Reliability .Bondability .Ultra Fine Pitch

Reliability .Bondability .Ultra Fine Pitch

Reliability . Bondability . Ultra Fine Pitch
State-of-the-Art 2N Gold Wire
with Ultimate Reliability and Bondability
Ultimater High Reliability Performance
Features
Ball Strength [gm]
6.0
Ultimate high reliability of 1st bond
Hassle-free bondability in both 1st and 2nd bond,
suitable for both laminate and leadframe devices
Significantly improved 2nd bond stitch pull value
Robust 2nd bond at lower parameters
Improved concentricity of FAB for ultrafine wire bonding
Soft free air ball, applicable for low-k and sensitive die
Higher MTBA as compared to other 2N gold wires
5.0
4.0
3.0
RelMax of 15 µm diameter passed HTS
5000 hours at 200°C – significantly
surpass the most stringent criteria in the
market, including automotive industry
2.0
1.0
0.0
0
100 200 300 500 1000 1500 3500 5000
Isothermal Aging @ 200°C in Air [hrs]
Bonder: K&S Maxum . Capillary: K&S E18CJ-2010-R33
Device: K&S PBGA test device (35 µm PPB) . Bonded
ball diameter: 27 µm . Gold wire: 15 µm
Stable intermetallic growth
at elevated storage temperature
Improved Bonded Ball Concentricity
15 µm 1000 hrs 200°C
6.25 µm
15 µm 5000 hrs 200°C
Soft Free Air Ball
Reference Wire
FAB Hardness [HV0.005/5]
85
80
75
70
65
60
Ultra-fine pitch ball bond concentricity
55
Wire bonder: K&S Maxum Ultra . Capillary: K&S M18CK-2013-R33 (H15 CD20 T40 OR5 FA08 ICA50°) . Device: K&S PBGA 4x4 test
device . Bonded ball diameter: 23 µm . Gold wire: 12.2 µm
Reference Wire
Wire bonder: K&S Maxum . EFO current: 20 mA
FAB size: 25 µm . Gold wire: 15 µm
Recommended Technical Data of
Diameter
Microns
15
18
20
23
25
28
30
33
Mils
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
Elongation (%)
2–6
2–7
3–7
3–7
3–7
3–8
3–8
3–8
Breaking Load (g)
3–7
4–9
5 – 11
8 – 14
10 – 16
13 – 19
15 – 20
18 – 25
For other diameters, please contact Heraeus Bonding Wires sales representative.
Larger 2nd Bond Window
Characteristics
with Improved Stitch Pull Value
Diameter at 25 µm
Diameter at 15 µm
ⵑ 90 GPa
ⵑ 90 GPa
35 – 110 µm
35 – 110 µm
45
57 – 67 HV (0.01 N/5 s)
57 – 67 HV (0.01 N/5 s)
40
Fusing Current, dia 10 mm length (in air)
0.37 A
0.29 A
Non-Gold Elements
< 1%
< 1%
Heat Conductivity
19.3 g/cm3
2.3 W/cm.K
19.3 g/cm3
2.3 W/cm.K
Electrical Resistivity
3.3 µ⍀-cm
3.3 µ⍀-cm
Coeff. of Linear Expansion (20 – 100 °C)
14.2 ppm/K
14.2 ppm/K
Heat Affected Zone (HAZ) at BSR 1.8
FAB Hardness at BSR 1.8
Density
Stitch pull reference 2N wire
35
Force [g]
Elastic Modulus
30
25
20
15
10
5
25
50
75
100
125
150
125
150
USG [mA]
Stitch pull reference RelMax
Maintaining Stitch Pull at Lower Bonding Parameter Setting
45
40
35
Optimum
-20%
Force [g]
Parameter reduction (USG, Force)
-40%
30
25
20
7
7
6
6
10
5
5
5
4
4
3
3
Stitch Pull [g]
15
2
Reference
RelMax
Reference
RelMax
50
75
100
USG [mA]
2
RelMax
25
Reference
<=3.500 <=3.700
<=4.000 <=4.250
<=4.750 <=5.000
<=5.250
<=4.500
>5.250
Bonder: K&S Maxum Ultra . Capillary: CIC Duracap 4B8CG2156-A33 . (H9.5, CD 12.5, T24, OR3, F011) . Device: K&S
PBGA test device . Gold wire: 20 µm
Wire bonder: K&S Maxum . Capillary: K&S 2CA5768L
(H9.5 CD12.5 T24 OR3 F011) . Device: K&S PBGA
test device . Gold wire: 20 µm
MTBA Improvement over Ref. 2N Wire
50%
41%
40%
29%
30%
20%
10%
0%
Device Type A
Device Type B
Device: BGA
Wire bonder: ASM Eagle 60 AP
Capillary: K&S SI-24060-302F
Gold wire: 20 µm
Device: BGA
Wire bonder: K&S Maxum Plus
Capillary: K&S 488CF-3454-R33
Gold wire: 23 µm
Superior Reliability
Superior Reliability
Superior Reliability
High
hL
Sen
si
str tive p
uct
ure ad
Hig
Layout: HET14025-0516-1
Gold Wire Segmentation by Properties
oop
/ Lo
wL
oop
Highest Looping
Performance
Electrical Performance
Widest Bonding
Highest Looping
Window
Performance
Widest Bonding
Window
Highest Looping
Performance
Average
The data given here is valid. We reserve the right to make technical alterations.
Widest Bonding
Window
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12-14
63450 Hanau, Germany
www.heraeus-electronics.com
Americas
Phone +1 610 825 6050
electronics.americas@heraeus.com
China
Phone +86 21 3357 5194
electronics.china@heraeus.com
Asia Pacific
Phone +65 6571 7677
electronics.apac@heraeus.com
Europe, Middle East and Africa
Phone +49 6181 35 3069
+49 6181 35 3627
electronics.emea@heraeus.com
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.