MORES - Indico

Ralf Röder
Hamburg
Berlin
Erfurt
Frankfurt/Main
München
Miniaturization of Optical Sensor Solutions
for Life Science, Health, BioMST and Process Automatization:
MORES
multi-domain chip stacks
lab-on-chip
Real Life Business Projekt des TALENT ITNs
Ralf Röder
September 2013
Research Institute
in the field of silicon-based microsystem technology
supervisory
board
scientific
advisory board
non-profit registered voluntary association since 1993
CiS Research Institut
staff (2012): 95 scientists + engineers + 20 skilled workers
turnover (2012): 12.5 million EUR
51 % public funding 35 % industrial contract research 21 % production
clean rooms
4 inch
wafer line
test
analyzis
mounting
packaging
laboratories & offices
design
simulation
MEMS
MOEMS
hundred percent
subsidiary
R&D Concepts
Road Maps
members (individuals , juristic persons: companies, institutes)
Research Institute
in the field of silicon-based microsystem technology
• Manufacturer of highly sophisticated customised optical sensors, sensor systems
and sensor applications: high reliability custom-made chips and hybrids
• High specification sensors.
• Technology and Know How Transfer Offering the whole product lifecycle: Design
to Full-System Assembly.
• Own production plant: Highly flexible. (individual items … series production / larger numbers)
• Development and application of new technologies & ongoing R&D.
• Research and development: Field application and customizing.
• Typical public funded research and B2B (R&D, components)
(B2C only in exceptional cases).
military applications allowed
Research Institute
MST
MEGA trends
funding
markets
know how
inhouse
technologies
technological
modules
Life Science
Medical
Optical
Microsystems
- amos -
Silicon
Detectors
Photo Diodes
Arrays
APD, GM-APD
SiPhotomultiplier
Radiation
Detectors
(HEP, CR, X-RAY)
Photo Diode
Green Solutions
Process
Measurement
MORES
AMOS
-Polarization
- Fluoriszenz
Bio MST
Analytics
Micromechanical
Sensors & Modules
piezoresistive
capacitive
High end
preasure Sensors
Force Sensors
Cantilever
micro-mechanical
components
interposer
Impedimetric
Sensors
Layer Analysis
Microclimatic
Event Switches
Bizeps
Services, Know How and Equipment
Competenz in Silicon
Services, Know How and Equipment
Simulation & Design
Wafer
• Layout – CAD-Software
• FEM-Simulation tools for electrical, optical,
mechanical and thermal calculations e.g. ANSYS,
COMSOL, ATLAS, ATHENA, TESCA
• SPICE-Simulations (HSPICE, CADENCE pSPICE)
• 4“ Wafer line, front and backside processing
• Spray-Coating for 3D-MEMS/MOEMS
• 3D plasma and wet structuring MEMS/MOEMS
• High temperature processes
• LP/PE-CVD, Magnetron sputtering
•Si-direct bonding, anodic bonding
Test & Analytics
Assembly and packaging
• 8“wafer prober, 4“& 6“ front & backside wafer prober
• Automatic die bonder, fine placer for flip-chip assembly
• Automatic ultra-sonic and thermosonic wire bonder
• Semiautomatic wire bonder
• Screenprinter and SMD-mounter
• Vapor-phase, hot bar, vacuum & laser soldering
• Automatic dispenser
• Opto-wafer-prober (e.g. OBIC)
• SIMS-analysis, SEM including EDX, AFM, FIB
• Optical and mechanical profilometer
• Climate & temperature shock test, Pressure cooker
• CV, TVS, UBR, pin-hole, lifetime
Location / Network
(selected)
MORES® Technologie Plattform
3D Micro / Nano
(Technologiemodule 3D-Strukturierung)
Through-Silicon Via (TSV)
(Durchkontaktierung von Siliziumwafern)
Chip-Stacking # Chip-in-Chip
(VCSEL-Chip in Si Cavity)
MORES™ - an example of product driven technology platform
- open platform Open
for interfaces
Filter
Detection
Transducer
Signalpreprocessing
Open
for components
Spray
coating
Technology platform of hybrid integration
Chip-in-Chip
Solgel layer
Si- wafer
Sensitive
layer
Lowered
Bond pads
2D/3D- array
FlipChip
LED/VCSEL
TSV
UBM
MCM
Open
for diversifaction
Photodiodes
SPM
EPoSS Annual Forum 2013
Cork, Ireland, 26th September 2013
A.Steinke, A.Albrecht, O.Brodersen, Th.Ortlepp
Global purposes &
R&D priorities
•
•
Improvement of the consistency of leading research, industrial orientated R&D and
realization of the solutions
samples prototypes production (small and midle sized series or/and
technology transfer to foundries with capabilities to realize mass production)
to improve unique features / goals:
•
Concentration of existing activities
•
Selection of new innovative goals (leading projects)
+
+
+
•
according to the development aims / specifications of our customers
technology scouting
technology and Know-how transfer
application-specific respectively custom-specific solutions (customizing)
especially for Small & Medium enterprices (SME)
economic efficiency
producibility
quality assurance
Extension of the technology platforms
available for R&D and prototyping
Silicon-based sensor and Nano / Micro solutions
Polylithic 3D-integration
Silicon used for system platforms (LoC, interposer, board …)
and Silicon packaging with additional functions
(filters, overload protection,…)
MORES Technology Platform
& Product / Solutions
Advantages
Disadvantages
• very high flexibility
• high costs for mass production
• micro-optical components
• micro-mechanical components
•…
• sensing elements / devices
• aditional functionality
• packageing
• cooling
•…
• batch processing of 3D MST
• cost eficency for individual solutions
and small series
• faster R&D process time to market
• exclusive solutions using technology platforms
Aims / Goals
Diversifikation
What ideas / concepts may be
handled using the existing resources?
Still be served?
What new resources should have to
develop or establish ?
• evaluate market potentials
• scouting of performance aims
based on custom requirements
• technology scouting Road Map process
* develoüp technology conzeptions
Concentration
Focusing of the resources .
What expertise is still needed?
What resources should be
outsourced?
• use of synergies
• Technology and
product transfer
• economic efficiency of very
specialized / individual solutions,
small series
Contact
CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH
Konrad-Zuse-Straße 14
99099 Erfurt
info@cismst.de
www.cismst.de
Ralf Röder
Technologieentwicklung
rroeder@cismst.de
Tel.: +49 361 6631 461
Mobil: +49 171 4085 429
Dr. Tobias Wittig
Arbeitsgruppenleiter Siliziumdetektoren
twittig@cismst. de
Tel.: +49 361 6631 419
Present Solutions
•
•
•
•
•
Nivellierungssensor / leveling sensor eLiSe
• Interview partner
CiS: Dr. Brodersen (obrodersen@cismst.de)
Sartorius: Herr Esser (richard.esser@sartorius.com)
Im-Ohr-Sensorsystem (Herz-Kreislauf-Diagnostik, Pulsoximetrie im äußeren Gehörgang)
/ In-ear sensor system
• Interview partner
CiS: Dr. Ortlepp (hgortlepp@cismst.de)
…
Streulichtsensor zur Bestimmung der Partikelkonzentration in Flüssigkeiten Scattered
light sensor for determining the particle concentration in liquids
• Interview partner
CiS: Dr. Müller (rmueller@cismst.de)
…
Fluoreszenzsensor / fluorescence sensor FLORES
-Interview partner
CiS: Dr. Winzer (awinzer@cismst.de)
Prof. Mathis (harald.mathis@fit.fraunhofer.de)