Lecture Presentation

Chabot College – Intro to Engr
Al Schoepp
2/13/14
Lam Research Confidential
Outline

Introduction

Industry Overview

Lam Research: Products & Technology

Future Technology Challenges

College Programs Overview

Summary

Q&A
Slide - 2
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Meet the CTO’s Team
Al Schoepp
Senior Technical Director
San Jose, California
Slide - 3

Responsible for the hardware support for technology
investigations, as well as investigating novel chamber
materials and novel hardware designs for future
generations of semiconductor equipment.

Earned his bachelor’s in mechanical engineering from
University of Missouri-Rolla and his masters in mechanical
engineering from Stanford University, the emphasis of his
graduate work was in high temperature gas dynamics and
product design.

Has been involved in semiconductor equipment
development for the last 29 years, his first 6 years were
with Watkins-Johnson where he was the chief designer
and architect of the WJ-999 CVD system, then a 4 year stint
at Novellus where he worked on the SPEED product
development , while the last 19 years have been with Lam
Research mainly focused in New Product Development.

Originally from New Athens, Illinois, Al currently resides in
Ben Lomond, California with his wife, Anne and their five
children.

Enjoys weightlifting, playing music, archery, camping,
hunting, making sausage, and building unique items.
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How do I explain to my parents what Lam Research does?
Power Management
NAND Flash
Graphics Engine
Multi-core CPU
Slide - 4
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Wafer Fabrication Equipment
Lam Research manufactures the
equipment that is used
for some of the processes
needed to create semiconductor
integrated circuits (chips)
Slide - 5
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Semiconductor Basics
Pure silicon ingots

What is a Semiconductor?
– Semiconductor = “partial conductor”
• Pure silicon is highly resistive
• Impure silicon can be a conductor
– This tailoring of resistances and materials can be used to make
nanoscopic electronic switches (transistors)
– Transistors can be “wired” together to make useful devices
– Integrated circuits are made on silicon wafers
300 mm Wafer
Single Chip (or Die)
(fingernails grow @ ~1nm/sec)
Slide - 6
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36 nm
© 2004 IEEE (IEDM 2004)
For comparison, the
diameter of a red
blood cell is about
8 µm = 8,000 nm
Single
Transistor
Relative Size of Wafer Fabrication Equipment (WFE) Market
Electronic Equipment
$1,600 Billion
Microprocessors
Major Market Segments
Computing
Automotive
Consumer
Communication
NAND Flash
Semiconductors
$300 Billion
Industrial/Military
Buildings, Computers, and Equipment
DRAM
Capital Spending
$60 Billion
WFE
$30B
Source: Dataquest, Lam Internal
Slide - 7
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Lam Research Customers by Region
Top Three Customers
China
Europe
Japan
Korea
N. America
Singapore
Taiwan
Not all customers are listed
Slide - 8
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Lam Products Introduction
Wafer Fabrication Applications
Hundreds of steps are needed to create an integrated circuit
Cross-Section of a Logic Device
Process Applications:

Ion Implantation
BEOL:

Thermal Processes
Back-End-of-Line
(Interconnect)

Lithography

Etch

Strip

Clean

Deposition

Chemical-Mechanical
Planarization (CMP)

Metrology

Inspection
© 2004 IEEE (IEDM 2004)
FEOL:
Front-End-of-Line
(Transistors)
Individual Transistor
© 2004 IEEE (IEDM 2004)
Slide - 10
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Lam Research
Applications
Lam’s Product Leadership
Installed Base
Support
Etch
Deposition
Strip & Clean
#1 in Conductor
#1 in Copper ECD
#1 in W-CVD
#2 in PECVD
#2 in HDP-CVD
#1 in Dry Strip
#2 in SW Clean
Spares
Productivity Services
Performance Upgrades
Reliant Systems
6% – 8%
of WFE
5% – 6%
of WFE
World-class
customer support
#2 in Dielectric
12% – 14%
of WFE
Silicon &
Industrial Apps
Silfex and
Peter Wolters
Lam Research serves ~26% of total wafer fab equipment market
Source: Leadership positions based on Gartner Dataquest and company data specific to 2012 shares; WFE percentages based on Gartner Dataquest and company data
ECD = electrochemical deposition; CVD = chemical vapor deposition; PECVD = plasma-enhanced CVD; HDP-CVD = high-density plasma CVD; SW = single-wafer
Slide - 11
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Wafer Fabrication Process Steps Example
Incoming
Wafer
Deposition
Lithography
Etch
Photoresist
Put down
the film to
be patterned
Slide - 12
Create the
pattern
mask
Strip
Clean
Remove
photoresist
Remove
residues and
particles
Residues
Selectively
remove film to
define features
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Deposition Processes
Plasma Enhanced
Chemical Vapor Deposition (PECVD)
Gnd
Showerhead
Supply Gas Mix
Supply Energy
for Reaction
Heat or/and Plasma
Reaction
Wafer
(PECVD)
RF
Gnd
Example: SiH4 + NH3  SiN
Slide - 13
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13
Lam Research Deposition Product Portfolio
ECD
W-PNL/CVD
PECVD
electrochemical deposition
tungsten pulsed nucleation layer/chemical vapor deposition
plasma-enhanced chemical vapor deposition
SABRE® Product Family
ALTUS® Product Family
VECTOR® Product Family
Gapfill HDP-CVD
Slide - 14
UVTP
high-density plasma chemical vapor deposition
ultraviolet thermal processing
SPEED™ Product Family
SOLA® Product Family
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Future Technology Challenges
Slide - 15
Lam Research Confidential
Transistors per Die
How and Why Did Moore’s Law Happen?
10
10
10
10
10
10
10
10
10
9
8
64M
16M
7
4M
1M
6
Pentium III
Pentium II
i7
Atom
i386
i286
4K
8086
1K
3
Duo
i486
64K
16K
4
1G
4G
Pentium
256K
Fairchild IC (1961)
5
256M
128M
512M
2G
4004
8080
100
10
Intel Core i7-980X MPU (2010)
1
1960
1970
1980
1990
2000
2010
Sources: Gordon Moore, ISSCC 2003 & Intel 2010
Fairchild/Computer History Museum, Mountain View, CA
Slide - 16
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Moore’s 1965 Article Predicts Why It Happens?
Source: Gordon E. Moore, Electronics, vol. 39, no. 8 (1965)
Slide - 17
Lam Research Confidential
What if everything followed Moore’s Law…
Moore’s Law Comparison: Semiconductors vs. Automobiles
Year
Speed
Capacity
Cost
Automobile
~200 mph
17 mpg
$8500
Integrated Circuit
8 MHz
(Intel 286)
130,000 transistors
(Intel 286)
$128
(64K DRAM Module)
Integrated Circuit
4 GHz
(Intel Haswell)
1,400,000,000
(Intel Haswell)
$30
(8GB DRAM Module)
“Moore’s Law” Automobile
100,000 mph
180,000 mpg
< $0.02
1983
2013
Slide - 18
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($20,000 in 2013 $)
What if everything followed Moore’s Law…
Moore’s Law Comparison: Semiconductors vs. Automobiles
Year
Speed
Capacity
Cost
Automobile
~200 mph
17 mpg
$8500
Integrated Circuit
8 MHz
(Intel 286)
130,000 transistors
(Intel 286)
$128
(64K DRAM Module)
Integrated Circuit
4 GHz
(Intel Haswell)
1,400,000,000
(Intel Haswell)
$30
(8GB DRAM Module)
“Moore’s Law” Automobile
100,000 mph
180,000 mpg
< $0.02
1983
2013
Slide - 19
Lam Research Confidential
($20,000 in 2013 $)
What if everything followed Moore’s Law…
Moore’s Law Comparison: Semiconductors vs. Automobiles
Year
Speed
Capacity
Cost
Automobile
~200 mph
17 mpg
$8500
Integrated Circuit
8 MHz
(Intel 286)
130,000 transistors
(Intel 286)
$128
(64K DRAM Module)
Integrated Circuit
4 GHz
(Intel Haswell)
1,400,000,000
(Intel Haswell)
$30
(8GB DRAM Module)
“Moore’s Law” Automobile
100,000 mph
180,000 mpg
< $0.02
1983
2013
Drive around the world in 15 minutes …
… on a pint of gas …
Slide - 20
Lam Research Confidential
($20,000 in 2013 $)
… and the car would
cost less than two
cents.
Summary – Semi Industry

Moore’s Law continues to drive the Semiconductor (& Equipment) Industry and enables
today’s and tomorrow’s electronic breakthroughs.

Semiconductor Equipment continues to require technology innovation.
– Must stay 1-2 generations ahead of the device makers.

The challenges are continuing to increase with each new device generation.
– There are a lot of hard problems that need to be solved in the coming years.

A wide variety of technical disciplines are needed to be able to solve these problems:
– Engineering, chemistry, physics, devices (EE), mathematics, materials, flow/transport, RF power,
chamber design, software, operations research, control systems, ergonomics, data analysis, sensors,
…

Lot’s of non-technical disciplines are needed as well:
– Business management, human resources, finance, operations, manufacturing, supply chain,
information technology, investor relations, marketing, …

Lam is a great place to work – full time or as a intern
Slide - 21
Lam Research Confidential
College Programs Overview
Slide - 22
Lam Research Confidential
Mission, Vision, and Core Values
Mission
Lam Research is dedicated to the success of our customers
by being the world-class provider of innovative technology
and productivity solutions to the semiconductor industry
Vision
Core Values

Number one in customer trust

Achievement

Number one in market share

Honesty and integrity

A company where successful people
want to work

Innovation and continuous improvement

Mutual trust and respect

Best-in-class products and services

Open communication

Financial performance to:

Ownership and accountability

Teamwork

Think: customer, company, individual
– Fund the solutions our customers require
– Provide the return our shareholders expect
Slide - 23
Lam Research Confidential
Lam Research

More than 30 years as a major supplier of wafer fabrication equipment and services to the
global semiconductor industry

Locations – 17 Countries Worldwide

Over 6,600 employees worldwide

Lam Research looks for interns, NCGs, MBAs, advanced degrees, and post-doctorates with
the following attributes:
–
–
–
–
–
–
–
–
–
–
–
Alignment with Lam’s Core Values
A Relevant Educational Background
Relevant Experience (internship experience)
Technical Capability/Industry/Business Knowledge
Innovation/Creativity
Achievement
Interpersonal Skills/Teamwork
Communication Skills
Project Management
Community Involvement
Leadership Program/Skills
Slide - 24
Lam Research Confidential
College Programs Overview – NCG’s

New College Graduate (NCG) Criteria
– Must be hired within 24 months of graduation
– OUTSTANDING ACADEMIC RECORD (Great GPA)
– Degree in one or more of the following subjects:
• Chemistry (Organic, Inorganic)
• Engineering (Chemical, Computer, Electrical, Industrial, Manufacturing, Mechanical)
• Finance
• Human Resources
• Information Systems
• Management Information Systems
• Marketing
• Materials Science
• Physics
• Plasma Physics
• Software Development and Engineering
• Supply Chain
 NCG 2013 – hired over 100 NCG’s globally
Slide - 25
Lam Research Confidential
College Programs Overview – Internships

Internship Program
– Summer and/or co-op employment for students
– Hands-on business experiences that complement academic studies and prepare for real-world
situations
– Project-based with a focus on learning and development
– $2500 Core Values Scholarship (2 Interns each Summer)
– Keynote Speaker Series, Social Events and Poster Session

Internship Criteria
– Must be currently enrolled in a University program
– Pursuing a B.S., M.S., MBA, or Ph.D. in engineering, science, or
a business related field
– Outstanding academic record

Summer 2013 – hired over 75 Interns in US

College Recruiter: Jennifer Lu

Email: Jennifer.Lu@lamresearch.com for any additional questions
Slide - 26
Lam Research Confidential
Advice from Al

Need to find your own path
– OK to try multiple areas
– Strengthen your weaknesses, but go with your strengths

Absolutely do project courses and get an internship at a company
– Need to validate your assumptions about interests
– Need to have failures…everything works on paper….

Must constantly be learning – even after college
– Problems are very diverse and multi disciplined..
– All of the easy stuff has been done already….

It is a marathon, not a sprint
– Hate the news about “get rich quick” invention…..very rare
– Usually takes years of continuous work to bring solutions/products to market
Slide - 27
Lam Research Confidential
Q&A