Copper Wire with an Al layer

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Cu Al
Copper Wire with an Al layer
Cu
Al Benefits
Copper wire with an Al layer
Suitable for temperature sensitive
devices
Bonding at room temperature
For wedge/wedge bonding process
High mechanical and thermal stability
For normal and high speed assembling
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Within the manufacture of complex assem-
wire Nano-CuAl enables copper wire bonding
bly structures and temperature sensitive
at room temperature, thus allowing highest
devices, the demand for highest quality
processing rates for advanced applications.
standards and robustness is a challenge.
For demands of high reliability and temperaWith the new Cu-Al Bonding Wire Nano-CuAl
ture sensitive devices, especially the alu-
for high performance Cu-wedge/wedge
minum fine wire wedge/wedge bonding has
bonding, Heraeus provides an interesting
its limitations.
solution in terms of high reliability of complex devices. Heraeus’ new Cu-Al bonding
Recommended Technical Data of
Diameter
Elongation (%)
Breaking Load (%)
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Cu Al
Microns
25
32
38
50
Mils
1.0
1.25
1.5
2.0
2–8
2–8
3 – 10
3 – 12
> 10 cN
> 14 cN
> 20 cN
> 37 cN
For other diameters, please contact Heraeus Bonding Wires sales representative.
N, Layout: HET16008-0516-1
Cu Al
The new Cu-Al Bonding Wire Nano-CuAl
Pull Force Results
consists of a copper wire basis of proven
14
Heraeus quality, with an Al layer concept
of defined thickness.
12
Under certain parameter presettings, this
pull force [cN]
10
wire can be bonded at room temperature,
effecting a stable connection at commonly
8
used ultrasonic transducer frequencies.
6
Si-Wafer
The result is an electrical connection with
4
3x3 mm Chip
all widely known advantages given from the
Ni/Au flash
2
use of copper – especially in terms of reliability, strength, loop stability and electrical
characteristics.
0
30
35
40
45
50
55
60
65
wedge width [µm]
Heraeus Electronics
Heraeus Deutschland GmbH & Co. KG
Heraeusstraße 12-14
63450 Hanau, Germany
www.heraeus-electronics.com
Americas
Phone +1 610 825 6050
electronics.americas@heraeus.com
China
Phone +86 21 3357 5457
electronics.china@heraeus.com
Asia Pacific
Phone +65 6571 7677
electronics.apac@heraeus.com
Europe, Middle East and Africa
Phone +49 6181 35 3069
+49 6181 35 3627
electronics.emea@heraeus.com
The descriptions and engineering data shown here have been compiled by Heraeus using commonly-accepted procedures, in conjunction with modern testing equipment, and have been compiled as according to the latest factual knowledge in our
possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or
any patent infringement resulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests to determine materials suitability for particular application.
The data given here is valid. We reserve the right to make technical alterations.
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