Technological State

Technological State
2014
receipt of information
prepare the production
creating films
press
drilling
exposuring
plating
printing
milling
quality-management
archiving
logistic
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
Our products:
single and double layers (non plated drill), double layer (plated drill)
multilayer spanning 30 layers
flexible/ flexirigid boards
copper thickness up to 400 µm
HDI circuit
smallest drill diameter 0.1 mm
microvias, blind holes, buried holes, buried blind holes, stacked holes, backdrilling
Impedance control, construction and measurement of testcoupon
back panel in embossing technology
galvanised or electroless nickel/gold, electroless pewter, ROHS or leaded HAL,
chemical nickel/ palladium/ gold
soldermasks and equipment printing in diverse colours
via fillers, strippable paint, carbon, plugged vias
maximum dimensions 490 x 570 mm
board thickness from 0.10 mm to 5.0 mm
| Image: depth milling, surface plated with galvanised gold |
| background image: stacker in the wet |
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
Circuit board dimensions:
Maximum dimensions:
Multilayer:
Structural width:
Circuit board thickness:
Drilling diameter:
Drilling:
490 mm x 570 mm
up to 30 layers, more upon request
up to 70 µm
between 0.1 mm and 5.0 mm; beyond that, dependent on the product
from 0.1 mm – 6.2 mm; diameters greater than 6.2 will be cut
non-plated drilling / plated drilling / blind via / buried via/ backdrilling
Contours:
milling / scratching / plated contours / partially plated contours / plated
depressions partially / plated depressions / phases / partial depth milling
Materials:
FR4, medium TG and high TG, PI, IMS, high frequenz and other materials
| background image: NC miniature circuit breaker |
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
Varnishes and Paints:
Soldermask:
via caster other soldermask via silkscreen
depending on customer requirements
Screen printing: Colour depending on customer requirements
Protective lacquer: SD 2955 / SD 2954
Carbon printing: XZ 302 (coats) via screenprinting
Insulation printing: depending on customer requirements
| Image: circuit boards with different soldermask colours |
| background image: lacquer casting machine |
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
Surfaces:
Hot Air Levelling – lead-free
Hot Air Levelling
Chemical pewter
Chemical silver
Chemical nickel/ palladium/ gold
Chemical nickel/ gold
Galvanized nickel/ gold
Galvanized nickel
| Background image: circuit boards with different surfaces |
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
Quality and procedure control:
Certified according to ISO 9001 2008
Certified according to
DIN EN ISO 14001 : 2005
Electrical test according to IPC 9252A
Automated optical inspection (AOI)
Impedance control
Micro-section control
| Background image: circuit board in a flying probe tester |
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
“To wish to progress is the largest part of progress!”
Lucius Annaeus Seneca
(4 BC - 65 AD)
Research project
„Sensormanschette“ - Integration of Piezo construction form in flexible/ flexirigid boards
„NanoCuNi “ - Development and use of nano-coated Cu and Ni bonding wires for microelectronic
connection technology.
This projects are in collaboration with the TU Dresden/ Fraunhofer, IWM Halle, as well as with other
industry-related partners.
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
Technological State
2014
Contact:
G&W Leiterplatte Dresden GmbH & Co. KG
Heidelberger Straße 16
01189 Dresden, Germany
Telephone: +49 (0) 351 40023-0 Fax: +49 (0) 351 40023-36
sekretariat@lp-dd.de
© 2014 by G&W Leiterplatten Dresden GmbH & Co. KG
www.lp-dd.de