue the deposition process if ANY of the lights do not turn on. Turn the key to the “Off” position, turn the
power supply switch to off and notify staff (Figure 27).
If you find that the only light off is the “Air” light (indicative of an issue with compressed air supply to the system),
wait several minutes to see whether the issue resolves itself. If not, turn the power supply switch to off and notify
staff.
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Turning on the Beam
Voltage Gauge
Interlock Switches
HV On
Gun 1 Fil On
Gun 1 Fil Off
Figure 28
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Figure 29
Press firmly and hold the red “HV On” button (“High Voltage Control”, Figure 28) for 2-3 seconds to turn on the high
voltage. You should hear a click when you release the button. The needle on the voltage gauge should now swing
up to between 9-10 kV.
WARNING, once HV is on and the voltage gauge displays 9-10kV the user must never leave the system until HV is
turned off.
Press firmly and hold the red “Gun 1 Fil On” button (“Gun Control 1”, Figure 29) for 2-3 seconds to turn on the gun.
You should hear a click when you release the button. Again all three interlock switches should light up, if they do
not, turn off the gun, the high voltage, and the power source and notify staff.
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Turning on the Beam
Voltage Gauge
Emission
Current Knob
Figure 30
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-
Figure 31
Check through the upper viewport that the chamber is now illuminated by a brownish/yellow light (Figure 30). If
this is not the case, but the interlock switches are all on (for high voltage and the gun), then the “Gun Fil On” switch
was not depressed firmly enough. Press “Gun Fil Off”, wait 2-3 seconds, the press “Gun Fil On” more firmly and
check the interlocks and viewport again (Figures 29, previous page, and 30).
Using ONLY THE INNER Gun “Emission Current” knob slowly increase the gun emission until the needle on the
current gauge above the knob reads 0.4 and wait 1 minute (Figure 31).
Note the IG1 pressure indicated on the pressure controller screen. This is the base pressure which must be recorded
in the log book (Figure 32, next page).
Also note that the outer portion of the “Emission Current” knob will turn slowly on its own as you turn the inner
knob, do not directly turn the outer portion of the knob. (Figure 31).
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Turning on the Beam
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Figure 32
After you have waited one minute and recorded the system base pressure, gently and uniformly turn the
INNER emission knob again until the gauge reads 0.6. Wait another full minute. Repeat this in increments of
0.2 with 1 minute breaks until you get to 1.0 THEN after the last one minute break, gently turn the INNER
emission knob until the gauge reads 1.05 (note that the increment has changed from 0.2 to 0.05). Wait
another minute (Figure 31, previous page).
The XYS-8 Sweep Control (Figure 33, next page) is used to position the electron beam inside the crucible and
to set up a beam motion pattern (“sweep”) to optimize evaporation.
Once the emission current gauge reads 1.05, make sure that the “Long frequency” and “Lat frequency” dials
on are set to 1, the lowest frequency possible. This will let you observe the electron beam travel during
adjustment. The LATERAL sweep knob (“Lat Sweep” in Figure 33) should also be turned all the way
counterclockwise (off) by the previous user, with the longitudinal sweep knob (“Long Sweep” in Figure 33)
left as is. Look through the upper viewport and switch the shutter switch to the “Open” position. You
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should see a faint line moving up and down over the crucible (Figure 34, next page).
Setting Up the Beam
Long Frequency
Lat Frequency
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Long Beam Long
Position Sweep
Figure 33
Lat Beam Lat
Position Sweep
Beam
Long
Crucible as seen
through viewport
Lat
Figure 34
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It is critical that the electron beam is set up
correctly in order to avoid possible damage to
the system!
NOTE the arrows indicating the directions for
the longitudinal and lateral beam adjustments
shown in Figure 34.
Adjust both the Longitudinal and Lateral
“Beam Position” knobs until the line formed by
the electron beam is centered in the crucible.
If the ends of the beam are outside or
touching the inner edges of the crucible, turn
the Longitudinal sweep down
(counterclockwise) to shrink the line until it is
just within the inner edges of the crucible.
Likewise, turn Long sweep up if the line does
not extend to near the inner edge of the
crucible.
Adjust the beam position so that both ends of
the beam have equal gaps with the inner edge
of the crucible (see Figure 35, next page).
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Setting Up the Beam
Gaps are
equal
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Figure 35
Ideally, the beam should be close to the inner edge but not touching the edge of the crucible, in order to avoid
evaporation of carbon from the crucible. Adjust the beam position until this is accomplished.
Increase (turn clockwise) the lateral “sweep” knob and so that the beam forms a figure 8 sweep pattern that is
evenly centered without touching any of the crucible edges and covers the most area of the material possible
(Figure 35).
The “Long” and “Lat” frequency settings on the XYS-8 Sweep Control (Figure 33, previous page) can be set as 1,
2, 3….. To 0 (Note that the setting “0” is the highest (NOT lowest) setting!)
Adjust the “Long” frequency setting to 0 and the “Lat” frequency to 9.
NOTE: DO NOT USE THE LAT FREQUENCY SETTING OF 0! (Your beam would jump, spatter material, possibly ruin
your sample.
The frequencies should not be set to 8 or lower as only the center portion will melt. This would require for the
power to be increased for the rest of the material to melt, resulting in higher chamber temperature, higher
pressure, and typically poorer film quality. Higher frequency (9 or 10) results in a better coverage of the crucible
material by the beam and a more even melt without the need for more power.
BE AWARE that all the materials except chromium have a mirror finish when melted, which results in a reflected
beam image to also be visible. Make sure you can tell where the beam truly is.
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Setting Up the Beam
Figure 36
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-
Also note that different materials will develop convex or concave surfaces when melting which
affects the beam reflection. Make sure you take this into account when identifying the beam’s
reflection in the material vs. the beam itself.
Once the beam has been set up properly, switch the shutter switch back to “Close” (Figure 36).
Note that the surface of each material will be very lightly contaminated from previous runs. As
the material heats up with the shutter open while you set up the beam, this contamination
might evaporate and could slightly contaminate your sample. Efficient set up of the beam will
minimize the possibility of light contamination.
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Temperature Properties
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Figure 37
Depending on the beam power and material being deposited, the temperature measured at the
sample holder can be very high (as high as 220 degrees Celsius). You need to be aware of the
properties of the photoresist used on your samples. If the sample temperature is allowed to reach too
high a temperature, you may burn the resist. If the temperature becomes equal or close to the hard
bake temperature of the resist, the resist can lose viscosity, which can result in wave-like patterns
forming on the resist. If the temperature becomes too high, you may lose your sample. You need to
make an effort to minimize power used whenever possible in order to avoid a loss of your sample.
The temperature readout for the sample plate is located just behind and to the right of the lid when
facing the machine (Figure 37).
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Beam Properties
Figure 38
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In order to ramp up the beam further to correct power for deposition, you must go to the log book
(Figure 38) and look at the most recent deposition runs for the materials you will be using. DO NOT
look at old deposition values. Look at the max current and deposition rates given by the previous
user. If a current seems high for a given deposition rate (angstroms/sec), then it is probably because
the beam itself was not setup properly. Always undershoot the values in the log book to
compensate for the different beam setups. A slower deposition rate is much more fixable than one
that is too high.
NOTE that optimization of film characteristics for your particular application is FULLY the
responsibility of the user.
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Beam Properties
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For some materials (e.g. nickel, gold, silver), you need to initially ramp up the current to a HIGHER
level then is required for deposition in order to start the melting process. Once the material melts,
the deposition rate will suddenly increase GREATLY (going up by more than 1 angstrom/second). At
this point, you need to reduce the current using the emission current knob to the level appropriate
for your desired deposition rate (Figure 39, next page).
Five magnetic materials are allowed in this system: Nickel, Iron, Cobalt, Permalloy (Nickel-Iron
Alloy), and Nickel-Chromium Alloy. The magnetism of these materials will affect the position of the
electron beam. Once the material reaches its Curie temperature upon heating, its magnetic
properties change, resulting in a sudden shift of the electron beam position.
To correct for this, the beam must be adjusted twice. When the emission current is adjusted initially
to a value of 1.05, position the beam (it will be shifted substantially from the position it would have
with a non-magnetic material, e.g. titanium). THEN, as you increase the beam emission current,
causing the material to heat up, approximately when the material begins to glow orange, the beam
will suddenly shift and needs to be readjusted. Start checking the beam position by briefly opening
the shutter and adjust the beam when the emission current readout is at a value of 1.3 (you will
need to reposition the beam in the opposite direction then when you initially set it up while at an
emission current readout value of 1.05).
NOTE, if you initially forget to do the second readjustment, VERY SLOWLY try to reposition the beam
to the correct position and adjust for your desired deposition rate. If the beam is out of position,
and you were to rapidly re-position it, you would cause the material to pop and splatter, and very
likely ruin your sample.
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Deposition
Voltage Gauge
Open
Emission
Current Knob
Close
Figure 39
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Figure 40
Once you know the appropriate power and deposition rate desired, you may continue to ramp up the power IN INCREMENTS OF
0.05 using the emission control knob with one minute rest between adjustments (Figure 39).
When the appropriate power is reached, open the shutter (shutter switch to “open”; Figure 40) so that the crystal monitor and
sample are exposed to the evaporating material (and the deposition rate can be read on the IC/5 deposition controller).
NOTE that while the shutter is closed, the rate displayed on the IC/5 might be negative (no material is reaching the crystal monitor).
When the shutter is opened, vibration from the shutter movement will cause a brief immediate negative drop in the rate that is not
actually occurring, leading to an error in the recorded thickness reading on the IC/5. Wait with your finger over F1 on the homepage
until the rate becomes zero again and immediately press F1 to zero the thickness (Figure 41, next page).
NOTE that the maximum deposition rate allowed is 3 angstroms/sec for aluminum and 4 angstroms/sec for all other materials. DO
NOT increase the power beyond this value, you will cause possible damage to the system.
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Deposition
Long Frequency
Figure 41
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-
Long Beam Long
Position Sweep
Figure 42
Lat Frequency
Lat Beam Lat
Position Sweep
If you observe the deposition rate to be too high or too low, you may adjust the emission control slowly (increments of 0.1 with 1
min breaks between adjustments) WITH the shutter remaining open until you reach the desired rate. It is impossible to control the
deposition rate to within 0.1 angstroms/second (Figures 39, previous page, and 41).
For longer deposition runs, you MUST keep watch over the deposition rate as it may change over time due to temperature
increase within the chamber. Adjust the emission control dial as explained above to maintain the desired deposition rate.
Periodically verify that the beam is still centered correctly. If it is not, use the “Long” and “Lat” beam position knobs to re-center it.
Beam drift is more common with longer deposition runs (Figure 42).
At exactly halfway through your deposition time, record the emission current control setting, evaporation (deposition) rate, and
pressure during evaporation in the log book (Figure 43, next page).
Close the shutter about one second BEFORE you reach the desired thickness, this compensates for the closing time of the shutter
(Figure 40, previous page).
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Powering Down
Voltage Gauge
Emission
Current Knob
Gun Fil On
Gun Fil Off
Figure 43
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Figure 44
Record the final thickness in the log book (Figure 43).
Ramp down the power in 30 second increments of 0.2 all the way until 0. Ramping down the power slowly helps keep the
filament from warping, which keeps the beam straight and focused. Remember that this means ramping down from 0.4 to 0.2 to
0 with 1 minute breaks between adjustments. DO NOT ramp down from 0.4 directly to 0 (Figure 44).
IMPORTANT: IF YOU ARE GOING TO DEPOSIT ANOTHER MATERIAL, FIRST press the “Gun Fil Off” button, THEN turn the turret to
the next material you are depositing and press “Gun Fil On”. Turning off the gun between switching materials is a failsafe so that
in the event of a short circuit in the power supply (where the beam bypasses the controller and emerges at full power) there will
be no damage to the copper hearth while the turret is turning (Figure 45, next page).
Hitting the copper hearth with the full beam power while turning could easily cut damage the hearth and flood the chamber with
cooling water, causing great damage to the system.
Once you have selected the proper material, make sure to go back and program this material as the active process using the IC/5
deposition controller (See “Programing the Materials” section, page 14).
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Powering Down
Voltage Gauge
HV Off
Figure 45
Figure 46
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-
At this point the process is the same as for the previous material beginning at when you initially pressed “Gun Fil On”
(Page 18). In short, check for the light in the chamber, ramp up the power, deposit, and ramp down and repeat the entire
process for as many material depositions as necessary (See “Turning on the Beam” section, page 18).
IF YOU ARE FINISHED, then continue by pushing “Gun 1 Fil OFF” (Figure 44, previous page). Then press the “HV Off”
button (voltage should drop back to 0 on the voltage gauge) and turn the key back to the off position (Figure 46).
Then, make sure all frequencies are turned back to 1 and the LATERAL “SWEEP” dial ONLY is turned off (fully
counterclockwise). The longitudinal “SWEEP” should remain untouched (Figure 47, next page).
Then turn off the high voltage power supply by pressing down the main power circuit breaker switch (Figure 48, next
30
page).
Powering Down
Long Frequency
Lat Frequency
Figure 48
Figure 47
Lat
Sweep
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Venting and Pumping the System
Auto
Start
Auto
Stop
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Figure 49
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Figure 50
Push the “Auto Stop” Button on the Vacuum Control
(Figure 49). The system will automatically close the high
vac valve, make sure the roughing valve is closed, and
open the high vac vent valve. As the system vents, the
IG1 gauge will turn off, and the PG1 gauge will begin to
display a pressure reading.
When the chamber has fully vented, make sure to
remove your sample first (to avoid contamination from
recent deposition and debris).
Remove any sample holders that are not the built in
sample holder (i.e. the one attached to the system lid
(Figure 16).
Replace the glass slide over the viewport with a fresh
one from the table for the next user, and then repeat the
instructions for pumping down the system (See
“Pumping Down the System” section, page 11).
When you turn on the mechanical pump switch and
press “Auto Start” to pump down, record this time as the
unload time in the log book (Figure 50 and 51, next
page).
STAY with the system until it reaches high vacuum again
(until the IG1 gauge has turned on and the pressure
reading is 1x10^-6 Torr or below).
MAKE SURE the mechanical pump switch is then turned
off, complete the log book entries, and you are finished
with the system (Figure 51, next page).
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Venting and Pumping the System
Figure 51
33