IPC NX und Panel NX

Transcription

IPC NX und Panel NX

IPC NX und Panel NX
Handbuch
Dokument: REV: 0.1
Handbuch IPC NX und Panel NX
gültig ab PLATINEN REV. 02*
Stand: 12.Juli 2007
Die Informationen in diesem Text wurden von uns sorgfältig überprüft und
sollten vollständig und korrekt sein. Dennoch können wir für fehlende oder
unrichtige Hinweise und sich daraus unter Umständen ergebende Schäden in
keinem Fall die Haftung übernehmen. Liefermöglichkeiten, Änderungen und
Irrtum vorbehalten.
Viele der Hardware- und Softwarebezeichnungen sind eingetragene WarenBezeichnungen und unterliegen den gesetzlichen Bestimmungen.
KWS Computersysteme GmbH / Carl Zeiss-Straße 1 / D-76275 Ettlingen /
Telefon: +49(0)7243/215-0 / Fax: +49(0)7243/215-100
Internet: http://www.kws-computer.de
*
auf Platinenrückseite als IPC NX V.2 und durch erste BIOS-Meldungen
ersichtlich
IPC NX und Panel NX
Inhalt
Dieses Dokument ist in folgende Kapitel aufgeteilt:
1. DATENBLATT
Kurzdatenblatt
2. INSTALLATION
nach dem Auspacken
3. FUNKTIONSBESCHREIBUNG
wenn man tiefer einsteigen will
4. LEDS UND
HARDWAREEINSTELLUNGEN
Leids, Schalter, Lötbrücken und
Jumper
5. SICHERHEITS
EIGENSCHAFTEN
Spannungsüberwachung,
Watchdog und Reset
6. SCHNITTSTELLEN UND
STECKER
von IPC NX und Panel NX
7. BIOS (in englisch)
das BIOS des IPC NX
8. BETRIEBSSYSTEME
Windows, Windows CE.net und
Linux
9. PROGRAMMIERMODELL
I/O-Ports und
Registerbeschreibungen
10. POWER MANAGEMENT
Möglichkeiten
11. FEHLERSUCHE
wenn es mal Probleme gibt
12. WARTUNG
13. ANHANG
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IPC NX und Panel NX
Inhalt
INHALT
1
1.1
DATENBLATT
14
BLOCKSCHALTBILD
15
1.2
KURZDATEN
16
1.2.1
Prozessor
22
1.2.2
Chipset
23
1.2.3
Cache
Fehler! Textmarke nicht definiert.
1.2.4
Arbeitsspeicher
25
1.2.5
Prozessdatenspeicher
Fehler! Textmarke nicht definiert.
1.2.6
Grafik
25
1.2.7
Laufwerke
25
1.2.8
Schnittstellen
26
1.2.9
Prozeß-Schnittstellen:
26
1.2.10 Systemfunktionen:
26
1.2.11 Lokale Erweiterung
27
1.2.12 Temperaturbereich
27
1.2.13 Software
27
1.2.14 Sonstiges
27
1.2.15 Optionen
27
1.2.16 Netzteil/Versorgungsspannung
27
1.2.17 Abmessungen
28
1.3
2
VERWENDETE HARDWARE
INSTALLATION
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2.1
SYSTEMBESTANDTEILE
30
2.2
TREIBER
30
2.3
SYSTEMMELDUNGEN BEIM HOCHFAHREN
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Inhalt
FUNKTIONSBESCHREIBUNG
32
3.1
POWER-ON
32
3.2
KUNDEN-LCDs
32
3.3
ETHERNET BOOT MANAGER (in englisch)
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4.1
LEDS UND HARDWAREEINSTELLUNGEN
LEDs
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4.2
SCHALTER
4.2.1
SYSTEMSCHALTER
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4.3
Jumper
4.3.1
Jumperfeld J16
4.3.1.1 ATX/AT-MODE
4.3.1.2 SHUTDOWN MODE (nicht implementiert)
4.3.1.3 RTC POWER-ON (nicht implementiert)
4.3.2
Jumperfeld J1
4.3.2.1 CLEAR CMOS-RAM
4.3.2.2 CMOS WRITE PROTECT
4.3.3
Jumperfeld J12
4.3.3.1 TOUCHSCREEN DISABLE
4.3.3.2 BIOS KOPIE EINSCHALTEN
4.3.3.3 LVDS STROBE EDGE MODE
4.3.3.4 BIOS WRITE PROTECT
4.3.4
Jumperfeld CN1
4.3.4.1 POWER-BUTTON KOPIE
4.3.4.2 SYSTEMLAUTSPRECHER
4.3.4.3 RESET KOPIE
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4.4
LÖTBRÜCKEN (LB)
4.4.1
LB63 TOUCHSCREEN an COM1 oder COM2
4.4.2
LB66,LB68 TOUCHSCREEN-TYPE
4.4.3
LB87,LB88,LB89 5-DRAHT TOUCH-TYPE
4.4.4
LB19 LCD-PANEL Voltage !!!
4.4.5
LB3,LB4 PANEL-Voltage Pinbelegung CON1 !!!
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IPC NX und Panel NX
4.4.6
4.4.7
5
Inhalt
LB13 BACKLIGHT Voltage !!!
LB11,LB12,LB14,LB15,LB18 CAN Interrupt
SICHERHEITSRELEVANTE EIGENSCHAFTEN
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5.1
Spannungsüberwachung
48
5.2
Watchdog (option)
48
5.3
Temperaturüberwachung
48
5.4
System Shutdown bei Temperaturüberschreitung
48
6
SCHNITTSTELLEN UND STECKER
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6.1
USB ANSCHLÜSSE
6.1.1
CON1 (USB0) extern
6.1.2
CON2 (USB2) extern
6.1.3
CON3 (USB1) extern
6.1.4
ETHERNET-1 Anschluß CON4 extern
6.1.5
ETHERNET-2 Anschluß CON5 extern
6.1.6
+24V-POWER Anschluß CON6 extern
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6.2
LCD ANSCHLUß (TTL) CON7 intern
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6.3
SERIELLE SCHNITTSTELLE COM1 (CON8) extern
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6.4
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6.5
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6.6
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6.7
LPC SCHNITTSTELLE CON12 intern
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6.8
SPDIF/CDIN SCHNITTSTELLE CON13 intern
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6.9
HD-Power/I2C SCHNITTSTELLE CON14 intern
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IPC NX und Panel NX
Inhalt
6.10
CompactFlash STECKER CON15 (CF0/IDE0)
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6.11
CompactFlash STECKER CON16 (CF1/IDE1)
54
6.12
IDE ANSCHLUß CON17 (2,5“ Festplatten,2mm Raster)
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6.13
SOUND LINE-OUT Anschluß CON18
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6.14
SOUND MIC Anschluß CON19
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6.15
SOUND LINE-IN Anschluß CON20
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6.16
Digitale I/O Anschluß CON21
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6.17
PS/2 TASTATUR ANSCHLUß CON22
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6.18
PS/2 MAUS ANSCHLUß CON23
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6.19
USB3/USB4 ANSCHLUß CON24
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6.20
VIDEO ANSCHLUß CON26
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6.21
serial ATA-1 ANSCHLUß CON27
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6.22
serial ATA-2 ANSCHLUß CON28
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6.23
PARALLELE SCHNITTSTELLE CON32
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6.24
VGA ANSCHLUß CON33
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6.25
BACKLIGHT CON34
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6.26
TOUCHSCREENANSCHLUß CON35
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6.27
SYSTEM-CONNECTOR CON36
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6.28
CPU Lüfter CON37
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6.29
alternativer Ethernet-1 Anschluß CON38
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Inhalt
6.30
alternativer Sound Anschluß CON39
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6.31
LCD LVDS-T/B Anschluß CON31A
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6.32
LCD LVDS-B second Anschluß CON31B
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7
BIOS (IN ENGLISCH)
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7.1
Current BIOS- Version
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7.2
Entering BIOS-Setup
63
7.3
PC BIOS Features
64
7.4
Software Compatibility
65
7.5
POWER ON SELF TEST
65
7.6
The BIOS User Interface
66
7.7
SETUP SCREEN SYSTEM
68
7.8
Basic CMOS Configuration Screen
7.8.1
Configuring Drive Assignments
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7.9
Configuring Floppy Drive Types
7.9.1
Configuring IDE Drive Types
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7.10
Custom Configuration Setup Screen
72
7.11
Shadow Configuration Setup Screen
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7.12
Start System BIOS Debugger Setup Screen
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7.13 MANUFACTURING MODE
7.13.1 Start RS232 Manufacturing Link Setup Screen
7.13.2 Sample Manufacturing Mode HOST Program
7.13.3 Manufacturing Mode Drive Redirection
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Inhalt
7.14
CONSOLE REDIRECTION
76
7.15
CE-READY—WINDOWS CE LOADER
76
7.16
INTEGRATED BIOS DEBUGGER
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8
BETRIEBSSYSTEME
79
9
PROGRAMMIERMODELL
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9.1
Digitale I/O-relevante Register
9.1.1
IN Port Register
9.1.2
OUT Port Register
9.1.3
Zugriff Digitale I/O-relevante Register
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9.2
System-Managment-Bus
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10
POWER MANAGMENT
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11
FEHLERSUCHE
83
11.1
BIOS-Console redirection through a COM port
83
11.2
CRITICAL ERROR BEEP CODES (in englisch)
83
11.3
BIOS POSTCODES (in englisch)
84
11.4
Touchscreen-controller
87
11.5
COM1 funktioniert nicht
88
11.6
Intel Boot Agent (in englisch)
88
12
WARTUNG
89
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IPC NX und Panel NX
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Inhalt
ANHANG
90
13.1 Literatur, Internet
13.1.1 Standard-Werk PC-Hardware
13.1.2 Eingesetzte Prozessoren, Chipset
13.1.3 Normen/Specifications
13.1.4 PCI
13.1.5 SMBus
13.1.6 USB
13.1.7 CompactFlash
13.1.8 ETHERNET
13.1.9 Betriebssysteme
13.1.10
BIOS
13.1.11
Zeitschrift
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13.2
Datenträger
92
13.3
Kundenkonfiguration, lieferbares Zubehör
92
13.4
Inhalt Kunden-CD
93
13.5
Standard Hardwarekonfiguration
94
13.6
Abkürzungen und Symbole
94
13.7
Bestückungspläne Platine
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IPC NX und Panel NX
Tabellenverzeichnis:
TAB. 1: FUNKTION DER LED’S.
TAB. 2: SCHALTER: ON/OFF, RESET
TAB. 3: ATX/AT-MODE, STIFTLEISTE J16
TAB. 4: SHUTDOWN MODE, STIFTLEISTE J16
TAB. 5: RTC POWER-ON, STIFTLEISTE J16
TAB. 6: CLEAR CMOS-RAM, STIFTLEISTE J1
TAB. 7: CMOS WRITE PROTECT, STIFTLEISTE J1
TAB. 8: TOUCHSCREEN DISABLE, STIFTLEISTE J12
TAB. 9: BIOS KOPIE EINSCHALTEN, STIFTLEISTE J12
TAB. 10: LVDS STROBE EDGE MODE, STIFTLEISTE J12
TAB. 11: POWER-BUTTON KOPIE, STIFTLEISTE CN1
TAB. 12: SYSTEMLAUTSPRECHER, STIFTLEISTE CN1
TAB. 13: RESET KOPIE, STIFTLEISTE CN1
TAB. 14: LB63:TOUCHSCREEN ODER COM1
TAB. 15: LB66,LB68:TOUCHSCREEN-TYPE
TAB. 16: LB87,LB88,LB89: 5-DRAHT TOUCH-TYPE
TAB. 17: LB19: LCD-PANEL VOLTAGE
TAB. 18: LB3,LB4: PANEL-VOLTAGE PINBELEGUNG CON1
TAB. 19: LB13: BACKLIGHT VOLTAGE
TAB. 20: LB11,LB12,LB14,LB15,LB18: CAN INTERRUPT
TAB. 95: +24V-POWER ANSCHLUß CON6
TAB. 31: PANEL ANSCHLUß CON7 (34POL. WANNE)
TAB. 25: COM1 ALS DSUB ANSCHLUß CON8
TAB. 24: COM2 ANSCHLUß CON9
TAB. 26: IDE ANSCHLUß CON17 (2MM RASTER)
TAB. 74: SOUND LINE-OUT ANSCHLUß CON18
TAB. 70: SOUND MIC ANSCHLUß CON19
TAB. 72: SOUND LINE-IN ANSCHLUß CON20
TABELLE 21: LPT AUF DER PLATINE ALS ANSCHLUß CON32
TAB. 32: VGA 15POL. STANDARD HD-DSUB BUCHSE
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IPC NX und Panel NX
ABBILDUNGEN:
FIG. 1. BLOCKSCHALTBILD STILISIERT
FIG. 1. BLOCKSCHALTBILD
FIG. 1. IPC NX -FRONTANSICHT
FIG. 2. IPC NX -SEITENANSICHT
FIG. 3. PANEL NX -FRONTANSICHT
FIG. 4. PANEL NX -RÜCKANSICHT
FIG. 5. PANEL NX -FORMSCHÖNE WANDHALTERUNG
FIG. 1. THE TEXT-BASED BIOS POST
FIG. 2. THE GRAPHICAL POST
FIG. 3. THE SYSTEM BIOS SETUP SCREEN MENU
FIG. 4. THE BASIC CMOS CONFIGURATION
FIG. 5. MANUFACTURING LINK SETUP SCREEN
FIG. 6. THE CE-READY FEATURE
FIG. 7. THE INTEGRATED BIOS DEBUGGER
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IPC NX und Panel NX
1.Datenblatt
Änderungen
Rev.
0.1 prim.
Änderung
erstellt
Datum
12.07.07
Handbuch
Autor
WS
13
14
Touchscreen
Touchscreen
Handbuch
Infrarot
LPT
LPC
KB/MOUSE
Serial 2x
Serial 2x
CompactFlash 2x
HD,DVD,CD 1x
5X
IPC NX und Panel NX
1.Datenblatt
1 Datenblatt
Fig. 1. Blockschaltbild stilisiert
IPC NX und Panel NX
1.Datenblatt
1.1 BLOCKSCHALTBILD
Fig. 1. Blockschaltbild
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IPC NX und Panel NX
1.Datenblatt
1.2 KURZDATEN
Unterschiede zwischen IPC NX und Panel NX
IPC NX
Prozessor
Chipsatz
RAM
Massenspeicher
Grafik
Schnittstellen
Systemfunktionen
Stromversorgung
Leistungsaufnahme
Temperaturbereich
Gehäuse
16
Geode NX CPU
1 oder 1.4 GHz Takt
SiS741CX Northbridge / SiS964 Southbridge
512 MByte oder 1 GByte DDR-SDRAM
2 Steckplätze für CF-Karten
2 externe serial ATA-Schnittstellen
IDE-Schnittstelle für interne 2.5“ Festplatte
max. 2048x1536 Pixel, interne Anschlüsse für TFTDisplays mit single/dual-LVDS und TTL-Interface
2D/3D Grafikbeschleuniger, externer VGA-Ausgang.
2 x 10/100 Ethernet extern
4 x RS232
PS/2 Maus und Tastatur
3 x USB 2.0 / 1.1 extern
Option Lautsprecher und Mikrofon
ON/OFF- und Reset-Taster
Kontroll-LEDs für ACPI, Netzteil und Ethernet
on-board-Netzteil für 24VDC Eingang
40W max.
-10 … 50°C bei ungehinderter Konvektion
Aluminium-Gehäuse für Wandmontage (2 x M8),
Abmessungen 273 x 50 x 165 mm (H x B x T)
Cu-Wärmeverteiler und Rippenkühlkörper
Lackierung in RAL5003 saphirblau
Kundenspezifische Sonderausführungen sind möglich
Handbuch
IPC NX und Panel NX
1.Datenblatt
Fig. 1. IPC NX -Frontansicht
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IPC NX und Panel NX
1.Datenblatt
Fig. 2. IPC NX -Seitenansicht
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Handbuch
IPC NX und Panel NX
1.Datenblatt
Panel NX
Prozessor
Chipsatz
RAM
Massenspeicher
Grafik
Schnittstellen
Display
Systemfunktionen
Stromversorgung
Gehäuse
Geode NX CPU, 1 GHz Takt
SiS741CX Northbridge / SiS964 Southbridge
512 MByte oder 1 GByte DDR-SDRAM
2 Steckplätze für CF-Karten
IDE-Schnittstelle für interne 2.5“ Festplatte
max. 2048x1536 Pixel, interne Anschlüsse für TFTDisplays mit single/dual-LVDS und TTL-Interface
2D/3D Grafikbeschleuniger.
1 x 10/100 Ethernet extern
2 x USB 2.0 / 1.1 extern (Tastatu und Mouse)
externer Audio-Ausgang,
externer Mikrofon- & Hochpegel-Eingang
15“ TFT, 1024x768, 300cd
Touch Screen oder Verbundglasscheibe
Auf Wunsch sind auch Versionen mit größeren Displays
(z.B. 42“ Diagonale) realisierbar.
Touch Screen Controller (4-Draht resistiv)
ON/OFF- und Reset-Taster
Kontroll-LEDs für ACPI und Ethernet
on-board-Netzteil für 24VDC Eingang
Steckernetzteil für 110-230VAC
Leistungsaufnahme 45W max.
Aluminium-Gehäuse, frontseitig dicht, mit VESA-Halterung
(100 mm) zur Montage z.B. am Tragarm, optional
Wandhalterung mit integriertem Netzteil für 110 / 230 VAC
Abmessungen 430 x 278 x 31 mm
Rückseitig Kupfer-Wärmeableiter
Lackierung in RAL9006 Weißaluminium
Kundenspezifische Sonderlackierungen sind möglich.
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IPC NX und Panel NX
1.Datenblatt
Fig. 3. Panel NX -Frontansicht
Fig. 4. Panel NX -Rückansicht
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IPC NX und Panel NX
1.Datenblatt
Fig. 5. Panel NX -formschöne Wandhalterung
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IPC NX und Panel NX
1.Datenblatt
1.2.1 Prozessor
32-Bit „Sockel A“ x86-CPU der Athlon XP - Klasse mit 266MHz AMD
Processor System Bus (2.1 GB/s) und 133MHz Front Side Bus (FSB).
Das Design basiert auf dem AMD Enhanced Mobile Athlon XP-M Core und ist
in 0.13um Technologie gefertigt.
Die Prozessoren verfügen über
- 128 Kbytes L1 cache und 256 Kbytes L2 cache
- 3DNow!™ technology, superscalar MMX™ und SSE Instruction Sets
- AMD PowerNow!
der Processor kann in verschiedenen „Performance States“ laufen
(Frequenz & Spannungs Kombinationen) und Software kann diese
„Performance States“ dynamisch ändern
- 9-issue, superscalar, 32-bit micro architecture optimized for highfrequency operation parallel x86 Instruction Decoders
- Dynamic scheduling with speculative out-of-order execution
- 2048-entry Branch Prediction Table and 12-entry Return Stack
- 3 superscalar, out-of-order integer pipelines each containing
- 3 superscalar, out-of-order multimedia pipelines
- FADD, MMX ALU, 3DNow!™ technology
- FMUL, MMX ALU (includes Mul and MAC),
- Level 1 64K-bit System Interface
- Multilevel TLB (24/256-entry I, 40/256-Entry D)
- High-speed 64-bit System Interface
- Deep internal buffering to support pipelines and external interfaces
- Up to 72 x86 instructions in-flight
- 18-entry integer scheduler
- 36-entry floating point scheduler
Eingesetzt werden folgende Prozessoren:
- AMD Geode™ NX 1500@6W processor (reale 1 GHz)
- AMD Geode™ NX 1750@14W processor (reale 1,4 GHz)
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1.Datenblatt
1.2.2 Chipset
Integrierte Northbridge, Southbridge und Super I/O, bis 256KB
Systembios mit integriertem VGA-BIOS d.h. es ist ggf. nur ein UpdateVorgang notwendig. Durch Jumper abrufbare BIOS-Kopie im Flash
vorhanden, BIOS-Schreibschutz ist möglich
SIS741CX Northbridge
• Host Interface
– Support AMD Athlon/XP
– 333MHz Front-Side Bus
– Synchronous/Asynchronous Host/DRAM Timing Support
• DRAM Controller
– DDR400/DDR333/DDR266 Support
• AGP3.5 and AGP2.0 Compliant
– for 8X/4X Mode Support
– Fast Write Support
• SiS MuTIOL® 1G Technology
– Delivering 1GB/s Bandwidth
• High performance 256-Bit 3D/128-Bit 2D Mirage™ Graphic Engine
– 2 pixel rendering pipelines and 4 texture units per cycle (2P4T)
– Up to 200Mhz 3D engine clock speed
• Advanced Hardware Acceleration for DVD playback
• Share Memory Size from 8MB and up to 64MB
• Dual 12-bit DDR Digital Interface for Digital LCD/TV-OUT support
• Built-in the 2nd display controller to support Dual View application
• Built-in high performance 333Mhz RAMDAC
– Max. graphic mode resolution up to 2048x1536@ true color, 75NI
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IPC NX und Panel NX
1.Datenblatt
SIS964 Southbridge
• USB 2.0 /1.1 Support
– Support a maximum of 8 USB Ports. Dynamic connection to USB 1.1 or USB 2.0.
• Serial ATA Controller
– 2x Independent ports with Ultra DMA 150 support
• IDE Controller
– 1x Independent IDE Channels with ATA133/100/66 support
• Integrated MAC Controller with Standard MII Interface
• Integrated Audio Controller w/ AC97 2.2 Compliance Interface
• PCI 2.3 Compliant
• LPC Interface 1.1 Compliance
• ACPI 2.0 Compliance
• I/O APIC Support
• PC2001 Compliance
• SiS MuTIOL® 1G Technology Delivering 1GB/sec Bandwidth
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IPC NX und Panel NX
1.Datenblatt
1.2.3 Arbeitsspeicher
maximal sind 1GB möglich, DDR266/DDR333
1.2.4 Grafik
SiS Mirage™ Graphic mit 64MB max Video Memory
Shared Memory Architecture
DirextX Support DirectX 7.0
2D Grafikengine on-chip mit 4 MB UMA-Architektur RAM.
Auflösung von 640x480 Pixel bis 1280x1024 Pixel, 24Bit und 75Hz.
Pixeltiefen von 8-,16-,24 und 32-Bit sind möglich, RAMDAC mit
135MHz. Der VGA-Ausgang ist als Stiftleiste zur Verbindung mit einem
DSUB-Standardgehäuse ausgelegt.
Der Anschluß von LC-Displays (Auflösung TFT bis zu 1024x1024
Pixel bei max. 18Bit/Pixel) in 3.3V-Technik erfolgt über eine 34polige Stiftleiste. Direkter Anschluß von LVDS-Panels wird durch einen
on-board LVDS-Transmitter unterstützt.
1.2.5 Laufwerke
2x Sockel für Compact-Flash-Karte (bootfähig),
diese kann oftmals auch als sinnvoller Ersatz für rotierende
Massenspeicher eingesetzt werden
1x IDE-Port mit bis zu 2 Festplatten PIO Mode 4 oder UDMA/33-Modus
(2,5" Notebook-Schnittstelle)
Unabhängiges Timing der beiden Festplatten,
Integrierte 4 x 32-bit Buffer-FIFOs per Kanal
2 serial ATA UDMA 150-Schnittstellen mit RAID function
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IPC NX und Panel NX
1.Datenblatt
1.2.6 Schnittstellen
1x PS/2 Maus
1x PS/2 Tastatur
4x Serielle Schnittstellen RS232
COM1 als 9 poliger DSUB Standard,
COM2,CVOM und COM4 ist als RJ-Twisted Pair ausgelegt
1x Parallele Standard Schnittstelle SPP, es ist auch ein Betrieb im
ECP, EPP-Modus möglich
IEEE 1284 kompatibele ECP
Ein Schutz gegen Beschädigung beim Druckereinschalten ist
integriert
5x USB je bis 0,5A (Overcurrent)
Ein Root Hub mit 2 USB ports, USB 1.1 und
OpenHCI 1.0 Spezifikation, erlaubt serielle Übertragung als
FS (12Mbits/sec) und LS (1.5Mbits/sec),
1.2.7 Prozeß-Schnittstellen:
1x Parallelport für einfache Schaltfunktionen (TTL)
2x Netzwerk 10Base T / 100Base TX Fast Ethernet (RJ45)
(als Optionen sind ETHERNET BOOT MANAGER und
Remote Wake up möglich)
8 digitale Ein/Ausgänge (DI/O 3,3V)
1.2.8 Systemfunktionen:
Watchdog (Option)
On-Board Touchscreen-Controller resistiv
(direkter ELO-, Microtouch-, 4-Draht- und 8-Draht-Anschluß)
- LED Blinking in S0, S1 and S3 States
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1.Datenblatt
1.2.9 Lokale Erweiterung
System Management Bus Interface ähnlich I2C (auf Stiftleiste).
1.2.10 Temperaturbereich
IPC NX
-10 … 50°C bei ungehinderter Konvektion
Panel NX
0 … 40°C
1.2.11 Software
General Software EMBEDDED BIOS,
Betriebssystem nach Wahl
1.2.12 Sonstiges
AT oder ATX-Modus einstellbar (Kaltstart betreffend).
ON/OFF und RESET- Schalter, auch als Kopie auf Stiftleiste
IDE-LED; LEDs für +5V Standby und andere Systemspannungen
Ethernet-LEDs.
Anschluß Systemlautsprecher.
1.2.13 Optionen
(bitte bei KWS anfragen )
Arbeitsspeicherausbau: DDR-266 (PC2100) / DDR-333 (PC2700)
512MB DDR-SDRAM, optional 1GB
auf Hauptplatine aufgelötet - keine DIMMs
Lieferform mit/ohne Gehäuse und Massenspeicher,
Kundenspezifische Varianten sind möglich.
1.2.14 Netzteil/Versorgungsspannung
Schaltnetzteil auf der Platine, 24 VDC Eingang,
versorgt auch eventuelle Laufwerke (5V/12V).
Die Leistungsaufnahme ist abhängig von der eingesetzten
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1.Datenblatt
Peripherie und vom Displaytyp.
Versorgungsspannung:
Leistungsaufnahme je
nach Prozessor
+24V ±25%
Max. 45W
1.2.15 Abmessungen
IPC NX
Aluminium-Gehäuse für Wandmontage (2 x M8),
Abmessungen 273 x 50 x 165 mm (H x B x T)
Cu-Wärmeverteiler und Rippenkühlkörper
Lackierung in RAL5003 saphirblau
Kundenspezifische Sonderausführungen möglich
Panel NX
Gehäuse Aluminium-Gehäuse, frontseitig dicht, mit VESAHalterung
(100 mm) zur Montage z.B. am Tragarm,
optional Wandhalterung mit integriertem Netzteil
für 110 / 230 VAC
Abmessungen 430 x 278 x 31 mm
Rückseitig Kupfer-Wärmeableiter
Lackierung in RAL9006 weißaluminium
Kundenspezifische Sonderlackierungen möglic
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1.Datenblatt
1.3 VERWENDETE HARDWARE
[ist noch zu ergänzen***]
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2.Installation
2 Installation
2.1 SYSTEMBESTANDTEILE
•
•
•
•
•
Platine mit Prozessor und Speicher
24V Netzteil
VGA-Kabel (Wanne nach VGA-DSUB)
CD mit Dokumention,Treibern und BIOS
mit/ohne Panel und Rückwand
2.2 TREIBER
Die Treiber-CD liegt normalerweise der Lieferung bei.
[siehe Kap.:x verwendete Hardware]
Wegen Linux-Treibern bitte mit KWS Kontakt aufnehmen:
Anmerkung zu den Ethernet-Treibern:
Intel 82559ER und Intel 82559 verwenden verschiedene Treiber
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2.Installation
2.3 SYSTEMMELDUNGEN BEIM HOCHFAHREN
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3.Funktionsbeschreibung
3 Funktionsbeschreibung
Wenn Sie sich über die PC-Technik informieren wollen, ist folgende Literatur
zu empfehlen [Kap.:13.1.1] . Hier kann leider nur auf Besonderheiten
des IPC NXs eingegangen werden.
3.1 POWER-ON
•
ATX- Modus verhält sich wie ein normaler PC mit Power- Button
Platinenschalter S4
• AT- Modus (DEFAULT), mit automatischem Einschalten beim
Anstehen der 24V und Ausschalten mit POWER-BUTTON
Um zwischen diesen Modi umzuschalten sind Jumper umzustecken
[siehe Kap.: 4.3.1.1]
Es ist möglich, parallel zum Power Schalter S4 einen externen Schalter
Anzubringen [siehe Kap.: 4.3.4.1].
System ist per Lan „Wake up“ fähig (nur im ATX-Modus)
Option (bitte bei KWS anfragen )
• Wake on Lan , per Software z.B. AMDs „PCnet Magic Packet (TM)
Utility“
3.2 KUNDEN-LCDs
Fragen Sie bitte bei KWS an, falls Sie Fragen zum Anschluss ihres WunschPanels haben. Die Belegung des Panel Anschlusses CON1
[siehe Kap.Fehler! Verweisquelle konnte nicht gefunden werden.] und des
Inverteranschlusses CN12 [siehe Kap.6.25].
Evt. muss das auch das VGA-BIOS angepasst werden.
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3.3 ETHERNET BOOT MANAGER (in englisch)
Intel(R) Boot Agent Release Notes[2]
Introduction
The Intel(R) Boot Agent is a software product that allows booting of
a personal computer using a boot image that resides on a remote
server. The product is compliant with the Wired for Management
Baseline 2.0 (WfM 2.0) specification and incorporates the PXE client
functionality described in the Pre-boot eXecution Environment Version
2.0 (PXE 2.0 and 2.1) specification. For more detailed information,
refer to the Intel(R) Boot Agent User's Guide included on the product
CD ROM.
Installing the Boot Agent Software
All Intel WfM-compatible adapters, such as the Intel(R) PRO/100+
Management Adapter, have a factory-installed, integrated flash ROM
device that has been pre-programmed with a Boot Agent software image.
Therefore, no software installation is required.
Installation of the Boot Agent on other adapters requires a flash ROM
device (non-volatile storage device) to be present within the client
computer system. This flash ROM can take these forms:
• A factory-installed, integrated flash ROM device on the computer
motherboard with remote boot enabled LOM (LAN on motherboard) hardware
support.
• A field-upgraded, add-on flash ROM device installed into your
network adapter. See the list of flash ROM devices that are compatible
with Intel(R) PRO/100+ or PRO/100B adapters under "Flash ROM Devices
Supported".
In cases involving hardware upgrades, once a flash ROM is available
within the client computer, a valid Boot Agent software image must
then be installed onto the flash ROM. The way in which the Boot Agent
software image is installed onto the flash ROM depends upon your
hardware configuration.
• If your computer includes the network adapter on its motherboard,
the Boot Agent software might need to be installed as part of a
motherboard BIOS code upgrade. Contact your computer or motherboard
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manufacturer to upgrade your motherboard BIOS code. Alternatively,
it is possible that the motherboard has a ROM socket with a 64 KB
flash ROM device. In this case, contact the motherboard manufacturer
to get the code that must be loaded into the flash ROM.
• If your computer uses a flash ROM-equipped adapter, use one of the
following procedures depending upon whether you are installing or
updating the Boot Agent software in a DOS environment or updating
the Boot Agent in a Windows* environment or in an EFI environment.
Installing/Updating the Boot Agent in a DOS Environment
Perform the following steps to install the Boot Agent software in a
DOS environment:
1. The following operation requires use of a DOS bootable floppy disk
containing an executable image of the fboot.exe utility. If you
do not have fboot.exe on your DOS bootable floppy disk, copy it to
your system disk from the CD ROM that came with your product, or
acquire the most up-to-date version from Intel's website at:
http://support.intel.com
2. Using your DOS bootable floppy disk, boot your computer to a DOS
prompt.
Caution: The next several steps require that your computer be booted only
to DOS and not from a Windows "DOS box". These steps cannot be
performed from a DOS Command Prompt window or using a DOS task within
Windows.
Note: If the flash ROM device installed in the adapter ROM socket is already
programmed (not blank), you may need to take steps to enable your
computer to boot from the floppy drive. If necessary, disable
the network boot function from either the BIOS setup program or the
Boot Agent's configuration setup menu. Then reboot to the DOS bootable
floppy disk containing the fboot utility that you just prepared.
3. Type:
fboot
The utility displays a list of all compatible network adapters found
in your system.
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4. In response to the first question from the utility, enter the
following:
a. If only one adapter is installed on your system,
enter "1" to continue.
b. If more than one adapter is installed in your system, you
will need to enter the NIC number (from the displayed list)
that corresponds to the Ethernet MAC Address of the desired
adapter.
The next information prompt should say:
Select Option (U)pdate or (R)estore:
5. Type U (update) if you want the fboot utility to update the flash
ROM device with the current version of Boot Agent software. Type R
(restore) if you want the fboot utility to write a previously-stored
flash image file onto the flash ROM device.
Note1: As part of the Update operation, fboot creates a backup file
on the floppy disk. Make sure that the write-enable tab on the
floppy disk is properly set.
Note2: Prior to the Restore operation, make sure that a flash image
file is available in the same directory as the fboot utility. This
file will have an automatically-generated filename with an .FLS
extension.
If you select the U (update) response, this prompt appears:
Create Restore Image? (Y)es or (N)o:
6. Type Y (yes) to create a flash image file from the current (not yet
updated) image of the flash ROM device. Type N (no) to cause fboot
to proceed without saving a copy of the current contents of the flash
ROM device.
If you choose not to save a copy of the current contents of the flash
ROM device (type N), fboot asks you the following question:
Continue Update Without Restore Image? (Y)es or (N)o:
7. Type Y (yes) to continue, which will update the flash image. Type
N (no) to cancel the update, which will leave the flash ROM contents
unchanged.
Note: The fboot utility automatically names the flash image file
(backup file) as XXXXXXXX.FLS, where XXXXXXXX are the last eight
digits of the adapter's Ethernet address.
Once you have answered the questions posed by the fboot utility, it
creates the flash image file (if appropriate), then writes the current
version of the Boot Agent image to the flash ROM device used by your
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network adapter. (The Boot Agent image is embedded in the fboot utility
itself.) This process takes approximately one minute and then fboot
exits to the DOS prompt.
Note: Care must be taken if you install the Intel(R) Boot Agent Version 4.0
and then install an older (i.e. pre-version 4.0 ) Intel(R) Boot Agent. When
reinstalling the older Boot Agent version, use FUTIL Version 3.46 or later.
Do not use the version of FUTIL or FBOOT that was provided with the older
Intel Boot Agent. If an older version of FUTIL or FBOOT is used to
reinstall, the Boot Agent configuration displayed by the PROSet and
BACONFIG utilities will be incorrect. Furthermore, attempts to
modify the Boot Agent configuration using PROSet and BACONFIG
will not work correctly either.
Updating the Boot Agent in a Windows* Environment
For instructions on updating the Boot Agent in a Windows environment,
refer to the Intel(R) Boot Agent User's Guide.
Updating the Boot Agent in the EFI Environment
For instructions on updating the Boot Agent in an Extensible Firmware
Interface (EFI) evironment, refer to the Intel(R) Boot Agent User's Guide.
Flash ROM Devices Supported
If you need to obtain a flash ROM device for your Intel(R) PRO/100+
or PRO/100B adapter, the following flash components are supported:
Vendor
AMD
ATMEL
ATMEL
ATMEL
ATMEL
CATALYST
CATALYST
CATALYST
CATALYST
INTEL
INTEL
SGS
SST
SST
SST
ST MICRO
36
Part No.
28F020
AT49BV512
AT29LV512
AT49LV010
AT49LV001N
28F256
28F512
28F010
28F020
28F010
28F020
28F512
29LE512
39SF512
39VF512
28F512
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ST MICRO
29W512B
Configuration Setup
Once you have installed the Boot Agent software, you may wish to
change the default settings for some of the Boot Agent's configuration
options. Generally, changing Boot Agent configuration options will be
required only after the first time you add a new network adapter to a
client computer within your network.
You can access the Boot Agent's configuration setup program while the
computer cycles through the boot process. The Intel(R) Boot Agent
User's Guide provides detailed descriptions about the following topics
related to configuration setup:
• Configuring the Boot Agent in a Pre-Boot Environment
• Configuring the Boot Agent in a Windows Environment
• Configuring the Boot Agent in a DOS Environment
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4.LEDs und Hardwareeinstellungen
4 LEDS UND
HARDWAREEINSTELLUNGEN
Die Lage der Leuchtdioden, der Schalter, Jumper und Lötbrücken ist den
Bestückungsplänen im Anhang [siehe Kap.:Fehler! Verweisquelle konnte
nicht gefunden werden. und Kap.0] zu entnehmen.
4.1 LEDs
Auf der Platine befinden sich 7 Leuchdioden, deren Funktion im Folgenden
beschrieben werden:
LED Farbe: Plan:
Funktion wenn ON/BLINKING:
gelb
LED1 HD wird angesprochen
grün
LED2 Standby-Spannung liegt an (+3.3VSB)
rot
LED3 +5V (Option)
rot
LED4 Gerät eingeschaltet (+3.3V)
rot
LED5 +2.5V (Option)
grün
LED6 Ethernet, ETH:Activity
transmit or receive
Ethernet, LINK good
gelb
LED7 Ethernet, SPEED 100Mbit/s
behält bei inaktiven LINK letzten Status
bei
Tab. 1: Funktion der LED’s.
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4.2 SCHALTER
Die Lage der Leuchtdioden, der Schalter, Jumper und Lötbrücken ist den
nicht gefunden werden. und Kap.: siehe Kap.0] zu entnehmen
4.2.1 SYSTEMSCHALTER
Schalter: NAME
S4
ON/OFF
S5
RESET
Funktion bei Power-Modus:
ATX:POWER-Button
AT: EIN/AUS
[siehe Kap.:3.1, Kap.:4.2.1 und
Kap.: 4.3.4.1]
Hardwarereset [siehe Kap.:4.2.1und
Kap.:4.3.4.3]
Tab. 2: Schalter: ON/OFF, RESET
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4.3 Jumper
Die Lage der Leuchtdioden, der Schalter, Jumper und Lötbrücken ist dem
nicht gefunden werden. und Kap.: siehe Kap.0] zu entnehmen
4.3.1 Jumperfeld J16
4.3.1.1 ATX/AT-MODE
[siehe Kap.: 3.1, Kap.:4.2.1 und Kap.: 4.3.4.1 ]
FUNKTION
DEFAULT
ATX-MODE
AT-MODE durch S4
X
EIN/AUS-schaltbar
AT-MODE nur durch
externes Netzteil
abschaltbar*
EINSTELLUNG
PIN7-9 geschlossen
PIN5-7 geschlossen
PIN7-8 geschlossen
Tab. 3: ATX/AT-MODE, Stiftleiste J16
*
= kein versehendliches oder beabsichtigtes Ausschalten durch Betätigen des
Schalters S4
AT-Mode:
System schaltet sich beim Anlegen der 24V
Spannungsversorgung selbstständig ein.
ATX-MODE:
EIN/AUS durch POWER-Button S4, Windows
Shutdown ist nicht implementiert.
4.3.1.2 SHUTDOWN MODE (nicht implementiert)
Ausschalten des Systems durch Windows oder eines Zusatztools
FUNKTION
DEFAULT EINSTELLUNG
SHUTDOWN nicht
X
PIN9-10 offen
möglich
SHUTDOWN möglich
PIN9-10 geschlossen
Tab. 4: SHUTDOWN MODE, Stiftleiste J16
Diese Funktion ist nur im ATX-Modus verfügbar [Kap.:4.3.1.1]
Es ist entweder der SHUTDOWN MODE oder RTC POWER-ON
möglich.
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4.3.1.3 RTC POWER-ON (nicht implementiert)
Einschalten des Systems durch den RTC Alarm-Controller verfügbar [Kap.:7]
FUNKTION
DEFAULT EINSTELLUNG
SHUTDOWN nicht
X
PIN11-12 offen
möglich
SHUTDOWN möglich
PIN11-12 geschlossen
Tab. 5: RTC POWER-ON, Stiftleiste J16
Diese Funktion ist nur im ATX-Modus verfügbar [Kap.:4.3.1.1]
Es ist entweder der SHUTDOWN MODE oder RTC POWER-ON
möglich.
4.3.2 Jumperfeld J1
4.3.2.1 CLEAR CMOS-RAM
Löschen des internen BIOS-SETUP Speichers und
der RTC-EInstellungen
FUNKTION
DEFAULT EINSTELLUNG
Normal MODE
X
PIN1-3 geschlossen
Clear CMOS-RAM
PIN3-5 geschlossen
Tab. 6: CLEAR CMOS-RAM, Stiftleiste J1
Zum Löschen des CMOS-RAMs System ausschalten, Jumper von PIN1-3 auf
PIN3-5 umstecken. System wieder für ein paar Sekunden einschalten, danach
ausschalten und Jumper auf ihre Ausgangsposition (PIN1-3 geschlossen)
stecken.
4.3.2.2 CMOS WRITE PROTECT
Schreibschutz des internen BIOS-SETUP Speichers (BIOS –Einstellungen) und
der RTC-EInstellungen
FUNKTION
DEFAULT EINSTELLUNG
Normal MODE
X
PIN4-6 geschlossen
Write PROTECTED
PIN2-4 geschlossen
Tab. 7: CMOS WRITE PROTECT, Stiftleiste J1
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4.3.3 Jumperfeld J12
4.3.3.1 TOUCHSCREEN DISABLE
Option Touchscreen an COM1 oder COM2 vorkonfigurieren:
Diese Funktion muss mit einer anderen Funkrion zusammen konfiguriert
werden siehe auch Kap.: 4.4.1]
FUNKTION
DEFAULT EINSTELLUNG
Touchscreen ein,
X
PIN1-3 geschlossen
mit COM1 verbunden
Touchscreen aus,
PIN3-5 geschlossen
mit COM1 verbunden
Tab. 8: TOUCHSCREEN DISABLE, Stiftleiste J12
Der Touchscreen ist standardmässig mit COM1 verbunden, d.h.
COM1 dann nicht mehr für andere Zwecke verfügbar.
4.3.3.2 BIOS KOPIE EINSCHALTEN
Wird versehentlich durch Fehlbedienung beim Aufspielen einer aktuellen
BIOS-Version der BIOS-Speichers beschädigt, so steht durch diese
Konfiguration eine Kopie des BIOS zur Verfügung und der Rechner kann
wieder in Betrieb genommen werden..
Im Moment ist ein durch den Benutzer durchgeführtes BIOS-Update
nicht implementiert.
FUNKTION
Normal MODE
Copy MODE
DEFAULT EINSTELLUNG
X
PIN8-10 geschlossen
Tab. 9: BIOS KOPIE EINSCHALTEN, Stiftleiste J12
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4.3.3.3 LVDS STROBE EDGE MODE
FUNKTION
Falling EDGE
Rising EDGE
DEFAULT EINSTELLUNG
X
PIN4-6 geschlossen
PIN2-4 geschlossen
Tab. 10: LVDS STROBE EDGE MODE, Stiftleiste J12
4.3.3.4 BIOS WRITE PROTECT
FUNKTION
Normal MODE
write protected
DEFAULT EINSTELLUNG
X
PIN9-11 geschlossen
Tab.11: BIOS WRITE PROTECT, Stiftleiste J12
4.3.4 Jumperfeld CN1
Ein Teil dieses Jumperfeldes [siehe Kap.Fehler! Verweisquelle konnte nicht
gefunden werden.] wird für die
Anschlüsse des Soundbausteines verwendet.
4.3.4.1 POWER-BUTTON KOPIE
parallel hierzu ist Platinenschalter S4 geschaltet [siehe Kap.:4.2 ]
Dieser Jumper ist für einen externen Resetschalter an Gehäuse vorgesehen.
SIGNAL
STIFTLEISTE und PIN
POW1
CN1 PIN1
GND
CN1 PIN2
Tab. 11: POWER-BUTTON KOPIE, Stiftleiste CN1
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4.3.4.2 SYSTEMLAUTSPRECHER
SIGNAL
SPEAKER
+5V
STIFTLEISTE und PIN
CN1 PIN5
CN1 PIN7
Tab. 12: SYSTEMLAUTSPRECHER, Stiftleiste CN1
4.3.4.3 RESET KOPIE
parallel hierzu ist Platinenschalter S5 geschaltet [siehe Kap.:4.2 ]
Dieser Jumper ist für einen externen Resetschalter an Gehäuse vorgesehen.
SIGNAL
STIFTLEISTE und PIN
RESET
CN1 PIN6
GND
CN1 PIN4
Tab. 13: RESET KOPIE, Stiftleiste CN1
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5.Sicherheitsrelevante Eigenschaften
4.4 LÖTBRÜCKEN (LB)
4.4.1 LB63 TOUCHSCREEN an COM1 oder COM2
2 polig; diese Funktion muss mit einer anderen Funktion zusammen
konfiguriert werden siehe auch Kap.:4.3.3.1 ]
FUNKTION
DEFAULT EINSTELLUNG
Touchscreen an COM1
X
LB63, J12 PIN1-2 geschlossen;
LB64,LB65 offen
Touchscreen an COM2
LB63, J12 PIN1-2 offen
LB64,LB65 geschlossen
-Leiterbahn muss aufgetrennt werden!!! daher
nur Vorkonfiguration
durch KWS
Tab. 14: LB63:TOUCHSCREEN oder COM1
4.4.2 LB66,LB68 TOUCHSCREEN-TYPE
jeweils 2 polig, es sind 4-Draht, 5-Draht und 8-Draht Touchscreens .
[siehe Kap.:4.2 ]
FUNKTIO
N
4-Draht
5-Draht
8-Draht
DEFAULT
X
EINSTELLUNG
LB66 geschlossen, LB68 offen
LB66 und LB68 offen
LB66 und LB68 geschlossen
Tab. 15: LB66,LB68:TOUCHSCREEN-TYPE
4.4.3 LB87,LB88,LB89 5-DRAHT TOUCH-TYPE
jeweils 3 polig, es sind Touchscreens der Firmen ELO und Microtouch
einsetzbar [siehe Kap.:4.2 ].
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FUNKTION
ELO
MICROTOUCH
DEFAULT EINSTELLUNG
X
PIN1-2 geschlossen
PIN2-3 geschlossen
Tab. 16: LB87,LB88,LB89: 5-DRAHT TOUCH-TYPE
4.4.4 LB19 LCD-PANEL Voltage !!!
3 polig,
Option: PANEL-Voltage (bitte bei KWS anfragen )
FUNKTION
DEFAULT EINSTELLUNG
Keine Spannung
X
alle offen
+3,3V
PIN1-2 geschlossen
+5V
PIN2-3 geschlossen
Tab. 17: LB19: LCD-PANEL Voltage
Wird das System ohne vom Kunden gewünschte Konfiguration
für ein spezielles LCD-Panel ausgeliefert, so liegt keine Spannungversorgung an CON1 an.
4.4.5 LB3,LB4 PANEL-Voltage Pinbelegung CON1 !!!
je 3 polig
PANEL-Voltage an Anschluß CON1 [siehe Kap.:x] als variable Pinbelegung
FUNKTION
DEFAULT EINSTELLUNG
Keine Spannung (N.C.)
X
alle offen
PANEL-Voltage
LB3,LB4
durch LB19 eingestellt
PIN1-2 geschlossen
[siehe Kap.:4.4.4]
GND
LB3,LB4
PIN2-3 geschlossen
Tab. 18: LB3,LB4: PANEL-Voltage Pinbelegung CON1
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4.4.6 LB13 BACKLIGHT Voltage !!!
3 polig,
Option: BACKLIGHT Voltage (bitte bei KWS anfragen )
[siehe Kap.:6.25]
FUNKTION
DEFAULT EINSTELLUNG
+12V
X
PIN1-2 geschlossen
+5V
PIN2-3 geschlossen
Tab. 19: LB13: BACKLIGHT Voltage
4.4.7 LB11,LB12,LB14,LB15,LB18 CAN Interrupt
je 2 polig,
Option: CAN Interrupt (bitte bei KWS anfragen )
[siehe Kap.:Fehler! Verweisquelle konnte nicht gefunden werden.,
Kap.:Fehler! Verweisquelle konnte nicht gefunden werden.]
FUNKTION
DEFAULT EINSTELLUNG
IRQ 5
LB11 geschlossen
IRQ 7
LB12 geschlossen
IRQ 10
X
LB14 geschlossen
IRQ 11
LB15 geschlossen
IRQ 15
LB18 geschlossen
Tab. 20: LB11,LB12,LB14,LB15,LB18: CAN Interrupt
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5 SICHERHEITSRELEVANTE
EIGENSCHAFTEN
5.1 Spannungsüberwachung
5.2 Watchdog (option)
Programmierung siehe [x],
5.3 Temperaturüberwachung
5.4 System Shutdown bei Temperaturüberschreitung
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6.Schnittstellen
6 Schnittstellen und Stecker
6.1 USB ANSCHLÜSSE
Connector: Buchse Standard „Series A“
jeder Anschluß bietet bis 0,5A und eine Overcurrentprotection.
Der Panel NX verfügt über
2 x USB 2.0 / 1.1 intern
3 x USB 2.0 / 1.1 intern
Der IPC NX verfügt über
6.1.1 CON1 (USB0) extern
ist als Legacy USB Device für die Tastatur reserviert,
bei Panel NX und IPC NX vorhanden
ist als Legacy USB Device für die Mouse reserviert
bei Panel NX und IPC NX vorhanden
nur beim IPC NX vorhanden
6.1.4 ETHERNET-1 Anschluß CON4 extern
RJ45, Standard IEEE 802.3
100BASE-TX – 100Mbits/s Twisted Pair Ethernet
10BASE
– 10Mbits/s Twisted Pair Ethernet
PHY: RTL8201CL-LF
Controller: SiS 900 Fast Ethernet Adapter
siehe CON38
bei IPC NX vorhanden
bei Panel NX als Option CON38 vorhanden
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6.Schnittstellen
6.1.5 ETHERNET-2 Anschluß CON5 extern
RJ45, Standard IEEE 802.3
100BASE-TX – 100Mbits/s Twisted Pair Ethernet
10BASE
– 10Mbits/s Twisted Pair Ethernet
Controller: Intel 82551ER Fast Ethernet Adapter
bei IPC NX vorhanden
6.1.6 +24V-POWER Anschluß CON6 extern
für Netzteil +24V DC ±25%
Connector auf Board:
Phoenix Contact:
3pol. Mini Combicon 90°
MC 1,5/ 3-GF-3,81
PIN
SIGNAL
1
CHGND (SCHIRM)
2
+24V DC ±25%
3
GND
Tab. 21: +24V-POWER Anschluß CON6
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6.2 LCD ANSCHLUß (TTL) CON7 intern
SIGNAL
GND
HS
GND
R1
R3
R5
G0
G2
G4
GND
B1
B3
B5
ENAB
PANEL-Voltage*
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
PIN
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
PANEL-Voltage**
or GND (LB4)
N.C.
31
32
SIGNAL
DOTCLK
VS
R0
R2
R4
GND
G1
G3
G5
B0
B2
B4
GND
PANEL-Voltage*
PANEL-Voltage**
or GND (LB3)
N.C.
33
34
über 4,7 K Pullup an
PANEL-Voltage*
Tab. 22: PANEL Anschluß CON7 (34pol. Wanne)
N.C. - nicht verbunden
*DEFAULT: Nicht verbunden (N.C.) [siehe Kap.:x]
**DEFAULT: Nicht verbunden (N.C.) [siehe Kap.:x]
Die PANEL-Voltage wird durch LB19 [siehe Kap.:x] eingestellt.
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6.3 SERIELLE SCHNITTSTELLE COM1 (CON8) extern
Der Touchscreen ist beim Panel NX standardmässig mit COM1 verbunden, d.h.
COM1 ist per DEFAULT nicht verfügbar.
Anschluß CON8 als 9poliger Standard DSUB
Norm EIA: RS232C
PIN SIGNAL
1
DCD
2
RxD
3
TxD
4
DTR
5
GND
6
DSR
7
RTS
8
CTS
9
RI
Tab. 23: COM1 als DSUB Anschluß CON8
RJ12-Buchse
PIN
1
2
3
4
5
6
SIGNAL
RTS
TxD
GND
GND
RxD
CTS
Tab. 24: COM2 Anschluß CON9
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RJ12-Buchse
als USB-UART FT232BL
PIN
1
2
3
4
5
6
SIGNAL
RTS
TxD
GND
GND
RxD
CTS
RJ12-Buchse
als USB-UART FT232BL
PIN
1
2
3
4
5
6
SIGNAL
RTS
TxD
GND
GND
RxD
CTS
6.7 LPC SCHNITTSTELLE CON12 intern
LPC = Low Pin Count Bus (Ersatz für ISA)
14 pol. Buchsenleiste RM2.54 für Stiftdurchmesser 0.63
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6.8 SPDIF/CDIN SCHNITTSTELLE CON13 intern
8pol. 2reihige Stiftl. SMD 180° RM2.54
6.9 HD-Power/I2C SCHNITTSTELLE CON14 intern
6.10 CompactFlash STECKER CON15 (CF0/IDE0)
Primary Master [LBxx siehe Kap.:x]
Standard [siehe Kap.:x]
True IDE-Mode
Bootverhalten
6.11 CompactFlash STECKER CON16 (CF1/IDE1)
Primary Slave [LBxx siehe Kap.:x]
True IDE-Mode
Bootverhalten
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6.12 IDE ANSCHLUß CON17 (2,5“ Festplatten,2mm Raster)
SIGNAL
RESET
DATA7
DATA6
DATA5
DATA4
DATA3
DATA2
DATA1
DATA 0
GND
DDREQ0
(DDREQ1)
IOW#
IOR#
IORDY
DDACK0#
(DDACK1#)
DIRQ14
(DIRQ15)
ADR1
ADR0
CS1P# (CS1S#)
HDACT#
+5V (Logic)
GND
PIN
1
3
5
7
9
11
13
15
17
19
21
PIN
2
4
6
8
10
12
14
16
18
20
22
SIGNAL
GND
DATA8
DATA9
DATA10
DATA11
DATA12
DATA13
DATA14
DATA15
23
25
27
29
24
26
28
30
GND
GND
SPSYNC
GND
31
32
IOCS16#
33
35
37
39
41
43
34
36
38
40
42
44
ADR2
CS3P# (CS3S#)
GND
+5V (Motor)
N.C.
GND
Tab. 27: IDE Anschluß CON17 (2mm Raster)
Der Onboard HDD-Stecker CON17 ist der secundary IDE [siehe Kap.x]
Die Spannungs-versorgung der Festplatte, auch einer 3,5“ Platte oder eines
CDROM-Laufwerkes kann über den Anschluß CON14 [siehe Kap.:x] erfolgen
Master-Slave Einstellungen werden an den Laufwerken eingestellt.
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6.13 SOUND LINE-OUT Anschluß CON18
Connector auf Board: Standard 3,5mm Klinkenbuchse
1
2
PIN
1.Tip
2.Ring
3.Sleeve
3
(Stecker vorne)
(Stecker mitte)
SIGNAL
linker Kanal
rechter Kanal
GND
(Stecker hinten, Schaft)
Tab. 28: SOUND LINE-OUT Anschluß CON18
Die SOUND Signale liegen auch alle am alternativen Stecker CON39.
6.14 SOUND MIC Anschluß CON19
Mikrofonanschluß
geht an AC97 Soundcontroller
1
2
PIN
1.Tip
2.Ring
3.Sleeve
(Stecker vorne)
(Stecker mitte)
3
SIGNAL
MIC
+Vref (Versorgungsspannung)
(MIC) GND
Tab. 29: SOUND MIC Anschluß CON19
Die SOUND Signale liegen auch alle am Flexkabelstecker CON39.
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6.15 SOUND LINE-IN Anschluß CON20
1
2
PIN
1.Tip
2.Ring
3.Sleeve
3
(Stecker vorne)
(Stecker mitte)
SIGNAL
linker Kanal
rechter Kanal
GND
Tab. 30: SOUND LINE-IN Anschluß CON20
Die SOUND Signale liegen auch alle am Flexkabelstecker CON39.
6.16 Digitale I/O Anschluß CON21
8 digitale Ein/Ausgänge (DI/O)
TTL-Level, xmA, nicht kurzschlussfest
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6.17 PS/2 TASTATUR ANSCHLUß CON22
6.18 PS/2 MAUS ANSCHLUß CON23
6.19 USB3/USB4 ANSCHLUß CON24
6.20 VIDEO ANSCHLUß CON26
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6.21 serial ATA-1 ANSCHLUß CON27
6.22 serial ATA-2 ANSCHLUß CON28
6.23 PARALLELE SCHNITTSTELLE CON32
SIGNAL
STROB#
PPD0
PPD1
PPD2
PPD3
PPD4
PPD5
PPD6
PPD7
ACK#
BUSY
PE
SELECT
PIN
1
3
5
7
9
11
13
15
17
19
21
23
25
PIN
2
4
6
8
10
12
14
16
18
20
22
24
26
SIGNAL
AUTO FEED#
ERROR#
INIT#
SLCT IN#
GND
GND
GND
GND
GND
GND
GND
GND
N.C.
Tabelle 31: LPT auf der Platine als Anschluß CON32
N.C. - nicht verbunden
# = Signal ist LOW aktiv.
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6.24 VGA ANSCHLUß CON33
VGA als 15pol. Standard High-Density DSUB-Buchse
PIN SIGNAL
1
ROT
2
GRÜN
3
BLAU
4
N.C.
5
GND
6
GND
7
GND
8
GND
9
N.C.
10
GND
11
N.C.
12
N.C.
13
HSYNC
14
VSYNC
15
N.C.
Tab. 32: VGA 15pol. Standard HD-DSUB Buchse
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6.25 BACKLIGHT CON34
DC
6.26 TOUCHSCREENANSCHLUß CON35
6.27 SYSTEM-CONNECTOR CON36
6.28 CPU Lüfter CON37
6.29 alternativer Ethernet-1 Anschluß CON38
6.30 alternativer Sound Anschluß CON39
6.31 LCD LVDS-T/B Anschluß CON31A
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6.32 LCD LVDS-B second Anschluß CON31B
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7.BIOS
7 BIOS (in englisch)
[3]
7.1 Current BIOS- Version
7.2 Entering BIOS-Setup
During POST, you can start the Setup program in one of two ways:
1. By pressing <Del> immediately after the following message appears briefly
at the top of the screen during POST:
PRESS <DEL> TO ENTER SETUP
2. By pressing <S> after the following message appears:
no bootable device available.
R
REBOOT
S
SETUP
ESC BIOS DEBUGGER
If the message disappears before you respond and you still wish to enter Setup,
restart the system to try again by turning it OFF then ON.
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7.3 PC BIOS Features
EMBEDDED BIOS provides a comprehensive Power-On Self-Test (POST)
algorithm that is automatically configured for the peripherals and capabilities
selected by the adaptation engineer.
During POST, hardware is initialized and tested, including the CPU, RAM, and
peripherals. POST provides “beep code” diagnostics for errors when a display
is not available, as well as error message diagnostics on the display when
available. POST can also be configured to output status report codes to a
manufacturing port (typically, port 80h) so that automated Q/A
equipment can determine the status of a system during POST. A special set of
ASCII POST status codes are also available through a serial port, for flexibility
in the debugging process when new hardware is being brought up. Either POST
code system, or both, can be used during debugging.
The EMBEDDED BIOS SETUP screen system is configurable at the source
level by the adaptation engineer to contain any combination of subscreens,
including Basic CMOS Configuration, Custom Configuration, Shadow
Configuration, Diagnostics screens, Manufacturing Mode, Debugger access,
and formatting of drive emulators such as RAM and RFD drives. SETUP
screens can also be customized at the source level (in the Board Personality
Module) to contain custom fields as required by the application.
Also available is a password protection system, so that a password must be
provided by the enduser before POST allows booting of an operating system.
The password is stored in CMOS, is one-way encrypted, and can be modified in
a Setup screen. The ability to shadow slower ROM devices with DRAM or
SRAM is selectable in the Shadow Setup screen and calls chipset-specific code
to enable shadowing for the BIOS ROM itself or for feature ROMs on a 16KB
region basis. DRAM may take the form of FP, EDO, SDRAM,
RDRAM, or other technologies.
EMBEDDED BIOS provides extensive support for both internal CPU cache
control (i486 and above) and external cache control (typically chipsetcontrolled). Internal cache is managed by the CPU class personality modules,
whereas external cache is managed by the cache manager, which
directs peripherals (chipset, 8042, custom I/O ports, or CPU integrated
peripherals) to manage the cache. Keyboard controls on the PC/AT keyboard
are implemented for enabling and disabling the cache on-the-fly (while the
system is running). The BIOS provides cache control services to applications
that allow operating systems and user code to control and inspect the status of
the cache. CPU speed controls are handled by the system BIOS by routing
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control through the appropriate logic (chipset, 8042, custom I/O ports, or CPU
integrated peripherals). As with cache control,
CPU speed is controllable on-the-fly at the keyboard or via programming
interfaces.
7.4 Software Compatibility
EMBEDDED BIOS offers a high degree of compatibility with past and current
BIOS standards, allowing it to run off-the-shelf operating system software and
application software. EMBEDDED BIOS has been tested with all industry
standard operating systems, including versions of Windows, Linux, DOS, and
real time operating systems.
EMBEDDED BIOS is rigorously tested with programs such as AMI Diag,
MSD, Check-It, Manifest, Q/A Plus, and so on, ensuring its compatibility with
established desktop application standards.
In addition to its standard data structures and programming interfaces,
EMBEDDED BIOS provides support for industry-standard initiatives,
including ACPI, APM, El Torito, Legacy USB, MP, PCI, PMM, PXE, and
SMBIOS (formerly DMI).
7.5 POWER ON SELF TEST
When the your development platform is powered on, Embedded BIOS tests and
initializes the hardware and programs the chipset and other peripheral
components. During this time, Power On Self Test (POST) progress codes are
written by the system BIOS to I/O port 80h, allowing the user to monitor the
progress with a special monitor. Kap.11.3 lists the POST codes and their
meanings.
During early POST, no video is available to display error messages should a
critical error be encountered; therefore, POST uses beeps [Kap.0] on the
speaker to indicate the failure of a critical system component during this time.
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7.6 The BIOS User Interface
When a keyboard and video device are attached, the BIOS can display either a
traditional character-based PC BIOS display with memory count-up, or it can
display a graphical POST with splash screen and progress icons. Both POST
displays accept a <DEL> key press to enter the setup screen, and both display
boot-time progress activity displays. The graphical display shows the status of
file system devices and even OEM-defined devices (when the OEM adapts the
BIOS to a particular OEM platform), but omits character-based PCI resource
display. The text-based POST displays the memory count-up and the PCI
resource assignment table.
Figure 1 shows the format of the text-based POST display. The display is very
similar if console redirection through a COM port is used instead.
Fig. 1. The text-based BIOS POST
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Figure 2 shows the graphical version of POST. The BIOS decompresses the
main image, and can display multiple overlaid graphics at various points in
POST. The OEM can define the entire sequence and control the timing of the
system for an embedded application, and can arrange to have different graphics
displayed on each successive boot of the system. This feature is ideal for
embedded systems that must show evidence of operation during startup, while
the application loads underneath the splash screen. Once the application begins
writing to the screen, the splash screen relinquishes control, providing a
seamless graphical progression for the end user.
Fig. 2. The graphical POST
When the SYSTEM is powered on for the first time, you’ll need to configure
the system through the Setup Screen System (described later) before
peripherals, such as disk drives, are recognized by the BIOS. The information is
written to battery-backed CMOS RAM on the board’s Real
Time Clock. Should the board’s battery fail, this information will be lost and
the board will need to be reconfigured.
The SYSTEM’s Basic Setup Screen provides an option to disable the graphical
POST and switch to the legacy text-based version. This feature may not
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permanently disable the graphical POST if the BIOS adaptation calls for
reverting to the graphical form after so many boots. If you find that
the graphical POST comes back after several boots, it is because this option is
enabled for this platform.
7.7 SETUP SCREEN SYSTEM
The SYSTEM is configured from within the Setup Screen System, a series of
menus that can be invoked from POST by pressing the <DEL> key if the main
keyboard is being used, or by pressing Ctrl C (^C) if the console is being
redirected to a terminal program.
Fig. 3. The System BIOS Setup Screen Menu
Once in the Setup Screen System (Fig. 3), the user can navigate with the UP
and DOWN arrow keys from the main console or use the Ctrl E (^E) and Ctrl X
(^X) keys from the remote terminal program to accomplish the same thing.
TAB and ENTER are used to advance to the next field, and ‘+’ and ‘-’ keys
cycle through values, such as those in the Basic Setup Screen or the
Diagnostics Setup Screen.
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7.8 Basic CMOS Configuration Screen
The SYSTEM’s drive types, boot activities, and POST optimizations are
configured from the Basic Setup Screen (Fig. 4). In order to use disk drives
with your system, you must select appropriate assignments of drive types in the
left-hand column. Then, if you are using true floppy and IDE drives (not
memory disks that emulate these drives), you need to configure the
drive types themselves in the Floppy Drive Types and IDE Drive Geometry
sections. Finally, you’ll need to configure the boot sequence in the middle of
the screen. Once these selections have been made, your system is ready to use.
Fig. 4. The Basic CMOS Configuration
7.8.1 Configuring Drive Assignments
Embedded BIOS allows the user to map a different file system to each drive
letter. The BIOS allows file systems for each IDE drive (Ide0, Ide1, Ide2, and
Ide3), and memory disks when configured (Flash0, ROM0, RAM0, etc.).
Figure 5 shows how the first IDE drive (Ide0) is assigned to drive C: in the
system.
To switch two hard disks around, just map map Ide0 to D: and Ide1 to C:.
Caution: Take care to not skip drive C: when making hard disk assignments.
The first hard drive should be C:. Also, do not assign the same file system to
more than one drive letter.. The BIOS permits this to allow embedded devices
to alias drives, but desktop operating systems may not be able to maintain
cache coherency with such a mapping in place. A special field in this section
entitled “Boot Method: (Windows CE/Boot Sector)” is used to configure the
CE Ready feature of the BIOS. For normal booting (DOS, Windows NT, etc.),
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select “Boot Sector” or “Unused”.
7.9 Configuring Floppy Drive Types
Sorry, no floppy drives are available in this IPC NX System
7.9.1 Configuring IDE Drive Types
If true IDE disk file systems (and not their emulators, such as ROM, RAM, or
Flash disks) are mapped to drive letters, then the IDE drives themselves must
be configured in this section. The
following table shows the drive assignments for Ide0-Ide3:
File System Name Controller Master/Slave
Ide0
Primary (1f0h) Master
Ide1
Primary (1f0h) Slave
Ide2
Secondary (170h) Master ->CompactFlash [Kap.6.10]
Ide3
Secondary (170h) Slave -> NOT AVAILABLE
To use the primary master IDE drive in your system (the typical case), just
configure Ide0 in this section, and map Ide0 to drive C: in the Configuring
Drive Assignments section.The IDE Drive Types section lets you select the
type for each of the four IDE drives: None, User, Physical, LBA, or CHS.
The User type allows the user to select the maximum cylinders, heads, and
sectors per track associated with the IDE drive. This method is now rarely used
since LBA is now in common use.
The Physical type instructs the BIOS to query the drive’s geometry from the
controller on each POST. No translation on the drive’s geometry is performed,
so this type is limited to drives of 512MB or less. Commonly, this is used with
embedded ATA PC Cards and CF-Cards [Kap.6.10].
The LBA type instructs the BIOS to query the drive’s geometry from the
controller on each POST, but then translate the geometry according to the
industry-standard LBA convention. This supports up to 128GB drives. Use this
method for all new drives.
The CHS type instructs the BIOS to query the drive’s geometry from the
controller on each POST, but then translate the geometry according to the
Phoenix CHS convention. Using this type on a drive previously formatted with
LBA or Physical geometry might show data as being missing or corrupted.
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EMBEDDED BIOS supports user-defined steps in the boot sequence. When the
entire system has been initialized, POST executes these steps in order until an
operating system successfully loads. In addition, other pre-boot features can be
run before, after, or between operating system load attempts.
The following actions are supported:
Drive A: - D: Boot operating system from specified drive. If “Loader” is set to
“BootRecord” or “Unused”, then the standard boot record will be
invoked, causing DOS, Windows95, Windows 98, Windows ME,
Windows 2000, Windows NT, Windows XP, Linux, or other industrystandard
operating systems to load. If “Boot Method” is set to “Windows
CE“, then the boot drive’s boot record will not be used, and instead the
BIOS will attempt to load and execute the Windows CE Kernel file,
NK.BIN, from the root directory of each boot device.
CDROM: Boot from the first IDE CDROM found that contains an El Torito
bootable CDROM.
Debugger: Launch the Integrated BIOS Debugger. To return exit the debugger
environment, type “G” at the debugger prompt and press ENTER.
MFGMODE: Initiate Manufacturing Mode, allowing the system to be
configured remotely via an RS232 connect to a host computer.
WindowsCE: Execute a ROM-resident copy of Windows CE, if available.
This feature is not applicable unless configured by the OEM in the BIOS
adaptation.
DOS in ROM: Execute a ROM-resident copy of DOS, if available. This
feature is not applicable unless an XIP copy of DOS has been stored in the
BIOS boot
ROM.
Alarm: Generate an alarm by beeping the speaker and sending a signal to a
Firmware Application running in the Firmbase environment. The
application can perform whatever processing is necessary to handle the
alarm, including taking local action, interacting with other tightly-coupled
computers, or even notifying other systems on the network, for example.
These applications are beyond the scope of the EMBEDDED BIOS
Adaptation Kit.
Maintenance: Enter maintenance mode by sending a signal to a Firmware
Application running in the Firmbase environment. The application can perform
whatever processing is necessary to implement the maintenance mode,
which is largely defined to mean some state where the system is capable of
being diagnosed and/or repaired in the field. These applications are
beyond the scope of the EMBEDDED BIOS Adaptation Kit.
RAS: Enter remote access mode by sending a signal to a Firmware Application
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running in the Firmbase environment. The application can perform
whatever processing is necessary to implement the RAS mode, which is
largely defined to mean some state where the system accepts remote
connections for normal operation; not specifically for field maintenance.
These applications are beyond the scope of the EMBEDDED BIOS
Adaptation Kit.
Power Off: Cause the System to switch off its power with a “soft off” feature,
and signal Firmware Applications running in the Firmbase environment that
power is going down. These applications are beyond the scope of the
EMBEDDED BIOS Adaptation Kit.
Reboot: Reboot the System, and send a signal to a Firmware Application
running in the Firmbase environment indicating that the System is rebooting.
These applications are beyond the scope of the EMBEDDED BIOS Adaptation
Kit.
CLI: Enter command line mode by calling a special Board Module Function
(BoardPostControl) that can be used to implement an OEM-defined
Command Language Interpreter. The design of such an interpreter is
beyond the scope of the EMBEDDED BIOS Adaptation Kit.
None: No action; POST proceeds to the next activity in the sequence.
7.10 Custom Configuration Setup Screen
The SYSTEM’s hardware-specific features are configured with the Custom
Setup Screen .
7.11 Shadow Configuration Setup Screen
The SYSTEM’s Shadow Configuration Setup Screen (Fig. 6) allows the
selective enabling and disabling of shadowing in 16KB sections, except for the
top 64KB of the BIOS ROM, which is shadowed as a unit. Normally,
shadowing should be enabled at C000/C400 (to enhance VGA
ROM BIOS performance) and then E000-F000 should be shadowed to
maximize system ROM BIOS performance.
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7.12 Start System BIOS Debugger Setup Screen
The Embedded BIOS Integrated Debugger may be invoked from the Setup
Screen main menu, as well as a boot activity. Once invoked, the debugger will
display the debugger prompt:
EBDEBUG:
and await debugger commands. To resume back to the Setup Screen main
menu, type the following command, which instructs the debugger to “go”:
EBDEBUG: G (ENTER)
7.13 MANUFACTURING MODE
7.13.1 Start RS232 Manufacturing Link Setup Screen
The Embedded BIOS Manufacturing Mode may be invoked from the Setup
Screen main menu, as well as a boot activity. Once invoked, Manufacturing
Mode takes over the system and freezes the system console (Fig. 8). The host
can resume operation of the system and give control back
to the SYSTEM Setup Screen system with special control software.
Fig. 5. Manufacturing Link Setup Screen
The SYSTEM’s BIOS may provide a special mode, called Manufacturing
Mode, that allows the SYSTEM to be controlled by a host computer such as a
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laptop or desktop PC. Running special software supplied by General Software,
the host can access the SYSTEM’s drives and manage the file systems on the
SYSTEM, reprogram Flash memories, and test the SYSTEM hardware.
There are several methods by which the SYSTEM can enter Manufacturing
Mode. These methods are detailed elsewhere in this manual and others.
Once the SYSTEM has entered Manufacturing Mode, the host PC may cause
the System to perform functions by issuing commands in protocol over the RS232 connection. There are two ways to access the System from the host PC.
7.13.2 Sample Manufacturing Mode HOST Program
The first way is to run a program that accesses the host-side Manufacturing
Mode functions. An example of such a program is HOST.EXE, which can be
obtained from General Software. This program runs under DOS and, using a
full-screen windowing interface, illustrates the basic functionality of the
Manufacturing Mode protocol. It should be noted that this program is a
working example program, and is not intended to be a production-quality
control tool. Run the HOST program on a “host” computer, so that its main
menu is displayed. By default HOST connects via COM1 (3F8h). The default
baud rate is set to “auto,” meaning it will use whatever baud rate the SYSTEM
is set to. You can change both of these by using command line
switches. Type “HOST /?” for the available switches.
On the host, select GET SYSTEM ATTENTION, within a couple seconds of
selecting the manufacturing mode on the SYSTEM. You should see the host
program immediately display a yellow status box that shows that the
connection has been established.
If the connection hasn’t been established, then try the connection again on the
host side, or reboot the SYSTEM and try again, this time having the host
program get the SYSTEM’s attention within two seconds or so of the
SYSTEM’s entering of manufacturing mode. If this still
fails, check that your null modem serial cable is connected securely to the
proper ports. You may also want to lower the baud rate for the manufacturing
mode on the SYSTEM, since a higher baud rate may be more error prone.
Once you have established a connection, you can use HOST to test the link by
continuously exercising it, or scanning the SYSTEM’s drives, or uploading
files in Flash, and more.
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7.13.3 Manufacturing Mode Drive Redirection
The second way to access the SYSTEM through Manufacturing Mode is to
install the MFGDRV.SYS device driver on the host system. This device driver
loads under MS-DOS and Windows 98 DOS mode, and maps a new drive letter
on the host to a drive on the SYSTEM.
Unfortunately it is a DOS-only driver, and will not operate under Windows, not
even in a Windows DOS box. Nor do we have a Linux version available at this
time. The INT 13h redirection support in the Manufacturing Mode protocol can
be exposed by loading the MFGDRV.SYS device driver on the host by using the
following CONFIG.SYS line:
DEVICE=MFGDRV.SYS /BAUD=rate /PORT=COMn /UNIT=u /AUTO
This device driver runs under any DOS-compatible operating system, and
creates a drive letter on your host PC (usually D: if your last hard drive is C:)
that can be used to interact with the specified INT 13h unit.
The u parameter specifies the BIOS unit number of the floppy disk, RAM disk,
RFD drive, or ROM disk to be redirected, where 0 corresponds to drive A: and
1 for drive B. By default, this value is 80 (a hex number without a “0x” in front
or ‘h’ appended to it), which corresponds with the unit for the first hard drive or
emulator.
The /BAUD=rate parameter can be used to match the baud rate used by the
System’s BIOS. Legal values are 19K, 28K, 38K, 56K, and 115K. If this
parameter is not specified, then the baud rate is autodetected.
The /AUTO parameter, if specified, tells MFGDRV.SYS to automatically format
the remote drive if it determines that it is unformatted. By default,
MFGDRV.SYS will not automatically format the remote drive, and will instead
examine the media for a pre-existing format. If not found, then
MFGDRV.SYS asks the host PC operator if the remote drive should be
formatted.
Once the connection is established, you can read and write the SYSTEM’s
drive as if it were simply another drive on your host system. The only
difference is that it will be a bit slower over the serial connection.
IMPORTANT: MFGDRV.SYS assumes that other software does not
reprogram the COM port being used on the host for its purposes, and that it has
exclusive access to it. If you run other software, such as terminal emulation
programs, they may disable the COM port UART, causing MFGDRV.SYS to
appear to stop working. It is best to avoid running such software on the host
when MFGDRV.SYS is loaded. Note: HOST.EXE is an example of such a
program, since it takes over the UART for its own purposes. If you run
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7.BIOS
HOST.EXE when MFGDRV.SYS is loaded, you must reboot the host PC for
the MFGDRV.SYS driver to reestablish its control over the UART.
A full discussion of the uses of Manufacturing Mode is beyond the scope of
this manual. Complete documentation and host-side software is available
directly from General Software. For more information, visit the General
Software web site at www.gensw.com.
7.14 CONSOLE REDIRECTION
The SYSTEM can operate either with a standard PC/AT or PS/2 keyboard and
VGA video monitor, or with a special emulation of a console over an RS232
cable connected to a host computer running a terminal program. To see an
example session with HYPERTERMINAL, see the debugger section’s screen
display.
To use the Console Redirection feature, simply remove the video display card
from the system so that no video ROM is available for the BIOS to detect. In
the absence of any video support, the BIOS automatically switches its keyboard
and screen functions to serial I/O over COM1 on the
board. The hardware connection to the host computer requires a null modem
cable.
The software on the SYSTEM can be any terminal emulation program that
supports ANSI terminal mode, using 9600 baud, no parity, and one stop bit
(Note: This can be modified by the OEM during BIOS adaptation.) The
program must be set to not use flow control, or the console
may seem to stall or not accept input.
Caution: HYPERTERMINAL’s default setting is to use flow control, which
will render the console inoperative. To change this, create a new session,
change the flow control setting to “none”, save the session, and exit
HYPERTERMINAL. Then reinvoke HYPERTERMINAL with the session and
it will operate with the new flow control setting.
7.15 CE-READY—WINDOWS CE LOADER
Your SYSTEM’s BIOS is “CE-Ready” and can directly boot Windows CE
without loading an intermediate operating system such as DOS and
LOADCEPC. Instead, the NK.BIN file can be placed on a disk drive or drive
emulator, and then the BIOS can be configured through the Basic
CMOS Configuration Setup Screen to boot the NK.BIN file from the boot
drives instead of the boot records on those drives.
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7.BIOS
To configure your system to boot Windows CE natively from a disk drive, set
the “Boot Method” field to “Windows CE” in the Basic CMOS Configuration
Setup Screen. Then, place a copy of NK.BIN suitable for execution by
LOADCEPC in the root directory of your normal boot drive, such as drive C:.
Then, reboot the system. The configuration box should be displayed
(Fig. 9) followed by the message “Loading Windows CE…” This indicates that
the loading process is continuing. Once fully loaded, Windows CE takes over
the system and runs using the standard PC keyboard, screen, and PS/2 mouse.
Fig. 6. The CE-Ready feature
7.16 INTEGRATED BIOS DEBUGGER
The SYSTEM’s BIOS contains a built-in debugger that can be a valuable tool
to aid the board bring-up process on new designs similar to the reference board.
It supports a DOS SYMDEBstyle command line interface, and can be used on
the main console’s keyboard and screen, or over a redirected connection to a
terminal program (see Console Redirection, above).
To activate the debugger at any time from the main console, press the left shift
and the control keys together. A display similar to the one in the
HYPERTERMINAL session below (Fig. 7)
will appear, containing the title, “Embedded BIOS Debugger Breakpoint Trap”
and a snapshot of the CPU general registers.
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7.BIOS
Fig. 7. The Integrated BIOS Debugger
To leave the debugger and resume the interrupted activity (whether POST,
BIOS, DOS, Windows, or an application program), enter the “G” command
(short for “go”) and press ENTER. If you were at a DOS prompt when you
entered the debugger, then DOS will still be waiting for its command, and will
not prompt again until you press ENTER again.
The debugger can also be entered from the Setup Screen System, and as a boot
activity (see Basic CMOS Setup Screen), as a last ditch effort during board
bring-up and development if no bootable device is available.
If your version of DOS, an application, or any OEM-supplied BIOS extensions
have debugging code (i.e., “INT 3” instructions) remaining, then these will
invoke the debugger automatically, although this is not an error. To continue,
use the “G” command. When Embedded BIOS is adapted by the OEM, the
debugger can be removed from the final production BIOS, and superfluous
debugging code in the application will not cause the debugger to be invoked.
A complete discussion of the debugger is beyond the scope of this chapter;
however, complete documentation is available from General Software.
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9.Fehlersuche
8 Betriebssysteme
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80
9.Fehlersuche
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9.Fehlersuche
9 Programmiermodell
Zusätzlich zu den PC-Standardregistern [siehe Kap.:13.1.1]
9.1 Digitale I/O-relevante Register
8 digitale Eingänge und 8 digitale Ausgänge (DI/O)
9.1.1 IN Port Register
8-Bit Register im I/O-Bereich
9.1.2 OUT Port Register
8-Bit Register im I/O-Bereich
9.1.3 Zugriff Digitale I/O-relevante Register
9.2 System-Managment-Bus
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9.Fehlersuche
10 Power Managment
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9.Fehlersuche
11 Fehlersuche
11.1 BIOS-Console redirection through a COM port
The BIOS can use the standard keyboard and video device, or use console
redirection to demonstrate headless operation. For headless operation, remove
the standard keyboard and screen devices and the system will boot unattended.
If an RS232 cable is attached to COM1, a PC/AT-style character-based POST
is available from HyperTerminal, PROCOMM, or any otherterminal emulator
software that supports VT100 emulation.
11.2 CRITICAL ERROR BEEP CODES (in englisch)
During the power-on self test (POST), the BIOS sounds a beep code when it
detects a error. Embedded BIOS tests much of the hardware early in POST
before messages can be displayed on the screen. When system failures are
encountered at these early stages, POST uses beep codes, a sequence of tones
on the speaker [Kap.: 4.3.4.2], to identify the source of the error. The following
is a comprehensive list of POST beep codes for the system BIOS.
Count
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Description of Problem
Memory refresh is not working.
Parity error found in 1st 64KB of memory.
Memory test of 1st 64KB failed.
T1 timer test failed.
CPU test failed.
Gate A20 test failed.
DMA page/base register test failed.
Video controller test failed.
Keyboard test failed.
CMOS shutdown register test failed.
External cache test failed.
General board initialization failed.
Exhaustive low memory test failed.
Exhaustive extended memory test failed.
CMOS restart byte test failed.
Address line test failed.
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17
18
1
9.Fehlersuche
Data line test failed.
Interrupt controller test failed.
Incorrect password used to access SETUP.
11.3 BIOS POSTCODES (in englisch)
Diese Daten werden während des Hochfahrens
auf die I/O-Adresse 80 geschieben.
Zur Auswertung benötigt man ein spezielles Diagnoseboard
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0ah
0bh
0ch
0dh
0eh
0fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1ah
1bh
84
Start POST (BIOS is executing).
Start CPU register test.
Start power-on delay.
Power-on delay finished.
Keyboard BAT finished.
Disable shadowing & cache.
Compute ROM CRC, wait for KBC.
CRC okay, KBC ready.
Verifying BAT command to KB.
Start KBC command.
Start KBC data.
Start pin 23,24 blocking & unblocking.
Start KBC NOP command.
Test CMOS RAM shutdown register.
Check CMOS checksum.
Initialize CMOS contents.
Initialize CMOS status for date/time.
Disable DMA, PICs.
Disable Port B, video display.
Initialize board, start memory detection.
Start timer tests.
Test 8254 T2, for speaker, port B.
Test 8254 T1, for refresh.
Test 8254 T0, for 18.2Hz.
Start memory refresh.
Test memory refresh.
Test 15usec refresh ON/OFF time.
Test base 64KB memory.
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1ch
20h
21h
22h
23h
24h
25h
26h
27h
28h
29h
2ah
2bh
2ch
2dh
2eh
2fh
30h
31h
32h
33h
34h
35h
36h
37h
38h
39h
3ah
40h
41h
42h
43h
44h
45h
46h
47h
48h
49h
4ah
4bh
9.Fehlersuche
Test data lines.
Test address lines.
Test parity (toggling).
Test Base 64KB memory.
Prepare system for IVT initialization.
Initialize vector table.
Read 8042 for turbo switch setting.
Initialize turbo data.
Modification of IVT.
Video in monochrome mode verified.
Video in color mode verified.
Toggle parity before video ROM test.
Initialize before video ROM check.
Passing control to video ROM.
Control returned from video ROM.
Check for EGA/VGA adapter.
No EGA/VGA found, test video memory.
Scan for video retrace signal.
Primary retrace failed.
Alternate found.
Verify video switches.
Establish display mode.
Initialize ROM BIOS data area.
Set cursor for power-on msg.
Display power-on message.
Save cursor position.
Display BIOS identification string.
Display “Hit <DEL> to ...” message.
Prepare protected mode test.
Prepare descriptor tables.
Enter virtual mode for memory test.
Enable interrupts for diagnostics mode.
Initialize data for memory wrap test.
Test for wrap, find total memory size.
Write extended memory test patterns.
Write conventional memory test patterns.
Find low memory size from patterns.
Find high memory size from patterns.
Verify ROM BIOS data area again.
Check for <DEL> pressed.
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4ch
4dh
4eh
4fh
50h
51h
52h
53h
54h
55h
56h
57h
58h
59h
60h
61h
62h
63h
64h
65h
66h
67h
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8ah
8bh
8ch
8dh
8eh
8fh
90h
91h
86
9.Fehlersuche
Clear extended memory for soft reset.
Save memory size.
Cold boot: Display 1st 64KB memtest.
Cold boot: Test all of low memory.
Adjust memory size for EBDA usage.
Cold boot: Test high memory.
Prepare for shutdown to real mode.
Return to real mode.
Shutdown successful.
Disable A20 line.
Check ROM BIOS data area again.
Check ROM BIOS data area again.
Clear “Hit <DEL>“ message.
Test DMA page register file.
Verify from display memory.
Test DMA0 base register.
Test DMA1 base register.
Checking ROM BIOS data area again.
Checking ROM BIOS data area again.
Program DMA controllers.
Initialize PICs.
Start keyboard test.
Issue KB reset command.
Check for stuck keys.
Initialize circular buffer.
Check for locked keys.
Check for memory size mismatch.
Check for password or bypass setup.
Password accepted.
Entering setup system.
Setup system exited.
Display power-on screen message.
Display “Wait...” message.
Shadow system & video BIOS.
Load standard setup values from CMOS.
Test and initialize mouse.
Test floppy disks.
Configure floppy drives.
Test hard disks.
Configure IDE drives.
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92h
93h
94h
95h
96h
97h
98h
99h
9ah
9bh
9ch
9dh
9eh
9fh
a0h
a1h
a2h
a3h
a4h
a5h
a6h
a7h
a8h
a9h
b0h
00h
b1h
b2h
b3h
9.Fehlersuche
Checking ROM BIOS data area.
Checking ROM BIOS data area.
Set base & extended memory sizes.
Adjust low memory size for EBDA.
Initialize before calling C800h ROM.
Call ROM BIOS extension at C800h.
ROM C800h extension returned.
Configure timer/printer data.
Configure serial port base addresses.
Prepare to initialize coprocessor.
Initialize numeric coprocessor.
Numeric coprocessor initialized.
Check KB settings.
Issue keyboard ID command.
KB ID flag reset.
Test cache memory.
Display soft errors.
Set keyboard typematic rate.
Program memory wait states.
Clear screen.
Enable parity and NMIs.
Initialize before calling ROM at E000h.
Call ROM BIOS extension at E000h.
ROM extension returned.
Display system configuration box.
Call INT 19h bootstrap loader.
Test low memory exhaustively.
Test extended memory exhaustively.
Enumerate PCI busses.
11.4 Touchscreen-controller
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9.Fehlersuche
11.5 COM1 funktioniert nicht
Ist evt. COM1 (oder nur auf Kundenwunsch COM2) durch
J12 PIN1-3 geschlossen als TOUCHSCREEN configuriert
[siehe Kap.:4.3.3.1]
11.6 Intel Boot Agent (in englisch)
Once installed, the Boot Agent product has very few potential areas
where problems can arise. In general, those problems (and possible
causes) are as follows:
• An error message "Media test failure, check cable" appears. The
network cable between your computer and the network is disconnected,
or there is a problem with the cable.
• Cannot change boot order. See the detailed description in the
Intel(R) Boot Agent User's Guide for corrective actions.
• For any other problems, see the detailed descriptions in the
Troubleshooting Procedures section of the Intel(R) Boot Agent User's
Guide for corrective actions.
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10.Wartung
12 Wartung
es existiert nur ein Bauteil des KWS IPC NXs, bei dem evt. Wartungsarbeiten
anfallen:
die eingebaute Lithium Batterie
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11.Anhang
13 Anhang
13.1 Literatur, Internet
IPC NX Hersteller: http://www.kws-computer.de
13.1.1 Standard-Werk PC-Hardware
[1] H.-P.Messmer: PC-Hardwarebuch, Bonn: Addison-Wesley-Longman
13.1.2 Eingesetzte Prozessoren, Chipset
Geode NX, Data manual
befindet sich auf der Kunden CD im Directory:
\Infos-Doku-Fehlersuche-aeltere Treiber\AMD\Manual
31177H_nx_databook.pdf
(oder neueren Datums)
http://www.amd.com
13.1.3 Normen/Specifications
13.1.4 PCI
[6] PCI SIG: PCI LOCAL BUS Specification Revision 2.1
http://www.pcisig.com
13.1.5 SMBus
Ernst Ahlers: Nervensystem, Der System Management-Bus auf PCMainboards c‘t 14/1997, S.210ff, Heise-Verlag
System Management Bus Specification http://www.sbs-forum.org
13.1.6 USB
System Management Bus Specification
http://www.usb.org
13.1.7 CompactFlash
CompactFlash Association,
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11.Anhang
CF+ und CompactFlash Specification Revsion 1.4
oder neuere Spec.
http://www.compactflash.org
13.1.8 ETHERNET
[2] Intel(R) Boot Agent Release Notes, 15.September.2000
http://www.intel.com
13.1.9 Betriebssysteme
LINUX http://www.suse.de
Vxworks, Wind River Systems http://www.windriver.com
QNX, QNX Software Systems http://www.qnx.com
OS-9000, Microware http://www.microware.com
13.1.10 BIOS
[3] General Software :
Embedded BIOS 2000
User’s Guide
[5] General Software :
Embedded BIOS 2000
Technical Reference Manual
befindet sich auf der Kunden CD im Directory:
\SONST \BIOS Manual\
TechRef.pdf
http://www.gensw.com
13.1.11 Zeitschrift
http://www.heise.de/ct
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11.Anhang
13.2 Datenträger
CompactFlash-Medien:
SanDisk Corporation
http://www.sandisk.com
SiliconTech
http://www.silicontech.com
13.3 Kundenkonfiguration, lieferbares Zubehör
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Maus und Tastatur
24V Netzteil
verschiedene Speicherausbaustufen
Verschiedene Panels
kundenspezifische Gehäuse
verschiedene Glasfronten
Touch-Einheit
verschiedene Tastenfelder
CompactFlash-Medien
IBM Microdrive
2,5“ Festplatten
USB Floppydrive
USB CDROM, CDBRENNER, HD
verschiedene Betriebssysteme
•
kundenspezifische Software
für genauere Informationen wenden Sie sich bitte an:
KWS Computersysteme GmbH / Carl Zeiss-Straße 1 / D-76275 Ettlingen / Telefon:
+49(0)7243/215-0 / Fax: +49(0)7243/215-100
Internet: http://www.kws-computer.de
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11.Anhang
13.4 Inhalt Kunden-CD
- dieses Handbuch
- System BIOS
- Ethernet Treiber
- IPC NX IPC NX Dokumentation von ST
- Sound Treiber
- Touchscreen Treiber
- Grafik Treiber
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11.Anhang
13.5 Standard Hardwarekonfiguration
13.6 Abkürzungen und Symbole
Bitgruppen in binärer Form werden durch ein folgendes "b" gekennzeichnet. Bsp.:
110b
Adressen und Registerinhalte werden in hexadezimal angegeben und durch ein
folgendes "h" gekennzeichnet
Bsp.: FFF0h
B ist die Abkürzung für Byte
b ist die Abkürzung für Bit.
CF
LBx
N.C.
PNP
RTC
SMbus
CompactFlash
Lötbrücke
Not Connected
Plug and Play
Real Time Clock
(interner Uhrenbaustein)
System Managment Bus
[NZE***]
noch zu ergänzen (wird in der nächsten
Version des Handbuches noch
nachgereicht)
#
Signal ist LOW aktiv.
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11.Anhang
13.7 Bestückungspläne Platine
siehe nächste Seiten
Abb.: 1: IPC NX REV.02- Bestückungsseite
Abb.: 2: IPC NX REV.02– Lötseite
siehe auch
auf der Kunden CD im Directory:
\Infos-Doku-Fehlersuche-aeltere Treiber\Bestückungspläne
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