Amphenol Invotec

Amphenol
THE PCB MANUFACTURER
DELIVERING TOMORROW’S
TECHNOLOGY TODAY
www.amphenol-invotec.com
Amphenol Invotec Ltd
Our Business Strategy
Operating from facilities in the UK, we are
one of Europe’s leading manufacturers of
time critical, advanced technology and high
reliability printed circuit boards.
• Customer satisfaction - central to everything we do
• Business & Manufacturing Excellence underpinned by
Lean Manufacturing & Continuous Improvement
• HDI, Flex & Flex-Rigid, advanced substrates and materials
• Thermal management solutions
• Significant QTA Capability
• High mix – Mid Volume
• NPI support
• DFM best practice and applications support
• Engagement in customer/supplier development programs
The company manufactures a wide range
of multilayer, HDI, sequential lamination,
flex and flex-rigid PCBs using a variety
of advanced materials, finishes and
technologies to meet exacting customer
specifications.
Our Markets
Sales %
We have a diverse European customer base encompassing key growth. Regardless of application, our customers
rely on Invotec to provide a total solution to their business needs. Key markets include:
30%
18%
14%
9%
7%
Military
Civil Aviation
Industrial
Space
Oil & Gas
5%
5%
3%
3%
2%
Automotive
Communication
Security/Encryption
Power/Energy
Rail/Transportation
Services
Research and Technological Development
Design for Manufacture
We work in partnership and share knowledge with
customers at the earliest opportunity.
Our DFM team proactively assesses customer
designs to ensure optimum performance and value.
We add value through our expertise, experience, flair
and ingenuity, enabling customers to convert their
visions into viable products.
Through this methodology, we deliver robust design
solutions leading to enhanced quality and an
accelerated time to market
New Product Introduction
Quick Turnaround (QTA)
Our strength is rooted in flexibility.
While we have the manufacturing capabilities and
scale to ensure the rapid delivery of high volume
orders, we also work as a development partner with
many customers.
We offer a broad range of technologies on
accelerated lead-times:
We produce prototypes and pilot batches, which are
proven for manufacturability prior to batch launch.
- IMS – 24 hrs
- PTH – 2 days
- Multi-Layer (Including HDI) – 3 days
- Sequential lamination – 5 days
- Flex-Rigid – 5 days
Knowing Our Customers
Local Account Managers backed by
our Customer Service team work with
you to provide a customised service
program.
The Value of Knowledge
Our technical resource on site and in
field applications provides you with
answers you want when and wherever
you need them.
Relationship Management
Successful commercial
relationships are built on being
open, honest and fair.
www.amphenol-invotec.com
3
Technology
Product Profile
For advice on any of these topics please contact us and we will be happy
to provide you with the necessary support to all your questions.
Sales Mix
10% RF
15% Thermal Management
16% Flex & Flex Rigid
31% HDI
38% Rigid M/L
49% Sequential Lamination
Capability
Inner layer
Tracks
Outer layer
Current
Advanced
Road Map
50 micron - 2 mils
50 micron - 2 mils
38 microns - 1.5 mils
38 microns - 1.5 mils
25 microns - 0.8 mils
25 microns - 0.8 mils
75 micron - 3 mils
75 micron - 3 mils
63 micron - 2.2 mils
63 micron - 2.2 mils
50 micron - 2 mils
50 micron - 2 mils
Laser via pads
External Pads
Internal Pads
0.250 mm - 10 mils
300 micron - 12 mils
200 micron - 8 mils
225 micron - 9 mils
150 micron - 6 mils
200 micron - 8 mils
Mechanical via pads
External Pads
Internal Pads
450 micron - 18 mils
500 micron - 20 mils
350 micron - 14 mils
450 micron - 18 mils
350 micron - 12 mils
425 micron - 16 mils
Aspect ratio
10:1
11:1
12:1
Solder resist
Solder mask clearance
40 micron
38 micron
12 micron
210 micron
9 Micron
210 micron
25 micron
25 micron
<25 micron
1+N+1
5+N+5
1+N+1
6+N+6
1+N+1
>6+N+6
24x21
24x18
24x21
24x18
>24x21
>24x18
5.00mm
5.3mm
>5.3mm
40
50
>50
Copper thickness
Min
Max
Min Dielectric thickness
HDI
Min
Max
Max panel size
Standard
Max panel thickness
Min
Max
Max layer count
20 micron
5 Micron
>210 micron
Min mechanical hole
Buried pair mechanical
Min diameter laser via
Buried pair laser
Min
Min
Min
Min
0.250 mm - 10 mils
0.150 mm - 6 mils
0.10 mm - 4 mils
0.070 mm - 2.8 mils
0.200 mm - 8 mils
0.150 mm - 6 mils
0.075 mm - 3 mils
<0.070 mm - 2.8 mils
0.150 - 6 mils
0.150 mm - 6 mils
0.050 mm - 2 mils
<0.070 mm - 2.8 mils
Mechanical depth control
+/-
+/- 25 microns
+/- 15 microns
+/- 10 microns
Control impedance
%
+/- 10%
+/- 7%
+/- 7%
www.amphenol-invotec.com
5
Stepped micro via
Controlled Impedance
Embedded Resistors
ProductsEmbedded devices
CTE- CIC / Carbon / Aramid / Molybdenum
New applications are often developed
Resin filled through vias
in partnership with customers to deliver
Resin filled buried
viasextreme
optimum performance
under
conditions. Resin filled blind vias
Plugged vias
Unrivalled
technical capabilities coupled
Thermal Management: up to 400 Microns of CU
with innovation and close customer/
External
heat sinks: Copper
/ Aluminium
supplier
relationships
ensure
a
Heat
exchangers
comprehensive
and
competitive servicebacked offering.
Metal backed substrates
Product Technology
Blind via
Micro via
Buried via
Copper filled vias
Stacked micro via
Stepped micro via
Controlled Impedance
Products
Embedded Resistors
Embedded devices
Single & double sided Rigid
CTE- CIC / Carbon / Aramid / Molybdenum
Single & Double sided flex
Resin filled through vias
Rigid Multi layer
Resin filled buried vias
Multi layer Flexible
Resin filled blind vias
Multi layer Flexi-rigid
Plugged vias
Mixed composite multilayer
Thermal Management: up to 400 Microns of CU
Mixed composite Flex rigid multilayer
External heat sinks: Copper / Aluminium
IMS (Insulated metal substrates)
Heat exchangers
Bonded External heat sinks
Metal backed substrates
Products
Single & double sided Rigid
Single & Double sided flex
Rigid Multi layer
Multi layer Flexible
Multi layer Flexi-rigid
Mixed composite multilayer
Mixed composite Flex rigid multilayer
IMS (Insulated metal substrates)
Bonded External heat sinks
Quality
Group Approvals
We continue to set ourselves ever more demanding
targets for excellence as we pursue an overall
company objective of zero defects.
• AS9100 Rev C
This commitment is fully embedded throughout the
company; it is our passion to continually satisfy
stringent customer requirements and satisfaction.
In this pursuit we also need to meet the
expectations of all relevant industry and regulatory
standards. Our quality management system
adapts to meet all such changes; regulatory and
contractual requirements are assessed, audited and
incorporated on an ongoing basis.
• ISO 9001
• NADCAP (Electronics) flex-rigid multi-layers
and microvia technologies
• ESA approved according to
ECSS-Q-ST-70-10C in accordance with:
PID SM18T iss. 02 - sequential rigid polyimide
PID SM19T iss. 02 - sequential rigid-flex
polyimide
• SC21 Silver Award
• IECQ / CECC (BS EN / 123000, 100, 200, 300,
400, 500, 600, 700, 800)
• Underwriters Laboratories (UL 796 / UL94 /
Group UL file number E72693(M)
www.amphenol-invotec.com
7
Tamworth
Hedging Lane, Dosthill,
Tamworth,Staffordshire,
England, B77 5HH
T +44 (0) 1827 263000
F +44 (0) 1827 263250
Sales Enquiries:
sales@amphenol-invotec.com
Telford
General Enquiries:
info@amphenol-invotec.com
Halesfield 4, Telford,
Shropshire, England,
TF7 4AP
RFQ:
design@amphenol-invotec.com
T +44 (0) 1827 263000
F +44 (0) 1827 263250
Sales Enquiries:
sales@amphenol-invotec.com
General Enquiries:
info@amphenol-invotec.com
RFQ:
telford.design@amphenol-invotec.com
UK Sales
European Sales
Keyhani Bendix, Esmail - Spain
Matthew Bowman - Sales Director
Monique Berckvens
- Benelux - European Sales Support
T +34 91 6407 302
F +34 91 6407 307
M +34 62 9054 629
E e.bendix@amphenol-roe.eu
M +44 (0)7774 788279
Ematthew.bowman@amphenol-invotec.com
Jeremy Brook
M +44 (0)7710 145672
Ejeremy.brook@amphenol-invotec.com
Terry Dowling
M +44 (0)7909 535247
Eterry.dowling@amphenol-invotec.com
Mark Sykes
M +44 (0) 7534 909762
Emark.sykes@amphenol-invotec.com
M +32 496 28 82 41
E monique.berckvens@@amphenol-invotec.com
Thomas Witt - Germany
T +49 7452 8 444 192
M +49 160 94 90 95 08
F +49 7452 8 444 193
Ethomas.witt@amphenol-invotec.com
Nordic Region - Elmatica
Monika Braun - Germany
M +47 91 84 73 00
Etorger.edland@elmatica.com
T +49 7452 8 444 192
F +49 7452 8 444 193
Emonika.braun@amphenol-invotec.com
Frédéric Dupont - France
T +33 6 07 08 60 68
F +33 1 69 94 05 17
M +33 6 0708 60 68
Efrédéric.dupont@amphenol-invotec.com
Technical Support
Fabio Visaggio - Italy
M +44 (0)7810 317589
Ehoward.swarbrick@amphenol-invotec.com
T +39 02 93254 208
F +39 02 93254 444
M +39 34 08213 852
Ef.visaggio@amphenol-roe.eu
Ram Pall
Giuliano Iguera - Italy
M +44 (0)7770 698201
Eram.pall@amphenol-invotec.com
T +39 02 93254 209
F +39 02 93254 444
M +39 34 99045 682
Eg.iguera@amphenol-roe.eu
Howard Swarbrick
Norway
Torger Edland
Country Manager - Norway
Denmark
Torben Hajslund
Country Manager
M+4532161826
Etorben.hajslund@elmatica.com
Finland
Mika Kupiainen
Country Manager
M+358-44-3204588
Emika@elmatica.com
Sweden
Jan Persson
Country Manager
M +46 705819616
EJanne.persson@elmatica.com