SolderQuik® BGA Preforms - Reballing Quick
Transcription
SolderQuik® BGA Preforms - Reballing Quick
SolderQuik® BGA Preforms - Reballing Quick Guide 1. Insert preform with logo side down 4. Insert BGA Copyright © 1998-2007 Winslow Automation, Inc. 2. Check alignment 5. Reflow 3. Apply paste flux evenly 6. Moisten & remove paper SolderQuik® is a registered trademark of Winslow Automation, Inc. SM-4051A