product catalog

20
13
PRODUCT CATALOG
Embedded OEM memory that covers legacy to leading edge
1
Table Of Contents
Table of Contents
Introduction
About Wintec Industries
// 2
Flash Products
Flash Product Naming Guide
// 4
CompactFlash® Cards
// 5
Secure Digital Cards
// 6
CFast Cards
// 7
USB Flash Drives
// 8
Embedded USB
// 9
Solid State Drives
Solid State Drive Naming Guide
// 10
2.5" SATA
// 11
1.8" microSATA
// 13
SATA DOM
// 14
Slim SATA
// 15
PCI-E ExpressCard
// 16
Half Size mini PCI-Express mSATA
// 17
Full Size mini PCI-Express mSATA
// 18
Legacy SSD – ZIF PATA/IDE
// 19
DRAM Modules
Naming Guide: DDR3
// 20
Naming Guide: DDR2, DDR
// 21
DDR3
// 22
DDR2
// 23
DDR
// 24
Modems
Embedded Modems
// 25
USB Modems
// 26
1
1
Introduction
About Wintec Industries
Wintec Industries is built upon a culture of hard work, opportunity
creation, and delivery of our commitments. Proudly recognized as
a globally diverse company, we continually strive to be a leader in
innovative business practices as well as a responsible member of our
global community and our environment.
Wintec’s quality policy is the backbone upon which our products and
services are built. Our 90,000 sq. ft. facility is ISO 9001:2008 certified
and equipped with state of the art manufacturing and testing machinery.
In addition, our products are manufactured with components that have
passed a stringent AVL (Approved Vendor List) and qualification process.
Through our quality policy we are committed to providing outstanding
products and services to our customers. Our quality themes outline the
direction of our daily work and also our long term goals.
Wintec’s Embedded OEM division provides a wide range of standard
and custom hardware designs, mechanical molding, and manufacturing
services to OEM customers. From concept to final product delivery,
we provide outstanding team level support in Sales, Engineering,
Production, Quality Assurance, and Logistics. Through teamwork and
communication, our goal is to achieve the highest level of customer
satisfaction and to build long-term relationships that enable successful
engineering projects and customer design wins.
Wintec Industries is a WMBE (Women Minority Business Enterprise)
and a certified ISO 9001-2000 company located in the heart of the
Silicon Valley. Our core products and services include the design
and manufacturing of Flash products and DRAM modules in a large
assortment of technologies and form factors. Our products are certified
from industry standards committees such as, JEDEC (Joint Electron
Device Engineering Council, CFA (Compact Flash Association), and the
SD Association (Secure Digital). Our experience in product design and
successful fulfillment of customer product needs span over 25 years.
Customers Are the Heart of Our Business
// Customer Satisfaction
// Consistency in the Manufacturing Process
// Continual Improvement in all Business practices
Extended Life
Cycle Products
SUPPORT
Quick Turnaround
Quality
Special Thanks
2
Provide the
highest level of
service to our
customers
Sourcing Diversity
Knowledge and
experience
Thank you to all Wintec customers for your support and partnership through the years. We look forward to
leading the way in this continuously changing and challenging industry and the exciting opportunities ahead.
Thank you again for your partnerships and commitment to building long lasting relationships!
1
Introduction
Leading Provider of Flash and
DRAM Technology Solutions
Our Embedded OEM solutions provide a wide range of standard
and custom hardware designs, mechanical molding, and
manufacturing services to OEM customers. From concept to
final product delivery, we provide outstanding team level support
in Sales, Engineering, Production, Quality Assurance, and
Logistics. Our goal is to achieve the highest level of customer
satisfaction, to build long-term relationships, and to provide
solutions and expertise to our OEM customers.
We make your Project visions Reality
Wintec Industries Embedded OEM division offers customers a
full service design, engineering, and manufacturing resource for
OEM system designs. Wintec account managers, engineers, and
developers work closely with our customers through the early stages
of project discovery and initial requirements though development,
testing and product delivery. Our electronic and electrical design
services offer the flexibility and customization that our customers seek.
Our teams are well experienced with creating customized solutions
with time tested technologies as well as applications that utilize the
latest tech.
Wintec OEM customers find great value in our customized testing
solutions. Customer OEM products are often developed to serve
a highly unique application. We work closely with our customer’s
to recreate their usage environments to ensure the quality of our
embedded products and our customer’s final solution. As a leading
DRAM Memory Module, Flash product, and Solid State Drive
manufacturer, we place substantial emphasis on our testing and
quality control procedures. Wintec Industries employs a standard
policy of 100% individual mainboard testing for all of our products.
Custom Services
We utilize X-ray technologies, heat chambers, and diagnostic
machinery, including AOI and dedicated burn-in chambers, to ensure
that only the highest quality memory products are delivered to our
customers.
Our manufacturing base, located in Milpitas, California, offers
our customers a significant advantage in time to market, plus the
capabilities to provide quick and clear communication and updates.
We specialize in both standard and customized manufacturing options.
Our packaging design capabilities provide customers a start-to-finish
solution from concept to delivery. From initial PCB layout to the final
programming and packaging of products, the services and solutions
that are available from Wintec Industries provides customers with the
widest array of options.
Wintec Industries Embedded OEM division has extensive experience
in creating customized products, labeling, serialization, software
and disk imaging. With full Field Engineering support offered for all
Wintec products and services, our experienced team ensures that our
customers will receive the most complete solution.
Electrical Design | PCB Layout | Software and Firmware | Packaging Design and Graphics | Testing | Logistics
Custom Products
We offer a wide range of SSD form factors
for use in Enterprise, Commercial and
Industrial grade applications.
We specialize in applications with tolerance
requirements for industrial temperatures
and reliability.
We provide services and support for the
latest memory technology and extended
support for legacy modules.
3
Flash Products
Flash Products
pg5 CompactFlash Cards
pg6 Secure Digital Cards
pg7 CFAST
pg8 USB Flash Drives
pg9 Embedded USB
Flash Naming Guide
W7CF032G1DAI-H41PM-4Q2.01
Firmware Revisions
Flash Component
Configuration
001 = 1 NAND Flash, Single Die, 1-CE
01D = 1 NAND Flash, Dual Die, 1-CE
002 = 2 NAND Flash, Single Die 1-CE
02D = 2 NAND Flash, Dual Die, 1-CE
2Q2 = 2 NAND Flash, Quad Die, 2-CE
2P4 = 2 NAND Flash, Dual Stacked, 4-CE
4D2 = 4 NAND Flash, Dual Die, 2-CE 4Q2 = 4 NAND Flash, Quad Die, 2-CE
4P4 = 4 NAND Flash, Dual Stack Package, 4-CE
NAND Flash & Die Revision
x = Die Revision, e.g. M-Die, A-Die
Px = Samsung Mx = Micron
Hx = HynixIx = Intel
Program Mode
0 = PIO Mode
1 = DMA / UDMA Enabled
2 = UDMA disabled, MDMA Enabled
Controller Manufacturer
Hx = Hyperstone Controller
Sx = SMI Controller
Temperature Rating
None = Commercial Temp (0°C to +70°C)
I = I-Temp (-40°C to +85°C)
SD Extended Temp (-25°C to +85°C)
Jx=JMicron
A = Standard
Device ID
X = Removable
T = Fixed Disk
D = Dual ID
(True IDE = fixed, PC Card
Memory Mode = removable)
Configuration
1 = Standard Configuration Density
M = Megabyte 064 = 64
128 = 128
256 = 256
Flash Product Type
CF = Compact Flash Card
SD = Secure Digital Card
US = USB Flash Drive
EU = Embedded USB Flash Drive
MU = Mini USB Flash Drive
CT = CFast Card
NAND Flash Type
2 = MLC NAND Flash
4 = MLC NAND Flash w/Custom Configuration
7 = SLC NAND Flash
8 = SLC NAND Flash w/Custom Configuration
W = Wintec OEM Product
4
H = SDHC
G = Gigabyte
512 = 512
001 = 1
002 = 2
004 = 4
008 = 8
016 = 16
1
Flash Products
CompactFlash® Cards
H2 Series
H4 Series
S2 Series
S4 Series
// Density up to 8GB
// 32-bit RISC/DSP Controller
// Solid State Data Storage
// Dual 3.3V / 5V Interface
// Industrial Wear Leveling
// On-Board ECC - Corrects up
to 6-bytes/Sector
// Density up to 16GB
// 32-bit RISC/DSP controller
// Large internal SRAM provides
firmware flexibility
// Dual voltage support (3.3V/5V)
// Internal voltage detector
// 20 Kbyte internal Boot ROM
and 32 Kbyte internal SRAM
// On-Board ECC corrects up to 4
random bytes per 512 bytes
// Density up to 128GB
// RISC/DSP Controller with
built-in buffer support
// Solid State Data Storage
// Dual voltage support (3.3V/5V)
// Power-down and idle mode
// Built-in hardware ECC circuit
(BCH), support 13/24 bit ECC
errors per 1024 bytes
// Density up to 128GB
// RISC/DSP Controller with
built-in buffer support
// Solid State Data Storage
// Dual voltage support (3.3V/5V)
// Power-down and idle mode
// Built-in hardware ECC circuit
(BCH), support 15
Series
H2
H4
S2
S4
CF Type
CFA 2.1
CFA 4.1
NAND
Type
SLC
SLC
Seq. Read/Write
8MBps / 6MBps
42MBps / 20MBps
ECC
Temp Range
Density
Status
0 - 70°C
64MB - 8GB
MP
-40 - 85°C
64MB - 8GB
MP
0 - 70°C
128MB - 16GB
MP
-40 - 85°C
128MB - 16GB
MP
6 bit Reed Solomon
4 Bit Reed Solomon
w/ CRC
SLC
60MBps / 40MBps
13/24 Bit BCH
0 - 70°C
1GB - 32GB
MP
MLC
50MBps / 20MBps
13/24 Bit BCH
0 - 70°C
4GB - 128GB
MP
SLC
90MBps / 50MBps
8/15 Bit BCH
0 - 70°C
1GB - 32GB
MP
MLC
80MBps /35MBps
8/15 Bit BCH
0 - 70°C
4GB - 128GB
MP
CFA 4.1
CFA 4.1
5
Flash Products
Secure Digital Cards
S3 Series
H6 Series
// Density up to 64GB
// 32-bit RISC/DSP Controller
// Solid State Data Storage
// 3.3V flash Interface
// Industry Standard Compatibility
// 10,000 Program/Erase Cycles
// Hardware BCH Engine to
configure ECC
// Density up to 8GB
// 32-bit RISC/DSP Controller
// Solid State Data Storage
// Dual 3.3V / 1.8V Interface
// Industry Standard Compatibility
// > 2,000,000 Program/Erase
// On-chip ECC and CRC16 unit
for flash data protection Cycles
Series
Type
NAND
Type
Seq. Read/Write
ECC
Temp Range
Density
Status
S3
SD 2.0
MLC
20MBps / 10MBps
40 Bit BCH
0 - 70°C
4GB - 64GB
MP
4 Bit Reed Solomon
w/ CRC
0 - 70°C
64MB - 8GB
MP
4 Bit Reed Solomon
w/ ECC
-25 - 85°C
64MB - 8GB
MP
H6
6
SD 2.0
SLC
20MBps / 18MBps
1
Flash Products
CFast Cards
JM-605 Series
A2 Series
// Density up to 128GB
// SLC/MLC NAND Flash
// SATA-II 3.0Gb/s operation
(Backward compatible to SATA-I 1.5Gb/s operation)
// > 100,000 Program/Erase Cycles
// On-Board ECC capable of correcting 16 or
24 bit errors per 1024 bytes
// S.M.A.R.T and TRIM Support
// Density up to 128GB
// 32-bit RISC micro processor
// SLC/MLC NAND Flash
// SATA-II 3.0Gb/s operation
(Backward compatible to SATA-I 1.5Gb/s operation)
// ECC capable of correcting up to 24 bits in 1KB double sector
// PFail handling and S.M.A.R.T support
// Partial/Slumber and PHYSLP power modes support
Series
JM-605
SATA
Type
NAND
Type
Seq. Read/Write
ECC
Temp Range
Density
Status
MLC
160MBps / 85MBps
16 / 24 Bit BCH
0 - 70°C
8GB-128GB
MP
160MBps / 110MBps
16 / 24 Bit BCH
0 - 70°C
8GB-32GB
MP
160MBps / 110MBps
16 / 24 Bit BCH
-40 - 85°C
8GB-32GB
MP
150MBps / 130MBps
8 / 24 Bit BCH w/
CRC
0 - 70°C
4GB-32GB
MP
150MBps / 130MBps
8 / 24 Bit BCH w/
CRC
-40 - 85°C
4GB-32GB
MP
SATA-II
SLC
A2
SATA-II
SLC
7
1
Flash Products
USB Flash Drives
W2MU-E5 Series
W7MU-E5 Series
// Density up to 32GB
// Fully Compatible with USB
v2.0 & v1.1
// True Plug and Play Functionality
// Built in LED to indicate power
and transfer status
// Small form factor
// Density up to 16GB
// Fully Compatible with USB
v2.0 & v1.1
// True Plug and Play Functionality
// Built in LED to indicate power
and transfer status
// Small form factor
Series
USB Type
NAND
Type
Seq. Read/Write
ECC
Temp Range
Density
Status
W2MU-E5
USB 2.0
MLC
18MBps / 8MBps
24/48 Bit BCH
0 - 70°C
512MB - 32GB
MP
W7MU-E5
USB 2.0
SLC
20MBps / 12MBps
24/48 Bit BCH
0 - 70°C /
-40 - 85°C
512MB - 16GB
MP
8
1
Flash Products
Embedded USB
W7EU-E5
W2EU-E5
// Density up to 16GB
// Embedded USB 2.0 Device
// SLC NAND type flash
// 5V & 3.3V operational voltage
// Various connector options
// RoHS Compliant
// Density up to 32GB
// Embedded USB 2.0 Device
// MLC NAND type flash
// 5V & 3.3V operational voltage
// Various connector options
// RoHS Compliant
Series
USB
Type
NAND
Type
Channels
Seq. Read/Write
ECC
W7EU-E5
USB 2.0
SLC
Single
20MBps / 18MBps
24/48 Bit BCH
Temp Range
Density
Status
512MB - 16GB
MP
4GB - 32GB
MP
0 - 70°C
-40 - 85°C
W2EU-E5
USB 2.0
MLC
Single
18MBps / 10MBps
24/48 Bit BCH
0 - 70°C
9
1
Solid State Drives
Solid
Flash States
Products
Drives
pg11 2.5" SATA SSD pg13 1.8" micro SATA SSD pg14 SATA DOM pg15 Slim SATA pg16 PCI-E ExpressCard pg17 Half Size mSATA
pg5 CompactFlash
Cards
pg7 USBpg21
FlashZIF
Drives
pg8 Embedded USB Flash pg9 CFast
pg18
Full Size mSATA
pg19pg6
2.5"Secure
PATA Digital
pg20Cards
DOM ATA/IDE
PATA/IDE
Solid
Flash State
Naming
Drive
Guide
Naming Guide
W7S
CS
F 10 23 02 G 1 T
DAAI I--DH1411M
PA
M2- -4BQD22. 0. A1 2
Firmware Revision
Firmware Revisions
Flash
Flash Component
Component
Configuration
Configuration
NAND Flash & Die Revision
Geometry
Program Mode
NAND Flash & Die Revision
Controller Manufacturer
Program Mode
Temperature Rating
Controller Manufacturer
A = Form-Factor
Device ID
Temperature Rating
Form Factor
Configuration
T = Fixed Disk
Density
1 = Standard Configuration
Density
Flash Product Type
SSD Type
NAND Flash Type
NAND Flash Type
W = Wintec OEM Product
W = Wintec OEM Product
10
4D2
Flash, Dual Die 2-CE
001 = 14 NAND Flash
4Q2
Die,1-CE
2-CE
01D = 4
1 NAND Flash, Quad
Dual Die,
08D
Dual Die
002 = 28 NAND Flash, Single
Die1-CE
1-CE
8Q2
Die,1-CE
2-CE
02D = 8
2 NAND Flash, Quad
Dual Die,
AS2
NANDFlash,
Flash,Quad
SingleDie,
Die,2-CE
2-CE 2Q2 == 12
2 NAND
AQ4
NANDFlash,
Flash,Dual
Quad
Die 4-CE
2P4 == 212NAND
Stacked,
4-CE
BD2
16NAND
NANDFlash,
Flash,Dual
DualDie,
Die,2-CE
2-CE
4D2 = 4
BQ4
16NAND
NANDFlash,
Flash,Quad
QuadDie,
Die,2-CE
4-CE
4Q2 = 4
BO4
NANDFlash,
Flash,Dual
Octal
Die, Package,
4-CE
4P4 == 416NAND
Stack
4-CE
CD2 = 20 NAND Flash, Quad Die, 4-CE
x = Die Revision, e.g. M-Die, A-Die
(blank)
= 4x nm Mx
and higher
Px = Samsung
= Micron
3Hx= =3xHynixIx
nm
= Intel
2 = 2x nm
0 = PIO Mode
x1 == Die
Revision,
M-Die, A-Die
DMA
/ UDMAe.g.
Enabled
Px
Samsung
Mx
= Micron
2 ==UDMA
disabled,
MDMA
Enabled
Hx = HynixIx = Intel
Hx = Hyperstone Controller
Sx = SMI Controller
1 = SATA
2None
= PATA
(DMA / UDMA
Enabled)
= Commercial
Temp
(0°C to +70°C)
I = I-Temp (-40°C to +85°C)
SD Extended Temp (-25°C to +85°C)
Dx = SandForce Ex = EastWho
Jx = JMicron Sx = SMI X = Removable
IT==I-Temp
(-40°C – +85°C)
Fixed Disk
None
= Commercial
Temp (0°C – 70°C)
D = Dual
ID
(True IDE = fixed, PC Card
Memory Mode = removable)
A = 2.5" Half Size
B = 2.5" Full Size
C = 1.8"
1 = Standard Configuration H = SDHC
M = Megabyte G = Gigabyte
064 = 64
512 = 512
004 = 4
G
= Gigabyte
128
= 128001 = 1
008 = 8
001
016 == 2
16 064 = 64
256 = 1256002
016 = 16160 = 160
002 = 2 025 = 25 100 = 100
200 = 200
004
4 032 Flash
= 32 Card
120 = 120
240 = 240
CF ==Compact
008
8 050
= 50Card
128 = 128
480 = 480
SD == Secure
Digital
US = USB Flash Drive
EU = Embedded USB Flash Drive
ES
(DOM,Drive
Slim SATA)
MU==Embedded
Mini USB Flash
EM
mSATACard
CT = CFast
EX = ExpressCard
SS
SolidNAND
StateFlash
Drives (1.8", 2.5")
2 = =MLC
ZF
ZIF PATA
4 ==MLC
NAND Flash w/Custom Configuration
7 = SLC NAND Flash
28 = MLC
NAND Flash
Flash w/Custom Configuration
SLC NAND
3 = eMLC NAND Flash
4 = MLC NAND Flash w/Custom Configuration
7 =SLC NAND Flash
8 = SLC NAND Flash w/Custom Configuration
1
Solid State Drives
2.5" SATA SSD
EWS-800
JM-612
SF-1222
SF-2281
// Density up to 512GB
// 40G, 80G, 160G, 320G,
400G available
// EastWho EWS-800 controller
with external DRAM buffer
// Up to 40 bits correctable per
1KB sector
// Hardware AES engine with
ECB/ XTS encryption mode
// Density up to 512GB
// JMicron 612 controller with
external SDRAM buffer
// Data Integrity under
power cycling
// BCH ECC correction supports 16/24 bit ECC
// Density up to 512GB
// SandForce SF-1200 controller
with internal cache buffer
// Intelligent Block Management
& Wear Leveling
// Up to 24 bytes correctable per
512B sector
// Density up to 512GB
// SandForce SF-2281 controller
with internal cache buffer
// Intelligent Block Management
& Wear Leveling
// Up to 55 bits correctable
per 512B sector
SF-2582
JM662
// Density up to 400GB
// SandForce Enterprise SF-2582
controller with internal cache
// DuraWriteTM technology
// RAISETM Data Protection
// Density up to 512GB
// JMicron 662 controller with
external DDR2 buffer
// Supports global wear-leveling
// Dynamic power management
// S.M.A.R.T Attribute Support
// BCH8/16/24/40 bits ECC
// Up to 55 b/512 byte sector
BCH ECC engine
// Enterprise SSD
// Tatalum PFAIL protection
11
Solid State Drives
2.5" SATA SSD
Series
SATA
Type
NAND Type
Seq. Read/Write
Random
Read/Write
Temp Range
Density
Status
EWS-800
SATA-II
MLC/SLC
200MBps / 150MBps
5K IOPS/1.5K IOPS
0 - 70°C / -40 - 85°C
32GB - 512GB
MP
JM-612
SATA-II
MLC
230MBps / 200MBps
10K IOPS/1K IOPS
0 - 70°C / -40 - 85°C
16GB - 512GB
MP
SF-1222
SATA-II
MLC/SLC
285MBps / 275MBps
30K IOPS/10K IOPS
0 - 70°C / -40 - 85°C
32GB - 128GB
(SLC)/512GB (MLC)
MP
SF-2281
SATA-III
MLC/SLC
(Async/Sync*)
550MBps / 500MBps
60K IOPS/20K IOPS
0 - 70°C
32GB - 512GB
MP
SF-2582
SATA-III
SLC/eMLC
550MBps / 500MBps
60K IOPS/60K IOPS
0 - 70°C / -40 - 85°C
50GB - 400GB
MP
JM662
SATA-III
MLC
500MBps / 300MBps
50K IOPS/20K IOPS
0 - 70°C
32GB - 512GB
MP
*Sync MLC drives perform better under uncompressed data loads
12
Solid State Drives
1.8" microSATA SSD
JM-612
// Density up to 256GB
// JMicron 612 controller with external
SDRAM buffer
// Data Integrity under power cycling
// BCH ECC correction supports
16/24 bit ECC
// Enhanced endurance by dynamic/static
wear leveling
Series
SATA
Type
NAND
Type
Seq. Read/Write
Random Read/Write
Temp Range
Density
Status
JM-612
SATA-II
SLC/MLC
230MBps / 160MBps
10K IOPS/1K IOPS
0 - 70°C / -40 - 85°C
32GB - 256GB
MP
13
Solid State Drives
SATA DOM
JM-605
// Density up to 64GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// Up to 24 bits correctable per 1KB sector
// Data Integrity under power-cycling
Series
SATA
Type
Channel
NAND Type
Seq. Read/Write
Temp
Range
Density
Status
MLC
60MBps / 20MBps
0 - 70°C
4GB-64GB
MP
SLC
80MBps / 50MBps
0 - 70°C / -40 - 85°C
1GB-16GB
MP
MLC
140MBps / 60MBps
0 - 70°C
8GB-128GB
MP
SLC
TBD
0 - 70°C / -40 - 85°C
1GB-32GB
MP
4 Channel /
2 Flash
JM-605
SATA-II
4 Channel /
4 Flash
14
Solid State Drives
Slim SATA
JM-605
JM-667
// Density up to 128GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// Up to 24 bits correctable per 1KB sector
// Data Integrity under power-cycling
// Density up to 256 GB
// JMicron 667 controller with
external DDR3 buffer
// Dynamic power management
// Data integrity under power-cycling
// BCH8/16/24/40 bits ECC
// S.M.A.R.T Attribute Support
Series
JM-605
JM-667
SATA
Type
NAND
Type
Seq. Read/Write
Random
Read/Write
Temp
Range
Density
Status
MLC
140MBps / 60MBps
8.5K IOPS / 600 IOPS
0 - 70°C
8GB-128GB
MP
0 - 70°C
8GB-32GB
MP
SLC
160MBps / 100MBps
8.5K IOPS / 1.5K IOPS
-40 - 85°C
8GB-32GB
MP
0 - 70°C
32GB-256GB
ES Mid Q1 2013
SATA-II
SATA-III
MLC
500MBps / 300MBps
50K IOPS / 20K IOPS
15
Solid State Drives
PCI-E ExpressCard SSD
JM-612
// Up to 128GB
// Intelligent Wear Leveling - Includes Dynamic/Static
Block Management
// Spares & Bad Block Management
// On-Board ECC – Corrects up to 24 bits/ 1KB sector
// High Environmental Tolerance
// SMART (Self-Monitoring, Analysis, Reporting Technology)
Series
SATA Type
NAND Type
Seq. Read/Write
Temp Range
Density
Status
JM-612
SATA-II
MLC
165MBps / 120MBps
0 - 70°C
64GB - 128GB
MP
16
Solid State Drives
Half Size mini PCI-Express mSATA SSD
JM-605
SM611/SM631
// Density up to 64GB
// JMicron 605 controller
// Bad Block Management & Wear Leveling
// ECC Engine: Up to 24 bits correctable per
1KB sector
// Data Integrity under power-cycling
// S.M.A.R.T. attribute support
// Density up to 64GB
// Advanced Wear leveling & Block Management
// SMART feature and data security support
// SSDLifeGuardTM and SSDLifeSaverTM for
SSD life monitoring and extension
// 15-bit/512B data error checking and
correcting capability
Series
JM-605
SM611/SM631
SATA Type
SATA-II
NAND Type
Seq. Read/Write
Temp Range
Density
Status
MLC
70MBps / 20MBps
0 - 70°C
4GB-64GB
MP
SLC
80MBps / 50MBps
0 - 70°C
4GB-64GB
MP
SLC
80MBps / 50MBps
-40 - 85°C
1GB-16GB
MP
MLC
50MBps / 20MBps
0 - 70°C
4GB-64GB
MP
SLC
60MBps / 35MBps
0 - 70°C
4GB-64GB
MP
SATA-II
17
Solid State Drives
Full Size mini PCI-Express mSATA SSD
SF-2281
JM-667
SF-2141/2181
// Density up to 256GB
// SandForce SF-2141/2181/2281
controller with internal cache buffer
// Intelligent Block Management &
Wear Leveling
// Intelligent Data Retention optimization
// Up to 55 bits correctable per 512B sector
// Density up to 256GB
// JMicron 667 controller with external
DDR3 cache
// Global wear leveling
// Dynamic power management
// BCH8/16/24/40 bits ECC
// S.M.A.R.T Attribute Support
// Density up to 128GB
// SandForce SF-2141/2181/2281 controller
with internal cache buffer
// Intelligent Block Management
& Wear Leveling
// Intelligent Data Retention optimization
// Up to 55 bits correctable per 512B sector
JM-605
EWS800
// Density up to 128GB
// JMicron 605 controller
// Bad Block Management &
Wear Leveling
// ECC Engine: Up to 24 bits
correctable per 1KB sector
// Data Integrity under
power-cycling
// Density up to 128GB
// EWS800 Controller with
SDRAM cache
// Up to 40bits correctable per
1KB sector
// Hardware AES engine with
ECB/XTS encryption
// TRIM and S.M.A.R.T.
attribute support
Series
SATA Type
NAND Type
Seq. Read/Write
Temp Range
Density
Status
SF-2281
SATA-III
MLC
550MBps / 505MBps
0 - 70°C
32GB-256GB
MP
JM-667
SATA-III
MLC
500MBps / 300MBps
0 - 70°C
32GB-256GB
MP
SF-2141 / 2181
SATA-II
MLC
270MBps / 250MBps
0 - 70°C
32GB-128GB
MP
MLC
140MBps / 60MBps
0 - 70°C
8GB-128GB
MP
SLC
160MBps / 80MBps
0 - 70°C
2GB-32GB
MP
SLC
160MBps / 80MBps
-40 - 85°C
2GB-32GB
MP
MLC/SLC
180MBps / 90MBps
0 - 70°C /
-40 - 85°C
4GB-128GB
MP
JM-605
EWS800
18
SATA-II
SATA-II
Solid State Drives
Legacy SSD – ZIF PATA/IDE
EWS720
// Density up to 256GB
// 8MB Cache buffer
// 32 bit high speed controller
// ZIF IDE/ATA 40-pin interface
// Internal Static and Dynamic Wear Leveling
// BCH ECC: 18 bit per 512 Byte
Series
NAND Type
Seq. Read/Write
Random Read/Write
Temp Range
Density
Status
MLC
125MBps / 90MBps
4800 IOPS / 300 IOPS
0 - 70°C
16GB - 256GB
MP
SLC
125MBps / 110MBps
4800 IOPS / 300 IOPS
0 - 70°C
4GB - 32GB
MP
EWS720
19
1
DRAM
DRAM
pg24 DDR3
pg25 DDR2
pg26 DDR
DDR3 Naming Guide
WL 3 R EV 9 1 G 1 3 I S E
Die Revision
M = M-DieC = C-Die
A = A-Die
D = D-Die
B = B-Die
DRAM Manufacturer
S = SamsungH = Hynix
M = Micron
E = Elpida
Module Latency
I = CL6N = CL11
J = CL7
P = CL13
L = CL9
Note: Latency will be specified only on non-register (No Buffer) DIMMs
I = Inphi
D = IDTM = Montage
Note: For Registered DIMM this will be used for register identification
Module Speed
80 = 800Mbs @ CL6 16 = 1600Mbs @ CL11
10 = 1066Mbs @CL718 = 1866Mbs @ CL13
13 = 1333Mbs @ CL9
Note: For Registered DIMM latency will not be specified using
additional letter.
Module Density
(0)1G =1GB
(0)8G = 8GB
(0)2G = 2GB
(1)6G = 16GB
(0)4G = 4GB
3(2)G = 32GB
Note: For VLP DIMM (0) (1) (2) will be ignored.
Module Type
UE(V)8 = 240-Unbuffered ECC, X8, 18-Chips, 2-Rank
UE(V)9 = 240-Unbuffered ECC, X8, 9-Chips, 1-Rank
UN(V)8 = 240-Unbuffered Non-ECC, X8, 8-Chips, 1-Rank
UN(V)6 = 240-Unbuffered Non-ECC, X8, 16-Chips, 2-Rank
RE(V)8 = 240-Registered ECC, X8, 18-Chips, 2-Rank
RE(V)9 = 240-Registered ECC, X8, 9-Chips, 1-Rank
RE(V)6 = 240-Registered ECC, X8, 36-Chips, 4-Rank
RE(V)4 = 240-Registered ECC, X4, 18-Chips, 1-Rank
RE(V)3 = 240-Registered ECC, X4, 36-Chips, 2-Rank
SE(V)8 = 204-SO-DIMM ECC, X8, 18-Chips, 2-Rank
SE(V)9 = 204-SO-DIMM ECC, X8, 9-Chips, 1-Rank
SE(V)8 = 204-SO-DIMM Non-ECC, X8, 8-Chips, 1-Rank
SE(V)6 = 204-SO-DIMM Non-ECC, X8, 16-Chips, 2-Rank
Note: For Standard DIMM (V) will be ignored. Mini RDIMM will use (NE),
Mini UDIMM (OE), LRDIMM (DE), SO-RDIMM (AE).
Device Type
(I)D3 = 1.5V DDR3 SDRAM
(I)L3 = 1.35V DDR3 SDRAM
Note: For I-Temp DRAM use (ID) or (IL)
W = Wintec OEM Product
20
1
DRAM
DDR2, DDR Naming Guide
W D 3 R E 0 8 GX 4 1 8 V - 1 3 3 3 L - P E I
Buffer/Register Set
(Registered Modules Only)
I = Inphi
L = Intel
D = IDT
DRAM Manufacturer
and Die Revision
P = Samsung
C = Hynix
E = Elpidia
CAS Latency
A = CL 2 B = CL 2.5
C = CL 3
G = CL 5I = CL 6
J = CL 7 K = CL 8 L = CL 9N = CL 11
E = CL4
Module Speed (MHz)
1600 (DDR3)
800 (DDR3/DDR2) 400 (DDR2/DDR)
133 (SDR)
Module Height
U = Ultra Low Profile
V = Very Low Profile
None = Standard height PCB
Memory Footprints
02 = 2-Chip
05 =5-Chip (ECC)
09 = 9-Chip (ECC) 18 = 18-Chip (ECC)
36 = 36-Chip (ECC)
Chip Configuration
X4 = x4 Mono DieH8 = x8 Stack Die
X8 = x8 Mono Die
Q4 = x4 Quad Die x4
X16 = x16 Mono Die Q8 = x8 Quad Die x8
D4 = x4 Dual/Twin Die D8 = x8 Dual/Twin Die
Module Density
G = Gigabyte
M = Megabyte
064 = 64
512 = 512
004 = 4
H = Micron
A = A-Die
J = Nanya
B = B-Die
I = ISSI
1333 (DDR3)
667 (DDR2)
333 (DDR)
100 (SDR)
128 = 128
001 = 1
008 = 8
C = C-Die
D = D-Die
1066 (DDR3)
533 (DDR2) 266 (DDR)
04 = 4-Chip
08 = 8-Chip
16 = 16-Chip 32 = 32-Chip
72 = 72-Chip (ECC)
256 = 256
002 = 2
016 = 16
Module Type
RE = Registered ECCModule
LE = Low Power Registered ECC (DDR3L)
UE = Unbuffered ECC
UN = Unbuffered Non-ECC
AE = Registered ECC SODIMM
SE = Unbuffered ECC SODIMM
SN = Unbuffered Non-ECC SODIMM
OE = Unbuffered ECC MiniDIMM
NE = MiniDIMM Registerd-ECC
PE=Unbuffered ECC SODIMM w/PLL
Technology Type
D3 = DDR3
D1 = DDR
D2 = DDR2SD = SDR
W = Wintec OEM Product
21
DRAM
DDR3
240 DIMM
244 mini-DIMM
204 SO-DIMM
240 LR-DIMM
// Density up to 16GB
// Unbuffered, Unbuffered ECC,
Registered ECC
// Standard Profile (1.181") and
VLP (0.74")
// Density up to 8GB
// Unbuffered ECC and
Registered ECC
// Standard Profile (1.181") and
VLP (0.74")
// Density up to 8GB
// Unbuffered, Unbuffered ECC,
Registered ECC
// Standard Profile (1.181")
// Density up to 32GB
// Registered ECC
// Standard Profile (1.181")
Registered ECC
High end server type applications
Unbuffered ECC
Non-mission critical servers,
networking Hubs/Routers and
embedded
Unbuffered Non-ECC
Consumer applications such as
PC, Gaming machines and POS
Registered ECC
Networking systems, routers, hubs
Unbuffered ECC
Less data intensive applications
like compact network equipment
systems
Registered ECC
Systems requiring large amounts
of data traffic
Unbuffered ECC
PC104 Boards and mini ITX
boards
Unbuffered Non-ECC
Consumer applications such as
Notebook/Laptop
Registered ECC
Datacenters in need for greater
scalability in both capacity and
bandwidth
Technology
Pins
Unbuffered
Unbuffered
ECC
Registered
ECC
PC3-6400
800 MT/s
PC3-8500
1066 MT/s
PC3-10600
1333 MT/s
PC3-12800
1600 MT/s
PC3-14900
1866 MT/s
1.5V
1GB - 8GB
1.5V
1GB - 8GB
1.5V
1GB - 16GB
MP
MP
MP
MP
CS
(Unbuffered)
1.35V
1GB - 8GB
1.35V
1GB - 16GB
MP
MP
MP
MP
1.5V
1GB - 8GB
1.5V
1GB - 8GB
MP
MP
MP
MP
1.35V
1GB - 8GB
1.35V
1GB - 8GB
MP
MP
MP
MP
Standard
1.5V
1GB - 8GB
1.5V
1GB - 8GB
MP
MP
MP
MP
VLP
1.5V
1GB - 4GB
1.5V
1GB - 4GB
MP
MP
MP
MP
1.5V
1GB - 8GB
1.5V
1GB - 8GB
MP
MP
MP
MP
1.5V
8GB - 32GB
MP
MP
MP
1.35V
8GB - 32GB
MP
MP
MP
Profile
Standard
240
DIMM
VLP
DDR3
244
mini-DIMM
204
SO-DIMM
240
LR-DIMM
KEY
22
ES
Standard
1.5V
1GB - 8GB
Standard
Engineering Sample
CS
Customer Sample
MP
Mass Production
EOL
End of Life
DRAM
DDR2
240 DIMM
200 SO-DIMM
244 mini-DIMM
// Density up to 8GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181") and VLP (0.74")
// Density up to 4GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
// Density up to 4GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181") and VLP (0.74")
Registered ECC
Data storage and servers with 24/7 data
intensive operations
Registered ECC
Telecommunications and similar applications that
handle large amounts of data
Unbuffered ECC
Embedded applications such as non-critical or
low traffic networking equipment
Unbuffered Non-ECC
Consumer applications such as
Notebooks / Laptops
Registered ECC
Applications that do not require address parity
Unbuffered ECC
Applications that do not require address parity
Unbuffered ECC
Non-mission critical servers, networking hubs/
routers and embedded applications that handle
less data traffic
Unbuffered Non-ECC)
Consumer applications such as PC, Kiosk and
POS terminals
Technology
Pins
Profile
Unbuffered
Unbuffered
ECC
Registered
ECC
PC2-3200
400 MT/s
PC2-4200
533 MT/s
PC2-5300
667 MT/s
PC2-6400
800 MT/s
Standard
1.8V
1GB - 4GB
1.8V
1GB - 4GB
1.8V
1GB - 8GB
MP
MP
MP
MP
1.8V
1GB - 4GB
MP
MP
MP
MP
240
DIMM
VLP
DDR2
200
SO-DIMM
Standard
1.8V
1GB - 4GB
1.8V
1GB - 4GB
1.8V
1GB - 2GB
MP
MP
MP
MP
Standard
1.8V
1GB - 4GB
1.8V
1GB - 2GB
1.8V
1GB - 4GB
MP
MP
MP
MP
1.8V
1GB - 2GB
1.8V
1GB - 2GB
MP
MP
MP
MP
244
mini-DIMM
VLP
KEY
ES
Engineering Sample
CS
Customer Sample
MP
Mass Production
EOL
End of Life
23
DRAM
DDR
184 DIMM
200 SO-DIMM
// Density up to 1GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
// Density up to 1GB
// Unbuffered, Unbuffered ECC, Registered ECC
// Standard Profile (1.181")
Registered ECC
High end server applications
Unbuffered ECC / Non-ECC
Notebook and small form factor appliances such as routers,
networks, 1U servers and POS that uses embedded boards.
Unbuffered ECC / Non-ECC
Embedded applications such as POS and kiosk systems
Technology
Pins
Profile
Unbuffered
Unbuffered
ECC
Registered
ECC
PC2-2100
266 MT/s
PC2-2700
333 MT/s
PC2-3200
400 MT/s
184
DIMM
Standard
2.5V
512MB - 1GB
2.5V
256MB - 1GB
2.5V
256MB - 1GB
MP
MP
MP
200
SO-DIMM
Standard
2.5V
128MB - 1GB
2.5V
256MB - 1GB
MP
MP
MP
DDR
KEY
24
ES
Engineering Sample
CS
Customer Sample
MP
Mass Production
EOL
End of Life
Modems
Embedded Modems
SL-SU Series
SLM Series
// 24-pin DIP Small form-factor
1.4”x0.9”
// Low power consumption
26mA at 3.3V supply
// Parallel Phone detection and
caller ID Detection
// Over-Voltage and Current
Protection: 70V and 200mA
// 24-pin DIP Small form-factor
2.0” x 1.0”
// Low power consumption
26mA at 3.3V supply
// Serial and Parallel mode support
// Dual voltage support (3.3V/5V)
// Over-Voltage and Current
Protection: 70V and 200mA
Series
SL-SU
SLM
KEY
Part Number
Maximum Speed
Error Correction
Support
Data Compression
Support
RoHS
Compliant
6/6
FCC
Certified
Status
SL2404SU
2.4Kbps (V.22bis)
V.42
V.42bis
Yes
Yes
MP
SL2415SU
14.4Kbps (V.32bis)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SL2434SU
33.6Kbps (V.34)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SL2457SU
56Kbps/33.6Kbps (V.90)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SL2493SU
56Kbps/48Kbps (V.92)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SLM2404(-I)
2.4Kbps (V.22bis)
V.42
V.42bis
Yes
Yes
MP
SLM2415(-I)
14.4Kbps (V.32bis)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SLM2434(-I)
33.6Kbps (V.34)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SLM2457(-I)
56Kbps/33.6Kbps (V.90)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
SLM2493(-I)
56Kbps/48Kbps (V.92)
V.42 / MNP2-4
V.42bis / MNP5
Yes
Yes
MP
ES
Engineering Sample
CS
Customer Sample
MP
Mass Production
EOL
End of Life
25
Modems
USB Modems
Hardware
Software
// Hardware
// USB 2.0
// 56Kbps / 48Kbps (V.92)
// 14.4Kbps Fax (T.31/V.17)
// RoHS Compliant
// FCC Certified
// Supports Windows 98/2000/
XP/Vista/7 and Linux
// Software
// USB 2.0
// 56Kbps / 48Kbps (V.92)
// 14.4Kbps Fax (T.31/V.17)
// RoHS Compliant
// FCC Certified
// Supports Windows 98/2000/
XP/Vista/7 and Linux
Series
Part Number
Maximum Speed
Error Correction
Support
Data Compression
Support
RoHS
Compliant
6/6
FCC
Certified
Status
USB
Modem
(Hardware)
WUMHV92A1CN.01-xxx
56Kbps/48Kbps (V.92)
14.4Kbps Fax (T.31/V.17)
V.42 / MNP2-4
V.44 / V.42 / MNP5
Yes
Yes
MP
USB
Modem
(Software)
WUMSV92E1LS.01-xxx
56Kbps/48Kbps (V.92)
14.4Kbps Fax (T.31/V.17)
V.42 / MNP2-4
V.44 / V.42 / MNP5
Yes
Yes
MP
KEY
26
ES
Engineering Sample
CS
Customer Sample
MP
Mass Production
EOL
End of Life
Contact a Wintec OEM Sales Representative Today!
website // www.wintecind.com/oem
email // oemsales@wintecind.com
phone // 408.856.0565