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LCS Value Proposition - LiquidCool Solutions
LCS Value Proposition November 2014 Data Center Trends 2014 • Improving Data Center Power Efficiency & Reducing Carbon Footprint • • • • Initiatives for raising data center temperatures Data center upgrades for cooling and power management Low power server alternatives (ARM) – HP Moonshot, etc. DCIM offerings for efficient management of DC infrastructure • Increasing power density & core counts for HPC clusters with focus on energy efficiencies. • “Green 500” configurations with pervasive adoption of GPGPU and Intel Phi cores for compute • Moves to higher voltage power inputs to reduce copper and power distribution challenges • Adoption of alternatives to traditional air cooling schemes • • • Cold Plates utilizing water and ethylene water glycol fluids Heat Pipes used in conjunction with water based heat exchangers Single phase and phase change submersion cooling employing dielectric fluids • Market growth for modular approaches to add Data Center capacity • Attractive economics, flexibility, and lead time compared to brick and mortar options • Modular Data Center Market projected by 451 Research to be $2.5 Billion annually by 2015 © LCS 2014 - Proprietary and Confidential 2 LCS Cooling Complements Trends • Improving Data Center Power Efficiency • • • • Reductions in “Power to Cool” at the device level of up to 98% (Traditional Air vs LCS) Typical reductions in overall data center power consumption of 40%* Inherent ability to recover and utilize waste heat for facility purposes Potential for achieving “True PUE’s” as low as 1.02 • Increasing Power Density • Vastly superior physics for heat transfer – volumetric heat capacity ~ 1500x that of air • More compact packaging options – no need for fans • Cooling system components can be remotely configured to increase IT density • Modular Data Center Configurations • • • • Lower cost infrastructure for fluid distribution and heat exchange More compact footprints than with typical air-cooled options Lower operating costs and maintenance requirements than air cooled configurations No considerations or provisions required for local air quality – sealed systems * Based on comparison to Data Center Study of 2012 ASHRAE Report Findings © LCS 2014 - Proprietary and Confidential 3 Fans are a Problem Fans Waste Energy • 15% of total datacenter energy is used to move air • Additionally fans in the chassis can use up to 20% of IT power at the device level • Fans are inefficient and generate heat that must be removed Fans Waste Space • Racks need room to breathe • CRAC units require space around the racks Fans Reduce Reliability • • • • Fans fail Thermal fluctuations drive solder joint failures Structure borne vibration frets electrical contacts Fans expose electronics to air • Oxidation/corrosion of electrical contacts • Exposure to electrostatic discharge events • Sensitivity to ambient particulate, humidity and temperature conditions © LCS 2014 - Proprietary and Confidential 4 Benefits from Eliminating Fans Cool High Power Electronics - Lower operating temperatures result in lower leakage current - All internal components are kept within normal operating temperature ranges Save Energy - For LCS, device power-to-cool can be reduced by up to 98% vs. air-cooled devices - For LCS, the “true” cooling PUE is ~1.03 - Waste heat easily can be recovered for other uses Save Space - Higher rack density because there is no need for hot aisles or to circulate air in the racks For LCS, 64 IT devices in a 42U rack or 72 devices in a 48U rack Increase Reliability - Sealed fluid circuits prevent failures from corrosion and contamination - Liquid submersion reduces thermal fatigue of solder joints Operate Silently - Fan noise is eliminated Five Technologies Eliminate Fans 1. 2. 3. 4. 5. Clustered Systems Green Revolution Cooling Iceotope SGI LiquidCool Solutions © LCS 2014 - Proprietary and Confidential 5 Clustered Systems • Clustered Systems circulates a refrigerant through an external cold plate mounted on top of each server in the rack. • Mechanical pressure is used to create contact between the cold plate and the top of the server. • Heat is transferred to from the server to the refrigerant by conduction. • The system requires a refrigerant temperature less than 30oC. © LCS 2014 - Proprietary and Confidential 6 Green Revolution Cooling • Green Revolution Cooling’s CarnotJetTM system circulates a mineral oil based dielectric fluid through a tank containing submerged IT devices. • The system resembles a rack tipped over on its back, with modified servers inserted vertically into slots in the tank. • Each 42U tank is filled with roughly 250 gallons of the mineral oil. • Maintenance access is through the top of the tank © LCS 2014 - Proprietary and Confidential 7 Iceotope • Iceotope mounts off-the-shelf motherboards inside sealed hot-swappable cartridges that are flooded with a dielectric fluid, 3M Novec. • Novec, which remains a liquid, moves heat to a hot plate mounted on the side of the cartridge. • Water circulates in a secondary circuit through the hot plate, and heat is transferred from Novec to water in the hot plate by conduction. • Aster Capital, an investment group backed by Alstom, Schneider Electric and Solvay, recently invested $10 million in Iceotope • Along with the investment Schneider announced that it intends to commercialize Iceotope technology © LCS 2014 - Proprietary and Confidential 8 SGI • SGI uses a two-phase (evaporative) immersion cooled system. • Electronic components are submerged into a bath of Novec, an expensive dielectric refrigerant. • Boiling occurs on the surface of the heat generating devices and vapor passively rises to the top of the enclosure, where it condenses on water-cooled coils and falls back into the tank. © LCS 2014 - Proprietary and Confidential 9 LiquidCool Solutions Patented Directed-Flow Technology • No fans or other moving parts in the chassis • Total liquid submersion in a eco-friendly dielectric fluid • Rack-mounted devices are easy to maintain • Within a device “cool” liquid is circulated directly to the components with the highest power density • The remaining components are cooled by bulk flow as the dielectric fluid is drawn through the unit to a return manifold • Electronics are decoupled from the environment How it Works © LCS 2014 - Proprietary and Confidential 10 Heat Dissipation LCS Cooling System Elements • Pump supplies “cool” dielectric liquid to multiple IT racks • If there is no energy recycling option “hot” fluid is circulated to an evaporative fluid cooler • Incoming “cool” fluid can be as warm as 45°C for most applications © LCS 2014 - Proprietary and Confidential 11 Reliability LCS technology decouples electronics from the room, eliminating the root causes of failure: • Dramatic reduction in thermal fluctuations, which drive solder joint failures • Much lower operating temperatures for the board and components (typically 20-30 C cooler device temps than with air) • No oxidation/corrosion of electrical contacts • No fretting corrosion of electrical contacts induced by structural vibration • No moving parts within the device enclosure (fan failures are one of the highest service triggers for electronics) • No exposure to electrostatic discharge events • No sensitivity to ambient particulate, humidity, or temperature conditions When maintenance is required to upgrade components: • The swap out procedure takes less than 2 minutes with no measurable loss of fluid • An IT device can be removed from a rack, drained, opened, serviced, reassembled, refilled, and reinstalled within a 15 minute turnaround window © LCS 2014 - Proprietary and Confidential 12 Robust IP Portfolio 20 Issued & 19 Pending Patents • • • • • • • Liquid tight server case with dielectric liquid for cooling electronics Extruded server case used with liquid coolant of electronics Computer with fluid inlets and outlets for direct-contact liquid cooling Case and rack system for liquid submersion cooling of an array of electronic components Computer case for liquid submersion cooled components Liquid submersion cooled computer with directed flow Gravity assisted directed liquid cooling of electronics © LCS 2014 - Proprietary and Confidential 13 Additional LCS Benefits Any Shape or Size Clustered Systems, Green Revolution, SGI, Iceotope No Water Iceotope Scalable Green Revolution, SGI Easy to Swap Devices Green Revolution, SGI Easy to Maintain Devices Green Revolution, SGI, Iceotope Harsh Environment Deployments Green Revolution, SGI Costs Less than Air Clustered Systems. SGI, Iceotope Liquid Submerged Computer Operating Underwater in an Aquarium © LCS 2014 - Proprietary and Confidential 14 Any Shape or Size 8 servers with liquid-to-liquid cooling distribution unit Industrial and embedded computing applications © LCS 2014 - Proprietary and Confidential 15 Any Shape or Size Liquid Submerged Computer with Passive Radiator Liquid Submerged Computer with Stacked Boards © LCS 2014 - Proprietary and Confidential 16 64-Server Configuration Connection to remote CDU © LCS 2014 - Proprietary and Confidential 17 Low Cost “Clamshell ”Server • • • Motherboard sandwiched between two sealed enclosures Rack-mountable I/O connectors remain outside the liquid enclosure © LCS 2014 - Proprietary and Confidential 18 Clamshell Server System © LCS 2014 - Proprietary and Confidential 19 Example –Modular Data Center Air-Cooled Input Power – 500kW IT Power – 250kW LiquidCool Input Power – 320kW IT Power – 250kW © LCS 2014 - Proprietary and Confidential 20 1MW Hybrid HPC Module Overall dimensions 12’ x 12’ x 42’ © LCS 2014 - Proprietary and Confidential 21 200 KW Hybrid HPC Module Overall dimensions: 12’ x 12’ x 20’ • Air cooled section for data storage & switches Liquid cooled section for compute © LCS 2014 – Proprietary and Confidential 22 Fluid Distribution for LSS 220 Rack © LCS 2014 – Proprietary and Confidential 23 250 kW Liquid-to-Liquid CDU Fully Redundant Heat Exchangers, Pumps, and Pump Control Units Approximate size: 48” wide x 48” deep x 30” high © LCS 2014 – Proprietary and Confidential 24 Federal Data Center Upgrade Current Facility Layout (Air-Cooled) • 50’ x 100’ Facility Space • 115 racks of air cooled IT equipment • Estimated IT compute power consumption of 500 kW • 7 Air Handling Units fully operational at capacity Facility Space Reduction using LCS Servers • 50’ x 100’ Facility Space • 24 Liquid Cooled 48U racks w/72 servers/rack • 500+ kW of IT compute capacity at 21 kW/rack • Approximate footprint = 450 ft2 • Air Handling Units to Red may be decommissioned • Remainder of space available for repurposing or expansion © LCS 2014 - Proprietary and Confidential 25 TROPEC Transformative Reductions in Operational Energy Consumption TROPEC Objective – Allow enterprise servers and communication/network equipment to continuously operate in tropical environments with no mechanical cooling • LiquidCool submitted a proposal for “Modular System for High-Efficiency Electronics Cooling at Expeditionary Base Camps” in September 2013 • A comprehensive assessment of the LiquidCool system has been completed at Lawrence Berkeley National Laboratory • US Navy (PACOM) has recommended that the LiquidCool system be moved forward to the field assessment phase • Independent testing of the TROPEC system achieved successful cooling of an HPC server and cooling unit at ambient temperature of 101°F for 24 hours achieving a true PUE of 1.019 © LCS 2014 - Proprietary and Confidential 26 LCS Value Proposition Any electronics can be cooled There is no water near electronics Rack-mounted devices are hot swappable and easy to maintain There are no moving parts or heat exchange barriers in the IT device chassis There is no boiling or condensing The dielectric liquid is inexpensive, eco-friendly and never needs to be replaced There are no microchannels to clog Electronics are not exposed to air pollution Blade and rack fans are eliminated There is no noise, vibration or extreme temperature fluctuation Air handlers and CRAC units are eliminated Mechanical refrigeration is eliminated There is no need for humidification or dehumidification Raised floors and high ceilings are eliminated Heat is recovered in a convenient form for recycling …and LCS cooling costs less too! © LCS 2014 - Proprietary and Confidential 27 More Information Herb Zien, CEO herb.zien@liquidcoolsolutions.com 414-803-6010 Jay Ford, VP Sales & Marketing jay.ford@liquidcoolsolutions.com 847-370-7296 Rick Tufty, VP Engineering rick.tufty@liquidcoolsolutions.com 507-535-5829 Steve Einhorn, Chairman seinhorn@capitalmidwest.com 414-453-4488 © LCS 2014 - Proprietary and Confidential 28
