Smart Systems Integration 2017

Invitation SSI 2017
International Conference and Exhibition
on Integration Issues of Miniaturized Systems
Call for Papers
Cork, Ireland,
8 – 9 March 2017
smartsystemsintegration.com
More and more smart components and smart integrated systems
enter into diverse innovative products and applications. They are
key components and key technologies for industry 4.0 as well as
internet of things and services. The application areas include not
only smartphones with their advanced functionality but also monitoring systems for sustainable production, smart grid, smart home
as well as support systems for senior citizens to guarantee their
more independent lifestyle.
In the past 10 years the international Smart Systems Integration
Conference and Exhibition has been successfully established by
Prof. Thomas Gessner in Europe and worldwide. He developed this
event into a unique podium of exchange of scientific ideas and a
competitive international exhibition. It was a deep shock for us as
we got the information that he suddenly passed away. Together
with the committees, Mesago and the European Technology Platform on Smart Systems Integration EPoSS, we will continue these
efforts to ensure the further success of this conference.
The overall topic for the keynote sessions of the SSI2017 are
emerging technologies for the internet of things and industry 4.0.
In the sessions we will continue to address application-oriented
topics like smart mobility, smart health, smart energy, smart production and smart society. Moreover, innovative smart systems,
their manufacturing technologies as well as issues of integration,
embedding and software are also in the focus of the conference.
Additionally, we will address business creation of smart systems,
e.g. market trends or ecosystems for smart solutions.
On behalf of the committee, the Co-Chair – Dr. Guenter Lugert
of Siemens AG and Chairman of EPoSS Executive Committee –
and the local Co-Chairs from Ireland – Dr. Eric Moore, (University
College Cork, Tyndall National Institute) and Ray Speer (Analog
Devices) – I am looking forward to receiving your application or
scientific oriented submission.
Co-organizer:
Part of the activities of:
Prof. Dr. T. Otto
Fraunhofer Institute for Electronic Nano Systems ENAS
Conference chair Smart Systems Integration 2017
Conference topics 2017
At a glance
A. Applications
A01 Smart mobility
A02 Smart health
A03 Smart energy
A04 Smart society
A05 Smart production
Highlight your expertise
at the SSI conference with
concurrent exhibition!
B. Hardware/Technologies
B01 Design of smart integrated systems
B02 Manufacturing of embedded micro and nano systems B03 Advanced micro and nano technologies
B04 New materials for nano structures and devices
B05 Smart low cost approaches including Roll-to-Roll
techno­logies and printed functionalities
B06 Smart test and reliability of components and systems
B07 System integration: 3D integration,
interconnect tech­nologies and packaging
Date C. Software for smart integrated systems
C01 Embedded software
C02 Stand-alone application software
Your advantages
D.
Business creation of Smart Systems
D01 Embedded software
D02 Perspectives of Smart Systems
D03 Ecosystems for Smart Solutions
D04 SME success stories
Special topics
Emerging technologies for IoT and Industry 4.0
Smart Systems Integration
International Conference and Exhibition
Focuses on complex systems in consideration of
the components,
Is application-oriented,
Close to the industry and
Shows the potential of research and development
activities worldwide.
8 – 9 March 2017
Conference Hours Wednesday 09:00 hrs – 17:35 hrs
Thursday
09:00 hrs – 16:15 hrs
Venue
Radisson BLU Hotel & Spa Cork
Ditchley House – Little Island
Little Island Business Park
Cork, Ireland
radissonblu.com/en/hotel-cork
– Present in front of a highly qualified audience.
– Exchange your experience with other experts.
– Build up your personal network.
– Benefit from maximum ­attention for your
presentation due to extensive press work and
several advertising activities.
– Take the opportunity to win the best paper/
poster award.
– Participate in the extensive social program including
Pre-conference field trip to Tyndall National Institute
and conference dinner at Ballymaloe House.
Contact for further details
Mesago Messe Frankfurt GmbH
Rotebuehlstrasse 83 – 85,
70178 Stuttgart, Germany
Ms. Antje Mörbe
Phone: +49 711 61946-292, Fax: -11292
E-Mail: antje.moerbe@mesago.com
Board of Management
Petra Haarburger, Martin Roschkowski
HRB 13344
Committee list
Conference chair
Prof. Dr. T. Otto Fraunhofer ENAS, DE
Co-chair
Dr. G. Lugert Siemens, EPoSS, DE
Local co-chair
Dr. E. Moore University College Cork, Tyndall National Institute, IE
R. Speer Analog Devices, IE
Scientific committee
L. Añorga CIDETEC, ES
R. Aschenbrenner Fraunhofer IZM, DE
Prof. Dr. R. R. Baumann Fraunhofer ENAS, DE
Prof. Dr. Dr. K. Bock TU Dresden, DE
Dr. C. Bosshard CSEM, CH
Dr. S. Brongersma Holst Centre, IMEC, NL
Dr. B. Candaele Thales, FR
Prof. Dr. C. Cané Centro Nacional de Microelectrónica (CNM-IMB), ES
Dr. J. De Boeck IMEC International, NL
M. Desmulliez Heriot-Watt University, UK
K. Dyrbye Grundfos Holding, DK
Dr. S. Finkbeiner Bosch Sensortec, DE
Prof. Dr. P. J. French Delft University of Technology, NL
U. Gäbler Infineon, DE
W. Gessner VDI/VDE-IT, DE
Dr. R. Günzler HSG IMIT, DE
Dr. C. Hedayat Fraunhofer ENAS, DE
Dr. H. Heinzelmann CSEM, CH
Prof. Dr. C. Hierold ETH, CH
Prof. Dr. K. Hiller Chemnitz University of Technology, DE
D. Holden CEA-LETI, FR
Dr. J. Kiihamäki VTT Technical Research Centre of Finland, FI
Prof. Dr. C. Kutter Fraunhofer EMFT, DE
Prof. Dr. K.-D. Lang Fraunhofer IZM, DE
Dr. C. Merveille IKERLAN, ES
Prof. Dr. W. Mokwa RWTH Aachen, DE
Submission requirements
Dr. A. Muller IMT, RO
A. P. Mynster DELTA, DK
A. Nebeling Elmos, DE
Prof. H.-E. Nilsson Mid Sweden University, SE
Prof. Dr. H. Pereira Neves Six Semiconductors, BR
Dr. I. V. Popova Gyrooptics, RU
G. Poupon CEA-LETI, FR
Dr. M. Riester Maristechcon D. Markus Riester, DE
Dr. G. Righini Istituto di Fisica Applicata Nello Carrara Firenze, IT
V. Rouet Airbus Group Innovations, FR
Prof. A. Rydberg University of Uppsala, SE
Prof. Dr. S. Rzepka Fraunhofer ENAS, DE
Dr. M. Scholles Fraunhofer IPMS, DE
U. Schwarz X-FAB MEMS Foundry, DE
Dr. R. Slatter Sensitec GmbH, DE
T. Stärz micro FAB, DE
Prof. J. Tuovinen JoyHaptics Ltd, FI
Dr. M. van der Beek Philips Research, NL
J. Wolf Fraunhofer IZM, DE
Prof. Dr. R. Zengerle IMTEK, DE
Conference language
English
Conditions of acceptance
Authors are expected to secure the registration fee
of 315 EUR + VAT as well as travel and accommodation
funding through their sponsoring organizations, before
submitting ­abstracts. Full payment will be due once the
submission has been accepted. Only original material
should be submitted. ­Government and company clearance
to present and publish should be finalized at the time of
submission. Non-research based papers which attempt to
promote commercial products cannot be submitted.
Selection process
The committee will review all submitted abstracts to maintain the high quality of the conference. Only papers submitted on time and addressing subjects which are topical and
­relevant to the conference will be considered for inclusion
in the conference programme. Submitted papers may be
­selected for oral or poster presentations.
Advisory committee
International members
Prof. Dr. M. Esashi Tohoku University, JP
R. H. Grace R. Grace Associates, US
K. Lightman MEMS & Sensors Industry Group, US
Members of EPoSS advisory committee
R. Dal Molin SORIN CRM, FR
R. Groppo Ideas & Motion, IT
A. Korhonen Murata Electronics, FI
Dr. J. Langheim STMicroelectronics International, FR
Dr. R. Neul Bosch, DE
A. Nguyen-Dinh Vermon, FR
H. Rödig Infineon Technologies, DE
Dr. W. van Driel Philips Electronics, NL
Impressions of SSI 2016
Exhibition and conference in Munich, Germany
Oral and poster presentations
Oral presentations will be held in different sessions. The
duration of each presentation should not exceed 25 minutes
including 5 minutes for subsequent discussions. Poster
authors will have the opportunity to present their posters
during a special poster session and throughout the conference. All oral and poster presentations will be included in
the conference proceedings.
Deadlines
Submission of abstracts
5 October 2016
Selection by committee
17 November 2016
Submission of full manuscripts
31 January 2017
Online
submission
at than 5 October 2016
Submission
no later
smartsystemsintegration.com
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