AM/FM/HD-Radio™ radio receiver IC
Transcription
AM/FM/HD-Radio™ radio receiver IC
TDA7708 AM/FM/HD-Radio™ radio receiver IC Data brief Description The TDA7708 is a single chip fully-CMOS AM/FM single-channel tuner for terrestrial radio receiver applications. The TDA7708 features multiple front-end lownoise amplifiers (LNAs) to cover AM LW/MW/SW bands, and the entire FM band, with advanced DSP-controlled automatic gain control (AGC) amplifier and mixer stages. *$3*36 VFQFPN64 (9 x 9 x 0.85 mm) After on-chip IF filtering, the TDA7708 digitizes the signal with a very high dynamic range ADC; it processes the complex phase-quadrature baseband signal allowing applications like multipath noise mitigation, and integrated RDS decoding. The TDA7708 furthermore integrates the HD-Radio™ channel filtering. Features Fully automotive grade CMOS design AM/FM Band Low-IF, DSP-based architecture Very high dynamic range built-in IF-ADC Minimum external component count Very small footprint package Optional Multipath noise mitigation processing Compatible with HD-Radio™ Besides providing optimal AM/FM quality reception, the TDA7708 allows to realize a complete HD-Radio™ receiver solution (in combination with the external STA680 HD-Radio™ digital decoder coprocessor), with a low bill of material, high performance and automotive grade quality and reliability. TDA7708 is pin-to-pin compatible with ST's dualchannel tuner TDA7707, allowing efficient design of scalable terrestrial radio-receiver platforms. Digital Audio Output Fully RoHS-compliant Table 1. Device summary Order code Package Packing TDA7708 VFQFPN64 (9 x 9 x 0.85 mm) Tray December 2014 DocID027311 Rev 1 For further information contact your local STMicroelectronics sales office. 1/7 www.st.com Contents TDA7708 Contents 1 Block and typical application diagrams . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2/7 DocID027311 Rev 1 TDA7708 Block and typical application diagrams Figure 1. Block diagram $*& &21752/ ,&63, LQWHUIDFH $0 '63 &/867(5 ,6 ''& $'& $*& VHQVH 1 Block and typical application diagrams '$& $'& )0 6833/< 9&2 9 9,&6 LQWHUIDFH +: $&&(/(5$ 7256 3// +'5DGLR LQWHUIDFH &5<67$/ 26& *$3*36 0+] Table 2. Main features list Features list Number of Channels 1 Reception Band AM/FM AM/FM Weak-Signal-Processing √ RDS decoder √ Supported (1) HD-Radio™ 1.0 Base Band Interface I2S VICS interface √ Control interface I2C/SPI Digital Audio out √ Stereo audio DAC √ 1. With external coprocessor. DocID027311 Rev 1 3/7 7 Block and typical application diagrams TDA7708 Figure 2. Typical AM/FM application with optional STA680 HD-Radio™ decoder 6'5$0 )/$6+ 0+] ,4%DVHEDQG ;2 ;, $0)0 EOHQG 7'$ )0DXGLR,6 GLJLWDODXGLR ,6 /5 ,& 67$ 63,,& $XGLR 3URFHVVRU +RVW X& ,&63, 3RZHU $PSOLILHU .H\SDG 'LVSOD\ *$3*36 Table 3. Absolute maximum ratings Symbol Parameter Vs Supply voltage Ptot Power dissipation Tamb Ambient temparature range Min Typ Max Units 3.15 3.3 3.45 V - 0.75(1) - W 1. Typical use-case. 4/7 DocID027311 Rev 1 -40 to +85 °C TDA7708 2 Package information Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages, are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK® is an ST trademark. ECOPACK® specifications are available at: www.st.com. Figure 3. VFQFPN64 mechanical data and package dimensions $)- ! MM INCH -). 490 -!8 -). 490 ! ! ! 2%& B B "3# % "3# % E 2%& $ $ "3# "3# "3# "3# . $ % , , , MIN MAX ȭ 0 /54,).%!.$ -%#(!.)#!,$!4 ! -!8 6&1&0. XXMMPITCH 6ERY&INE1UAD&LAT0ACKAGE.OLEAD -AXIMUMALLOWABLEBURRSISMMINALLDIRECTIONS " *$3*36 Package is compliant to IPC/JEDEC J-STD-020D June 2007 standard Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices", MSL Level 3. DocID027311 Rev 1 5/7 7 Revision history 3 TDA7708 Revision history Table 4. Document revision history 6/7 Date Revision 16-Dec-2014 1 Changes Initial release. DocID027311 Rev 1 TDA7708 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2014 STMicroelectronics – All rights reserved DocID027311 Rev 1 7/7 7