MC13135 MC13136 FM Communications Receivers - PL-1
Transcription
MC13135 MC13136 FM Communications Receivers - PL-1
MC13135 MC13136 FM Communications Receivers The MC13135/MC13136 are the second generation of single chip, dual conversion FM communications receivers developed by Motorola. Major improvements in signal handling, RSSI and first oscillator operation have been made. In addition, recovered audio distortion and audio drive have improved. Using Motorola’s MOSAIC 1.5 process, these receivers offer low noise, high gain and stability over a wide operating voltage range. Both the MC13135 and MC13136 include a Colpitts oscillator, VCO tuning diode, low noise first and second mixer and LO, high gain limiting IF, and RSSI. The MC13135 is designed for use with an LC quadrature detector and has an uncommitted op amp that can be used either for an RSSI buffer or as a data comparator. The MC13136 can be used with either a ceramic discriminator or an LC quad coil and the op amp is internally connected for a voltage buffered RSSI output. These devices can be used as stand–alone VHF receivers or as the lower IF of a triple conversion system. Applications include cordless telephones, short range data links, walkie–talkies, low cost land mobile, amateur radio receivers, baby monitors and scanners. • • • • • • • • • DUAL CONVERSION NARROWBAND FM RECEIVERS P SUFFIX PLASTIC PACKAGE CASE 724 24 1 DW SUFFIX PLASTIC PACKAGE CASE 751E (SO–24L) 24 Complete Dual Conversion FM Receiver – Antenna to Audio Output 1 Input Frequency Range – 200 MHz Voltage Buffered RSSI with 70 dB of Usable Range ORDERING INFORMATION Low Voltage Operation – 2.0 to 6.0 Vdc (2 Cell NiCad Supply) Low Current Drain – 3.5 mA Typ Device Low Impedance Audio Output < 25 Ω Operating Temperature Range Plastic DIP MC13135P VHF Colpitts First LO for Crystal or VCO Operation Isolated Tuning Diode MC13135DW Buffered First LO Output to Drive CMOS PLL Synthesizer MC13136P SO–24L TA = – 40° to +85°C MC13136DW PIN CONNECTIONS MC13135 1st LO 1st LO Base 1 1st LO Emitter 2 1st LO Out 3 VCC1 4 2nd LO Emitter 5 2nd LO Base 6 2nd Mixer Out 7 VEE 8 Limiter In 9 VCC1 2nd LO VCC2 24 Varicap C 1st LO Base 1 23 Varicap A 1st LO Emitter 2 22 1st Mixer In 1 1st LO Out 3 21 1st Mixer In 2 VCC1 4 20 1st Mixer Out 2nd LO Emitter 5 19 VCC2 18 2nd Mixer In AF 17 Audio Out 16 Op Amp Out Varicap 2nd Mixer Out 7 VEE 8 Limiter In 9 24 Varicap C 22 1st Mixer In 1 VCC1 21 1st Mixer In 2 20 1st Mixer Out 2nd LO VCC2 2nd LO Base 6 19 VCC2 18 2nd Mixer In AF 17 Audio Out 16 Buffered RSSI Output Demod 15 Op Amp In – Decouple 1 10 Decouple 2 11 14 Op Amp In + Decouple 2 11 RSSI 12 13 Quad Coil Limiter SO–24L 23 Varicap A Demod Decouple 1 10 Plastic DIP MC13136 1st LO Varicap Package RSSI 12 Limiter 15 Op Amp In – 14 Limiter Output 13 Quad Input Each device contains 142 active transistors. 8–214 MOTOROLA ANALOG IC DEVICE DATA MC13135 MC13136 MAXIMUM RATINGS Rating Pin Symbol Value Unit 4, 19 VCC (max) 6.5 Vdc RF Input Voltage 22 RFin 1.0 Vrms Junction Temperature – TJ +150 °C Storage Temperature Range – Tstg – 65 to +150 °C Power Supply Voltage RECOMMENDED OPERATING CONDITIONS Rating Pin Symbol Value Unit 4, 19 VCC 2.0 to 6.0 Vdc Maximum 1st IF – fIF1 21 MHz Maximum 2nd IF – fIF2 3.0 MHz Ambient Temperature Range – TA – 40 to + 85 °C Power Supply Voltage ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 4.0 Vdc, fo = 49.7 MHz, fMOD = 1.0 kHz, Deviation = ±3.0 kHz, f1st LO = 39 MHz, f2nd LO = 10.245 MHz, IF1 = 10.7 MHz, IF2 = 455 kHz, unless otherwise noted. All measurements performed in the test circuit of Figure 1.) Characteristic Condition Symbol Min Typ Max Unit Total Drain Current No Input Signal ICC – 4.0 6.0 mAdc Sensitivity (Input for 12 dB SINAD) Matched Input VSIN – 1.0 – µVrms Recovered Audio MC13135 MC13136 VRF = 1.0 mV AFO 170 215 220 265 300 365 – 130 – Limiter Output Level (Pin 14, MC13136) mVrms VLIM mVrms 1st Mixer Conversion Gain VRF = – 40 dBm MXgain1 – 12 – dB 2nd Mixer Conversion Gain VRF = – 40 dBm MXgain2 – 13 – dB First LO Buffered Output – VLO – 100 – mVrms Total Harmonic Distortion VRF = – 30 dBm THD – 1.2 3.0 % Demodulator Bandwidth – BW – 50 – kHz RSSI Dynamic Range – RSSI – 70 – dB – – –17 –11 – – – – 27 – First Mixer 3rd Order Intercept (Input) Second Mixer 3rd Order Intercept (RF Input) TOIMix1 Matched Unmatched dBm Matched Input TOIMix2 First LO Buffer Output Resistance – RLO – – – Ω First Mixer Parallel Input Resistance – R – 722 – Ω First Mixer Parallel Input Capacitance – C – 3.3 – pF First Mixer Output Impedance – ZO – 330 – Ω Second Mixer Input Impedance – ZI – 4.0 – kΩ Second Mixer Output Impedance – ZO – 1.8 – kΩ Detector Output Impedance – ZO – 25 – Ω MOTOROLA ANALOG IC DEVICE DATA dBm 8–215 MC13135 MC13136 TEST CIRCUIT INFORMATION Although the MC13136 can be operated with a ceramic discriminator, the recovered audio measurements for both the MC13135 and MC13136 are made with an LC quadrature detector. The typical recovered audio will depend on the external circuit; either the Q of the quad coil, or the RC matching network for the ceramic discriminator. On the MC13136, an external capacitor between Pins 13 and 14 can be used with a quad coil for slightly higher recovered audio. See Figures 10 through 13 for additional information. Since adding a matching circuit to the RF input increases the signal level to the mixer, the third order intercept (TOI) point is better with an unmatched input (50 Ω from Pin 21 to Pin 22). Typical values for both have been included in the Electrical Characterization Table. TOI measurements were taken at the pins with a high impedance probe/spectrum analyzer system. The first mixer input impedance was measured at the pin with a network analyzer. Figure 1a. MC13135 Test Circuit VCC 0.84 µH 1st LO 0.01 24 Varicap 1 0.1 Figure 1. 23 20 p 39.0 MHz Xtal 1.0 k 2 22 5.0 p 0.001 62 pF 3 VCC1 5.0 k 0.2 µH 21 20 5 120 p 50 p 10.245 MHz Xtal 2nd LO Ceramic Filter 10.7 MHz VCC2 6 19 0.1 7 9 AF 17 Demod 10 0.1 0.1 360 18 8 Ceramic Filter 455 kHz RF Input 0.01 4 0.1 180 p 8.2 k 0.1 Limiter 16 11 39 k 15 0.1 14 12 0.1 39 k 13 455 kHz Quad Coil Figure 1b. MC13136 Quad Detector Test Circuit VCC AF Demod Limiter 16 39 k 15 12 0.1 14 39 k 13 455 kHz Quad Coil 8–216 MOTOROLA ANALOG IC DEVICE DATA MC13135 MC13136 1200 RSSI OUTPUT (mVdc, Pin 12) 5.0 4.0 3.0 RFin = 49.7 MHz fMOD = 1.0 kHz fDEV = ± 3.0 kHz 2.0 1.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 600 400 –120 –100 – 80 – 60 Figure 4. Varactor Capacitance, Resistance versus Bias Voltage Figure 5. Oscillator Frequency versus Varactor Bias 10 CP, f = 150 MHz RP, f = 50 MHz 8.0 6.0 10 4.0 CP, f = 50 MHz 5.0 2.0 RP, f = 150 MHz 1.0 1.5 2.0 2.5 3.0 3.5 0 4.0 47.5 47.0 0.61 µH 46.5 46.0 500 p 1 1st LO 24 23 45.5 27 p 2 500 p 0.2 µF 1.0 MΩ VB Varicap 5.0 p 45.0 1.0 2.0 3.0 4.0 5.0 6.0 VB, VARACTOR BIAS VOLTAGE, VPin24 to VPin 23 (Vdc) VB, VARACTOR BIAS VOLTAGE (Vdc) Figure 6. Signal Levels versus RF Input Figure 7. Signal + Noise, Noise, and AM Rejection versus Input Power 10 S+N 0 S+N, N, AND AMR (dB) 10 Second Mixer Output POWER (dBm) – 20 48.0 30 –10 –30 First Mixer Output First Mixer Input –50 – 90 – 80 – 70 – 60 – 50 –10 – 20 – 30 – 40 RFin, RF INPUT (dBm) MOTOROLA ANALOG IC DEVICE DATA – 30 – 20 S + N 30% AM – 40 – 50 – 60 Second Mixer Input – 70 –100 – 40 RF INPUT (dBm) 15 0 0.5 800 VCC = 4.0 V RFin = 49.67 MHz fMOD = 1.0 kHz fDEV = ± 3.0 kHz VCC, SUPPLY VOLTAGE (V) 25 20 1000 200 –140 8.0 f, FREQUENCY (MHz) 0 0 C P , EQUIVALENT PARALLEL CAPACITANCE (pF) Figure 3. RSSI Output versus RF Input 1400 R P , EQUIVALENT PARALLEL RESISTANCE (k Ω) I CC , SUPPLY CURRENT (mA) Figure 2. Supply Current versus Supply Voltage 6.0 – 70 –130 VCC = 4.0 Vdc RFin = 49.67 MHz fMOD = 1.0 kHz fDEV = ± 3.0 kHz –110 N – 90 – 70 – 50 – 30 RFin, RF INPUT (dBm) 8–217 MC13135 MC13136 Figure 8. Op Amp Gain and Phase versus Frequency Figure 9. First Mixer Third Order Intermodulation (Unmatched Input) 80 Gain 10 0 160 –10 200 – 30 240 – 50 10 k 100 k R R = 68 kΩ 455 kHz Quad Coil Toko 7MC–8128Z R = 47 kΩ R = 39 kΩ 500 0 ±1.0 ± 3.0 ± 5.0 ± 7.0 ± 9.0 – 40 – 20 8.0 VCC 7.0 13 R = 68 kΩ 455 kHz Quad Coil Toko 7MC–8128Z 6.0 5.0 R = 47 kΩ 4.0 3.0 2.0 R = 39 kΩ 1.0 ±1.0 ± 3.0 ± 5.0 ± 7.0 ± 9.0 Figure 13. Distortion versus Deviation for MC13136 VCC muRata C R 455 kHz Resonator CDB455C34 R = 2.7 kΩ C = 270 pF R=∞ C = 660 pF 200 R = 1.2 kΩ C = 100 pF ± 4.0 ± 5.0 ± 6.0 ± 7.0 fDEV, DEVIATION (kHz) ± 8.0 ± 9.0 0 R Figure 12. Recovered Audio versus Deviation for MC13136 400 8–218 – 60 fDEV, DEVIATION (kHz) 600 0 ± 3.0 – 80 fDEV, DEVIATION (kHz) THD, TOTAL HARMONIC DISTORTION (%) RA, RECOVERED AUDIO (mVpp) 800 13 –100 –100 Figure 11. Distortion versus Deviation for MC13135 1000 14 3rd Order Intermod Products Figure 10. Recovered Audio versus Deviation for MC13135 1500 1000 Desired Products – 60 RF INPUT (dBm) VCC 13 – 40 – 80 280 10 M – 20 f, FREQUENCY (Hz) 2000 RA, RECOVERED AUDIO (mVpp) 1.0 M 0 THD, TOTAL HARMONIC DISTORTION (%) AV , GAIN (dB) Phase MIXER OUTPUT (dB) 120 30 20 φ, EXCESS PHASE (DEGREES) 50 10 VCC 14 8.0 13 C R 6.0 muRata 455 kHz Resonator CDB455C34 R=∞ C = 660 pF R = 2.7 kΩ C = 270 pF 4.0 2.0 0 ± 3.0 R = 1.2 kΩ C = 100 pF ± 4.0 ± 5.0 ± 6.0 ± 7.0 ± 8.0 ± 9.0 fDEV, DEVIATION (kHz) MOTOROLA ANALOG IC DEVICE DATA MC13135 MC13136 CIRCUIT DESCRIPTION The MC13135/13136 are complete dual conversion receivers. They include two local oscillators, two mixers, a limiting IF amplifier and detector, and an op amp. Both provide a voltage buffered RSSI with 70 dB of usable range, isolated tuning diode and buffered LO output for PLL operation, and a separate VCC pin for the first mixer and LO. Improvements have been made in the temperature performance of both the recovered audio and the RSSI. VCC Two separate VCC lines enable the first LO and mixer to continue running while the rest of the circuit is powered down. They also isolate the RF from the rest of the internal circuit. Local Oscillators The local oscillators are grounded collector Colpitts, which can be easily crystal–controlled or VCO controlled with the on–board varactor and external PLL. The first LO transistor is internally biased, but the emitter is pinned–out and IQ can be increased for high frequency or VCO operation. The collector is not pinned out, so for crystal operation, the LO is generally limited to 3rd overtone crystal frequencies; typically around 60 MHz. For higher frequency operation, the LO can be provided externally as shown in Figure 16. Buffer An amplifier on the 1st LO output converts the single–ended LO output to a differential signal to drive the mixer. Capacitive coupling between the LO and the amplifier minimizes the effects of the change in oscillator current on the mixer. Buffered LO output is pinned–out at Pin 3 for use with a PLL, with a typical output voltage of 320 mVpp at VCC = 4.0 V and with a 5.1 k resistor from Pin 3 to ground. As seen in Figure 14, the buffered LO output varies with the supply voltage and a smaller external resistor may be needed for low voltage operation. The LO buffer operates up to 60 MHz, typically. Above 60 MHz, the output at Pin 3 rolls off at approximately 6.0 dB per octave. Since most PLLs require about 200 mVpp drive, an external amplifier may be required. Figure 14. Buffered LO Output Voltage versus Supply Voltage 600 RPin3 = 3.0 kΩ OUTPUT (mVpp ) 500 Mixers The first and second mixer are of similar design. Both are double balanced to suppress the LO and input frequencies to give only the sum and difference frequencies out. This configuration typically provides 40 to 60 dB of LO suppression. New design techniques provide improved mixer linearity and third order intercept without increased noise. The gain on the output of the 1st mixer starts to roll off at about 20 MHz, so this receiver could be used with a 21 MHz first IF. It is designed for use with a ceramic filter, with an output impedance of 330 Ω. A series resistor can be used to raise the impedance for use with a crystal filter, which typically has an input impedance of 4.0 kΩ. The second mixer input impedance is approximately 4.0 kΩ; it requires an external 360 Ω parallel resistor for use with a standard ceramic filter. Limiting IF Amplifier and Detector The limiter has approximately 110 dB of gain, which starts rolling off at 2.0 MHz. Although not designed for wideband operation, the bandwidth of the audio frequency amplifier has been widened to 50 kHz, which gives less phase shift and enables the receiver to run at higher data rates. However, care should be taken not to exceed the bandwidth allowed by local regulations. The MC13135 is designed for use with an LC quadrature detector, and does not have sufficient drive to be used with a ceramic discriminator. The MC13136 was designed to use a ceramic discriminator, but can also be run with an LC quad coil, as mentioned in the Test Circuit Information section. The data shown in Figures 12 and 13 was taken using a muRata CDB455C34 ceramic discriminator which has been specially matched to the MC13136. Both the choice of discriminators and the external matching circuit will affect the distortion and recovered audio. RSSI/Op Amp The Received Signal Strength Indicator (RSSI) on the MC13135/13136 has about 70 dB of range. The resistor needed to translate the RSSI current to a voltage output has been included on the internal circuit, which gives it a tighter tolerance. A temperature compensated reference current also improves the RSSI accuracy over temperature. On the MC13136, the op amp on board is connected to the output to provide a voltage buffered RSSI. On the MC13135, the op amp is not connected internally and can be used for the RSSI or as a data slicer (see Figure 17c). 400 RPin3 = 5.1 kΩ 300 200 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC, SUPPLY VOLTAGE (Vdc) MOTOROLA ANALOG IC DEVICE DATA 8–219 MC13135 MC13136 Figure 15. PLL Controlled Narrowband FM Receiver at 46/49 MHz MC13135 VCC 0.1 2.7 k 1st LO 500 p 500 p 100 k 24 Varicap 1 23 47 k 27 p 0.68 µH 1.0 2 0.1 150 pF RF Input 0.01 4 20 Ceramic Filter 10.7 MHz 5 120 p VDD Fin1 D0 PD1 D1 PD2 D2 LD D3 VSS Fin2 MC145166 0.2 µH 21 VCC1 0.1 3.0 p 62 pF 3 5.1 k OSC OSC Out In 0.001 22 5.0 p 0.01 50 p 10.245 MHz Xtal 2nd LO VCC2 6 19 7 0.1 9 AF Demod 10 0.1 0.1 360 18 8 Ceramic Filter 455 kHz Recovered Audio 1.0 k 17 0.15 Limiter 10 k 16 11 RSSI Output 15 14 12 0.1 68 k 13 455 kHz Quad Coil Figure 16. 144 MHz Single Channel Application Circuit Preamp for MC13135 at 144.455 MHz 1st LO External Oscillator Circuit VCC 15 k L1 100 p 0.82 µ 1.0 k 8–220 15 p 68 p 5.6 k X1 43 p 470 1.0 µ fosc = 133.755 MHz Q1 – MPS5179 X1 – 44.585 MHz 3rd Overtone Series Resonant Crystal L1 – 0.078 µH Inductor (Coilcraft Part # 146–02J08) + 5.1 k 3300 p Q1 1000p VCC 15 k + 1.0 µF L3 12 p To Mixer 470 p RF Input 39 p Q1 L2 12 p 1.0 µF 3300 p 470 Q1 – MPS5179 L2 – 0.05 µH L3 – 0.07 µH MOTOROLA ANALOG IC DEVICE DATA MC13135 MC13136 Figure 17a. Single Channel Narrowband FM Receiver at 49.7 MHz MC13135 VCC 1.0 µH 1.0 k 1st LO 2200 p 1 27 p 39 MHz Xtal 5.0 p 2 + 1.0 Figure 17. 24 Varicap 23 22 3 Buffered LO Output 0.01 0.01 4 0.1 20 5 120 p 50 p 2nd LO Ceramic Filter 10.7 MHz VCC2 6 19 7 10.245 MHz Xtal Ceramic Filter 455 kHz 0.1 9 AF Demod 10 0.1 360 18 8 0.1 62 pF RF Input 150 p 50 Ω Source 0.2 µH 21 VCC1 5.1 k 0.001 17 1.0 k Recovered Audio 0.15 Limiter 10 k 16 11 RSSI Output 15 14 12 0.1 13 39 k 455 kHz Quad Coil Figure 17b. PC Board Component View 39 MHz XT 3 NOTES: 1. 0.2 µH tunable (unshielded) inductor 2. 39 MHz Series mode resonant 3rd Overtone Crystal 3. 1.5 µH tunable (shielded) inductor 4. 10.245 MHz Fundamental mode crystal, 32 pF load 5. 455 kHz ceramic filter, muRata CFU 455B or equivalent 6. Quadrature coil, Toko 7MC–8128Z (7mm) or Toko RMC–2A6597HM (10mm) 7. 10.7 MHz ceramic filter, muRata SFE10.7MJ–A or equivalent 2 1 1.0 k 0.1 CF 0.01 5 0.1 10.7 MHz CF 4 MC13135 10.245 MHz XT 62p 0.01 50p 120p 150p .001 27p 5p 1.0 + 0.1 5.1k 2200p 360 1.0k 7 10k 455 KHz 0.15 0.1 0.22 10 + +4.7 10k 0.1 51K 39K MC34119 Figure 17c. Optional Data Slicer Circuit (Using Internal Op Amp) +10 0.1 VCC 6 20 k Vin (Pin 17) 20 k 15 16 14 10 k FSK Data Output 0.001 10 k 1.0 M MOTOROLA ANALOG IC DEVICE DATA 8–221 MC13135 MC13136 Figure 18. PC Board Solder Side View L.O. 3.25″ AUDIO VCC GROUND RF IN SPEAKER VCC2 RSSI MC13135 MC13136 3.375″ (Circuit Side View) Figure 19. PC Board Component View 39 MHz XT 3 NOTES: 1. 0.2 µH tunable (unshielded) inductor 2. 39 MHz Series mode resonant 3rd Overtone Crystal 3. 1.5 µH tunable (shielded) inductor 4. 10.245 MHz Fundamental mode crystal, 32 pF load 5. 455 kHz ceramic filter, muRata CFU 455B or equivalent 6. Ceramic discriminator, muRata CDB455C34 or equivalent 7. 10.7 MHz ceramic filter, muRata SFE10.7MJ–A or equivalent 2 1 1.0 k 0.1 0.1 1.0 + 360 1.0k 7 CF 5 0.01 10.7 MHz CF 4 MC13136 10.245 MHz XT 62p 0.01 50p 120p 150p .001 27p 5p 0.1 5.1k 2200p 10k 455 KHz 0.15 0.1 0.22 10 + 51K 2.7k 6 +4.7 10k 270p 0.1 MC34119 +10 0.1 8–222 MOTOROLA ANALOG IC DEVICE DATA MC13135 MC13136 Figure 20a. Single Channel Narrowband FM Receiver at 49.7 MHz MC13136 Figure 20. VCC 1.0 µH 1.0 + 1st LO 2200 p 23 27 p 2 39 MHz Xtal 5.0 p 1.0 k Buffered LO Output 24 Varicap 1 22 62 pF 3 0.01 5.0 k 4 0.1 21 VCC1 50 p 10.245 MHz Xtal 2nd LO RF Input 50 Ω Source Ceramic Filter 10.7 MHz VCC2 6 19 0.1 360 18 8 9 AF 17 1.0 k Recovered Audio Demod 10 0.1 150 pF 20 7 Ceramic Filter 455 kHz 0.1 0.2 µH 0.01 5 120 p 0.001 0.15 Limiter 10 k 16 11 15 12 RSSI Output 14 270 p 0.1 13 2.7 k muRata 455 kHz Resonator CDB455C34 Figure 20b. Optional Audio Amplifier Circuit Recovered Audio + 10 0.22 3 8 MC34119 1 4.7 + 2 4 7 6 +10 VCC Speaker 5 10 k 51 k MOTOROLA ANALOG IC DEVICE DATA 8–223 8–224 Figure 21. MC13135 Internal Schematic 18 VCC 1 VCC 2 15 k 8.0 k 6.0 k 3 1 6 1.0 k 1.0 k 22 2 5.0 p 4.0 k 4.0 k 5 21 1.6 k 12 k 7 100 20 VEE VEE First LO First Mixer Second LO Second Mixer 16 Figure 21. VCC 2 14 15 12 100 k VEE VEE Op Amp 13 VCC 2 VCC 2 MOTOROLA ANALOG IC DEVICE DATA Bias 9 2.0 k 10 11 VEE 5.0 p 17 52 k 50 k VEE Limiting IF Amplifier Detector and Audio Amplifier This device contains 142 active transistors. MC13135 MC13136 VCC 2 MOTOROLA ANALOG IC DEVICE DATA Figure 22. MC13136 Internal Schematic 18 VCC 1 VCC 2 15 k 8.0 k 6.0 k 3 1 6 1.0 k 1.0 k 22 2 5.0 p 4.0 k 4.0 k 5 21 1.6 k 12 k 7 100 20 VEE VEE First LO First Mixer Second LO Second Mixer 16 Figure 22. VCC 2 15 12 100 k VEE VEE Op Amp 13 VCC 2 VCC 2 Bias 9 2.0 k 10 11 8–225 VEE 5.0 p 17 52 k 50 k VEE Limiting IF Amplifier 14 This device contains 142 active transistors. Detector and Audio Amplifier MC13135 MC13136 VCC 2 Tape and Reel Options In Brief . . . Motorola offers the convenience of Tape and Reel packaging for our growing family of standard integrated circuit products. Reels are available to support the requirements of both first and second generation pick–and–place equipment. The packaging fully conforms to the latest EIA–481A specification. The antistatic embossed tape provides a secure cavity, sealed with a peel–back cover tape. MOTOROLA ANALOG IC DEVICE DATA Page Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2 Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4 Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5 12–1 Tape and Reel Configurations Mechanical Polarization SOIC and Micro–8 DEVICES PLCC DEVICES Typical Typical PIN 1 User Direction of Feed User Direction of Feed DPAK and D2PAK DEVICES Typical User Direction of Feed 12–2 SOT–23 (5 Pin) DEVICES SOT–89 (3 Pin) DEVICES SOT–89 (5 Pin) DEVICES Typical Typical Typical User Direction of Feed User Direction of Feed User Direction of Feed MOTOROLA ANALOG IC DEVICE DATA Tape and Reel Configurations (continued) TO–92 Reel Styles STYLE A (Preferred) STYLE E Carrier Strip Carrier Strip Rounded Side Adhesive Tape Flat Side Adhesive Tape ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ Feed ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ Feed Flat side of transistor and adhesive tape visible. Rounded side of transistor and adhesive tape visible. TO–92 Ammo Pack Styles STYLE P (Preferred) STYLE M Adhesive Tape On Top Side Adhesive Tape On Top Side ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ Flat Side Carrier Strip Rounded side of transistor and adhesive tape visible. Label ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉ Feed Feed Rounded Side Carrier Strip Flat side of transistor and adhesive tape visible. Label Style M ammo pack is equivalent to Style E of reel pack dependent on feed orientation from box. Style P ammo pack is equivalent to Styles A and B of reel pack dependent on feed orientation from box. TO–92 EIA Radial Tape in Fan Fold Box or On Reel H2A H2A H2B H2B H W2 H4 H5 T1 L1 H1 W1 W L T T2 F1 F2 P2 P1 MOTOROLA ANALOG IC DEVICE DATA P2 D P 12–3 Tape and Reel Information Table Tape p Width (mm) Devices(1) per Reel Reel Size (inch) Device Suffix SO–8, SOP–8 SO–14 SO–16 12 16 16 2,500 2,500 2,500 13 13 13 R2 R2 R2 SO–16L, SO–8+8L WIDE SO–20L WIDE SO–24L WIDE SO–28L WIDE SO–28L WIDE 16 24 24 24 32 1,000 1,000 1,000 1,000 1,000 13 13 13 13 13 R2 R2 R2 R2 R3 Micro–8 12 2,500 13 R2 PLCC–20 PLCC–28 PLCC–44 16 24 32 1,000 500 500 13 13 13 R2 R2 R2 PLCC–52 PLCC–68 PLCC–84 32 44 44 500 250 250 13 13 13 R2 R2 R2 TO–226AA (TO–92)(2) 18 2,000 13 RA, RE, RP, or RM (Ammo Pack) only DPAK 16 2,500 13 RK D2PAK 24 800 13 R4 SOT–23 (5 Pin) 8 3,000 7 TR SOT–89 (3/5 Pin) 12 1,000 7 T1 Package (1) Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned. (2) Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office. 12–4 MOTOROLA ANALOG IC DEVICE DATA Analog MPQ Table Tape/Reel and Ammo Pack Package Type Package Code MPQ Case 775 Case 776 Case 777 0802 0804 0801 1000/reel 500/reel 500/reel Case 751 Case 751A Case 751B Case 751G Case 751D Case 751E Case 751F 0095 0096 0097 2003 2005 2008 2009 2500/reel 2500/reel 2500/reel 1000/reel 1000/reel 1000/reel 1000/reel Case 846A – 2500/reel Case 29 Case 29 0031 0031 2000/reel 2000/Ammo Pack Case 369A – 2500/reel Case 936 – 800/reel – 3000/reel – 1000/reel – 1000/reel PLCC SOIC Micro–8 TO–92 DPAK D2PAK SOT–23 (5 Pin) Case 1212 SOT–89 (3 Pin) Case 1213 SOT–89 (5 Pin) Case 1214 MOTOROLA ANALOG IC DEVICE DATA 12–5 12–6 MOTOROLA ANALOG IC DEVICE DATA Packaging Information In Brief . . . The packaging availability for each device type is indicated on the individual data sheets and the Selector Guide. All of the outline dimensions for the packages are given in this section. The maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: PD(TA) = TJ(max) – TA RθJA(Typ) where: PD(TA) = Power Dissipation allowable at a given operating ambient temperature. This must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. TJ(max) = Maximum operating Junction Temperature as listed in the Maximum Ratings Section. See individual data sheets for TJ(max) information. TA = Maximum desired operating Ambient Temperature RθJA(Typ) = Typical Thermal Resistance Junction-toAmbient MOTOROLA ANALOG IC DEVICE DATA 13–1 Case Outline Dimensions LP, P, Z SUFFIX CASE 29-04 Plastic Package (TO-226AA/TO-92) ISSUE AD A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSION D AND J APPLY BETWEEN L AND K MINIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. B R P 1 2 L F SEATING PLANE DIM A B C D F G H J K L N P R V K 3 D X X G J H V C SECTION X–X 1 N INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.022 0.016 0.019 0.045 0.055 0.095 0.105 0.015 0.020 0.500 ––– 0.250 ––– 0.080 0.105 ––– 0.100 0.115 ––– 0.135 ––– MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.41 0.55 0.41 0.48 1.15 1.39 2.42 2.66 0.39 0.50 12.70 ––– 6.35 ––– 2.04 2.66 ––– 2.54 2.93 ––– 3.43 ––– N KC, T SUFFIX CASE 221A-06 Plastic Package ISSUE Y –T– F –B– 4 SEATING PLANE C T S 4 Q A U 1 2 3 H –Y– 1 2 3 K R L J G D 3 PL 0.25 (0.010) M B M Y NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D F G H J K L N Q R S T U INCHES MIN MAX 0.560 0.625 0.380 0.420 0.140 0.190 0.020 0.045 0.139 0.155 0.100 BSC ––– 0.280 0.012 0.045 0.500 0.580 0.045 0.070 0.200 BSC 0.100 0.135 0.080 0.115 0.020 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 14.23 15.87 9.66 10.66 3.56 4.82 0.51 1.14 3.53 3.93 2.54 BSC ––– 7.11 0.31 1.14 12.70 14.73 1.15 1.77 5.08 BSC 2.54 3.42 2.04 2.92 0.51 1.39 5.97 6.47 0.00 1.27 N 13–2 MOTOROLA ANALOG IC DEVICE DATA TH SUFFIX CASE 314A-03 Plastic Package ISSUE D –T– B –P– Q SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C E OPTIONAL CHAMFER A U F L DIM A B C D E F G J K L Q S U K 1 5 G 5X S D 0.014 (0.356) T, TV SUFFIX CASE 314B-05 Plastic Package ISSUE J M T P M OPTIONAL CHAMFER E A U L S W V F 1 5 5X G 5X 0.24 (0.610) M J T H D 0.10 (0.254) M T P N M –T– T SUFFIX CASE 314C–01 Plastic Package ISSUE A –Q– B MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 14.478 14.859 1.702 BSC 0.381 0.635 18.542 18.923 8.128 9.271 3.556 3.886 5.334 6.604 11.888 12.827 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 0.043 (1.092) MAXIMUM. C B –P– Q K J 5X INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.570 0.585 0.067 BSC 0.015 0.025 0.730 0.745 0.320 0.365 0.140 0.153 0.210 0.260 0.468 0.505 –T– SEATING PLANE DIM A B C D E F G H J K L N Q S U V W INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.850 0.935 0.067 BSC 0.166 BSC 0.015 0.025 0.900 1.100 0.320 0.365 0.320 BSC 0.140 0.153 ––– 0.620 0.468 0.505 ––– 0.735 0.090 0.110 MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 21.590 23.749 1.702 BSC 4.216 BSC 0.381 0.635 22.860 27.940 8.128 9.271 8.128 BSC 3.556 3.886 ––– 15.748 11.888 12.827 ––– 18.669 2.286 2.794 SEATING PLANE C E A 1 2 3 4 5 L 1 DIM A B C D E G J K L Q K 5 G D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. INCHES MIN MAX 0.610 0.625 0.380 0.420 0.160 0.190 0.020 0.040 0.035 0.055 0.067 BSC 0.015 0.025 0.500 ––– 0.355 0.370 0.139 0.147 MILLIMETERS MIN MAX 15.59 15.88 9.65 10.67 4.06 4.83 0.51 1.02 0.89 1.40 1.702 BSC 0.38 0.64 12.70 ––– 9.02 9.40 3.53 3.73 5 PL 0.356 (0.014) M T Q MOTOROLA ANALOG IC DEVICE DATA M J 13–3 T, T1 SUFFIX CASE 314D-03 Plastic Package ISSUE D –T– SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION D DOES NOT INCLUDE INTERCONNECT BAR (DAMBAR) PROTRUSION. DIMENSION D INCLUDING PROTRUSION SHALL NOT EXCEED 10.92 (0.043) MAXIMUM. C –Q– B E U A L DIM A B C D E G H J K L Q U S 1 2 3 4 5 K S 12 3 45 J G D H 5 PL 0.356 (0.014) DT-1 SUFFIX CASE 369-07 Plastic Package (DPAK) ISSUE K M T Q C E R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 DIM A B C D E F G H J K R S V 4 A 1 2 3 S 1 –T– 2 K SEATING PLANE 3 J F H D G DT SUFFIX CASE 369A-13 Plastic Package (DPAK) ISSUE Y 0.13 (0.005) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE C B E R 4 Z A S 1 3 2 3 U K F J L H D G 13–4 MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 2.29 BSC 0.87 1.01 0.46 0.58 8.89 9.65 4.45 5.46 1.27 2.28 0.77 1.27 T M 4 1 INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.090 BSC 0.034 0.040 0.018 0.023 0.350 0.380 0.175 0.215 0.050 0.090 0.030 0.050 3 PL –T– V MILLIMETERS MIN MAX 14.529 15.570 9.906 10.541 4.318 4.572 0.635 0.965 1.219 1.397 1.702 BSC 2.210 2.845 0.381 0.635 25.908 27.051 8.128 9.271 3.556 3.886 2.667 2.972 13.792 14.783 M B V INCHES MIN MAX 0.572 0.613 0.390 0.415 0.170 0.180 0.025 0.038 0.048 0.055 0.067 BSC 0.087 0.112 0.015 0.025 1.020 1.065 0.320 0.365 0.140 0.153 0.105 0.117 0.543 0.582 2 PL 0.13 (0.005) M DIM A B C D E F G H J K L R S U V Z INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 ––– 0.030 0.050 0.138 ––– MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 ––– 0.77 1.27 3.51 ––– T MOTOROLA ANALOG IC DEVICE DATA DP1, N, P, P1 SUFFIX CASE 626-05 Plastic Package ISSUE K 8 5 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. –B– 1 4 F DIM A B C D F G H J K L M N –A– NOTE 2 L 8 C 1 J –T– N SEATING PLANE D M K INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 G H 0.13 (0.005) M T A B M M N, P, N-14, P2 SUFFIX CASE 646-06 Plastic Package ISSUE L 14 8 1 7 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. B A F 14 DIM A B C D F G H J K L M N L 1 C J N H DP2, N, P, PC SUFFIX CASE 648-08 Plastic Package ISSUE R MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 G D SEATING PLANE K M 9 1 8 B F C 16 L S 1 –T– SEATING PLANE K H G D J 16 PL 0.25 (0.010) MOTOROLA ANALOG IC DEVICE DATA MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. –A– 16 INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.039 M T A M M DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 13–5 B, P, P2, V SUFFIX CASE 648C-03 Plastic Package (DIP–16) ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. INTERNAL LEAD CONNECTION BETWEEN 4 AND 5, 12 AND 13. –A– 16 9 1 8 –B– L NOTE 5 16 C 1 –T– M N SEATING PLANE K E F J G D 16 PL 0.13 (0.005) 16 PL 0.13 (0.005) M T A M T B MILLIMETERS MIN MAX 18.80 21.34 6.10 6.60 3.69 4.69 0.38 0.53 1.27 BSC 1.02 1.78 2.54 BSC 0.20 0.38 2.92 3.43 7.62 BSC 0_ 10_ 0.39 1.01 S S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION A AND B DOES NOT INCLUDE MOLD PROTRUSION. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25 (0.010). 6. ROUNDED CORNER OPTIONAL. R 16 9 1 8 –B– M P L F 16 J 1 C –T– SEATING PLANE S K H G D 13 PL 0.25 (0.010) P SUFFIX CASE 649-03 Plastic Package ISSUE D P M T B A S L B 1 12 J H F C N 1 K G D SEATING PLANE INCHES MIN MAX 0.740 0.760 0.245 0.260 0.145 0.175 0.015 0.021 0.050 0.070 0.100 BSC 0.050 BSC 0.008 0.015 0.120 0.140 0.295 0.305 0_ 10 _ 0.200 BSC 0.300 BSC 0.015 0.035 MILLIMETERS MIN MAX 18.80 19.30 6.23 6.60 3.69 4.44 0.39 0.53 1.27 1.77 2.54 BSC 1.27 BSC 0.21 0.38 3.05 3.55 7.50 7.74 0_ 10 _ 5.08 BSC 7.62 BSC 0.39 0.88 NOTES: 1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 13 Q DIM A B C D F G H J K L M P R S S A 24 13–6 INCHES MIN MAX 0.740 0.840 0.240 0.260 0.145 0.185 0.015 0.021 0.050 BSC 0.040 0.70 0.100 BSC 0.008 0.015 0.115 0.135 0.300 BSC 0_ 10_ 0.015 0.040 –A– P SUFFIX CASE 648E–01 Plastic Package (DIP–16) ISSUE O 24 DIM A B C D E F G J K L M N M DIM A B C D F G H J K L M N P Q MILLIMETERS MIN MAX 31.50 32.13 13.21 13.72 4.70 5.21 0.38 0.51 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.30 2.92 3.43 14.99 15.49 ––– 10 0.51 1.02 0.13 0.38 0.51 0.76 INCHES MIN MAX 1.240 1.265 0.520 0.540 0.185 0.205 0.015 0.020 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.012 0.115 0.135 0.590 0.610 ––– 10 _ 0.020 0.040 0.005 0.015 0.020 0.030 MOTOROLA ANALOG IC DEVICE DATA A, B, N, P SUFFIX CASE 707-02 Plastic Package ISSUE C 18 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 10 B 1 9 A L C 18 DIM A B C D F G H J K L M N 1 K N F H D G J M SEATING PLANE P SUFFIX CASE 710-02 Plastic Package ISSUE B 1 28 DIM A B C D F G H J K L M N 15 B 14 1 L C A N G F D M K NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 1 40 21 B 1 20 L A C N J F MOTOROLA ANALOG IC DEVICE DATA INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15_ 0.020 0.040 SEATING PLANE 40 G MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15_ 0.51 1.02 J P SUFFIX CASE 711-03 Plastic Package ISSUE C H INCHES MIN MAX 0.875 0.915 0.240 0.260 0.140 0.180 0.014 0.022 0.050 0.070 0.100 BSC 0.040 0.060 0.008 0.012 0.115 0.135 0.300 BSC 0_ 15 _ 0.020 0.040 NOTES: 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITION, IN RELATION TO SEATING PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 28 H MILLIMETERS MIN MAX 22.22 23.24 6.10 6.60 3.56 4.57 0.36 0.56 1.27 1.78 2.54 BSC 1.02 1.52 0.20 0.30 2.92 3.43 7.62 BSC 0_ 15_ 0.51 1.02 D K DIM A B C D F G H J K L M N MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 1.02 1.52 2.54 BSC 1.65 2.16 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15_ 0.51 1.02 INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.040 0.060 0.100 BSC 0.065 0.085 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15_ 0.020 0.040 M SEATING PLANE 13–7 F, P, P-3 SUFFIX CASE 724-03 Plastic Package (NDIP–24) ISSUE D NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. 24 1 –A– 24 13 1 12 –B– L C –T– NOTE 1 K SEATING PLANE N E G M J F D 0.25 (0.010) H, P, DP SUFFIX CASE 738-03 Plastic Package ISSUE E 24 PL 0.25 (0.010) 24 PL T A M M INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 DIM A B C D E F G J K L M N T B M M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. –A– 20 11 1 10 B DIM A B C D E F G J K L M N L C 20 1 –T– K SEATING PLANE J F M T A C 0.25 H M B M 1 4 8 B 1 h e q SEATING PLANE 0.10 A1 B 0.25 13–8 X 45 _ A C M C B S A S M NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS ARE IN MILLIMETERS. 3. DIMENSION D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. 5 E T B M M D 8 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 20 PL 0.25 (0.010) A INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 20 PL 0.25 (0.010) D D, D1, D2 SUFFIX CASE 751-05 Plastic Package (SO-8, SOP-8) ISSUE R M N E G MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 L DIM A A1 B C D E e H h L q MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.18 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ MOTOROLA ANALOG IC DEVICE DATA D SUFFIX CASE 751A-03 Plastic Package (SO-14) ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– 14 8 –B– 1 P 7 PL 0.25 (0.010) 7 M B M 14 1 R X 45 _ G F C –T– 0.25 (0.010) M J M K D 14 PL SEATING PLANE T B A S S DIM A B C D F G J K M P R 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 –B– 1 P 8 PL 0.25 (0.010) 8 M B S G 16 1 K R F X 45 _ C SEATING PLANE D J M 16 PL 0.25 (0.010) DW, FP SUFFIX CASE 751D-04 Plastic Package (SO-20L, SO–20) ISSUE E INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 –A– D SUFFIX CASE 751B-05 Plastic Package (SO-16) ISSUE J –T– MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 T B M A S S –A– 20 10X P 0.010 (0.25) 1 M B M 10 20X J D 0.010 (0.25) M T A B S S 20 F 1 R C –T– 18X MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 G MOTOROLA ANALOG IC DEVICE DATA K SEATING PLANE INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 –B– DIM A B C D F G J K M P R X 45 _ DIM A B C D F G J K M P R MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 M 13–9 DW SUFFIX CASE 751E-04 Plastic Package (SO-24L, SOP (16+4+4)L) ISSUE E –A– 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 13 –B– 12X P 0.010 (0.25) 1 M B M 12 24X 24 D J 0.010 (0.25) 1 T A M B S S DIM A B C D F G J K M P R F R X 45 _ C –T– M SEATING PLANE DW SUFFIX CASE 751F-04 Plastic Package (SO-28L, SOIC–28) ISSUE E K G 22X 1 –A– 15 14X –B– 1 P 0.010 (0.25) M B M 14 M 28X D R 0.010 (0.25) M T A B S S X 45 _ C 26X –T– G F SEATING PLANE K DW SUFFIX CASE 751G-02 Plastic Package (SO-16L, SOP–16L, SOP-8+8L) ISSUE A –B– 8X P 0.010 (0.25) M B M 8 16X MILLIMETERS MIN MAX 17.80 18.05 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.01 10.55 0.25 0.75 J D 16 1 0.010 (0.25) M T A S B S F R X 45 _ C –T– 14X 13–10 G INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 9 1 DIM A B C D F G J K M P R J –A– 16 INCHES MIN MAX 0.601 0.612 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 28 28 MILLIMETERS MIN MAX 15.25 15.54 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.05 10.55 0.25 0.75 K SEATING PLANE M DIM A B C D F G J K M P R MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 MOTOROLA ANALOG IC DEVICE DATA D SUFFIX CASE 751K–01 Plastic Package (SO–16) ISSUE O 16 1 16 S –A– –B– 0.25 (0.010) M B 9 P 1 M_ F DIM A B C D F G J K M P R 8 G R X 45 _ C –T– K J 0.25 (0.010) DW SUFFIX CASE 751N–01 Plastic Package (SOP–16L) ISSUE O SEATING PLANE 14 X D M T A B S S –A– 9 –B– 1 0.010 (0.25) P M B M 8 16 13X 1 J D 0.010 (0.25) M T A S B S F R X 45 _ C –T– S K 9X MOTOROLA ANALOG IC DEVICE DATA SEATING PLANE M MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.368 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. T 16 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4 MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R S T MILLIMETERS MIN MAX 10.15 10.45 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.05 10.55 0.25 0.75 2.54 BSC 3.81 BSC INCHES MIN MAX 0.400 0.411 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.395 0.415 0.010 0.029 0.100 BSC 0.150 BSC G 13–11 CASE 762-01 Plastic Medium Power Package (SIP-9) ISSUE C 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. Q 0.25 (0.010) T A M 1 M –A– –C– U V M X S W E Y R B 9 1 –T– N SEATING PLANE K D M T C 9 PL 0.25 (0.010) FN SUFFIX CASE 775-02 Plastic Package (PLCC-20) ISSUE C 0.25 (0.010) J H G F M T A M Y BRK –N– 0.007 (0.180)M T L–M S N S 0.007 (0.180)M T L–M S N U S D –L– Z –M– W 20 D 1 V G1 X 0.010 (0.250)S T L–M S N S VIEW D–D A 0.007 (0.180)M T L–M S N S R 0.007 (0.180)M T L–M S N S Z H C 0.007 (0.180)M T L–M S N S E G 0.004 (0.100) J –T– SEATING PLANE VIEW S G1 0.010 (0.250)S T L–M S N 13–12 K1 K F S VIEW S 0.007 (0.180)M T L–M S N MILLIMETERS MIN MAX 22.40 23.00 6.40 6.60 3.45 3.65 0.40 0.55 9.35 9.60 1.40 1.60 2.54 BSC 1.51 1.71 0.360 0.400 3.95 4.20 30 _BSC 2.50 2.70 3.15 3.45 13.60 13.90 1.65 1.95 22.00 22.20 0.55 0.75 2.89 BSC 0.65 0.75 2.70 2.80 INCHES MIN MAX 0.873 0.897 0.252 0.260 0.135 1.143 0.015 0.021 0.368 0.377 0.055 0.062 0.100 BSC 0.059 0.067 0.014 0.015 0.155 0.165 30_BSC 0.099 0.106 0.124 0.135 0.535 0.547 0.064 0.076 0.866 0.874 0.021 0.029 0.113 BSC 0.025 0.029 0.106 0.110 NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 1 B M DIM A B C D E F G H J K M N Q R S U V W X Y S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.310 0.330 0.040 ––– MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 7.88 8.38 1.02 ––– MOTOROLA ANALOG IC DEVICE DATA FN SUFFIX CASE 776-02 Plastic Package (PLCC–28) ISSUE D 1 0.007 (0.180) B T L–M M N S T L–M S S Y BRK –N– 0.007 (0.180) U M N S D Z –M– –L– W 28 D X G1 0.010 (0.250) T L–M S N S S V 1 VIEW D–D A 0.007 (0.180) R 0.007 (0.180) M T L–M S N S C M T L–M S N 0.007 (0.180) H Z M T L–M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) –T– T L–M S N S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA ANALOG IC DEVICE DATA 0.007 (0.180) M T L–M S N S VIEW S DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10_ 0.410 0.430 0.040 ––– MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10_ 10.42 10.92 1.02 ––– 13–13 FN SUFFIX CASE 777-02 Plastic Package (PLCC) ISSUE C 0.007(0.180) M T B L–M 0.007(0.180) M T U N S L–M S S N S 1 –N– Y D BRK Z –M– –L– G1 0.010 (0.25) X VIEW D–D V 44 W 1 D 0.007(0.180) M T L–M S N S R 0.007(0.180) M T L–M S N S T 0.007(0.180) M T H A S L–M S L–M S N S N N S S K1 Z K J C F E 0.007(0.180) M T 0.004 (0.10) –T– SEATING G 0.010 (0.25) S T L–M S N NOTES: 1. DATUMS –L–, –M–, AND –N– ARE DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. M SUFFIX CASE 803C PRELIMINARY Plastic Package DIM A B C E F G H J K R U V W X Y Z G1 K1 VIEW S S 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). 11 K –B– 1 1 10 S 10 PL 0.13 (0.005) M B M N C E MILLIMETERS MIN MAX 17.40 17.65 17.40 17.65 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 16.51 16.66 16.51 16.66 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10 _ 15.50 16.00 1.02 ––– J G 20 INCHES MIN MAX 0.685 0.695 0.685 0.695 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.650 0.656 0.650 0.656 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10 _ 0.610 0.630 0.040 ––– NOTES: 6 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 9 MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER SIDE. 10 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– –F– 20 S VIEW S PLANE G1 L–M D 20 PL 0.13 (0.005) M T B 0.10 (0.004) L S –T– A S SEATING PLANE M DIM A B C D E F G H J K L M N S MILLIMETERS MIN MAX 12.35 12.80 5.10 5.45 1.95 2.05 0.35 0.50 ––– 0.81 12.40* 1.15 1.39 0.59 0.81 0.18 0.27 1.10 1.50 0.05 0.20 0_ 10 _ 0.50 0.85 7.40 8.20 INCHES MIN MAX 0.486 0.504 0.201 0.215 0.077 0.081 0.014 0.020 ––– 0.032 0.488* 0.045 0.055 0.023 0.032 0.007 0.011 0.043 0.059 0.001 0.008 0_ 10 _ 0.020 0.033 0.291 0.323 *APPROXIMATE 13–14 MOTOROLA ANALOG IC DEVICE DATA TV SUFFIX CASE 821C-04 Plastic Package (15-Pin ZIP) ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION. AT MAXIMUM MATERIAL CONDITION. 1 15 SEATING PLANE –T– C E M –Q– B DIM A B C D E G H J K L M R S U V Y –P– U Y K V A R S H PIN 15 PIN 1 L G 15X D 15X 0.010 (0.254) T SUFFIX CASE 821D-03 Plastic Package ISSUE C T P Q M S J 0.024 (0.610) M T 15 SEATING PLANE –T– C B E –P– U DIM A B C D E F G H J K Q R U Y A R K PIN 1 Y PIN 15 G 7X 15X MILLIMETERS MIN MAX 17.374 17.627 19.914 20.116 4.395 4.597 0.610 0.787 1.473 1.574 1.270 BSC 4.293 BSC 0.458 0.609 17.780 18.034 5.080 BSC 3.760 3.835 10.567 10.820 3.988 4.242 2.667 2.921 22.047 REF 15.875 16.231 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DELETED 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION. AT MAXIMUM MATERIAL CONDITION. 1 Q –L– INCHES MIN MAX 0.684 0.694 0.784 0.792 0.173 0.181 0.024 0.031 0.058 0.062 0.050 BSC 0.169 BSC 0.018 0.024 0.700 0.710 0.200 BSC 0.148 0.151 0.416 0.426 0.157 0.167 0.105 0.115 0.868 REF 0.625 0.639 H F D 0.010 (0.254) 15X M T P L MOTOROLA ANALOG IC DEVICE DATA S J 0.024 (0.610) M INCHES MIN MAX 0.681 0.694 0.784 0.792 0.173 0.181 0.024 0.031 0.058 0.062 0.016 0.023 0.050 BSC 0.110 BSC 0.018 0.024 1.078 1.086 0.148 0.151 0.416 0.426 0.110 BSC 0.503 REF MILLIMETERS MIN MAX 17.298 17.627 19.914 20.116 4.395 4.597 0.610 0.787 1.473 1.574 0.407 0.584 1.270 BSC 2.794 BSC 0.458 0.609 27.382 27.584 3.760 3.835 10.567 10.820 2.794 BSC 12.776 REF T 13–15 FTB SUFFIX CASE 824D–01 Plastic Package (TQFP–44) ISSUE O 1 L –T–, –U–, –Z– –Z– 44 34 11 T–U G AE DETAIL AA M V S AE PLATING F BASE METAL ÉÉÉÉ ÇÇÇÇ ÇÇÇÇ ÉÉÉÉ J 23 12 0.20 (0.008) DETAIL AA 0.05 (0.002) Z AC Z S T–U 0.20 (0.008) M B L S –U– AB Z –T– S 33 1 22 N D 0.20 (0.008) A 0.20 (0.008) AB T–U M S Z S S Z S M AC T–U S Z S SECTION AE–AE 0.05 (0.002) T–U S 0.20 (0.008) M AC T–U M C –AB– E 0.10 (0.004) –AC– H Y R K W X VIEW AD 13–16 DETAIL AD Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.530 (0.021). MILLIMETERS DIM MIN MAX A 9.950 10.050 B 9.950 10.050 C 1.400 1.600 D 0.300 0.450 E 1.350 1.450 F 0.300 0.400 G 0.800 BSC H 0.050 0.150 J 0.090 0.200 K 0.450 0.550 L 8.000 BSC M 12_REF N 0.090 0.160 Q 1_ 5_ R 0.100 0.200 S 11.900 12.100 V 11.900 12.100 W 0.200 REF X 1.000 REF Y 12_REF INCHES MIN MAX 0.392 0.396 0.392 0.396 0.055 0.063 0.012 0.018 0.053 0.057 0.012 0.016 0.031 BSC 0.002 0.006 0.004 0.008 0.018 0.022 0.315 BSC 12_REF 0.004 0.006 1_ 5_ 0.004 0.008 0.469 0.476 0.469 0.476 0.008 REF 0.039 REF 12_REF MOTOROLA ANALOG IC DEVICE DATA FB SUFFIX CASE 824E–02 Plastic Package (QFP) ISSUE A 44 1 S 0.20 (0.008) M –L–, –M–, –N– T L–M S N S H L–M S N S A 0.20 (0.008) M 0.05 (0.002) L–M PIN 1 IDENT J1 44 G J1 34 VIEW Y 33 1 G 11 40X S T L–M M J 0.20 (0.008) VIEW Y BASE METAL B1 D M T L–M S N S SECTION J1–J1 44 PL 22 –N– M VIEW P C E –H– W Y q1 R DATUM PLANE ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ 0.20 (0.008) 23 12 F PLATING V S 0.20 (0.008) M B –M– 0.05 (0.002) N –L– H L–M N N S S 3 PL –H– R K A1 C1 VIEW P MOTOROLA ANALOG IC DEVICE DATA R1 R2 q2 DATUM PLANE 0.01 (0.004) –T– NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –L–, –M– AND –N– TO BE DETERMINED AT DATUM PLANE –H–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –T–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –H–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.530 (0.021). DIM A B C D E F G J K M S V W Y A1 B1 C1 R1 R2 q1 q2 MILLIMETERS INCHES MIN MAX MIN MAX 9.90 10.10 0.390 0.398 9.90 10.10 0.390 0.398 2.00 2.21 0.079 0.087 0.30 0.45 0.0118 0.0177 2.00 2.10 0.079 0.083 0.30 0.40 0.012 0.016 0.80 BSC 0.031 BSC 0.13 0.23 0.005 0.009 0.65 0.95 0.026 0.037 5_ 10 _ 5_ 10_ 12.95 13.45 0.510 0.530 12.95 13.45 0.510 0.530 0.000 0.210 0.000 0.008 5_ 10 _ 5_ 10 _ 0.450 REF 0.018 REF 0.130 0.005 0.170 0.007 1.600 REF 0.063 REF 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 5_ 10 _ 5_ 10 _ 0_ 7_ 0_ 7_ 13–17 FB SUFFIX CASE 840F–01 Plastic Package ISSUE O 64 1 L –Z– 64 49 S S T–U 48 T–U 1 –T–, –U–, –Z– –U– DETAIL AA S S AC Z M G DETAIL AA 33 S 16 AE V 0.20 (0.008) –T– AE 0.20 (0.008) M 0.050 (0.002) B Z L AB Z P 32 Z 17 S S Z S F M C SECTION AE–AE –AB– Y D J E H ÉÉÉ ÇÇ ÉÉÉ ÇÇ ÉÉÉ ÇÇ ÉÉÉ ÇÇ ÉÉÉ N S Z AC T–U S AC T–U M S M 0.20 (0.008) BASE METAL 0.20 (0.008) A 0.20 (0.008) M AB T–U 0.050 (0.002) T–U 0.10 (0.004) –AC– DETAIL AD Q R K W X DETAIL AD 13–18 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT DATUM PLANE –AC–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). MILLIMETERS DIM MIN MAX A 9.950 10.050 B 9.950 10.050 C 1.400 1.600 D 0.170 0.270 E 1.350 1.450 F 0.170 0.230 G 0.500 BSC H 0.050 0.150 J 0.090 0.200 K 0.450 0.550 7.500 BSC L M 12° REF N 0.090 0.160 0.250 BSC P Q 1° 5° R 0.100 0.200 S 11.900 12.100 V 11.900 12.100 0.200 REF W 1.000 REF X 12° REF Y INCHES MIN MAX 0.392 0.396 0.392 0.396 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BSC 0.002 0.006 0.004 0.008 0.018 0.022 0.295 BSC 12° REF 0.004 0.006 0.010 BSC 5° 1° 0.004 0.008 0.469 0.476 0.469 0.476 0.008 REF 0.039 REF 12° REF MOTOROLA ANALOG IC DEVICE DATA DM SUFFIX CASE 846A–02 Plastic Package (Micro–8) ISSUE C 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. –A– –B– K PIN 1 ID G D 8 PL 0.08 (0.003) –T– M T B S A S SEATING PLANE 0.038 (0.0015) C H MOTOROLA ANALOG IC DEVICE DATA J DIM A B C D G H J K L MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 ––– 1.10 0.25 0.40 0.65 BSC 0.05 0.15 0.13 0.23 4.75 5.05 0.40 0.70 INCHES MIN MAX 0.114 0.122 0.114 0.122 ––– 0.043 0.010 0.016 0.026 BSC 0.002 0.006 0.005 0.009 0.187 0.199 0.016 0.028 L 13–19 FB SUFFIX CASE 848B-04 Plastic Package (TQFP–52) ISSUE C 1 52 L 39 27 S D S V B –A–, –B–, –D– 0.20 (0.008) 0.20 (0.008) M L B M C A–B S S B H A–B –B– –A– 0.05 (0.002) A–B DETAIL A D 26 40 DETAIL A 14 52 1 13 –D– B 0.20 (0.008) M H A–B F S D S S D S 0.05 (0.002) A–B J V 0.20 (0.008) M C A–B N BASE METAL M_ C D DETAIL C 0.02 (0.008) E –H– M C A–B S D S SECTION B–B DATUM PLANE 0.10 (0.004) H M_ G U_ R Q_ K T W X DETAIL C 13–20 –C– SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT DATUM PLANE –H–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –C–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –H–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N Q R S T U V W X MILLIMETERS MIN MAX 9.90 10.10 9.90 10.10 2.10 2.45 0.22 0.38 2.00 2.10 0.22 0.33 0.65 BSC ––– 0.25 0.13 0.23 0.65 0.95 7.80 REF 5_ 10_ 0.13 0.17 0_ 7_ 0.13 0.30 12.95 13.45 0.13 ––– 0_ ––– 12.95 13.45 0.35 0.45 1.6 REF INCHES MIN MAX 0.390 0.398 0.390 0.398 0.083 0.096 0.009 0.015 0.079 0.083 0.009 0.013 0.026 BSC ––– 0.010 0.005 0.009 0.026 0.037 0.307 REF 5_ 10 _ 0.005 0.007 0_ 7_ 0.005 0.012 0.510 0.530 0.005 ––– 0_ ––– 0.510 0.530 0.014 0.018 0.063 REF MOTOROLA ANALOG IC DEVICE DATA FB SUFFIX CASE 848D–03 Plastic Package ISSUE C 52 1 4X 4X TIPS 0.20 (0.008) H L–M N 0.20 (0.008) T L–M N 52 40 1 CL 39 3X VIEW –X– X=L, M, N AB Y –L– AB –M– B B1 VIEW Y V V1 27 14 26 J –N– A1 S1 ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ BASE METAL F PLATING 13 G 0.13 (0.005) M D T L–M U S N S A SECTION AB–AB S ROTATED 90_ CLOCKWISE 4X C θ2 0.10 (0.004) T –H– –T– SEATING PLANE 4X θ3 VIEW AA 0.05 (0.002) S W θ1 2XR R1 0.25 (0.010) C2 θ GAGE PLANE K C1 E Z VIEW AA MOTOROLA ANALOG IC DEVICE DATA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –L–, –M– AND –N– TO BE DETERMINED AT DATUM PLANE –H–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –T–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46 (0.018). MINIMUM SPACE BETWEEN PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07 (0.003). DIM A A1 B B1 C C1 C2 D E F G J K R1 S S1 U V V1 W Z θ θ1 θ2 θ3 MILLIMETERS MIN MAX 10.00 BSC 5.00 BSC 10.00 BSC 5.00 BSC ––– 1.70 0.05 0.20 1.30 1.50 0.20 0.40 0.75 0.45 0.22 0.35 0.65 BSC 0.07 0.20 0.50 REF 0.08 0.20 12.00 BSC 6.00 BSC 0.09 0.16 12.00 BSC 6.00 BSC 0.20 REF 1.00 REF 0_ 7_ ––– 0_ 12 _ REF 5_ 13 _ INCHES MIN MAX 0.394 BSC 0.197 BSC 0.394 BSC 0.197 BSC ––– 0.067 0.002 0.008 0.051 0.059 0.008 0.016 0.018 0.030 0.009 0.014 0.026 BSC 0.003 0.008 0.020 REF 0.003 0.008 0.472 BSC 0.236 BSC 0.004 0.006 0.472 BSC 0.236 BSC 0.008 REF 0.039 REF 0_ 7_ ––– 0_ 12 _ REF 5_ 13 _ 13–21 B SUFFIX CASE 858–01 Plastic Package ISSUE O 42 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010). –A– 42 22 –B– 1 21 DIM A B C D F G H J K L M N L H C –T– SEATING PLANE N G F D 42 PL K 0.25 (0.010) M T A M J 42 PL 0.25 (0.010) S M T B INCHES MIN MAX 1.435 1.465 0.540 0.560 0.155 0.200 0.014 0.022 0.032 0.046 0.070 BSC 0.300 BSC 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 36.45 37.21 13.72 14.22 3.94 5.08 0.36 0.56 0.81 1.17 1.778 BSC 7.62 BSC 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15 _ 0.51 1.02 S B SUFFIX CASE 859–01 Plastic Package (SDIP) ISSUE O 56 1 –A– 56 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010) 29 –B– 1 28 L H C –T– K SEATING PLANE G F D 56 PL 0.25 (0.010) 13–22 E M T A S N J M 56 PL 0.25 (0.010) M T B DIM A B C D E F G H J K L M N INCHES MIN MAX 2.035 2.065 0.540 0.560 0.155 0.200 0.014 0.022 0.035 BSC 0.032 0.046 0.070 BSC 0.300 BSC 0.008 0.015 0.115 0.135 0.600 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 51.69 52.45 13.72 14.22 3.94 5.08 0.36 0.56 0.89 BSC 0.81 1.17 1.778 BSC 7.62 BSC 0.20 0.38 2.92 3.43 15.24 BSC 0_ 15 _ 0.51 1.02 S MOTOROLA ANALOG IC DEVICE DATA FB, FTB SUFFIX CASE 873-01 Plastic Package (TQFP–32) ISSUE A 1 L S D S H A–B V P B M S D S 0.20 (0.008) B B 0.20 (0.008) L M –B– –A– 0.05 (0.002) A–B 16 C A–B 17 24 25 –A–, –B–, –D– DETAIL A DETAIL A 32 9 1 8 F BASE METAL –D– A 0.20 (0.008) C A–B M D S S 0.05 (0.002) A–B N J S 0.20 (0.008) M H A–B D S S D 0.20 (0.008) M M C A–B D S S DETAIL C SECTION B–B VIEW ROTATED 90 _CLOCKWISE C E –H– –C– SEATING PLANE H M G DATUM PLANE 0.01 (0.004) U T R –H– DATUM PLANE K X DETAIL C MOTOROLA ANALOG IC DEVICE DATA Q NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT DATUM PLANE –H–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –C–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –H–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. DIM A B C D E F G H J K L M N P Q R S T U V X MILLIMETERS MIN MAX 6.95 7.10 6.95 7.10 1.40 1.60 0.273 0.373 1.30 1.50 0.273 ––– 0.80 BSC ––– 0.20 0.119 0.197 0.33 0.57 5.6 REF 6_ 8_ 0.119 0.135 0.40 BSC 5_ 10_ 0.15 0.25 8.85 9.15 0.15 0.25 5_ 11_ 8.85 9.15 1.00 REF INCHES MIN MAX 0.274 0.280 0.274 0.280 0.055 0.063 0.010 0.015 0.051 0.059 0.010 ––– 0.031 BSC ––– 0.008 0.005 0.008 0.013 0.022 0.220 REF 6_ 8_ 0.005 0.005 0.016 BSC 5_ 10_ 0.006 0.010 0.348 0.360 0.006 0.010 5_ 11_ 0.348 0.360 0.039 REF 13–23 T SUFFIX CASE 894-03 Plastic Package (23-Pin SZIP) ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION R DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH OR PROTRUSIONS. 5. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 (0.250). 6. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 1 23 C E B –N– L U K Y P F V M S H A R W –T– 23X PIN 1 0.024 (0.610) PIN 23 G 23X D 0.010 (0.254) 13–24 M T Q J SEATING PLANE S N M T DIM A B C D E F G H J K L M N P R S U V W Y INCHES MIN MAX 0.684 0.694 1.183 1.193 0.175 0.179 0.026 0.031 0.058 0.062 0.165 0.175 0.050 BSC 0.169 BSC 0.014 0.020 0.625 0.639 0.770 0.790 0.148 0.152 0.148 0.152 0.390 BSC 0.416 0.424 0.157 0.167 0.105 0.115 0.868 REF 0.200 BSC 0.700 0.710 MILLIMETERS MIN MAX 17.374 17.627 30.048 30.302 4.445 4.547 0.660 0.787 1.473 1.574 4.191 4.445 1.270 BSC 4.293 BSC 0.356 0.508 15.875 16.231 19.558 20.066 3.760 3.861 3.760 3.861 9.906 BSC 10.566 10.770 3.988 4.242 2.667 2.921 22.047 REF 5.080 BSC 17.780 18.034 S MOTOROLA ANALOG IC DEVICE DATA FTA SUFFIX CASE 932–02 Plastic Package (TQFP–48) ISSUE D 1 48 P 4X 0.200 (0.008) AB T–U Z 9 DETAIL Y A A1 48 37 AE 1 AE 36 –T– –U– B V B1 12 25 13 V1 –T–, –U–, –Z– DETAIL Y 24 –Z– S1 M_ TOP & BOTTOM S R 4X 0.200 (0.008) AC T–U Z GAUGE PLANE 0.250 (0.010) C E 0.080 (0.003) AC G –AB– W H Q_ –AC– AD K DETAIL AD X ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ BASE METAL N J F D 0.080 (0.003) M AC T–U S Z S SECTION AE–AE MOTOROLA ANALOG IC DEVICE DATA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X MILLIMETERS MIN MAX 7.000 BSC 3.500 BSC 7.000 BSC 3.500 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BASIC 0.050 0.150 0.090 0.200 0.500 0.700 12 _REF 0.090 0.160 0.250 BASIC 1_ 5_ 0.150 0.250 9.000 BSC 4.500 BSC 9.000 BSC 4.500 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.276 BSC 0.138 BSC 0.276 BSC 0.138 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BASIC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BASIC 1_ 5_ 0.006 0.010 0.354 BSC 0.177 BSC 0.354 BSC 0.177 BSC 0.008 REF 0.039 REF 13–25 D2T SUFFIX CASE 936–03 Plastic Package ISSUE B 1 2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 4. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 3 TERMINAL 4 K U A S B V H F 1 2 3 DIM A B C D E F G H J K L M N P R S U V J D G 0.010 (0.254) M T –T– OPTIONAL CHAMFER E C M L INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.051 REF 0.100 BSC 0.539 0.579 0.125 MAX 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.295 REF 2.540 BSC 13.691 14.707 3.175 MAX 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN P N R D2T SUFFIX CASE 936A–02 Plastic Package (D2PAK) ISSUE A 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A AND K. 4. DIMENSIONS U AND V ESTABLISH A MINIMUM MOUNTING SURFACE FOR TERMINAL 6. 5. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH OR GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.025 (0.635) MAXIMUM. 5 TERMINAL 6 U A V S K B H 1 2 3 4 5 DIM A B C D E G H K L M N P R S U V D 0.010 (0.254) M T G –T– OPTIONAL CHAMFER E C M N INCHES MIN MAX 0.386 0.403 0.356 0.368 0.170 0.180 0.026 0.036 0.045 0.055 0.067 BSC 0.539 0.579 0.050 REF 0.000 0.010 0.088 0.102 0.018 0.026 0.058 0.078 5 _ REF 0.116 REF 0.200 MIN 0.250 MIN MILLIMETERS MIN MAX 9.804 10.236 9.042 9.347 4.318 4.572 0.660 0.914 1.143 1.397 1.702 BSC 13.691 14.707 1.270 REF 0.000 0.254 2.235 2.591 0.457 0.660 1.473 1.981 5 _ REF 2.946 REF 5.080 MIN 6.350 MIN L P R 13–26 MOTOROLA ANALOG IC DEVICE DATA 20 DT, DTB SUFFIX CASE 948E–02 Plastic Package (TSSOP–20) ISSUE A 1 20X 0.15 (0.006) T U M 20 L/2 2X K REF 0.10 (0.004) S T U V S K K1 ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ S J J1 11 B L PIN 1 IDENT 0.25 (0.010) N 10 1 0.15 (0.006) T U SECTION N–N –U– M S A –V– N F DETAIL E C G D –W– H 0.100 (0.004) –T– SEATING DTB SUFFIX 16 CASE 948F–01 Plastic Package (TSSOP–16, TSSOP–16L) ISSUE O 1 16X K REF 0.10 (0.004) M T U S V S ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ S K K1 2X L/2 16 9 J1 B –U– L SECTION N–N J PIN 1 IDENT. 8 1 S M A –V– N F DETAIL E C 0.10 (0.004) –T– SEATING PLANE MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ –W– H D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. N 0.25 (0.010) 0.15 (0.006) T U DIM A B C D F G H J J1 K K1 L M DETAIL E PLANE 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. G DETAIL E MOTOROLA ANALOG IC DEVICE DATA 13–27 DTB SUFFIX CASE 948G–01 Plastic Package (TSSOP–14) ISSUE O 14 1 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. S S N 2X 14 L/2 0.25 (0.010) 8 M B –U– L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A –V– ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 J J1 SECTION N–N –W– C 0.10 (0.004) –T– SEATING PLANE 13–28 D G H DETAIL E DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MOTOROLA ANALOG IC DEVICE DATA DTB SUFFIX CASE 948H–01 Plastic Package ISSUE O 24 1 24X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S 2X 24 L/2 B –U– L PIN 1 IDENT. 12 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. 13 S A –V– DIM A B C D F G H J J1 K K1 L M C 0.10 (0.004) –T– SEATING PLANE G D H MILLIMETERS MIN MAX 7.70 7.90 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.303 0.311 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ –W– DETAIL E N 0.25 (0.010) K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ M K1 J1 N F SECTION N–N J MOTOROLA ANALOG IC DEVICE DATA DETAIL E 13–29 DTB SUFFIX CASE 948J–01 Plastic Package (TSSOP–8) ISSUE O 8 1 0.15 (0.006) T U NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. K REF 8x 0.10 (0.004) S M T U V S S K 2X L/2 ÉÉ ÇÇÇ ÇÇÇ ÉÉ K1 8 5 J J1 B –U– L PIN 1 IDENT. SECTION N–N 4 1 N 0.25 (0.010) 0.15 (0.006) T U S A –V– M N F DETAIL E –W– C 0.10 (0.004) –T– SEATING PLANE G D SEE DETAIL E H M SUFFIX CASE 967–01 Plastic Package (EIAJ–20) ISSUE O INCHES MIN MAX 0.114 0.122 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 1 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE 1 M_ L 10 DETAIL P Z D VIEW P e A c A1 b 0.13 (0.005) MILLIMETERS MIN MAX 2.90 3.10 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ 20 20 13–30 DIM A B C D F G H J J1 K K1 L M M 0.10 (0.004) DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX ––– 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 ––– 0.81 INCHES MIN MAX ––– 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 ––– 0.032 MOTOROLA ANALOG IC DEVICE DATA FTB SUFFIX CASE 976–01 Plastic Package (TQFP–20) ISSUE O 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 1 4X 9 0.200 (0.008) AB T–U Z A A1 20 DETAIL Y 16 15 1 –T– –U– V B1 V1 11 5 6 10 –Z– S1 MILLIMETERS MIN MAX 4.000 BSC 2.000 BSC 4.000 BSC 2.000 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.650 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_REF 0.090 0.160 0.250 BSC 1_ 5_ 0.150 0.250 6.000 BSC 3.000 BSC 6.000 BSC 3.000 BSC 0.200 REF 1.000 REF DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X B S 4X 0.200 (0.008) AB T–U Z DETAIL AD ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ ÉÉÉÉ ÇÇÇÇ J –AB– INCHES MIN MAX 0.157 BSC 0.079 BSC 0.157 BSC 0.079 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.026 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BSC 1_ 5_ 0.006 0.010 0.236 BSC 0.118 BSC 0.236 BSC 0.118 BSC 0.008 REF 0.039 REF –AC– N F D 0.080 (0.003) AC 0.080 (0.003) M_ S AC T–U S Z S SECTION AE–AE TOP & BOTTOM R –T–, –U–, –Z– C E AE W H K X DETAIL AD MOTOROLA ANALOG IC DEVICE DATA Q_ AE GAUGE PLANE 0.250 (0.010) G DETAIL Y 13–31 FTA SUFFIX CASE 977–01 Plastic Package ISSUE O 24 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5. DIMENSIONS S AND V TO BE DETERMINED AT DATUM PLANE –AC–. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.350 (0.014). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9. EXACT SHAPE OF EACH CORNER IS OPTIONAL. 1 4X 9 0.200 (0.008) AB T–U Z A A1 24 –T– DETAIL Y 19 18 1 –U– V DIM A A1 B B1 C D E F G H J K M N P Q R S S1 V V1 W X B V1 13 6 B1 12 7 –Z– S1 S 4X 0.200 (0.008) AB T–U Z MILLIMETERS MIN MAX 4.000 BSC 2.000 BSC 4.000 BSC 2.000 BSC 1.400 1.600 0.170 0.270 1.350 1.450 0.170 0.230 0.500 BSC 0.050 0.150 0.090 0.200 0.500 0.700 12_REF 0.090 0.160 0.250 BSC 1_ 5_ 0.150 0.250 6.000 BSC 3.000 BSC 6.000 BSC 3.000 BSC 0.200 REF 1.000 REF INCHES MIN MAX 0.157 BSC 0.079 BSC 0.157 BSC 0.079 BSC 0.055 0.063 0.007 0.011 0.053 0.057 0.007 0.009 0.020 BSC 0.002 0.006 0.004 0.008 0.020 0.028 12 _REF 0.004 0.006 0.010 BSC 1_ 5_ 0.006 0.010 0.236 BSC 0.118 BSC 0.236 BSC 0.118 BSC 0.008 REF 0.039 REF DETAIL AD –T–, –U–, –Z– –AB– –AC– AE AE 0.080 (0.003) AC M_ TOP & BOTTOM R C E J W H K X Q_ ÇÇÇÇ ÉÉÉÉ ÉÉÉÉ ÇÇÇÇ ÉÉÉÉ ÇÇÇÇ P G DETAIL Y N F GAUGE PLANE D 0.250 (0.010) 0.080 (0.003) S AC T–U S Z S DETAIL AD SECTION AE–AE 13–32 MOTOROLA ANALOG IC DEVICE DATA N SUFFIX CASE 1212–01 Plastic Package (SOT–23) ISSUE O 1 A B D 5 E A2 0.05 S NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. A1 4 1 2 L 3 E1 L1 B C 5X 0.10 C B M A S C S e e1 H SUFFIX CASE 1213–01 Plastic Package (SOT–89) ISSUE O DIM A1 A2 B C D E E1 e e1 L L1 MILLIMETERS MIN MAX 0.00 0.10 1.00 1.30 0.30 0.50 0.10 0.25 2.80 3.00 2.50 3.10 1.50 1.80 0.95 BSC 1.90 BSC 0.20 ––– 0.45 0.75 1 A D A2 C B D1 E1 E L1 B 0.10 B1 e M C B S A S 2X 0.10 M C B S A S C NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUM C IS A SEATING PLANE. DIM A2 B B1 C D D1 E E1 e e1 L1 MILLIMETERS MIN MAX 1.40 1.60 0.37 0.57 0.32 0.52 0.30 0.50 4.40 4.60 1.50 1.70 ––– 4.25 2.40 2.60 1.50 BSC 3.00 BSC 0.80 ––– e1 MOTOROLA ANALOG IC DEVICE DATA 13–33