MC13135 MC13136 FM Communications Receivers - PL-1

Transcription

MC13135 MC13136 FM Communications Receivers - PL-1
MC13135
MC13136
FM Communications Receivers
The MC13135/MC13136 are the second generation of single chip, dual
conversion FM communications receivers developed by Motorola. Major
improvements in signal handling, RSSI and first oscillator operation have
been made. In addition, recovered audio distortion and audio drive have
improved. Using Motorola’s MOSAIC 1.5 process, these receivers offer
low noise, high gain and stability over a wide operating voltage range.
Both the MC13135 and MC13136 include a Colpitts oscillator, VCO tuning
diode, low noise first and second mixer and LO, high gain limiting IF, and
RSSI. The MC13135 is designed for use with an LC quadrature detector and
has an uncommitted op amp that can be used either for an RSSI buffer or as
a data comparator. The MC13136 can be used with either a ceramic
discriminator or an LC quad coil and the op amp is internally connected for a
voltage buffered RSSI output.
These devices can be used as stand–alone VHF receivers or as the lower
IF of a triple conversion system. Applications include cordless telephones,
short range data links, walkie–talkies, low cost land mobile, amateur radio
receivers, baby monitors and scanners.
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DUAL CONVERSION
NARROWBAND
FM RECEIVERS
P SUFFIX
PLASTIC PACKAGE
CASE 724
24
1
DW SUFFIX
PLASTIC PACKAGE
CASE 751E
(SO–24L)
24
Complete Dual Conversion FM Receiver – Antenna to Audio Output
1
Input Frequency Range – 200 MHz
Voltage Buffered RSSI with 70 dB of Usable Range
ORDERING INFORMATION
Low Voltage Operation – 2.0 to 6.0 Vdc (2 Cell NiCad Supply)
Low Current Drain – 3.5 mA Typ
Device
Low Impedance Audio Output < 25 Ω
Operating
Temperature Range
Plastic DIP
MC13135P
VHF Colpitts First LO for Crystal or VCO Operation
Isolated Tuning Diode
MC13135DW
Buffered First LO Output to Drive CMOS PLL Synthesizer
MC13136P
SO–24L
TA = – 40° to +85°C
MC13136DW
PIN CONNECTIONS
MC13135
1st LO
1st LO Base 1
1st LO Emitter
2
1st LO Out
3
VCC1
4
2nd LO Emitter
5
2nd LO Base
6
2nd Mixer Out
7
VEE
8
Limiter In
9
VCC1
2nd LO
VCC2
24
Varicap C
1st LO Base
1
23
Varicap A
1st LO Emitter
2
22
1st Mixer In 1
1st LO Out
3
21
1st Mixer In 2
VCC1
4
20
1st Mixer Out
2nd LO Emitter
5
19
VCC2
18
2nd Mixer In
AF
17
Audio Out
16
Op Amp Out
Varicap
2nd Mixer Out
7
VEE
8
Limiter In
9
24 Varicap C
22 1st Mixer In 1
VCC1
21 1st Mixer In 2
20 1st Mixer Out
2nd LO
VCC2
2nd LO Base 6
19 VCC2
18 2nd Mixer In
AF
17 Audio Out
16 Buffered RSSI Output
Demod
15
Op Amp In –
Decouple 1 10
Decouple 2 11
14
Op Amp In +
Decouple 2 11
RSSI 12
13
Quad Coil
Limiter
SO–24L
23 Varicap A
Demod
Decouple 1 10
Plastic DIP
MC13136
1st LO
Varicap
Package
RSSI 12
Limiter
15 Op Amp In –
14 Limiter Output
13 Quad Input
Each device contains 142 active transistors.
8–214
MOTOROLA ANALOG IC DEVICE DATA
MC13135 MC13136
MAXIMUM RATINGS
Rating
Pin
Symbol
Value
Unit
4, 19
VCC (max)
6.5
Vdc
RF Input Voltage
22
RFin
1.0
Vrms
Junction Temperature
–
TJ
+150
°C
Storage Temperature Range
–
Tstg
– 65 to +150
°C
Power Supply Voltage
RECOMMENDED OPERATING CONDITIONS
Rating
Pin
Symbol
Value
Unit
4, 19
VCC
2.0 to 6.0
Vdc
Maximum 1st IF
–
fIF1
21
MHz
Maximum 2nd IF
–
fIF2
3.0
MHz
Ambient Temperature Range
–
TA
– 40 to + 85
°C
Power Supply Voltage
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 4.0 Vdc, fo = 49.7 MHz, fMOD = 1.0 kHz, Deviation = ±3.0 kHz, f1st LO = 39 MHz, f2nd
LO = 10.245 MHz, IF1 = 10.7 MHz, IF2 = 455 kHz, unless otherwise noted. All measurements performed in the test circuit of Figure 1.)
Characteristic
Condition
Symbol
Min
Typ
Max
Unit
Total Drain Current
No Input Signal
ICC
–
4.0
6.0
mAdc
Sensitivity (Input for 12 dB SINAD)
Matched Input
VSIN
–
1.0
–
µVrms
Recovered Audio
MC13135
MC13136
VRF = 1.0 mV
AFO
170
215
220
265
300
365
–
130
–
Limiter Output Level
(Pin 14, MC13136)
mVrms
VLIM
mVrms
1st Mixer Conversion Gain
VRF = – 40 dBm
MXgain1
–
12
–
dB
2nd Mixer Conversion Gain
VRF = – 40 dBm
MXgain2
–
13
–
dB
First LO Buffered Output
–
VLO
–
100
–
mVrms
Total Harmonic Distortion
VRF = – 30 dBm
THD
–
1.2
3.0
%
Demodulator Bandwidth
–
BW
–
50
–
kHz
RSSI Dynamic Range
–
RSSI
–
70
–
dB
–
–
–17
–11
–
–
–
– 27
–
First Mixer 3rd Order Intercept
(Input)
Second Mixer 3rd Order
Intercept (RF Input)
TOIMix1
Matched
Unmatched
dBm
Matched
Input
TOIMix2
First LO Buffer Output Resistance
–
RLO
–
–
–
Ω
First Mixer Parallel Input Resistance
–
R
–
722
–
Ω
First Mixer Parallel Input Capacitance
–
C
–
3.3
–
pF
First Mixer Output Impedance
–
ZO
–
330
–
Ω
Second Mixer Input Impedance
–
ZI
–
4.0
–
kΩ
Second Mixer Output Impedance
–
ZO
–
1.8
–
kΩ
Detector Output Impedance
–
ZO
–
25
–
Ω
MOTOROLA ANALOG IC DEVICE DATA
dBm
8–215
MC13135 MC13136
TEST CIRCUIT INFORMATION
Although the MC13136 can be operated with a ceramic
discriminator, the recovered audio measurements for both
the MC13135 and MC13136 are made with an LC quadrature
detector. The typical recovered audio will depend on the
external circuit; either the Q of the quad coil, or the RC
matching network for the ceramic discriminator. On the
MC13136, an external capacitor between Pins 13 and 14 can
be used with a quad coil for slightly higher recovered audio.
See Figures 10 through 13 for additional information.
Since adding a matching circuit to the RF input increases
the signal level to the mixer, the third order intercept (TOI)
point is better with an unmatched input (50 Ω from Pin 21 to
Pin 22). Typical values for both have been included in the
Electrical Characterization Table. TOI measurements were
taken at the pins with a high impedance probe/spectrum
analyzer system. The first mixer input impedance was
measured at the pin with a network analyzer.
Figure 1a. MC13135 Test Circuit
VCC
0.84 µH
1st LO
0.01
24
Varicap
1
0.1
Figure 1.
23
20 p
39.0
MHz
Xtal
1.0 k
2
22
5.0 p
0.001
62 pF
3
VCC1
5.0 k
0.2 µH
21
20
5
120 p
50 p
10.245
MHz Xtal
2nd LO
Ceramic
Filter
10.7 MHz
VCC2
6
19
0.1
7
9
AF
17
Demod
10
0.1
0.1
360
18
8
Ceramic
Filter
455 kHz
RF
Input
0.01
4
0.1
180 p
8.2 k
0.1
Limiter
16
11
39 k
15
0.1
14
12
0.1
39 k
13
455 kHz
Quad
Coil
Figure 1b. MC13136 Quad Detector Test Circuit
VCC
AF
Demod
Limiter
16
39 k
15
12
0.1
14
39 k
13
455 kHz
Quad Coil
8–216
MOTOROLA ANALOG IC DEVICE DATA
MC13135 MC13136
1200
RSSI OUTPUT (mVdc, Pin 12)
5.0
4.0
3.0
RFin = 49.7 MHz
fMOD = 1.0 kHz
fDEV = ± 3.0 kHz
2.0
1.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
600
400
–120
–100
– 80
– 60
Figure 4. Varactor Capacitance, Resistance
versus Bias Voltage
Figure 5. Oscillator Frequency
versus Varactor Bias
10
CP, f = 150 MHz
RP, f = 50 MHz
8.0
6.0
10
4.0
CP, f = 50 MHz
5.0
2.0
RP, f = 150 MHz
1.0
1.5
2.0
2.5
3.0
3.5
0
4.0
47.5
47.0
0.61 µH
46.5
46.0
500 p
1 1st LO
24
23
45.5
27 p
2
500 p
0.2 µF
1.0 MΩ
VB
Varicap
5.0 p
45.0
1.0
2.0
3.0
4.0
5.0
6.0
VB, VARACTOR BIAS VOLTAGE, VPin24 to VPin 23 (Vdc)
VB, VARACTOR BIAS VOLTAGE (Vdc)
Figure 6. Signal Levels versus RF Input
Figure 7. Signal + Noise, Noise, and
AM Rejection versus Input Power
10
S+N
0
S+N, N, AND AMR (dB)
10
Second Mixer Output
POWER (dBm)
– 20
48.0
30
–10
–30
First Mixer Output
First Mixer Input
–50
– 90
– 80
– 70
– 60
– 50
–10
– 20
– 30
– 40
RFin, RF INPUT (dBm)
MOTOROLA ANALOG IC DEVICE DATA
– 30
– 20
S + N 30% AM
– 40
– 50
– 60
Second Mixer Input
– 70
–100
– 40
RF INPUT (dBm)
15
0
0.5
800
VCC = 4.0 V
RFin = 49.67 MHz
fMOD = 1.0 kHz
fDEV = ± 3.0 kHz
VCC, SUPPLY VOLTAGE (V)
25
20
1000
200
–140
8.0
f, FREQUENCY (MHz)
0
0
C P , EQUIVALENT PARALLEL CAPACITANCE (pF)
Figure 3. RSSI Output versus RF Input
1400
R P , EQUIVALENT PARALLEL RESISTANCE (k Ω)
I CC , SUPPLY CURRENT (mA)
Figure 2. Supply Current versus Supply Voltage
6.0
– 70
–130
VCC = 4.0 Vdc
RFin = 49.67 MHz
fMOD = 1.0 kHz
fDEV = ± 3.0 kHz
–110
N
– 90
– 70
– 50
– 30
RFin, RF INPUT (dBm)
8–217
MC13135 MC13136
Figure 8. Op Amp Gain and Phase
versus Frequency
Figure 9. First Mixer Third Order Intermodulation
(Unmatched Input)
80
Gain
10
0
160
–10
200
– 30
240
– 50
10 k
100 k
R
R = 68 kΩ
455 kHz
Quad Coil
Toko 7MC–8128Z
R = 47 kΩ
R = 39 kΩ
500
0
±1.0
± 3.0
± 5.0
± 7.0
± 9.0
– 40
– 20
8.0
VCC
7.0
13
R = 68 kΩ
455 kHz
Quad Coil
Toko 7MC–8128Z
6.0
5.0
R = 47 kΩ
4.0
3.0
2.0
R = 39 kΩ
1.0
±1.0
± 3.0
± 5.0
± 7.0
± 9.0
Figure 13. Distortion versus
Deviation for MC13136
VCC
muRata
C R 455 kHz
Resonator
CDB455C34
R = 2.7 kΩ
C = 270 pF
R=∞
C = 660 pF
200
R = 1.2 kΩ
C = 100 pF
± 4.0
± 5.0
± 6.0
± 7.0
fDEV, DEVIATION (kHz)
± 8.0
± 9.0
0
R
Figure 12. Recovered Audio versus
Deviation for MC13136
400
8–218
– 60
fDEV, DEVIATION (kHz)
600
0
± 3.0
– 80
fDEV, DEVIATION (kHz)
THD, TOTAL HARMONIC DISTORTION (%)
RA, RECOVERED AUDIO (mVpp)
800 13
–100
–100
Figure 11. Distortion versus
Deviation for MC13135
1000
14
3rd Order
Intermod
Products
Figure 10. Recovered Audio versus
Deviation for MC13135
1500
1000
Desired Products
– 60
RF INPUT (dBm)
VCC
13
– 40
– 80
280
10 M
– 20
f, FREQUENCY (Hz)
2000
RA, RECOVERED AUDIO (mVpp)
1.0 M
0
THD, TOTAL HARMONIC DISTORTION (%)
AV , GAIN (dB)
Phase
MIXER OUTPUT (dB)
120
30
20
φ, EXCESS PHASE (DEGREES)
50
10
VCC
14
8.0 13
C R
6.0
muRata
455 kHz
Resonator
CDB455C34
R=∞
C = 660 pF
R = 2.7 kΩ
C = 270 pF
4.0
2.0
0
± 3.0
R = 1.2 kΩ
C = 100 pF
± 4.0
± 5.0
± 6.0
± 7.0
± 8.0
± 9.0
fDEV, DEVIATION (kHz)
MOTOROLA ANALOG IC DEVICE DATA
MC13135 MC13136
CIRCUIT DESCRIPTION
The MC13135/13136 are complete dual conversion
receivers. They include two local oscillators, two mixers, a
limiting IF amplifier and detector, and an op amp. Both
provide a voltage buffered RSSI with 70 dB of usable range,
isolated tuning diode and buffered LO output for PLL
operation, and a separate VCC pin for the first mixer and LO.
Improvements have been made in the temperature
performance of both the recovered audio and the RSSI.
VCC
Two separate VCC lines enable the first LO and mixer to
continue running while the rest of the circuit is powered down.
They also isolate the RF from the rest of the internal circuit.
Local Oscillators
The local oscillators are grounded collector Colpitts, which
can be easily crystal–controlled or VCO controlled with the
on–board varactor and external PLL. The first LO transistor is
internally biased, but the emitter is pinned–out and IQ can be
increased for high frequency or VCO operation. The collector
is not pinned out, so for crystal operation, the LO is generally
limited to 3rd overtone crystal frequencies; typically around
60 MHz. For higher frequency operation, the LO can be
provided externally as shown in Figure 16.
Buffer
An amplifier on the 1st LO output converts the
single–ended LO output to a differential signal to drive the
mixer. Capacitive coupling between the LO and the amplifier
minimizes the effects of the change in oscillator current on
the mixer. Buffered LO output is pinned–out at Pin 3 for use
with a PLL, with a typical output voltage of 320 mVpp at VCC
= 4.0 V and with a 5.1 k resistor from Pin 3 to ground. As seen
in Figure 14, the buffered LO output varies with the supply
voltage and a smaller external resistor may be needed for low
voltage operation. The LO buffer operates up to 60 MHz,
typically. Above 60 MHz, the output at Pin 3 rolls off at
approximately 6.0 dB per octave. Since most PLLs require
about 200 mVpp drive, an external amplifier may be required.
Figure 14. Buffered LO Output Voltage
versus Supply Voltage
600
RPin3 = 3.0 kΩ
OUTPUT (mVpp )
500
Mixers
The first and second mixer are of similar design. Both are
double balanced to suppress the LO and input frequencies to
give only the sum and difference frequencies out. This
configuration typically provides 40 to 60 dB of LO
suppression. New design techniques provide improved mixer
linearity and third order intercept without increased noise.
The gain on the output of the 1st mixer starts to roll off at
about 20 MHz, so this receiver could be used with a 21 MHz
first IF. It is designed for use with a ceramic filter, with an
output impedance of 330 Ω. A series resistor can be used to
raise the impedance for use with a crystal filter, which
typically has an input impedance of 4.0 kΩ. The second mixer
input impedance is approximately 4.0 kΩ; it requires an
external 360 Ω parallel resistor for use with a standard
ceramic filter.
Limiting IF Amplifier and Detector
The limiter has approximately 110 dB of gain, which starts
rolling off at 2.0 MHz. Although not designed for wideband
operation, the bandwidth of the audio frequency amplifier has
been widened to 50 kHz, which gives less phase shift and
enables the receiver to run at higher data rates. However,
care should be taken not to exceed the bandwidth allowed by
local regulations.
The MC13135 is designed for use with an LC quadrature
detector, and does not have sufficient drive to be used with a
ceramic discriminator. The MC13136 was designed to use a
ceramic discriminator, but can also be run with an LC quad
coil, as mentioned in the Test Circuit Information section. The
data shown in Figures 12 and 13 was taken using a muRata
CDB455C34 ceramic discriminator which has been specially
matched to the MC13136. Both the choice of discriminators
and the external matching circuit will affect the distortion and
recovered audio.
RSSI/Op Amp
The Received Signal Strength Indicator (RSSI) on the
MC13135/13136 has about 70 dB of range. The resistor
needed to translate the RSSI current to a voltage output has
been included on the internal circuit, which gives it a tighter
tolerance. A temperature compensated reference current
also improves the RSSI accuracy over temperature. On the
MC13136, the op amp on board is connected to the output to
provide a voltage buffered RSSI. On the MC13135, the op
amp is not connected internally and can be used for the RSSI
or as a data slicer (see Figure 17c).
400
RPin3 = 5.1 kΩ
300
200
100
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VCC, SUPPLY VOLTAGE (Vdc)
MOTOROLA ANALOG IC DEVICE DATA
8–219
MC13135 MC13136
Figure 15. PLL Controlled Narrowband FM Receiver at 46/49 MHz
MC13135
VCC
0.1
2.7 k
1st LO
500 p 500 p
100 k
24
Varicap
1
23
47 k
27 p
0.68 µH
1.0
2
0.1
150 pF
RF
Input
0.01
4
20
Ceramic
Filter
10.7 MHz
5
120 p
VDD Fin1
D0
PD1
D1
PD2
D2
LD
D3
VSS Fin2
MC145166
0.2 µH
21
VCC1
0.1
3.0 p
62 pF
3
5.1 k
OSC OSC
Out
In
0.001
22
5.0 p
0.01
50 p
10.245
MHz Xtal
2nd LO
VCC2
6
19
7
0.1
9
AF
Demod
10
0.1
0.1
360
18
8
Ceramic
Filter
455 kHz
Recovered
Audio
1.0 k
17
0.15
Limiter
10 k
16
11
RSSI
Output
15
14
12
0.1
68 k
13
455 kHz
Quad Coil
Figure 16. 144 MHz Single Channel Application Circuit
Preamp for MC13135 at 144.455 MHz
1st LO External Oscillator Circuit
VCC
15 k
L1
100 p
0.82 µ
1.0 k
8–220
15 p
68 p
5.6 k
X1
43 p
470
1.0 µ
fosc =
133.755 MHz
Q1 – MPS5179
X1 – 44.585 MHz 3rd Overtone
Series Resonant Crystal
L1 – 0.078 µH Inductor
(Coilcraft Part # 146–02J08)
+
5.1 k
3300 p
Q1 1000p
VCC
15 k
+
1.0 µF
L3
12 p
To Mixer
470 p
RF Input
39 p
Q1
L2
12 p
1.0 µF
3300 p
470
Q1 – MPS5179
L2 – 0.05 µH
L3 – 0.07 µH
MOTOROLA ANALOG IC DEVICE DATA
MC13135 MC13136
Figure 17a. Single Channel Narrowband FM Receiver at 49.7 MHz
MC13135
VCC
1.0 µH
1.0 k
1st LO
2200 p
1
27 p
39 MHz
Xtal 5.0 p
2
+
1.0
Figure 17.
24
Varicap
23
22
3
Buffered LO
Output
0.01
0.01
4
0.1
20
5
120 p
50 p
2nd LO
Ceramic
Filter
10.7 MHz
VCC2
6
19
7
10.245 MHz
Xtal
Ceramic
Filter
455 kHz
0.1
9
AF
Demod
10
0.1
360
18
8
0.1
62 pF RF Input
150 p 50 Ω Source
0.2 µH
21
VCC1
5.1 k
0.001
17
1.0 k
Recovered
Audio
0.15
Limiter
10 k
16
11
RSSI
Output
15
14
12
0.1
13
39 k
455 kHz
Quad Coil
Figure 17b. PC Board Component View
39 MHz
XT
3
NOTES: 1. 0.2 µH tunable (unshielded) inductor
2. 39 MHz Series mode resonant
3rd Overtone Crystal
3. 1.5 µH tunable (shielded) inductor
4. 10.245 MHz Fundamental mode crystal,
32 pF load
5. 455 kHz ceramic filter, muRata CFU 455B
or equivalent
6. Quadrature coil, Toko 7MC–8128Z (7mm)
or Toko RMC–2A6597HM (10mm)
7. 10.7 MHz ceramic filter, muRata SFE10.7MJ–A
or equivalent
2
1
1.0 k
0.1
CF
0.01
5
0.1
10.7 MHz
CF
4
MC13135
10.245 MHz
XT
62p
0.01
50p
120p
150p
.001
27p
5p
1.0
+
0.1
5.1k
2200p
360
1.0k
7
10k
455 KHz
0.15
0.1
0.22
10
+
+4.7
10k
0.1
51K
39K
MC34119
Figure 17c. Optional Data Slicer Circuit
(Using Internal Op Amp)
+10
0.1
VCC
6
20 k
Vin
(Pin 17)
20 k
15
16
14
10 k
FSK Data
Output
0.001 10 k
1.0 M
MOTOROLA ANALOG IC DEVICE DATA
8–221
MC13135 MC13136
Figure 18. PC Board Solder Side View
L.O.
3.25″
AUDIO
VCC
GROUND
RF IN
SPEAKER
VCC2
RSSI
MC13135
MC13136
3.375″
(Circuit Side View)
Figure 19. PC Board Component View
39 MHz
XT
3
NOTES: 1. 0.2 µH tunable (unshielded) inductor
2. 39 MHz Series mode resonant
3rd Overtone Crystal
3. 1.5 µH tunable (shielded) inductor
4. 10.245 MHz Fundamental mode crystal,
32 pF load
5. 455 kHz ceramic filter, muRata CFU 455B
or equivalent
6. Ceramic discriminator, muRata CDB455C34
or equivalent
7. 10.7 MHz ceramic filter, muRata SFE10.7MJ–A
or equivalent
2
1
1.0 k
0.1
0.1
1.0
+
360
1.0k
7
CF
5
0.01
10.7 MHz
CF
4
MC13136
10.245 MHz
XT
62p
0.01
50p
120p
150p
.001
27p
5p
0.1
5.1k
2200p
10k
455 KHz
0.15
0.1
0.22
10
+
51K
2.7k
6
+4.7
10k
270p
0.1
MC34119
+10
0.1
8–222
MOTOROLA ANALOG IC DEVICE DATA
MC13135 MC13136
Figure 20a. Single Channel Narrowband FM Receiver at 49.7 MHz
MC13136
Figure 20.
VCC
1.0 µH
1.0
+
1st LO
2200 p
23
27 p
2
39 MHz
Xtal
5.0 p
1.0 k
Buffered LO
Output
24
Varicap
1
22
62 pF
3
0.01
5.0 k
4
0.1
21
VCC1
50 p
10.245 MHz
Xtal
2nd LO
RF Input
50 Ω Source
Ceramic
Filter
10.7 MHz
VCC2
6
19
0.1
360
18
8
9
AF
17
1.0 k
Recovered
Audio
Demod
10
0.1
150 pF
20
7
Ceramic
Filter
455 kHz
0.1
0.2 µH
0.01
5
120 p
0.001
0.15
Limiter
10 k
16
11
15
12
RSSI
Output
14
270 p
0.1
13
2.7 k
muRata
455 kHz
Resonator
CDB455C34
Figure 20b. Optional Audio Amplifier Circuit
Recovered
Audio
+
10
0.22
3
8
MC34119
1
4.7
+ 2
4
7
6
+10
VCC
Speaker
5
10 k
51 k
MOTOROLA ANALOG IC DEVICE DATA
8–223
8–224
Figure 21. MC13135 Internal Schematic
18
VCC 1
VCC 2
15 k
8.0 k
6.0 k
3
1
6
1.0 k
1.0 k
22
2
5.0 p
4.0 k
4.0 k
5
21
1.6 k
12 k
7
100
20
VEE
VEE
First LO
First Mixer
Second LO
Second Mixer
16
Figure 21.
VCC 2
14
15
12
100 k
VEE
VEE
Op Amp
13
VCC 2
VCC 2
MOTOROLA ANALOG IC DEVICE DATA
Bias
9
2.0 k
10
11
VEE
5.0 p
17
52 k
50 k
VEE
Limiting IF Amplifier
Detector and Audio Amplifier
This device contains 142 active transistors.
MC13135 MC13136
VCC 2
MOTOROLA ANALOG IC DEVICE DATA
Figure 22. MC13136 Internal Schematic
18
VCC 1
VCC 2
15 k
8.0 k
6.0 k
3
1
6
1.0 k
1.0 k
22
2
5.0 p
4.0 k
4.0 k
5
21
1.6 k
12 k
7
100
20
VEE
VEE
First LO
First Mixer
Second LO
Second Mixer
16
Figure 22.
VCC 2
15
12
100 k
VEE
VEE
Op Amp
13
VCC 2
VCC 2
Bias
9
2.0 k
10
11
8–225
VEE
5.0 p
17
52 k
50 k
VEE
Limiting IF Amplifier
14
This device contains 142 active transistors.
Detector and Audio Amplifier
MC13135 MC13136
VCC 2
Tape and Reel Options
In Brief . . .
Motorola offers the convenience of Tape and Reel
packaging for our growing family of standard integrated circuit
products. Reels are available to support the requirements of
both first and second generation pick–and–place equipment.
The packaging fully conforms to the latest EIA–481A
specification. The antistatic embossed tape provides a
secure cavity, sealed with a peel–back cover tape.
MOTOROLA ANALOG IC DEVICE DATA
Page
Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2
Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4
Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5
12–1
Tape and Reel Configurations
Mechanical Polarization
SOIC and Micro–8
DEVICES
PLCC DEVICES
Typical
Typical
PIN 1
User Direction of Feed
User Direction of Feed
DPAK and D2PAK
DEVICES
Typical
User Direction of Feed
12–2
SOT–23 (5 Pin)
DEVICES
SOT–89 (3 Pin)
DEVICES
SOT–89 (5 Pin)
DEVICES
Typical
Typical
Typical
User Direction of Feed
User Direction of Feed
User Direction of Feed
MOTOROLA ANALOG IC DEVICE DATA
Tape and Reel Configurations
(continued)
TO–92 Reel Styles
STYLE A
(Preferred)
STYLE E
Carrier Strip
Carrier Strip
Rounded
Side
Adhesive Tape
Flat Side
Adhesive Tape
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Flat side of transistor and adhesive tape visible.
Rounded side of transistor and adhesive tape visible.
TO–92 Ammo Pack Styles
STYLE P
(Preferred)
STYLE M
Adhesive Tape On
Top Side
Adhesive Tape On
Top Side
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉ
Flat Side
Carrier
Strip
Rounded side of transistor and
adhesive tape visible.
Label
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉ
Feed
Feed
Rounded Side
Carrier
Strip
Flat side of transistor and
adhesive tape visible.
Label
Style M ammo pack is equivalent to Style E of reel
pack dependent on feed orientation from box.
Style P ammo pack is equivalent to Styles A and B of reel pack
dependent on feed orientation from box.
TO–92 EIA Radial Tape in Fan Fold Box or On Reel
H2A
H2A
H2B
H2B
H
W2
H4 H5
T1
L1
H1
W1 W
L
T
T2
F1
F2
P2
P1
MOTOROLA ANALOG IC DEVICE DATA
P2
D
P
12–3
Tape and Reel Information Table
Tape
p Width
(mm)
Devices(1)
per Reel
Reel Size
(inch)
Device
Suffix
SO–8, SOP–8
SO–14
SO–16
12
16
16
2,500
2,500
2,500
13
13
13
R2
R2
R2
SO–16L, SO–8+8L WIDE
SO–20L WIDE
SO–24L WIDE
SO–28L WIDE
SO–28L WIDE
16
24
24
24
32
1,000
1,000
1,000
1,000
1,000
13
13
13
13
13
R2
R2
R2
R2
R3
Micro–8
12
2,500
13
R2
PLCC–20
PLCC–28
PLCC–44
16
24
32
1,000
500
500
13
13
13
R2
R2
R2
PLCC–52
PLCC–68
PLCC–84
32
44
44
500
250
250
13
13
13
R2
R2
R2
TO–226AA (TO–92)(2)
18
2,000
13
RA, RE, RP, or RM
(Ammo Pack) only
DPAK
16
2,500
13
RK
D2PAK
24
800
13
R4
SOT–23 (5 Pin)
8
3,000
7
TR
SOT–89 (3/5 Pin)
12
1,000
7
T1
Package
(1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.
(2) Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations
are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.
12–4
MOTOROLA ANALOG IC DEVICE DATA
Analog MPQ Table
Tape/Reel and Ammo Pack
Package Type
Package Code
MPQ
Case 775
Case 776
Case 777
0802
0804
0801
1000/reel
500/reel
500/reel
Case 751
Case 751A
Case 751B
Case 751G
Case 751D
Case 751E
Case 751F
0095
0096
0097
2003
2005
2008
2009
2500/reel
2500/reel
2500/reel
1000/reel
1000/reel
1000/reel
1000/reel
Case 846A
–
2500/reel
Case 29
Case 29
0031
0031
2000/reel
2000/Ammo Pack
Case 369A
–
2500/reel
Case 936
–
800/reel
–
3000/reel
–
1000/reel
–
1000/reel
PLCC
SOIC
Micro–8
TO–92
DPAK
D2PAK
SOT–23 (5 Pin)
Case 1212
SOT–89 (3 Pin)
Case 1213
SOT–89 (5 Pin)
Case 1214
MOTOROLA ANALOG IC DEVICE DATA
12–5
12–6
MOTOROLA ANALOG IC DEVICE DATA
Packaging Information
In Brief . . .
The packaging availability for each device type is indicated
on the individual data sheets and the Selector Guide. All of the
outline dimensions for the packages are given in this section.
The maximum power consumption an integrated circuit
can tolerate at a given operating ambient temperature can be
found from the equation:
PD(TA) =
TJ(max) – TA
RθJA(Typ)
where:
PD(TA) = Power Dissipation allowable at a given
operating ambient temperature. This must
be greater than the sum of the products of
the supply voltages and supply currents at
the worst case operating condition.
TJ(max) = Maximum operating Junction Temperature
as listed in the Maximum Ratings Section.
See individual data sheets for TJ(max)
information.
TA = Maximum desired operating Ambient
Temperature
RθJA(Typ) = Typical Thermal Resistance Junction-toAmbient
MOTOROLA ANALOG IC DEVICE DATA
13–1
Case Outline Dimensions
LP, P, Z SUFFIX
CASE 29-04
Plastic Package
(TO-226AA/TO-92)
ISSUE AD
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
B
R
P
1
2
L
F
SEATING
PLANE
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
K
3
D
X X
G
J
H
V
C
SECTION X–X
1
N
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.015
0.020
0.500
–––
0.250
–––
0.080
0.105
–––
0.100
0.115
–––
0.135
–––
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.41
0.55
0.41
0.48
1.15
1.39
2.42
2.66
0.39
0.50
12.70
–––
6.35
–––
2.04
2.66
–––
2.54
2.93
–––
3.43
–––
N
KC, T SUFFIX
CASE 221A-06
Plastic Package
ISSUE Y
–T–
F
–B–
4
SEATING
PLANE
C
T
S
4
Q
A
U
1 2 3
H
–Y–
1
2
3
K
R
L
J
G
D 3 PL
0.25 (0.010)
M
B
M
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
F
G
H
J
K
L
N
Q
R
S
T
U
INCHES
MIN
MAX
0.560
0.625
0.380
0.420
0.140
0.190
0.020
0.045
0.139
0.155
0.100 BSC
–––
0.280
0.012
0.045
0.500
0.580
0.045
0.070
0.200 BSC
0.100
0.135
0.080
0.115
0.020
0.055
0.235
0.255
0.000
0.050
MILLIMETERS
MIN
MAX
14.23
15.87
9.66
10.66
3.56
4.82
0.51
1.14
3.53
3.93
2.54 BSC
–––
7.11
0.31
1.14
12.70
14.73
1.15
1.77
5.08 BSC
2.54
3.42
2.04
2.92
0.51
1.39
5.97
6.47
0.00
1.27
N
13–2
MOTOROLA ANALOG IC DEVICE DATA
TH SUFFIX
CASE 314A-03
Plastic Package
ISSUE D
–T–
B
–P–
Q
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
E
OPTIONAL
CHAMFER
A
U
F
L
DIM
A
B
C
D
E
F
G
J
K
L
Q
S
U
K
1
5
G
5X
S
D
0.014 (0.356)
T, TV SUFFIX
CASE 314B-05
Plastic Package
ISSUE J
M
T P
M
OPTIONAL
CHAMFER
E
A
U
L
S
W
V
F
1
5
5X
G
5X
0.24 (0.610)
M
J
T
H
D
0.10 (0.254)
M
T P
N
M
–T–
T SUFFIX
CASE 314C–01
Plastic Package
ISSUE A
–Q–
B
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
14.478 14.859
1.702 BSC
0.381
0.635
18.542 18.923
8.128
9.271
3.556
3.886
5.334
6.604
11.888 12.827
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 0.043 (1.092) MAXIMUM.
C
B
–P–
Q
K
J
5X
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.570
0.585
0.067 BSC
0.015
0.025
0.730
0.745
0.320
0.365
0.140
0.153
0.210
0.260
0.468
0.505
–T–
SEATING
PLANE
DIM
A
B
C
D
E
F
G
H
J
K
L
N
Q
S
U
V
W
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.850
0.935
0.067 BSC
0.166 BSC
0.015
0.025
0.900
1.100
0.320
0.365
0.320 BSC
0.140
0.153
–––
0.620
0.468
0.505
–––
0.735
0.090
0.110
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
21.590 23.749
1.702 BSC
4.216 BSC
0.381
0.635
22.860 27.940
8.128
9.271
8.128 BSC
3.556
3.886
––– 15.748
11.888 12.827
––– 18.669
2.286
2.794
SEATING
PLANE
C
E
A
1 2 3 4 5
L
1
DIM
A
B
C
D
E
G
J
K
L
Q
K
5
G
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
INCHES
MIN
MAX
0.610
0.625
0.380
0.420
0.160
0.190
0.020
0.040
0.035
0.055
0.067 BSC
0.015
0.025
0.500
–––
0.355
0.370
0.139
0.147
MILLIMETERS
MIN
MAX
15.59
15.88
9.65
10.67
4.06
4.83
0.51
1.02
0.89
1.40
1.702 BSC
0.38
0.64
12.70
–––
9.02
9.40
3.53
3.73
5 PL
0.356 (0.014) M T Q
MOTOROLA ANALOG IC DEVICE DATA
M
J
13–3
T, T1 SUFFIX
CASE 314D-03
Plastic Package
ISSUE D
–T–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
C
–Q–
B
E
U
A
L
DIM
A
B
C
D
E
G
H
J
K
L
Q
U
S
1 2 3 4 5
K
S
12
3
45
J
G
D
H
5 PL
0.356 (0.014)
DT-1 SUFFIX
CASE 369-07
Plastic Package
(DPAK)
ISSUE K
M
T Q
C
E
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
DIM
A
B
C
D
E
F
G
H
J
K
R
S
V
4
A
1
2
3
S
1
–T–
2
K
SEATING
PLANE
3
J
F
H
D
G
DT SUFFIX
CASE 369A-13
Plastic Package
(DPAK)
ISSUE Y
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SEATING
PLANE
C
B
E
R
4
Z
A
S
1
3
2
3
U
K
F
J
L
H
D
G
13–4
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
2.29 BSC
0.87
1.01
0.46
0.58
8.89
9.65
4.45
5.46
1.27
2.28
0.77
1.27
T
M
4
1
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.090 BSC
0.034
0.040
0.018
0.023
0.350
0.380
0.175
0.215
0.050
0.090
0.030
0.050
3 PL
–T–
V
MILLIMETERS
MIN
MAX
14.529 15.570
9.906 10.541
4.318
4.572
0.635
0.965
1.219
1.397
1.702 BSC
2.210
2.845
0.381
0.635
25.908 27.051
8.128
9.271
3.556
3.886
2.667
2.972
13.792 14.783
M
B
V
INCHES
MIN
MAX
0.572
0.613
0.390
0.415
0.170
0.180
0.025
0.038
0.048
0.055
0.067 BSC
0.087
0.112
0.015
0.025
1.020
1.065
0.320
0.365
0.140
0.153
0.105
0.117
0.543
0.582
2 PL
0.13 (0.005)
M
DIM
A
B
C
D
E
F
G
H
J
K
L
R
S
U
V
Z
INCHES
MIN
MAX
0.235
0.250
0.250
0.265
0.086
0.094
0.027
0.035
0.033
0.040
0.037
0.047
0.180 BSC
0.034
0.040
0.018
0.023
0.102
0.114
0.090 BSC
0.175
0.215
0.020
0.050
0.020
–––
0.030
0.050
0.138
–––
MILLIMETERS
MIN
MAX
5.97
6.35
6.35
6.73
2.19
2.38
0.69
0.88
0.84
1.01
0.94
1.19
4.58 BSC
0.87
1.01
0.46
0.58
2.60
2.89
2.29 BSC
4.45
5.46
0.51
1.27
0.51
–––
0.77
1.27
3.51
–––
T
MOTOROLA ANALOG IC DEVICE DATA
DP1, N, P, P1 SUFFIX
CASE 626-05
Plastic Package
ISSUE K
8
5
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B–
1
4
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
–A–
NOTE 2
L
8
C
1
J
–T–
N
SEATING
PLANE
D
M
K
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
G
H
0.13 (0.005)
M
T A
B
M
M
N, P, N-14, P2 SUFFIX
CASE 646-06
Plastic Package
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
14
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
1
C
J
N
H
DP2, N, P, PC SUFFIX
CASE 648-08
Plastic Package
ISSUE R
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
G
D
SEATING
PLANE
K
M
9
1
8
B
F
C
16
L
S
1
–T–
SEATING
PLANE
K
H
G
D
J
16 PL
0.25 (0.010)
MOTOROLA ANALOG IC DEVICE DATA
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
M
T A
M
M
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
13–5
B, P, P2, V SUFFIX
CASE 648C-03
Plastic Package
(DIP–16)
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. INTERNAL LEAD CONNECTION BETWEEN 4 AND
5, 12 AND 13.
–A–
16
9
1
8
–B–
L
NOTE 5
16
C
1
–T–
M
N
SEATING
PLANE
K
E
F
J
G
D 16 PL
0.13 (0.005)
16 PL
0.13 (0.005)
M
T A
M
T B
MILLIMETERS
MIN
MAX
18.80
21.34
6.10
6.60
3.69
4.69
0.38
0.53
1.27 BSC
1.02
1.78
2.54 BSC
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
S
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION A AND B DOES NOT INCLUDE MOLD
PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNER OPTIONAL.
R
16
9
1
8
–B–
M
P
L
F
16
J
1
C
–T–
SEATING
PLANE
S
K
H
G
D 13 PL
0.25 (0.010)
P SUFFIX
CASE 649-03
Plastic Package
ISSUE D
P
M
T B
A
S
L
B
1
12
J
H
F
C
N
1
K
G
D
SEATING
PLANE
INCHES
MIN
MAX
0.740
0.760
0.245
0.260
0.145
0.175
0.015
0.021
0.050
0.070
0.100 BSC
0.050 BSC
0.008
0.015
0.120
0.140
0.295
0.305
0_
10 _
0.200 BSC
0.300 BSC
0.015
0.035
MILLIMETERS
MIN
MAX
18.80
19.30
6.23
6.60
3.69
4.44
0.39
0.53
1.27
1.77
2.54 BSC
1.27 BSC
0.21
0.38
3.05
3.55
7.50
7.74
0_
10 _
5.08 BSC
7.62 BSC
0.39
0.88
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
13
Q
DIM
A
B
C
D
F
G
H
J
K
L
M
P
R
S
S
A
24
13–6
INCHES
MIN
MAX
0.740
0.840
0.240
0.260
0.145
0.185
0.015
0.021
0.050 BSC
0.040
0.70
0.100 BSC
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.040
–A–
P SUFFIX
CASE 648E–01
Plastic Package
(DIP–16)
ISSUE O
24
DIM
A
B
C
D
E
F
G
J
K
L
M
N
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
Q
MILLIMETERS
MIN
MAX
31.50
32.13
13.21
13.72
4.70
5.21
0.38
0.51
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.30
2.92
3.43
14.99
15.49
–––
10
0.51
1.02
0.13
0.38
0.51
0.76
INCHES
MIN
MAX
1.240
1.265
0.520
0.540
0.185
0.205
0.015
0.020
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.012
0.115
0.135
0.590
0.610
–––
10 _
0.020
0.040
0.005
0.015
0.020
0.030
MOTOROLA ANALOG IC DEVICE DATA
A, B, N, P SUFFIX
CASE 707-02
Plastic Package
ISSUE C
18
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
10
B
1
9
A
L
C
18
DIM
A
B
C
D
F
G
H
J
K
L
M
N
1
K
N
F
H
D
G
J
M
SEATING
PLANE
P SUFFIX
CASE 710-02
Plastic Package
ISSUE B
1
28
DIM
A
B
C
D
F
G
H
J
K
L
M
N
15
B
14
1
L
C
A
N
G
F
D
M
K
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1
40
21
B
1
20
L
A
C
N
J
F
MOTOROLA ANALOG IC DEVICE DATA
INCHES
MIN
MAX
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
SEATING
PLANE
40
G
MILLIMETERS
MIN
MAX
36.45
37.21
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
J
P SUFFIX
CASE 711-03
Plastic Package
ISSUE C
H
INCHES
MIN
MAX
0.875
0.915
0.240
0.260
0.140
0.180
0.014
0.022
0.050
0.070
0.100 BSC
0.040
0.060
0.008
0.012
0.115
0.135
0.300 BSC
0_
15 _
0.020
0.040
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
28
H
MILLIMETERS
MIN
MAX
22.22
23.24
6.10
6.60
3.56
4.57
0.36
0.56
1.27
1.78
2.54 BSC
1.02
1.52
0.20
0.30
2.92
3.43
7.62 BSC
0_
15_
0.51
1.02
D
K
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
M
SEATING
PLANE
13–7
F, P, P-3 SUFFIX
CASE 724-03
Plastic Package
(NDIP–24)
ISSUE D
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
24
1
–A–
24
13
1
12
–B–
L
C
–T–
NOTE 1
K
SEATING
PLANE
N
E
G
M
J
F
D
0.25 (0.010)
H, P, DP SUFFIX
CASE 738-03
Plastic Package
ISSUE E
24 PL
0.25 (0.010)
24 PL
T A
M
M
INCHES
MIN
MAX
1.230
1.265
0.250
0.270
0.145
0.175
0.015
0.020
0.050 BSC
0.040
0.060
0.100 BSC
0.007
0.012
0.110
0.140
0.300 BSC
0_
15_
0.020
0.040
DIM
A
B
C
D
E
F
G
J
K
L
M
N
T B
M
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
–A–
20
11
1
10
B
DIM
A
B
C
D
E
F
G
J
K
L
M
N
L
C
20
1
–T–
K
SEATING
PLANE
J
F
M
T A
C
0.25
H
M
B
M
1
4
8
B
1
h
e
q
SEATING
PLANE
0.10
A1
B
0.25
13–8
X 45 _
A
C
M
C B
S
A
S
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
5
E
T B
M
M
D
8
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
20 PL
0.25 (0.010)
A
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
20 PL
0.25 (0.010)
D
D, D1, D2 SUFFIX
CASE 751-05
Plastic Package
(SO-8, SOP-8)
ISSUE R
M
N
E
G
MILLIMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27 BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
L
DIM
A
A1
B
C
D
E
e
H
h
L
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.18
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751A-03
Plastic Package
(SO-14)
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
M
B
M
14
1
R X 45 _
G
F
C
–T–
0.25 (0.010)
M
J
M
K
D 14 PL
SEATING
PLANE
T B
A
S
S
DIM
A
B
C
D
F
G
J
K
M
P
R
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
16
1
K
R
F
X 45 _
C
SEATING
PLANE
D
J
M
16 PL
0.25 (0.010)
DW, FP SUFFIX
CASE 751D-04
Plastic Package
(SO-20L, SO–20)
ISSUE E
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
–A–
D SUFFIX
CASE 751B-05
Plastic Package
(SO-16)
ISSUE J
–T–
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
T B
M
A
S
S
–A–
20
10X
P
0.010 (0.25)
1
M
B
M
10
20X
J
D
0.010 (0.25)
M
T A
B
S
S
20
F
1
R
C
–T–
18X
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
G
MOTOROLA ANALOG IC DEVICE DATA
K
SEATING
PLANE
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
11
–B–
DIM
A
B
C
D
F
G
J
K
M
P
R
X 45 _
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M
13–9
DW SUFFIX
CASE 751E-04
Plastic Package
(SO-24L,
SOP (16+4+4)L)
ISSUE E
–A–
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
13
–B–
12X
P
0.010 (0.25)
1
M
B
M
12
24X
24
D
J
0.010 (0.25)
1
T A
M
B
S
S
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R
X 45 _
C
–T–
M
SEATING
PLANE
DW SUFFIX
CASE 751F-04
Plastic Package
(SO-28L, SOIC–28)
ISSUE E
K
G
22X
1
–A–
15
14X
–B–
1
P
0.010 (0.25)
M
B
M
14
M
28X
D
R
0.010 (0.25)
M
T A
B
S
S
X 45 _
C
26X
–T–
G
F
SEATING
PLANE
K
DW SUFFIX
CASE 751G-02
Plastic Package
(SO-16L, SOP–16L,
SOP-8+8L)
ISSUE A
–B–
8X
P
0.010 (0.25)
M
B
M
8
16X
MILLIMETERS
MIN
MAX
17.80
18.05
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.01
10.55
0.25
0.75
J
D
16
1
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
14X
13–10
G
INCHES
MIN
MAX
0.701
0.711
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
9
1
DIM
A
B
C
D
F
G
J
K
M
P
R
J
–A–
16
INCHES
MIN
MAX
0.601
0.612
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
28
28
MILLIMETERS
MIN
MAX
15.25
15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.05
10.55
0.25
0.75
K
SEATING
PLANE
M
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
MOTOROLA ANALOG IC DEVICE DATA
D SUFFIX
CASE 751K–01
Plastic Package
(SO–16)
ISSUE O
16
1
16
S
–A–
–B–
0.25 (0.010)
M
B
9
P
1
M_
F
DIM
A
B
C
D
F
G
J
K
M
P
R
8
G
R X 45 _
C
–T–
K
J
0.25 (0.010)
DW SUFFIX
CASE 751N–01
Plastic Package
(SOP–16L)
ISSUE O
SEATING
PLANE
14 X D
M
T A
B
S
S
–A–
9
–B–
1
0.010 (0.25)
P
M
B
M
8
16
13X
1
J
D
0.010 (0.25)
M
T A
S
B
S
F
R X 45 _
C
–T–
S
K
9X
MOTOROLA ANALOG IC DEVICE DATA
SEATING
PLANE
M
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.368
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
T
16
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
S
T
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
2.54 BSC
3.81 BSC
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
0.100 BSC
0.150 BSC
G
13–11
CASE 762-01
Plastic Medium Power Package
(SIP-9)
ISSUE C
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
Q
0.25 (0.010)
T A
M
1
M
–A–
–C–
U
V
M
X
S
W
E
Y
R
B
9
1
–T–
N
SEATING
PLANE
K
D
M
T C
9 PL
0.25 (0.010)
FN SUFFIX
CASE 775-02
Plastic Package
(PLCC-20)
ISSUE C
0.25 (0.010)
J
H
G
F
M
T A
M
Y BRK
–N–
0.007 (0.180)M T L–M S N
S
0.007 (0.180)M T L–M S N
U
S
D
–L–
Z
–M–
W
20
D
1
V
G1
X
0.010 (0.250)S T L–M S N
S
VIEW D–D
A
0.007 (0.180)M T L–M S N
S
R
0.007 (0.180)M T L–M S N
S
Z
H
C
0.007 (0.180)M T L–M S N
S
E
G
0.004 (0.100)
J –T– SEATING
PLANE
VIEW S
G1
0.010 (0.250)S T L–M S N
13–12
K1
K
F
S
VIEW S
0.007 (0.180)M T L–M S N
MILLIMETERS
MIN
MAX
22.40
23.00
6.40
6.60
3.45
3.65
0.40
0.55
9.35
9.60
1.40
1.60
2.54 BSC
1.51
1.71
0.360
0.400
3.95
4.20
30 _BSC
2.50
2.70
3.15
3.45
13.60
13.90
1.65
1.95
22.00
22.20
0.55
0.75
2.89 BSC
0.65
0.75
2.70
2.80
INCHES
MIN
MAX
0.873
0.897
0.252
0.260
0.135
1.143
0.015
0.021
0.368
0.377
0.055
0.062
0.100 BSC
0.059
0.067
0.014
0.015
0.155
0.165
30_BSC
0.099
0.106
0.124
0.135
0.535
0.547
0.064
0.076
0.866
0.874
0.021
0.029
0.113 BSC
0.025
0.029
0.106
0.110
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
1
B
M
DIM
A
B
C
D
E
F
G
H
J
K
M
N
Q
R
S
U
V
W
X
Y
S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
MOTOROLA ANALOG IC DEVICE DATA
FN SUFFIX
CASE 776-02
Plastic Package
(PLCC–28)
ISSUE D
1
0.007 (0.180)
B
T L–M
M
N
S
T L–M
S
S
Y BRK
–N–
0.007 (0.180)
U
M
N
S
D
Z
–M–
–L–
W
28
D
X
G1
0.010 (0.250)
T L–M
S
N
S
S
V
1
VIEW D–D
A
0.007 (0.180)
R
0.007 (0.180)
M
T L–M
S
N
S
C
M
T L–M
S
N
0.007 (0.180)
H
Z
M
T L–M
N
S
S
S
K1
E
0.004 (0.100)
G
J
S
K
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250)
–T–
T L–M
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
MOTOROLA ANALOG IC DEVICE DATA
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10_
0.410
0.430
0.040
–––
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10_
10.42
10.92
1.02
–––
13–13
FN SUFFIX
CASE 777-02
Plastic Package
(PLCC)
ISSUE C
0.007(0.180) M T
B
L–M
0.007(0.180) M T
U
N
S
L–M
S
S
N
S
1
–N–
Y
D
BRK
Z
–M–
–L–
G1
0.010 (0.25)
X
VIEW D–D
V
44
W
1
D
0.007(0.180) M T
L–M
S
N
S
R
0.007(0.180) M T
L–M
S
N
S
T
0.007(0.180) M T
H
A
S
L–M
S
L–M
S
N
S
N
N
S
S
K1
Z
K
J
C
F
E
0.007(0.180) M T
0.004 (0.10)
–T– SEATING
G
0.010 (0.25)
S
T
L–M
S
N
NOTES:
1. DATUMS –L–, –M–, AND –N– ARE DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
M SUFFIX
CASE 803C
PRELIMINARY
Plastic Package
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
VIEW S
S
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
11
K
–B–
1
1
10
S
10 PL
0.13 (0.005)
M
B
M
N
C
E
MILLIMETERS
MIN
MAX
17.40
17.65
17.40
17.65
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
16.51
16.66
16.51
16.66
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
15.50
16.00
1.02
–––
J
G
20
INCHES
MIN
MAX
0.685
0.695
0.685
0.695
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.650
0.656
0.650
0.656
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.610
0.630
0.040
–––
NOTES:
6 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7 CONTROLLING DIMENSION: MILLIMETER.
8 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER
SIDE.
10 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–F–
20
S
VIEW S
PLANE
G1
L–M
D 20 PL
0.13 (0.005) M T B
0.10 (0.004)
L
S
–T–
A
S
SEATING
PLANE
M
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
S
MILLIMETERS
MIN
MAX
12.35
12.80
5.10
5.45
1.95
2.05
0.35
0.50
–––
0.81
12.40*
1.15
1.39
0.59
0.81
0.18
0.27
1.10
1.50
0.05
0.20
0_
10 _
0.50
0.85
7.40
8.20
INCHES
MIN
MAX
0.486
0.504
0.201
0.215
0.077
0.081
0.014
0.020
–––
0.032
0.488*
0.045
0.055
0.023
0.032
0.007
0.011
0.043
0.059
0.001
0.008
0_
10 _
0.020
0.033
0.291
0.323
*APPROXIMATE
13–14
MOTOROLA ANALOG IC DEVICE DATA
TV SUFFIX
CASE 821C-04
Plastic Package
(15-Pin ZIP)
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
1
15
SEATING
PLANE
–T–
C
E
M
–Q–
B
DIM
A
B
C
D
E
G
H
J
K
L
M
R
S
U
V
Y
–P–
U
Y
K
V
A
R
S
H
PIN 15
PIN 1
L
G
15X
D
15X
0.010 (0.254)
T SUFFIX
CASE 821D-03
Plastic Package
ISSUE C
T P Q
M
S
J
0.024 (0.610)
M
T
15
SEATING
PLANE
–T–
C
B
E
–P–
U
DIM
A
B
C
D
E
F
G
H
J
K
Q
R
U
Y
A
R
K
PIN 1
Y
PIN 15
G
7X
15X
MILLIMETERS
MIN
MAX
17.374 17.627
19.914 20.116
4.395
4.597
0.610
0.787
1.473
1.574
1.270 BSC
4.293 BSC
0.458
0.609
17.780 18.034
5.080 BSC
3.760
3.835
10.567 10.820
3.988
4.242
2.667
2.921
22.047 REF
15.875 16.231
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DELETED
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.003 (0.076) TOTAL IN EXCESS OF THE D
DIMENSION. AT MAXIMUM MATERIAL CONDITION.
1
Q
–L–
INCHES
MIN
MAX
0.684
0.694
0.784
0.792
0.173
0.181
0.024
0.031
0.058
0.062
0.050 BSC
0.169 BSC
0.018
0.024
0.700
0.710
0.200 BSC
0.148
0.151
0.416
0.426
0.157
0.167
0.105
0.115
0.868 REF
0.625
0.639
H
F
D
0.010 (0.254)
15X
M
T P L
MOTOROLA ANALOG IC DEVICE DATA
S
J
0.024 (0.610)
M
INCHES
MIN
MAX
0.681
0.694
0.784
0.792
0.173
0.181
0.024
0.031
0.058
0.062
0.016
0.023
0.050 BSC
0.110 BSC
0.018
0.024
1.078
1.086
0.148
0.151
0.416
0.426
0.110 BSC
0.503 REF
MILLIMETERS
MIN
MAX
17.298 17.627
19.914 20.116
4.395
4.597
0.610
0.787
1.473
1.574
0.407
0.584
1.270 BSC
2.794 BSC
0.458
0.609
27.382 27.584
3.760
3.835
10.567 10.820
2.794 BSC
12.776 REF
T
13–15
FTB SUFFIX
CASE 824D–01
Plastic Package
(TQFP–44)
ISSUE O
1
L
–T–, –U–, –Z–
–Z–
44
34
11
T–U
G
AE
DETAIL AA
M
V
S
AE
PLATING
F
BASE METAL
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
J
23
12
0.20 (0.008)
DETAIL AA
0.05 (0.002) Z
AC Z
S
T–U
0.20 (0.008)
M
B
L
S
–U–
AB Z
–T–
S
33
1
22
N
D
0.20 (0.008)
A
0.20 (0.008)
AB T–U
M
S
Z
S
S
Z
S
M
AC T–U
S
Z
S
SECTION AE–AE
0.05 (0.002) T–U
S
0.20 (0.008)
M
AC T–U
M
C
–AB–
E
0.10 (0.004)
–AC–
H
Y
R
K
W
X
VIEW AD
13–16
DETAIL AD
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT
DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.530
(0.021).
MILLIMETERS
DIM MIN
MAX
A
9.950 10.050
B
9.950 10.050
C
1.400
1.600
D
0.300
0.450
E
1.350
1.450
F
0.300
0.400
G
0.800 BSC
H
0.050
0.150
J
0.090
0.200
K
0.450
0.550
L
8.000 BSC
M
12_REF
N
0.090
0.160
Q
1_
5_
R
0.100
0.200
S 11.900 12.100
V 11.900 12.100
W
0.200 REF
X
1.000 REF
Y
12_REF
INCHES
MIN
MAX
0.392
0.396
0.392
0.396
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.018
0.022
0.315 BSC
12_REF
0.004
0.006
1_
5_
0.004
0.008
0.469
0.476
0.469
0.476
0.008 REF
0.039 REF
12_REF
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 824E–02
Plastic Package
(QFP)
ISSUE A
44
1
S
0.20 (0.008)
M
–L–, –M–, –N–
T L–M
S
N
S
H L–M
S
N
S
A
0.20 (0.008)
M
0.05 (0.002) L–M
PIN 1
IDENT
J1
44
G
J1
34
VIEW Y
33
1
G
11
40X
S
T L–M
M
J
0.20 (0.008)
VIEW Y
BASE METAL
B1
D
M
T L–M
S
N
S
SECTION J1–J1
44 PL
22
–N–
M
VIEW P
C E
–H–
W
Y
q1
R
DATUM
PLANE
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
0.20 (0.008)
23
12
F
PLATING
V
S
0.20 (0.008)
M
B
–M–
0.05 (0.002) N
–L–
H L–M
N
N
S
S
3 PL
–H–
R
K
A1
C1
VIEW P
MOTOROLA ANALOG IC DEVICE DATA
R1
R2
q2
DATUM
PLANE
0.01 (0.004)
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.530 (0.021).
DIM
A
B
C
D
E
F
G
J
K
M
S
V
W
Y
A1
B1
C1
R1
R2
q1
q2
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
9.90
10.10
0.390
0.398
9.90
10.10
0.390
0.398
2.00
2.21
0.079
0.087
0.30
0.45 0.0118 0.0177
2.00
2.10
0.079
0.083
0.30
0.40
0.012
0.016
0.80 BSC
0.031 BSC
0.13
0.23
0.005
0.009
0.65
0.95
0.026
0.037
5_
10 _
5_
10_
12.95
13.45
0.510
0.530
12.95
13.45
0.510
0.530
0.000
0.210
0.000
0.008
5_
10 _
5_
10 _
0.450 REF
0.018 REF
0.130
0.005
0.170
0.007
1.600 REF
0.063 REF
0.130
0.300
0.005
0.012
0.130
0.300
0.005
0.012
5_
10 _
5_
10 _
0_
7_
0_
7_
13–17
FB SUFFIX
CASE 840F–01
Plastic Package
ISSUE O
64
1
L
–Z–
64
49
S
S
T–U
48
T–U
1
–T–, –U–, –Z–
–U–
DETAIL AA
S
S
AC Z
M
G
DETAIL AA
33
S
16
AE
V
0.20 (0.008)
–T–
AE
0.20 (0.008) M
0.050 (0.002)
B
Z
L
AB Z
P
32
Z
17
S
S
Z
S
F
M
C
SECTION AE–AE
–AB–
Y
D
J
E
H
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
N
S
Z
AC T–U
S
AC T–U
M
S
M
0.20 (0.008)
BASE
METAL
0.20 (0.008)
A
0.20 (0.008) M AB T–U
0.050 (0.002) T–U
0.10 (0.004)
–AC–
DETAIL AD
Q
R
K
W
X
DETAIL AD
13–18
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED
AT DATUM PLANE –AC–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
MILLIMETERS
DIM MIN
MAX
A
9.950 10.050
B
9.950 10.050
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.450
0.550
7.500 BSC
L
M
12° REF
N
0.090
0.160
0.250 BSC
P
Q
1°
5°
R
0.100
0.200
S 11.900 12.100
V 11.900 12.100
0.200 REF
W
1.000 REF
X
12° REF
Y
INCHES
MIN
MAX
0.392
0.396
0.392
0.396
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BSC
0.002
0.006
0.004
0.008
0.018
0.022
0.295 BSC
12° REF
0.004
0.006
0.010 BSC
5°
1°
0.004
0.008
0.469
0.476
0.469
0.476
0.008 REF
0.039 REF
12° REF
MOTOROLA ANALOG IC DEVICE DATA
DM SUFFIX
CASE 846A–02
Plastic Package
(Micro–8)
ISSUE C
8
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
–A–
–B–
K
PIN 1 ID
G
D 8 PL
0.08 (0.003)
–T–
M
T B
S
A
S
SEATING
PLANE
0.038 (0.0015)
C
H
MOTOROLA ANALOG IC DEVICE DATA
J
DIM
A
B
C
D
G
H
J
K
L
MILLIMETERS
MIN
MAX
2.90
3.10
2.90
3.10
–––
1.10
0.25
0.40
0.65 BSC
0.05
0.15
0.13
0.23
4.75
5.05
0.40
0.70
INCHES
MIN
MAX
0.114
0.122
0.114
0.122
–––
0.043
0.010
0.016
0.026 BSC
0.002
0.006
0.005
0.009
0.187
0.199
0.016
0.028
L
13–19
FB SUFFIX
CASE 848B-04
Plastic Package
(TQFP–52)
ISSUE C
1
52
L
39
27
S
D
S
V
B
–A–, –B–, –D–
0.20 (0.008)
0.20 (0.008)
M
L
B
M
C A–B
S
S
B
H A–B
–B–
–A–
0.05 (0.002) A–B
DETAIL A
D
26
40
DETAIL A
14
52
1
13
–D–
B
0.20 (0.008) M H A–B
F
S
D
S
S
D
S
0.05 (0.002) A–B
J
V
0.20 (0.008)
M
C A–B
N
BASE METAL
M_
C
D
DETAIL C
0.02 (0.008)
E
–H–
M
C A–B
S
D
S
SECTION B–B
DATUM
PLANE
0.10 (0.004)
H
M_
G
U_
R
Q_
K
T
W
X
DETAIL C
13–20
–C–
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
Q
R
S
T
U
V
W
X
MILLIMETERS
MIN
MAX
9.90
10.10
9.90
10.10
2.10
2.45
0.22
0.38
2.00
2.10
0.22
0.33
0.65 BSC
–––
0.25
0.13
0.23
0.65
0.95
7.80 REF
5_
10_
0.13
0.17
0_
7_
0.13
0.30
12.95
13.45
0.13
–––
0_
–––
12.95
13.45
0.35
0.45
1.6 REF
INCHES
MIN
MAX
0.390
0.398
0.390
0.398
0.083
0.096
0.009
0.015
0.079
0.083
0.009
0.013
0.026 BSC
–––
0.010
0.005
0.009
0.026
0.037
0.307 REF
5_
10 _
0.005
0.007
0_
7_
0.005
0.012
0.510
0.530
0.005
–––
0_
–––
0.510
0.530
0.014
0.018
0.063 REF
MOTOROLA ANALOG IC DEVICE DATA
FB SUFFIX
CASE 848D–03
Plastic Package
ISSUE C
52
1
4X
4X TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
52
40
1
CL
39
3X VIEW
–X–
X=L, M, N
AB
Y
–L–
AB
–M–
B
B1
VIEW Y
V
V1
27
14
26
J
–N–
A1
S1
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
BASE METAL
F
PLATING
13
G
0.13 (0.005)
M
D
T L–M
U
S
N
S
A
SECTION AB–AB
S
ROTATED 90_ CLOCKWISE
4X
C
θ2
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
4X
θ3
VIEW AA
0.05 (0.002)
S
W
θ1
2XR
R1
0.25 (0.010)
C2
θ
GAGE PLANE
K
C1
E
Z
VIEW AA
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
R1
S
S1
U
V
V1
W
Z
θ
θ1
θ2
θ3
MILLIMETERS
MIN
MAX
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
–––
1.70
0.05
0.20
1.30
1.50
0.20
0.40
0.75
0.45
0.22
0.35
0.65 BSC
0.07
0.20
0.50 REF
0.08
0.20
12.00 BSC
6.00 BSC
0.09
0.16
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0_
7_
–––
0_
12 _ REF
5_
13 _
INCHES
MIN
MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
–––
0.067
0.002
0.008
0.051
0.059
0.008
0.016
0.018
0.030
0.009
0.014
0.026 BSC
0.003
0.008
0.020 REF
0.003
0.008
0.472 BSC
0.236 BSC
0.004
0.006
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0_
7_
–––
0_
12 _ REF
5_
13 _
13–21
B SUFFIX
CASE 858–01
Plastic Package
ISSUE O
42
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
–A–
42
22
–B–
1
21
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
H
C
–T–
SEATING
PLANE
N
G
F
D 42 PL
K
0.25 (0.010)
M
T A
M
J 42 PL
0.25 (0.010)
S
M
T B
INCHES
MIN
MAX
1.435
1.465
0.540
0.560
0.155
0.200
0.014
0.022
0.032
0.046
0.070 BSC
0.300 BSC
0.008
0.015
0.115
0.135
0.600 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
36.45
37.21
13.72
14.22
3.94
5.08
0.36
0.56
0.81
1.17
1.778 BSC
7.62 BSC
0.20
0.38
2.92
3.43
15.24 BSC
0_
15 _
0.51
1.02
S
B SUFFIX
CASE 859–01
Plastic Package
(SDIP)
ISSUE O
56
1
–A–
56
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)
29
–B–
1
28
L
H
C
–T–
K
SEATING
PLANE
G
F
D 56 PL
0.25 (0.010)
13–22
E
M
T A
S
N
J
M
56 PL
0.25 (0.010)
M
T B
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.035 BSC
0.032
0.046
0.070 BSC
0.300 BSC
0.008
0.015
0.115
0.135
0.600 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
0.89 BSC
0.81
1.17
1.778 BSC
7.62 BSC
0.20
0.38
2.92
3.43
15.24 BSC
0_
15 _
0.51
1.02
S
MOTOROLA ANALOG IC DEVICE DATA
FB, FTB SUFFIX
CASE 873-01
Plastic Package
(TQFP–32)
ISSUE A
1
L
S
D
S
H A–B
V
P
B
M
S
D
S
0.20 (0.008)
B
B
0.20 (0.008)
L
M
–B–
–A–
0.05 (0.002) A–B
16
C A–B
17
24
25
–A–, –B–, –D–
DETAIL A
DETAIL A
32
9
1
8
F
BASE
METAL
–D–
A
0.20 (0.008)
C A–B
M
D
S
S
0.05 (0.002) A–B
N
J
S
0.20 (0.008)
M
H A–B
D
S
S
D
0.20 (0.008)
M
M
C A–B
D
S
S
DETAIL C
SECTION B–B
VIEW ROTATED 90 _CLOCKWISE
C E
–H–
–C–
SEATING
PLANE
H
M
G
DATUM
PLANE
0.01 (0.004)
U
T
R
–H–
DATUM
PLANE
K
X
DETAIL C
MOTOROLA ANALOG IC DEVICE DATA
Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
X
MILLIMETERS
MIN
MAX
6.95
7.10
6.95
7.10
1.40
1.60
0.273
0.373
1.30
1.50
0.273
–––
0.80 BSC
–––
0.20
0.119
0.197
0.33
0.57
5.6 REF
6_
8_
0.119
0.135
0.40 BSC
5_
10_
0.15
0.25
8.85
9.15
0.15
0.25
5_
11_
8.85
9.15
1.00 REF
INCHES
MIN
MAX
0.274
0.280
0.274
0.280
0.055
0.063
0.010
0.015
0.051
0.059
0.010
–––
0.031 BSC
–––
0.008
0.005
0.008
0.013
0.022
0.220 REF
6_
8_
0.005
0.005
0.016 BSC
5_
10_
0.006
0.010
0.348
0.360
0.006
0.010
5_
11_
0.348
0.360
0.039 REF
13–23
T SUFFIX
CASE 894-03
Plastic Package
(23-Pin SZIP)
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION R DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH
OR PROTRUSIONS.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.010 (0.250).
6. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF
THE D DIMENSION AT MAXIMUM MATERIAL
CONDITION.
1
23
C
E
B
–N–
L
U
K
Y
P
F
V
M
S
H
A
R
W
–T–
23X
PIN 1
0.024 (0.610)
PIN 23
G
23X
D
0.010 (0.254)
13–24
M
T Q
J
SEATING
PLANE
S
N
M
T
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
W
Y
INCHES
MIN
MAX
0.684
0.694
1.183
1.193
0.175
0.179
0.026
0.031
0.058
0.062
0.165
0.175
0.050 BSC
0.169 BSC
0.014
0.020
0.625
0.639
0.770
0.790
0.148
0.152
0.148
0.152
0.390 BSC
0.416
0.424
0.157
0.167
0.105
0.115
0.868 REF
0.200 BSC
0.700
0.710
MILLIMETERS
MIN
MAX
17.374 17.627
30.048 30.302
4.445
4.547
0.660
0.787
1.473
1.574
4.191
4.445
1.270 BSC
4.293 BSC
0.356
0.508
15.875 16.231
19.558 20.066
3.760
3.861
3.760
3.861
9.906 BSC
10.566 10.770
3.988
4.242
2.667
2.921
22.047 REF
5.080 BSC
17.780 18.034
S
MOTOROLA ANALOG IC DEVICE DATA
FTA SUFFIX
CASE 932–02
Plastic Package
(TQFP–48)
ISSUE D
1
48
P
4X
0.200 (0.008) AB T–U Z
9
DETAIL Y
A
A1
48
37
AE
1
AE
36
–T–
–U–
B
V
B1
12
25
13
V1
–T–, –U–, –Z–
DETAIL Y
24
–Z–
S1
M_
TOP & BOTTOM
S
R
4X
0.200 (0.008) AC T–U Z
GAUGE PLANE
0.250 (0.010)
C
E
0.080 (0.003) AC
G
–AB–
W
H
Q_
–AC–
AD
K
DETAIL AD
X
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
BASE METAL
N
J
F
D
0.080 (0.003)
M
AC T–U
S
Z
S
SECTION AE–AE
MOTOROLA ANALOG IC DEVICE DATA
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BASIC
0.050
0.150
0.090
0.200
0.500
0.700
12 _REF
0.090
0.160
0.250 BASIC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BASIC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BASIC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
13–25
D2T SUFFIX
CASE 936–03
Plastic Package
ISSUE B
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
3
TERMINAL 4
K
U
A
S
B
V
H
F
1
2
3
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
U
V
J
D
G
0.010 (0.254)
M
T
–T–
OPTIONAL
CHAMFER
E
C
M
L
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.051 REF
0.100 BSC
0.539
0.579
0.125 MAX
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.295 REF
2.540 BSC
13.691 14.707
3.175 MAX
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
P
N
R
D2T SUFFIX
CASE 936A–02
Plastic Package
(D2PAK)
ISSUE A
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
5
TERMINAL 6
U
A
V
S
K
B
H
1 2 3 4 5
DIM
A
B
C
D
E
G
H
K
L
M
N
P
R
S
U
V
D
0.010 (0.254)
M
T
G
–T–
OPTIONAL
CHAMFER
E
C
M
N
INCHES
MIN
MAX
0.386
0.403
0.356
0.368
0.170
0.180
0.026
0.036
0.045
0.055
0.067 BSC
0.539
0.579
0.050 REF
0.000
0.010
0.088
0.102
0.018
0.026
0.058
0.078
5 _ REF
0.116 REF
0.200 MIN
0.250 MIN
MILLIMETERS
MIN
MAX
9.804 10.236
9.042
9.347
4.318
4.572
0.660
0.914
1.143
1.397
1.702 BSC
13.691 14.707
1.270 REF
0.000
0.254
2.235
2.591
0.457
0.660
1.473
1.981
5 _ REF
2.946 REF
5.080 MIN
6.350 MIN
L
P
R
13–26
MOTOROLA ANALOG IC DEVICE DATA
20
DT, DTB SUFFIX
CASE 948E–02
Plastic Package
(TSSOP–20)
ISSUE A
1
20X
0.15 (0.006) T U
M
20
L/2
2X
K REF
0.10 (0.004)
S
T U
V
S
K
K1
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
S
J J1
11
B
L
PIN 1
IDENT
0.25 (0.010)
N
10
1
0.15 (0.006) T U
SECTION N–N
–U–
M
S
A
–V–
N
F
DETAIL E
C
G
D
–W–
H
0.100 (0.004)
–T– SEATING
DTB SUFFIX
16
CASE 948F–01
Plastic Package
(TSSOP–16, TSSOP–16L)
ISSUE O
1
16X K REF
0.10 (0.004)
M
T U
S
V
S
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
S
K
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
S
M
A
–V–
N
F
DETAIL E
C
0.10 (0.004)
–T– SEATING
PLANE
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
–W–
H
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
N
0.25 (0.010)
0.15 (0.006) T U
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
DETAIL E
PLANE
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
G
DETAIL E
MOTOROLA ANALOG IC DEVICE DATA
13–27
DTB SUFFIX
CASE 948G–01
Plastic Package
(TSSOP–14)
ISSUE O
14
1
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
13–28
D
G
H
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MOTOROLA ANALOG IC DEVICE DATA
DTB SUFFIX
CASE 948H–01
Plastic Package
ISSUE O
24
1
24X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
2X
24
L/2
B
–U–
L
PIN 1
IDENT.
12
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
13
S
A
–V–
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
H
MILLIMETERS
MIN
MAX
7.70
7.90
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.303
0.311
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
–W–
DETAIL E
N
0.25 (0.010)
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
M
K1
J1
N
F
SECTION N–N
J
MOTOROLA ANALOG IC DEVICE DATA
DETAIL E
13–29
DTB SUFFIX
CASE 948J–01
Plastic Package
(TSSOP–8)
ISSUE O
8
1
0.15 (0.006) T U
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
K REF
8x
0.10 (0.004)
S
M
T U
V
S
S
K
2X
L/2
ÉÉ
ÇÇÇ
ÇÇÇ
ÉÉ
K1
8
5
J J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
4
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
M
N
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
SEE DETAIL E
H
M SUFFIX
CASE 967–01
Plastic Package
(EIAJ–20)
ISSUE O
INCHES
MIN
MAX
0.114
0.122
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
1
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
11
Q1
E HE
1
M_
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
MILLIMETERS
MIN
MAX
2.90
3.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
20
20
13–30
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.81
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.032
MOTOROLA ANALOG IC DEVICE DATA
FTB SUFFIX
CASE 976–01
Plastic Package
(TQFP–20)
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
4X
9
0.200 (0.008) AB T–U Z
A
A1
20
DETAIL Y
16
15
1
–T–
–U–
V
B1
V1
11
5
6
10
–Z–
S1
MILLIMETERS
MIN
MAX
4.000 BSC
2.000 BSC
4.000 BSC
2.000 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.650 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_REF
0.090
0.160
0.250 BSC
1_
5_
0.150
0.250
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
B
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
J
–AB–
INCHES
MIN
MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.026 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BSC
1_
5_
0.006
0.010
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
–AC–
N
F
D
0.080 (0.003) AC
0.080 (0.003)
M_
S
AC T–U
S
Z
S
SECTION AE–AE
TOP & BOTTOM
R
–T–, –U–, –Z–
C E
AE
W
H
K
X
DETAIL AD
MOTOROLA ANALOG IC DEVICE DATA
Q_
AE
GAUGE
PLANE
0.250 (0.010)
G
DETAIL Y
13–31
FTA SUFFIX
CASE 977–01
Plastic Package
ISSUE O
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
1
4X
9
0.200 (0.008) AB T–U Z
A
A1
24
–T–
DETAIL Y
19
18
1
–U–
V
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
B
V1
13
6
B1
12
7
–Z–
S1
S
4X
0.200 (0.008) AB T–U Z
MILLIMETERS
MIN
MAX
4.000 BSC
2.000 BSC
4.000 BSC
2.000 BSC
1.400
1.600
0.170
0.270
1.350
1.450
0.170
0.230
0.500 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_REF
0.090
0.160
0.250 BSC
1_
5_
0.150
0.250
6.000 BSC
3.000 BSC
6.000 BSC
3.000 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.157 BSC
0.079 BSC
0.157 BSC
0.079 BSC
0.055
0.063
0.007
0.011
0.053
0.057
0.007
0.009
0.020 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12 _REF
0.004
0.006
0.010 BSC
1_
5_
0.006
0.010
0.236 BSC
0.118 BSC
0.236 BSC
0.118 BSC
0.008 REF
0.039 REF
DETAIL AD
–T–, –U–, –Z–
–AB–
–AC–
AE
AE
0.080 (0.003) AC
M_
TOP & BOTTOM
R
C E
J
W
H
K
X
Q_
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
P
G
DETAIL Y
N
F
GAUGE
PLANE
D
0.250 (0.010)
0.080 (0.003)
S
AC T–U
S
Z
S
DETAIL AD
SECTION AE–AE
13–32
MOTOROLA ANALOG IC DEVICE DATA
N SUFFIX
CASE 1212–01
Plastic Package
(SOT–23)
ISSUE O
1
A
B
D
5
E
A2
0.05 S
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
A1
4
1
2
L
3
E1
L1
B
C
5X
0.10
C B
M
A
S
C
S
e
e1
H SUFFIX
CASE 1213–01
Plastic Package
(SOT–89)
ISSUE O
DIM
A1
A2
B
C
D
E
E1
e
e1
L
L1
MILLIMETERS
MIN
MAX
0.00
0.10
1.00
1.30
0.30
0.50
0.10
0.25
2.80
3.00
2.50
3.10
1.50
1.80
0.95 BSC
1.90 BSC
0.20
–––
0.45
0.75
1
A
D
A2
C
B
D1
E1
E
L1
B
0.10
B1
e
M
C B
S
A
S
2X
0.10
M
C B
S
A
S
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCING
PER ASME Y14.5M, 1994.
3. DATUM C IS A SEATING PLANE.
DIM
A2
B
B1
C
D
D1
E
E1
e
e1
L1
MILLIMETERS
MIN
MAX
1.40
1.60
0.37
0.57
0.32
0.52
0.30
0.50
4.40
4.60
1.50
1.70
–––
4.25
2.40
2.60
1.50 BSC
3.00 BSC
0.80
–––
e1
MOTOROLA ANALOG IC DEVICE DATA
13–33