HOW TO SUCCEED IN TELIT MODULES INTEGRATIONS Telit @ M2M Platforms Seminar e-mail:

HOW TO SUCCEED
IN TELIT MODULES INTEGRATIONS
Telit @ M2M Platforms Seminar
www.m2m-platforms.com
e-mail: sales@m2m-platforms.com
HOW TO SUCCEED
IN TELIT MODULES INTEGRATIONS
Overview
1- Technical Support Center presentation
2- How to succeed in Telit module integration
3- How to use our services properl
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Telit Technical Support Center
• Three specific dedicated Teams for customer support:
• Technical Sales Team
• Customer Support Team
• After Sales Team
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Telit Technical Support Center
• Technical Sales Team members
– Manager Technical Sales (Max Lonzar)
– 2 Technical Sales Engineer (Stefano Radetich, Daniele
Scalembra)
• Customer Support Team members
– Manager Customer Support (Andrea Ghezzo)
– 3 Customer Support Engineer (Alessandro Rossi, Fabio
Bernardi, Luca Tomasi)
Technical Support Team coordinates the RF and BB Telit R&D
engineers to give the best support to system integrator
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Technical Support Team
Targets
• FAE support
• Troubleshooting on customers’ problems (BB & RF)
• Design review of customers’ applications (schematics
& layout)
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Hardware support requirements
To give the customer the best support the following information
are required:
– Characteristics of application
• Field of application, temperature range, low power, SIM
design, special environment, type of power supply
– Hardware information
• All the information concerning schematics and PCB
description (files, datasheet)
– Global environment
• Mechanical connection between Telit module and mother
board
• Description of Mechanical housing if exists
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Overview
1- Technical Support Team presentation
2- How to succeed in Telit module integration
a) Schematic
b) Placement
c) Layout
3- How to use properly our services
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
SCHEMATIC REVIEW
•
BB schematic review target is to check :
– Power supply features
– Compatibility of analog/digital levels between Telit module and
customer hardware functions
– Speed and timing of Telit peripheral components
•
RF schematic review target is :
– Checking of connections in relation with RF behaviour
– VBATT ,Telit/antenna path, characteristics of antenna
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Application review
Main points to check :
•
•
•
•
•
•
•
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Power supply
Serial link
SIM
ON/OFF
Reset
Audio
RF Interface
RF
INTERFACE
AUDIO
INTERFACE
POWER
SUPPLY
SIM
CARD
SERIAL
INTERFACE
UART
HARDWARE
INTERFACE
IO/AD
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Power Supply
– The power supply is one of the key issue in the design of a GSM
terminal
– A weak power supply design could affect phase and frequency
error, spurious emission, EMC performances
– Voltage range for VBATT : 3.4V – 4.2V. Nominal 3.8V
– When using a switching regulator, a 500kHz or more switching
frequency regulator is preferable because of its smaller inductor size
and its faster transient response.
– Power consumption in idle mode:
• 17 mA
– Beware to the current provided !
• 2A peak during Tx bursts
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Serial Link
• Serial link
– Main serial link
• RXD,TXD,RTS,CTS,DSR,
DTR,DCD,RI
– 2.8V pads with clamping
diodes (Vforward=0.3V)
• Need a RS232 transceiver to
comply with RS232 standard (-12V
/+12V)
DCD-dcd_uart
RXD-tx_uart
TXD-rx_uart
DTR-dtr_uart
DTE
Telit Main
serial link
DSR-dsr_uart
RTS-rts_uart
CTS-cts_uart
RI-ri_uart
• Flow control signals (RTS-CTS)
are mandatory for data
transmission
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
SIM Interface
– Only 3V SIM supported (new platform
1.8V)
– SIM interface voltage level is 2.8V
– Add capacitor of 33pF ( on SIM_CLK,
SIM_DATA and SIM_RST). It must be
closed to SIM holder
– Ceramic capacitor placed near VSIM
should not exceed 47nF
– Length of (Wire + Track) should not
exceed 10 cm
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
ON/OFF
– To turn on the module the pad ON must be tied low for at least 1
second and then released.
– The maximum current that can be drained from the ON pad is 0,1 mA.
– Don't use any pull up resistor on the ON line, it is internally pulled up.
– The line ON must be connected only in open collector configuration.
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
RESET
– Active low
– To unconditionally reboot the module, the pad RESET# must be tied low
for at least 200 milliseconds and then released.
– The maximum current that can be drained from the ON# pad is 0,15 mA.
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
AUDIO
• 2 MICROPHONES
– 4 lines MIC_MT+, MIC_MT- , MIC_HF+ , MIC_HF– Can be used in differential or single ended mode but differential
mode is preferable to have better acoustic performances
– Audio filters are present inside the module
• 2 SPEAKER
– 4 lines EAR_HF+, EAR_HF- , EAR_MT+ , EAR_HF+
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Overview
1- Technical Support Team presentation
2- How to succeed in Telit module integration
a) Schematic
b) Placement
c) Layout
3- How to use properly our services
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
PCB placement and layout Advises
Placement phase is as important as the layout phase : a bad
placement lead to a bad layout and inevitably to EMC problems.
Placement must be done by function (power upply,SIM,audio,RF,…)
Specific constraints must be applied to the placement:
– Electrical
• E.g. :Power supply part must not be placed too close to the
audio one
– Mechanical
– …
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Overview
1- Technical Support Team presentation
2- How to succeed in Telit module integration
a) Schematic
b) Placement
c) Layout
3- How to use properly our services
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW - BASEBAND & RF
• Baseband and radio layout Review targets are :
– Check all sensitive signal tracks for all PCB layers
• VBATT ,audio tracks, SIM tracks
• EMC approach in PCB analysis
– Check ground planes
• Ground plane present on top close to module
• Great number of via in GND layer
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW - BASEBAND & RF
• Layout checked by signal type
– Power
– Digital very fast
– Digital fairly fast
– Digital slow
– Analog (Audio, ADC)
– RF
• Ground separation between each signal type verified
• Recommendation: 4 layers mini with ground plane
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW - POWER SUPPLY
• Recommendations
– +VBATT 2.5mm typical width.
– Ground plane on the Main board is strongly recommended.
– Ground separation is recommended between each signal type.
– Micro via are used to connect each layer of ground
– The use of a good common ground plane is suggested.
– The power supply input cables should be kept separate from
noise sensitive lines such as microphone/earphone cables.
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW - AUDIO
• Basic recommendations to have better acoustic performances
– The speaker lines must be routed in parallel and shielded , without
any wire in between these lines
– The microphone lines must be routed in parallel and shielded ,
without any wire in between these lines
– All the filtering components (RLC) must be placed as close as
possible to the associated MIC and EAR pins
– A specific audio-ground can be used to reduce TDMA noise
– The recommended traces width is 0,3mm
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW – ANTENNA PATH
• Needs:
– Description of the link between the module and the antenna
• Connector type
• Coaxial cable (type, length)
• Environnement impact
– Antenna location
– Application housing
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW – ANTENNA PATH
Four possible ways to connect the antenna (coaxial cable MMCX GSC,
soldered, design the antenna directly on PCB [GE modules] )
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
LAYOUT REVIEW – ANTENNA
On GE863 and GE864 it is possible to design the antenna directly on
application boar.
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
Overview
1- Technical Support Center presentation
2- How to succeed in Telit module integration
3- How to use our services properl
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
TELIT SERVICES
Generally, Most of the time problems in a design are detected too late (after
layout phase and sometimes after manufacturing beginning).
The sooner we are involved in a customer design , the better the
final result will be.
Advise to system integrator to perform a schematic review as
soon as his schematics are completed.
Advise to system integrator to perform a layout review before
application manufacturing.
HW support experts group is dedicated to answer any HW related
questions/open points customers may have during the integration
project or during field support.
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
APPROVAL
Telit modules are assessed to be conform to the R&TTE Directive as stand-alone
product, so if the module is installed in conformance with Telit installation
instructions require no further evaluation under Article 3.2 of the R&TTE Directive
and do not require further involvement of a R&TTE Directive Notified Body for the final
product.
In all other cases, or if the manufacturer of the final product is in doubt then the
equipment integrating the radio module must be assessed against Article 3.2 of the
R&TTE Directive.
In all cases assessment of the final product must be made against the Essential
requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC
respectively, and any relevant Article 3.3 requirements.
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
FAMILY PRODUCTS
CERTIFICATIONS
GE864
• R&TTE / CE
GC864
• GCF
• FCC
GE863-GPS
GM862-GPS
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• IC Canada
• PTCRB
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
FAMILY PRODUCT
DELTA CERTIFICATION
FOR APPLICATION
R&TTE / CE
DELTA TEST
GM862 based
GC864 based
SAFETY
EMC
RF SPECTRUM
*(IF NEEDED)
R&TTE / CE
DELTA TEST
GE864 based
GE863 based
SAFETY
NO SIM test if : Path from SIM pins to the SIM holder is
less than 20cm and not active components are added
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EMC
RF SPECTRUM *
* i.e. Radiated spurious emissions
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
INTERNAL TESTS CAPABILITY
• RF TEST CAPABILITIES
• EMC TEST CAPABILITIES
• VALIDATION TEST CAPABILITIES ON APPLICATION
PRODUCTS
• VALIDATION TEST ON MANUFACTORY PROCESS
• VALIDATION TEST ON PRODUCT
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
INTERNAL TESTS FACILITY
•
8 METERS ANECHOIC CHAMBER
•
3 METERS DISTANCE MEASUREMENT
•
30 MHz TO 4 GHz MEASUREMENT
•
SHIELD ROOM
• ACHOUSTIC CHAMBER
• PHYSICAL TEST LAB
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
RF TEST CAPABILITIES
Conducted RF TEST ( TS 51.10-1 )
Conducted RF spurious emissions ( test cases 12..1.1 – 12.1.2 )
Transmitter Frequency error under multipath/ interference (test cases 13.2 )
Transmitter Frequency error and phase error ( test cases 13.1 )
Transmitter output power ( test cases 13.3 )
Transmitter- Output RF spectrum ( test cases 13.4 )
Receiver Blocking and spurious response ( test cases 14.7.1 )
Radiate RF TEST ( TS 51.10-1 )
Radiated RF spurious emissions ( test cases 12.2.1 - 12.2.2 )
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
EMC TEST CAPABILITIES
EMC Emission test ( EN 301 489-11 EN 301 489-7)
• Radiate emission (30MHz-1GHz in Anechoic chamber) - EN 55022
• Conducted emission at AC port (150KHz - 30MHz) - EN 55022
• Conducted emission at DC port (150KHz - 30MHz) - EN 55022
EMC Immunity test ( EN 301 489-1 EN 301 489-7)
• Immunity to RF electromagnetic field (80-2000 MHz 3V/m) – EN 61000-4-3
• Immunity to conducted RF disturbance (0.15-80MH) – EN 61000-4-6
• Electrostatic discharge – EN 61000-4-2
• Fast transient - EN 61000-4-4
• Transient and surge – ISO 7637-1/2
• Voltage dips and interruptions - EN 61000-411
• Surges – EN 61000-4-5
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
VALIDATION TEST CAPABILITIES
Radiated power
Measurement of the radiated power in free space condition (Measure
in anechoic chamber)
Radiated Receiver sensitivity
Measurement of the receiver static sensitivity in free space conditions
(Measure in anechoic chamber)
Telit ANECHOIC CHAMBER aligned with TILAB laboratory in
TORINO
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HOW TO SUCCEED
IN TELIT MODULES NTEGRATIONS
EXTERNAL TESTS CAPABILITY
EXTERNAL LABORATORY USED BY TELIT
CETECOM SPAIN ( Malaga WWW.CETECOM.ES )
•
EXPERT IN GSM/GPRS TEST CAPABILITY
•
EXPERT IN SHORT RANGE DEVICE TEST
SICOM TEST S.r.l. ( ITALY – Trieste WWW.SICOMTESTING.COM )
• TEST CAPABILITY SHARED WITH DAI TELECOM
• FULL SERVICE FOR CERTIFICATION PROCESS ON
GSM/GPRS
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Join Telit wireless solutions!
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