PHOTONIC PACKAGING

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Märkisches Museum
REGISTRATION
Mohrenstraße
Please register by August 18th 2014 at the latest by our web
tool: www.izm.fraunhofer.de/en/ppws
Contact: Georg Weigelt | Phone: +49 30 46403-279
Fax: -650 | georg.weigelt@izm.fraunhofer.de
PARTICIPATION FEE
595,00 € per person (incl. evening event)
The fees are VAT exempt according to § 4 No. 22 UStG.
We see that there are many opportunities to be taken by
OEM manufacturers, suppliers and service assemblers to
face the specific challenges regarding very tight tolerances,
photonic system requirements and supply chain management.
VENUE
Thus the Photonics Packaging Workshop at the Fraunhofer
Forum Berlin focuses on effective manufacturing strategies
in Europe and automated assembly technologies for
optoelectronic and photonic integration on board, package
and device level.
WHO SHOULD ATTEND?
Fraunhofer-Forum Berlin im SpreePalais
Anna-Louisa-Karsch-Str. 2, 10178 Berlin, Germany
The workshop is aimed primarily at developers CTOs and
supply chain managers from equipment manufacturers and
endusers who are considering the use of photonic packaging
technologies relating to optoelectronic modules, components
or interconnects in their electronic engineering and manufacturing services.
Cover: Automated micro-optic assembly
W O R K S H O P : B E R L I N , S E P T E M B E R 1 0 TH/ 1 1 TH, 2 0 1 4
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Photonic packaging is crucial and includes single packages,
modules or subsystems comprising at least one optoelectronic device or micro-optical element or optical interconnects.
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Photonic integration is driven today by the increasing
demand of bandwidth in data- and telecommunication.
Furthermore miniaturization in lightening and projection
techniques, and a wide variety of optical sensors require
new concepts to reduce cost and guarantee reliability.
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WORKSHOP PROFILE
SpreePalais
TXL
Behrenstraße
Französische Str.
Mohrenstraße
Alexanderplatz
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Bauhofstraße
Dorotheenstraße
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Georgenstraße
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Taubenstraße
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Behrenstraße
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Hackescher Markt
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Am Weidendamm
Friedrichstraße
Mittelstraße
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Ziegelstraße
PHOTONIC PACKAGING
EFFECTIVE MANUFACTURING IN EUROPE
I N C O O P E R AT I O N W I T H
Collective LED bonding
Array of 100 blue LED-Chips transferred and soldered at the same
Optical connector assembly on electrical-optical circuit board (EOCB)
Green Laser SHG Module
time
SEPTEMBER 10TH, 2014
SEPTEMBER 11TH, 2014
10.00 Registration
M ANUFAC TUR IN G S E RV IC E S
11.00 Workshop opening and session introduction
Dr. Henning Schröder, Fraunhofer IZM
Carlos Lee, Director General EPIC
11.30 Photonics Packaging – Managing the supply
chain
Jörg Muchametow, Eagleyard Photonics GmbH
15.00 Coffee break
15.30 Volume production of single mode micro-optical
components with wafer-level assembly
Jaromir Kubielka, Argotech a.s./ Dr. Jörg-R. Kropp,
InBeCon GmbH
9.00
9.15
FLEXI BLE AUTO MATI O N AND PRO CESSES
Session introduction
Dr. Henning Schröder, Fraunhofer IZM
Challenges in manufacturing of photonic
assemblies for innovative railway signal
solutions
Martin Franke, Siemens AG
12.00 From high precission chip assembly to photonic
system integration
Ralph Schachler, AEMtec GmbH
16.00 Challenge of assembling optoelectronic components in diode laser modules for a wide range of
applications
Dr. Nils Kirstaedter, Lumics GmbH
12.30 Lunch break
16.30 Transfer to Fraunhofer IZM
13.30 Status and challenges of PMS for datacom
applications in Europe
Dr. Gunther Vollrath, Aifotec AG
17.00 Lab tour
10.15 Hybridly integrated 300 Gbit/s on-boardtransceiver for data center applications
Dr. Ulrich Keil, FCI Deutschland GmbH
18.30 Get-together
10.45 Coffee break
14.00 Automated active assembly of optical components on printed circuit boards
Dr. Henning Schröder, Fraunhofer IZM
9.45
Flexible automation for micro assembly in
photonics
Torsten Vahrenkamp, ficonTEC GmbH
11.15 Strategies for high precision adhesive bonding
in optoelectronic applications
Andreas Kraft, DELO Industrie Klebstoffe GmbH &
Co. KGaA
11.45 The ST-TECIP preproduction silicon photonics
packaging bench: Building a path from the labs
to full production
Dr. Ignazio Piacentini, PI miCos GmbH
12.15 Laser-processing of building blocks for flexible
active optical alignment assemblies
Dr. Gunnar Böttger, Fraunhofer IZM
12.45 Photonic wire bonding: Level-1 packaging and
multi-chip integration enabled by 3D laser
lithography
Prof. Dr. Christian Koos, Karlsruhe Institute of
Technology
13.15 Closing remarks
Dr. Henning Schröder, Fraunhofer IZM
13.30 Lunchtime snack
14.45 End of workshop
14.30 Polymer-based OSA´s – Assembly and packaging
for datacom and sensor solutions
Roman Schmidt, First Sensor AG
+ + + + D O N ' T M I S S O U R E V E N I N G E V E N T O N S E P T E M B E R 1 0 TH + + + + W I T H T H E I N T E G R AT E D L A B T O U R A N D T H E O P P O R T U N I T Y T O M E E T O U R E X P E R T S + + + + E N J O Y T H E I N S P I R I N G C I T Y O F B E R L I N + + + +