Accurate broadband modelling of multiconductor line RLGC
Transcription
Accurate broadband modelling of multiconductor line RLGC
Accurate broadband modelling of multiconductor line RLGC-parameters in the presence of good conductors and semiconducting substrates Daniël De Zutter (Fellow IEEE) Ghent University Dept. of Information Technology Electromagnetics Group 1 Overview Accurate broadband modelling of multiconductor line RLGC-parameters in the presence of good conductors and semiconducting substrates Introduction RLGC-parameters modelling approach Examples Further research and challenges Questions & discussion 2 Introduction How to model signal integrity? full 3D numerical tools direct access to multiport S-parameters PlayStation 3 motherboard and time-domain data holistic but time-consuming (some times too easily) believed to be accurate divide and conquer multiconductor lines, vias, connectors, packages, chips, …. model each of them with a dedicated tool derive a circuit model for each part obtain the S-parameters and time-domain data from overall circuit representation gives more insight to the designer (optimisation) overall accuracy might be difficult to assess 3 Introduction Multiconductor Transmission Lines simplify (idealize) to a 2D problem 2D fields, charges, currents RLGC PlayStation 3 motherboard 3D fields, charges, currents Transmission lines voltages & currents 4 Multiconductor TML Telegrapher’s equations (RLGC) 1 2 ….. N reference N+1 conductors – one reference conductor i : Nx1 current vector v : Nx1 voltage vector C : NxN capacitance matrix L : NxN inductance matrix G : NxN conductance matrix R : NxN resistance matrix 5 Multiconductor TML wish list reference broadband results (time-domain) many regions some semi-conducting good conductors (e.g. copper) small details exact current crowding and skin effect modelling on-chip interconnect example: • 4 differential line pairs • semi-conducting region • unusual reference conductor modelling approach? 6 Model building vector potential How to “correctly” define voltages? scalar potential Step 1: define the voltages on the good conductors z c is constant on c = Telegrapher’s v(z) good cond. >> v(z) i.e. we only take the effect of longitudinal currents into account (quasi – Transverse Magnetic approximation; hz-field is negligible) 7 Model building Step 2: quasi-TM approximation in lossy dielectrics and semi-conductors lossy dielectric ( << ) and tranversal ø i.e. as we neglect transversal currents, we also neglect possible charges sufficiently large w.r.t. semi-conductor behaves as a good conductor c vsc semi-cond. smaller than or comparable to behaves as a “lossy” dielectric but 8 Model building How do we keep a link between the (v,i)-description and the modal fields? 1V 1V 0V differential pair – even mode -1 V 1V 0V differential pair – odd mode Step 3: judicious choice of model to properly link fields and MTL representation field eigenmodes (Em, Hm) voltage-current TL eigenmodes (vm, im) 9 Model building use field reciprocity and carry it over from the fields to voltages and currents =0 important consequence: the symmetry of the RLGC-matrices is automatically guaranteed 10 Model building What about the currents? Is our choice still free? Step 4: current interpretation classical: integrated current density through cross-section i v1,i1 extension to semi-conducting substrates c semicond. diel. c v2,i2 Maxwell + quasi-TM approx. + mode orthogonality leads to: circuit current in is actual current through conductor n + suitably weighted sum of currents through semiconductors! 11 Model building Step 5: determine complex capacitance matrix with a boundary integral equation + consider equivalent polarisation charges eq in free space + express the potential everywhere in terms of eq sc c diel. + c ~ Q=Cv + for each piece of material we need a relationship between and its normal derivative /n on the boundary of that material 12 Model building Step 6: determine complex inductance matrix with a boundary integral equation + consider equivalent contrast currents note: these currents spread out over all cross-sections of conductors and semi-conductors in free space sc c c diel. integral equation for ez ~ yielding L but current distribution must be accounted for from DC to high skin-effect ! 13 Model building Suppose that we can replace current distribution in cross-section by equivalent one on the boundary and valid from DC to skin effect sc c c diel. sc c diel. c admittance operator 14 Model building ~ determination of C = C + G/j + eq: equivalent charges residing in free (half)-space + to be determined by solving an semi-cond. v1 integral equation for eq + we need a relation between and /n on each boundary c cond. cond. c qc ~ determination of L = L + R/j + jc,z: equivalent currents residing in free (half)-space + to be determined by solving an integral equation for jc,z + we need a relation between jc,z and ez on each boundary c v2 diel. semi-cond. i1 cond. cond. diel. i2 c jc,z 15 Model building Admittance operator Y B in S: (f = or f = ez) determine relationship between f and f/n on c c S r r’ n A Y(A,B): how f at A contributes to f/n at B does this not generate more difficulties than it solves??? can be solved analyticallly for rectangles and triangles (also circles) and these shapes can be combined to more general ones! 16 Model building broadband results (time-domain) + admittance operator works fine from DC to beyond 100GHz many regions and small details + all of them replaced by equivalent quantities on boundaries placed in homogeneous space + integral equations are highly accurate in modelling these details some semi-conducting good conductors (e.g. copper) and exact current crowding and skin effect + admittance operator works fine even in copper + only the boundary is needed (no internal currents – no problem with exponentially decaying internal fields near boundary at high frequencies) 17 Admittance operator 45 B 26 5 m copper A 50 1 20 m 20 B A 79.1 MHz - skin depth = 7.43m 10 GHz - skin depth = 0.66m 18 Examples Metal Insulator Semiconductor (MIS) line good dielectric good conductor 19 Examples Coated submicron conductor 3117 nm 500 nm 238 nm 450 nm 500 nm 450 nm copper: 1.7 cm chromium: 12.9 cm coating thickness : 10 nm 20 Examples L R inductance and resistance p.u.l as a function of frequency 21 Examples 4 differential pairs on chip interconnect + all dimensions in m + sig = 40MS/m + sub = 2S/m + dop = 0.03MS/m 22 Examples eight quasi-TM modes quasi-even the modal voltages V = V0exp(-j) are displayed (V0 = bb ) @ 10GHz quasi-odd slow wave factor: mode prop. velocity v = c/SWF 23 Examples complex capacitance matrix @10GHz 24 Examples complex inductance matrix @10GHz 25 Examples Pair of coupled inverted embedded on-chip lines 26 Examples Discretisation 27 Examples L and R results 28 Examples C and G results 29 Examples Cross-section of a new high-speed connector (courtesy of FCI) dielectric 1 mm copper 1 2 dielectric 2 mm 30 Examples L and R results L (nH/m) L11 & L22 L12 = L21 frequency R (Ohm/m) R11 & R22 R12 = R21 frequency 31 Examples C and G results C (pF/m) C11 C22 C12 = C21 frequency G (S/m or Mho/m) G22 G11 G12G=12G21 frequency 32 Examples Fibre weave (in progress) differential stripline pair cross-section 33 Examples x 10 8 -4 Fibre weave (in progress) - discretisation 6 mm/10 4 2 0 -2 -4 0 0.5 mm 1 1.5 x 10 -3 34 Ongoing research Starting point: fast and accurate determination of RLGC-data sensitivity and tolerance analysis of multiconductor lines with respect to geometrical and material data full stochastic analysis (probability density functions) time-domain modelling with non-linear (stochastic) loads combination with macromodelling for RLGC-data to tackle the problem of many stochastic variables 35 Challenges to account for surface roughness (several empirical formulas do exist) to go beyond quasi-TM approximations a full-wave approach is needed voltages and currents become difficult to define many models in literature of past decades: current/power – voltage/power – current/reciprocity voltage/reciprocity – causal - ...... computationally very demanding to drop “divide and conquer”? or find a smart way out? 36 Acknowledgement Thanks to all PhD students and colleagues of the EM group I have been working with on these topics over very many years: Niels Faché (now with Agilent Technologies) Jan Van Hese (now with Agilent Technologies) F. Olyslager (full-time professor at INTEC, UGent – deceased) Thomas Demeester (post-doc at INTEC, UGent) Luc Knockaert (part-time professor at INTEC, UGent) Tom Dhaene (full-time professor at INTEC, UGent) Dries Vande Ginste (full-time professor at INTEC, UGent) 37 Questions and Discussion? 38