Low Pressure Molding Cost Savings Summary

Low Pressure Molding Cost Savings Summary
Current Potting Process
1
Capital Equipment
$
LPM* Process
$
Moldman™
Dispense Equipment
Heat Ovens
UV Chamber or Tunnel
Other (Make Housings/Cover)
2
Production Floorspace
Production Floorspace
Start to Finish
3
Tooling Costs
Moldset
Cover
Housing
Other
4
Work in Process
Work in Process
Value of Assembly at Dispense
Value of Assembly at Precure
Value of Assembly at Curing
Value of Assembly at Post Cure
5
6
Labor Costs
Labor Costs
Start to Finish
Start to Finish
Energy Costs for Equipment
Energy Costs for Equipment
Dispense
Moldman™
Cure
7
Preventative Maintenance Costs
for Equipment
Preventative Maintenance Costs
for Equipment
Dispense
Moldman™
Cure
8
9
Cycle Time
Cycle Time
Start to Finish
Start to Finish
Bill of Materials Costs
Bill of Materials Costs
Material (Parts)
Material (Parts)
Potting Material
Macromelt®
Total Cost Savings
* LPM = Low Pressure Molding.
Savings
Macromelt® Application Questionnaire
Maximum operating temperature of
final device?
Size of the device being encapsulated
(length x width)?
End environment of printed circut board
(e.g. outdoor, office, tire, etc.)?
Are there any specific solvents or
environments that the coating must
withstand?
Board complexity: high density or
low density?
UL required?
What surfaces need to be adhered to?
Repair or reworkability required?
Required output/parts per hour?
Except as otherwise noted, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. ® = registered in the U.S. Patent and Trademark Office.
Moldman is a trademark of Cavist Corporation. © Henkel Corporation, 2013. All rights reserved. 9192/LT-6659 (2/13)